JP6633381B2 - Electronic component mounting board, electronic device and electronic module - Google Patents

Description

  The present invention relates to an electronic component mounting board, an electronic device, and an electronic module.

  2. Description of the Related Art Conventionally, there has been known an electronic component mounting substrate and an electronic device in which electronic components and other electronic components are mounted on a main surface of an insulating substrate (for example, see Patent Document 1).

  In such an electronic element mounting substrate, the insulating substrate has a concave portion on its upper surface for housing and mounting electronic components.

JP 2004-363185 A

  However, in recent years, miniaturization of electronic devices has been demanded, and the insulating substrate of the electronic element mounting substrate has become smaller. When a plurality of concave portions are arranged on the insulating substrate, the thickness of the side wall sandwiched by each concave portion is increased. Is becoming smaller. When the electronic device is operated, the heat of the electronic component is less likely to be transmitted to the outside from the concave portion arranged in the central portion, and the heat is hardly dissipated to the outside. There is a concern that the side wall may be distorted, and a crack may be formed in the side wall sandwiched between the concave portion arranged at the center and the other concave portion.

According to one aspect of the present invention, an electronic component mounting substrate has a first concave portion for opening an electronic component and a second concave portion for mounting another electronic component, the rectangular shape in a plan view. In a plan view, the first concave portion is provided at a central portion of the insulating substrate, the second concave portion is provided at a corner of the insulating substrate, and the first concave portion is rectangular and the second recess is triangular or rectangular shape, the side surface of the second concave side of the first recess, Ri side and parallel der of the first concave side of the second recess, flat in view, a set of corners positioned diagonally in the first recess, that provided on the imaginary straight line intersecting perpendicularly with respect to a pair of opposite sides of said insulating substrate.

  According to one aspect of the invention, an electronic device includes the electronic component mounting board having the above configuration, an electronic component mounted in the first recess, and another electronic component mounted in the second recess. Have.

  According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device having the above configuration connected to the connection pad via solder.

In the electronic component mounting board according to one aspect of the present invention, a rectangular insulating substrate having a first concave portion for opening an electronic component and a second concave portion for mounting another electronic component, which is opened in the main surface, has a rectangular shape in plan view. In a plan view, the first recess is provided at the center of the insulating substrate, the second recess is provided at a corner of the insulating substrate, the first recess is rectangular, and the second recess is triangular. a shape or a rectangular shape, the side surface of the second concave side of the first recess, Ri side and parallel der the first concave side of the second recess, in plan view, one of diagonally positioned in the first recess set of corners, that are provided on an imaginary straight line intersecting perpendicularly with respect to a pair of opposite sides of the insulating substrate. With the above configuration, the corner of the first concave portion is located on the outer edge side of the insulating substrate in plan view, and when the electronic device is operated, heat of the electronic component is easily transmitted to the outside through the first concave portion, It is easy to dissipate to the outside, and can be excellent in long-term reliability. Further, the thickness of the side wall sandwiched between the first concave portion and the second concave portion can be made large, and when the electronic device is operated, even if the insulating substrate tries to expand due to the heat of the electronic component, the first concave portion and the second concave portion can be formed. Distortion hardly occurs in the side wall sandwiched between the two recesses, and it is possible to suppress the occurrence of cracks in the side wall sandwiched between the first recess and the second recess.

  The electronic device according to one aspect of the present invention includes the electronic component mounting board having the above configuration, an electronic component mounted in the first concave portion, and another electronic component mounted in the second concave portion. An electronic device having excellent reliability can be obtained.

  The electronic module according to one aspect of the present invention has excellent long-term reliability by having a module substrate having connection pads and an electronic device having the above-described configuration connected to the connection pads via solder. Things.

2A is a top view illustrating the electronic device according to the first embodiment of the present invention, and FIG. 2B is a bottom view of FIG. FIG. 2A is a vertical cross-sectional view taken along line AA of the electronic device shown in FIG. 1A, and FIG. 2B is a vertical cross-sectional view taken along line BB. FIG. 2 is a longitudinal sectional view showing an electronic module in which the electronic device in FIG. 1 is mounted on a module substrate. (A) is a top view showing an electronic device in a second embodiment of the present invention, (b) is a bottom view of (a). 4A is a sectional view taken along line AA of the electronic device shown in FIG. 4A, and FIG. 4B is a sectional view taken along line BB. FIG. 5 is an enlarged top view of a main part of a part C in FIG. (A) And (b) is a longitudinal section of an electronic device in a 3rd embodiment of the present invention. It is a top view showing an electronic device in a 4th embodiment of the present invention.

  Some exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
As shown in FIGS. 1 to 3, the electronic device according to the first embodiment of the present invention is mounted on the electronic component mounting substrate 1 and the first concave portion 12 and the second concave portion 13 of the electronic component mounting substrate 1. Electronic component 2 (first electronic component 21 and second electronic component 22). As shown in FIG. 3, the electronic device is connected using a solder 6 on a module substrate 5 constituting an electronic module, for example.

  The electronic component mounting board 1 according to the present embodiment has an opening on the main surface (upper surface), and the first concave portion 12 on which the electronic component (first electronic component 21) is mounted and another electronic component (second electronic component 22). It has a rectangular insulating substrate 11 having a second concave portion 13 to be mounted and having a rectangular shape in plan view. The first concave portion 12 has a rectangular shape in plan view, and is provided at a central portion of the insulating substrate 11. The second recess 13 has a triangular or rectangular shape in plan view, and is provided at a corner of the insulating substrate 11. The electronic component mounting board 1 has a wiring conductor 14 provided on the main surface and inside of the insulating substrate 11. 1 to 3, an electronic component mounting board 1 and an electronic device are mounted on an xy plane in a virtual xyz space. 1 to 3, the upward direction refers to the positive direction of the virtual z-axis. Note that the distinction between the upper and lower parts in the following description is for convenience, and does not limit the upper and lower parts when the electronic component mounting board 1 or the like is actually used.

The insulating substrate 11 has one main surface (upper surface in FIGS. 1 to 3), the other main surface (lower surface in FIGS. 1 to 3), and side surfaces. The insulating substrate 11 is composed of a plurality of insulating layers, is opened on one main surface, and has a first concave portion 12 for mounting an electronic component (first electronic component 21) and another electronic component (second electronic component 22). And has a rectangular plate-like shape when viewed in plan, that is, when viewed from a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is provided with a solder bump and a gold bump on the mounting region on the bottom surface of the first concave portion 12 and on the mounting region on the bottom surface of the second concave portion 13. Alternatively, it is bonded and fixed via a connection member 3 such as a conductive resin (such as an anisotropic conductive resin).

As the insulating substrate 11, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used. it can. If the insulating substrate 11 is, for example, a sintered body of aluminum oxide, raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO) And an appropriate organic binder and a solvent are added and mixed to produce a slurry. The slurry is formed into a sheet by employing a conventionally known doctor blade method or a calender roll method to produce a ceramic green sheet. Next, the ceramic green sheet is appropriately punched, a plurality of ceramic green sheets are laminated to form a formed body, and the formed body is fired at a high temperature (about 1600 ° C.) to form the insulating substrate 11. Be produced.

  The first recess 12 is provided on one main surface of the insulating substrate 11. The first concave portion 12 is for mounting the first electronic component 21 on the bottom surface. A wiring conductor 14 for electrically connecting to the first electronic component 21 extends from the bottom surface of the first recess 12. The second recess 13 is provided on one main surface of the insulating substrate 11, similarly to the first recess 12. The second recess 13 is for mounting the second electronic component 22 on the bottom surface. A wiring conductor 14 for electrically connecting to the second electronic component 22 extends from the bottom surface of the second recess 13. The first concave portion 12 has a rectangular shape in plan view, and is provided at a central portion of the insulating substrate 11. In the example shown in FIG. 1, the first concave portion 12 has a side surface of the first concave portion 12 arranged in an inclined direction with respect to an outer edge of the insulating substrate 11 in a plan view. Are arranged in a direction inclined by 45 °. Here, the shape of the first concave portion 12 may be a rectangular shape having corners provided in an arc shape in plan view. The second recess 13 has a triangular or rectangular shape in a plan view, and is provided at a corner of the insulating substrate 11. In the example shown in FIG. 1, the second concave portion 13 has a rectangular shape in plan view, and is provided at four right corners of the insulating substrate 11. Further, the shape of the second concave portion 13 may be a triangular shape or a rectangular shape in which a corner is provided in an arc shape in plan view. Further, the triangular shape or the rectangular shape may be a shape having a projecting portion in plan view. The side surface of the first concave portion 12 on the side of the second concave portion 13 and the side surface of the second concave portion 13 on the side of the first concave portion 12 are parallel as shown in FIG.

  The first concave portion 12 and the second concave portion 13 are provided with through holes that become the first concave portion 12 or the second concave portion 13 by, for example, laser processing or punching using a die in some of the ceramic green sheets for the insulating substrate 11. It can be formed by forming each of the ceramic green sheets and laminating this ceramic green sheet on another ceramic green sheet having no through hole.

  The wiring conductor 14 is provided on the main surface and inside of the insulating substrate 11. The wiring conductors 14, together with the external electrodes 12, are used to electrically connect the electronic component 2 (the first electronic component 21 and the second electronic component 22) mounted on the electronic component mounting substrate 1 to the module substrate 5. Things. The wiring conductor 14 includes a wiring conductor 14 provided on or on the surface of the insulating substrate 11, and a through conductor that penetrates the insulating layer forming the insulating substrate 11 and electrically connects the wiring conductors 14 positioned above and below. Contains.

  The wiring conductor 14 is a metal powder metallized mainly containing tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding a suitable organic binder and a solvent to a high melting point metal powder such as W, Mo or Mn is mixed with an insulating material. The ceramic green sheet for the substrate 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is baked simultaneously with the ceramic green sheet for the insulating substrate 11, thereby being adhered and formed at a predetermined position on the insulating substrate 11. The wiring conductors 14 are formed, for example, by printing and applying a metallizing paste for the wiring conductors 14 on a ceramic green sheet for the insulating substrate 11 by printing means such as a screen printing method, and firing the same together with the ceramic green sheets for the insulating substrate 11. Is done. In the case where the wiring conductor 14 is a through conductor, for example, a through hole for a through conductor is formed in a ceramic green sheet for the insulating substrate 11 by a processing method such as punching by a mold or punching or laser processing. The through-hole is formed by filling the through-hole with a metallizing paste for a through conductor by the above-described printing means, and firing it together with the ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adding a suitable solvent and a binder to the above-mentioned metal powder and kneading the mixture to adjust the viscosity to an appropriate level. Note that glass powder and ceramic powder may be included in order to increase the bonding strength with the insulating substrate 11.

A metal plating layer is applied to the surface of the wiring conductor 14 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal such as nickel, copper, gold or silver which has excellent corrosion resistance and connectivity with the connection member 3 and has a thickness of, for example, 0.5 to 5 μm.
m nickel plating layer and 0.1-3 μm gold plating layer, or 1-10 μm thick
A nickel plating layer of about m and a silver plating layer of about 0.1 to 1 μm are sequentially applied. Accordingly, the corrosion of the wiring conductor 14 can be effectively suppressed, the bonding between the wiring conductor 14 and the electronic component 2, the joining of the wiring conductor 14 with the connection member 3 such as a bonding wire, and the connection between the wiring conductor 14 and the module. Bonding with the connection pads 41 formed on the connection substrate 4 can be strengthened.

  Further, the metal plating layer is not limited to the nickel plating layer / gold plating layer, but may be nickel plating layer / gold plating layer / silver plating layer or other plating including nickel plating layer / palladium plating layer / gold plating layer. It may be a metal plating layer.

  Further, on the wiring conductor 14 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of about 10 to 80 μm is applied as a metal plating layer to the above-described underlayer of the nickel plating layer and the gold plating layer. By doing so, the heat of the electronic component 2 may be easily satisfactorily radiated to the electronic component mounting substrate 1 via the copper plating layer.

By mounting the first electronic component 21 on the bottom surface of the first concave portion 12 of the electronic component mounting substrate 1 and mounting the second electronic component 22 on the bottom surface of the second concave portion 13 of the electronic component mounting substrate 1, Can be produced. The first electronic component 21 mounted on the electronic component mounting substrate 1 is a light receiving element, an image sensor, a light emitting element, a semiconductor element such as an IC chip or an LSI chip, and the second electronic component 22 is a light emitting element, a resistor, or the like. Element, capacitor, zener diode, and the like. For example, when a light receiving element is used as the first electronic component 21, a light emitting element is used as the second electronic component 22. For example, when the electronic component 2 is a flip-chip type semiconductor element, the semiconductor element is connected to the semiconductor element via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (such as an anisotropic conductive resin). The electrodes and the wiring conductors 14 are mounted on the electronic component mounting substrate 1 by being electrically and mechanically connected. Further, for example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the wiring conductor 14 by a bonding member such as a low melting point brazing material or a conductive resin, and then the bonding wire The electrodes of the semiconductor element and the wiring conductors 14 are electrically connected to each other via the connection member 3 such as the electronic component mounting board 3 so as to be mounted on the electronic component mounting board 1. Thereby, the electronic component 2 is electrically connected to the external electrode 12. The electronic component 2 is sealed with a cover made of resin, glass, ceramics, metal, or the like, using a sealing material made of resin, glass, or the like, if necessary.

  As shown in FIG. 3, the wiring conductor 14 of the electronic device of the present embodiment is connected to the connection pad 41 of the module substrate 4 via the solder 5 as shown in FIG.

  Further, in plan view, a pair of corners located at a diagonal in the first concave portion 12 are provided on a virtual straight line (first virtual straight line 11a) perpendicularly intersecting a pair of opposite sides of the insulating substrate 11. Therefore, the region of the corner portion of the insulating substrate 11 can be broadened without bias, and the second concave portion 13 can be provided in the wide region of the corner portion of the insulating substrate 11. When the electronic device is operated by increasing the distance between the second concave portion 13 and the electronic device, the heat of the second electronic component 22 can be suppressed from being transmitted to the first electronic component 21 side of the insulating substrate 11, and the electronic component mounting can be suppressed. It is possible to suppress a decrease in bonding reliability between the substrate for use 1 and the electronic component 2.

  The second recesses 13 are provided at a plurality of corners of the insulating substrate 11, respectively, and are provided at positions where the corners of the first recess 12 are sandwiched between the plurality of second recesses 13 in plan view. In this case, the distance between the corner of the first recess 12 and the corner of the second recess 13 can be increased. Even if it tries to expand, distortion is unlikely to occur in the portion sandwiched between the corners of the first recess 12 and the second recess 13, and the portion is sandwiched between the corners of the first recess 12 and the second recess 13. The generation of cracks in portions can be favorably suppressed.

  The electronic component mounting board 1 of the present embodiment has an opening on the main surface, a first recess 12 for mounting an electronic component (first electronic component 21), and a second recess 12 for mounting another electronic component (second electronic component 22). It has an insulating substrate 11 having a rectangular shape in plan view having two concave portions 13. The first concave portion 12 is provided at a central portion of the insulating substrate 11 in plan view, and the second concave portion 13 is formed in a corner of the insulating substrate 11. The first concave portion 12 has a rectangular shape and the second concave portion 13 has a triangular or rectangular shape. The side surface of the first concave portion 12 on the side of the second concave portion 13 and the first concave portion of the second concave portion 13 are provided. The 12 side surfaces are parallel. With the above configuration, the corner of the first concave portion 12 is located on the outer edge side of the insulating substrate 11 in plan view, and when the electronic device is operated, the heat of the electronic component (first electronic component 21) is reduced to the first level. It is easy to be transmitted to the outside via the concave portion 12 and easily radiated to the outside, so that it is possible to achieve excellent long-term reliability. Further, the thickness of the side wall sandwiched between the first concave portion 12 and the second concave portion 13 can be made large, and even if the insulating substrate 11 tries to expand due to the heat of the electronic component 2 when the electronic device is operated. Distortion hardly occurs in the side wall sandwiched between the first recess 12 and the second recess 13, and the occurrence of cracks in the side wall sandwiched between the first recess 12 and the second recess 12 can be suppressed.

  When an optical element such as a light receiving element is used as the first electronic component 21, heat transfer from the second electronic component 22 to the insulating substrate 11 around the first electronic component 21 is suppressed, and the optical element such as the light receiving element is used. Thus, external light can be satisfactorily received.

  1, the wiring conductor 14 provided on the other main surface of the insulating substrate 11 is larger than the second concave portion 13 in a plan view and is overlapped with the second concave portion 13 as seen in a plan view. When the electronic device is operated, the heat of the second electronic component 22 mounted in the second recess 13 is transmitted to the module substrate 4 via the wiring conductor 14 when the electronic device is operated. This makes it easy to dissipate heat to the side of the insulating substrate 11 of the first electronic component 21 and suppresses the occurrence of distortion in the insulating substrate 11 around the corner of the first recess 12. The occurrence of cracks in the insulating substrate between the corners of the recess 12 and the second recess 12 can be suppressed.

The electronic device of the present embodiment includes an electronic component mounting board 1 having the above configuration, an electronic component (first electronic component 21) mounted in the first concave portion 12, and another electronic component mounted in the second concave portion 13. (Second electronic component 22), an electronic device having excellent long-term reliability can be obtained.

  The electronic module of the present embodiment has excellent long-term reliability by having the module substrate 4 having the connection pads 41 and the electronic device having the above configuration connected to the connection pads 41 via the solder 5. It can be.

  The electronic component mounting substrate 1 according to the present embodiment can be suitably used in a small and high-output electronic device, and the connection reliability of the electronic component mounting substrate 1 can be improved. For example, a light receiving element is used as the first electronic component 21, and a small electronic component mounting substrate 1 using a light emitting element as the second electronic component 22 can be suitably used.

(Second embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

  The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment in that the second recess 13 has a triangular shape in plan view, and three side surfaces of the second recess 13. Are parallel to the side surface of the first recess 12 and the two side surfaces of the insulating substrate 11, respectively. In the second embodiment, the second concave portion 13 has a right-angled triangular shape having a circular arc shape in plan view.

  According to the electronic component mounting board 1 of the second embodiment of the present invention, the corner of the first concave portion 12 is located on the outer edge side of the insulating substrate 11 in plan view, similarly to the wiring board 1 of the first embodiment. When the electronic device is operated, the heat of the electronic component (first electronic component 21) is easily transmitted to the outside via the first concave portion 12, and is easily radiated to the outside. It can be excellent. Further, the thickness of the side wall sandwiched between the first concave portion 12 and the second concave portion 13 can be made large, and even if the insulating substrate 11 tries to expand due to the heat of the electronic component 2 when the electronic device is operated. Distortion hardly occurs in the side wall sandwiched between the first recess 12 and the second recess 13, and the occurrence of cracks in the side wall sandwiched between the first recess 12 and the second recess 12 can be suppressed.

  The second recess 13 has three side surfaces. One side surface of the second concave portion 13 is formed parallel to the side surface of the first concave portion 13 on the side of the second concave portion 13, and the two side surfaces of the second concave portion 13 are each formed with the outer surface of the insulating substrate 11. They are formed in parallel. With this configuration, in addition to the above, the thickness of the portion sandwiched between the second concave portion 13 and the side surface of the insulating substrate 11 can be increased, and when the electronic device is operated, the electronic component 2, particularly, the second concave portion Even if the insulating substrate 11 expands due to the heat of the second electronic component 22 mounted on the substrate 13, the portion between the second concave portion 13 and the side surface of the insulating substrate 11 is hardly distorted. It is possible to suppress the occurrence of cracks in the portion sandwiched between the side surfaces of the eleventh surface.

In addition, as in the examples shown in FIGS. 4 and 6, in a plan view, the second concave portion 13 is located inside a virtual straight line (second virtual straight line 11 b) connecting the respective side surfaces on the outer edge side of the insulating substrate 11. Since the respective corners of the first recess 12 are located, even when the outer shape of the first recess 12 and the first electronic component 21 mounted in the first recess 12 is to be large in plan view, The thickness of the portion sandwiched between the corner of the first concave portion 12 and the side surface of the insulating substrate 11 can be made large, and when the electronic device is operated, the electronic component 2 is mounted on the first concave portion 12 in particular. Even if the insulating substrate 11 tries to expand due to the heat of the first electronic component 21, distortion is unlikely to occur between the corners of the first recess 12 and the portion sandwiched between the side surfaces of the insulating substrate 11, and the corners of the first recess 12 Suppressing the occurrence of cracks in the portion sandwiched between the side surfaces of the insulating substrate 11 It is possible. In this case, the side face of the first recess 12 on the side of the second recess 13 is formed longer than the side face of the second recess 13 on the side of the first recess 12.

  The electronic component mounting board 1 of the second embodiment can be manufactured by using the same manufacturing method as the electronic component mounting board 1 of the above-described first embodiment.

(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7A is a vertical cross-sectional view corresponding to a position similar to the line AA of the electronic device according to the above-described embodiment, and FIG. 7B is a cross-sectional view taken along line BB of the electronic device according to the above-described embodiment. It is a longitudinal cross-sectional view corresponding to a similar position.

  The electronic device according to the third embodiment of the present invention is different from the electronic device according to the above-described embodiment in that the depth of the first concave portion 12 and the depth of the second concave portion 13 are different.

  According to the electronic component mounting board 1 of the third embodiment of the present invention, similarly to the first embodiment, the corner of the first concave portion 12 is located on the outer edge side of the insulating substrate 11 in plan view. When the electronic device is operated, the heat of the electronic component (the first electronic component 21) is easily transmitted to the outside through the first concave portion 12 and easily radiated to the outside, and has excellent long-term reliability. can do. Further, the thickness of the side wall sandwiched between the first concave portion 12 and the second concave portion 13 can be made large, and even if the insulating substrate 11 tries to expand due to the heat of the electronic component 2 when the electronic device is operated. Distortion hardly occurs in the side wall sandwiched between the first recess 12 and the second recess 13, and the occurrence of cracks in the side wall sandwiched between the first recess 12 and the second recess 12 can be suppressed.

  Also, as in the example shown in FIG. 7, if the depth of the second recess 13 disposed at the corner of the insulating substrate 11 is smaller than that of the first recess 12, when the electronic device is operated, Even if the insulating substrate 11 tries to expand due to the heat of the electronic component 2, the distortion on the outer peripheral side of the insulating substrate 11 is reduced, and between the first concave portion 12 and the second concave portion 12 or between the second concave portion 13 and the insulating substrate 11. It is possible to suppress the occurrence of cracks during the process.

  The electronic component mounting board 1 of the third embodiment can be manufactured using the same manufacturing method as the electronic component mounting board 1 of the above-described first embodiment.

(Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described with reference to FIG.

  The electronic device according to the third embodiment of the present invention is different from the electronic device according to the above-described embodiment in that the first recess 12 has a projection 121 at a corner in plan view.

  According to the electronic component mounting board 1 of the fourth embodiment of the present invention, similarly to the wiring board 1 of the first embodiment, the corner of the first concave portion 12 is located on the outer edge side of the insulating substrate 11 in plan view. When the electronic device is operated, the heat of the electronic component (first electronic component 21) is easily transmitted to the outside via the first concave portion 12, and is easily radiated to the outside. It can be excellent. Further, the thickness of the side wall sandwiched between the first concave portion 12 and the second concave portion 13 can be made large, and even if the insulating substrate 11 tries to expand due to the heat of the electronic component 2 when the electronic device is operated. Distortion hardly occurs in the side wall sandwiched between the first recess 12 and the second recess 13, and the occurrence of cracks in the side wall sandwiched between the first recess 12 and the second recess 12 can be suppressed.

When the first concave portion 12 has the protrusion 121 at the corner in plan view as in the example shown in FIG. 8, the first concave portion 12 does not substantially increase the outer shape of the first concave portion 12. The first electronic component 21 having a large outer shape can be mounted on the electronic component 21 so that the corner of the electronic component 21 and the corner of the first concave portion 12 can be easily suppressed from coming into contact with each other.

  The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfer on a side surface or a corner in a plan view. For example, a notch may be provided between the side surface and one main surface of the insulating substrate 11, and a so-called castellation conductor in which the wiring conductor 14 extends on the inner surface of the notch may be provided.

  In addition, in the example shown in FIGS. 1 to 7, the first recess 12 and the second recess 13 have side walls formed in a vertical shape in a vertical cross-sectional view, but the first recess 12 or the second recess 13 has In a vertical sectional view, the side wall may be a step-shaped concave portion whose opening side is wider than the bottom side. Further, the first recess 12 or the second recess 13 may be a recess in which the size on the opening side of the recess is smaller than the size on the bottom surface side of the recess in plan view.

  The electronic component mounting board 1 may be manufactured in the form of a multi-cavity electronic component mounting board.

1 .... Electronic component mounting board
11 ... Insulating substrate
11a: First virtual straight line
11b: Second virtual straight line
12 ··· First recess
13 ····· Second recess
14 ・ ・ ・ ・ ・ ・ Wiring conductor 2 ・ ・ ・ ・ ・ ・ Electronic components
21..First electronic component
22 ··· Second electronic component 3 ··· Connection member 4 ···· Module substrate
41 Connection pad 5 Solder

Claims (5)

An opening on the main surface, a first recess for mounting an electronic component and a second recess for mounting another electronic component, the insulating substrate having a rectangular shape in plan view,
In a plan view, the first recess is provided at a central portion of the insulating substrate, and the second recess is provided at a corner of the insulating substrate,
The first concave portion has a rectangular shape and the second concave portion has a triangular shape or a rectangular shape. A side surface of the first concave portion on the side of the second concave portion is parallel to a side surface of the second concave portion on the side of the first concave portion. der is,
In plan view, the corners of a pair of diagonally positioned in the first recess, characterized that you have provided on imaginary straight line intersecting perpendicularly to the opposed pair of sides of the insulating substrate electronic Component mounting board. The second recess is provided at each of a plurality of corners of the insulating substrate,
In plan view, the electronic component mounting board according to claim 1, characterized in that each corner portion of the first recess is provided at a position sandwiched plurality of said second recess. In a plan view, each corner of the first concave portion is located inside a virtual straight line connecting the respective side surfaces on the outer edge side of the insulating substrate in the second concave portion. Item 3. The electronic component mounting substrate according to item 2 . An electronic component mounting board according to any one of claims 1 to 3 ,
An electronic component mounted in the first recess;
An electronic device comprising: another electronic component mounted in the second recess. A module substrate having connection pads;
An electronic module comprising: the electronic device according to claim 4 connected to the connection pad via solder.

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