JP6561058B2 - 集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法 - Google Patents
集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法 Download PDFInfo
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- JP6561058B2 JP6561058B2 JP2016537538A JP2016537538A JP6561058B2 JP 6561058 B2 JP6561058 B2 JP 6561058B2 JP 2016537538 A JP2016537538 A JP 2016537538A JP 2016537538 A JP2016537538 A JP 2016537538A JP 6561058 B2 JP6561058 B2 JP 6561058B2
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- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000000404 calcium aluminium silicate Substances 0.000 description 1
- 235000012215 calcium aluminium silicate Nutrition 0.000 description 1
- WNCYAPRTYDMSFP-UHFFFAOYSA-N calcium aluminosilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O WNCYAPRTYDMSFP-UHFFFAOYSA-N 0.000 description 1
- 229940078583 calcium aluminosilicate Drugs 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- GBAOBIBJACZTNA-UHFFFAOYSA-L calcium sulfite Chemical compound [Ca+2].[O-]S([O-])=O GBAOBIBJACZTNA-UHFFFAOYSA-L 0.000 description 1
- 235000010261 calcium sulphite Nutrition 0.000 description 1
- HHSPVTKDOHQBKF-UHFFFAOYSA-J calcium;magnesium;dicarbonate Chemical compound [Mg+2].[Ca+2].[O-]C([O-])=O.[O-]C([O-])=O HHSPVTKDOHQBKF-UHFFFAOYSA-J 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- VTEHVUWHCBXMPI-UHFFFAOYSA-N dichloro-bis(prop-2-enyl)silane Chemical compound C=CC[Si](Cl)(Cl)CC=C VTEHVUWHCBXMPI-UHFFFAOYSA-N 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- YZEPTPHNQLPQIU-UHFFFAOYSA-M dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]-(3-trimethoxysilylpropyl)azanium;chloride Chemical compound [Cl-].CO[Si](OC)(OC)CCC[N+](C)(C)CCOC(=O)C(C)=C YZEPTPHNQLPQIU-UHFFFAOYSA-M 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical class C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- VJYFKVYYMZPMAB-UHFFFAOYSA-N ethoprophos Chemical compound CCCSP(=O)(OCC)SCCC VJYFKVYYMZPMAB-UHFFFAOYSA-N 0.000 description 1
- QBKVWLAQSQPTNL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate;styrene Chemical compound CCOC(=O)C(C)=C.C=CC1=CC=CC=C1 QBKVWLAQSQPTNL-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- MSYLJRIXVZCQHW-UHFFFAOYSA-N formaldehyde;6-phenyl-1,3,5-triazine-2,4-diamine Chemical class O=C.NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 MSYLJRIXVZCQHW-UHFFFAOYSA-N 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- BPLYVSYSBPLDOA-GYOJGHLZSA-N n-[(2r,3r)-1,3-dihydroxyoctadecan-2-yl]tetracosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(=O)N[C@H](CO)[C@H](O)CCCCCCCCCCCCCCC BPLYVSYSBPLDOA-GYOJGHLZSA-N 0.000 description 1
- FOGSDLLFGSNQCW-UHFFFAOYSA-N n-[(prop-2-enoylamino)methoxymethyl]prop-2-enamide Chemical compound C=CC(=O)NCOCNC(=O)C=C FOGSDLLFGSNQCW-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000011356 non-aqueous organic solvent Substances 0.000 description 1
- 229920000847 nonoxynol Polymers 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical class CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical class O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 239000000429 sodium aluminium silicate Substances 0.000 description 1
- 235000012217 sodium aluminium silicate Nutrition 0.000 description 1
- GJPYYNMJTJNYTO-UHFFFAOYSA-J sodium aluminium sulfate Chemical compound [Na+].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GJPYYNMJTJNYTO-UHFFFAOYSA-J 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 229910001495 sodium tetrafluoroborate Inorganic materials 0.000 description 1
- RUQIYMSRQQCKIK-UHFFFAOYSA-M sodium;2,3-di(propan-2-yl)naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S([O-])(=O)=O)=C(C(C)C)C(C(C)C)=CC2=C1 RUQIYMSRQQCKIK-UHFFFAOYSA-M 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- KWDQAHIRKOXFAV-UHFFFAOYSA-N trichloro(pentyl)silane Chemical compound CCCCC[Si](Cl)(Cl)Cl KWDQAHIRKOXFAV-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- FYUZFGQCEXHZQV-UHFFFAOYSA-N triethoxy(hydroxy)silane Chemical compound CCO[Si](O)(OCC)OCC FYUZFGQCEXHZQV-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- HGCVEHIYVPDFMS-UHFFFAOYSA-N trimethoxy(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)silane Chemical compound C1C(C[Si](OC)(OC)OC)CCC2OC21 HGCVEHIYVPDFMS-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910001720 Åkermanite Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
第1のガラス状結合剤材料内の鉱物粒子を含む粒塊性研磨粒子を提供する工程;
粒塊性研磨粒子を第2のガラス状結合剤材料前駆体と組み合わせて、集塊性研磨粒子前駆体を形成する工程;及び、
集塊性研磨粒子前駆体を加熱して、第1のガラス状結合剤材料とは異なる第2のガラス状結合剤材料に第2のガラス状結合剤材料前駆体を変換し、それにより集塊性研磨粒子を形成する工程、を含み、第1のガラス状結合剤材料は、第2のガラス状結合剤材料とは、
i)元素の組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる方法である。
i)元素の組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる、集塊性研磨粒子を提供する。
i)元素の組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる、研磨物品を提供する。
「1mmの目を有する試験用ふるい」という用語は、ASTMのE11−13「Standard Specification for Woven Wire Testing sieve Cloth and Testing sieves(試験用ふるいワイヤ織布及び試験用ふるい用標準仕様)」に準拠する試験用ふるいであって、1辺が1mmの、実質的に正方形のふるいの目を有するものを意味し、
「研磨粒子」という用語は、少なくとも8、好ましくは少なくとも9のモース硬度を有する粒子を意味し、
「担持面積率」という用語は、構造化研磨物品の研磨層の総面積に対する、研磨面接触総面積(すなわち、成形研磨複合体の遠位端部)の比率を意味し、
「結合剤材料」という用語は、それを介して粒子が保持される、連続的なマトリクスを形成する材料を意味し、
「集塊性研磨粒子」という用語は、結合剤材料により互いに結合された粒塊性研磨粒子及び/又は集合性研磨粒子を含む研磨粒子を意味し、
「楕円体状」という用語は、球に加えて、例えば、楕円をその軸の1つの周りに回転させてできる楕円体のような、完全に丸くはないものの球のような形状の物体を含み、
「超砥粒」という用語は、集合的又は個別的に、ダイヤモンド及び/又は立方晶窒化ホウ素を指し、かつ、
「ガラス状結合剤材料」という用語は、ガラス様の結合剤材料(例えば、ガラス又はガラス−セラミックス)であって、例えば、充填剤粒子のような追加的な成分を含有し得るものを意味する。
−50+60、−60+70、−70+80、−80+100、−100+120、−120+140、−140+170、−170+200、−200+230、
−230+270、−270+325、−325+400、−400+450、−450+500、又は−500+635を含む、公称ふるい分け等級を有することができる。
第1の実施形態においては、本開示は、集塊性研磨粒子を製造するための方法を提供し、その方法は:
第1のガラス状結合剤内の鉱物粒子を含む粒塊性研磨粒子を提供する工程;
粒塊性研磨粒子を第2のガラス状結合剤材料前駆体と組み合わせ、集塊性研磨粒子前駆体を形成する工程;及び、
集塊性研磨粒子前駆体を加熱して、第2のガラス状結合剤材料前駆体を第1のガラス状結合剤とは異なる第2のガラス状結合剤に転換し、それにより集塊性研磨粒子を形成する工程、を含み、第1のガラス状結合剤は第2のガラス状結合剤とは:
i)元素組成、又は
ii)固有の物理的特性のうちの少なくとも1点で異なる方法である。
鉱物粒子と第1のガラス状結合剤材料前駆体とを含む粒塊性研磨粒子前駆体を形成する工程;及び、
粒塊性研磨粒子前駆体を、第1の最高温度で加熱して、粒塊性研磨粒子を形成する工程、を含み、
集塊性研磨粒子前駆体が、第1の最高温度よりも少なくとも15℃低い第2の最高温度で加熱される、第1〜第6の実施形態のいずれか1つによる集塊性研磨粒子を製造するための方法を提供する。
鉱物粒子と第1のガラス状結合剤材料前駆体とを含む組成物を、複数の成形型の空洞に入れて、粒塊性研磨粒子前駆体を形成する工程を含む、第7の実施形態による集塊性研磨粒子を製造するための方法を提供する。
i)元素組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる、集塊性研磨粒子を提供する。
i)元素組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる、研磨物品を提供する。
研磨試験方法
Bruker社(マサチューセッツ州、Billerica)から入手可能なCETR CP−4研磨機を用いて、研磨を実施した。次に、3M両面コートテープ442PCとして、3M社(ミネソタ州、St.Paul)から入手可能な1枚の両面感圧性接着テープを、構造化研磨パッドの側、例えば、実施例1aでは、形成部とは反対側に貼り付けた。厚さ50ミル(0.13mm)のポリカーボネートシートであるサブパッドを、構造化研磨パッドに、442PCテープを介して貼り付けた。次に、ポリカーボネートのサブパッドを有する直径7 3/8インチ(187mm)の構造化研磨パッドを、上の積層体からダイカットした。サブパッドを有するパッドを、CP−4のプラテンに、両面接着テープを用いて取り付けた。それぞれが直径約3インチ(7.62cm)の3つのポケットを有する真ちゅうキャリアを、CP−4の上側ドライブシャフトに取り付けた。GT Crystal Systems LLC社(マサチューセッツ州、Salem)から入手可能な、3つの直径3インチ(7.62cm)のC−平面サファイヤウェハが、キャリアポケット内に配置された。キャリアの穴の直径は、サファイヤウェハの直径よりもわずかに大きいので、ウェハがキャリアの穴の中で自由に回転することが可能になっていた。研磨の間、プラテンを120rpmで回転させ、研磨機のヘッドを121rpmで回転させ、6psi(13.8kPa)の圧力をかけた。Intersurface Dynamics社(コネチカット州、Bethel)から入手可能で、重量%のPWA−5を有するCHALLENGE 543HTの5重量%溶液である潤滑剤を、研磨試験中ずっとパッド中央に、約20ml/分の流速で流した。一部のケースでは、比較例CE−Aに対するPWA−5の代わりに、PWA−5が用いられた。3枚のウェハを用いて、研磨を30分間にわたり実行した。各固定研磨パッドに対して3枚のウェハを研磨した。ウェハ密度が3.97g/cm3であることに基づき、測定された重量損失を用いて、除去された材料の量を求めた。ミクロン/分で報告する除去速度は、30分の研磨間隔で、3枚のウェハの厚みが減少した量の平均値である。
米国特許第6,551,366号(D’Souzaら)に開示されている一般的な手順にしたがって、研磨粒塊を調製した。
SDA−2を、粒塊前駆体/PWA−3粉末混合物を、720℃ではなく765℃でガラス化した点以外はSDA−1と同様にして調製した。
SDA−3を、粒塊前駆体/PWA−3粉末混合物を、720℃ではなく830℃でガラス化した点以外はSDA−1と同様にして調製した。
SDA−4を、粉砕したGFの量が26.2gで、用いたMCD−1ダイヤモンドの量が32.0gであった点、及び粒塊前駆体/PWA−3粉末混合物を、720℃ではなく820℃でガラス化した点以外はSDA−1と同様にして調製した。
SDA−5を、粉砕したGFの量が34.9gで、用いたMCD−1ダイヤモンドの量が23.3gであった点以外はSDA−1と同様にして調製した。
SDA−6を、粉砕したGFの量が34.9gで、用いたMCD−1ダイヤモンドの量が23.3gであった点、及び粒塊前駆体/PWA−3粉末混合物を、720℃ではなく765℃でガラス化した点以外はSDA−1と同様にして調製した。
SDA−7を、粉砕したGFの量が34.9gで、用いたMCD−1ダイヤモンドの量が23.3gであった点、及び粒塊前駆体/PWA−3粉末混合物を、720℃ではなく830℃でガラス化した点以外はSDA−1と同様にして調製した。
研磨粒子SDA−1を有する集塊性研磨粒子を、以下のようにして調製した。36.4重量部のStandex230を、63.6重量部の脱イオン化水に、カウレスブレードを備えたエアミキサーを用いて撹拌することにより溶解させた。別の容器内で、61.5gのStandex230溶液と、55.40gの粉砕したGFと、83.1gのSDA−1を、標準的プロペラブレードで5分間にわたり完全に混合し、続いて、30分間にわたり超音波浴槽内で撹拌して、スラリーを形成した。GFは使用前に、メジアン粒径が約2.5μmになるように粉砕しておいた。スラリーを、テクスチャをつけたポリプロピレンの工具のシートにコーティングしたが、テクスチャは空洞のアレイであり、余分なスラリーは、ドクターブレードで除去した。ポリプロピレンの工具の空洞は、頭を切り落とした四角錐であり、180μmの深さを有し、ベース部分の寸法が250μm×250μmであり、かつ遠位端の寸法が150μm×150μmであった。空洞は、正方形のグリッドのアレイ状に配列されており、そのピッチ、すなわち、空洞の中心間の距離は、375μmであった。空洞を形成する側面は、遠位端に向かって幅が狭くなるテーパー状であり、集塊性研磨粒子が容易に工具から取り外せるようになっていた。テクスチャをつけたポリプロピレンの工具は、望ましいポリプロピレンのシートのテクスチャの逆のテクスチャを有する金属製のマスター工具からのテクスチャがポリプロピレンに形成される、型押し加工工程により形成された。マスター工具の角錐配列は、従来の金属のダイヤモンド旋削プロセスによって製造した。マスター工具によるポリプロピレンシートの型押しは、ポリプロピレンの融解温度付近で、従来の型押し技術に従って行われた。
実施例2〜18を、集塊性研磨粒子中の噴霧乾燥した粒塊性粒子の重量百分率(噴霧乾燥粒塊と集塊性研磨粒子内の粉砕したガラスフリットとの総重量約138.5gに対する重量百分率)と、ガラス化温度(すなわち、成形された集塊性研磨粒子の1時間の最高アニーリング温度)とを、表1(下記)に報告されているように調整した点以外は実施例1と同様にして調製した。
構造化研磨パッドを、実施例1の集塊性研磨粒子を用いて、以下の手順にしたがって調製した。SR368D、28.0g;OX50、1.0g;IRG819、0.3g;VAZO 52、0.3g;SP32000、1.2g;A174、0.7g;W400、57.6g;及び、実施例1の集塊性研磨粒子、10.9gを混合し、樹脂ベースのスラリーを得た。樹脂ベースのスラリーを、テクスチャをつけたポリプロピレン工具のシートにコーティングしたが、テクスチャは空洞のアレイであった。ポリプロピレン工具の空洞は、直方体様の形状であり、深さが800μm、空洞の底部の寸法が2.36mm×2.36mmで、空洞開口部の寸法が2.8mm×2.8mmであった。空洞は、正方形のグリッドのアレイ状に配列されており、そのピッチ(すなわち、空洞の中心間の距離)は、4.0mmであった。テクスチャをつけたポリプロピレン工具は、実施例1に対して説明したのと同様の型押し加工により用意した。樹脂ベースのスラリーのコーティング幅は、10インチ(25.4cm)であった。厚さ5ミル(0.127mm)のポリエステルフィルム裏材のシートが、樹脂ベースのスラリーコーティングに、ポリエステルフィルム裏材上に適用されるゴムのローラを用いて手で貼り付けられ、スラリーがポリエステルフィルム裏材の表面を濡らした。次に、樹脂ベースのスラリーコーティングは、コーティング、工具、及び裏材を、American Ultra社(インディアナ州、レバノン)から市販の2つの紫外線ランプ(400ワット/インチ(157.5W/cm))を発生させる中圧力水銀灯下を、約30フィート/分(9.1m/分)の速度で通過させることにより、裏材を介して硬化された。硬化したスラリーは、ポリエステルフィルム裏材に粘着していたが、工具から取り除かれ、立方体形状の特徴部分を裏材に取り付けられた状態にしていた。特徴部分を有する裏材は、従来型の空気透過型オーブン90℃で12時間にわたり、更に後硬化され、構造化研磨パッドを形成した。
構造化研磨パッドは、固定した研磨パッド組成内の集塊性研磨粒子の量を調整し、表1の最終列にあるような、固定した研磨パッド内の集塊性研磨粒子の百分率を得たという点以外は、実施例1aに対して説明した手続きによって準備した。
比較実施例Aは、3M 677XA EL TRIZACT DIAMOND TILE(直径6ミクロン)として3M社(ミネソタ州、St.Paul)から入手可能な、固定された研磨パッドであった。
Claims (24)
- 第1のガラス状結合剤内の鉱物粒子を含む粒塊性研磨粒子を提供する工程;
前記粒塊性研磨粒子を第2のガラス状結合剤材料前駆体と組み合わせ、集塊性研磨粒子前駆体を形成する工程;及び、
前記集塊性研磨粒子前駆体を加熱して、前記第2のガラス状結合剤材料前駆体を前記第1のガラス状結合剤とは異なる第2のガラス状結合剤に転換し、それにより前記集塊性研磨粒子を形成する工程、を含み、前記第1のガラス状結合剤は前記第2のガラス状結合剤とは:
i)元素組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる、集塊性研磨粒子を製造するための方法。 - 前記第1のガラス状結合剤と前記第2のガラス状結合剤とが、同じ元素組成を有する、請求項1に記載の集塊性研磨粒子を製造するための方法。
- 前記第1のガラス状結合剤と前記第2のガラス状結合剤とが、異なる元素組成を有する、請求項1に記載の集塊性研磨粒子を製造するための方法。
- 前記鉱物粒子が、ダイヤモンド粒子を含む、請求項1〜3のいずれか一項に記載の集塊性研磨粒子を製造するための方法。
- 前記鉱物粒子が、0.1〜15ミクロンのメジアン粒径を有し、前記粒塊性研磨粒子が40〜400ミクロンのメジアン粒径を有する、請求項4に記載の集塊性研磨粒子を製造するための方法。
- 前記粒塊性研磨粒子が、楕円体状に成形されている、請求項1〜5のいずれか一項に記載の集塊性研磨粒子を製造するための方法。
- 前記粒塊性研磨粒子を提供する工程が:
前記鉱物粒子と前記第1のガラス状結合剤材料前駆体とを含む粒塊性研磨粒子前駆体を形成する工程;及び、
前記粒塊性研磨粒子前駆体を、第1の最高温度で加熱して、前記粒塊性研磨粒子を形成する工程、を含み、
前記集塊性研磨粒子前駆体が、前記第1の最高温度よりも少なくとも15℃低い第2の最高温度で加熱される、請求項1〜6のいずれか一項に記載の集塊性研磨粒子を製造するための方法。 - 前記鉱物粒子と前記第1のガラス状結合剤材料前駆体とを含む前記粒塊性研磨粒子前駆体を形成する工程が、
前記鉱物粒子と前記第1のガラス状結合剤材料前駆体とを含む組成物を、複数の成形型の空洞に入れて、前記粒塊性研磨粒子前駆体を形成する工程を含む、請求項7に記載の集塊性研磨粒子を製造するための方法。 - 前記第2のガラス状結合剤が、前記第1のガラス状結合剤よりも破砕しにくい、請求項1〜8のいずれか一項に記載の集塊性研磨粒子を製造するための方法。
- 鉱物粒子と第1のガラス状結合剤とを含む粒塊性研磨粒子を含み、前記粒塊性研磨粒子が、第2のガラス状結合剤により結合されており、前記第1のガラス状結合剤は、前記第2のガラス状結合剤とは:
i)元素組成、又は
ii)固有の物理的特性
のうちの少なくとも1点で異なる、集塊性研磨粒子。 - 前記第1のガラス状結合剤と前記第2のガラス状結合剤とが、同じ元素組成を有する、請求項10に記載の集塊性研磨粒子。
- 前記第1のガラス状結合剤と前記第2のガラス状結合剤とが、異なる元素組成を有する、請求項10に記載の集塊性研磨粒子。
- 前記鉱物粒子が、ダイヤモンド粒子を含む、請求項10〜12のいずれか一項に記載の集塊性研磨粒子。
- 前記ダイヤモンド粒子が、0.1〜15ミクロンのメジアン粒径を有し、かつ前記粒塊性研磨粒子が40〜400ミクロンのメジアン粒径を有する、請求項13に記載の集塊性研磨粒子。
- 前記粒塊性研磨粒子が、楕円体状に成形されている、請求項10〜14のいずれか一項に記載の集塊性研磨粒子。
- 前記第2のガラス状結合剤が、前記第1のガラス状結合剤よりも破砕しにくい、請求項10〜15のいずれか一項に記載の集塊性研磨粒子。
- 前記集塊性研磨粒子のメジアン粒径が、前記粒塊性研磨粒子のメジアン粒径よりも少なくとも2.5倍大きい、請求項10〜16のいずれか一項に記載の集塊性研磨粒子。
- 結合剤材料内に保持された集塊性研磨粒子を含み、前記集塊性研磨粒子が粒塊性研磨粒子を含み、前記粒塊性研磨粒子が鉱物粒子と第1のガラス状結合剤とを含み、前記粒塊性研磨粒子が、第2のガラス状結合剤により結合されており、前記第1のガラス状結合剤が前記第2のガラス状結合剤とは:
i)元素組成、又は
ii)固有の物理的特性、
のうちの少なくとも1つの点で異なる、研磨物品。 - 裏材の主面に固着された研磨層を含む構造化研磨物品を含み、前記研磨層が、成形研磨複合体を含み、かつ、少なくとも一部の前記成形研磨複合体が、前記結合剤材料内に保持された前記集塊性研磨粒子を含む、請求項18に記載の研磨物品。
- 前記研磨層が、20〜70%の担持面積率を有する、請求項19に記載の研磨物品。
- 前記鉱物粒子が、ダイヤモンド粒子を含む、請求項18〜20のいずれか一項に記載の研磨物品。
- 前記ダイヤモンド粒子が、0.1〜15ミクロンのメジアン粒径を有し、前記粒塊性研磨粒子が40〜400ミクロンのメジアン粒径を有する、請求項21に記載の研磨物品。
- 前記集塊性研磨粒子のメジアン粒径が、前記粒塊性研磨粒子のメジアン粒径よりも少なくとも2.5倍大きい、請求項18〜22のいずれか一項に記載の研磨物品。
- 前記第2のガラス状結合剤が、前記第1のガラス状結合剤よりも破砕しにくい、請求項18〜23のいずれか一項に記載の研磨物品。
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US201361913659P | 2013-12-09 | 2013-12-09 | |
US61/913,659 | 2013-12-09 | ||
PCT/US2014/069034 WO2015088953A1 (en) | 2013-12-09 | 2014-12-08 | Conglomerate abrasive particles, abrasive articles including the same, and methods of making the same |
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JP2017509715A JP2017509715A (ja) | 2017-04-06 |
JP6561058B2 true JP6561058B2 (ja) | 2019-08-14 |
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US (2) | US10315289B2 (ja) |
JP (1) | JP6561058B2 (ja) |
CN (1) | CN105813808B (ja) |
TW (1) | TWI653125B (ja) |
WO (1) | WO2015088953A1 (ja) |
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-
2014
- 2014-12-08 JP JP2016537538A patent/JP6561058B2/ja active Active
- 2014-12-08 CN CN201480067461.9A patent/CN105813808B/zh not_active Expired - Fee Related
- 2014-12-08 US US15/100,585 patent/US10315289B2/en not_active Expired - Fee Related
- 2014-12-08 WO PCT/US2014/069034 patent/WO2015088953A1/en active Application Filing
- 2014-12-09 TW TW103142910A patent/TWI653125B/zh not_active IP Right Cessation
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- 2019-04-22 US US16/390,758 patent/US20190240808A1/en not_active Abandoned
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CN105813808B (zh) | 2018-10-09 |
WO2015088953A1 (en) | 2015-06-18 |
TWI653125B (zh) | 2019-03-11 |
TW201544257A (zh) | 2015-12-01 |
US20190240808A1 (en) | 2019-08-08 |
US20160303711A1 (en) | 2016-10-20 |
JP2017509715A (ja) | 2017-04-06 |
US10315289B2 (en) | 2019-06-11 |
CN105813808A (zh) | 2016-07-27 |
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