JP6573789B2 - Electronic component unit manufacturing method and electronic component unit - Google Patents

Description

  The present invention relates to an electronic component unit manufacturing method and an electronic component unit.

  As an electronic component unit provided in a conventional wire harness mounted on a vehicle or the like, for example, in Patent Document 1, a bottom portion where a connector pin is erected and a connector pin is surrounded along an outer periphery of the bottom portion. An electronic control device is disclosed that includes a connector housing having a side wall portion that forms a connector insertion region into which a connector to be connected is inserted. In this electronic control device, the connector housing also serves as a case for housing the circuit board, and the circuit board is housed in accordance with the space inside the connector housing by being bent at a flexible portion. At the same time, the rear end side of the connector pin protruding from the bottom of the connector housing is electrically connected to the circuit board.

JP-A-2005-191130

  Incidentally, the electronic control device described in Patent Document 1 has room for further improvement, for example, in terms of improving workability during manufacturing.

  This invention is made | formed in view of said situation, Comprising: It aims at providing the electronic component unit manufacturing method which can improve workability | operativity, and an electronic component unit.

  In order to achieve the above object, an electronic component unit manufacturing method according to the present invention includes a plurality of mounting portions on which electronic components are mounted, and the mounting portions are more flexible and electrically connect the plurality of mounting portions. A pair of corners of a housing to which a substrate having a bent portion to be connected is assembled is pressed against a fulcrum support surface along the bent portion as a pair of fulcrums, and a rotation axis passing through the pair of fulcrums is a rotation center. And a step of turning back one of the plurality of mounting portions together with the case by the bent portion by rotating the case.

  Moreover, in the said electronic component unit manufacturing method, the said pair of fulcrum by a pair of said corner | angular part shall be located on both sides of the said bending part.

  In the electronic component unit manufacturing method, in the folding step, a plurality of the substrates and the casings are arranged in a direction along the rotation axis, and the plurality of casings are arranged with the rotation axis as a rotation center. By rotating together, one of the plurality of mounting portions of the plurality of substrates together with the plurality of housings can be folded together at each of the bent portions.

  Further, the electronic component unit manufacturing method includes a housing installation step of installing the housing on one of the plurality of mounting portions before the folding step, wherein the plurality of mounting portions include the first mounting. Part and a second mounting part, and the substrate is integrated in a plurality in the direction in which the first mounting part and the second mounting part are arranged to form a board assembly, A bracket portion projecting from an outer surface; and in the housing installation step, the housing is positioned on one of the first mounting portions of the plurality of substrates of the substrate assembly and is adjacent to the substrate. A plurality of the housings may be installed on the substrate assembly in a positional relationship in which the bracket portion is positioned on the second mounting portion of the other substrate.

  In the electronic component unit manufacturing method, before the folding step, a terminal provided in the housing is inserted into a through hole provided in one of the plurality of mounting parts, and the plurality of mounting parts are A soldering step of soldering the terminal inserted into the through hole and electrically connecting the terminal and the substrate in a state where the casing is installed on one; It may have a lightening portion through which hot air for soldering can flow toward the contact point between the through hole and the terminal.

  In order to achieve the above object, an electronic component unit according to the present invention includes a plurality of mounting portions on which electronic components are mounted, and is more flexible than the mounting portion and electrically connects the plurality of mounting portions. A substrate having a bent portion; and a housing to which the substrate is assembled, wherein the housing has a pair of corner portions located between the bent portions in a state where at least one of the plurality of mounting portions is assembled. It is characterized by having.

  In the electronic component unit, the casing has a pair of corner portions pressed against a fulcrum support surface along the bent portion to form a pair of fulcrums, and a rotation axis passing through the pair of fulcrums. Can be used as a jig for turning back one of the plurality of mounting portions at the bent portion.

  In the electronic component unit manufacturing method and the electronic component unit according to the present invention, the pair of corner portions of the casing are used as a pair of fulcrums, and the casing is rotated about a rotation axis passing through the pair of fulcrums. Thus, one of the plurality of mounting portions is folded back at the bent portion together with the housing. Thereby, in the electronic component unit manufacturing method and the electronic component unit, the bent portion can be folded using the housing as a jig for folding one of the plurality of mounting portions at the bent portion. There is an effect that it is possible to improve workability when manufacturing an electronic component unit configured by housing the substrate bent at the bent portion in the casing.

FIG. 1 is a perspective view illustrating a schematic configuration of an electronic component unit according to the embodiment. FIG. 2 is an exploded perspective view illustrating a schematic configuration of the electronic component unit according to the embodiment. FIG. 3 is an exploded perspective view illustrating a schematic configuration of the electronic component unit according to the embodiment. FIG. 4 is an exploded perspective view illustrating a schematic configuration of the electronic component unit according to the embodiment. FIG. 5 is an exploded perspective view illustrating a state where the cover of the electronic component unit according to the embodiment is removed. 6 is a cross-sectional view taken along line AA shown in FIG. FIG. 7 is a flowchart illustrating a method for manufacturing the electronic component unit according to the embodiment. FIG. 8 is a plan view illustrating the method for manufacturing the electronic component unit according to the embodiment. FIG. 9 is a perspective view illustrating the method for manufacturing the electronic component unit according to the embodiment. FIG. 10 is a plan view illustrating the method for manufacturing the electronic component unit according to the embodiment. 11 is a cross-sectional view taken along line BB shown in FIG. FIG. 12 is a perspective view illustrating the method for manufacturing the electronic component unit according to the embodiment. FIG. 13 is a perspective view illustrating the method for manufacturing the electronic component unit according to the embodiment.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same.

[Embodiment]
FIG. 1 is a perspective view illustrating a schematic configuration of an electronic component unit according to the embodiment. 2, 3, and 4 are exploded perspective views illustrating a schematic configuration of the electronic component unit according to the embodiment. FIG. 5 is an exploded perspective view illustrating a state where the cover of the electronic component unit according to the embodiment is removed. 6 is a cross-sectional view taken along the line AA shown in FIG. 1 (cross-sectional view along the short side direction). In addition, in order to make it easy to understand, FIG.1, FIG.2, FIG.3 shows the electric wire with the dashed-two dotted line, and, in FIG.4, FIG.5, FIG.6, illustration of the electric wire is abbreviate | omitted. In addition, a power input connector, a power output connector, and a control signal connector, which will be described later, omit illustration of some elements such as a terminal insertion hole for simplification.

  The electronic component unit manufacturing method according to this embodiment is for manufacturing the electronic component unit 1 shown in FIGS. 1, 2, 3, 4, 5, and 6. In the following, first, the basic configuration of the electronic component unit 1 shown in FIGS. 1, 2, 3, 4, 5, and 6 will be described, and then the electronic component unit manufacturing method will be described in detail.

  The electronic component unit 1 shown in FIGS. 1, 2, 3, 4, 5, and 6 is detachably assembled to an electrical connection box 100 (see FIG. 1) mounted on a vehicle such as an automobile. This constitutes an electronic component module. Here, the electric connection box 100 is mounted on a vehicle such as an automobile, and is incorporated in a wire harness WH, and includes a connector, a fuse, a relay, a capacitor, a branching unit, an electronic control unit, and the like that constitute a connection processing part such as an electric wire. The electrical components are collected and accommodated inside. The wire harness WH is, for example, a bundle of a plurality of electric wires W used for power supply and signal communication for connection between devices mounted on a vehicle to form a collective part. Are connected to each device. The wire harness WH includes a plurality of electric wires W and an electric junction box 100 including the electronic component unit 1 electrically connected to the electric wires W. The electric wire W includes, for example, a conductor portion (core wire) obtained by twisting a plurality of conductive metal strands and an insulating covering portion that covers the outside of the conductor portion. The wire harness WH bundles and aggregates a plurality of electric wires W, and the electric connection box 100 is electrically connected to the end portions of the bundled electric wires W via a connector 6 as a connection portion. In addition to this, the wire harness WH may further include a grommet, a protector, a fixture, and the like. The electrical junction box 100 is installed in, for example, an engine compartment (engine room) or a vehicle compartment of a vehicle, connected between a power source such as a battery and various electronic devices mounted in the vehicle, and supplied from the power source. Distributes power to various electronic devices in the vehicle. The electrical junction box 100 may be called a junction box, a fuse box, a relay box, or the like. In the present embodiment, these are collectively called an electrical junction box. The electronic component unit 1 of the present embodiment incorporated in the electrical junction box 100 is connected between a power source such as a battery mounted on the vehicle and various electronic devices mounted on the vehicle, and the various electronic devices. It constitutes so-called power integration that distributes power to devices.

  Hereinafter, each structure of the electronic component unit 1 is demonstrated concretely. Each direction used in the following description will be described as a direction in which the wire harness WH is mounted on the vehicle unless otherwise specified. Further, here, in order to make the following explanation easy to understand, the first direction among the first direction, the second direction, and the third direction intersecting each other for convenience is referred to as a “height direction”. The direction is referred to as “short side direction”, and the third direction is referred to as “long side direction”. The height direction as the first direction, the short side direction as the second direction, and the long side direction as the third direction are orthogonal to each other.

  The electronic component unit 1 according to this embodiment includes an electronic component 2, a substrate 3, a terminal 4, and a housing 5.

  The electronic component 2 is mounted on the substrate 3, and here is an element that exhibits various functions. The electronic component 2 is, for example, a capacitor, a relay, a resistor, a transistor, an IPS (Intelligent Power Switch), an electronic control unit including a microcomputer, or the like. Here, the electronic component 2 includes, for example, a heat-generating component 21 that generates heat with power consumption and a heat-fragile component 22 that has lower heat resistance than the heat-generating component 21. The heat-generating component 21 is typically an electronic component 2 that is more likely to generate heat than the heat-fragile component 22 and has higher durability against heat than the heat-fragile component 22, and for example, power distribution such as relays, transistors, and IPS involved in power distribution. This is an electronic component 2 of the system. The heat-fragile component 22 is typically an electronic component 2 that is less likely to generate heat than the heat-generating component 21 and has less heat durability than the heat-generating component 21, for example, a control-system electronic component 2 such as a microcomputer involved in control. . In the following description, the heat-generating component 21 and the heat-fragile component 22 are simply referred to as the electronic component 2 when it is not necessary to distinguish between them.

  The board 3 constitutes an electronic circuit on which various electronic components 2 are mounted and electrically connected to each other. Here, the board 3 is a so-called rigid flexible printed circuit board (Rigid Flexible Printed Circuit Board). A wiring pattern (print pattern) is printed on the substrate 3 by an electrically conductive material such as copper on an insulating layer made of an insulating material such as epoxy resin, glass epoxy resin, paper epoxy resin, or ceramic. The substrate 3 may be a multi-layered structure obtained by laminating a plurality of insulating layers printed with a wiring pattern (that is, a multi-layer substrate).

  The substrate 3 of the present embodiment includes a plurality of rigid portions 31 as a plurality of mounting portions on which the electronic component 2 is mounted, and a bending that is more flexible than the rigid portion 31 and electrically connects the plurality of rigid portions 31. It has a flexible part 32 as a part, and a plurality of rigid parts 31 and a flexible part 32 are integrated. Each rigid part 31 has high rigidity to such an extent that it is harder to bend than the flexible part 32. Each rigid portion 31 is electrically connected to the wiring pattern of the lead wires and terminals 4 of the electronic component 2 by soldering or the like. On the other hand, the flexible part 32 has a high flexibility so as to be bent more easily than the rigid part 31. The flexible part 32 is provided between the adjacent rigid parts 31 among the plurality of rigid parts 31, and electrically connects them to each other. The flexible part 32 electrically connects the plurality of rigid parts 31 via a wiring pattern made of a conductive material such as copper. For example, the substrate 3 may be made of different materials for the insulating layer between the rigid portion 31 and the flexible portion 32, the number of laminated insulating layers corresponding to the flexible portion 32 may be reduced, or the portion corresponding to the flexible portion 32 may be reduced. The flexible part 32 having flexibility from the rigid part 31 can be formed by cutting a part of the insulating layer to reduce the thickness.

  More specifically, the plurality of rigid portions 31 of the present embodiment are configured to include two of a power supply system rigid portion 33 as a first mounting portion and a control system rigid portion 34 as a second mounting portion. Both the power system rigid part 33 and the control system rigid part 34 are formed in a rectangular plate shape. The power supply system rigid portion 33 and the control system rigid portion 34 are formed in substantially the same shape and size. Here, in the power supply system rigid portion 33 and the control system rigid portion 34, the main surfaces on both the front and back sides constitute mounting surfaces 33a and 34a for mounting the electronic component 2, but the present invention is not limited thereto. The power supply system rigid portion 33 is mounted on each mounting surface 33a with a heat generating component 21 that is mainly a power distribution system electronic component 2 such as a relay, transistor, or IPS. On the other hand, in the control system rigid portion 34, the heat-fragile component 22 that is mainly the control-system electronic component 2 such as a microcomputer is mounted on each mounting surface 34a. The heat generating component 21 and the heat-fragile component 22 are fixed to the mounting surfaces 33a and 34a by soldering or the like, and are electrically connected to the wiring patterns of the mounting surfaces 33a and 34a. In the following description, the power supply system rigid unit 33 and the control system rigid unit 34 are simply referred to as the rigid unit 31 when it is not necessary to distinguish between them.

  And the flexible part 32 of this embodiment electrically connects the power system rigid part 33 and the control system rigid part 34 as the some rigid part 31. As shown in FIG. The substrate 3 of the present embodiment is located side by side in a direction perpendicular to the long side in a positional relationship in which the long side of the power system rigid part 33 and the control system rigid part 34 face each other, The flexible part 32 is interposed between the power system rigid part 33 and the control system rigid part 34 in the direction orthogonal to the long side. That is, the flexible part 32 connects one long side of the power system rigid part 33 and one long side of the control system rigid part 34 along a direction orthogonal to the long side. The flexible portion 32 extends along the long side direction, and is formed to be slightly shorter than the long sides of the power system rigid portion 33 and the control system rigid portion 34 here. The flexible portion 32 has flexibility as described above, and can be bent in a direction in which the power system rigid portion 33 and the control system rigid portion 34 are folded around the bending axis along the long side direction. It is. As described later, the substrate 3 is in a state in which the flexible portion 32 is bent, more specifically, in a state in which the flexible portion 32 is bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially vertical. Housed in the housing 5.

  The terminal 4 is erected in a straight line from one of the plurality of rigid portions 31 and electrically connects the connector 6, which is a connection portion with the electric wire W, and the substrate 3. A plurality of terminals 4 are provided. Each terminal 4 is made of a conductive metal material. Each terminal 4 includes a terminal having a different outer dimension or having an end portion divided into two or three parts, but is basically formed in a straight bar shape. Here, the plurality of terminals 4 include a terminal 41 electrically connected to a power input connector 61 as a connector 6 to be described later, a terminal 42 electrically connected to a power output connector 62 as a connector 6, and a connector. 6 includes a terminal 43 electrically connected to the control signal connector 63. The terminal 41 is provided with one whose end is divided into three sections. Two terminals 42 having two end portions are provided side by side in the long side direction. Nineteen terminals 43 whose ends are not separated are provided side by side in the long side direction and the short side direction. In the following description, the terminals 41, 42, and 43 are simply referred to as terminals 4 when it is not necessary to distinguish between them.

  Each terminal 4 of this embodiment is erected only on the power system rigid portion 33 among the plurality of rigid portions 31. Each terminal 4 is erected in a straight line substantially perpendicular to one mounting surface 33 a of the power system rigid portion 33. That is, each terminal 4 protrudes and extends from the mounting surface 33a along the short side direction and the height direction orthogonal to the long side direction in a state where the substrate 3 is accommodated in a case 5 described later. Each terminal 4 has an end portion inserted from one side of the mounting surface 33a into a through hole 33b (see FIG. 2, FIG. 3, FIG. 4, etc.) provided in the portion where the wiring pattern is formed on the mounting surface 33a. The mounting surface 33a is fixed by soldering or the like and is electrically connected to the wiring pattern of the mounting surface 33a. In addition, each terminal 4 is exposed in a connector fitting portion 51h, 51i, 51j, which will be described later, in a state where the substrate 3 is accommodated in a casing 5 which will be described later, and the connector fitting portions 51h, 51i. , 51j are electrically connected to the connector 6 fitted.

  The housing 5 is one in which the substrate 3 is assembled and the substrate 3 is accommodated. Here, the housing 5 accommodates the substrate 3 with the flexible portion 32 bent toward the terminal 4 side. The housing 5 of the present embodiment includes a connector block 51 as a main body portion on which a connector 6 constituting a connection portion with the substrate 3, the terminal 4 and the electric wire W is assembled, and the substrate 3 and the terminal 4 assembled with the connector block 51. And a cover 52 as a lid member for covering the like. Both the connector block 51 and the cover 52 are formed of an insulating synthetic resin. In the housing 5, the substrate 3 is assembled in an interior defined by the connector block 51 and the cover 52, and the substrate 3 is accommodated.

  The connector block 51 includes a bottom portion 51a, side wall portions 51b and 51c, support column portions 51d, 51e, 51f, and 51g, connector fitting portions 51h, 51i, and 51j as connection portion fitting portions, and bracket portions 51k and 51l. These are integrally formed.

  The bottom 51a is a bottom body formed in a rectangular plate shape in which the side along the short side direction is the short side and the side along the long side direction is the long side. The bottom portion 51 a is formed in a rectangular plate shape that is slightly larger than the power system rigid portion 33. The bottom 51a is formed with a lightening hole or the like.

  The side wall portions 51b and 51c are wall bodies that are erected vertically along the height direction from the short side of the bottom portion 51a. The side wall parts 51b and 51c are formed in a rectangular plate shape, and extend from one end part in the short side direction of the short side of the bottom part 51a to the other end part. The side wall 51b and the side wall 51c face each other along the long side direction.

  The column portions 51d, 51e, 51f, and 51g are columnar bodies that are erected vertically from the four corners of the bottom portion 51a one by one along the height direction. The column portions 51d, 51e, 51f, and 51g are formed so as to protrude along the height direction, although the shapes are slightly different from each other. Here, the column part 51d and the column part 51e are formed so as to protrude along the height direction from both ends in the short side direction of the side wall part 51b. The support column 51d and the support column 51e face each other along the short side direction. The support column part 51f and the support column part 51g are formed so as to protrude along the height direction from both ends in the short side direction of the side wall part 51c. The support column part 51f and the support column part 51g face each other along the short side direction. Moreover, the support | pillar part 51d and the support | pillar part 51f are formed in the long side of the same side of the bottom part 51a, and are opposed along a long-side direction. The support column 51e and the support column 51g are formed on the long side of the bottom 51a opposite to the support columns 51d and 51f, and face each other along the long side direction.

  The connector fitting portions 51h, 51i, 51j are portions into which the connector 6 that is a connection portion with the electric wire W is fitted. Here, the connector 6 includes a power input connector 61 for inputting power via the electric wire W, a power output connector 62 for outputting power via the electric wire W, and a control signal via the electric wire W. And a control signal connector 63 for transmitting and receiving the signal. The connector fitting portion 51h is for fitting the power input connector 61, the connector fitting portion 51i is for fitting the power output connector 62, and the connector fitting portion 51j is for control signals. The connector 63 is fitted. Here, the power input connector 61, the power output connector 62, and the control signal connector 63 are, for example, so-called vertical connectors.

  The connector fitting parts 51h, 51i, 51j are arranged along the height direction with the power system rigid part 33 in which the terminal 4 is erected among the plurality of rigid parts 31 in a state where the substrate 3 is accommodated in the housing 5. It is formed at an opposing position. More specifically, the connector fitting portion 51h is located at a position facing the region where the terminal 41 is erected in the power supply system rigid portion 33 in the state where the board 3 is accommodated in the housing 5 along the height direction. It is formed. The connector fitting portion 51 i is formed at a position facing the region where the terminal 42 is erected in the power system rigid portion 33 in the state where the substrate 3 is accommodated in the housing 5 along the height direction. The connector fitting portion 51j is formed at a position facing the region where the terminal 43 is erected in the power supply system rigid portion 33 in the state in which the substrate 3 is accommodated in the housing 5 along the height direction. Here, the connector fitting parts 51h, 51i, 51j are formed on the protruding part wall-like part 51m formed on the bottom part 51a. The protruding portion wall-shaped portion 51m is a wall body that protrudes from the bottom portion 51a along the height direction on the same side as the protruding side of the side wall portions 51b and 51c and the column portions 51d, 51e, 51f, and 51g. The protruding portion wall-shaped portion 51m is formed in a substantially rectangular parallelepiped hollow shape, and extends along the long side direction at the edge of the long side of the bottom portion 51a on the side of the column portions 51e and 51g. The connector fitting portions 51h, 51i, 51j are formed as concave portions in a hollow portion on the opposite side to the protruding side of the protruding portion wall-shaped portion 51m. The connector fitting portion 51h is formed as a concave portion having a shape and a size with which the power input connector 61 can be fitted. The connector fitting portion 51i is formed as a concave portion having a shape and a size capable of fitting the power output connector 62. The connector fitting portion 51j is formed as a concave portion having a shape and a size with which the control signal connector 63 can be fitted. Further, the protruding wall 51m is inserted into the front end surface in the height direction, that is, the surface facing the power system rigid portion 33 along the height direction in a state where the substrate 3 is accommodated in the housing 5. A hole (also referred to as a cavity) 51ma (see FIG. 6) is formed. Each terminal 4 is exposed in the connector fitting portions 51h, 51i, and 51j with one end thereof penetrating through the terminal insertion hole 51ma in a state where the substrate 3 is accommodated in the housing 5. Here, the terminal 41 is exposed in the connector fitting portion 51h through the terminal insertion hole 51ma of the protruding portion wall-shaped portion 51m. The terminal 42 is exposed in the connector fitting part 51i through the terminal insertion hole 51ma of the protruding part wall-like part 51m. The terminal 43 is exposed in the connector fitting portion 51j through the terminal insertion hole 51ma of the protruding portion wall-like portion 51m. The power input connector 61 is electrically connected to the terminal 41 exposed in the connector fitting portion 51h by fitting in the connector fitting portion 51h. The power output connector 62 is electrically connected to the terminal 42 exposed in the connector fitting portion 51i by fitting in the connector fitting portion 51i. The control signal connector 63 is electrically connected to the terminal 43 exposed in the connector fitting portion 51j by fitting in the connector fitting portion 51j. In the following description, the power input connector 61, the power output connector 62, and the control signal connector 63 are simply referred to as the connector 6 when there is no need to distinguish them.

  The bracket portions 51k and 51l are for fixing the housing 5 to the vehicle body or the like of the vehicle. The bracket portions 51k, 51l protrude in a plate shape from the long side of the bottom portion 51a on the support column portions 51e, 51g side, that is, the long side on the side where the protruding portion wall-shaped portion 51m is provided, and the tip portion has an arc shape. As well as being formed, fastening holes 51n and 51o are formed. Here, the bracket part 51k is formed at the end on the column part 51e side, and the bracket part 51l is formed on the end on the column part 51g side. The fastening holes 51n and 51o penetrate in the height direction. The bracket 5 is fixed to the fixing part on the vehicle body side by inserting a fastening member such as a bolt into the fastening holes 51n and 51o and fastening the casing 5 to the fixing part on the vehicle body side.

  In the connector block 51 configured as described above, one end portion of each terminal 4 is inserted and held in a terminal insertion hole 51ma (see FIG. 6) formed in the distal end surface of the protruding wall-like portion 51m, and a connector fitting portion. With the terminals 51h, 51i, and 51j exposed, the other end portions of the terminals 4 are inserted into the through holes 33b (see FIGS. 2, 3, and 4) of the power system rigid portion 33 and soldered. In this state, in the substrate 3, the power system rigid portion 33 faces the protruding portion wall-shaped portion 51m along the height direction, the long side of the power system rigid portion 33 is along the long side direction, and the short side is the short side direction. , And the power supply system rigid portion 33 is assembled to the connector block 51 in such a positional relationship that the flexible portion 32 is along the long side of the column portions 51d and 51f. In this case, in the substrate 3, the positioning projection 51q formed at the tip of the support column 51e is inserted into the positioning hole 51p formed in one corner of the power supply system rigid portion 33 opposite to the flexible portion 32 side. Is positioned. And the board | substrate 3 inserts the screws 71 and 72 into the screw holes 51r and 51s formed in the both corners of the flexible part 32 side of the power system rigid part 33, and the said screws 71 and 72 are the tips of the column parts 51d and 51f. Are fixed to the column portions 51d, 51e, 51f, 51g. In the substrate 3, the flexible portion 32 is bent toward the terminal 4, that is, the control system rigid portion 34 is bent toward the support column portions 51d and 51f with respect to the power supply system rigid portion 33. The flexible portion 32 of the board 3 is bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially perpendicular, and the long side of the control system rigid portion 34 is along the long side direction and the short side is the height direction. The control system rigid portion 34 is assembled to the connector block 51 in such a positional relationship as follows. That is, the board | substrate 3 is comprised by the substantially L shape as a whole in the cross sectional view (refer FIG. 6) along a short side direction because the flexible part 32 bends. In this case, the board 3 has screws 73 and 74 inserted into screw holes 51v and 51w formed at opposite corners of the control system rigid part 34 on the opposite side to the flexible part 32 side. By being fastened to fastening holes 51x and 51y formed in the base end portions of 51d and 51f (in other words, base end portions on the side surfaces of the side wall portions 51b and 51c), the side portions of the support portions 51d and 51f are fixed. The In this way, the board 3 is assembled to the connector block 51 with the flexible portion 32 bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially vertical. In this state, the substrate 3 has the power system rigid part 33 along the direction perpendicular to the height direction, the control system rigid part 34 along the direction perpendicular to the short side direction, and the power system rigid part 33 is the protruding wall. The control system rigid portion 34 is positioned so as to face the shape portion 51m along the height direction, and is positioned on the outer side in the short side direction of the support column portions 51d and 51f. In addition, the manufacturing method of this electronic component unit 1 is demonstrated in detail later.

  The cover 52 covers the substrate 3 and the like assembled to the connector block 51 from the side opposite to the connector block 51. The cover 52 includes a rectangular frame-shaped portion 52a as a wall formed in a substantially square shape, and a ceiling portion 52b that closes one opening of the rectangular frame-shaped portion 52a. The ceiling part 52b is a ceiling body formed in a rectangular plate shape in which a side along the short side direction is a short side and a side along the long side direction is a long side. The ceiling part 52b is formed in a rectangular plate shape that is slightly larger than the bottom part 51a. The rectangular frame-shaped part 52a is formed so as to stand on the edge of the ceiling part 52b. The rectangular frame-shaped part 52a includes a pair of long side wall surfaces 52c and 52d along the long side direction of the ceiling part 52b, and a pair of short side wall surfaces 52e and 52f along the short side direction of the ceiling part 52b. Formed with. The cover 52 is formed in a rectangular cylindrical shape having one end opened and the other end closed by the rectangular frame-shaped portion 52a and the ceiling portion 52b. The cover 52 is attached to the connector block 51 in such a positional relationship as to cover the substrate 3 or the like assembled to the connector block 51 from the side opposite to the connector block 51. When the cover 52 is attached to the connector block 51, the long side wall surfaces 52 c and 52 d and the short side wall surfaces 52 e and 52 f constituting the rectangular frame-shaped portion 52 a are the side wall portions 51 b and 51 c of the connector block 51 and the column portions. 51d, 51e, 51f, 51g, located outside the control system rigid part 34. The cover 52 is locked to the connector block 51 via various locking mechanisms while being attached to the connector block 51. Here, in the cover 52, the engaging recess 52g provided on the short side wall surfaces 52e and 52f on the cover 52 side and the claw portion 51z provided on the side wall portions 51b and 51c on the connector block 51 side are engaged. Thus, the connector block 51 is engaged, and the connector block 51 is detachably assembled.

  The housing 5 is configured as described above, and accommodates the substrate 3 in a state where the flexible portion 32 is bent toward the terminal 4 side. More specifically, the housing 5 is an interior partitioned by the connector block 51 and the cover 52 in a state where the plurality of rigid portions 31 are arranged along different wall surfaces that respectively form the internal space portion of the housing 5. The board | substrate 3 is accommodated in the space part side (refer FIG. 6 etc.). Here, in the housing 5, the power system rigid portion 33 among the plurality of rigid portions 31 is arranged along the ceiling portion 52 b of the cover 52, and the control system rigid portion 34 among the plurality of rigid portions 31 is the length of the cover 52. The board | substrate 3 is accommodated in the internal space part side in the state arrange | positioned along the side wall surface 52c. In the state in which the substrate 3 is accommodated in the housing 5, the power system rigid portion 33 faces the ceiling portion 52b along the height direction, and the control system rigid portion 34 extends along the short side direction to the long side wall surface. 52c.

  And each terminal 4 of this embodiment is located in the outer side in one of the some rigid parts 31, here, the power system rigid part 33, and the housing | casing 5 comprised as mentioned above is provided. The layout is designed to reduce the size of the unit by effectively using the space inside and saving space.

  Specifically, each terminal 4 is located closer to the opposite side of the flexible part 32 in the power system rigid part 33 (see FIGS. 2, 5, 6, etc.). In other words, the through hole 33 b into which one end of each terminal 4 is inserted is located closer to the opposite side of the flexible part 32 in the power system rigid part 33. Here, the case where the power supply system rigid portion 33 is located on the opposite side of the flexible portion 32 includes the case where most of the plurality of terminals 4 are located on the opposite side of the flexible portion 32. Here, typically, most of the plurality of terminals 4 and the through holes 33b are mainly the center position C of the power supply system rigid portion 33 (here, the center position in the short side direction (see FIGS. 5 and 6, etc.)). It is located closer to the end opposite to the flexible portion 32, that is, the outer end opposite to the flexible portion 32 and the control system rigid portion 34.

  Each terminal 4 is positioned closer to the opposite side of the flexible part 32 in the power system rigid part 33, so that an accommodation space part 53 for accommodating the electronic component 2 between the board 3 and the housing 5 is provided. (See FIG. 2, FIG. 6, etc.) The accommodating space 53 is formed in each terminal 4 with respect to the short side direction (the direction in which the power supply system rigid portion 33 and the flexible portion 32 are arranged) in the internal space portion of the housing 5 partitioned by the connector block 51 and the cover 52. More on the flexible part 32 side, the wall surface of the housing 5, here, the ceiling part 52b, the long side wall surface 52c, the short side wall surfaces 52e, 52f and the like are formed. In other words, the accommodating space 53 is a protruding wall shape that is a wall that forms the connector fitting portions 51h, 51i, 51j in the internal space of the housing 5 partitioned by the connector block 51 and the cover 52. It is partitioned between the portion 51m and the ceiling portion 52b, the long side wall surface 52c, the short side wall surfaces 52e, 52f and the like. Here, the accommodation space portion 53 is formed as a space portion having a substantially L-shaped cross section in a sectional view along the short side direction (see FIG. 6). The electronic component 2 mounted on the rigid portion 31, here, the heat generating component 21 mounted on the power system rigid portion 33 and the heat-fragile component 22 mounted on the control system rigid portion 34 are accommodated in the accommodating space 53. Is done.

  Further, in the electronic component unit 1 of the present embodiment, the lock release portions 61a, 62a, 63a as release portions for releasing the fitting between the connector 6 and the connector fitting portions 51h, 51i, 51j are provided on the housing space portion 53 side. Located (see FIG. 2, FIG. 6, etc.). Here, the lock release portion 61a is an arm-like member provided in the power input connector 61, and is positioned on the accommodation space portion 53 side in a state where the power input connector 61 is fitted in the connector fitting portion 51h. The distal end portion is exposed from the connector fitting portion 51h. The unlocking portion 61a bends by being pinched with a finger or the like, releases the fitting state between the power input connector 61 and the connector fitting portion 51h, and can remove the power input connector 61 from the connector fitting portion 51h. And The lock release portion 62a is an arm-like member provided in the power output connector 62, and is positioned on the housing space 53 side with the power output connector 62 fitted in the connector fitting portion 51i, and has a distal end portion. It is exposed from the connector fitting part 51i. The unlocking portion 62a bends when pinched with a finger or the like, releases the fitting state between the power output connector 62 and the connector fitting portion 51i, and can remove the power output connector 62 from the connector fitting portion 51i. And The lock release portion 63a is an arm-like member provided in the control signal connector 63, and is positioned on the accommodating space portion 53 side in a state where the control signal connector 63 is fitted in the connector fitting portion 51j, and the distal end portion thereof. It is exposed from the connector fitting part 51j. The unlocking portion 63a bends by being pinched with a finger or the like, releases the fitting state between the control signal connector 63 and the connector fitting portion 51j, and can remove the control signal connector 63 from the connector fitting portion 51j. And In other words, the lock release portions 61 a, 62 a, and 63 a are positioned facing the control system rigid portion 34 side in a state where the substrate 3 is accommodated in the housing 5. Here, the lock release parts 61a, 62a, and 63a face the heat-fragile part 22 that is the electronic part 2 mounted on the control system rigid part 34 and located in the accommodation space part 53 along the short side direction.

  Next, with reference to FIGS. 7, 8, 9, 10, 11, 12, and 13, a manufacturing method (electronic component unit manufacturing method) of the electronic component unit 1 configured as described above will be described. explain. FIG. 7 is a flowchart illustrating a method for manufacturing the electronic component unit according to the embodiment. 8 and 10 are plan views illustrating a method for manufacturing the electronic component unit according to the embodiment. FIG. 9, FIG. 12, and FIG. 13 are perspective views for explaining a method of manufacturing an electronic component unit according to the embodiment. 11 is a cross-sectional view taken along line BB shown in FIG. In the following description, while referring to the flowchart of FIG. Although the manufacturing method of the electronic component unit 1 described below is described as an operation performed manually by an operator using various devices, equipment, jigs, etc., the present invention is not limited to this. It may be executed automatically.

  First, the worker provides the terminal 4 on the housing 5 as a terminal installation step (step ST1). More specifically, the worker inserts the terminal 41 into the terminal insertion hole 51ma (see FIG. 6) formed in the distal end surface of the portion corresponding to the connector fitting portion 51h in the protruding wall portion 51m of the connector block 51. Insert one end. As a result, one end of the terminal 41 is exposed in the connector fitting portion 51h via the terminal insertion hole 51ma. Similarly, the worker inserts one end portion of the terminal 42 into the terminal insertion hole 51ma formed in the distal end surface of the portion corresponding to the connector fitting portion 51i in the protruding portion wall-shaped portion 51m of the connector block 51. Thereby, one end of the terminal 42 is exposed in the connector fitting portion 51i through the terminal insertion hole 51ma. The worker inserts one end portion of the terminal 43 into the terminal insertion hole 51ma formed in the distal end surface of the portion corresponding to the connector fitting portion 51j in the protruding portion wall-shaped portion 51m of the connector block 51. Thus, one end of the terminal 43 is exposed in the connector fitting portion 51j through the terminal insertion hole 51ma.

  Next, as an insertion / installation step, the worker inserts the other end of the terminal 4 into the through hole 33b (see FIGS. 2, 3, 4 and the like) provided in one of the plurality of rigid portions 31 of the substrate 3. And the housing 5 is set on one of the plurality of rigid portions 31 (step ST2). Part of this insertion / installation step (step ST2) constitutes a case installation step of installing the case 5 on one of the plurality of rigid portions 31.

  Here, in the method of manufacturing the electronic component unit 1 of the present embodiment, the steps from the insertion / installation step (step ST2) to the second cutting step (step ST7) are performed by integrating a plurality of substrates 3 as shown in FIG. This is performed on the assembled substrate assembly 300. The substrate assembly 300 is configured by integrating a plurality of substrates 3 side by side in a direction in which the power supply system rigid portion 33 and the control system rigid portion 34 are arranged and in a direction orthogonal to the arrangement direction. The direction orthogonal to the arrangement direction corresponds to a direction along the extending direction of the flexible portion 32, and further corresponds to a direction along a rotation axis X described later. Here, for convenience, the direction in which the power system rigid part 33 and the control system rigid part 34 are arranged is referred to as “L1 direction”, and the direction orthogonal to the arranged direction is referred to as “L2 direction”. In the substrate assembly 300, four substrates 3 are arranged along the L1 direction, and two substrates 3 are arranged along the L2 direction, respectively, so that a total of eight substrates 3 are integrated. The eight substrates 3 are integrated by carriers (connecting portions) 301, 302, and 303 to constitute a substrate assembly 300. The carriers 301, 302, and 303 extend in a bar shape in the L1 direction and connect the substrates 3 to each other. The carrier 301 connects one end portion in the L2 direction of the four substrates 3 arranged in the L1 direction, and the carrier 302 connects the other end portion in the L2 direction of the remaining four substrates 3 arranged in the L1 direction. Are interposed between the four substrates 3 connected by the carrier 301 and the four substrates 3 connected by the carrier 302 and are connected to each other. The eight substrates 3 constituting the substrate assembly 300 are integrated in a plate-like state in which the flexible portion 32 is not bent, and the substrate assembly 300 forms a rectangular plate as a whole. In the substrate assembly 300, the long side of the power supply system rigid portion 33 and the long side of the control system rigid portion 34 of each substrate 3 adjacent in the L1 direction face each other with a slight gap along the L1 direction. Further, the eight substrates 3 constituting the substrate assembly 300 are integrated with the electronic component 2 mounted thereon and the through holes 33b are formed. That is, each substrate 3 constituting the substrate assembly 300 has the heat generating component 21 mounted on the mounting surface 33a of the power supply system rigid portion 33 and the through hole 33b, and the control system rigid portion 34 has a through hole 33b. The heat-fragile component 22 is mounted on the mounting surface 34a.

  In the insertion / installation step (step ST2), as shown in FIGS. 9, 10, and 11, the worker places the casing 5 on each substrate 3 of the substrate assembly 300 configured as described above. The connector block 51 to be configured is installed. More specifically, the operator inserts the terminal of each connector block 51 into the through hole 33b provided in each power supply system rigid portion 33 among the plurality of rigid portions 31 of each substrate 3 constituting the substrate assembly 300. The other end portion of the terminal 4 held in the hole 51ma is inserted, and the connector block 51 is installed on each power system rigid portion 33. In the insertion / installation process (step ST2) of the present embodiment, the worker places the connector block 51 on one power system rigid portion 33 of the plurality of boards 3 of the board assembly 300, and the board. A plurality of connector blocks 51 are installed on the board assembly 300 in a positional relationship where the bracket parts 51k and 51l projecting from the outer surface of the connector block 51 are positioned on the control system rigid part 34 of the other board 3 adjacent to the board 3. To do. In this state, each connector block 51 is positioned immediately above each power supply system rigid portion 33 because the positional relationship between the long side and the short side matches the positional relationship between the long side and the short side of each power supply system rigid portion 33. . Further, in this state, each connector block 51 has the support portions 51d, 51e, 51f, and 51g, the distal end side located on each power supply system rigid portion 33 side, and each bottom portion 51a on the opposite side to each power supply system rigid portion 33. To position. In this insertion / installation step (step ST2), the worker inserts the positioning protrusion 51q (see FIG. 2 and the like) of the column 51e into the positioning hole 51p (see FIG. 2 and the like) of the power system rigid part 33. Keep it.

  Next, as a soldering process, the worker inserts the terminal 4 provided in the connector block 51 into each through-hole 33 b provided in the power system rigid part 33 and inserts the connector on the power system rigid part 33. With the block 51 installed, the terminal 4 inserted into the through hole 33b is soldered to electrically connect the terminal 4 and the power system rigid part 33 of the substrate 3 (step ST3). For example, the worker solders the terminal 4 inserted into the through hole 33b and the power system rigid portion 33 by so-called reflow soldering.

  Here, as shown in FIGS. 9, 10, and 11, the connector block 51 of this embodiment is configured so that the hot air for soldering used in this soldering step (step ST3) The thinning portion 54 that can be distributed toward the contact point is provided. Here, a plurality of the lightening portions 54 are formed in the protruding portion wall-shaped portion 51m provided with the connector fitting portions 51h, 51i, 51j. Each thinned portion 54 of the present embodiment is formed on the side opposite to the bracket portions 51k and 51l across the connector fitting portions 51h, 51i, and 51j in the protruding portion wall-shaped portion 51m (see FIG. 11 and the like). . In other words, each thinned portion 54 is provided on the side where the flexible portion 32 is located in the protruding portion wall-shaped portion 51 m in a state where the substrate 3 is assembled to the connector block 51. The plurality of lightening portions 54 are provided side by side along the long side direction (L2 direction) in the protruding portion wall-shaped portion 51m. Each hollow portion 54 penetrates through each bottom portion 51a and the like, and is a space through which soldering hot air can be blown toward the contact point between the through hole 33b and the terminal 4 through the side of the connector fitting portions 51h, 51i, 51j. (See arrow AR1 in FIG. 11). Each thinned portion 54 is preferably appropriately inclined so that the hot air for soldering directly hits the contact point between the through hole 33 b and the terminal 4. Further, in each of the thinned portions 54, the opening opposite to the contact point between the through hole 33b and the terminal 4 functions as an inflow opening for soldering hot air. Each of the thinned portions 54 is tapered at the edge of the inflow opening so that the hot air for soldering can easily flow into the inflow opening.

  Next, the worker fixes the power supply system rigid portion 33 of each board 3 to each connector block 51 as a first fixing step (step ST4). More specifically, the worker can insert the positioning projection 51q (see FIG. 2 and the like) of the support column 51e into the positioning hole 51p (see FIG. 2 and the like) of the power system rigid part 33 and position the power supply system. The screws 71 and 72 are inserted into the screw holes 51r and 51s of the rigid part 33, and the screws 71 and 72 are fastened to the fastening holes 51t and 51u of the post parts 51d and 51f, so that the power system rigid part 33 is attached to the post part. It fixes to 51d, 51e, 51f, 51g.

  Next, as a first cutting step, the worker cuts the connection portion between the power supply system rigid portion 33 of each substrate 3 and the carriers 301, 302, and 303 (step ST5).

  Next, the worker turns back one of the plurality of rigid parts 31, here, the power system rigid part 33 with the flexible part 32, as shown in FIG. 9, FIG. 11, FIG. 12, and FIG. (Step ST6). More specifically, the worker presses the pair of corner portions 55 and 56 of the connector block 51 against the fulcrum support surface 400 along the flexible portion 32 to form a pair of fulcrum points P1 and P2. Then, the worker flexibly turns the power supply system rigid portion 33 together with the connector block 51 by rotating the connector block 51 around the rotation axis X (see FIG. 9) passing through the pair of fulcrums P1 and P2. The part 32 is folded back (see arrow AR2 in FIGS. 9 and 11). Thus, the worker can bend the flexible portion 32 toward the terminal 4, that is, bend the control system rigid portion 34 relative to the power supply system rigid portion 33 toward the support column portions 51 d and 51 f side.

  The pair of corner portions 55 and 56 of the connector block 51 are formed at the tip end portions of the column portions 51d and 51f located on the side opposite to the side from which the bracket portions 51k and 51l protrude (FIGS. 2, 3 and 5). See also 5 etc.). The corner portion 55 is the outermost corner portion of the column portion 51d, here, the outermost corner portion of the portion protruding from the surface on which the fastening hole 51t (see FIG. 3) is formed. The fulcrum P <b> 1 is configured by being pressed against 400. The corner portion 56 is the outermost corner portion of the column portion 51f, here, the outermost corner portion of the portion protruding from the surface where the fastening hole 51u (see FIG. 3) is formed, and the fulcrum support surface The fulcrum P <b> 2 is configured by being pressed against 400. As a result, the connector block 51 has a fulcrum P1 constituted by the corner portions 55 and 56 and by extension the corner portions 55 and 56 in a state where one of the plurality of rigid portions 31, here, the power supply system rigid portion 33 is assembled. , P2 is located outside (projected side) from the power system rigid portion 33. The pair of corner portions 55 and 56 are connectors having pivot points X1 (see FIG. 9) passing through the pair of fulcrums P1 and P2 as pivot centers, by forming curved portions of the fulcrums P1 and P2. The turning operation when turning the block 51 can be made smooth. Further, in each connector block 51, the pair of fulcrum points P <b> 1 and fulcrum points P <b> 2 by the pair of corner portions 55 and 56 are located on the fulcrum support surface 400 with the flexible portion 32 interposed therebetween. That is, the connector block 51 has at least one of the plurality of rigid portions 31, here, a pair of corner portions 55 and 56 positioned with the flexible portion 32 sandwiched in a state where the power system rigid portion 33 is assembled. It is. And the rotation axis X which passes along a pair of fulcrum P1, P2 is formed along the L2 direction here. Here, the fulcrum support surface 400 is, for example, a work surface of a work table on which the substrate assembly 300 is placed to perform work. For example, a part of the control system rigid portion 34 is used as the fulcrum support surface 400. May function. That is, the worker may press the pair of corner portions 55 and 56 of the connector block 51 against the control system rigid portion 34 as the fulcrum support surface 400 along the flexible portion 32 to form a pair of fulcrums P1 and P2.

  In the turning-back process (step ST6), the worker typically arranges a plurality of substrates 3 and connector blocks 51 in a direction along the rotation axis X, and a plurality of rotations about the rotation axis X as a rotation center. It is preferable that the power supply system rigid portions 33 of the plurality of substrates 3 together with the plurality of connector blocks 51 are folded together at the respective flexible portions 32 by rotating the connector blocks 51 together. That is, the worker configures the board assembly 300 to rotate the two connector blocks 51 arranged along the L2 direction together, thereby bringing the power supply system rigid parts 33 of the two boards 3 together. It is preferable that the flexible portion 32 be folded back.

  Further, in the turning-back process (step ST6), the worker is positioned on the opposite side of the corner portions 55 and 56 constituting the fulcrums P1 and P2 when the connector block 51 is rotated, and protrudes from the outer surface of the connector block 51. By turning the bracket portions 51k and 51l to perform the turning operation, the folding operation can be performed more easily and accurately.

  Next, as a second cutting step, the worker cuts the connection portion between the control system rigid portion 34 of each substrate 3 and the carriers 301, 302, and 303 (step ST7).

  Next, an operator fixes the control system rigid part 34 of each board | substrate 3 to each connector block 51 as a 2nd fixing process (step ST8). More specifically, the operator inserts the screws 73 and 74 into the screw holes 51v and 51w of the control system rigid portion 34, and fastens the screws 73 and 74 to the fastening holes 51x and 51y of the support columns 51d and 51f. The control system rigid part 34 is fixed to the column parts 51d and 51f.

  Next, as a cover mounting process, the worker attaches the board 3 or the like assembled to the connector block 51 in a state where the flexible portion 32 is bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially vertical. The cover 52 is attached to the connector block 51 so as to cover the connector block 51 from the side opposite to the connector block 51 (step ST9). In this case, the worker engages the locking recess 52g on the cover 52 side and the claw portion 51z on the connector block 51 side to mount and lock the cover 52 on the connector block 51, and the electronic component unit 1 To do. Above, the manufacturing method of the electronic component unit 1 is complete | finished.

  According to the manufacturing method of the electronic component unit 1 described above, the plurality of rigid portions 31 on which the electronic component 2 is mounted, and the plurality of rigid portions 31 that are more flexible than the rigid portion 31 are electrically connected. The pair of corner portions 55 and 56 of the housing 5 that accommodates the substrate 3 having the flexible portion 32 are pressed against the fulcrum support surface 400 along the flexible portion 32 to form a pair of fulcrum points P1 and P2, and the pair of fulcrum points P1. , By turning the casing 5 around the rotation axis X passing through P2, one of the rigid parts 31 together with the casing 5, here, the power system rigid part 33 is folded back by the flexible part 32. A folding step (step ST6) is included.

  Further, according to the electronic component unit 1 described above, the plurality of rigid portions 31 on which the electronic component 2 is mounted and the flexible that is more flexible than the rigid portion 31 and electrically connects the plurality of rigid portions 31. A substrate 3 having a portion 32 and a housing 5 to which the substrate 3 is assembled. The housing 5 is in a state where at least one of the plurality of rigid portions 31, in this case, the power system rigid portion 33 is assembled. It has a pair of corner | angular parts 55 and 56 located on both sides of the flexible part 32. FIG. In the housing 5, the pair of corner portions 55 and 56 are pressed against the fulcrum support surface 400 along the flexible portion 32 to form the pair of fulcrum points P1 and P2, and pass through the pair of fulcrum points P1 and P2. By rotating about the rotation axis X as a rotation center, one of the plurality of rigid portions 31, here, a power supply system rigid portion 33 is a jig that turns back at the flexible portion 32.

  Therefore, in the manufacturing method of the electronic component unit 1 and the electronic component unit 1, the pair of corner portions 55 and 56 of the housing 5 are set as the pair of fulcrums P1 and P2, and the rotation axis passes through the pair of fulcrums P1 and P2. By rotating the housing 5 around X as the rotation center, the power system rigid portion 33 is folded back by the flexible portion 32 together with the housing 5. Thereby, in the manufacturing method of this electronic component unit 1 and the electronic component unit 1, the flexible part 32 is folded using the housing 5 as a jig for folding the power system rigid part 33 by the flexible part 32. Therefore, the flexible part 32 can be accurately folded back while suppressing the flexible part 32 from being twisted. As a result, when manufacturing the electronic component unit 1 and the electronic component unit 1, the electronic component unit 1 configured by accommodating the substrate 3 bent by the flexible portion 32 in the housing 5 is manufactured. Workability can be improved.

  Furthermore, according to the manufacturing method of the electronic component unit 1 described above and the electronic component unit 1, the pair of fulcrums P <b> 1 and P <b> 2 by the pair of corner portions 55 and 56 are positioned with the flexible portion 32 interposed therebetween. Therefore, in the manufacturing method of the electronic component unit 1 and the electronic component unit 1, the distance between the pair of fulcrums P1 and P2 with respect to the direction along the rotation axis X is relatively long, and the pair of fulcrums P1 and P1, Since the casing 5 can be rotated with the flexible portion 32 sandwiched by P2 and the power system rigid portion 33 can be folded back by the flexible portion 32, the flexible portion 32 can be more reliably prevented from being twisted. Workability can be improved reliably.

  Furthermore, according to the method for manufacturing the electronic component unit 1 and the electronic component unit 1 described above, in the folding step (step ST6), a plurality of the substrates 3 and the housing 5 are arranged in the direction along the rotation axis X. The power supply system rigid portions 33 of the plurality of substrates 3 are folded together by the flexible portions 32 together with the plurality of housings 5 by rotating the plurality of housings 5 together around the rotation axis X. . Therefore, in the manufacturing method of the electronic component unit 1 and the electronic component unit 1, the rotation axis X passing through a plurality of pairs of fulcrums P1 and P2 aligned along the rotation axis X is set relatively long. With the rotation axis X as the rotation center, the plurality of housings 5 can be collectively rotated and the power supply system rigid portions 33 can be collectively folded at the respective flexible portions 32. The part 32 can be prevented from being twisted, and workability can be improved more reliably. In addition, in the manufacturing method of the electronic component unit 1 and the electronic component unit 1, the plurality of housings 5 can be collectively rotated, and the power system rigid portions 33 can be collectively folded at the flexible portions 32. For example, the work man-hour at the time of producing the electronic component unit 1 in large quantities can be reduced.

  Furthermore, according to the manufacturing method of the electronic component unit 1 and the electronic component unit 1 described above, the housing 5 is installed on one of the plurality of rigid portions 31 before the folding step (step ST6). Including an insertion / installation process (housing installation process, step ST2), the plurality of rigid portions 31 include a power supply system rigid portion 33 and a control system rigid portion 34, and the substrate 3 includes the power supply system rigid portion 33 and the control system. A plurality of pieces are integrated in the direction in which the rigid portions 34 are arranged to form a substrate assembly 300, and the housing 5 includes bracket portions 51k and 51l protruding from the outer surface, and an insertion / installation process (step ST2). Then, the housing 5 is positioned on one power supply system rigid portion 33 of the plurality of substrates 3 of the substrate assembly 300 and a bracket is mounted on the control system rigid portion 34 of another substrate 3 adjacent to the substrate 3. 51k, in a positional relationship where 51l is located, is placed a plurality of the housing 5 on the printed circuit board assembly 300. Therefore, in the method of manufacturing the electronic component unit 1 and the electronic component unit 1, a plurality of housings 5 are installed in a space-saving and space-efficient manner on the substrate assembly 300 constituted by the plurality of substrates 3. Therefore, work efficiency can be improved.

  Furthermore, according to the manufacturing method of the electronic component unit 1 and the electronic component unit 1 described above, one of the plurality of rigid portions 31, here the power system rigid portion, is provided before the folding step (step ST <b> 6). The terminal 4 inserted into the through hole 33b in a state where the terminal 4 provided in the housing 5 is inserted into the through hole 33b provided in the 33 and the housing 5 is installed on the power system rigid portion 33. Includes a soldering step (step ST3) in which the terminal 4 and the substrate 3 are electrically connected to each other, and the casing 5 is supplied with hot air for soldering toward the contact point between the through hole 33b and the terminal 4 It has a cutout 54 that is possible. Therefore, in the manufacturing method of the electronic component unit 1 and the electronic component unit 1, the terminal 4 inserted into the through hole 33 b is soldered in a state where the housing 5 is installed on the power system rigid portion 33. Even so, the hot air for soldering is applied to the contact point between the through hole 33b and the terminal 4 through the thinned portion 54 without the hot air for soldering being blocked by the wall surface of the housing 5 or the like. Can be soldered properly. Further, in each of the thinned portions 54, the opening on the side opposite to the contact point between the through hole 33b and the terminal 4 functions as an inflow opening for the hot air for soldering, and the edge of the inflow opening is tapered. . Accordingly, each of the thinned portions 54 can be configured such that the hot air for soldering easily flows into the contact point between the through hole 33b and the terminal 4, so that the hot air for soldering can be more efficiently passed. The contact between the hole 33b and the terminal 4 can be applied. In addition, the electronic component unit 1 manufactured by the manufacturing method of the electronic component unit 1 can also use the thinned portion 54 as a drain hole, and also uses the resin material constituting the housing 5. Therefore, the manufacturing cost can be reduced and the weight can be reduced.

  And according to the manufacturing method of the electronic component unit 1 demonstrated above, the process from an insertion and installation process (step ST2) to a 2nd cutting process (step ST7) is using several board | substrates 3 as shown in FIG. Since the operation is performed on the integrated substrate assembly 300, before the substrates 3 are cut into small pieces, the housing 5 is assembled in a so-called imposition state to form an assembly and each substrate is assembled. 3 can be folded back by the flexible portion 32. And in this manufacturing method of the electronic component unit 1, after assembling the housing | casing 5 in the state in which the some board | substrate 3 was surfaced and folding each board | substrate 3 in the flexible part 32, each board | substrate 3 was cut into small pieces and electronic The component unit 1 can be completed. As a result, in this method of manufacturing the electronic component unit 1, the process of dividing the plurality of integrated substrates 3 into small pieces can be performed as far as possible, and the work is performed with the plurality of substrates 3 being faced. Since as many processes as possible can be ensured, the number of work steps can be suppressed, and the production efficiency can be improved.

  And as for the electronic component unit 1 manufactured as mentioned above, and the wire harness WH to which this electronic component unit 1 is applied, while the some rigid part 31 is connected via the flexible part 32, the said flexible part Since the board | substrate 3 can be accommodated in the housing | casing 5 in the state which 32 bent, the whole unit can be made low-profile. In the electronic component unit 1 and the wire harness WH, the terminal 4 for connecting the connector 6 to the electric wire W and the substrate 3 is erected linearly from one of the plurality of rigid portions 31 and the terminal 4 is rigid. In order to accommodate the electronic component 2 mounted on the rigid portion 31 in the space between the terminal 4 and the substrate 3 in the housing 5 by being positioned close to the side of the flexible portion 32 in the portion 31. Therefore, it is possible to effectively use the electronic component 2 in the housing 5 to save space. As a result, the electronic component unit 1 and the wire harness WH can be reduced in size.

  Also, the electronic component unit 1 and the wire harness WH are such that each terminal 4 is erected in a straight line from one of the plurality of rigid portions 31. For example, the terminal 4 is bent in an L shape. In comparison, the terminals 4 can be shared as much as possible, and the number of required types of the shapes of the terminals 4 can be suppressed. Moreover, since the electronic component unit 1 and the wire harness WH can make each terminal 4 perpendicular | vertical with respect to the rigid part 31, compared with the case where the terminal 4 bends in an L shape, for example, full length Can be shortened, and cost reduction and weight reduction can be achieved. Thereby, the electronic component unit 1 and the wire harness WH can suppress manufacturing cost, for example.

  The electronic component unit manufacturing method and the electronic component unit according to the above-described embodiment of the present invention are not limited to the above-described embodiment, and various modifications can be made within the scope described in the claims. .

  In the above description, the electronic component unit 1 has been described as what is called power integration, but is not limited thereto.

  In the above description, the plurality of rigid portions 31 have been described as including the power supply system rigid portion 33 as the first mounting portion and the control system rigid portion 34 as the second mounting portion. Not limited to this, it may be configured to include three or more. In the above description, the board 3 is provided with the terminal 4 for inputting / outputting electric power and the heat generating component 21 that easily generates heat in the power supply system rigid portion 33, while the heat-fragile component 22 having low durability against heat is controlled by the control system rigid Although it has been described that the region where the main heat generation source is provided and the region where the heat-sensitive component is provided are divided and divided (zoning) on the substrate 3 by being provided in the portion 34, the present invention is not limited thereto.

  In the above description, the substrate 3 has a cross-sectional view along the short side direction (see FIG. 6) because the flexible portion 32 is bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially vertical. However, the present invention is not limited to this. The substrate 3 only needs to be accommodated in the housing 5 with at least the flexible portion 32 bent to the terminal 4 side, and the angle formed by the power system rigid portion 33 and the control system rigid portion 34 may be an obtuse angle or an acute angle. Good.

  In the above description, the lock release portions 61a, 62a, and 63a for releasing the fitting between the connector 6 and the connector fitting portions 51h, 51i, and 51j are described as being located on the housing space portion 53 side. For example, it may face the outside of the housing 5.

  In the above description, the housing 5 has been described as having the thinned portion 54, but the present invention is not limited thereto, and a configuration without the thinned portion 54 may be used. Moreover, although the housing | casing 5 demonstrated as what has the connector block 51 as a main-body part, and the cover 52 as a cover member, if the board | substrate 3 is assembled | attached as mentioned above, it will not restrict to this.

  Moreover, in the manufacturing method of the electronic component unit 1 described above, the steps from the insertion / installation step (step ST2) to the second cutting step (step ST7) are performed on the substrate assembly 300 in which a plurality of substrates 3 are integrated. However, the present invention is not limited to this. In the substrate assembly 300, a plurality of substrates 3 may be arranged only in the L1 direction, or may be arranged only in the L2 direction. Further, in the insertion / installation step (step ST <b> 2) described above, the housing 5 is positioned on one power system rigid portion 33 of the plurality of substrates 3 of the substrate assembly 300 and is adjacent to the substrate 3. Although it has been described that the plurality of housings 5 are installed on the substrate assembly 300 in the positional relationship where the bracket portions 51k and 51l are positioned on the control system rigid portion 34 of the other substrate 3, the present invention is not limited to this.

DESCRIPTION OF SYMBOLS 1 Electronic component unit 2 Electronic component 3 Board | substrate 4, 41, 42, 43 Terminal 5 Case 31 Rigid part (mounting part)
32 Flexible part (bent part)
33 Power system rigid part (first mounting part)
33b Through-hole 34 Control system rigid part (second mounting part)
51 Connector block 51k, 51l Bracket part 52 Cover 53 Housing space part 54 Thickening part 55, 56 Corner part 100 Electrical connection box 300 Substrate assembly 400 Support point P1, P2 Support point WH Wire harness X Rotating axis

Claims (6)

A plurality of mounting portions on which electronic components are mounted, and a pair of corner portions of a housing to which a substrate having a bent portion that is more flexible than the mounting portion and electrically connects the plurality of mounting portions is assembled. A plurality of mounting parts together with the casing by rotating the casing around a rotation axis passing through the pair of supporting points as a pair of supporting points by pressing against the supporting point supporting surface along the bent portion Including a folding step of folding one of the bent portions at the bent portion,
Electronic component unit manufacturing method. The pair of fulcrums by the pair of corners are located across the bent portion,
The electronic component unit manufacturing method according to claim 1. In the folding step, a plurality of the substrates and the casings are arranged in a direction along the rotation axis, and the plurality of casings are rotated together around the rotation axis as a rotation center. Folding together one of the plurality of mounting portions of the plurality of substrates together with the housing at each of the bent portions,
The electronic component unit manufacturing method according to claim 1 or 2. Including a housing installation step of installing the housing on one of the plurality of mounting portions before the folding step;
The plurality of mounting parts include a first mounting part and a second mounting part,
A plurality of the substrates are integrated in the direction in which the first mounting portion and the second mounting portion are aligned to form a substrate assembly,
The housing has a bracket portion protruding from the outer surface,
In the housing installation step, the housing is positioned on one of the first mounting portions of the plurality of substrates of the substrate assembly, and the second mounting portion of the other substrate adjacent to the substrate. A plurality of the casings are installed on the substrate assembly in a positional relationship where the bracket portion is positioned on the board assembly.
The electronic component unit manufacturing method according to any one of claims 1 to 3. Before the folding step, a terminal provided in the housing is inserted into a through hole provided in one of the plurality of mounting portions, and the housing is installed on one of the plurality of mounting portions. And soldering the terminal inserted into the through hole to electrically connect the terminal and the substrate,
The housing has a lightening portion through which hot air for soldering can flow toward the contact point between the through hole and the terminal.
The electronic component unit manufacturing method according to any one of claims 1 to 4. A plurality of mounting portions on which electronic components are mounted, and a substrate having a bent portion that is more flexible than the mounting portion and electrically connects the plurality of mounting portions;
A housing to which the substrate is assembled,
Wherein the housing, while one of at least the plurality of mounting portions assembled, have a pair of corner portions located across the bent portion, the pair of corners, along the bent portion fulcrum A jig configured to be pressed against the support surface to form a pair of fulcrums and to turn one of the plurality of mounting portions at the bent portion by being rotated about a rotation axis passing through the pair of fulcrums. and said to be a,
Electronic component unit.

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