JP6673268B2 - Management device, control method of management device, information processing program, and recording medium - Google Patents

Description

  The present invention relates to a management device and the like for managing a wire bonding line for arranging electronic components on a substrate on which wiring is formed and performing wire bonding.

  Conventionally, a COB (Chip on Board) method is known as a method of mounting an unpackaged IC chip (bare chip) on a printed wiring board. The COB method is performed in the following procedure. The bare chip is placed on a printed wiring board and bonded using, for example, a silver paste (die bonding). Then, the printed wiring board on which the bare chip is mounted is subjected to plasma cleaning to clean the surface thereof. After the plasma cleaning, wire bonding (wire bonding) is performed between the electrode portion of the bare chip and the terminal portion formed as a part of the wiring of the printed wiring board. Thereafter, the bare chip and the wire are sealed with a resin, and a desired product is manufactured through a post-process such as mounting of another electronic component.

  When such a COB method is used, the shape of the state where the IC chip is mounted on the printed wiring board can be made thinner and smaller than when the package type IC chip is mounted on the printed wiring board. However, a bonding portion formed by wire bonding may have a decrease in bonding strength and peeling due to various factors.

  Therefore, a method has been proposed in which a terminal, a pad, and a lead frame are irradiated with light before wire bonding, and the surface state of the terminal, pad, and lead frame is grasped based on the reflectance of the light (for example, see Patent Document 1). In this method, when the surface condition is poor, the ultrasonic output at the time of wire bonding is increased to improve the quality of the bonded portion.

JP-A-5-160229 (published June 25, 1993)

  However, the bonding strength of the bonding portion is susceptible to the influence of the 4M fluctuation (the influence of the apparatus and the operator, etc.), and particularly the fluctuation of the quality of the plating (for example, gold plating) applied to the terminal portion of the printed wiring board. Is big.

  As in the method described in Patent Literature 1, even when the ultrasonic wave output is increased by grasping that the surface state is poor before wire bonding, bonding failure may occur at the bonding portion. there were. In this case, the IC chip and the wire having a poor connection will be discarded, resulting in a production loss.

  An object of one embodiment of the present invention is to realize a management device that can reduce production loss.

  In order to solve the above problem, a management device according to one embodiment of the present invention arranges an electronic component on a substrate on which a wiring is formed and wire-bonds an electrode portion of the electronic component and a terminal portion of the wiring. A management device that manages a wire bonding line, a board evaluation unit that evaluates the substrate based on surface state information related to a surface state of the substrate before placing the electronic component, and an apparatus that includes the wire bonding line. A condition setting unit that sets the operating conditions of the substrate, the substrate evaluation unit evaluates whether the substrate has a surface state suitable for wire bonding for each of one or more predetermined regions of the substrate. The condition setting unit determines that the electronic component is not arranged in the inappropriate bonding region for the inappropriate bonding region evaluated to be unsuitable for wire bonding, and the appropriate bonding region evaluated to be suitable for wire bonding. To Then, based on the latest relationship between the surface state, the operating conditions, and the bonding quality state of the wires bonded by the wire bonding line, different operating conditions are set according to the surface state of the appropriate bonding region. It is characterized by doing.

  Here, the bonding strength of the bonding part (part-side bonding part) formed on the electrode part of the electronic component by wire bonding and the bonding part (substrate-side bonding part) formed on the terminal part of the board is determined by the electrode part and the terminal part. Fluctuates depending on the surface condition of Plating (for example, gold plating) is applied to the terminal portion of the substrate, and the bonding strength of the substrate-side bonding portion is affected by the quality of the plating.

  The quality of plating can vary depending on various factors such as various conditions in the plating process and deterioration of the plating solution. However, in general, inspection of the plating quality state is not perfect (not performed) at a site such as a factory that manufactures products. That is, the variation factor in the plating process is directly linked to the variation factor in the wire bonding process.

  In the wire bonding line, wire bonding is performed after removing contamination on the surface of the plating by, for example, plasma cleaning. When a bonding failure occurs, the plating quality is analyzed and evaluated. If the plating quality is out of the predetermined specification, the substrate is discarded. To do).

  However, if the plasma cleaning time is too long, there is a problem that a bad influence is exerted on the bare chip and that the plating thickness is reduced and the bonding strength is reduced. It is also conceivable to change the wire bonding conditions, but this alone has a narrow adjustable range, and it is difficult to make all the products non-defective even if the plating quality is within a predetermined specification.

  In the wire bonding line, not only the plating quality fluctuates, but also the following fluctuations occur. That is, devices and tools used for wire bonding vary in their effects under certain operating conditions under the influence of the surrounding environment such as, for example, abrasion conditions, temperature, and humidity.

  According to the above configuration, before arranging the electronic component on the substrate, the substrate evaluation unit evaluates, for each predetermined region, whether or not the surface state is suitable for wire bonding. Here, the predetermined region may be the entire substrate. Alternatively, when a plurality of circuits for manufacturing a desired product are formed on a substrate, each circuit region can be a predetermined region.

  Then, the condition setting unit determines that the electronic component is not to be arranged in a bonding inappropriate region evaluated as inappropriate by the board evaluation unit for wire bonding. In addition, the condition setting unit, for a suitable bonding region evaluated to be suitable for wire bonding, the surface state of the substrate, the operating conditions, the bonding quality state of the wire bonded by the wire bonding line, Based on the latest relationship, different operating conditions are set according to the surface condition of the appropriate joining region.

  Here, the above relationship can be obtained in advance by using data of a combination of a certain surface condition and operating condition, and a wire joining quality condition of the joint obtained at that time. In addition, the above relation can be updated to the latest state by appropriately updating using the data obtained by operating the wire bonding line. Therefore, based on this relationship, it is possible to obtain an appropriate operating condition for achieving an appropriate wire bonding quality state (a bonding portion having a high bonding strength).

  That is, the wire bonding can be performed by changing the operating conditions in the wire bonding line to appropriate operating conditions that can increase the bonding strength.

  Therefore, it is possible to reduce the probability that a bonding failure is found after the electronic components are arranged and the wires are bonded. As a result, it is possible to reduce the occurrence of defects such as defects of materials such as electronic components and wires, time spent in a production process, energy, and the like, which are found after wire bonding. Therefore, production loss can be reduced.

  Further, in the management device according to one aspect of the present invention, the predetermined region includes one or more terminal portions, and the wire bonding line includes a surface cleaning device configured to clean a surface of the substrate on which the electronic component is disposed. And a wire bonding apparatus that applies a load and an ultrasonic wave using a metal wire to wire-bond the electrode part and the terminal part of the electronic component, and the surface state of the substrate based on the surface state information. State classification information on rules for classifying, and a storage unit for storing operation condition information indicating the relation with respect to operation conditions corresponding to each classification, and for each classification of the state classification information, the surface cleaning The combination of the surface cleaning conditions in the apparatus and the wire bonding conditions in the wire bonding apparatus are different, and the condition setting unit determines that the appropriate bonding area has a good surface condition. When evaluated by the evaluation unit, according to the surface condition of the appropriate bonding region, while changing the wire bonding conditions in the wire bonding device, the surface cleaning conditions in the surface cleaning device should not be changed. preferable.

  According to the above configuration, the state classification information includes information on rules for classifying the surface state of the substrate. The surface state can be classified using the surface state information and the state classification information.

  The condition setting unit sets appropriate surface cleaning conditions and wire bonding conditions according to the classification result by the substrate evaluation unit. Here, the operating condition information, for example, for each classification of the surface state of the substrate, mapping the relationship between the surface cleaning conditions and wire bonding conditions, the bonding strength of the bonding portion, to determine the operating conditions at which the bonding strength is maximum. It can be created by asking. By setting the operating conditions using the operating condition information, the joining strength of the joint can be increased. Therefore, it is possible to reduce the probability that a bonding failure is found, and reduce production loss.

  The combination of the operating conditions of the surface cleaning device and the wire bonding device differs for each classification of the state classification information. Here, if there is an appropriate bonding region that is evaluated as being in a good surface state by the substrate evaluation unit, the wire bonding conditions in the wire bonding device are changed, and the surface cleaning conditions in the surface cleaning device are not changed. That is, when the substrate quality is good (normal case), the surface cleaning time (for example, the plasma cleaning time) need not be changed. Therefore, the production quantity of the products in the wire bonding line and the COB type production line can be stabilized. This is because if the surface cleaning time is lengthened, the speed of the production line can be reduced. Further, in the conventional method, if the surface cleaning time is changed, it is necessary to search for an appropriate wire bonding condition, and the time for that is required.

  Further, the surface cleaning time is changed only when the plating quality of the substrate put into the line is within the predetermined specification but is poor quality. This makes it possible to reduce product defects while suppressing a decrease in the production quantity of the product.

  As a result, it is possible to reduce the number of defects while reducing the effect on the production quantity of products in the wire bonding line and the COB type production line.

  Further, in the management device according to one aspect of the present invention, when a portion to be wire-bonded in the terminal portion is a board-side bonding target portion, the surface state information is obtained by measuring an image of the surface of the substrate. In addition, each of the measurement values of the plurality of board-side joining target portions includes a measurement range, and the state classification information includes a numerical range for determining that the board-side joining target portion is inappropriate for wire joining, and a plurality of the board. The substrate evaluation unit, based on the surface state information and the state classification information, determines the inappropriate bonding area, When there is a suitable bonding region, based on a representative value calculated using a measurement value of one or more substrate-side bonding target portions included in the suitable bonding region, the surface state of the substrate is classified and evaluated. Good

  According to the above configuration, as the surface state information of the substrate, image data obtained by imaging the surface of the substrate can be image-measured, and information quantified by, for example, saturation, brightness, hue, or the like can be obtained. The state classification information includes information on a numerical range for classifying the surface state of the substrate. Therefore, the classification of the surface state can be relatively easily performed using the surface state information and the state classification information.

  In addition, when there is an appropriate bonding region on the substrate, the substrate evaluation unit determines a surface state of the substrate based on a representative value calculated using a measurement value of one or more substrate-side bonding target portions included in the appropriate bonding region. Can be classified. This representative value may be an average value or a median value of a plurality of measured values. In this case, the condition setting unit can set appropriate operating conditions based on the overall surface state of the substrate. Therefore, it is easy to increase the bonding strength of each bonding portion in the entire substrate.

  Alternatively, as the representative value, a measurement value estimated to have the worst plating quality among the measurement values of one or more substrate-side bonding target portions included in the appropriate bonding region may be employed.

  This makes it possible to further reduce the probability that a bonding defect will be found after the electronic components are arranged and wire bonding is performed. Therefore, production loss can be reduced.

  Further, the management device according to one aspect of the present invention is configured such that, when wire bonding is performed under certain surface cleaning conditions and wire bonding conditions, the strength of the wire bonding portion is determined based on information including an ultrasonic waveform acquired from the wire bonding device. A strength estimating unit for estimating the surface cleaning conditions, wire bonding conditions, and the estimated strength of the wire bonding unit, and using the estimated strength of the wire bonding unit, a condition information creating unit that creates the operating condition information for each classification of the surface state of the substrate; May be further provided.

  According to the above configuration, the strength estimating unit estimates the strength of the joint based on the information including the ultrasonic waveform at the time of wire joining. Here, along with the operation of the wire bonding line, data on the operating conditions, the surface condition of the substrate-side bonding target portion, and the corresponding estimated strength of the bonding portion are obtained. The condition information creation unit can create operation condition information using the obtained data.

  Further, in the management device according to one aspect of the present invention, the condition information creating unit may include a surface cleaning condition, a wire joining condition, and an estimated strength of the wire joining unit as a result obtained by operating the wire joining line. Preferably, the operating condition information is updated using a combination of

  According to the above configuration, the condition information creating unit can also appropriately update the operation condition information. This makes it possible to obtain, as the operating condition information, the latest relationship between the surface state of the substrate, the operating conditions, and the bonding quality state of the wires bonded by the wire bonding line. Therefore, it is possible to obtain an appropriate operating condition for achieving an appropriate wire bonding quality state (a bonding portion having a high bonding strength) based on the latest relationship.

  Further, in the management device according to one aspect of the present invention, the board evaluation unit may be configured such that the board-side bonding target unit that indicates a measurement value within a numerical range classified as inappropriate for wire bonding in a predetermined area. When there is one or more, it is preferable that the area be evaluated as the inappropriate bonding area.

  According to the above configuration, a region including at least one substrate-side bonding target portion unsuitable for wire bonding can be a bonding inappropriate region. This makes it possible to further reduce the probability that a bonding defect will be found after the electronic components are arranged and wire bonding is performed.

  Further, in the management device according to one aspect of the present invention, the board is a multi-piece board formed by arranging a plurality of circuit boards, and the one or more predetermined areas correspond to the circuit boards, respectively. May be.

  According to the above configuration, the multi-piece board is put into the wire bonding line, and the electronic device is not arranged on the circuit board evaluated as the unsuitable joining area, and the electronic device is arranged on the other circuit boards. Wire bonding can be performed under operating conditions according to the surface condition.

  In order to solve the above problem, a control method of a management device according to one embodiment of the present invention includes disposing an electronic component on a substrate on which a wiring is formed, and connecting an electrode part of the electronic component and a terminal part of the wiring. A control method of a management device that manages a wire bonding line for performing wire bonding, wherein a board evaluation step of evaluating the board based on surface state information on a surface state of the board before arranging the electronic component; and And a condition setting step of setting an operating condition of an apparatus included in the bonding line. In the substrate evaluating step, for each of one or more predetermined regions, the substrate is in a surface state suitable for wire bonding. It is evaluated whether or not the electronic component is not arranged in the inappropriate bonding region for the inappropriate bonding region evaluated as inappropriate for wire bonding in the condition setting step. For the appropriate bonding region evaluated to be suitable for wire bonding, based on the latest relationship between the surface state, the operating conditions, and the bonding quality state of the wires bonded by the wire bonding line. It is characterized in that different operating conditions are set according to the surface condition of the appropriate joining region.

  According to the above configuration, in the board evaluation step, before arranging the electronic component on the board, the board is evaluated for each predetermined region whether or not the surface state is suitable for wire bonding. Then, in the condition setting step, it is determined that the electronic component is not to be arranged in the unsuitable bonding region evaluated as inappropriate for wire bonding in the board evaluation step. Further, in the condition setting step, different operating conditions are set according to the surface condition of the appropriate bonding region evaluated as being suitable for wire bonding. That is, the wire bonding can be performed by changing the operating conditions in the wire bonding line to appropriate operating conditions that can increase the bonding strength.

  Therefore, it is possible to reduce the probability that a bonding failure is found after the electronic components are arranged and the wires are bonded. As a result, it is possible to reduce the occurrence of defects such as defects of materials such as electronic components and wires, time spent in a production process, energy, and the like, which are found after wire bonding. Therefore, production loss can be reduced.

  According to one embodiment of the present invention, there is an effect of realizing a management device capable of reducing production loss.

It is a block diagram which shows roughly the structure of the management system including the management apparatus of this Embodiment, and a wire joining line. It is a figure which shows the outline of an example of the electronic component mounting process of a COB system. It is a figure in an administration system of one embodiment of the present invention which shows roughly an example of a flow of processing performed in a wire joining line. It is a table | surface which shows the specific example of classification reference | standard data and operating condition data. (A) is a table showing a change history of operating conditions, and (b) is a table showing joining condition data at the time of wire joining and joining strength of a joining portion estimated from data obtained at the time of wire joining. . (A) is a table showing operating conditions and strength estimation results for the second bond, and (b) is a table showing operating conditions and strength estimation results for each saturation classification in the second bond. 5 is a flowchart illustrating a flow of a process executed by the management device according to the present embodiment. 5 is a flowchart illustrating a flow of an update process executed by the management device according to the present embodiment.

  One embodiment of the present invention will be described below with reference to FIGS.

  In the present embodiment, a wire for bonding a bare chip (electronic component) on a printed wiring board (substrate on which wiring is formed), which is a partial process in a COB-type electronic component mounting process, is used as a management device. A management device that manages a joining line will be described. Note that the management device in one embodiment of the present invention is not necessarily limited to this. For example, the present invention can be applied to a process of mounting a bare chip by wire bonding on a substrate having a lead frame (terminal portion) as a wiring in a manufacturing process of an IC package.

  In the present embodiment, a configuration in which a single-sided hard printed wiring board having a conductor pattern formed on one side is used as a substrate on which a bare chip is mounted will be described. In another embodiment, the substrate may be, for example, a double-sided printed wiring board, a multilayer printed wiring board, or a flexible board.

(Wire bonding line)
FIG. 2 is a diagram illustrating an outline of an example of a COB-type electronic component mounting process. Here, an example of a COB-type electronic component mounting process will be described, and a detailed description will be omitted for convenience of description. In this description, a wire bonding line to be managed by the management device according to one embodiment of the present invention will be schematically described.

  As shown in FIG. 2, a COB electronic component mounting process 900 as an example is performed according to the following flow. First, in a pre-process not shown, a bare chip (also referred to as a die) cut out from a wafer on which an integrated circuit is formed, and a printed wiring board are prepared. A plating process is appropriately performed on the printed wiring board. For example, gold plating is applied to an end portion (terminal portion) of the wiring to be wire-bonded to the bare chip on the printed wiring board. Hereinafter, this terminal portion may be referred to as a substrate-side pad. The plating is not limited to gold plating, but may be copper plating or aluminum plating.

  A die bonder 901 arranges and bonds a bare chip on a printed wiring board using, for example, a silver paste as a die bond. The die bond is cured using the oven 902. Next, using a plasma cleaner 903, the surfaces of the bare chip and the printed wiring board are subjected to plasma cleaning. Thereby, the electrode surface of the bare chip and the gold plating surface of the substrate side pad are cleaned. Hereinafter, the electrode (electrode portion) of the bare chip may be referred to as a chip-side pad. Using a wire bonder 904, the chip side pad and the substrate side pad are wire bonded. This wire bonding is performed using, for example, gold.

  In general, inspection of wire bonding is performed by visual inspection by a person. Here, the case where the appearance inspection device 905 is used is shown. Using an auto dispenser 906, a resin such as silicon is applied and sealed so as to cover the bare chip, the gold wire, and the joint. The resin is defoamed using a defoaming machine 907. The resin is cured using a curing furnace 908.

  Thereafter, cream solder is applied onto the printed wiring board using an automatic solder printer 909. Various electronic components such as a chip capacitor and a resistor are mounted on the cream solder by using a chip mounter 910, and then reflowed by using a reflow furnace 911, so that the electronic components are surface-mounted. I do. A function test is performed using the function tester 912, and a product is manufactured through other post-processes.

  The wire bonding line managed by the management apparatus according to the present embodiment includes a process performed by the die bonder 901 to the wire bonder 904 in the COB electronic component mounting process 900.

(Management system)
FIG. 1 is a block diagram schematically illustrating a configuration of a management system 1 including a management device 10 and a wire bonding line 20 according to the present embodiment. Next, a configuration of the management system 1 including the management device 10 and the wire bonding line 20 according to one embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 1, the management system 1 includes a management device 10 and a wire bonding line 20. The management device 10 is communicably connected to each device included in the wire bonding line 20. The wire bonding line 20 includes a surface condition measuring device 21, a die bonding device 22, a plasma cleaning device (surface cleaning device) 23, and a wire bonding device 24.

  In the present embodiment, in a process prior to the wire bonding line 20, a printed wiring board sheet (a plurality of printed circuit boards) formed by arranging a plurality of printed wiring boards (circuit boards) is prepared. It is thrown into. Such a printed wiring board sheet is subjected to various processes in a post-process of the wire bonding line 20 and then cut into each printed wiring board to be a product. In other words, the printed wiring board sheet includes a plurality of pieces as circuit boards.

  The surface condition measuring device 21 includes a camera, and uses the camera to capture an image of the surface of the printed wiring board sheet before the bare chip is arranged, and analyze the obtained image data. The surface condition measuring device 21 includes data on the respective positions of the plurality of board-side pads existing on the surface of the printed wiring board sheet, and a portion where the wire joining device 24 joins the wires in a later step (board side). At least one of the data on the position of the joining target portion) is input. This input may be performed by transferring data from the management device 10 or may be performed using an input unit (not shown) included in the wire bonding device 24.

  The surface condition measuring device 21 analyzes the image data for each of the plurality of board-side joining target portions included in the printed wiring board sheet based on the input data, and quantifies the surface condition. This digitization can be performed by, for example, hue, saturation, brightness, or the like. In the present embodiment, saturation is used.

  The surface state measurement device 21 may recognize the position of the substrate-side pad by analyzing the image data.

  By digitizing the target portion to be bonded on the substrate side, it is possible to detect not only the dirt caused by the contamination of the plating solution in the previous process but also the defect of the surface state at a specific point due to scattering of other dirt and the like. .

  Further, the specific mode in which the surface state measuring device 21 quantifies the surface state of a portion to be wire-bonded, such as a substrate-side bonding target portion or a substrate-side pad, is not particularly limited. For example, the surface state may be quantified using a method of irradiating infrared light and measuring the reflectance or absorptance of the infrared light.

  The die bonding apparatus 22 is configured to include the die bonder 901 and the oven 902 included in the COB-type electronic component mounting process 900 described above. A known device may be used as the die bonding device 22, and a detailed description thereof will be omitted.

  The plasma cleaning device 23 is a device that removes organic substances on the surfaces of the substrate-side pad and the chip-side pad using argon plasma. The wire bonding apparatus 24 is a thermosonic (ultrasonic thermocompression bonding) method that uses a gold wire (metal wire) passing through a capillary to perform bonding using ultrasonic waves in addition to heat and load. Bonding). Known devices can be used as the plasma cleaning device 23 and the wire bonding device 24, and a detailed description thereof will be omitted. The plasma cleaning device 23 is an example of a surface cleaning device, and the surface cleaning device is not limited to this. An apparatus for removing organic substances on the surface of the substrate-side pad and the chip-side pad using a laser or an ion beam can also be used.

  The wire bonding line 20 only needs to be configured in the order of the surface state measuring device 21 to the wire bonding device 24, and may include another device (not shown) between the devices. During the processing in the wire bonding line 20, the printed wiring board sheet may be temporarily stored in a storage location (not shown).

(Management device 10)
The management device 10 includes a state determination unit (board evaluation unit) 11 that determines the surface state of the printed wiring board sheet to be evaluated, and an appropriate device included in the wire bonding line 20 based on the determination result (evaluation) of the surface state. Operating condition setting unit (condition setting unit) 12 for setting various operating conditions, a strength estimating unit 13 for estimating the wire joining strength based on the information at the time of wire joining from the wire joining device 24, the operating conditions and the estimation. A log data creation unit 14 that creates log data using intensity, a storage unit 15 that stores various data, and a condition creation unit (condition information creation unit) 16 that creates and updates data stored in the storage unit 15 And The management device 10 may be configured by, for example, a PC (Personal Computer).

  The storage unit 15 also stores classification reference data (state classification information) 15a serving as a reference for determining (classifying) the surface state of the printed wiring board, and the appropriateness of the wire bonding line 20 corresponding to each classification of the surface state. Log data in which operating condition data (operating condition information) 15b for various operating conditions, operating conditions of the wire bonding line 20, and the wire bonding strength (bonding quality state) estimated by the strength estimating unit 13 are recorded. 15c are stored. The classification reference data 15a, the operating condition data 15b, and the log data 15c will be described later in detail together with the description of the processing flow executed by the management system 1.

  The state determination unit 11 determines the bare chip based on the information (surface state information) about the saturation as the index of the surface state of each substrate-side bonding target, which is received from the surface state measurement device 21, and the classification reference data 15a. The surface condition of the printed wiring board sheet (substrate) before being arranged is evaluated. Here, the state determination unit 11 evaluates the surface state of each of the plurality of circuit boards included in the printed wiring board sheet. Then, it is determined that the circuit board including the board-side bonding target portion that is not suitable for wire bonding is a bonding inappropriate substrate (bonding inappropriate region) that is not suitable for wire bonding. In other words, the state determination unit 11 evaluates, for each of one or more predetermined regions, whether or not the region has a surface state suitable for wire bonding, for each of one or more predetermined regions. The classification reference data 15a is data serving as a reference for this determination.

  Here, the circuit board as the predetermined area includes a board-side pad (terminal part). Although the number of the board-side pads is not particularly limited, the circuit board includes at least one board-side pad. One board-side pad includes at least one board-side joining target portion.

  As will be described in detail later, the state determination unit 11 determines, based on the surface state information and the classification criterion data 15a, that when the saturation of a certain substrate side bonding target part is within a predetermined numerical range, the substrate side bonding target part is It is determined that it is not suitable for wire bonding. In this case, the state determination unit 11 determines that the circuit board (predetermined region) including the board-side bonding target portion is a board that is not suitable for bonding.

  The state determination unit 11 determines that the circuit board, which is not determined as an unsuitable bonding board and is evaluated as capable of wire bonding, in the printed wiring board sheet is a bondable board (suitable bonding area). Here, when the printed wiring board sheet includes a plurality of bondable boards, the state determination unit 11 determines the state of the printed wiring board sheet based on the saturation information of the board-side bonding target portion included in each of the plurality of bondable boards. Calculate the representative saturation as a representative value.

  The representative saturation may be an average value or a median of a plurality of saturations obtained from a plurality of board-side joining target portions included in the printed wiring board sheet. In addition, the representative saturation may be the saturation closest to the numerical range of the classification reference data 15a that is determined to be an unsuitable bonding substrate among the plurality of saturations obtained from the plurality of substrate-side bonding target portions. Good. Further, the representative saturation may be, for example, a value adopting a maximum value or a minimum value of a plurality of saturations obtained from a plurality of board-side joining target portions included in the printed wiring board sheet. The method for calculating the representative saturation is not particularly limited.

  Then, the representative saturation may be calculated using the saturation of all the board-side joining target portions included in the plurality of bondable boards included in the printed wiring board sheet, and may be calculated from among all the board-side joining target portions. The calculation may be performed using the extracted saturations of the plurality of substrate-side joining target portions.

  Note that the configuration may be such that the image data captured by the camera of the surface state measurement device 21 is analyzed by the state determination unit 11 instead of the surface state measurement device 21 to calculate the saturation.

  The operating condition setting unit 12 sets the operating conditions of the die bonding device 22, the plasma cleaning device 23, and the wire bonding device 24 based on the evaluation result by the state determination unit 11 and the operating condition data 15b. The operating condition setting unit 12 determines the operating conditions of the die bonding apparatus 22 so that no bare chip is placed on the inappropriate bonding substrate. Further, the operating conditions of the plasma cleaning device 23 and the wire bonding device 24 are set based on the surface condition of the printed wiring board sheet and the operating condition data 15b classified based on the representative saturation of the printed wiring board sheet. This will be described later in detail.

  The strength estimating unit 13 estimates the joining strength of the joint based on the ultrasonic waveform data at the time of wire joining obtained from the wire joining device 24. For example, the following method can be used for estimating the bonding strength. The wire bonding device 24 includes a vibrator. The current value flowing through the vibrator, the driving voltage of the vibrator, and the movement of the tip of the capillary that has moved in the pressing direction while performing wire bonding to one portion to be bonded. The intensity is estimated using the amount (the amount of Z-axis displacement). The current value flowing through the vibrator and the driving voltage of the vibrator correspond to the ultrasonic waveform of the vibrator. That is, the joining strength can be estimated from the waveform amplitude stabilizing part in the ultrasonic waveform of the transducer. For example, the following equation can be used.

Intensity = a0 + a1 × X1 + a2 × X2 + a3 × X3
Here, X1 is a Z-axis displacement (change amount), X2 is a current (amplitude), and X3 is a voltage (amplitude). a0, a1, a2, and a3 are influence coefficients.

  Note that the strength estimating unit 13 may be configured to estimate the joint strength using at least information including an ultrasonic waveform. Further, the strength estimating unit 13 may estimate the joining strength by using another known method.

  The log data creating unit 14 creates log data 15c using the following information acquired from the operating condition setting unit 12 and the strength estimating unit 13. That is, the log data creating unit 14 acquires information on the operating conditions of the die bonding device 22, the plasma cleaning device 23, and the wire bonding device 24 from the operating condition setting unit 12. Further, the log data creating unit 14 also acquires, through the operating condition setting unit 12, information on the saturation of the substrate-side joining target portion used in the state determining unit 11. In addition, the log data creating unit 14 acquires, from the strength estimating unit 13, information on the joining strength estimated for the joining portion formed by wire joining to the board-side joining target portion. The log data creation unit 14 creates log data 15c using these pieces of information.

  The log data creating unit 14 is also used to create log data 15c using past operation history data input using an input unit (not shown) of the management device 10.

  The condition creation unit 16 creates and updates the operation condition data 15b using the log data 15c, which will be described in detail later.

(Wire bonding line)
FIG. 3 is a diagram schematically illustrating an example of a flow of processing performed in the wire bonding line 20 in the management system 1 according to the embodiment of the present invention. Next, the management of the wire bonding line 20 (manufacturing line) by the management device 10 according to the present embodiment will be described with reference to FIG. The wire bonding line 20 managed by the management device 10 in the present embodiment includes (1) surface measurement, (2) substrate evaluation, (3) die bonding, (4) plasma cleaning, and (5) wire bonding process. including. Hereinafter, each of these steps and the preceding steps will be described.

(pre-process)
First, it is assumed that the printed wiring board sheet 30 and the bare chip 40 are prepared in the pre-process. The printed wiring board sheet 30 includes a plurality of circuit boards 31. The printed wiring board sheet 30 of the present embodiment is printed with printed wiring (circuit) in 16 sections, for example, so that 16 products are finally obtained. This may be done by connecting the sixteen circuit boards 31 to form a printed wiring board sheet 30 so that the printed wiring board sheet 30 can be separated in a later process, or by finally cutting the printed wiring board sheet 30. Alternatively, the circuit board 31 may be used. The specific mode such as the shape of the printed wiring board sheet 30 is not particularly limited.

(1) Surface Measurement As shown as “(1) Surface Measurement” in FIG. 3, the camera 21 a included in the surface state measurement device 21 captures image data of the surface of the printed wiring board sheet 30. The surface state measuring device 21 performs image analysis on the obtained image data, and calculates saturation as a surface state index for the board-side joining target portions included in each of the 16 circuit boards 31. Here, what kind of properties are selected as the circuit board 31 and the bare chip 40 in order to manufacture a desired product is not particularly limited. The number of board-side joining target portions included in one circuit board 31 may be one hundred or more. Similarly, the number of chip-side pads included in one bare chip 40 may be one hundred or more.

(2) Board Evaluation As shown as “(2) Board Evaluation” in FIG. 3, the state determination unit 11 determines the state of the surface state of the 16 circuit boards 31 based on the surface state information and the classification reference data 15a. The surface condition of the printed wiring board sheet 30 is evaluated. Then, based on the evaluation, the operating condition setting unit 12 sets the operating conditions of the die bonding device 22, the plasma cleaning device 23, and the wire bonding device 24.

  The classification criterion data 15a includes an appropriate numerical value range serving as a criterion for determining whether or not the substrate is a bonding inappropriate substrate. This appropriate numerical range can be set appropriately in advance. Although the surface state of the substrate-side bonding target portion can be improved by plasma cleaning in a later process, the plasma cleaning reduces the plating thickness when performed for a long time, and increases the required time, thereby lowering production efficiency. Therefore, the range of the cleaning time is substantially limited. The above-mentioned suitability numerical range may be set as a criterion based on whether or not the improvement of the surface state is limited and a bonding failure may occur when plasma cleaning is performed within a limited time range.

  Specifically, for example, when the state determination unit 11 determines that all of the 16 circuit boards 31 are unsuitable for bonding, the printed wiring board sheet 30 itself is NG-sorted, and is used for a subsequent process. Is not removed from the wire bond line. In addition, when the state determination unit 11 determines that, for example, one circuit board 31 is an unsuitable bonding board, the operation condition setting unit 12 determines not to dispose the bare chip 40 on the circuit board 31.

  In addition, the state determination unit 11 performs the following determination on the circuit board 31 that does not correspond to the unsuitable bonding board, that is, the circuit board 31 that does not include the board-side bonding target part having a saturation within the appropriate numerical value range. That is, specifically, for example, in the case where the number of unsuitable substrates is one, for the remaining fifteen circuit boards 31, first, the state determination unit 11 first determines the color of the board-side bonding target part included in the fifteen circuit boards 31. The representative saturation is determined based on the degree. Next, the surface state of the printed wiring board sheet 30 is classified based on the representative saturation and the classification reference data 15a. In the classification reference data 15a, numerical ranges corresponding to the classification of a plurality of surface states are set. The operating condition setting unit 12 sets the operating conditions of the plasma cleaning device 23 and the wire bonding device 24 based on the classified result.

  FIG. 4 shows a classification table as a table for easy understanding of specific examples of the classification reference data 15a and the operating condition data 15b. “PC time” means the plasma cleaning time (surface cleaning conditions) in the plasma cleaning device 23, and “Bond load” and “US_Power” are the load applied during bonding in the wire bonding device 24 and the ultrasonic output (wire Bonding condition), and the same applies to the following description in this specification.

  As illustrated in FIG. 4, as an example, the state determination unit 11 determines that the surface state of the circuit board 31 including the substrate-side bonding target part having the saturation of 130 or more is poor, and is a bonding inappropriate substrate. (NG selection). When the representative saturation as the representative value is 80 or more and less than 110, the state determination unit 11 determines that the surface state of the printed wiring board sheet 30 is good. In this case, the operating condition setting unit 12 does not change the operating condition of the plasma cleaning device 23 and sets the operating condition of the wire bonding device 24. More specifically, the plasma cleaning apparatus 23 sets the plasma cleaning time (the minimum value of the PC time) as short as possible as a standard set value. When the representative saturation is 80 or more and less than 110, the operating conditions of the plasma cleaning device 23 are not changed as the standard set values, and only the operating conditions of the wire bonding device 24 are set.

  When the representative saturation is less than 80, for example, the state determination unit 11 determines that the surface state is acceptable. In this case, the operating condition setting unit 12 sets the operating conditions of the plasma cleaning device 23 and the wire bonding device 24.

  The operating condition set by the operating condition setting unit 12 is determined based on the operating condition data 15b. The method of calculating the operation condition data 15b will be described later.

  The numerical range for classifying the surface state in the classification reference data 15a can be set in advance as appropriate. Further, it is preferable to set in consideration of the intensity resolution required for quality control.

(3) Die Bonding As shown as “(3) Die bonding” in FIG. 3, the bare chip 40 is arranged on the printed wiring board sheet 30 and bonded using, for example, a silver paste as a die bond. Here, a state in which the die bonding process is performed on six of the sixteen circuit boards 31 is shown.

  Here, for example, the die bonding apparatus 22 does not dispose the bare chip 40 on the circuit board 31a that is determined to be an unsuitable bonding board by the state determination unit 11. On the other hand, the die bonding apparatus 22 arranges the bare chip 40 on the circuit board 31 that has not been determined by the state determination unit 11 to be a bonding inappropriate board. Thus, it is possible to reduce the probability that a bonding failure is found after the electronic components are arranged and the wires are bonded. As a result, it is possible to reduce the loss of materials such as electronic components and wires, and the loss of time and energy spent in the production process in the subsequent steps.

  Note that a configuration in which a plurality of bare chips 40 are arranged on one circuit board 31 may be employed.

(4) Plasma Cleaning As shown as “(4) Plasma cleaning” in FIG. 3, the circuit board 31 and the bare chip 40 are each subjected to plasma cleaning. This plasma cleaning is performed by placing the printed wiring board sheet 30 in the plasma cleaning device 23.

  This cleaning time is performed under the conditions set by the operating condition setting unit 12 based on the evaluation (classification) of the surface condition of the printed wiring board sheet 30 as described above. Therefore, for example, when the surface state of the printed wiring board sheet 30 is “OK” and it is preferable to enhance the plasma cleaning of the substrate-side pads and the chip-side pad surfaces, the plasma cleaning time can be lengthened. . This time can be set appropriately within a range in which the plating thickness does not become too thin and the production efficiency does not decrease too much.

(5) Wire bonding As shown as “(5) Wire bonding” in FIG. 3, the chip-side pads of the bare chip 40 arranged on the circuit board 31 and the substrate-side pads of the circuit board 31 are connected to the wire bonding apparatus 24. And the wire is joined by the gold wire 50.

  Wire bonding is performed by a first bond performed on a chip-side pad and a second bond performed on a substrate-side pad. The joint formed by the first bond is referred to as a chip-side joint 51, and the joint formed by the second bond is referred to as a substrate-side joint 52.

  The bonding strength of the board-side bonding portion 52 is greatly affected by the plating state (surface state) of the board-side bonding target portion of the board-side pad. According to the processing of the wire bonding line 20 managed by the management device 10 of the present embodiment, it is possible to suppress the influence of such plating quality.

｛Operation condition setting｝
Next, creation of the log data 15c by the log data creation unit 14 and creation and update of the operation condition data 15b by the condition creation unit 16 will be described with reference to FIGS. FIG. 5A is a table showing the change history of the operating conditions, and FIG. 5B is a diagram showing the joining condition data at the time of wire joining and the joining of the joining portion estimated from the data obtained at the time of wire joining. It is a table | surface which shows intensity | strength. FIG. 6A is a table showing the operating conditions and the strength estimation results for the second bond, and FIG. 6B is a table showing the operating conditions and the strength estimation results for each saturation of the second bond. is there.

  First, the log data creation unit 14 acquires past operation history data on a certain wire bonding line. Here, for example, it is assumed that the operation history data of the wire bonding line from the die bonder 901 to the wire bonder 904 in the above-described COB-type electronic component mounting process 900 (see FIG. 2) is acquired.

  The history data may be data collected by the management device 10 by operating the wire bonding line 20.

  As shown in FIG. 5A, the operating time such as the PC time in the plasma cleaner 903 and the Bond load and US_Power in the wire bonder 904 are often changed. This change is appropriately made according to the state of the bonding portion after the wire bonding by the wire bonder 904, the bonding strength, and the like.

  Then, as shown in FIG. 5B, the operating conditions of the wire bonding apparatus and the strength estimation value estimated using the obtained data are obtained. Here, for example, three bare chips are arranged on a printed wiring board sheet, and six wires are bonded to each bare chip. Since there is a 1st bond and a 2nd bond for each of the 6 wires, 12 pieces of data are obtained from the printed wiring board sheet.

  The data of the saturation of the first bond on the chip side can be obtained by imaging the surface of the bare chip and analyzing the obtained image data. Further, the bonding strength at each bonding portion can be obtained by estimating using the above-described method.

  Using such past operation history data, the log data creation unit 14 creates log data 15c. The log data 15c may be in a format as shown in the table of FIG. 5B, or may be edited in another format.

  Next, the condition creating unit 16 creates operation condition data 15b using the log data 15c. The condition creating unit 16 extracts, from the log data 15c, main data on the second bond, that is, data on PC time, Bond load, US_Power, saturation, and intensity estimation result. FIG. 6A shows data of the condition function window in which these data are tabulated. Such condition function window data is similarly created for the first bond.

  Then, the condition creating unit 16 refers to the classification reference data 15a and, based on the numerical value range of the saturation corresponding to the classification of the surface state, divides the data of the above-mentioned condition function window by the classification of the surface state (saturation). By numerical range). FIG. 6B shows data of the condition function window for each classification.

  Subsequently, the condition creating unit 16 creates a response surface as described below using the data of the condition function window for each classification, and determines operating conditions that can increase the joining strength of the wire joint.

  For example, in a classification in which the saturation is 80 or more and less than 110 (the surface condition is good), a response surface can be created as in the following equation (1).

Intensity = b0 + b1 × Y1 + b2 × Y2 + b12 × Y1 × Y2 + b11 × Y1 × Y1 + b22 × Y2 × Y2 (1)
Here, Y1 is the Bond load, and Y2 is US_Power. b0, b1, b2, b12, b11, and b22 are influence coefficients.

  In addition, for example, in a classification in which the saturation is less than 80 (surface condition is acceptable), a response surface can be created as in the following equation (2).

Intensity = c0 + c1 × Y1 + c2 × Y2 + c3 × Y3 + c12 × Y1 × Y2 + c23 × Y2 × Y3 + c31 × Y3 × Y1 + c11 × Y1 × Y1 + c22 × Y2 × Y2 + c33 × Y3 × Y3 (2)
Here, Y1 is the Bond load, Y2 is US_Power, and Y3 is the PC time. c0, c1, c2, c3, c12, c23, c31, c11, c22, and c33 are influence coefficients.

  The response surface created as described above can be approximated using the least-squares method to determine the operating condition at which the strength is maximized. That is, it is possible to obtain an operating condition under which the derivative of the intensity on the response surface becomes zero. The maximum value of the intensity can also be obtained by using the Newton-Raphson method, the steepest descent method, or the like.

  In this way, the condition creating unit 16 determines the operating condition at which the joining strength of the joint is increased for each classification of the surface condition in the classification reference data 15a, and stores the operating condition in the storage unit 15 as the operating condition data 15b.

  The above can be summarized as follows. The operating condition data 15b is data indicating the latest relationship between the surface state of the circuit board 31, the operating conditions of the device included in the wire bonding line, and the bonding quality state of the wires bonded by the wire bonding line. The operating condition setting unit 12 sets different operating conditions according to the surface condition of the appropriate joining region using the operating condition data 15b.

(Main effects of the management device 10)
Not only the quality of the plating (eg, gold plating) applied to the terminal portion of the printed wiring board but also the influence of 4M variation such as the wire bonding apparatus, the bonding tool, and the state of the die bonding in the previous process. receive. When the wire bonding conditions are determined based only on the surface state as in the method described in Patent Literature 1, the 4M variation is not taken into account, and it is difficult to set appropriate wire bonding conditions.

  Also, even if the ultrasonic output is increased according to the plating state, only the oxide film on the plating surface of the portion to be joined is mechanically shaved, so unlike plasma cleaning, dirt and dust are likely to remain. . In particular, dirt may remain around the portion to be joined. Therefore, even if the conditions are adjusted, the strength of the wire bonding portion cannot be made sufficient, and the applicable range is reduced only by increasing the ultrasonic output. Further, since there is a possibility that dirt may remain, there is a large risk of peeling off in a post-process including a use environment of a customer.

  On the other hand, the management apparatus 10 according to one embodiment of the present invention selects a substrate having a severe plating contamination state as a bonding inappropriate substrate and does not arrange a bare chip. As a result, loss of production man-hours can be eliminated. In addition, the management device 10 controls the conditions of the plasma cleaning process (PC time) and the conditions of the wire bonding process (ultrasonic output power, indentation load) so that the bonding strength increases according to the surface condition of the printed wiring board sheet 30. Set. Thereby, the operating conditions can be adjusted and applied to a wider range of plating conditions. Then, when the plasma cleaning time, which has conventionally occurred, is adjusted, the step of creating the conditional function window again and adjusting the ultrasonic output power and the pushing load is unnecessary.

  Further, since the plating quality fluctuates with time, if time is spent on condition adjustment, it may no longer be usable. On the other hand, the management apparatus 10 can create the latest condition function window using the intensity estimation result of the ultrasonic waveform and automatically optimize the process conditions. Therefore, the process of the wire bonding line 20 can be performed under the process conditions suitable for the latest plating quality state.

(Processing flow)
With reference to FIG. 7, a flow of processing performed by the management device 10 of the present embodiment will be described. FIG. 7 is a flowchart illustrating a flow of a process executed by the management device 10 according to the present embodiment.

  As shown in FIG. 7, the management device 10 first causes the surface state measurement device 21 to acquire image data of the surface of the printed wiring board sheet 30 (Step 11: hereinafter abbreviated as S11).

  Next, the management device 10 causes the surface state measurement device 21 to perform image analysis on the image data obtained in S11 and calculate saturation as a surface state index (S12). The surface state measurement device 21 calculates the saturation of the board-side joining target portion for each of the plurality of circuit boards included in the printed wiring board sheet 30.

  The state determination unit 11 acquires the surface state information on the saturation from the surface state measurement device 21, and classifies the surface state of the printed wiring board sheet 30 based on the classification reference data 15a (S13: board evaluation step). .

  This classification is first performed for each of the plurality of circuit boards 31 included in the printed wiring board sheet 30. Specifically, when the circuit board 31 includes, for example, one or more board-side bonding target portions having a saturation of 130 or more (determined as defective in S14), the state determination unit 11 determines that the circuit board 31 is a board that is not suitable for bonding. (NG selection) (S15: condition setting step). The operating condition setting unit 12 determines not to dispose the bare chip 40 in the die bonding apparatus 22 for the circuit board 31.

  Then, the state determination unit 11 calculates a representative saturation as a representative value for the circuit board 31 in the printed wiring board sheet 30 that has not been determined to be a bonding inappropriate board.

  When the representative saturation is, for example, 80 or more and less than 110, the state determination unit 11 determines that the surface state of the printed wiring board sheet 30 is good (determined to be good in S14). The operating condition setting unit 12 sets the operating conditions of the wire bonding apparatus 24 based on the operating condition data 15b (S16: condition setting step). In this case, the condition of the wire bonding step is optimized without changing the PC time (for example, keeping the PC time = 20). Here, PC time = 20 is a standard set value in the plasma cleaning apparatus 23. As described above, when the saturation of the substrate is in the normal state, the operating conditions are optimized without changing the PC time, so that the influence on the production amount can be reduced.

  If the representative saturation is, for example, less than 80, 110 or more and less than 120, or 120 or more and less than 130, the state determination unit 11 determines that the surface state of the printed wiring board sheet 30 is acceptable (Yes in S14). Determined). The operating condition setting unit 12 sets the operating conditions of the plasma cleaning device 23 and the wire bonding device 24 based on the operating condition data 15b (S17).

(Flow of update process)
With reference to FIG. 8, a flow of a process of updating operating condition data 15b performed by management device 10 of the present embodiment will be described. FIG. 8 is a flowchart illustrating a flow of the update process executed by the management device 10 according to the present embodiment.

  As shown in FIG. 8, first, the log data creation unit 14 collects log data of each facility included in the wire bonding line 20 (S21). This data is also data of a change history of the operating conditions.

  Further, the log data creating unit 14 collects signal data at the time of wire bonding from the wire bonding device 24 (S22). This data includes an ultrasonic waveform (US waveform) and a tool pushing amount (z displacement) at the time of wire bonding.

  The log data creation unit 14 calculates a feature amount from the data obtained in S22 (S23). Further, the strength estimating unit 13 estimates the joint strength of the joint (S24). Using these calculated and estimated data, the log data creation unit 14 creates log data 15c.

  Next, the condition creating unit 16 creates functional window data for each surface state classification (S25). The numerical range used for this classification can be set as appropriate.

  With respect to the functional window data of the classification whose saturation is 80 or more and less than 110 (YES in S26), a response surface for the case where the surface state is “good” is calculated (S27). Here, the PC surface is set to a standard set value, and the response surface is calculated using the Bond load and US_Power as variables. The standard set value may be a value generally set in the plasma cleaning apparatus 23, or may be a time as short as possible within a settable range. The condition creating unit 16 uses the calculated response surface to calculate an operating condition at which the bonding strength is maximized (S28), and the operating condition for the case where the surface condition is “good” so that the calculated operating condition is satisfied. The data 15b is updated (S29).

  For the function window data of the class whose saturation is not 80 or more and less than 110 (NO in S26), the condition creating unit 16 calculates a response surface for each saturation range of the classification in the classification reference data 15a (S30). Here, the response surface is calculated using the PC time, the bond load, and US_Power as variables within a settable range.

  Using the calculated response surface, an operating condition (optimal condition) at which the bonding strength is maximized is calculated within a settable range of the PC time (S31). If the calculated maximum joint strength is larger than the joint strength reference (YES in S32), the condition creating unit 16 converts the operating condition data 15b of the corresponding saturation range classification so that the calculated operating condition is satisfied. Update (S33).

  If the calculated maximum joining strength is smaller than the joining strength standard (NO in S32), the condition creating unit 16 sets the numerical range of the classification standard data 15a such that the classification of the corresponding saturation range is NG selection. Is updated (S34).

(Modification 1)
In the first embodiment, the object whose surface state is to be quantified is the substrate-side joining target portion, but is not limited to this. The management device according to one aspect of the present invention may be configured so that the digitization of the surface state is performed for each substrate-side pad.

  When the object whose surface state is to be quantified by the surface state measuring device 21 is the entire substrate-side pad, dirt (defective surface state) caused by contamination of the plating solution in the previous process can be detected. In this case, if the plating quality of a certain board-side pad is poor, it is highly likely that the plating quality on the printed wiring board sheet has deteriorated as a whole. Therefore, the measurement may be performed by sampling from a plurality of board-side pads existing on the printed wiring board sheet. Alternatively, measurement may be performed on one substrate-side pad, and the measured value may be used as a representative value. Thereby, the processing speed of the analysis in the surface state measuring device 21 can be increased.

  Further, in the present modification, the state determination unit 11 may determine that a circuit board (predetermined region) including a board-side pad that is not suitable for wire bonding is a board that is not suitable for bonding.

(Modification 2)
In the first embodiment, the state determination unit 11 evaluates the printed wiring board sheet based on the surface state (saturation) of the board-side pad, and the operation condition setting unit 12 sets the operation state based on the evaluation. I was A management device according to one embodiment of the present invention sets operating conditions in accordance with a suitable bonding region and a surface state of an electronic component in consideration of a surface state (for example, saturation) of not only a substrate-side pad but also a chip-side pad. It may be.

[Example of software implementation]
The control blocks of the management device 10 (particularly, the state determination unit 11, the operation condition setting unit 12, the intensity estimation unit 13, the log data creation unit 14, and the condition creation unit 16) are logic circuits formed on an integrated circuit (IC chip) or the like. (Hardware) or software using a CPU (Central Processing Unit).

  In the latter case, the management device 10 includes a CPU that executes instructions of a program that is software for realizing each function, a ROM (Read Only Memory) in which the program and various data are recorded in a computer (or CPU), or a ROM (Read Only Memory). A storage device (these are referred to as “recording media”), a RAM (Random Access Memory) for expanding the above program, and the like are provided. Then, the object of the present invention is achieved when the computer (or CPU) reads the program from the recording medium and executes the program. As the recording medium, a “temporary tangible medium” such as a tape, a disk, a card, a semiconductor memory, or a programmable logic circuit can be used. Further, the program may be supplied to the computer via an arbitrary transmission medium (a communication network, a broadcast wave, or the like) capable of transmitting the program. Note that one embodiment of the present invention can also be realized in the form of a data signal embedded in a carrier wave, in which the above-described program is embodied by electronic transmission.

  The present invention is not limited to the embodiments described above, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

10: Management device 11: State determination unit (board evaluation unit) 12: Operating condition setting unit (condition setting unit) 13: Strength estimation unit 15: Storage unit 15a: Classification reference data 15b: Operation condition data 15c: Log data 16: Condition creating unit 20: Wire bonding line 21: Surface condition measuring device 22: Die bonding device 23: Plasma cleaning device 24: Wire bonding device 30: Printed wiring board sheet 31, 31a: Circuit board 40: Bare chip 51: Chip side bonding portion 52: Board-side joint

Claims (10)

A management device that arranges electronic components on a substrate on which wiring is formed, and manages a wire bonding line that wire-bonds an electrode portion of the electronic component and a terminal portion of the wiring,
A board evaluation unit that evaluates the board based on surface state information on the surface state of the board before arranging the electronic component,
A condition setting unit that sets operating conditions of the device included in the wire bonding line,
The substrate evaluation unit, for the substrate, for each one or more predetermined regions to evaluate whether the predetermined region is a surface state suitable for wire bonding,
The condition setting unit determines that the electronic component is not arranged in the inappropriate connection region for the inappropriate connection region evaluated to be unsuitable for wire bonding, and the appropriate connection region evaluated to be suitable for wire bonding. Based on the latest relationship between the surface state of the substrate, the operating conditions, and the bonding quality state of the wires bonded by the wire bonding line, different operating conditions vary according to the surface state of the appropriate bonding region. set,
In the terminal portion, if a portion to be wire-bonded is a board-side bonding target portion,
The surface state information is obtained by measuring the image of the surface of the substrate, including the respective measured values of the plurality of substrate-side joining target portion,
The substrate evaluation unit, when the appropriate bonding region is present on the substrate, based on a representative value calculated using a measurement value of one or more substrate-side bonding target portions included in the appropriate bonding region, the substrate, A management device characterized by classifying and evaluating the surface condition of the object. Each of the predetermined areas includes one or more of the terminal portions,
The wire bonding line is a surface cleaning device that cleans the surface of the substrate on which the electronic component is disposed, and applies a load and ultrasonic waves using a metal wire to wire-bond the electrode portion of the electronic component and the terminal portion. A wire bonding apparatus,
State classification information for rules for classifying the surface state of the substrate based on the surface state information, and, for operating conditions corresponding to each classification, further comprising a storage unit that stores operating condition information indicating the relationship,
For each classification of the state classification information, the combination of surface cleaning conditions in the surface cleaning device and wire bonding conditions in the wire bonding device is different,
The condition setting unit is configured to, if the appropriate bonding area is evaluated by the substrate evaluation unit to be in a good surface state, according to a surface state of the appropriate bonding area, the wire bonding condition in the wire bonding apparatus. 2. The management device according to claim 1, wherein the control unit changes the surface cleaning conditions in the surface cleaning device. Before Symbol status classification information includes a numerical range for the substrate-side bonding target portion is determined to be unsuitable for wire bonding, and a numerical range for classifying the substrate in any of a plurality of surface state Including
The substrate evaluation part, based on the surface condition information and the status classification information management apparatus according to claim 2, wherein the benzalkonium to determine the junction inappropriate region. In the case of performing wire bonding under the surface cleaning conditions and the wire bonding conditions, an intensity estimating unit that estimates the strength of the wire bonding unit based on information including an ultrasonic waveform acquired from the wire bonding apparatus,
A condition information creating unit that creates the operating condition information for each classification of the surface state of the substrate using the surface cleaning conditions, the wire joining conditions, and the estimated strength of the wire joining unit. The management device according to claim 3, wherein:   The condition information creating unit, as a result obtained by operating the wire bonding line, using a combination of the surface cleaning conditions, wire bonding conditions, and the estimated strength of the wire bonding portion, the operating condition information, The management device according to claim 4, wherein the management device is updated.   The board evaluation unit, when there is one or more board-side bonding target portions that indicate measurement values within a numerical range classified as inappropriate for wire bonding in the predetermined area, the predetermined area is bonded to the predetermined area. The management apparatus according to any one of claims 3 to 5, wherein the management apparatus is configured to evaluate the area as an inappropriate area. The board is a multi-piece board formed by arranging a plurality of circuit boards,
The management device according to any one of claims 1 to 6, wherein each of the predetermined areas corresponds to one of the circuit boards. A control method of a management device for arranging an electronic component on a substrate on which a wiring is formed and managing a wire bonding line that wire-bonds an electrode part of the electronic component and a terminal part of the wiring,
A board evaluation step of evaluating the board based on surface state information on a surface state of the board before arranging the electronic component,
A condition setting step of setting operating conditions of the device that the wire bonding line includes,
In the substrate evaluation step, for the substrate, for each one or more predetermined regions to evaluate whether the predetermined region is a surface state suitable for wire bonding,
In the condition setting step, for the inappropriate bonding region evaluated to be inappropriate for wire bonding, it is determined that the electronic component is not arranged in the inappropriate bonding region, and the suitable bonding region evaluated to be suitable for wire bonding is determined. Based on the latest relationship between the surface state of the substrate, the operating conditions, and the bonding quality state of the wires bonded by the wire bonding line, different operating conditions vary depending on the surface state of the appropriate bonding region. set,
In the terminal portion, if a portion to be wire-bonded is a board-side bonding target portion,
The surface state information is obtained by measuring the image of the surface of the substrate, including the respective measured values of the plurality of substrate-side joining target portion,
In the substrate evaluation step, if the appropriate bonding region is present on the substrate, the substrate based on a representative value calculated using a measurement value of one or more substrate-side bonding target portions included in the appropriate bonding region, A method for controlling a management device, comprising classifying and evaluating the surface condition of a device.   An information processing program for causing a computer to function as the management device according to claim 1.   A computer-readable recording medium on which the information processing program according to claim 9 is recorded.

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