JP6718352B2 - 基板搬送ハンドの診断システム - Google Patents
基板搬送ハンドの診断システム Download PDFInfo
- Publication number
- JP6718352B2 JP6718352B2 JP2016189150A JP2016189150A JP6718352B2 JP 6718352 B2 JP6718352 B2 JP 6718352B2 JP 2016189150 A JP2016189150 A JP 2016189150A JP 2016189150 A JP2016189150 A JP 2016189150A JP 6718352 B2 JP6718352 B2 JP 6718352B2
- Authority
- JP
- Japan
- Prior art keywords
- image
- substrate
- substrate holding
- hand
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/905—Control arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30244—Camera pose
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
ロボットアームの手先部に連結される基部と、前記基部と結合され、基板を保持する基板保持部とを備える基板搬送ハンドの診断システムであって、
前記基部に固定され、前記基板保持部を撮像するカメラと、
前記カメラが撮像した画像情報を取得し、当該画像情報に基づいて前記基板保持部の健常性を診断する診断装置とを備えることを特徴としている。
図1に示す基板搬送ロボット1は、基台73と、基台73に対し昇降可能且つ回動可能に支持されたロボットアーム(以下、単に「アーム7」と称する)と、アーム7の手先部に連結された基板搬送ハンド(以下、単に「ハンド5」と称する)と、基板搬送ロボット1の動作を司るコントローラ6とを備えている。
続いて、ハンド5のコンディションを診断する診断システム10について説明する。図1〜3に示すように、診断システム10は、ハンド5に取り付けられたカメラ80と、メラが撮像した画像情報を取得し、当該画像情報に基づいてハンド5の基板保持部52の健常性を診断する診断装置8とを備えている。
3 :基板
3a :中心点
5 :基板搬送ハンド
6 :コントローラ
7 :アーム
8 :診断装置
10 :診断システム
51 :基部
52 :基板保持部
53 :フロントガイド
54 :リアガイド
55 :プッシャー
60〜63 :駆動ユニット
64 :駆動機構
73 :基台
74 :昇降軸
75 :リンク
76 :リンク
80 :カメラ
81 :カメラ座
84 :画像処理部
85 :比較部
86 :健常性判断部
87 :変形特定部
88 :軌道修正部
A1〜A3 :関節軸線
C :ハンド中心線
Claims (7)
- ロボットアームの手先部に連結される基部と、前記基部と結合され、基板を保持する基板保持部とを備える基板搬送ハンドの診断システムであって、
前記基部に固定され、前記基板保持部を撮像するカメラと、
前記カメラが撮像した画像情報を取得し、当該画像情報に基づいて前記基板保持部の健常性を診断する診断装置とを備える、
基板搬送ハンドの診断システム。 - 前記診断装置は、前記画像情報から、撮像された画像に含まれる前記基板保持部の輪郭線を抽出し、抽出した輪郭線の画像と予め記憶された健常な輪郭線の画像とを比較し、前記抽出した輪郭線の前記健常な輪郭線からの偏差量に基づいて、前記基板保持部の健常性の有無を判断する、
請求項1に記載の基板搬送ハンドの診断システム。 - 前記診断装置は、健常性が無いと判断したときに、前記偏差量に基づいて、予め記憶された変形の種類の中から該当するものを選択する、
請求項2に記載の基板搬送ハンドの診断システム。 - 前記診断装置は、前記変形の種類と前記偏差量とに基づいて、前記基板搬送ハンドの軌道修正による矯正の可否を判断し、矯正が可能であるときは、軌道修正量を算出して前記ロボットアームの制御手段へ出力し、矯正が不可能であるときは、停止信号を前記ロボットアームの制御手段へ出力する、
請求項3に記載の基板搬送ハンドの診断システム。 - 前記診断装置は、前記画像情報に含まれる前記基板保持部の画像と、予め記憶された健常な前記基板保持部の画像とを比較して、それらの画像間変化を抽出し、抽出した前記画像間変化に基づいて、前記基板保持部の健常性の有無を判断する、
請求項1に記載の基板搬送ハンドの診断システム。 - 前記カメラは、前記基板保持部に加えて、前記基部の一部を撮像し、
前記診断装置は、前記画像情報に含まれる前記基部を抽出し、抽出した前記基部の画像と、予め記憶された健常な前記基部の画像とを比較して、それらの画像間変化を抽出し、抽出した前記画像間変化に基づいて、前記基部に対する前記カメラの位置の変化の有無を判断する、
請求項1〜5のいずれか一項に記載の基板搬送ハンドの診断システム。 - 前記基板搬送ハンド以外の場所に基準点が予め規定されており、
前記カメラは、前記基板搬送ハンドが所定の位置及び姿勢にあるときに、その視野範囲に前記基準点及び前記基板保持部が入るように撮像し、
前記診断装置は、前記画像情報に含まれる前記基準点及び前記基板保持部の画像と、健常な前記基準点及び前記基板保持部の画像とを比較して、それらの画像間変化を抽出し、抽出した前記画像間変化に基づいて、前記基部に対する前記カメラの位置の変化の有無を判断する、
請求項1〜5のいずれか一項に記載の基板搬送ハンドの診断システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016189150A JP6718352B2 (ja) | 2016-09-28 | 2016-09-28 | 基板搬送ハンドの診断システム |
KR1020187037035A KR102172266B1 (ko) | 2016-09-28 | 2017-09-21 | 기판 반송 핸드의 진단 시스템 |
US16/337,856 US11476138B2 (en) | 2016-09-28 | 2017-09-21 | Diagnostic system of substrate transfer hand |
CN201780050991.6A CN109564889B (zh) | 2016-09-28 | 2017-09-21 | 基板搬送手的诊断系统 |
PCT/JP2017/034016 WO2018061957A1 (ja) | 2016-09-28 | 2017-09-21 | 基板搬送ハンドの診断システム |
TW106132806A TWI659491B (zh) | 2016-09-28 | 2017-09-25 | 基板搬送手之診斷系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016189150A JP6718352B2 (ja) | 2016-09-28 | 2016-09-28 | 基板搬送ハンドの診断システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018056256A JP2018056256A (ja) | 2018-04-05 |
JP6718352B2 true JP6718352B2 (ja) | 2020-07-08 |
Family
ID=61762608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016189150A Active JP6718352B2 (ja) | 2016-09-28 | 2016-09-28 | 基板搬送ハンドの診断システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US11476138B2 (ja) |
JP (1) | JP6718352B2 (ja) |
KR (1) | KR102172266B1 (ja) |
CN (1) | CN109564889B (ja) |
TW (1) | TWI659491B (ja) |
WO (1) | WO2018061957A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11088004B2 (en) * | 2018-01-30 | 2021-08-10 | Brooks Automation, Inc. | Automatic wafer centering method and apparatus |
JP2019177126A (ja) * | 2018-03-30 | 2019-10-17 | 株式会社三洋物産 | 遊技機 |
JP7149119B2 (ja) * | 2018-07-03 | 2022-10-06 | 日本電産サンキョー株式会社 | 産業用ロボット |
US20200070349A1 (en) * | 2018-08-31 | 2020-03-05 | Kawasaki Jukogyo Kabushiki Kaisha | Robot and method of adjusting original position of robot |
WO2020067234A1 (ja) * | 2018-09-28 | 2020-04-02 | 日本電産株式会社 | 制御装置 |
KR102687859B1 (ko) * | 2018-11-29 | 2024-07-24 | 삼성디스플레이 주식회사 | 기판 이송 시스템 및 기판 이송 방법 |
US10953539B2 (en) * | 2018-12-27 | 2021-03-23 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer robot and automatic teaching method |
JP7273568B2 (ja) * | 2019-03-19 | 2023-05-15 | 株式会社ディスコ | 加工装置 |
KR102697512B1 (ko) * | 2020-09-03 | 2024-08-21 | 가와사끼 쥬고교 가부시끼 가이샤 | 기판 유지 핸드 및 기판 반송 로봇 |
JP7630246B2 (ja) * | 2020-09-04 | 2025-02-17 | 川崎重工業株式会社 | ロボット及びハンド部姿勢調整方法 |
JP7619805B2 (ja) | 2020-12-29 | 2025-01-22 | 川崎重工業株式会社 | ロボットシステム及び撮影方法 |
JP2022144478A (ja) * | 2021-03-19 | 2022-10-03 | 川崎重工業株式会社 | ウエハ搬送ロボット及びウエハ取出方法 |
US12046501B2 (en) * | 2022-10-06 | 2024-07-23 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate handling apparatus and method of handling substrate |
JP2024055616A (ja) * | 2022-10-07 | 2024-04-18 | 川崎重工業株式会社 | 基板搬送用ロボットシステム、および、基板搬送用ロボットによる基板の置き位置および取り位置の少なくともいずれかの補正方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05343495A (ja) * | 1992-06-05 | 1993-12-24 | Tokyo Electron Tohoku Ltd | 被処理物の移載装置 |
JP3242710B2 (ja) * | 1992-09-01 | 2001-12-25 | 横浜ゴム株式会社 | 移載物の軸間受渡し方法 |
JPH0970780A (ja) | 1995-09-06 | 1997-03-18 | Fanuc Ltd | ロボットのツール形状補正方式 |
JP3507330B2 (ja) * | 1998-05-18 | 2004-03-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US20040199361A1 (en) * | 2003-04-01 | 2004-10-07 | Ching-Shan Lu | Method and apparatus for equipment diagnostics and recovery with self-learning |
JP4342923B2 (ja) * | 2003-12-09 | 2009-10-14 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP2006120820A (ja) * | 2004-10-21 | 2006-05-11 | Hitachi Sci Syst Ltd | 薄型基板処理装置及び薄型基板搬送装置 |
JP4869852B2 (ja) * | 2006-09-28 | 2012-02-08 | 株式会社ダイヘン | 搬送用ロボットの教示方法 |
JP5272617B2 (ja) | 2008-09-26 | 2013-08-28 | 株式会社Ihi | ロボット装置及びロボット装置の制御方法 |
JP2010188437A (ja) * | 2009-02-16 | 2010-09-02 | Amada Co Ltd | ロボットハンドの歪み検出方法および自動交換システム |
JP5661022B2 (ja) * | 2011-11-21 | 2015-01-28 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
JP6035063B2 (ja) * | 2012-06-29 | 2016-11-30 | 株式会社ダイヘン | 基板搬送装置 |
CN107000224B (zh) | 2014-12-22 | 2019-09-24 | 川崎重工业株式会社 | 机械手系统及末端执行器的变形检测方法 |
JP2016185572A (ja) * | 2015-03-27 | 2016-10-27 | セイコーエプソン株式会社 | ロボット、ロボット制御装置およびロボットシステム |
KR102181121B1 (ko) * | 2016-09-20 | 2020-11-20 | 주식회사 원익아이피에스 | 기판 이송 장치 및 기판 이송 장치의 제어 방법 |
-
2016
- 2016-09-28 JP JP2016189150A patent/JP6718352B2/ja active Active
-
2017
- 2017-09-21 KR KR1020187037035A patent/KR102172266B1/ko active Active
- 2017-09-21 CN CN201780050991.6A patent/CN109564889B/zh active Active
- 2017-09-21 US US16/337,856 patent/US11476138B2/en active Active
- 2017-09-21 WO PCT/JP2017/034016 patent/WO2018061957A1/ja active Application Filing
- 2017-09-25 TW TW106132806A patent/TWI659491B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2018056256A (ja) | 2018-04-05 |
US20200027765A1 (en) | 2020-01-23 |
WO2018061957A1 (ja) | 2018-04-05 |
KR102172266B1 (ko) | 2020-10-30 |
KR20190013863A (ko) | 2019-02-11 |
CN109564889A (zh) | 2019-04-02 |
CN109564889B (zh) | 2023-04-11 |
TWI659491B (zh) | 2019-05-11 |
TW201828390A (zh) | 2018-08-01 |
US11476138B2 (en) | 2022-10-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6718352B2 (ja) | 基板搬送ハンドの診断システム | |
CN108274469B (zh) | 基于多维视觉传感器的真空机械手防碰撞检测系统的检测方法 | |
US11267142B2 (en) | Imaging device including vision sensor capturing image of workpiece | |
JP4174342B2 (ja) | ワーク搬送装置 | |
US20170043477A1 (en) | Robot system with visual sensor and a plurality of robots | |
US10068872B2 (en) | Mounting apparatus and method of correcting offset amount of the same | |
US9694499B2 (en) | Article pickup apparatus for picking up randomly piled articles | |
CN102837317B (zh) | 拾取系统 | |
JP5893695B1 (ja) | 物品搬送システム | |
JP5272617B2 (ja) | ロボット装置及びロボット装置の制御方法 | |
CN111745617B (zh) | 搬送装置和交接系统 | |
US12194644B2 (en) | Work robot and work system | |
US20220088795A1 (en) | Manipulator controller, manipulator control method, and non-transitory computer-readable storage medium storing manipulator control program | |
JP7281910B2 (ja) | ロボット制御システム | |
CN116758017A (zh) | 流水线上密集竖排的袋装食品精确数量与异常情况的视觉实时检测方法 | |
TWI832118B (zh) | 機器人系統及滑動判定方法 | |
JP6218782B2 (ja) | 締結作業方法及び締結システム | |
JP7326082B2 (ja) | 荷役装置の制御装置、及び、荷役装置 | |
JP7213010B2 (ja) | ロボットシステム及び搬送されているワークに対して作業を行う方法 | |
US11679502B2 (en) | Robot control system | |
CN112060073B (zh) | 机器人系统 | |
JP2021030392A (ja) | ワーク搬送装置およびワークの搬送方法 | |
CN118679038A (zh) | 机器人监视系统、监视装置、监视装置的控制方法以及程序 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190828 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200519 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200612 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6718352 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |