JP6752030B2 - Information processing device and information processing method - Google Patents

Description

The present invention relates to an information processing apparatus and an information processing method, and more particularly to an information processing apparatus and an information processing method used in a mounting-related processing apparatus for mounting and processing a component.

Conventionally, as a mounting device, a device that stores the air pressure for clamping corresponding to the substrate in advance and clamps the substrate with the air pressure corresponding to the substrate to be produced has been proposed (see, for example, Patent Document 1). .. It is said that this device can prevent mistakes in substrate clamping.

Japanese Unexamined Patent Publication No. 2011-204908

However, in the mounting apparatus described in Patent Document 1, the substrate can be clamped according to the stored substrate type, but there are various types of substrates, and if the substrate information is not stored, an appropriate operation is performed. In some cases, it was not possible for the person to handle the implementation-related processing smoothly.

The present invention has been made in view of such a problem, and an object of the present invention is to provide an information processing apparatus and an information processing method capable of performing smoother implementation-related processing.

The present invention has taken the following measures to achieve the above-mentioned main object.

The information processing device and the information processing device of the present invention
An information processing device used in a mounting-related processing device related to the process of mounting a component on a board.
An acquisition unit that acquires substrate information including the size and thickness of the substrate to be processed, and
Using the acquired substrate information, information on the warp of the substrate caused by its own weight or clamping is obtained, and a determination unit for determining whether or not the substrate satisfies a predetermined reference range.
A control unit that outputs the determined result,
It is equipped with.

This device acquires board information, obtains information on the warp of the board, and outputs a determination result of whether or not the board satisfies the reference range. Therefore, in this apparatus, it is possible to know in advance whether or not the substrate can be used in the mounting-related processing apparatus based on the acquisition of the substrate information, and smooth mounting-related processing can be performed. Here, the "predetermined reference range" may be, for example, empirically or specified by specifications within a range in which the substrate can be handled by the mounting-related processing apparatus. Further, the "mounting-related processing" includes, for example, a printing process for printing a viscous material on a substrate, a mounting process for mounting a component on a substrate, an inspection process for inspecting the state of a component arranged on the substrate, and a transport for transporting the substrate. One or more of the processing, the reflow processing for reflowing the substrate on which the parts are arranged, and the like are included. The board information may include information such as a board type and a split position.

In the information processing apparatus of the present invention, the determination unit obtains the correspondence between the thickness of the substrate and the buckling load at the time of clamping the substrate as information on the warp of the substrate, and the determination unit includes the acquired substrate information of the substrate. It may be determined whether or not the buckling load corresponding to the thickness is within the reference range. In this device, it is possible to determine whether the substrate can be clamped based on the relationship between the buckling load and the substrate thickness. At this time, when the substrate is out of the predetermined reference range, the control unit outputs one or more of the information that the substrate cannot be clamped and the information regarding the change of the clamping method of the substrate as the determination result. It may be the one to do. In this device, since it is possible to know in advance information such as that this substrate cannot be clamped and that the clamping method should be changed, it is easy for the operator to deal with it, and smooth mounting-related processing can be performed. Further, the control unit may change the clamp load of the substrate within the buckling load corresponding to the thickness of the substrate when the substrate is out of the predetermined reference range. In this device, the clamp load is changed, so that the substrate can be fixed more appropriately.

Alternatively, in the information processing apparatus of the present invention, the determination unit obtains the correspondence between the thickness of the substrate and the amount of its own weight deflection as information on the warp of the substrate, and the thickness of the substrate included in the acquired substrate information. It may be determined whether or not the amount of self-weight deflection corresponding to the above is within the reference range. In this device, it is possible to determine whether or not the substrate can be used based on the thickness of the substrate and the amount of deflection of its own weight. At this time, the acquisition unit acquires the board information including the position of the component mounted on the board and the weight of the component, and the determination unit acquires the acquired position of the mounted component and the weight of the component. The amount of the self-weight deflection may be obtained in consideration of the above. In this device, for example, even when a mounted component is arranged on a part of the board, it can be determined whether or not the board can be used. Further, the control unit may output information that the substrate cannot be conveyed as the determination result when the substrate is out of the predetermined reference range. This device can determine whether or not the substrate can be conveyed according to the warp of the substrate.

In the information processing apparatus of the present invention, the acquisition unit may acquire the board information from the mounting job information including the execution conditions of the mounting-related processing. With this device, it is possible to acquire board information while making the input of the operator easier.

The information processing method of the present invention is an information processing method used for mounting-related processing related to a process of mounting a component on a substrate.
(A) A step of acquiring substrate information including the size and thickness of the substrate to be processed, and
(B) A step of obtaining information on the warpage of the substrate caused by its own weight or clamping by using the acquired substrate information, and determining whether or not the substrate satisfies a predetermined reference range.
(C) A step of outputting the determined result and
Is included.

In this method, similarly to the information processing apparatus described above, it is possible to know in advance whether the substrate can be used in the mounting-related processing apparatus based on the acquisition of the substrate information, and smooth mounting-related processing can be performed. In this information processing method, various aspects of the above-mentioned information processing apparatus may be adopted, or steps may be added to realize each function of the above-mentioned information processing apparatus.

Schematic diagram of the mounting system 10. The schematic explanatory view of the substrate processing unit 22. The flowchart which shows an example of the board judgment processing routine. Explanatory drawing showing an example of a self-weight deflection curve and a reference range. Explanatory drawing which shows an example of a buckling load curve and a reference range. The explanatory view which shows an example of the undivided substrate S and the divided substrate S.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory view of the mounting system 10. FIG. 2 is a schematic explanatory view of the substrate processing unit 22. The mounting system 10 includes a printing device 20 that executes a printing process for printing solder on the board S, a mounting processing device 30 that executes a mounting process for mounting components on the board S, and a management computer (PC) that manages information. ) 40 and. Although FIG. 1 shows one printing device 20 and one mounting device 30 for convenience, a plurality of each may be present. Further, although not shown, the mounting system 10 includes an inspection device for inspecting the state of solder printed on the substrate, an inspection device for inspecting the state of parts arranged on the board, and a transfer device for transporting the board S. It also includes a reflow device for reflowing the substrate S on which the components are arranged. The mounting-related processing device may include one or more of a printing device 20, a mounting device 30, an inspection device, a transfer device, a reflow device, and the like. Further, the mounting-related processing may include one or more of printing processing, mounting processing, inspection processing, transfer processing, reflow processing, and the like.

As shown in FIGS. 1 and 2, the printing apparatus 20 is an apparatus for applying solder to the lower substrate S through the pattern holes by pushing the solder into the pattern holes formed in the screen mask M using the squeegee 28. Is. The printing device 20 includes a control unit 21, a substrate processing unit 22, a mask unit 24, and a printing unit 25. The control unit 21 controls the entire device, and includes a CPU, a storage device, and the like. The substrate processing unit 22 moves and fixes the substrate S, and includes a conveyor belt and a clamp mechanism 23. As shown in FIG. 2, the clamp mechanism 23 has a fixing plate in contact with the side surface of the substrate S to fix the substrate S. The mask unit 24 positions the screen mask M in a state of being fitted in the frame and supports and fixes it in a horizontal posture. The printing unit 25 includes a printing head 26, a head moving portion 27, and a squeegee 28. The print head 26 prints the solder by moving the squeegee 28 on the screen mask M by the head moving portion 27.

The mounting device 30 is a device that arranges the components supplied by the supply unit 34 at predetermined positions on the substrate S. The mounting device 30 includes a control unit 31, a substrate processing unit 32, a supply unit 34, and a mounting unit 35. The control unit 31 controls the entire device, and includes a CPU, a storage device, and the like. The substrate processing unit 32, like the substrate processing unit 22, moves and fixes the substrate S, and includes a conveyor belt and a clamp mechanism 33. The mounting unit 35 includes a mounting head 36, a head moving portion 37, and a suction nozzle 38. The mounting head 36 mounts the components on the substrate S by moving the suction nozzle 38 by the head moving portion 37.

The management PC 40 is a computer that manages information on each device of the mounting system 10. The management PC 40 includes a control unit 41, a storage unit 43, an input device 47, and a display 48. The control unit 41 controls the entire device, and includes a CPU, a storage device (ROM, RAM), and the like. The storage unit 43 is a large-capacity storage medium such as an HDD, and stores various application programs and various data files. The mounting job information 44 and the determination program 45 are stored in the storage unit 43. The mounting job information 44 includes component information related to the components to be mounted and board information related to the board S. The board information includes the size (vertical and horizontal dimensions), thickness, weight, material, and physical properties (elastic modulus, Poisson's ratio, specific gravity, etc.) of the board S, and in the case of a split board divided into a plurality of boards, The depth and width of the split groove, position information, etc. are included. The input device 47 includes, for example, a keyboard and a mouse for an operator to input various commands. The display 48 displays various information.

Next, the operation of the mounting system 10 of the present embodiment configured in this way, particularly the process of determining whether the substrate S to be used for the mounting process can be used in the apparatus will be described. FIG. 3 is a flowchart showing an example of a board determination processing routine executed by the CPU 42 of the management PC 40. This routine is stored in the control unit 41 of the management PC 40 and executed by the start instruction by the operator. Here, the process of determining whether the substrate S can be used by the printing apparatus 20 will be mainly described.

When this routine is started, the CPU 42 first acquires substrate information including the size and thickness of the substrate S (step S100). The board information may be acquired, for example, by reading out what is included in the target mounting job information 44, or by acquiring what is input by the operator in the input device 47. Next, the CPU 42 determines whether or not there is a mounted component on the substrate S (step S110). In the mounting system 10, for example, in the target device, a component may be mounted on the front surface of the substrate S, reflowed, and then mounted on a pre-attached board on which the component is mounted on the back surface. Here, it is determined whether or not such a mounted component is on the substrate S. When there are no mounted components on the substrate S, the CPU 42 calculates the own weight deflection curve of the substrate S as information regarding the warp of the substrate S (step S120).

The CPU 42 obtains the self-weight deflection curve as a correspondence relationship between the self-weight deflection amount and the substrate thickness by using a general formula for substrate information and stress. As the substrate information, for example, size (length and width mm), elastic modulus (GPa), Poisson's ratio, specific gravity and the like are used. The amount of self-weight deflection is the amount of deformation of the substrate S due to its own weight. The amount of deformation of the substrate S can be obtained, for example, by dividing the substrate S into unit grids (mesh), calculating the downward force acting by its own weight for each unit grid, and the amount of deformation thereof, and integrating them. On the other hand, when there is a mounted component on the substrate S, the weight of the mounted component is added to calculate the own weight deflection curve (step S130). When the weight of the component is taken into consideration, the CPU 42 determines the amount of deformation of the substrate S by applying a downward force based on the mass of each position of the mounted component in addition to the amount of deformation of the substrate S.

After calculating the self-weight deflection curve in step S120 or step S130, the CPU 42 determines whether or not the thickness of the substrate S used for mounting is within the reference range (step S140). FIG. 4 is an explanatory diagram showing an example of the self-weight deflection curve and the reference range. FIG. 4 shows an example of the own weight deflection curves of a plurality of types of substrates having the same size (length × width). The reference range may be empirically or specified as a range of the amount of deflection that can be conveyed and fixed by the substrate processing unit even if it is deflected by its own weight. The range beyond this reference range is the non-transportable range. For example, in the substrate B, if the thickness of the substrate to be used is less than t0 (mm), it is determined that the substrate cannot be conveyed. When the thickness of the substrate S is not within the reference range, the CPU 42 displays an error message on the display 48 indicating that the substrate S cannot be conveyed due to its own weight deflection (step S150), and ends this routine. The CPU 42 may display information on the thickness of the board S that can be conveyed when the error is displayed. For example, the CPU 42 may display a message on the substrate B that the substrate B can be conveyed if the thickness is t0 or more. The operator who confirms this error display can deal with the deflection of its own weight before the mounting process, such as changing the thickness of the substrate S or fixing the substrate S to the carrier board which is a support plate and transporting the substrate S.

When the thickness of the substrate S is within the reference range in step S140, the CPU 42 performs a determination process regarding whether the substrate S can be side-clamped as being transportable by the substrate processing unit 22 (steps S160 to S220). .. Specifically, the CPU 42 determines whether or not the substrate S has a split groove based on the substrate information (step S160). When the substrate S has no split groove, the CPU 42 calculates the buckling load curve of the substrate S as information regarding the warp of the substrate S (step S170).

The CPU 42 obtains a buckling load curve as a correspondence relationship between the buckling load and the substrate thickness by using a general formula relating to substrate information and stress. The buckling load can be obtained by, for example, the equation (1). In this equation (1), m is the boundary condition based on the load type, E is the Young's modulus of the substrate, I is the moment of inertia of area, and L is the length of the substrate in the load direction. In the buckling load curve, for example, when a load is applied from the side surface, a load (buckling load) that reaches a predetermined upper limit of the allowable warpage amount (for example, 2 mm or 3 mm) is calculated, and the thickness of the substrate S is calculated. It can be obtained as the correspondence relationship of the buckling load to the curve. As the substrate information, for example, size (length and width mm), elastic modulus (GPa), Poisson's ratio, specific gravity and the like are used. For the buckling load, for example, the substrate S is divided into unit grids (mesh), the load from the side surface and the amount of deformation at that time are calculated for each unit grid, and the amount of warpage of the entire substrate S is calculated by integrating them. It can be obtained as a value at which this warp amount reaches a predetermined upper limit value of the allowable warp amount. On the other hand, when there is a split groove on the substrate S in step S160, the buckling load curve is calculated in consideration of the position, depth, width and the like of the split groove (step S180). When adding the split groove, the CPU 42 determines the amount of warpage (deformation amount) of the substrate S assuming that the space corresponding to the split groove exists in the unit cell. Since the amount of deformation of the space is larger than the amount of deformation of the substrate member, the amount of warpage is relatively large and the buckling load is relatively small in the substrate S having the split groove.
Buckling load Pcr = m (π ² EI / L ² )… Equation (1)

After calculating the buckling load curve in step S170 or step S180, the CPU 42 determines whether or not the thickness of the substrate S used for mounting is within the reference range (step S190). FIG. 5 is an explanatory diagram showing an example of a buckling load curve and a reference range. FIG. 5 shows an example of buckling load curves of a plurality of types of substrates having the same size (length × width). Even if the reference range is empirically determined as a range above the load that can sufficiently fix the substrate S so as not to cause a deviation when performing a mounting-related process (printing process in this case). Good. For example, in the substrate B, if the thickness of the substrate to be used is less than t1 (mm), it is determined that the standard side clamp cannot be used. When the thickness of the substrate S is within the reference range, the CPU 42 saves the determination result and ends this routine as it is. On the other hand, when the thickness of the substrate S is not within the reference range, the CPU 42 determines whether or not the load change of the side clamp is permitted (step S200). It is assumed that this permission setting has been entered by the operator in advance by default. If the load of the side clamp is changed, the certainty of the mounting-related processing (printing processing in this case) is lowered, and the production according to the specifications becomes possible. Therefore, it shall be determined in advance according to the convenience of the user.

When the load change is permitted in step S200, the CPU 42 determines whether or not the buckling load corresponding to the thickness of the substrate S is within a predetermined load changeable range below the reference range (). Step S210). This load changeable range is, for example, less certain than the load in the reference range, but may be empirically determined within a range in which the substrate S can be fixed when performing mounting-related processing. For example, in the substrate B of FIG. 5, when the thickness of the substrate to be used is less than t1 (mm) and t2 (mm) or more, the load of the side clamp is set to n1 (N) according to the thickness. It is determined that the value can be changed to less than, n2 (N) or more. When the buckling load is within the load changeable range, the CPU 42 changes the clamp load to a value corresponding to the thickness of the substrate S (step S220), saves the result (step S230), and executes this routine. finish.

On the other hand, when the buckling load is not within the load changeable range, or when the load change is not permitted in step S200, the CPU 42 displays an error message including a message that the side clamp cannot be performed on the substrate S. (Step S150), and the routine is terminated as it is. At this time, the CPU 42 may display a message to change the fixing method of the substrate S to a vacuum support that supports the lower surface of the substrate S while reducing the pressure instead of the side clamp. The operator who confirms this error display can take measures against buckling, such as changing the clamp method to vacuum support instead of the side clamp, or changing the clamping method before the mounting process. The range below the load changeable range is the recommended vacuum support range.

An example of calculating the buckling load of the substrate S will be described. FIG. 6 is an explanatory diagram showing an example of (a) undivided substrate S and (b) divided substrate S. This substrate has a size of L200 mm × W150 mm, a thickness of 1.6 mm, a material of glass / epoxy substrate, an elastic modulus of 28.5 GPa, a Poisson's ratio of 0.16, and a specific gravity of 1.585. The split substrate has split grooves (through grooves) having a split groove width of 2 mm formed in the shape and position shown in FIG. 6 (b). When the buckling load was calculated for this substrate by the above formula (boundary condition m = 1), the calculation results were 91.2N for the undivided substrate and 9.4N for the split substrate. It can be determined whether or not the substrate S can be side-clamped based on whether or not the obtained buckling load is within the reference range.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The control unit 41 of the present embodiment corresponds to the acquisition unit, the determination unit, and the control unit of the present invention. In the present embodiment, an example of the information processing method of the present invention is also clarified by explaining the operation of the management PC 40.

According to the management PC 40 described above, the board information is acquired, the self-weight deflection curve and the buckling load curve are obtained as the information regarding the warp of the board S, and the determination result of whether or not the board S satisfies the reference range is output. .. Therefore, in the management PC 40, it is possible to know in advance whether the board S can be used in a mounting-related processing device such as the printing device 20 or the mounting device 30 based on the acquisition of the board information, and smooth mounting-related processing (printing) can be performed. One or more of processing, mounting processing, inspection processing, transport processing, and reflow processing) can be performed. Further, the control unit 41 obtains the correspondence relationship between the thickness of the substrate S and the buckling load at the time of clamping the substrate as information on the warp of the substrate S, and buckling corresponding to the thickness of the substrate S included in the acquired substrate information. Determine if the load is within the reference range. In this device, it is possible to determine whether the substrate S can be clamped based on the relationship between the buckling load and the substrate thickness. Further, when the substrate S is out of the predetermined reference range, the control unit 41 outputs one or more of the information that the substrate cannot be clamped and the information regarding the change of the clamping method of the substrate S as the determination result. In this device, since it is possible to know in advance information such as that the substrate S cannot be clamped and that the clamping method should be changed, it is easy for the operator to deal with it and smooth mounting-related processing can be performed. .. Furthermore, when the substrate S is out of a predetermined reference range, the control unit 41 changes the clamp load of the substrate S within the buckling load corresponding to the thickness of the substrate S. In this device, since the clamp load is changed, the substrate S can be fixed more appropriately.

Further, the control unit 41 obtains the correspondence relationship between the thickness of the substrate S and the amount of its own weight deflection as information on the warp of the substrate S, and the amount of its own weight deflection corresponding to the thickness of the substrate S included in the acquired substrate information is within the reference range. Determine if it is within. In this apparatus, it is possible to determine whether or not the substrate S can be used based on the thickness of the substrate S and the amount of its own weight deflection. Further, the control unit 41 acquires board information including the position of the component mounted on the board S and the weight of the component, and determines the amount of its own weight deflection in consideration of the acquired position of the mounted component and the weight of the component. Ask. In this device, for example, even when a mounted component is arranged on a part of the substrate S, it can be determined whether or not the substrate S can be used. Further, the control unit 41 outputs information that the substrate S cannot be conveyed as a determination result when the substrate S is out of the predetermined reference range. This device can determine whether or not the substrate S can be conveyed according to the warp of the substrate S. Furthermore, since the control unit 41 acquires the board information from the mounting job information, it is possible to acquire the board information while making the input of the operator easier.

Further, in this apparatus, since the board information is referred to when creating the conditions necessary for executing the mounting-related processing, smooth mounting-related processing can be performed without requiring any man-hours. Further, in this apparatus, stable clamping with less warpage of the substrate S becomes possible, so that the quality of mounting-related processing is further improved. Furthermore, in this device, since it is known in advance whether or not the substrate S can be clamped and whether or not the substrate S can be transported, it is possible to reduce man-hours such as setting conditions and preparing for transport.

It goes without saying that the present invention is not limited to the above-described embodiments, and can be implemented in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the deflection due to its own weight and the buckling due to the side clamp are obtained as the information regarding the warp of the substrate S, but either one may be omitted. The management PC 40 can also obtain a determination result as to whether the substrate S can be conveyed or the substrate S can be side-clamped. Further, although the self-weight deflection curve and the buckling load curve are obtained as information on the warp of the substrate S, the curve is not particularly limited, and the amount of deflection due to the own weight corresponding to the thickness of the substrate S is obtained. Alternatively, the buckling load corresponding to the thickness of the substrate S may be obtained.

In the above-described embodiment, when the buckling load is obtained, it is determined using the side clampable range (reference range), the load changeable range, and the vacuum support recommended range, but the present invention is not particularly limited thereto. , The determination process other than the reference range may be omitted. Even in this way, it is possible to obtain a determination result as to whether the buckling load is included in the reference range. Further, although the control unit 41 determines the load change permission setting in step S200, it may be omitted and the load may always be changed, or the load may not be changed at all times.

In the above-described embodiment, the weight of the pre-attached component is added, the split groove position of the substrate S is added, and the like, but the present invention is not particularly limited, and any one of these may be omitted. For example, when a mounting process without a pre-attached component or a substrate S having no split groove is used, even if any of these is omitted, a determination result can be obtained for the warp of the substrate.

Although not described in the above-described embodiment, for example, a sensor for detecting the height of the substrate is added to a mounting-related processing device such as a printing device 20 or a mounting device 30, and the clamp mechanism 23 or the clamp mechanism 33 automatically clamps the sensor. The amount of warpage of the substrate S when the pressure is changed may be actually measured to confirm whether the calculation result is correct. In this device, mounting-related processing can be performed more reliably.

Although not particularly described in the above-described embodiment, for example, the management PC 40 refers to information (thickness, etc.) of the substrate S that is not available in the apparatus based on the determination results such as buckling load and own weight deflection. It may be possible to impose input restrictions. In this device, implementation-related processing can be performed more smoothly by suppressing input work that may be wasted by the operator.

Although not particularly described in the above-described embodiment, for example, the management PC 40 obtains the outline data of the substrate, the mounting position data, the split groove position, etc. by linking with the CAD data, and the substrate S can be used in the apparatus. It may be used to determine whether or not. In this device, CAD data can be used to realize smooth implementation-related processing.

In the above-described embodiment, the board determination processing routine is performed by the management PC 40, but the present invention is not particularly limited to this, and control units of other devices such as the control unit 21 of the printing device 20 and the control unit 31 of the mounting device 30 It may be done in. Further, in the above-described embodiment, the present invention has been described as the management PC 40 (information processing device), but it may be an information processing method.

The present invention can be used in the field of mounting electronic components.

10 mounting system, 20 printing device, 21 control unit, 22 board processing unit, 23 clamp mechanism, 24 mask unit, 25 printing unit, 26 print head, 27 head moving unit, 28 squeegee, 30 mounting device, 31 control unit, 32 Board processing unit, 33 clamp mechanism, 34 supply unit, 35 mounting unit, 36 mounting head, 37 head moving part, 38 suction nozzle, 40 management PC, 41 control unit, 42 CPU, 43 storage unit, 44 mounting job information, 45 Judgment program, 47 input device, 48 display, S board.

Claims (7)

An information processing device that is equipped with a board processing unit that conveys a board and is used as a mounting-related processing device related to the processing of mounting components on a board.
An acquisition unit that acquires substrate information including the size , thickness, and material of the substrate to be processed,
Using the acquired said substrate information, the own weight to determine the information about the self-weight bending amount of the substrate as the information about the more resulting warp of the substrate, determination unit that the substrate is whether satisfies a predetermined reference range,
A control unit that outputs the determined result is provided .
The reference range is a range of the amount of deflection of the substrate that can be conveyed by the substrate processing unit.
The determination unit obtains the correspondence relationship between the thickness of the substrate and the amount of deflection of its own weight as information on the warp of the substrate, and the amount of deflection of its own weight corresponding to the thickness of the substrate included in the acquired substrate information is within the reference range. Judge whether it is inside or not,
The control unit is an information processing device that outputs information that the substrate cannot be conveyed as a determination result when the substrate is out of the predetermined reference range . The acquisition unit acquires the board information including the position of the component mounted on the board and the weight of the component.
The information processing apparatus according to claim 1 , wherein the determination unit obtains the amount of its own weight deflection in consideration of the acquired position of the mounted component and the weight of the component. The information processing apparatus according to claim 1 or 2 , wherein the acquisition unit acquires the board information from the mounting job information including the execution conditions of the mounting-related processing. The determination unit obtains the correspondence relationship between the thickness of the substrate and the buckling load at the time of clamping the substrate as information on the warp of the substrate, and the buckling load corresponding to the thickness of the substrate included in the acquired substrate information. The information processing apparatus according to any one of claims 1 to 3 , wherein it is determined whether or not is within the reference range. The control unit outputs one or more of the information that the substrate cannot be clamped and the information regarding the change of the clamping method of the substrate as the determination result when the substrate is out of the predetermined reference range. Item 4. The information processing apparatus according to item 4 . The control unit according to claim 4 or 5 , wherein when the substrate is out of the predetermined reference range, the clamp load of the substrate is changed within the buckling load corresponding to the thickness of the substrate. Information processing device. An information processing method used for mounting-related processing related to processing of mounting a component on a board by using a mounting-related processing device provided with a board processing unit for transporting and fixing a board .
(A) A step of acquiring substrate information including the size , thickness and material of the substrate to be processed, and
(B) using the obtained said substrate information, for information about the self-weight bending amount of the substrate as the information about the more resulting warp of the substrate to its own weight, the own weight deflection amount obtained is conveyed and fixed by the substrate processing unit The step of determining whether or not the reference range, which is the range of the possible amount of self-weight deflection, is satisfied,
(C) A step of outputting information that the substrate cannot be conveyed when the obtained amount of the self-weight deflection is out of the reference range .
Information processing methods including.

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