JP6553965B2 - Electronic component unit substrate and electronic component unit - Google Patents

Description

  The present invention relates to an electronic component unit substrate and an electronic component unit.

  As an electronic component unit provided in a conventional wire harness mounted on a vehicle or the like, for example, in Patent Document 1, a bottom portion on which a connector pin is erected and a connector pin are surrounded along the outer periphery of the bottom portion. An electronic control device is disclosed that includes a connector housing having a side wall portion that forms a connector insertion region into which a connector to be connected is inserted. In this electronic control device, the connector housing also serves as a case for housing the circuit board, and the circuit board is housed in accordance with the space inside the connector housing by being bent at a flexible portion. At the same time, the rear end side of the connector pin protruding from the bottom of the connector housing is electrically connected to the circuit board.

JP-A-2005-191130

  By the way, the electronic control device described in Patent Document 1 described above has a configuration in which terminals can be appropriately soldered even when, for example, the interval between a plurality of through holes formed in a substrate is relatively narrow. It is desired.

  This invention is made in view of said situation, Comprising: It aims at providing the board | substrate for electronic component units which can solder a terminal appropriately, and an electronic component unit.

In order to achieve the above object, the substrate for an electronic component unit according to the present invention has a plate-like mounting portion on which an electronic component is mounted, and the mounting portion penetrating in the plate thickness direction, and the opening shape is formed in a regular circle. And a plurality of through holes into which terminals are inserted and soldered, and the plurality of through holes are coated with solder paste through openings respectively formed in the metal mask in accordance with the respective through holes. A terminal is soldered, the terminal is formed to have a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole, the width of each side of the square is 0.64 mm, and the opening is an opening The shape is a rectangle, the length of the short side is 1.80 mm, the length of the long side is 3.00 mm, the thickness in the thickness direction is 150 μm, and adjacent to the direction along the short side Do Opening distance between, and the spacing between the opening adjacent in the direction along the long sides is 0.40 mm, the plurality of through holes, a direction perpendicular to at least the thickness direction and the Three of the through holes at the center of the direction are provided at the center of the direction with respect to the opening, and the through holes on one side of the direction are provided. The through hole located on the other side in the direction with respect to the opening is located on the other side in the direction with respect to the opening, and each inner diameter is 1. The distance between centers of the through holes adjacent to each other in the direction along the short side of the opening is 2.20 mm, and the distance between the through holes adjacent to each other in the direction along the long side of the opening is Center distance is 3.00 The distance between the through hole and the short side of the opening is 0.50 mm or more, and the mounting portion has a plate thickness of 1.0 mm or more and 1.2 mm or less.

In order to achieve the above object, an electronic component unit substrate according to the present invention includes a plate-shaped mounting portion on which an electronic component is mounted, and an opening shape that penetrates the mounting portion in the plate thickness direction and has a round shape. And a plurality of through holes into which terminals are inserted and soldered, and the plurality of through holes are coated with solder paste through openings respectively formed in the metal mask in accordance with the respective through holes. The terminal is soldered, the terminal is formed to have a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole, the width of each side of the square is 0.50 mm, and the opening is an opening The shape is a rectangle, the length of the short side is 1.40 mm, the length of the long side is 2.80 mm, and the thickness in the thickness direction is 150 μm, adjacent to the direction along the short side Do Opening distance between, and the spacing between the opening adjacent in the direction along the long sides is 0.40 mm, the plurality of through holes, a direction perpendicular to at least the thickness direction and the Three through holes are provided side by side in the direction along the long side of the opening, and the through hole at the center of the direction is located at the center of the direction with respect to the opening, and the through hole on one side of the direction is The through hole located on the other side in the direction with respect to the opening is located on the other side in the direction with respect to the opening, and each inner diameter is 1. The distance between the centers of the through holes adjacent to each other in the direction along the short side of the opening is 1.80 mm, and the distance between the through holes adjacent to each other in the direction along the long side of the opening is 0 mm. Center distance is 2.80 The distance between the through hole and the short side of the opening is 0.50 mm or more, and the mounting portion has a plate thickness of 1.0 mm or more and 1.2 mm or less.

  In the electronic component unit substrate, the plurality of through holes may be arranged in a rectangular lattice shape.

In order to achieve the above object, an electronic component unit according to the present invention includes a plate-like mounting portion on which an electronic component is mounted, and an opening shape that penetrates the mounting portion in the plate thickness direction and has a round shape. And a housing having a plurality of through holes to which terminals are inserted and soldered, and a housing for housing the substrate, wherein the plurality of through holes are respectively formed in a metal mask in alignment with the respective through holes. The solder paste is applied through the opening and the terminal is soldered, and the terminal is formed to have a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole, and the width of each side of the square is 0 The opening has a rectangular opening shape, the short side length is 1.80 mm, the long side length is 3.00 mm, and the thickness in the plate thickness direction is 150 μm. , And the the opening distance between the adjacent in the direction along the short side, and the spacing between the opening adjacent in the direction along the long sides is 0.40 mm, the plurality of through holes, There are provided at least three in a direction orthogonal to the plate thickness direction and along the long side of the opening, and the through hole at the center of the direction is located at the center of the direction with respect to the opening The through hole on one side in the direction is located closer to the other side in the direction with respect to the opening, and the through hole on the other side in the direction is on the one side in the direction with respect to the opening. positioned closer to a respective inner diameter 1.2 mm, the distance between centers of the through holes is 2.20 mm, long side of the opening adjacent in the direction along the short side of the opening Adjacent to each other in the direction along The center-to-center distance between the through holes is 3.00 mm, the distance between the through hole and the short side of the opening is 0.50 mm or more, and the mounting portion has a plate thickness of 1.0 mm to 1.2 mm. It is characterized by being.

In order to achieve the above object, an electronic component unit according to the present invention includes a plate-like mounting portion on which an electronic component is mounted, and an opening shape that penetrates the mounting portion in the plate thickness direction and has a round shape. And a housing having a plurality of through holes to which terminals are inserted and soldered, and a housing for housing the substrate, wherein the plurality of through holes are respectively formed in a metal mask in alignment with the respective through holes. The solder paste is applied through the opening and the terminal is soldered, and the terminal is formed to have a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole, and the width of each side of the square is 0 The opening has a rectangular opening shape, a short side length of 1.40 mm, a long side length of 2.80 mm, and a thickness in the thickness direction of 150 μm. , And the the opening distance between the adjacent in the direction along the short side, and the spacing between the opening adjacent in the direction along the long sides is 0.40 mm, the plurality of through holes, There are provided at least three in a direction orthogonal to the plate thickness direction and along the long side of the opening, and the through hole at the center of the direction is located at the center of the direction with respect to the opening The through hole on one side in the direction is located closer to the other side in the direction with respect to the opening, and the through hole on the other side in the direction is on the one side in the direction with respect to the opening. positioned closer to a respective inner diameter 1.0 mm, the distance between centers of the through holes is 1.80 mm, long side of the opening adjacent in the direction along the short side of the opening Adjacent to each other in the direction along The center-to-center distance between the through holes is 2.80 mm, the distance between the through hole and the short side of the opening is 0.50 mm or more, and the mounting portion has a plate thickness of 1.0 mm to 1.2 mm. It is characterized by being.

  In the electronic component unit substrate and the electronic component unit according to the present invention, the dimensional relationship of each part is made to be the dimensional relationship as described above, thereby securing the necessary amount of solder paste without overlapping the openings of the metal mask. Therefore, even if the interval between the plurality of through holes is the above-mentioned size, there is an effect that the terminal can be properly soldered.

FIG. 1 is a perspective view showing a schematic configuration of an electronic component unit according to the embodiment. FIG. 2 is an exploded perspective view showing a schematic configuration of the electronic component unit according to the embodiment. FIG. 3 is an exploded perspective view showing a schematic configuration of the electronic component unit according to the embodiment. FIG. 4 is an exploded perspective view showing a schematic configuration of the electronic component unit according to the embodiment. FIG. 5 is an exploded perspective view illustrating a state where the cover of the electronic component unit according to the embodiment is removed. 6 is a cross-sectional view taken along line AA shown in FIG. FIG. 7 is a schematic cross-sectional view showing a schematic configuration of a substrate according to the embodiment. FIG. 8 is a schematic plan view for explaining a metal mask applied to the substrate according to the embodiment.

  Hereinafter, embodiments according to the present invention will be described in detail based on the drawings. The present invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by persons skilled in the art or those that are substantially the same.

[Embodiment]
FIG. 1 is a perspective view illustrating a schematic configuration of an electronic component unit according to the embodiment. FIG.2, FIG.3, FIG.4 is a disassembled perspective view showing schematic structure of the electronic component unit which concerns on embodiment. FIG. 5 is an exploded perspective view showing a state in which the cover of the electronic component unit according to the embodiment is removed. 6 is a cross-sectional view taken along the line A-A shown in FIG. 1 (a cross-sectional view along the short side direction). FIG. 7 is a schematic cross-sectional view illustrating a schematic configuration of the substrate according to the embodiment. FIG. 8 is a schematic plan view illustrating the metal mask applied to the substrate according to the embodiment. In addition, in order to make it easy to understand, FIG.1, FIG.2, FIG.3 shows the electric wire with the dashed-two dotted line, and, in FIG.4, FIG.5, FIG.6, illustration of the electric wire is abbreviate | omitted. In addition, a power input connector, a power output connector, and a control signal connector, which will be described later, omit illustration of some elements such as a terminal insertion hole for simplification.

  1, 2, 3, 4, 5, 6, and 7, an electronic component unit 1 according to the present embodiment is mounted on a vehicle such as an automobile (see FIG. 1). It constitutes an electronic component module that is detachably assembled with respect to. Here, the electric connection box 100 is mounted in a vehicle such as an automobile and incorporated in the wire harness WH, and constitutes a connector, a fuse, a relay, a capacitor, a branch portion, an electronic control unit, etc. The electrical components are collected and accommodated inside. The wire harness WH is, for example, a bundle of a plurality of electric wires W used for power supply and signal communication for connection between devices mounted in a vehicle, and is made into a collective part, and the plurality of electric wires W are Are connected to each device. The wire harness WH includes a plurality of electric wires W and an electric junction box 100 including the electronic component unit 1 electrically connected to the electric wires W. The electric wire W includes, for example, a conductor portion (core wire) formed by twisting a plurality of conductive metal wires, and an insulating covering portion covering the outside of the conductor portion. The wire harness WH bundles and collects a plurality of electric wires W, and the electric connection box 100 is electrically connected to an end of the bundled electric wires W via a connector 6 or the like as a connection portion. In addition to this, the wire harness WH may further include a grommet, a protector, a fixture, and the like. The electric connection box 100 is installed, for example, in an engine compartment (engine room) or a vehicle cabin of a vehicle, and is connected between a power supply such as a battery and various electronic devices mounted in the vehicle and supplied from the power supply Distributes power to various electronic devices in the vehicle. The electrical junction box 100 may be called a junction box, a fuse box, a relay box, or the like. In the present embodiment, these are collectively called an electrical junction box. The electronic component unit 1 of the present embodiment incorporated in the inside of the electrical connection box 100 is connected between a power supply such as a battery mounted on a vehicle and various electronic devices mounted on the vehicle, It constitutes so-called power integration that distributes power to devices.

  Hereinafter, each structure of the electronic component unit 1 is demonstrated concretely. Each direction used in the following description will be described as a direction in which the wire harness WH is mounted on the vehicle unless otherwise specified. Here, in order to make the following description easy to understand, the first direction among the first direction, the second direction, and the third direction crossing each other for convenience is referred to as the “height direction”, and The direction is called "short side direction", and the third direction is called "long side direction". The height direction as the first direction, the short side direction as the second direction, and the long side direction as the third direction are orthogonal to each other.

  The electronic component unit 1 of the present embodiment includes an electronic component 2, a substrate 3 as an electronic component unit substrate, a terminal 4, and a housing 5.

  The electronic component 2 is mounted on the substrate 3 and is an element that exhibits various functions here. The electronic component 2 is, for example, a capacitor, a relay, a resistor, a transistor, an IPS (Intelligent Power Switch), an electronic control unit including a microcomputer, or the like. Here, the electronic component 2 includes, for example, a heat-generating component 21 that generates heat with power consumption and a heat-fragile component 22 that has lower heat resistance than the heat-generating component 21. The heat-generating component 21 is typically an electronic component 2 that is more susceptible to heat generation than the heat-sensitive component 22 and more resistant to heat than the heat-sensitive component 22. For example, power distribution such as relays, transistors, and IPS related to power distribution This is an electronic component 2 of the system. The heat-vulnerable component 22 is typically an electronic component 2 which is less likely to generate heat than the heat-generating component 21 and less resistant to heat than the heat-generating component 21 and is, for example, an electronic component 2 of a control system such as a microcomputer involved in control. . In the following description, the heat-generating component 21 and the heat-fragile component 22 are simply referred to as the electronic component 2 when it is not necessary to distinguish between them.

  The substrate 3 constitutes an electronic circuit on which various electronic components 2 are mounted and which electrically connects them, and here is a so-called rigid flexible printed circuit board. In the substrate 3, for example, a wiring pattern (print pattern) 3b is printed with a conductive material such as copper on an insulating layer 3a made of an insulating material such as epoxy resin, glass epoxy resin, paper epoxy resin or ceramic. . The substrate 3 may be a multi-layered substrate (that is, a multilayer substrate) in which a plurality of insulating layers 3a printed with a wiring pattern 3b are stacked.

  The substrate 3 of the present embodiment includes a plurality of rigid portions 31 as a plurality of mounting portions on which the electronic component 2 is mounted, and a bending that is more flexible than the rigid portion 31 and electrically connects the plurality of rigid portions 31. It has a flexible part 32 as a part, and a plurality of rigid parts 31 and a flexible part 32 are integrated. Each rigid portion 31 has rigidity high enough to be less easily bent than the flexible portion 32. In each rigid portion 31, the lead wires and terminals 4 of the electronic component 2 are electrically connected to the wiring pattern 3b by soldering or the like. On the other hand, the flexible portion 32 has high flexibility so as to be more easily bent than the rigid portion 31. The flexible part 32 is provided between the adjacent rigid parts 31 among the plurality of rigid parts 31, and electrically connects them to each other. The flexible part 32 electrically connects the plurality of rigid parts 31 via the wiring pattern 3b made of a conductive material such as copper. The substrate 3 has, for example, different materials of the insulating layer 3 a between the rigid portion 31 and the flexible portion 32, reduces the number of laminated insulating layers 3 a in a portion corresponding to the flexible portion 32, or corresponds to the flexible portion 32. The flexible part 32 having flexibility from the rigid part 31 can be formed by cutting a part of the insulating layer 3a to reduce the thickness. While the substrate 3 of the present embodiment illustrated in FIG. 7 has a plurality of layers of the insulating layer 3a and the wiring pattern 3b of the rigid portion 31, the insulating layer 3a of the portion corresponding to the flexible portion 32; The flexible portion 32 is formed by forming the wiring pattern 3 b in one layer.

  More specifically, the plurality of rigid portions 31 of the present embodiment are configured to include two of a power supply system rigid portion 33 as a first mounting portion and a control system rigid portion 34 as a second mounting portion. Both the power system rigid part 33 and the control system rigid part 34 are formed in a rectangular plate shape. The power supply system rigid portion 33 and the control system rigid portion 34 are formed in substantially the same shape and size. Here, both of the power supply system rigid unit 33 and the control system rigid unit 34 constitute mounting surfaces 33a and 34a for mounting the electronic component 2 on the main surfaces on both the front and back sides, but the present invention is not limited thereto. The power supply system rigid portion 33 is mounted on each mounting surface 33a with a heat generating component 21 that is mainly a power distribution system electronic component 2 such as a relay, transistor, or IPS. On the other hand, in the control system rigid unit 34, the heat-vulnerable component 22, which is an electronic component 2 of a control system such as a microcomputer, is mounted on each mounting surface 34a. The heat-generating component 21 and the heat-weakened component 22 are respectively fixed to the mounting surfaces 33a and 34a by soldering or the like, and are electrically connected to the wiring patterns 3b of the mounting surfaces 33a and 34a. In the following description, the power supply system rigid unit 33 and the control system rigid unit 34 are simply referred to as the rigid unit 31 when it is not necessary to distinguish them.

  And the flexible part 32 of this embodiment electrically connects the power supply system rigid part 33 and the control system rigid part 34 as several rigid parts 31. FIG. In the positional relationship in which the long side of the power supply system rigid part 33 and the control system rigid part 34 are opposite to each other, the substrate 3 of the present embodiment is positioned side by side in a direction perpendicular to the long side. The flexible part 32 is interposed between the power system rigid part 33 and the control system rigid part 34 in the direction orthogonal to the long side. That is, the flexible part 32 connects one long side of the power supply system rigid part 33 and one long side of the control system rigid part 34 along a direction orthogonal to the long side. The flexible portion 32 extends along the long side direction, and is formed to be slightly shorter than the long sides of the power system rigid portion 33 and the control system rigid portion 34 here. The flexible portion 32 is flexible as described above, and can be bent in the direction in which the power supply system rigid portion 33 and the control system rigid portion 34 are folded around the bending axis along the long side direction. It is. As described later, the substrate 3 is in a state in which the flexible portion 32 is bent, more specifically, in a state in which the flexible portion 32 is bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially perpendicular. Housed in the housing 5.

  The terminal 4 is erected in a straight line from one of the plurality of rigid portions 31 and electrically connects the connector 6, which is a connection portion with the electric wire W, and the substrate 3. A plurality of terminals 4 are provided. Each terminal 4 is made of a conductive metal material. Although each terminal 4 includes those whose external dimensions are different or whose ends are bifurcated or trifurcated, they are basically formed in a straight rod shape. Here, the plurality of terminals 4 are terminals 41 electrically connected to the power input connector 61 as the connector 6 described later, terminals 42 electrically connected to the power output connector 62 as the connector 6, and the connector 6 includes a terminal 43 electrically connected to the control signal connector 63. One terminal 41 is provided with its end divided into three parts. Two terminals 42 having two end portions are provided side by side in the long side direction. Nineteen terminals 43 whose ends are not separated are provided side by side in the long side direction and the short side direction. The number of terminals 41, 42, 43 is not limited to the above. In the following description, the terminals 41, 42, and 43 are simply referred to as terminals 4 when it is not necessary to distinguish between them.

  Each of the terminals 4 in the present embodiment is set up only at the power supply system rigid portion 33 among the plurality of rigid portions 31. Each terminal 4 is erected in a straight line substantially perpendicular to one mounting surface 33 a of the power supply system rigid portion 33. That is, each terminal 4 protrudes and extends from the mounting surface 33a along the short side direction and the height direction orthogonal to the long side direction in a state where the substrate 3 is accommodated in a case 5 described later. Each terminal 4 is inserted into the through hole 33b (see FIG. 2, FIG. 3, FIG. 4, etc.) provided in the portion where the wiring pattern 3b is formed in the mounting surface 33a, and the end is inserted from one side of the mounting surface 33a. Then, it is fixed to the mounting surface 33a by soldering or the like, and is electrically connected to the wiring pattern 3b of the mounting surface 33a. Further, in the state in which the substrate 3 is accommodated in the housing 5 described later, the other end of each terminal 4 is exposed in the connector engaging portions 51 h, 51 i, 51 j described later, and the connector engaging portions 51 h, 51 i , 51j are electrically connected to the connector 6 fitted.

  The housing 5 accommodates the substrate 3. Here, the housing 5 accommodates the substrate 3 in a state where the flexible portion 32 is bent toward the terminal 4 side. The housing 5 of the present embodiment includes a connector block 51 as a main body portion on which a connector 6 constituting a connection portion with the substrate 3, the terminal 4 and the electric wire W is assembled, and the substrate 3 and the terminal 4 assembled with the connector block 51. And a cover 52 as a lid member for covering the like. Both the connector block 51 and the cover 52 are formed of an insulating synthetic resin. In the housing 5, the substrate 3 is assembled in an interior defined by the connector block 51 and the cover 52, and the substrate 3 is accommodated.

  The connector block 51 has a bottom 51a, side walls 51b and 51c, support columns 51d, 51e, 51f and 51g, connector fitting portions 51h and 51i as connector fitting portions, and bracket portions 51k and 51l. These are integrally formed.

  The bottom 51a is a bottom body formed in a rectangular plate shape in which the side along the short side direction is the short side and the side along the long side direction is the long side. The bottom portion 51 a is formed in a rectangular plate shape that is slightly larger than the power system rigid portion 33. The bottom 51a is formed with a lightening hole or the like.

  The side wall portions 51b and 51c are wall bodies that are erected vertically along the height direction from the short side of the bottom portion 51a. The side wall parts 51b and 51c are formed in a rectangular plate shape, and extend from one end part in the short side direction of the short side of the bottom part 51a to the other end part. The side wall 51 b and the side wall 51 c face each other along the long side direction.

  The column portions 51d, 51e, 51f, and 51g are columnar bodies that are erected vertically from the four corners of the bottom portion 51a one by one along the height direction. The column portions 51d, 51e, 51f, and 51g are formed so as to protrude along the height direction, although the shapes are slightly different from each other. Here, the column part 51d and the column part 51e are formed so as to protrude along the height direction from both ends in the short side direction of the side wall part 51b. The support portion 51 d and the support portion 51 e oppose each other along the short side direction. The support column part 51f and the support column part 51g are formed so as to protrude along the height direction from both ends in the short side direction of the side wall part 51c. The support 51f and the support 51g face each other along the short side direction. Further, the support column 51d and the support column 51f are formed on the same long side on the same side of the bottom 51a, and are opposed along the long side direction. The support column 51e and the support column 51g are formed on the long side of the bottom 51a opposite to the support columns 51d and 51f, and are opposed along the long side direction.

  The connector fitting portions 51h, 51i, 51j are portions into which the connector 6 that is a connection portion with the electric wire W is fitted. Here, the connector 6 includes a power input connector 61 for inputting power via the electric wire W, a power output connector 62 for outputting power via the electric wire W, and a control signal via the electric wire W. And a control signal connector 63 for transmitting and receiving the signal. The connector fitting portion 51h is for fitting the power input connector 61, the connector fitting portion 51i is for fitting the power output connector 62, and the connector fitting portion 51j is for control signals. The connector 63 is fitted. Here, the power input connector 61, the power output connector 62, and the control signal connector 63 use, for example, so-called vertical connectors.

  The connector fitting portions 51h, 51i, 51j are arranged along the height direction with the power supply system rigid portion 33 in which the terminal 4 is erected among the plurality of rigid portions 31 in a state where the substrate 3 is accommodated in the housing 5. It is formed at an opposing position. More specifically, the connector fitting portion 51 h is located at a position facing the area where the terminal 41 is erected in the power system rigid portion 33 in the height direction with the substrate 3 being accommodated in the housing 5. It is formed. The connector fitting portion 51 i is formed at a position facing the region where the terminal 42 is erected in the power system rigid portion 33 in the state where the substrate 3 is accommodated in the housing 5 along the height direction. The connector fitting portion 51 j is formed at a position facing the region where the terminal 43 is provided in the power system rigid portion 33 in the height direction in a state where the substrate 3 is accommodated in the housing 5. Here, the connector fitting parts 51h, 51i, 51j are formed on the protruding part wall-like part 51m formed on the bottom part 51a. The protruding portion wall-shaped portion 51m is a wall body that protrudes from the bottom portion 51a along the height direction on the same side as the protruding side of the side wall portions 51b and 51c and the column portions 51d, 51e, 51f, and 51g. The protruding portion wall-shaped portion 51m is formed in a substantially rectangular parallelepiped hollow shape, and extends along the long side direction at the edge of the long side of the bottom portion 51a on the side of the column portions 51e and 51g. The connector fitting portions 51h, 51i, 51j are formed as concave portions in a hollow portion on the opposite side to the protruding side of the protruding portion wall-shaped portion 51m. The connector fitting portion 51 h is formed as a recess having a shape and a size in which the power input connector 61 can be fitted. The connector fitting portion 51i is formed as a recess having a shape and a size in which the power output connector 62 can be fitted. The connector fitting portion 51j is formed as a recess having a shape and a size in which the control signal connector 63 can be fitted. In addition, the protrusion wall portion 51m is inserted into a tip end surface in the height direction, that is, a surface facing the power supply system rigid portion 33 along the height direction in a state where the substrate 3 is accommodated in the housing 5. A hole (also referred to as a cavity) 51ma (see FIG. 6) is formed. In the state where the substrate 3 is housed in the housing 5, one end of each terminal 4 passes through the terminal insertion hole 51ma and is exposed in the connector fitting portions 51h, 51i, 51j. Here, the terminal 41 is exposed in the connector fitting portion 51h through the terminal insertion hole 51ma of the protruding portion wall-shaped portion 51m. The terminal 42 is exposed in the connector fitting portion 51i through the terminal insertion hole 51ma of the protrusion wall portion 51m. The terminal 43 is exposed in the connector fitting portion 51j via the terminal insertion hole 51ma of the protrusion wall portion 51m. The power input connector 61 is electrically connected to the terminal 41 exposed in the connector fitting portion 51h by fitting in the connector fitting portion 51h. The power output connector 62 is electrically connected to the terminal 42 exposed in the connector fitting portion 51i by fitting in the connector fitting portion 51i. The control signal connector 63 is electrically connected to the terminal 43 exposed in the connector fitting portion 51j by fitting in the connector fitting portion 51j. In the following description, the power input connector 61, the power output connector 62, and the control signal connector 63 are simply referred to as the connector 6 when it is not necessary to distinguish them.

  The bracket portions 51k, 51l are for fixing the housing 5 to the vehicle body or the like of the vehicle. The bracket portions 51k, 51l protrude outward in a plate shape from the long side of the bottom portion 51a on the side of the support portions 51e, 51g, that is, the long side on which the protrusion wall portion 51m is provided As well as being formed, fastening holes 51n and 51o are formed. Here, the bracket part 51k is formed at the end on the column part 51e side, and the bracket part 51l is formed on the end on the column part 51g side. The fastening holes 51n and 51o penetrate in the height direction. In the housing 5, the bracket members 51k and 51l are fixed to the fixing portion on the vehicle body side by inserting a fastening member such as a bolt into the fastening holes 51n and 51o and fastening them to the fixing portion on the vehicle body side.

  In the connector block 51 configured as described above, one end portion of each terminal 4 is inserted and held in a terminal insertion hole 51ma (see FIG. 6) formed in the distal end surface of the protruding wall-like portion 51m, and a connector fitting portion. The other end of each terminal 4 is inserted into the through hole 33b (see FIG. 2, FIG. 3, FIG. 4, etc.) of the power supply system rigid portion 33 and soldered in the state of being exposed in 51h, 51i, 51j. In this state, in the substrate 3, the power supply system rigid part 33 opposes the protrusion wall portion 51m along the height direction, and the long side of the power supply rigid part 33 is along the long side direction and the short side is the short side direction. , And the power supply system rigid portion 33 is assembled to the connector block 51 in such a positional relationship that the flexible portion 32 is along the long side of the column portions 51d and 51f. In this case, in the substrate 3, the positioning protrusion 51 q formed at the tip of the support column 51 e is inserted into the positioning hole 51 p formed at one corner opposite to the flexible portion 32 of the power supply system rigid unit 33. Is positioned. Then, in the substrate 3, the screws 71 and 72 are inserted into screw holes 51 r and 51 s formed at both corners of the flexible portion 32 of the power supply system rigid portion 33, and the screws 71 and 72 are the tips of the support portions 51 d and 51 f Are fixed to the column portions 51d, 51e, 51f, 51g. The flexible portion 32 of the substrate 3 is bent toward the terminal 4, that is, the control system rigid portion 34 is bent toward the support portions 51 d and 51 f with respect to the power supply system rigid portion 33. The flexible section 32 is bent so that the power supply system rigid section 33 and the control system rigid section 34 are substantially vertical, and the long side of the control system rigid section 34 is along the long side and the short side is in the height direction. The control system rigid portion 34 is assembled to the connector block 51 in such a positional relationship as follows. That is, the board | substrate 3 is comprised by the substantially L shape as a whole in the cross sectional view (refer FIG. 6) along a short side direction because the flexible part 32 bends. In this case, in the substrate 3, the screws 73 and 74 are inserted into screw holes 51 v and 51 w formed at both corners of the control system rigid portion 34 opposite to the flexible portion 32 side, and the screws 73 and 74 are pillars By being fastened to fastening holes 51x and 51y formed in the base end portions of 51d and 51f (in other words, the base end portions on the side surfaces of the side wall portions 51b and 51c), they are fixed to the sides of the support portions 51d and 51f Ru. In this way, the board 3 is assembled to the connector block 51 with the flexible portion 32 bent so that the power system rigid portion 33 and the control system rigid portion 34 are substantially vertical. In this state, in the substrate 3, the power system rigid portion 33 is along the direction orthogonal to the height direction, and the control system rigid portion 34 is along the direction orthogonal to the short side direction, and the power system rigid portion 33 is a protrusion wall. There is a positional relationship in which the control system rigid portion 34 is positioned on the outer side in the short side direction of the support portions 51 d and 51 f so as to face the shape portion 51 m along the height direction.

  The cover 52 covers the substrate 3 and the like assembled to the connector block 51 from the side opposite to the connector block 51. The cover 52 is configured to include a rectangular frame-shaped portion 52a as a wall formed substantially in a U-shape, and a ceiling portion 52b closing one opening of the rectangular frame-shaped portion 52a. The ceiling part 52b is a ceiling body formed in a rectangular plate shape in which a side along the short side direction is a short side and a side along the long side direction is a long side. The ceiling part 52b is formed in a rectangular plate shape that is slightly larger than the bottom part 51a. The rectangular frame-like portion 52a is formed to stand upright on the edge of the ceiling 52b. The rectangular frame-like portion 52a includes a pair of long side wall surfaces 52c and 52d along the long side direction of the ceiling portion 52b and a pair of short side wall surfaces 52e and 52f along the short side direction of the ceiling portion 52b. Formed with. The cover 52 is formed in a rectangular cylindrical shape in which one end is opened by the rectangular frame-shaped portion 52a and the ceiling portion 52b and the other end is closed. The cover 52 is attached to the connector block 51 in such a positional relationship as to cover the substrate 3 or the like assembled to the connector block 51 from the side opposite to the connector block 51. When the cover 52 is mounted on the connector block 51, the long side wall surfaces 52c and 52d and the short side wall surfaces 52e and 52f that constitute the rectangular frame 52a are the side wall portions 51b and 51c of the connector block 51 and the support portions. 51d, 51e, 51f, 51g, located outside the control system rigid part 34. The cover 52 is locked to the connector block 51 via various locking mechanisms in a state of being mounted to the connector block 51. Here, in the cover 52, engagement between the locking recesses 52g provided on the short side wall surfaces 52e and 52f on the cover 52 side and the claws 51z provided on the side walls 51b and 51c on the connector block 51 side Thus, the connector block 51 is engaged, and the connector block 51 is detachably assembled.

  The housing 5 is configured as described above, and accommodates the substrate 3 in a state where the flexible portion 32 is bent toward the terminal 4 side. More specifically, the housing 5 is an interior partitioned by the connector block 51 and the cover 52 in a state where the plurality of rigid portions 31 are arranged along different wall surfaces that respectively form the internal space portion of the housing 5. The board | substrate 3 is accommodated in the space part side (refer FIG. 6 etc.). Here, in the case 5, the power system rigid portion 33 of the plurality of rigid portions 31 is disposed along the ceiling 52 b of the cover 52, and the control system rigid portion 34 of the plurality of rigid portions 31 is the length of the cover 52. The board | substrate 3 is accommodated in the internal space part side in the state arrange | positioned along the side wall surface 52c. Power supply system rigid portion 33 faces ceiling portion 52b along the height direction, and control system rigid portion 34 extends along the short side direction, with substrate 3 housed in housing 5 52c.

  And each terminal 4 of this embodiment is provided in one of a plurality of rigid parts 31, here, the power supply system rigid part 33 by being located in the outer side, and is configured as described above. The layout is designed to reduce the size of the unit by effectively using the space inside and saving space.

  Specifically, each terminal 4 is positioned on the side opposite to the flexible portion 32 in the power supply system rigid portion 33 (see FIG. 2, FIG. 5, FIG. 6, etc.). In other words, the through hole 33 b into which one end of each terminal 4 is inserted is located closer to the opposite side of the flexible part 32 in the power system rigid part 33. Here, in the case where the power supply system rigid portion 33 is positioned on the opposite side to the flexible portion 32, the case where most of the plurality of terminals 4 are positioned on the opposite side to the flexible portion 32 is included. Here, the plurality of terminals 4 and the through holes 33b are typically mostly at the central position C of the power system rigid portion 33 (here, the central position in the short side direction (see FIG. 5, FIG. 6, etc.)) It is located closer to the end opposite to the flexible portion 32, that is, the outer end opposite to the flexible portion 32 and the control system rigid portion 34.

  Then, each terminal 4 is positioned on the opposite side to the flexible portion 32 in the power supply system rigid portion 33, so that the housing space portion 53 for housing the electronic component 2 between itself and the substrate 3 in the housing 5 is formed. (See FIG. 2, FIG. 6, etc.) The housing space portion 53 is provided in each of the terminals 4 in the short side direction (the direction in which the power supply system rigid portion 33 and the flexible portion 32 are aligned) in the internal space portion of the housing 5 partitioned by the connector block 51 and the cover 52. Further, on the side of the flexible portion 32, the wall surface of the housing 5, in this case, the ceiling portion 52b, the long side wall surface 52c, the short side wall surfaces 52e and 52f, and the like are formed. In other words, the housing space portion 53 is a protrusion wall shape which is a wall forming the connector fitting portions 51h, 51i, 51j in the inner space portion of the housing 5 partitioned by the connector block 51 and the cover 52. It is partitioned between the portion 51m and the ceiling portion 52b, the long side wall surface 52c, the short side wall surfaces 52e, 52f and the like. Here, the accommodation space portion 53 is formed as a space portion having a substantially L-shaped cross section in a cross-sectional view along the short side direction (see FIG. 6). The electronic component 2 mounted on the rigid portion 31, in this case, the heat generating component 21 mounted on the power system rigid portion 33, and the thermally vulnerable component 22 mounted on the control system rigid portion 34 are housed in the housing space portion 53. Be done.

  Further, in the electronic component unit 1 of the present embodiment, the lock release portions 61a, 62a, 63a as release portions for releasing the fitting between the connector 6 and the connector fitting portions 51h, 51i, 51j are on the housing space 53 side. Located (see FIG. 2, FIG. 6, etc.). Here, the unlocking portion 61a is an arm-like member provided to the power input connector 61, and is positioned on the housing space 53 side in a state where the power input connector 61 is fitted to the connector fitting portion 51h. The distal end portion is exposed from the connector fitting portion 51h. The unlocking portion 61a is flexed by being held with a finger or the like, and the fitting state of the power input connector 61 and the connector fitting portion 51h is released, and the power input connector 61 can be removed from the connector fitting portion 51h. I assume. The unlocking portion 62a is an arm-like member provided to the power output connector 62, and is positioned on the housing space 53 side with the power output connector 62 fitted in the connector fitting portion 51i and has a tip end It is exposed from the connector fitting part 51i. The unlocking portion 62a is bent by being held with a finger or the like, and the fitting state of the power output connector 62 and the connector fitting portion 51i is released, and the power output connector 62 can be removed from the connector fitting portion 51i. I assume. The lock release portion 63a is an arm-like member provided in the control signal connector 63, and is positioned on the accommodating space portion 53 side in a state where the control signal connector 63 is fitted in the connector fitting portion 51j, and the distal end portion thereof. It is exposed from the connector fitting part 51j. The unlocking portion 63a is bent by being held with a finger or the like, and the fitting state of the control signal connector 63 and the connector fitting portion 51j is released, and the control signal connector 63 can be removed from the connector fitting portion 51j. I assume. In other words, the lock release portions 61 a, 62 a, and 63 a are positioned facing the control system rigid portion 34 side in a state where the substrate 3 is accommodated in the housing 5. Here, the lock release parts 61a, 62a, and 63a face the heat-fragile part 22 that is the electronic part 2 mounted on the control system rigid part 34 and located in the accommodation space part 53 along the short side direction.

  The plurality of through holes 33b formed in the substrate 3 of the present embodiment are formed through the openings 301 respectively formed in the metal mask 300 in accordance with the through holes 33b, as shown in FIGS. Solder paste (see the shaded area in FIG. 8) is applied and the terminals 4 are soldered. Here, the plurality of through holes 33b penetrate through the plate-like power supply system rigid portion 33 constituting the substrate 3 in the thickness direction and the opening shape is formed in a regular circle, and the terminal 4 is inserted, so-called reflow soldering processing Soldered. The plurality of through holes 33b of the present embodiment are arranged in a rectangular lattice shape. Further, the substrate 3 is configured to include lands 33c which are annular conductor portions on the periphery of each through hole 33b. Here, the metal mask 300 is a masking jig used when applying solder paste to each through hole 33b by printing as preparation for reflow soldering, and is a paste in which the opening 301 is formed. It covers an area other than the print area. In the following description, for convenience, one of the directions orthogonal to the plate thickness direction of the substrate 3 and the metal mask 300 shown in FIG. 7 is referred to as a horizontal direction (left and right direction in FIG. 8). The direction orthogonal to the horizontal direction is referred to as the vertical direction (the vertical direction in FIG. 8). FIG. 8 illustrates an example in which a plurality of through-holes 33b are arranged in a rectangular lattice shape, with three in the horizontal direction and three in the vertical direction.

  Then, the substrate 3 of the present embodiment is set such that the dimensional relationship of the through hole 33 b, the metal mask 300, the opening 301, etc. becomes a predetermined dimensional relationship with the dimensions of the applied terminal 4. Even if the distance between the plurality of through holes 33b is relatively narrow, the required amount of solder paste can be secured without overlapping the openings 301 of the metal mask 300, whereby the terminals 4 can be properly soldered. It is possible to attach.

  In the following, as shown in FIGS. 7 and 8, the dimensions of each part such as the substrate 3, the terminal 4, and the metal mask 300 are represented by the following symbols. That is, the terminal 4 is formed in a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole 33b, and the width of each side of the square is represented by “TW”. The opening 301 of the metal mask 300 is formed in a rectangular shape, and a plurality of openings 301 are arranged in a rectangular lattice pattern, that is, in a horizontal direction and a vertical direction. The length of the short side along the horizontal direction in FIG. 8 is represented by “H”, and the length of the long side along the vertical direction in FIG. 8 is represented by “V”. The thickness in the thickness direction is represented by “t1”. Further, in the openings 301, the distance between the openings 301 adjacent in the horizontal direction along the short side is represented by "CH1", and the distance between the openings 301 adjacent in the vertical direction along the long side is It is represented by “CH2”. The plurality of through holes 33b have an inner diameter represented by “φ1”, and a distance between centers of the through holes 33b adjacent in the lateral direction along the short side of the opening 301 is represented by “PH”. The center-to-center distance between the longitudinally adjacent through holes 33b along the long side of 301 is represented by “PV”, and is the smallest of the distances along the longitudinal direction between the through hole 33b and the short side of the opening 301 Is represented by "D1" and the largest by "D2". Further, the thickness of the rigid portion 31 in the thickness direction of the substrate 3 is represented by “t2”. Here, the three through holes 33b at the center in the vertical direction are located substantially at the center in the vertical direction with respect to the corresponding opening 301, and the three through holes 33b on the upper side in the vertical direction are with respect to the corresponding opening 301. The three through holes 33 b located on the lower side in the vertical direction and located on the lower side in the vertical direction are located on the upper side in the vertical direction with respect to the corresponding openings 301. Here, in the plurality of through holes 33b, the outer diameter of the land 33c is represented by “φ2”.

<In case of 0.64 terminal>
As an example, when the width TW of the terminal 4 is 0.64 mm, the length H of the short side of the opening 301, the length V of the long side of the opening 301, the thickness t1 in the plate thickness direction of the opening 301, the short side Distance CH1 between the openings 301 adjacent in the direction (horizontal direction), distance CH2 between the openings 301 adjacent in the long side direction (longitudinal direction), inner diameter φ1 of the through hole 33b, adjacent in the short side direction (horizontal direction) Center-to-center distance PH between through holes 33b, center-to-center distance PV between through holes 33b adjacent in the long side direction (longitudinal direction), minimum value D1 of distance between through hole 33b and short side of opening 301, through The maximum value D2 of the distance between the hole 33b and the short side of the opening 301 and the thickness t2 of the rigid portion 31 of the substrate 3 in the thickness direction are set to the following values. Here, as an example, the outer diameter φ2 of the land 33c is set to the following value.

TW = 0.64mm
H = 1.80mm
V = 3.00mm
t1 = 150 μm
CH1 = CH2 = 0.40 mm
φ1 = 1.2mm
PH = 2.20mm
PV = 3.00mm
D1, D2 ≧ 0.50 mm, D1 = 0.50 mm, D2 = 1.30 mm
1.0 mm ≦ t2 ≦ 1.2 mm
φ2 = 1.7mm

<In case of 0.50 terminal>
As another example, when the width TW of the terminal 4 is 0.50 mm, the length H of the short side of the opening 301, the length V of the long side of the opening 301, the thickness t1 in the thickness direction of the opening 301, A space CH1 between openings 301 adjacent to each other in the short side direction (horizontal direction), a space CH2 between openings 301 adjacent to each other in the long side direction (longitudinal direction), an inner diameter φ1 of through hole 33b, a short side direction (horizontal direction) Distance PH between centers of through holes 33b adjacent to each other, distance PV between centers of through holes 33b adjacent in the long side direction (longitudinal direction), and minimum value D1 of distance between through hole 33b and short side of opening 301 The maximum value D2 of the distance between the through hole 33b and the short side of the opening 301 and the thickness t2 of the rigid portion 31 of the substrate 3 in the thickness direction are set to the following values. Here, as an example, the outer diameter φ2 of the land 33c is set to the following value.

TW = 0.50mm
H = 1.40mm
V = 2.80mm
t1 = 150 μm
CH1 = CH2 = 0.40 mm
φ1 = 1.0mm
PH = 1.80mm
PV = 2.80mm
D1, D2 ≧ 0.50 mm, D1 = 0.50 mm, D2 = 1.30 mm
1.0 mm ≦ t2 ≦ 1.2 mm
φ2 = 1.3mm

  In the substrate 3 and the electronic component unit 1 configured as described above, the dimensional relationship of each part is the dimensional relationship as described above, so that the opening 301 of the metal mask 300 does not overlap. It is possible to ensure the amount of solder paste applied through the solder as a necessary and sufficient amount with respect to the required amount of solder.

  Here, the required solder amount is the volume of the solder required to solder the terminal 4 to the through hole 33 b, and the solder volume in the through hole 33 b (the total volume of the through hole 33 b to the through hole of the terminal 4 This corresponds to the sum of the fillet solder volume (corresponding to the value obtained by subtracting the fillet internal volume of the terminal 4 from the total fillet volume). The required amount of solder is typically determined according to the width TW of the terminal 4, the inner diameter φ1 of the through hole 33b, the thickness t2 of the substrate 3 in the thickness direction, and the like.

  On the other hand, the amount of solder paste is the volume of the solder paste applied through the opening 301, and the amount of solder paste required is determined according to the above-mentioned required amount of solder. When a solder paste is subjected to a reflow soldering process in a reflow furnace, it tends to shrink due to drying by heat and to decrease in volume. For this reason, the required amount of solder paste is determined by taking into account the amount of heat shrinkage of this solder paste with respect to the above-mentioned required amount of solder. Generally, the volume ratio of the solder powder to the paste flux in the solder paste is about 0.51: 0.49, so in this case, the amount of solder paste schematically required is [the amount of solder paste required. ≈Required solder amount × 1.96].

  Further, in the substrate 3, as the thickness t2 in the thickness direction becomes relatively thin, the total volume of the through holes 33b becomes relatively small, so the required amount of solder becomes relatively small, and consequently the required solder paste Accordingly, the amount of solder paste required can be ensured even if the opening area of the opening 301 of the metal mask 300 is relatively small. By taking advantage of this fact, the substrate 3 has a plate thickness t2 of 1.2 mm or less, and the dimensional relationship of each part is made to be the dimensional relationship as described above. , Etc.), the amount of solder paste applied through the opening 301 is necessary and sufficient for the required amount of solder without the opening 301 of the metal mask 300 overlapping. Can be ensured as a small amount. In particular, this effect becomes more remarkable in the solder paste for the central through hole 33b among the nine through holes 33b illustrated in FIG. On the other hand, the board 3 has a thickness t2 in the thickness direction of at least 1.0 mm, so that the minimum rigidity of the board 3 itself can be secured. Thus, it is possible to suppress the necessary amount of solder and secure a sufficient amount of solder paste with respect to the necessary amount of solder, and to ensure an appropriate strength. As described above, the substrate 3 and the electronic component unit 1 to which the substrate 3 is applied can suppress, for example, the generation of solder holes and the occurrence of bridges even when the intervals between the plurality of through holes 33b are the above-described dimensions. Thus, the terminal 4 can be properly soldered. In particular, the substrate 3 tends to be constrained by the terminal pitch on the connector side when the terminals 4 are linear as in the electronic component unit 1 of the present embodiment. Even if there is, the terminal 4 can be soldered properly while narrowing the distance between the through holes 33 b in accordance with the terminal pitch on the connector side.

  In addition, the board 3 and the electronic component unit 1 have a relatively thin plate thickness t2 as described above to suppress the necessary amount of solder and ensure the amount of solder paste as a necessary and sufficient amount relative to the necessary amount of solder. Even if the distance between the through holes 33 b (the above-mentioned PH, PV, etc.) becomes relatively narrow, for example, the portion in the through hole 33 b of the terminal 4 is crushed to make the width The terminal 4 can be properly soldered without taking measures such as thinning the TW. Therefore, the board 3 and the electronic component unit 1 can appropriately solder the terminals 4 while suppressing an increase in the number of man-hours at the time of manufacture, and for example, the manufacturing cost can be suppressed. Further, the board 3 and the electronic component unit 1 are required to reduce the necessary solder amount by relatively reducing the plate thickness t2 as described above, and to ensure the solder paste amount as a necessary and sufficient amount with respect to the necessary solder amount. Even if the distance between the through holes 33 b (the above-mentioned PH, PV, etc.) becomes relatively narrow, for example, an orthorhombic lattice shape, a rhombic lattice shape, a hexagonal lattice shape, or a triangular shape. The terminals 4 can be properly soldered in a state in which the through holes 33b are arranged in a rectangular lattice shape without taking measures such as offsetting the through-holes 33b as in the lattice shape. Therefore, since the substrate 3 and the electronic component unit 1 can share the terminals 4 as much as possible, and the number of shape types of the required terminals 4 can be suppressed, the manufacturing cost can be reduced, for example. Can be suppressed.

  The electronic component unit 1 to which the substrate 3 described above is applied and the wire harness WH to which the electronic component unit 1 is applied are connected to the plurality of rigid portions 31 via the flexible portion 32 and the flexible portion Since the substrate 3 can be accommodated in the housing 5 in a state where the portion 32 is bent, the overall height of the unit can be reduced. Then, in the electronic component unit 1 and the wire harness WH, the terminal 4 connecting the connector 6 with the electric wire W and the substrate 3 is erected linearly from one of the plurality of rigid portions 31 and the terminal 4 is rigid. In order to accommodate the electronic component 2 mounted on the rigid portion 31 in the space between the terminal 4 and the substrate 3 in the housing 5 by being positioned close to the side of the flexible portion 32 in the portion 31. Therefore, it is possible to effectively use the electronic component 2 in the housing 5 to save space. As a result, the electronic component unit 1 and the wire harness WH can be miniaturized, and even if the distance between the through holes 33 b is relatively narrowed to achieve further miniaturization, the electronic component unit 1 and the wire harness WH can be properly made as described above. The terminal 4 can be soldered.

  Further, in the electronic component unit 1 and the wire harness WH, since each terminal 4 is erected in a straight line from one of the plurality of rigid portions 31, for example, the terminal 4 may be bent in an L shape. In comparison, the terminals 4 can be shared as much as possible, and the number of required types of the shapes of the terminals 4 can be suppressed. Moreover, since the electronic component unit 1 and the wire harness WH can make each terminal 4 perpendicular | vertical with respect to the rigid part 31, compared with the case where the terminal 4 bends in an L shape, for example, full length Can be shortened and cost reduction and weight reduction can be achieved. Thereby, the electronic component unit 1 and the wire harness WH can suppress manufacturing cost, for example.

  In addition, the board | substrate for electronic component units which concerns on embodiment of this invention mentioned above, and an electronic component unit are not limited to embodiment mentioned above, A various change is possible in the range described in the claim. .

  In the above description, the electronic component unit 1 has been described as so-called power integration, but the present invention is not limited to this.

  In the above description, the plurality of rigid units 31 are described as including the power system rigid unit 33 as the first mounting unit and the control system rigid unit 34 as the second mounting unit. Not limited to this, it may be configured to include three or more. Further, in the above description, the substrate 3 is provided with the terminal 4 to which power is input / output and the heat generating component 21 which easily generates heat in the power system rigid portion 33, while the heat fragile component 22 having low resistance to heat is controlled. By providing the portion 34, the region where the main heat generation source is provided and the region where the parts susceptible to heat are provided are divided on the substrate 3 and divided (zoning), but the invention is not limited thereto.

  Further, in the above description, the flexible section 32 is bent so that the power supply system rigid section 33 and the control system rigid section 34 are substantially perpendicular to each other in the substrate 3 so that the cross section along the short side (see FIG. In the above description, it has been described that the whole is substantially L-shaped, but the present invention is not limited thereto. The substrate 3 may be accommodated in the housing 5 with at least the flexible portion 32 bent toward the terminal 4, and the power system rigid portion 33 and the control system rigid portion 34 may form an obtuse angle or an acute angle. Good.

  Also, in the above description, the lock release portions 61a, 62a, 63a for releasing the fitting between the connector 6 and the connector fitting portions 51h, 51i, 51j are described as being located on the accommodation space portion 53 side. For example, it may face the outside of the housing 5.

  Moreover, in the above description, although the terminal 4 was demonstrated as what is a linear terminal, it is not restricted to this, An L-shaped terminal may be sufficient. In this case, it is possible to solder the terminals 4 appropriately after the spacing between the through holes 33 b (the above-mentioned PH, PV, etc.) is relatively narrowed to achieve space saving and miniaturization.

  Further, the outer diameter φ2 of the land 33c described above is not limited to the value described above.

1 Electronic component unit 2 Electronic component 3 Substrate (Electronic component unit substrate)
4, 41, 42, 43 Terminal 5 Housing 31 Rigid part (mounting part)
33b through hole 33c land 300 metal mask 301 opening

Claims (5)

A plate-like mounting unit on which electronic components are mounted;
A plurality of through-holes penetrating the mounting portion in the plate thickness direction and having an opening shape formed in a round shape and terminals inserted and soldered;
The plurality of through holes are soldered by applying solder paste through openings formed in the metal mask according to the through holes, and the terminals are soldered.
The terminal is formed in a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole, and the width of each side of the square is 0.64 mm,
The opening has a rectangular opening shape, a short side length of 1.80 mm, a long side length of 3.00 mm, a thickness in the thickness direction of 150 μm, and the short side length The interval between the openings adjacent in the direction along the direction and the interval between the openings adjacent in the direction along the long side is 0.40 mm,
Three of the plurality of through holes are provided at least in a direction orthogonal to the thickness direction and in a direction along the long side of the opening, and the through hole at the center of the direction with respect to the opening is The through hole on one side of the direction is located closer to the other side of the direction with respect to the opening, and the through hole on the other side of the direction is in the opening. located closer to one side of the direction for a respective inner diameter 1.2 mm, distance between centers of the through holes adjacent in the direction along the short side of the opening is located at 2.20mm The distance between centers of the through holes adjacent to each other in the direction along the long side of the opening is 3.00 mm, and the distance between the through hole and the short side of the opening is 0.50 mm or more.
The mounting part has a plate thickness of 1.0 mm to 1.2 mm,
Electronic component unit substrate. A plate-like mounting unit on which electronic components are mounted;
A plurality of through-holes penetrating the mounting portion in the plate thickness direction and having an opening shape formed in a round shape and terminals inserted and soldered;
The plurality of through holes are soldered by applying solder paste through openings formed in the metal mask according to the through holes, and the terminals are soldered.
The terminal has a square cross-sectional shape in a direction perpendicular to the insertion direction into the through hole, and the width of each side of the square is 0.50 mm.
The opening has a rectangular opening shape, a short side length of 1.40 mm, a long side length of 2.80 mm, a thickness in the thickness direction of 150 μm, and the short side length The interval between the openings adjacent in the direction along the direction and the interval between the openings adjacent in the direction along the long side is 0.40 mm,
Three of the plurality of through holes are provided at least in a direction orthogonal to the thickness direction and in a direction along the long side of the opening, and the through hole at the center of the direction with respect to the opening is The through hole on one side of the direction is located closer to the other side of the direction with respect to the opening, and the through hole on the other side of the direction is in the opening. Correspondingly, the center distance between the through holes adjacent to each other in the direction along the short side of the opening is 1.80 mm, which is located closer to one side in the direction and each inner diameter is 1.0 mm. The distance between centers of the through holes adjacent to each other in the direction along the long side of the opening is 2.80 mm, and the distance between the through hole and the short side of the opening is 0.50 mm or more.
The mounting part has a plate thickness of 1.0 mm to 1.2 mm,
Electronic component unit substrate. The plurality of through holes are arranged in a rectangular lattice shape,
The electronic component unit substrate according to claim 1. A plate-like mounting portion on which an electronic component is mounted; and a substrate having a plurality of through holes penetrating through the mounting portion in the thickness direction and having an opening shape formed in a circular shape and terminals inserted and soldered ,
And a case for containing the substrate,
The plurality of through holes are soldered by applying solder paste through openings formed in the metal mask according to the through holes, and the terminals are soldered.
The terminal is formed in a square cross-sectional shape in a direction orthogonal to the insertion direction into the through hole, and the width of each side of the square is 0.64 mm,
The opening has a rectangular opening shape, a short side length of 1.80 mm, a long side length of 3.00 mm, a thickness in the thickness direction of 150 μm, and the short side length The interval between the openings adjacent in the direction along the direction and the interval between the openings adjacent in the direction along the long side is 0.40 mm,
Three of the plurality of through holes are provided at least in a direction orthogonal to the thickness direction and in a direction along the long side of the opening, and the through hole at the center of the direction with respect to the opening is The through hole on one side of the direction is located closer to the other side of the direction with respect to the opening, and the through hole on the other side of the direction is in the opening. located closer to one side of the direction for a respective inner diameter 1.2 mm, distance between centers of the through holes adjacent in the direction along the short side of the opening is located at 2.20mm The distance between centers of the through holes adjacent to each other in the direction along the long side of the opening is 3.00 mm, and the distance between the through hole and the short side of the opening is 0.50 mm or more.
The mounting part has a plate thickness of 1.0 mm to 1.2 mm,
Electronic component unit. A plate-like mounting portion on which an electronic component is mounted; and a substrate having a plurality of through holes penetrating through the mounting portion in the thickness direction and having an opening shape formed in a circular shape and terminals inserted and soldered ,
And a case for containing the substrate,
The plurality of through holes are soldered by applying solder paste through openings formed in the metal mask according to the through holes, and the terminals are soldered.
The terminal has a square cross-sectional shape in a direction perpendicular to the insertion direction into the through hole, and the width of each side of the square is 0.50 mm.
The opening has a rectangular opening shape, a short side length of 1.40 mm, a long side length of 2.80 mm, a thickness in the thickness direction of 150 μm, and the short side length The interval between the openings adjacent in the direction along the direction and the interval between the openings adjacent in the direction along the long side is 0.40 mm,
Three of the plurality of through holes are provided at least in a direction orthogonal to the thickness direction and in a direction along the long side of the opening, and the through hole at the center of the direction with respect to the opening is The through hole on one side of the direction is located closer to the other side of the direction with respect to the opening, and the through hole on the other side of the direction is in the opening. Correspondingly, the center distance between the through holes adjacent to each other in the direction along the short side of the opening is 1.80 mm, which is located closer to one side in the direction and each inner diameter is 1.0 mm. The distance between centers of the through holes adjacent to each other in the direction along the long side of the opening is 2.80 mm, and the distance between the through hole and the short side of the opening is 0.50 mm or more.
The mounting part has a plate thickness of 1.0 mm to 1.2 mm,
Electronic component unit.

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