JP6595308B2 - Electronic component mounting substrate, electronic device and electronic module - Google Patents

Description

  The present invention relates to an electronic component mounting substrate, an electronic device, and an electronic module.

  Conventionally, a wiring board and an electronic device in which an electronic component and other electronic components are mounted on a main surface of an insulating substrate are known (see, for example, Patent Document 1).

JP 2005-38406 A

  However, in recent years, downsizing of electronic devices has been demanded. The insulating substrate is becoming smaller, and the distance between the electronic component mounted on the main surface and other electronic components is becoming narrower. When the electronic device is operated, the heat of other electronic components is transferred around the electronic components on the insulating substrate, or the heat of the electronic components is transferred around the other electronic components on the insulating substrate. Bonding reliability with the electronic component or other electronic components is reduced, or the periphery of the electronic component on the insulating substrate is easily distorted, and the electronic component is tilted. For example, when the electronic component is a light receiving element, it cannot receive light normally. There is concern.

According to one aspect of the present invention, the electronic component mounting substrate has an opening in the main surface, the first recess for mounting the electronic component, and the second recess in which the other electronic component is mounted. have a dielectric substrate having the bottom surface of the first recess is found provided on the other main surface, a bottom surface of said second recess is provided on the main surface side, in a plan perspective, said second The wiring conductor is larger than the recess and is disposed on the main surface so that the second recess is accommodated .

  According to one aspect of the present invention, an electronic device includes an electronic component mounting board having the above-described configuration, an electronic component mounted in the first recess, and another electronic component mounted in the second recess. Have.

  According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device configured as described above connected to the connection pad via solder.

In an electronic component mounting board according to one aspect of the present invention, an insulation having an opening on a main surface, a first recess for mounting an electronic component, and an opening on another main surface and a second recess for mounting another electronic component. have a substrate, the bottom surface of the first recess is al provided the other main surface, a bottom surface of the second recess is provided on the main surface side, in a plan perspective, larger than the second recess, the second recess Has a wiring conductor arranged on the main surface so as to fit . With the above configuration, the heat transfer path between the bottom surface of the first recess for mounting the electronic component and the bottom surface of the second recess for mounting the other electronic component on the insulating substrate is substantially lengthened, and the electronic device is activated. Suppresses the heat of other electronic components from being transmitted to the periphery of the electronic components on the insulating substrate, or suppresses the heat of the electronic components from being transmitted to the periphery of the other electronic components on the insulating substrate. It can suppress that the joint reliability of a mounting board | substrate and an electronic component or another electronic component falls. In addition, when the electronic device is operated, the periphery of the electronic component on the insulating substrate is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

In the electronic device according to one aspect of the present invention, in the electronic device having the above configuration, the electronic component mounting substrate having the above configuration, the electronic component mounted in the first recess, and the other electronic component mounted in the second recess. Thus, an electronic device with excellent long-term reliability can be obtained.

  The electronic module according to one aspect of the present invention has excellent long-term reliability by including the module substrate having connection pads and the electronic device having the above-described configuration connected to the connection pads via solder. Can be.

(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a bottom view of (a). (A) is a longitudinal cross-sectional view in the AA line of the electronic device shown to Fig.1 (a), (b) is a longitudinal cross-sectional view in the BB line. It is a longitudinal cross-sectional view which shows the electronic module which mounted the electronic device in FIG. 1 on the board | substrate for modules. (A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a bottom view of (a). (A) is sectional drawing in the AA line of the electronic device shown to Fig.4 (a), (b) is sectional drawing in BB line. (A) is a top view which shows the electronic device in the 3rd Embodiment of this invention, (b) is a bottom view of (a). (A) is sectional drawing in the AA line of the electronic device shown to Fig.6 (a), (b) is sectional drawing in a BB line. (A) is a top view which shows the electronic device in the 4th Embodiment of this invention, (b) is a bottom view of (a). (A) is sectional drawing in the AA line of the electronic device shown to Fig.8 (a), (b) is sectional drawing in a BB line.

  Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
As shown in FIGS. 1 to 3, the electronic device according to the first embodiment of the present invention is mounted on the electronic component mounting substrate 1 and the first recess 12 and the second recess 13 of the electronic component mounting substrate 1. Electronic component 2 (first electronic component 21 and second electronic component 22). As shown in FIG. 3, the electronic device is connected to a module substrate 5 constituting an electronic module, for example, using solder 6.

  The electronic component mounting substrate 1 according to the present embodiment is opened in the main surface (lower surface), and is opened in the first recess 12 and the other main surface (upper surface) for mounting the electronic component (first electronic component 21). And an insulating substrate 11 having a second recess 13 for mounting the electronic component (second electronic component 22). The bottom surface of the first recess 12 is provided on the other main surface side, and the bottom surface of the second recess 13 is provided on the main surface side. The electronic component mounting substrate 1 has a wiring conductor 15 provided on the main surface and inside of the insulating substrate 11. 1 to 3, the electronic component mounting board 1 and the electronic device are mounted on an xy plane in a virtual xyz space. 1-3, the upward direction refers to the positive direction of the virtual z-axis. In addition, the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the electronic component mounting board 1 or the like is actually used.

The insulating substrate 11 has one main surface (the lower surface in FIGS. 1 to 3), the other main surface (the upper surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers, and is opened on one main surface, and is provided with a first recess 12 for mounting an electronic component (first electronic component 21), and is opened on the other main surface, and another electronic component (first 2 has a second recess 13 for mounting the electronic component 22), and has a rectangular plate shape when seen from a plan view, that is, from a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is solder bumps and gold bumps on the mounting region on the bottom surface of the first recess 12 and on the mounting region on the bottom surface of the second recess 13. Or it adhere | attaches and fixes through the connection members 3, such as conductive resin (anisotropic conductive resin etc.).

For the insulating substrate 11, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body is used. it can. If the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), etc. A suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. Next, an appropriate punching process is performed on the ceramic green sheet, and a plurality of ceramic green sheets are laminated to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.), whereby the insulating substrate 11 is formed. Produced.

  The first recess 12 is provided on one main surface of the insulating substrate 11. The first recess 12 is for mounting the first electronic component 21 on the bottom surface. A wiring conductor 15 for electrical connection with the first electronic component 21 is led out to the bottom surface of the first recess 12. The second recess 13 is provided on the other main surface of the insulating substrate 11. The second recess 13 is for mounting the second electronic component 22 on the bottom surface. A wiring conductor 15 for electrical connection with the second electronic component 22 is led out to the bottom surface of the second recess 13. The bottom surface of the first recess 12 is provided closer to the other main surface of the insulating substrate 11 than the bottom surface of the second recess 13 in the longitudinal sectional view. The first concave portion 12 and the second concave portion 13 are arranged so as not to overlap each other in plan perspective. The bottom surface of the second recess 13 is provided on the one main surface side of the insulating substrate 11 with respect to the bottom surface of the first recess 12 in the longitudinal sectional view. In the example shown in FIG. 1, the second recesses 13 are provided with four second recesses 13 on the other main surface of the insulating substrate 11, and the four second recesses 13 are first recesses in plan perspective. It is arranged so as to surround 12. The second recess 13 is formed to be smaller than the first recess 12 in a plan view, and a second electronic component 22 smaller than the first electronic component 21 is mounted in the second recess 13. In the example shown in FIGS. 1 to 3, the first concave portion 12 and the second concave portion 13 have a rectangular shape with a corner having an arc shape in a plan view. It may be a shape. If the insulating substrate 11 is rectangular in plan view, a small electronic component mounting substrate 1 can be easily formed.

  For example, the first recess 12 and the second recess 13 have through-holes that become the first recess 12 or the second recess 13 formed on some of the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a mold, or the like. It can be formed by forming each ceramic green sheet and laminating this ceramic green sheet on another ceramic green sheet in which no through hole is formed.

  The wiring conductor 15 is provided on the main surface and inside of the insulating substrate 11. The wiring conductor 15 is for electrically connecting the electronic component 2 mounted on the electronic component mounting substrate 1 and the module substrate 5 together with the external electrode 12. The wiring conductor 15 includes a wiring conductor 15 provided on the surface or inside of the insulating substrate 11, and a through conductor that electrically connects the wiring conductors 15 positioned vertically through the insulating layer constituting the insulating substrate 11. Is included.

The wiring conductor 15 is a metal powder metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. For example, if the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing a suitable organic binder and solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is fired at the same time as the ceramic green sheet for the insulating substrate 11 to be deposited on a predetermined position of the insulating substrate 11. The wiring conductor 15 is formed by, for example, printing and applying a metallized paste for the wiring conductor 15 on a ceramic green sheet for the insulating substrate 11 by printing means such as a screen printing method, and baking together with the ceramic green sheet for the insulating substrate 11. Is done. Further, when the wiring conductor 15 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a die or punching process by punching or a processing method such as laser processing. It is formed by filling the through hole with a metallized paste for through conductor by the above printing means and firing it with the ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.

A metal plating layer is applied to the surface of the wiring conductor 15 exposed from the insulating substrate 11 by electroplating or electroless plating. The metal plating layer is made of a metal excellent in corrosion resistance such as nickel, copper, gold or silver and connectivity with the connection member 3, and has a thickness of 0.5 to 5 μm, for example.
m nickel plating layer and 0.1-3 μm gold plating layer, or thickness 1-10 μm
A nickel plating layer of about m and a silver plating layer of about 0.1 to 1 μm are sequentially deposited. As a result, corrosion of the wiring conductor 15 can be effectively suppressed, the wiring conductor 15 and the electronic component 2 are fixed, the wiring conductor 15 is bonded to the connection member 3 such as a bonding wire, and the wiring conductor 15 and the module. The bonding with the connection pad 51 formed on the substrate 5 can be strengthened.

  In addition, the metal plating layer is not limited to the nickel plating layer / gold plating layer, but may include nickel plating layer / gold plating layer / silver plating layer or other nickel plating layer / palladium plating layer / gold plating layer. It may be a metal plating layer.

  Further, on the wiring conductor 15 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of, for example, about 10 to 80 μm is deposited as a metal plating layer on the above-described nickel plating layer and gold plating layer. Thus, the heat of the electronic component 2 may be easily radiated to the electronic component mounting substrate 1 side through the copper plating layer.

By mounting the first electronic component 21 on the bottom surface of the first recess 12 of the electronic component mounting substrate 1 and mounting the second electronic component 22 on the bottom surface of the second recess 13 of the electronic component mounting substrate 1, an electronic device is obtained. Can be produced. The first electronic component 21 mounted on the electronic component mounting substrate 1 is a light receiving element, an imaging element, a light emitting element, a semiconductor element such as an IC chip or an LSI chip, and the second electronic component 22 is a light emitting element, a resistor, or the like. An element, a capacitive element, a Zener diode, or the like. For example, when a light receiving element is used as the first electronic component 21, a light emitting element is used as the second electronic component 22. For example, when an optical element is used as the first electronic component 21, the other main surface of the insulating substrate 11 and the bottom surface of the first recess 12 are formed on the bottom surface of the first recess 12 as in the example shown in FIGS. Are provided. The optical element is mounted in the first recess 12 with the light receiving surface facing the opening 14, and external light enters the optical element mounted in the first recess 12 through the opening 14 and is received. I try to do it. As in the case of the recess, the opening 14 has through-holes to be the opening 14 formed in the ceramic green sheet by laser processing or punching with a mold in some ceramic green sheets for the insulating substrate 11. Can be formed. For example, when the electronic component 2 is a flip-chip type semiconductor element, the semiconductor element is connected to the semiconductor element via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). The electrode and the wiring conductor 15 are mounted on the electronic component mounting board 1 by being electrically and mechanically connected. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the wiring conductor 15 by a bonding member such as a low melting point brazing material or a conductive resin, and then bonded to the bonding wire. The electrode of the semiconductor element and the wiring conductor 15 are electrically connected via the connecting member 3 such as the electronic component mounting board 1. Thereby, the electronic component 2 is electrically connected to the external electrode 12. Moreover, the electronic component 2 is sealed with a lid made of resin, glass, ceramics, metal, or the like, using a sealing material made of resin, glass, or the like, if necessary.

  As shown in FIG. 3, the wiring conductor 15 of the electronic device of this embodiment is connected to the connection pad 51 of the module substrate 5 via the solder 6 as shown in FIG.

  In addition, when the wiring conductor 15 is arranged on one main surface of the insulating substrate 11 so as to be larger than the second concave portion 13 and overlap the second concave portion 13 in a plan view as shown in the example shown in FIG. When the electronic device is operated, the heat of the second electronic component 22 mounted in the second recess 13 can be easily transmitted to the module substrate 5 side via the wiring conductor 15. Heat transfer to the first recess 12 side in the insulating substrate 11, that is, heat transfer to the first electronic component 21 side can be suppressed.

  Further, the heat of the second electronic component 22 generated when the electronic device is operated is easily transferred to the module substrate 5, and the insulating substrate between the lower surface of the insulating substrate 11 and the bottom surface of the second recess 13. Since the thickness of 11 is small, heat transfer to the module substrate 5 can be improved, and a crack is generated between the bottom surface and the side wall of the second recess 13 due to distortion of the insulating substrate 11 due to heat. Therefore, it is effective as a thin electronic component mounting substrate 1.

  Further, if the distance between the bottom surface of the second recess 13 and the wiring conductor 15 provided on one main surface of the insulating substrate 11 is smaller than the distance between the bottom surface of the first recess 12 and the bottom surface of the second recess 13, 2 Heat of the second electronic component 22 mounted in the recess 13 can be easily transferred to the module substrate 5 through the wiring conductor 15, and heat transfer to the first recess 12 side can be suppressed. The distance between the bottom surface of the second recess 13 and the wiring conductor 15 provided on one main surface of the insulating substrate 11 is not more than ½ of the distance between the bottom surface of the first recess 12 and the bottom surface of the second recess 13. Is more preferable.

  The electronic component mounting board 1 of the present embodiment is opened in the main surface, opened in the first recess 12 for mounting the electronic component (first electronic component 21) and other main surfaces, and other electronic components (second It has an insulating substrate 11 having a second recess 13 for mounting an electronic component 22), the bottom surface of the first recess 12 is provided on the other main surface side, and the bottom surface of the second recess 13 is the main surface side. Is provided. With the above configuration, the bottom surface of the first recess 12 in which the electronic component (first electronic component 21) is mounted and the bottom surface of the second recess 13 in which another electronic component (second electronic component 22) is mounted in the insulating substrate 11 When the electronic device is operated, the heat of other electronic components is prevented from being transferred to the periphery of the electronic components in the insulating substrate 11, and the electronic component mounting substrate 1 is It is possible to suppress a decrease in the bonding reliability between the electronic component and the electronic component. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

  When an optical element such as a light receiving element is used as the first electronic component 21, heat transfer from the second electronic component 22 to the insulating substrate 11 around the first electronic component 21 is suppressed, and the optical element such as the light receiving element Can receive external light well.

  The electronic device according to the present embodiment includes the electronic component mounting substrate 1 having the above-described configuration, an electronic component (first electronic component 21) mounted in the first recess 12, and another electronic component mounted in the second recess 13. By having (second electronic component 22), it is possible to provide an electronic device having excellent long-term reliability.

  The electronic module of the present embodiment has excellent long-term reliability by including the module substrate 5 having the connection pads 51 and the electronic device having the above-described configuration connected to the connection pads 51 via the solder 6. Can be.

  The electronic component mounting board 1 in the present embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be enhanced. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

  In the electronic device according to the second embodiment of the present invention, the first recess 12 is provided at the center of the insulating substrate 11, and the second recess 13 is provided at the corner of the insulating substrate 11.

  According to the electronic component mounting substrate 1 in the second embodiment of the present invention, the electronic component (first electronic component 21) on the insulating substrate 11 is mounted in the same manner as the wiring substrate 1 in the first embodiment. 1 When the heat transfer path between the bottom surface of the recess 12 and the bottom surface of the second recess 22 on which another electronic component (second electronic component 22) is mounted becomes substantially long, It is possible to suppress the heat of other electronic components from being transmitted to the periphery of the electronic component in the insulating substrate 11, and to suppress the decrease in the bonding reliability between the electronic component mounting substrate 1 and the electronic component. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

  According to the electronic component mounting substrate 1 of the second embodiment, the insulating substrate 11 is rectangular in plan view, and the first recess 12 is provided in the center of the insulating substrate 11 in plan view, and the second recess Since 13 is provided at the corner of the insulating substrate 11, the corner of the insulating substrate 11 can be widened compared to the electronic component mounting substrate 1 of the first embodiment. Since the concave portion 13 can be provided in a wide area of the corner of the insulating substrate 11, the distance between the first concave portion 12 and the second concave portion 13 is widened so that the heat of the second electronic component 22 is directed to the first electronic component 21 side. Heat transfer can be suppressed, and the thickness of the insulating substrate 11 between the first recess 12 and the second recess 13 can be increased, and distortion generated in the insulating substrate 11 can be suppressed.

  The first recess 12 has a rectangular shape when seen in a plan view, and each corner is provided at a position sandwiched between the corners of the insulating substrate 11, so that the corner region of the insulating substrate 11 can be favorably widened. In addition, since the second recess 13 can be provided in a wide area of the corner of the insulating substrate 11, the second recess 13 and the second recess 13 are widened so that when the electronic device is operated, the second recess 13 is provided. It is possible to suppress the heat of the electronic component 22 from being transmitted to the first electronic component 21 side in the insulating substrate 11 and to suppress the decrease in the bonding reliability between the electronic component mounting substrate 1 and the first electronic component 21. . Moreover, the thickness between the 1st recessed part 12 and the 2nd recessed part 13 in the insulated substrate 11 becomes a thick thing, the distortion which arises in the insulated substrate 11 can be suppressed, and it can suppress that the 1st electronic component 21 inclines.

The first recess 12 is rectangular in a plan view, and a pair of corners located diagonally in the first recess 12 is on a virtual straight line 11 a that intersects perpendicularly with a pair of opposing sides of the insulating substrate 11. Therefore, the corner region of the insulating substrate 11 can be widened without unevenness, and the second recess 13 can be provided in a wide region of the corner of the insulating substrate 11. When the distance between the second concave portion 13 is increased and the electronic device is operated, the heat of the second electronic component 22 can be suppressed from being transmitted to the first electronic component 21 side of the insulating substrate 11, and the electronic component can be suppressed. It can suppress that the joint reliability of the mounting substrate 1 and an electronic component falls. Moreover, the thickness between the 1st recessed part 12 and the 2nd recessed part 13 in the insulated substrate 11 becomes thick, can suppress the distortion which arises in the insulated substrate 11, and can suppress that the 1st electronic component 21 inclines.

  Similarly to the first embodiment, the electronic component mounting board 1 of the second embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be improved. Can be increased. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

  The electronic component mounting board 1 of the second embodiment can be manufactured using the same manufacturing method as the electronic component mounting board 1 of the first embodiment described above.

(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS.

  In the electronic device according to the third embodiment of the present invention, the first recess 12 is provided at the center of the insulating substrate 11, the second recess 13 is provided at the corner of the insulating substrate 11, and the second recess 13 The side surface on the first recess 12 side and the side surface on the second recess 13 side in the first recess 12 are parallel.

  According to the electronic component mounting substrate 1 in the third embodiment of the present invention, as in the electronic component mounting substrate 1 in the first embodiment, the bottom surface of the first recess for mounting the electronic component in the insulating substrate 11. And the bottom surface of the second concave portion on which the other electronic component is mounted become substantially long, and when the electronic device is operated, the heat of the other electronic component is transferred to the electronic component on the insulating substrate 11. It is possible to suppress the transmission to the periphery of the electronic component and to suppress the decrease in the bonding reliability between the electronic component mounting substrate 1 and the electronic component. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

  Further, since the side surface of the second recess 13 on the first recess 12 side and the side surface of the first recess 12 on the second recess 13 side are parallel, the corners of the first recess 12 and the corners of the second recess 13 are formed. The thickness of the insulating substrate 11 between the first concave portion 12 and the second concave portion 13 is not locally reduced, and the operation of the first electronic component 21 or the second electronic component 22 is not performed. It is possible to suppress the occurrence of cracks or the like between the first recess 12 and the second recess 13 in the insulating substrate 11 due to the heat generated by.

  Similarly to the first embodiment, the electronic component mounting board 1 of the third embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be improved. Can be increased. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

  The electronic component mounting substrate 1 of the third embodiment can be manufactured using the same manufacturing method as the electronic component mounting substrate 1 of the first embodiment described above.

(Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described with reference to FIGS.

  The electronic device according to the fourth embodiment of the present invention differs from the electronic device according to the first embodiment described above in that one main surface (lower surface) of the insulating substrate 11 and the second recess are formed on the bottom surface of the second recess 13. An opening 14 penetrating the bottom surface of 13 is provided, and a wiring conductor 15 is provided in a region overlapping the bottom surface of the first recess 12 on the other main surface (upper surface) of the insulating substrate 11.

  According to the electronic component mounting substrate 1 in the fourth embodiment of the present invention, the bottom surface of the first recess in which the electronic component is mounted in the insulating substrate 11 as in the electronic component mounting substrate 1 in the first embodiment. And the bottom surface of the second concave portion on which the other electronic component is mounted become substantially long, and when the electronic device is operated, the heat of the electronic component is transferred to the other electronic component on the insulating substrate 11. It is possible to suppress the transmission to the periphery of the electronic component, and it is possible to suppress a decrease in the bonding reliability between the electronic component mounting substrate 1 and other electronic components. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

  In addition, when the wiring conductor 15 is disposed on the other main surface of the insulating substrate 11 so as to overlap the first recess 12 and surround the first recess 12 in a plan view, when the electronic device is operated, The heat of the first electronic component 21 mounted in the first recess 12 can be easily transferred to the module substrate 5 side via the wiring conductor 15, and the second recess 13 side of the insulating substrate 11 of the first electronic component 21 can be made. Heat transfer to the side, that is, heat transfer to the second electronic component 22 side can be suppressed.

  Similar to the first embodiment, the electronic component mounting board 1 of the fourth embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 is improved. Can be increased. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

  The electronic component mounting substrate 1 of the fourth embodiment can be manufactured using the same manufacturing method as the electronic component mounting substrate 1 of the first embodiment described above.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the wiring conductor 15 includes a so-called castoration conductor in which a notch is provided between the side surface of the insulating substrate 11 and one main surface, and the wiring conductor 15 extends to the inner surface of the notch. May be.

  Further, in the electronic component mounting substrate 1 in the first to fourth embodiments, the first recess 12 and the second recess 13 have vertical sidewalls in the longitudinal sectional view. Alternatively, the second recess 13 may be a step-like recess whose side wall is wider on the opening side than on the bottom side in a longitudinal sectional view. Further, the first recess 12 or the second recess 13 may be a recess whose size on the opening side of the recess is smaller than the size on the bottom surface side of the recess when seen in a plan view.

  The electronic component mounting board 1 may be manufactured in the form of a multi-piece electronic component mounting board.

1 .... Electronic component mounting board
11 ... Insulating substrate
11a ... Virtual straight line
12 ··· First recess
13 ... Second recess
14 ... Opening
15 ... Wiring conductor 2 ... Electronic components
21 ... 1st electronic component
22 ... Second electronic component 3 ... Connection member 5 ... Module substrate
51 ... Connection pads 6 ... Solder

Claims (7)

Open to the major surface, a first recess for mounting the electronic components, and opened to the other main surface, it has a dielectric substrate having a second recess for mounting the other electronic components,
The bottom surface of the first recess is found provided on the other main surface,
A bottom surface of the second recess is provided on the main surface side ;
An electronic component mounting board comprising: a wiring conductor disposed on the main surface so as to be larger than the second recess and accommodated in the second recess, as seen in a plan view . The insulating substrate is rectangular in plan view,
2. The electronic component mounting device according to claim 1, wherein the first concave portion is provided in a central portion of the insulating substrate and the second concave portion is provided in a corner portion of the insulating substrate when seen in a plan view. substrate.   3. The electronic component mounting board according to claim 2, wherein the first recess has a rectangular shape in a plan view, and each corner is provided at a position sandwiched between the corners of the insulating substrate.   The first recess is rectangular in plan view, and a pair of corners located diagonally in the first recess is provided on an imaginary straight line that intersects perpendicularly with the opposing pair of sides of the insulating substrate. The electronic component mounting board according to claim 2, wherein the electronic component mounting board is provided. The second recess is rectangular in plan view,
5. The electronic component mounting device according to claim 3, wherein a side surface of the second recess portion on the side of the first recess portion and a side surface of the first recess portion on the side of the second recess portion are parallel to each other. substrate. An electronic component mounting substrate according to any one of claims 1 to 5,
An electronic component mounted in the first recess;
An electronic device comprising: another electronic component mounted in the second recess. A module substrate having connection pads;
An electronic module comprising: the electronic device according to claim 6 connected to the connection pad via solder.

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