JP6546343B2 - ドレッシング装置及びこれを含むウエハー研磨装置 - Google Patents
ドレッシング装置及びこれを含むウエハー研磨装置 Download PDFInfo
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- JP6546343B2 JP6546343B2 JP2018512290A JP2018512290A JP6546343B2 JP 6546343 B2 JP6546343 B2 JP 6546343B2 JP 2018512290 A JP2018512290 A JP 2018512290A JP 2018512290 A JP2018512290 A JP 2018512290A JP 6546343 B2 JP6546343 B2 JP 6546343B2
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- unit
- suction
- brushing
- polishing
- wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims description 145
- 238000004140 cleaning Methods 0.000 claims description 129
- 230000001680 brushing effect Effects 0.000 claims description 108
- 239000000243 solution Substances 0.000 claims description 103
- 238000002347 injection Methods 0.000 claims description 95
- 239000007924 injection Substances 0.000 claims description 95
- 239000002245 particle Substances 0.000 claims description 51
- 230000000903 blocking effect Effects 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 76
- 238000007517 polishing process Methods 0.000 description 33
- 239000007921 spray Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 21
- 238000012546 transfer Methods 0.000 description 21
- 230000007547 defect Effects 0.000 description 12
- 239000002002 slurry Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Cleaning In General (AREA)
Description
Claims (12)
- 下定盤に付着される研磨パッドを洗浄するドレッシング装置であって、
前記研磨パッドをブラッシングするブラシ(brush)を含むブラッシング部;
前記研磨パッドに洗浄液を噴射する噴射ノズル;
前記噴射ノズルによる洗浄液噴射時に発生するパーティクルを吸入する吸入口を含む吸入部;及び
前記ブラッシング部の下面よりさらに下方に突出する遮断部
を含み、
前記噴射ノズル、前記吸入部及び前記ブラッシング部は互いに連続して接しており、
前記遮断部は、前記ブラッシング部の外側に配置されている、ドレッシング装置。 - 前記ブラッシング部、前記噴射ノズル、及び前記吸入部は互いに結合された状態で同じスイング速度(swing speed)で前記研磨パッド上でスイングする、請求項1に記載のドレッシング装置。
- 外側から内側に向かう方向に前記ブラッシング部、前記吸入部、及び前記噴射ノズルが順次位置する、請求項1または2に記載のドレッシング装置。
- 前記吸入部の前記吸入口は前記噴射ノズルを取り囲み、
前記ブラッシング部は前記吸入部を取り囲む、請求項3に記載のドレッシング装置。 - 前記遮断部は前記ブラッシング部に接している、請求項4に記載のドレッシング装置。
- 外側から内側に向かう方向に前記吸入部、前記噴射ノズル、及び前記ブラッシング部が順次位置する、請求項1または2に記載のドレッシング装置。
- 前記噴射ノズルは前記ブラッシング部を取り囲み、
前記吸入部の前記吸入口は前記噴射ノズルを取り囲む、請求項6に記載のドレッシング装置。 - 前記遮断部は前記吸入部に接する、請求項7に記載のドレッシング装置。
- 外側から内側に向かう方向に前記ブラッシング部、前記噴射ノズル、及び前記吸入部が順次に位置する、請求項1または2に記載のドレッシング装置。
- 前記噴射ノズルは前記吸入部を取り囲み、
前記ブラッシング部は前記噴射ノズルを取り囲む、請求項9に記載のドレッシング装置。 - 前記吸入部は、所定の圧力又は流量で前記吸入口を通じて吸入されたパーティクルを排気する排気管をさらに含み、
前記吸入口の直径は前記排気管の直径より大きい、請求項1から10のいずれか1項に記載のドレッシング装置。 - 下定盤及び前記下定盤に付着される研磨パッドを含む研磨テーブル;
ウエハーを前記研磨パッドにロードし、ロードされたウエハーを加圧して研磨するヘッド部;及び
前記研磨パッドを洗浄する請求項1から11のいずれか1項に記載のドレッシング装置を含む、ウエハー研磨装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150150851A KR101841549B1 (ko) | 2015-10-29 | 2015-10-29 | 드레싱 장치 및 이를 포함하는 웨이퍼 연마 장치 |
KR10-2015-0150851 | 2015-10-29 | ||
PCT/KR2016/000933 WO2017073845A1 (ko) | 2015-10-29 | 2016-01-28 | 드레싱 장치 및 이를 포함하는 웨이퍼 연마 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018527753A JP2018527753A (ja) | 2018-09-20 |
JP6546343B2 true JP6546343B2 (ja) | 2019-07-17 |
Family
ID=58631727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018512290A Active JP6546343B2 (ja) | 2015-10-29 | 2016-01-28 | ドレッシング装置及びこれを含むウエハー研磨装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10737366B2 (ja) |
JP (1) | JP6546343B2 (ja) |
KR (1) | KR101841549B1 (ja) |
CN (1) | CN108352311B (ja) |
WO (1) | WO2017073845A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI839075B (zh) * | 2023-01-12 | 2024-04-11 | 中國砂輪企業股份有限公司 | 研磨墊修整裝置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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US20190126430A1 (en) * | 2016-04-21 | 2019-05-02 | Ebara Corporation | Substrate treatment apparatus |
JP7034650B2 (ja) * | 2017-09-28 | 2022-03-14 | 株式会社ディスコ | 加工装置 |
KR102461592B1 (ko) * | 2017-12-27 | 2022-11-01 | 주식회사 케이씨텍 | 기판 처리 장치 |
KR102037747B1 (ko) * | 2018-01-08 | 2019-10-29 | 에스케이실트론 주식회사 | 웨이퍼 연마 장치 |
JP7083722B2 (ja) * | 2018-08-06 | 2022-06-13 | 株式会社荏原製作所 | 研磨装置、及び、研磨方法 |
JP7162465B2 (ja) | 2018-08-06 | 2022-10-28 | 株式会社荏原製作所 | 研磨装置、及び、研磨方法 |
CN109159020B (zh) * | 2018-10-26 | 2021-05-11 | 长江存储科技有限责任公司 | 研磨装置 |
KR20220073192A (ko) * | 2020-11-26 | 2022-06-03 | 에스케이실트론 주식회사 | 연마 패드 세정 장치 및 연마 장치 |
KR20230025614A (ko) * | 2021-08-13 | 2023-02-22 | 주식회사 제우스 | 기판처리방법 |
KR102347333B1 (ko) * | 2021-09-10 | 2022-01-04 | 김현호 | 연마용 제품회전장치 |
KR102624639B1 (ko) * | 2021-10-12 | 2024-01-15 | 에스케이실트론 주식회사 | 웨이퍼 연마 패드의 세정 장치 |
KR102709559B1 (ko) | 2021-12-20 | 2024-09-26 | 에이치디현대중공업 주식회사 | 선박용 엔진 연료공급 시스템 및 방법 |
WO2024044023A1 (en) * | 2022-08-24 | 2024-02-29 | Applied Materials, Inc. | Pad surface cleaning device around pad conditioner to enable insitu pad conditioning |
CN116393836B (zh) * | 2023-04-14 | 2023-12-12 | 山东乾元半导体科技有限公司 | 一种led晶圆切割机 |
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JP2000042899A (ja) * | 1998-07-29 | 2000-02-15 | Speedfam-Ipec Co Ltd | ポリッシングパッドのドレッシング装置およびドレッシング方法 |
JP2001277095A (ja) * | 2000-03-31 | 2001-10-09 | Mitsubishi Materials Corp | パッドコンディショニング装置及びパッドコンディショニング方法 |
US20010029155A1 (en) * | 2000-01-31 | 2001-10-11 | Applied Materials, Inc. | Multi-step conditioning process |
JP2001237204A (ja) * | 2000-02-22 | 2001-08-31 | Hitachi Ltd | 半導体装置の製造方法 |
TW200400866A (en) * | 2002-04-02 | 2004-01-16 | Rodel Inc | Composite conditioning disk |
KR100523623B1 (ko) * | 2003-02-04 | 2005-10-24 | 동부아남반도체 주식회사 | Cmp 장비의 다이아몬드 디스크의 클리닝 드레서 |
JP2006159317A (ja) * | 2004-12-03 | 2006-06-22 | Asahi Sunac Corp | 研磨パッドのドレッシング方法 |
JP2007035973A (ja) | 2005-07-27 | 2007-02-08 | Fujitsu Ltd | 半導体装置の製造方法及び研磨装置 |
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JP4728977B2 (ja) * | 2007-02-09 | 2011-07-20 | 株式会社荏原製作所 | 定盤洗浄装置を備えた基板両面研磨機 |
CN101386149B (zh) * | 2007-09-12 | 2011-01-26 | K.C.科技股份有限公司 | 用于化学机械抛光设备的清洁装置 |
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JP5887227B2 (ja) * | 2012-08-07 | 2016-03-16 | 株式会社荏原製作所 | ドレッサーディスク洗浄用ブラシ、洗浄装置及び洗浄方法 |
-
2015
- 2015-10-29 KR KR1020150150851A patent/KR101841549B1/ko active Active
-
2016
- 2016-01-28 US US15/758,163 patent/US10737366B2/en active Active
- 2016-01-28 WO PCT/KR2016/000933 patent/WO2017073845A1/ko active Application Filing
- 2016-01-28 CN CN201680062929.4A patent/CN108352311B/zh active Active
- 2016-01-28 JP JP2018512290A patent/JP6546343B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI839075B (zh) * | 2023-01-12 | 2024-04-11 | 中國砂輪企業股份有限公司 | 研磨墊修整裝置 |
Also Published As
Publication number | Publication date |
---|---|
US10737366B2 (en) | 2020-08-11 |
KR101841549B1 (ko) | 2018-03-23 |
KR20170049926A (ko) | 2017-05-11 |
JP2018527753A (ja) | 2018-09-20 |
CN108352311A (zh) | 2018-07-31 |
US20180243882A1 (en) | 2018-08-30 |
CN108352311B (zh) | 2022-06-14 |
WO2017073845A1 (ko) | 2017-05-04 |
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