JP6509139B2 - Substrate support apparatus and method of manufacturing the same - Google Patents
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- JP6509139B2 JP6509139B2 JP2016016704A JP2016016704A JP6509139B2 JP 6509139 B2 JP6509139 B2 JP 6509139B2 JP 2016016704 A JP2016016704 A JP 2016016704A JP 2016016704 A JP2016016704 A JP 2016016704A JP 6509139 B2 JP6509139 B2 JP 6509139B2
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- 239000000758 substrate Substances 0.000 title claims description 29
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- 239000000463 material Substances 0.000 claims description 41
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- 239000000843 powder Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 5
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Description
本発明は、半導体ウエハなどの対象物を支持する基板支持装置及びその製造方法に関する。 The present invention relates to a substrate support apparatus for supporting an object such as a semiconductor wafer and a method of manufacturing the same.
半導体ウエハのプラズマ処理を行うプラズマ処理装置では、半導体ウエハを支持する基板支持装置として、支持面がセラミックス溶射膜からなる静電チャックが用いられることがある。 In a plasma processing apparatus that performs plasma processing of a semiconductor wafer, an electrostatic chuck whose support surface is formed of a ceramic sprayed film may be used as a substrate support apparatus that supports the semiconductor wafer.
静電チャックには、ヘリウムガス、アルゴンガスなどのガスを流すために、ガス流路が設けられている。ガス流路内のアーキング（異常放電）を防止するために、ガス流路を絶縁させる必要がある。 The electrostatic chuck is provided with a gas flow path for flowing a gas such as helium gas or argon gas. In order to prevent arcing (abnormal discharge) in the gas flow path, it is necessary to insulate the gas flow path.
そこで、特許文献１には、絶縁性を有し貫通孔が形成されたセラミックス多孔質体（圧入体）を、金属製の基材に形成した穴（被圧入穴）に圧入し、その後、基材及びセラミックス多孔質体の上面にセラミックス溶射膜を形成することが記載されている。 Therefore, in Patent Document 1, a ceramic porous body (press-fit body) having insulating properties and in which through-holes are formed is press-fit into a hole (press-fit hole) formed in a metal base, and then a base It is described that a ceramic sprayed film is formed on the top surface of the material and the ceramic porous body.
しかしながら、特許文献１に記載された技術では、セラミックス多孔質体を基材に形成した被圧入穴に圧入させているが、実際には、セラミックス多孔質体の先端部と被圧入穴の開口端との間に隙間が存在しなければ、圧入は非常に困難である。 However, in the technique described in Patent Document 1, although the ceramic porous body is press-fit into the press-in hole formed in the base material, actually, the open end of the ceramic porous body and the open end of the press-in hole If there is no gap between them, press-in is very difficult.
しかし、このような隙間が存在すると、基材及びセラミックス多孔質体の上面にセラミックス溶射膜を形成した際に、クラック又は窪みなどの欠陥が生じ、吸着性能が劣化する。 However, when such a gap is present, when the ceramic sprayed film is formed on the upper surface of the base material and the ceramic porous body, defects such as cracks or dents occur, and the adsorption performance is deteriorated.
本発明は、かかる事情に鑑みてなされたものであり、セラミックス溶射膜に欠陥が生じることの防止を図ることが可能な基板支持装置及びその製造方法を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate supporting apparatus capable of preventing the occurrence of defects in a ceramic sprayed film and a method for manufacturing the same.
本発明の基板支持装置は、導電性材料からなる基材と、前記基材に形成された被圧入穴に圧入され、貫通孔を有し、絶縁性材料からなる圧入体と、前記被圧入穴に圧入された前記圧入体及び前記基材の面一の上面を覆うセラミックス溶射膜とを備えた基板支持装置であって、前記被圧入穴は、開口端から連続的又は断続的に縮径しており、前記圧入体は、前記被圧入穴に圧入された際に前記被圧入穴の縮径した周壁と圧接する部分と、前記部分より大径の部分を基端に有し、前記基材の表面と前記圧入体との基端面との段差は３０μｍ以下であり、前記被圧入穴の開口端と前記圧入体の基端との隙間は、５μｍ以上６０μｍ以下であることを特徴とする。 A substrate supporting apparatus according to the present invention includes a base made of a conductive material, and a press-fit body press-fit into a press-fit hole formed in the base, having a through hole and made of an insulating material, and the press-fit hole A substrate supporting device comprising the press-fit body press-fit into the substrate and the ceramic sprayed film covering the upper surface of the base of the substrate, wherein the press-in hole is continuously or intermittently reduced in diameter from the open end The press-fit body has at its proximal end a portion to be in pressure contact with the diameter-reduced peripheral wall of the press-fit hole when pressed into the press-fit hole, and a portion larger in diameter than the portion; The step between the surface of the press-fit body and the base end face is 30 μm or less, and the gap between the open end of the press-fit hole and the base end of the press-fit body is 5 μm to 60 μm.
本発明の基板支持装置によれば、基材に形成された被圧入穴は開口端から連続的又は断続的に縮径している。この縮径により、被圧入穴に圧入する際に圧入体がガイドされるので、傾斜して圧入できないなどの事態が防止され、圧入作業の容易化を図ることが可能となる。 According to the substrate supporting apparatus of the present invention, the press-fit hole formed in the base material is continuously or intermittently reduced in diameter from the open end. This diameter reduction guides the press-fit body when press-fitting into the press-fit hole, thereby preventing a situation where the press-fit can not be performed by tilting or the like, and the press-fitting operation can be facilitated.
そして、圧入体は、被圧入穴に圧入された際に被圧入穴の縮径した周壁と圧接する部分より大径の部分を基端に有する。そのため、このような大径の部分を圧入体が備えない場合と比較して、被圧入穴の開口端と圧入体の基端との隙間を小さくすることが可能となる。そのため、被圧入穴に圧入された圧入体及び基材の上面を覆うセラミックス溶射膜に、隙間への落ち込みによるクラック、窪みなどの欠陥が生じて、吸着性能などが劣化するおそれの低下を図ることが可能となる。 Then, the press-fit body has at its proximal end a portion larger in diameter than a portion pressed against the diameter-reduced peripheral wall of the press-fit hole when pressed into the press-fit hole. Therefore, it is possible to reduce the gap between the open end of the press-fit hole and the proximal end of the press-fit body, as compared with the case where the press-fit body does not have such a large diameter portion. Therefore, defects such as cracks and depressions due to falling into gaps are generated in the ceramic spray coating covering the upper surfaces of the press-fit body and the base material press-fit into the press-fit holes, thereby reducing the possibility of deteriorating the adsorption performance. Is possible.
また、基材の表面と圧入体との基端面との段差が３０μｍ以下である。これにより、後述する実施例から明らかなように、セラミックス溶射膜にクラック、窪みなどの欠陥が生じることの解消を図ることが可能となる。なお、段差は１０μｍ以下であることが好ましい。 Moreover, the level | step difference of the surface of a base material and the base end surface of a press injection body is 30 micrometers or less. As a result, as is apparent from Examples described later, it is possible to eliminate the occurrence of defects such as cracks and depressions in the ceramic sprayed film. The level difference is preferably 10 μm or less.
さらに、被圧入穴の開口端と圧入体の基端との隙間は、５μｍ以上６０μｍ以下である。なお、この隙間は被圧入穴の開口端の直径と圧入体の基端の直径との差の１／２と定義する。 Furthermore, the gap between the open end of the press-fit hole and the proximal end of the press-fit body is 5 μm or more and 60 μm or less. This gap is defined as 1/2 of the difference between the diameter of the open end of the press-fit hole and the diameter of the proximal end of the press-fit body.
被圧入穴の開口端と圧入体の基端との隙間が５μｍ未満であると、被圧入穴に圧入する際に圧入体が良好にガイドされない。一方、被圧入穴の開口端と圧入体の基端との隙間が６０μｍを超えると、セラミックス溶射膜にクラック、窪みなどの欠陥が生じ、吸着性能などが劣化するおそれが生じる。 When the gap between the open end of the press-fit hole and the base end of the press-fit body is less than 5 μm, the press-fit body is not well guided when press-fitting into the press-fit hole. On the other hand, if the gap between the opening end of the press-in hole and the base end of the press-fit body exceeds 60 μm, defects such as cracks and dents occur in the ceramic sprayed film, and the adsorption performance may be deteriorated.
また、本発明の基板支持装置において、前記被圧入穴は、前記圧入体が前記圧入穴に圧入された際に圧接する前記周壁の部分よりも奥側に、当該部分よりも縮径した部分を有し、前記圧入体は、前記被圧入穴に圧入された際に前記被圧入穴の周壁と圧接する部分より奥側に、前記被圧入穴の周壁との間に隙間を有する部分を有することが好ましい。 Further, in the substrate supporting apparatus of the present invention, the press-fit hole is a portion having a diameter smaller than the portion on the back side of the portion of the peripheral wall pressed against when the press-fit body is press-fit into the press-fit hole. The press-fit body has a portion having a gap between the press-fit hole and the circumferential wall of the press-fit hole on the back side of the portion pressed against the circumferential wall of the press-fit hole when pressed into the press-fit hole. Is preferred.
この場合、被圧入穴と圧入体とが当接する部分を減少して、圧入の容易化を図ることが可能となる。 In this case, the portion where the press-fit hole and the press-fit body abut each other can be reduced to facilitate press-fitting.
本発明の基板支持装置の製造方法は、導電性材料からなる基材に開口端から連続的又は断続的に縮径するように形成され被圧入穴に、貫通孔を有し、絶縁性材料からなる圧入体を圧入させて、前記圧入体を部分的に前記被圧入穴の縮径した周壁に圧接させ、前記基材の表面と前記圧入体との基端面との段差を３０μｍ以下にする工程と、前記基材の表面と前記圧入体との基端面との上にセラミックス粉末を溶射してセラミックス溶射膜を形成する工程とを備えたことを特徴とする。 The method for manufacturing a substrate supporting device according to the present invention is a method of manufacturing a substrate made of a conductive material, having a through hole in a press-in hole formed to be continuously or intermittently reduced in diameter from an open end. Forming a press-fit body and pressing the press-fit body into partial contact with the peripheral wall of the press-fit hole to reduce the difference in height between the surface of the base and the base end face of the press-fit body to 30 μm or less And a step of thermally spraying a ceramic powder on the surface of the base material and the base end face of the press-fit body to form a ceramic sprayed film.
本発明の基板支持装置の製造方法によれば、基材に形成された被圧入穴は開口端から連続的又は断続的に縮径している。この縮径により、被圧入穴に圧入する際に圧入体がガイドされるので、傾斜して圧入できないなどの事態が防止され、圧入作業が容易となる。 According to the method of manufacturing a substrate support device of the present invention, the press-fit hole formed in the base material is continuously or intermittently reduced in diameter from the open end. This diameter reduction guides the press-fit body when press-fitting into the press-fit hole, thereby preventing a situation in which the press-fit can not be performed by tilting or the like, and the press-fitting operation becomes easy.
そして、圧入体は、被圧入穴に圧入された際に被圧入穴の縮径した周壁と圧接する部分より大径の部分を基端に有する。そのため、このような大径の部分を圧入体が備えない場合と比較して、被圧入穴の開口端と圧入体の基端との隙間を小さくすることが可能となる。そのため、被圧入穴に圧入された圧入体及び基材の上面を覆うセラミックス溶射膜に、隙間への落ち込みによるクラック、窪みなどの欠陥が生じて、吸着性能などが劣化するおそれの低下を図ることが可能となる。 Then, the press-fit body has at its proximal end a portion larger in diameter than a portion pressed against the diameter-reduced peripheral wall of the press-fit hole when pressed into the press-fit hole. Therefore, it is possible to reduce the gap between the open end of the press-fit hole and the proximal end of the press-fit body, as compared with the case where the press-fit body does not have such a large diameter portion. Therefore, defects such as cracks and depressions due to falling into gaps are generated in the ceramic spray coating covering the upper surfaces of the press-fit body and the base material press-fit into the press-fit holes, thereby reducing the possibility of deteriorating the adsorption performance. Is possible.
また、基材の表面と圧入体との基端面との段差が３０μｍ以下となるように圧入体を被圧入穴に圧入している。これにより、後述する実施例から明らかなように、セラミックス溶射膜にクラック、窪みなどの欠陥が生じることの解消を図ることが可能となる。 Further, the press-fit body is press-fit into the press-fit hole such that the step between the surface of the base material and the base end face of the press-fit body is 30 μm or less. As a result, as is apparent from Examples described later, it is possible to eliminate the occurrence of defects such as cracks and depressions in the ceramic sprayed film.
本発明の基板支持装置は、導電性材料からなる基材と、前記基材に形成された被圧入穴に圧入され、貫通孔を有し、絶縁性材料からなる圧入体と、前記被圧入穴に圧入された前記圧入体及び前記基材の面一の上面を覆うセラミックス溶射膜とを備えた基板支持装置であって、前記被圧入穴は、開口端から連続的又は断続的に縮径しており、前記圧入体は、前記被圧入穴に圧入された際に前記被圧入穴の縮径した周壁と圧接する部分を有し、前記基材の表面と前記圧入体との基端面との段差は３０μｍ以下であることを特徴とする。 A substrate supporting apparatus according to the present invention includes a base made of a conductive material, and a press-fit body press-fit into a press-fit hole formed in the base, having a through hole and made of an insulating material, and the press-fit hole A substrate supporting device comprising the press-fit body press-fit into the substrate and the ceramic sprayed film covering the upper surface of the base of the substrate, wherein the press-in hole is continuously or intermittently reduced in diameter from the open end The press-fit body has a portion to be in pressure contact with the diameter-reduced peripheral wall of the press-fit hole when pressed into the press-fit hole, and the surface of the base and the proximal end face of the press-fit body The difference in level is 30 μm or less.
本発明の基板支持装置によれば、基材に形成された被圧入穴は開口端から連続的又は断続的に縮径している。この縮径により、被圧入穴に圧入する際に圧入体がガイドされるので、傾斜して圧入できないなどの事態が防止され、圧入作業の容易化を図ることが可能となる。 According to the substrate supporting apparatus of the present invention, the press-fit hole formed in the base material is continuously or intermittently reduced in diameter from the open end. This diameter reduction guides the press-fit body when press-fitting into the press-fit hole, thereby preventing a situation where the press-fit can not be performed by tilting or the like, and the press-fitting operation can be facilitated.
そして、基材の表面と圧入体との基端面との段差が３０μｍ以下である。これにより、後述する実施例から明らかなように、セラミックス溶射膜にクラック、窪みなどの欠陥が生じることの解消を図ることが可能となる。なお、段差は１０μｍ以下であることが好ましい。 And the level | step difference of the surface of a base material and the base end surface of a press injection body is 30 micrometers or less. As a result, as is apparent from Examples described later, it is possible to eliminate the occurrence of defects such as cracks and depressions in the ceramic sprayed film. The level difference is preferably 10 μm or less.
（静電チャックの構造）
まず、本発明の基板支持装置の実施形態に係る静電チャック１００について図１乃至図３を参照して、説明する。
(Structure of electrostatic chuck)
First, an electrostatic chuck 100 according to an embodiment of a substrate supporting apparatus of the present invention will be described with reference to FIGS. 1 to 3.
静電チャック１００は、半導体製造装置、フラットパネルディスプレイ製造装置などにおいて半導体ウエハ等を固定するために使用される。図１には、静電チャック１００のガス流路の部分が示されている。このようなガス流路は、静電チャック１００に複数個形成されている。静電チャック１００は、図示しないが、全体として略円盤形状に形成されている。 The electrostatic chuck 100 is used to fix a semiconductor wafer or the like in a semiconductor manufacturing apparatus, a flat panel display manufacturing apparatus, or the like. A portion of the gas flow path of the electrostatic chuck 100 is shown in FIG. A plurality of such gas flow paths are formed in the electrostatic chuck 100. Although not shown, the electrostatic chuck 100 is formed in a substantially disk shape as a whole.
静電チャック１００は、導電性材料からなる基材１０と、基材１０に形成された被圧入穴１１に圧入され、貫通孔を有し、絶縁性材料からなる圧入体２０と、被圧入穴１１に圧入された圧入体２０及び基材１０の面一の上面を覆うセラミックス溶射膜３０とを備えている。 The electrostatic chuck 100 includes a base 10 made of a conductive material, a press-fit hole 11 formed in the base 10 and a press-fit body 20 having a through hole and made of an insulating material, and a press-fit hole A ceramic sprayed film 30 is provided which covers the upper surface of the press-fit body 20 pressed into 11 and the flush upper surface of the base material 10.
基材１０は、例えば、アルミニウム、モリブデン等の金属、又はアルミニウム、シリコンなどの金属と炭化珪素、酸化アルミニウムなどのセラミックスとの複合体から構成されている。基材１０は、全体として略円盤状に形成されている。 The base 10 is made of, for example, a metal such as aluminum or molybdenum, or a composite of a metal such as aluminum or silicon and a ceramic such as silicon carbide or aluminum oxide. The base 10 is formed in a substantially disc shape as a whole.
基材１０には、圧入体２０が圧入される被圧入穴１１が形成されている。被圧入穴１１は、本実施形態では、基材１０内に形成された図示しない中空構造の内腔と連通する穴である。ただし、被圧入穴１１は、基材１０の上面から下面まで貫通する貫通孔であってもよい。 The base 10 is formed with a press-fit hole 11 into which the press-fit body 20 is press-fitted. In the present embodiment, the press-fit hole 11 is a hole that communicates with a not-shown hollow structure formed in the base material 10. However, the press-fit holes 11 may be through holes penetrating from the upper surface to the lower surface of the base material 10.
被圧入穴１１は、開口端から連続的又は断続的に縮径している。被圧入穴１１は、本実施形態では、圧入体２０の外周壁と密着する内周壁を有する被圧入穴部１１ａと、開口端に位置し、被圧入穴部１１ａの直径Ｄａよりも僅かに大きな直径Ｄｂを有する拡径穴部１１ｂとを備えている。被圧入穴部１１ａの直径Ｄａは、例えば、１ｍｍ以上１２ｍｍ以下が好ましい。そして、被圧入穴部１１ａと拡径穴部１１ｂの間には段差が形成されている。ただし、被圧入穴部１１ａと拡径穴部１１ｂの間にはテーパ状などの壁面が形成されているものであってもよい。 The press-fit hole 11 is continuously or intermittently reduced in diameter from the open end. In the present embodiment, the press-fit hole 11 is located at the opening end and a press-fit hole portion 11a having an inner peripheral wall in close contact with the outer peripheral wall of the press-fit body 20, and slightly larger than the diameter Da of the press-fit hole portion 11a. And an enlarged diameter hole 11b having a diameter Db. The diameter Da of the press-fit hole 11a is preferably, for example, 1 mm or more and 12 mm or less. A step is formed between the press-fit hole 11a and the enlarged diameter hole 11b. However, a tapered wall or the like may be formed between the press-fit hole 11a and the enlarged diameter hole 11b.
被圧入穴１１は、さらに、被圧入穴部１１ａより奥方（図１の下方）側に位置し、被圧入穴部１１ａの直径Ｄａよりも小さな直径Ｄｃを有する縮径穴部１１ｃも備えている。これにより、被圧入穴１１は、圧入体２０が被圧入穴１１に圧入された際に圧接する被圧入穴部１１ａよりも奥側に、当該被圧入穴部１１ａよりも縮径した部分である縮径穴部１１ｃを有している。そして、被圧入穴部１１ａと縮径穴部１１ｃの間にはテーパ状の壁面が形成されている。ただし、被圧入穴部１１ａと縮径穴部１１ｃの間に段差が形成されているものであってもよい。縮径穴部１１ｃは圧入体２０の圧入深さ過大を防止する機能もあるが、被圧入穴１１は縮径穴部１１ｃを備えないものであってもよい。 The press-fit hole 11 is further provided with a diameter-reduced hole portion 11c located on the back side (downward in FIG. 1) side of the press-fit hole portion 11a and having a diameter Dc smaller than the diameter Da of the press-fit hole portion 11a. . Thus, the press-fit hole 11 is a portion having a diameter smaller than that of the press-fit hole 11a on the back side of the press-fit hole 11a that is pressed against when the press-fit body 20 is press-fit into the press-fit hole 11. It has a diameter reducing hole 11c. A tapered wall is formed between the press-fit hole 11a and the diameter-reduced hole 11c. However, a step may be formed between the press-fit hole 11a and the diameter-reduced hole 11c. Although the diameter reducing hole 11c has a function of preventing the press-fitting depth of the press-fitting body 20 from being excessive, the press-fit hole 11 may not have the diameter-reducing hole 11c.
圧入体２０は、絶縁性材料からなり、基材１０の被圧入穴１１に圧入されるプラグである。圧入体２０は、全体として、大略円柱形状であり、軸心を中心として軸心方向に貫通する貫通孔２１が形成されている。また、圧入体２０の先端面（図１の下方側の面）には凹部２２が形成されている場合がある。貫通孔２１と凹部２２でガス流路のコンダクタンスを調整する機能がある。 The press-fit body 20 is a plug made of an insulating material and press-fit into the press-fit hole 11 of the base 10. The press-fit body 20 has a generally cylindrical shape as a whole, and a through hole 21 penetrating in the axial direction centering on the axial center is formed. Moreover, the recessed part 22 may be formed in the front end surface (surface of the downward side of FIG. 1) of the press-fit body 20. As shown in FIG. The through hole 21 and the recess 22 have a function of adjusting the conductance of the gas flow path.
圧入体２０は、Ａｌ２Ｏ３、ＳｉＯ２、ＺｒＯ２もしくはＹ２Ｏ３又はこれらの複合材などからなるセラミックス多孔質体から形成されることが好ましい。ただし、圧入体２０は、Ａｌ２Ｏ３、ＳｉＯ２、ＺｒＯ２もしくはＹ２Ｏ３又はこれらの複合材などからなるセラミックス緻密質体から形成されていてもよい。 The press-fit body 20 is preferably formed of a ceramic porous body made of Al 2 O 3 , SiO 2 , ZrO 2 or Y 2 O 3, or a composite material of these. However, the press-fit body 20 may be formed of a ceramic dense body made of Al 2 O 3 , SiO 2 , ZrO 2 or Y 2 O 3 or a composite material of these.
例えば、Ａｌ２Ｏ３からら圧入体２０を形成する場合、Ａｌ２Ｏ３の純度は９９．５％以上であることが好ましく、９９．９％以上であればさらに好ましい。純度が高いほど、半導体ウエハ等への汚染を防止することが可能となる。 For example, when an Al 2 O 3 Carrara pressed body 20, it is preferable that the purity of Al 2 O 3 99.5% or more, further preferably equal to 99.9%. As the purity is higher, it is possible to prevent contamination of semiconductor wafers and the like.
そして、圧入体２０は、被圧入穴１１に圧入された際に被圧入穴部１１ａの周壁と圧接する部分である基部２０ａと、基部２０ａの直径ｄａよりも大きな直径ｄｂを有し、基端に位置する拡径部２０ｂとを備えている。そして、基部２０ａと拡径部２０ｂの間には段差が形成されている。ただし、基部２０ａと拡径部２０ｂの間はテーパ状などに形成されているものであってもよい。ただし、被圧入穴１１の開口端と圧入体２０の基端との間に所定の隙間が形成されるのであれば、拡径部２０ｂは省略してもよい。 The press-fit body 20 has a base 20a which is a portion pressed against the peripheral wall of the press-fit hole 11a when press-fitted into the press-fit hole 11, and a diameter db larger than the diameter da of the base 20a. And an enlarged diameter portion 20b located on the And a level | step difference is formed between the base 20a and the enlarged diameter part 20b. However, the space between the base portion 20a and the enlarged diameter portion 20b may be tapered. However, if a predetermined gap is formed between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20, the enlarged diameter portion 20b may be omitted.
被圧入穴部１１ａの直径Ｄａと基部２０ａの直径ｄａとは、基部２０ａが被圧入穴部１１ａに圧入された際に、締り嵌めとなるような寸法に設定されている。本実施形態では、基部２０ａが被圧入穴部１１ａの全体に亘って圧入されるのではなく、それぞれの一部において圧入されるように構成されている。 The diameter Da of the press-fit hole 11a and the diameter da of the base 20a are set to dimensions such that an interference fit is achieved when the base 20a is press-fit into the press-fit hole 11a. In the present embodiment, the base portion 20a is not press-fit over the entire press-fit hole 11a, but is configured to be press-fit in part of each.
圧入体２０は、さらに、基部２０ａの直径ｄａよりも小さな直径ｄｃを有し、先端側に位置する縮径部２０ｃをも備えている。圧入体２０は、被圧入穴１１に圧入された際に被圧入穴部１１ａと圧接する基部２０ａより先端側に、縮径穴部１１ｃとの間に隙間を有する部分である縮径部２０ｃを有している。そして、基部２０ａと縮径部２０ｃの間には段差が形成されている。ただし、基部２０ａと縮径部２０ｃの間はテーパ状などに形成されているものであってもよい。 The press-fit body 20 further has a diameter dc smaller than the diameter da of the base 20a, and also includes a reduced diameter portion 20c located on the tip side. The press-fit body 20 has a reduced diameter portion 20c, which is a portion having a gap with the diameter-reduced hole portion 11c on the tip end side from the base 20a which is in pressure contact with the press-fit hole 11a when pressed into the press-fit hole 11. Have. And a level | step difference is formed between the base 20a and the diameter reduction part 20c. However, between the base 20a and the reduced diameter portion 20c may be formed in a tapered shape or the like.
拡径穴部１１ｂの直径Ｄｂは、圧入体２０が被圧入穴１１に圧入された際に、基部２０ａと接触しないような隙間を有するように設定されている。例えば、拡径穴部１１ｂの直径Ｄｂは、被圧入穴部１１ａの直径よりも２０μｍ以上大きいことが好ましいが、圧入体２０の被圧入穴１１への挿入ガイドの機能を奏するのであればこの限りではない。 The diameter Db of the enlarged diameter hole portion 11 b is set to have a gap that does not contact the base portion 20 a when the press-fit body 20 is press-fit into the press-fit hole 11. For example, the diameter Db of the enlarged diameter hole portion 11b is preferably larger than the diameter of the press-fit hole portion 11a by 20 μm or more, but as long as the function of the insertion guide to the press-fit hole 11 of the press-fit body 20 is exhibited is not.
拡径穴部１１ｂの直径Ｄｂは、圧入体２０が被圧入穴１１に圧入された際に、拡径部２０ｂとも接触しないような隙間を有するように設定されている。そして、これにより、被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、例えば、５μｍ以上６０μｍ以下であることが好ましく、１０μｍ以上５０μｍ以下であることがより好ましい。 The diameter Db of the enlarged diameter hole portion 11 b is set so as to have a gap that does not come in contact with the enlarged diameter portion 20 b when the press-fit body 20 is pressed into the pressed-in hole 11. And thereby, it is preferable that they are 5 micrometers or more and 60 micrometers or less, for example, and, as for the clearance gap s of the opening end of the press-fit hole 11 and the base end of the press injection body 20, it is more preferable that they are 10 micrometers or more 50 micrometers or less.
縮径穴部１１ｃの直径Ｄｃと縮径部２０ｃの直径ｄｃとは、圧入体２０が被圧入穴１１に圧入される際に、圧入を妨げないような寸法に設定されている。縮径穴部１１ｃと縮径部２０ｃとの間の隙間は、数ｍｍ程度であってもよい。なお、圧入体２０は縮径部２０ｃを備えないものであってもよい。 The diameter Dc of the reduced diameter hole portion 11c and the diameter dc of the reduced diameter portion 20c are set so as not to prevent the press fit when the press fit body 20 is pressed into the press fit hole 11. The clearance between the diameter reducing hole 11 c and the diameter reducing portion 20 c may be about several mm. The press-fit body 20 may not include the diameter-reduced portion 20c.
被圧入穴１１に圧入された圧入体２０の基端面及び基材１０の上面とは面一となっている。ただし、この部分には、３０μｍ以下であれば、段差ｈ（不図示）があってもよい。 The base end face of the press-fit body 20 press-fit into the press-fit hole 11 and the upper surface of the base 10 are flush with each other. However, a step h (not shown) may be present in this portion as long as it is 30 μm or less.
セラミックス溶射膜３０は、被圧入穴１１に圧入された圧入体２０及び基材１０の面一の上面を覆っている。セラミックス溶射膜３０は、Ａｌ２Ｏ３、Ｙ２Ｏ３、ＺｒＯ２などのセラミックス粉末又はこれらを主成分とした複合物からなるセラミックス複合物粉末が溶射により形成されている。 The ceramic sprayed film 30 covers the flush upper surface of the press-fit body 20 and the base material 10 which are press-fit into the press-fit holes 11. The ceramic sprayed film 30 is formed by thermal spraying ceramic powder such as ceramic powder such as Al 2 O 3 , Y 2 O 3 and ZrO 2 or a composite mainly composed of these.
セラミックス溶射膜３０の厚みは、１００μｍ以上１０００μｍ以下であることが好ましい。セラミックス溶射膜３０には、その上面から下面に亘り、圧入体２０の貫通孔２１に挿通する貫通孔３１が形成されている。このセラミックス溶射膜３０の貫通孔３１と圧入体２０の貫通孔２１とで、ガス流路を形成する。このように、基材１０に露出しないガス流路を確保することにより、ガス流路の絶縁性が確保され、アーキングの発生を防止することが可能となる。 The thickness of the ceramic sprayed film 30 is preferably 100 μm or more and 1000 μm or less. A through hole 31 is formed in the ceramic sprayed film 30 from the upper surface to the lower surface to be inserted into the through hole 21 of the press-fit body 20. A gas flow path is formed by the through holes 31 of the ceramic spray coating 30 and the through holes 21 of the press-fit body 20. As described above, by securing the gas flow path which is not exposed to the base material 10, the insulation property of the gas flow path is secured, and it becomes possible to prevent the occurrence of arcing.
（静電チャックの製造方法）
次に、本発明の基板支持装置に係る静電チャック１００の製造方法について説明する。
(Method of manufacturing electrostatic chuck)
Next, a method of manufacturing the electrostatic chuck 100 according to the substrate supporting apparatus of the present invention will be described.
まず、金属又は金属とセラミックスとの複合体から形成された略円盤状の基材１０を用意する。この基材１０には、研削加工及び研磨加工によって被圧入穴１１を形成しておく。 First, a substantially disk-shaped substrate 10 formed of a metal or a composite of a metal and a ceramic is prepared. Press-fit holes 11 are formed in the base 10 by grinding and polishing.
また、セラミックス多孔質体又はセラミックス緻密質体からなる圧入体２０を用意する。この圧入体２０には、研削加工及び研磨加工によって形成されたものである。 Further, a press-fit body 20 made of a ceramic porous body or a ceramic dense body is prepared. The press-fit body 20 is formed by grinding and polishing.
そして、基材１０の被圧入穴１１に圧入体２０を圧入させる。このとき、被圧入穴１１の開口端は拡径穴部１１ｂにより、圧入体２０の基部２０ａがガイドされるので、圧入体２０が傾斜して圧入できないなどの事態が防止され、圧入作業の容易化を図ることが可能となる。 Then, the press-fit body 20 is press-fit into the press-fit hole 11 of the base material 10. At this time, since the base 20a of the press-fit body 20 is guided by the enlarged diameter hole portion 11b at the open end of the press-fit hole 11, a situation where the press-fit body 20 is inclined and can not be press-fit is prevented. It is possible to achieve
被圧入穴１１に圧入体２０を圧入させる際、圧入体２０の基端面より大きな平坦面を有するプレス装置を用いる。これにより、基材１０の表面と圧入体２０の基端面とを面一にすることが可能となる。ただし、圧入体２０の極微小な弾性変形により、基材１０の表面と圧入体２０の基端面とを完全に面一にすることは困難である。そこで、これらの間の段差ｈを３０μｍ以下にすればよい。 When the press-fit body 20 is press-fit into the press-fit hole 11, a press device having a flat surface larger than the base end face of the press-fit body 20 is used. This makes it possible to make the surface of the base 10 and the base end face of the press-fit body 20 flush with each other. However, it is difficult to completely make the surface of the base 10 and the base end face of the press-fit body 20 flush with each other due to the extremely small elastic deformation of the press-fit body 20. Therefore, the difference in height h between them may be 30 μm or less.
その後、被圧入穴１１に圧入された圧入体２０及び基材１０の上面に、セラミックス粉末又はセラミックス複合物粉末を溶射して、セラミックス溶射膜３０を形成する。 Thereafter, the ceramic powder or the ceramic composite powder is thermally sprayed on the upper surfaces of the press-fit body 20 and the base material 10 pressed into the press-fit holes 11 to form the ceramic sprayed film 30.
そして、セラミックス溶射膜３０に、その上面から下面に亘り、圧入体２０の貫通孔２１に挿通する貫通孔３１を研削加工により形成する。 Then, through holes 31 to be inserted into the through holes 21 of the press-fit body 20 are formed in the ceramic sprayed film 30 by grinding from the upper surface to the lower surface.
本実施形態において、圧入体２０は拡径部２０ｂを基端に有する。そのため、このような拡径部２０ｂを圧入体２０が備えない場合と比較して、被圧入穴１１の開口端と圧入体２０の基端との隙間ｓを小さくすることが可能となる。そのため、被溶射時の隙間ｓへの落ち込みによって被圧入穴１１に圧入された圧入体２０及び基材１０の上面を覆うセラミックス溶射膜３０にクラック、窪みなどの欠陥が生じ、静電チャック１００の吸着性能などが劣化するおそれの低下を図ることが可能となる。 In the present embodiment, the press-fit body 20 has the enlarged diameter portion 20 b at the proximal end. Therefore, it is possible to reduce the gap s between the open end of the press-fit hole 11 and the base end of the press-fit body 20 as compared to the case where the press-fit body 20 does not include such an enlarged diameter portion 20 b. Therefore, defects such as cracks and depressions occur in the ceramic sprayed film 30 covering the upper surfaces of the press-fit body 20 and the base 10 pressed into the press-fit hole 11 due to the fall into the gap s at the time of thermal spraying. It becomes possible to aim at the fall of a possibility that adsorption performance etc. may deteriorate.
また、基材１０の表面と圧入体２０との基端面との間の段差ｈは３０μｍ以下であるので、後述する実施例から明らかなように、セラミックス溶射膜３０にクラック、窪みなどの欠陥が生じることの解消を図ることが可能となる。 Further, since the step h between the surface of the base material 10 and the base end face of the press-fit body 20 is 30 μm or less, defects such as cracks and dents in the ceramic sprayed film 30 are apparent from Examples to be described later. It becomes possible to aim at the elimination of what happens.
（静電チャックの構造の変形例）
本発明の基板支持装置は、上述した実施形態に係る静電チャック１００に限定されない。
(Modified example of structure of electrostatic chuck)
The substrate support apparatus of the present invention is not limited to the electrostatic chuck 100 according to the above-described embodiment.
例えば、被圧入穴１１又は圧入体２０の角部は、丸みを帯びていても、面取りが施されていてもよい。また、被圧入穴１１又は圧入体２０のテーパは、直線的であっても曲線的であってもよい。 For example, the corners of the press-fit hole 11 or the press-fit body 20 may be rounded or chamfered. In addition, the taper of the press-in hole 11 or the press-in body 20 may be linear or curved.
さらに、例えば図４に示すように、被圧入穴１１が被圧入穴部１１ａと縮径穴部１１ｃとの間に、被圧入穴部１１ａの直径Ｄａよりも大きな直径Ｄｄを有する拡径穴部１１ｄを有するものであってもよい。このような拡径穴部１１ｄが存在することにより、被圧入穴１１と圧入体２０との圧入深さが短くなり、圧入作業の容易化を図ることが可能となる。 Furthermore, for example, as shown in FIG. 4, the diameter-increased hole 11 has a diameter Dd larger than the diameter Da of the pressure-inserted hole 11a between the pressure-inserted hole 11a and the diameter-reduced hole 11c. It may have 11 d. By the presence of such an enlarged diameter hole portion 11d, the press-fitting depth of the press-fit hole 11 and the press-fitting body 20 becomes short, and the press-fitting operation can be facilitated.
また、被圧入穴部１１ａの直径Ｄａと基部２０ａの直径ｄａとは、基部２０ａが被圧入穴部１１ａに圧入された際に、中間嵌めとなるような寸法に設定してもよい。 Further, the diameter Da of the press-fit hole 11a and the diameter da of the base 20a may be set to be an intermediate fit when the base 20a is press-fit into the press-fit hole 11a.
(圧入体の製作）
圧入体２０の原料粉末として、純度９９．９％以上、平均粒径２０μｍのＡｌ２Ｏ３セラミックス粉末を用意した。そして、この原料粉末を成形型に入れて１６００度で２時間、５ＭＰａでホットプレス焼成して、気孔率２３％、平均気孔穴径３μｍのアルミナ多孔質体を得た。
(Production of press-fit body)
As a raw material powder of the press-fit body 20, Al 2 O 3 ceramic powder having a purity of 99.9% or more and an average particle diameter of 20 μm was prepared. Then, this raw material powder was put into a molding die and subjected to hot press baking at 5 ° C. for 2 hours at 1600 ° C. to obtain an alumina porous body having a porosity of 23% and an average pore diameter of 3 μm.
別の圧入体２０の原料粉末として、純度９９．５％以上、平均粒径０．５μｍのＡｌ２Ｏ３セラミックス粉末を用意した。そして、この原料粉末を成形型に入れて１６００度で２時間、常圧焼成して、気孔率１％以下、平均気孔穴径１μｍ以下のアルミナ焼結体を得た。 As another raw material powder of the press-fit body 20, Al 2 O 3 ceramic powder having a purity of 99.5% or more and an average particle diameter of 0.5 μm was prepared. Then, this raw material powder was put into a molding die and fired under atmospheric pressure at 1600 ° C. for 2 hours to obtain an alumina sintered body having a porosity of 1% or less and an average pore diameter of 1 μm or less.
そして、これらに研削加工及び研磨加工を施して、３０個の圧入体２０を形成した。圧入体２０の軸心には直径０．５ｍｍの貫通孔２１を形成した。 Then, they were ground and polished to form 30 press-fit bodies 20. A through hole 21 with a diameter of 0.5 mm was formed in the axial center of the press-fit body 20.
(基材の製作）
基材１０の素材１として、アルミニウム合金（Ａ６０６１）からなり、直径３００ｍｍ、厚み５０ｍｍの円盤状のものを用意した。そして、これに研削加工及び研磨加工を施して、３０個の上下面を貫通した被圧入穴１１を形成した。
(Production of base material)
As a raw material 1 of the base material 10, a disc-like material made of an aluminum alloy (A6061) and having a diameter of 300 mm and a thickness of 50 mm was prepared. Then, this was subjected to grinding and polishing to form press-fit holes 11 penetrating the 30 upper and lower surfaces.
基材１０の別素材２として、ステンレス鋼（ＳＵＳ３０４）からなり、直径３００ｍｍ、厚み５０ｍｍの円盤状のものを用意した。そして、これに研削加工及び研磨加工を施して、３０個の上下面を貫通した被圧入穴１１を形成した。 As another raw material 2 of the base material 10, a disk-shaped one made of stainless steel (SUS 304) and having a diameter of 300 mm and a thickness of 50 mm was prepared. Then, this was subjected to grinding and polishing to form press-fit holes 11 penetrating the 30 upper and lower surfaces.
(圧入）
プレス装置を用いて、圧入体２０をそれぞれ被圧入穴１１に圧入させた。
(Press fit)
The press-fit bodies 20 were press-fit into the press-fit holes 11 respectively using a press device.
(溶射膜の製作）
セラミックス溶射膜３０の原料粉末として、純度９９．９％、平均粒径２０μｍのＡｌ２Ｏ３セラミックス粉末を用意した。そして、この原料粉末を、被圧入穴１１に圧入された圧入体２０及び基材１０の上面に溶射して、厚さ２５０μｍのセラミックス溶射膜３０を形成した。そして、最後に、セラミックス溶射膜３０に直径０．５ｍｍの貫通孔３１を形成した。
(Production of sprayed film)
An Al 2 O 3 ceramic powder having a purity of 99.9% and an average particle diameter of 20 μm was prepared as a raw material powder of the ceramic sprayed film 30. Then, the raw material powder was sprayed on the upper surfaces of the press-fit body 20 and the base material 10 pressed into the press-fit holes 11 to form a ceramic sprayed film 30 with a thickness of 250 μm. Finally, through holes 31 with a diameter of 0.5 mm were formed in the ceramic sprayed film 30.
(溶射膜製作後の加工）
セラミックス溶射膜３０の表面を研削加工、研磨加工により調整後、圧入体２０に形成した貫通孔２１の直上のセラミックス溶射膜３０に直径０．５ｍｍの穴を貫通させる加工を行って貫通孔３１を形成し、セラミックス溶射膜３０の表面と圧入体２０の流路とを接続した。
(Processing after producing the sprayed film)
After adjusting the surface of the ceramic sprayed film 30 by grinding and polishing, the ceramic sprayed film 30 immediately above the through hole 21 formed in the press-fit body 20 is processed to penetrate a hole with a diameter of 0.5 mm. Then, the surface of the ceramic sprayed film 30 and the flow path of the press-fit body 20 were connected.
（実施例１）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、各被圧入穴１１は、被圧入穴部１１ａが直径Ｄａ３．９６２４ｍｍで深さＬａ３．３０２ｍｍ、拡径穴部１１ｂが直径Ｄｂ４．２４８ｍｍで深さＬｂ１．７７８ｍｍ、縮径穴部１１ｃが直径Ｄｃ３．５０５ｍｍで深さＬｃ１５ｍｍであった。被圧入穴部１１ａと拡径穴部１１ｂとの間には段差を形成し、被圧入穴部１１ａと縮径穴部１１ｃとの間には４５度のテーパ面を形成した。
Example 1
The base material 10 is made of an aluminum alloy (A6061), and each press-fit hole 11 has a diameter Da of 3.9624 mm and a depth of La 3.302 mm, and a diameter enlarged hole 11 b of a diameter Db of 4.248 mm. Lb 1.778 mm, diameter reduction hole 11 c had a diameter Dc of 3.505 mm and a depth Lc of 15 mm. A step was formed between the press-fit hole 11a and the enlarged diameter hole 11b, and a 45 ° tapered surface was formed between the press-fit hole 11a and the diameter reduced hole 11c.
圧入体２０は、アルミナ多孔質体からなり、基部２０ａが直径ｄａ３．９８８ｍｍで長さｌａ３．０ｍｍ、拡径部２０ｂが直径ｄｂ４．１８８ｍｍで長さｌｂ１．５ｍｍ、縮径部２０ｃが直径ｄｃ３．０ｍｍで長さｌｃ８ｍｍであった。基部２０ａと拡径部２０ｂとの間及び基部２０ａと縮径部２０ｃとの間にはそれぞれ段差を形成した。 The press-fit body 20 is made of an alumina porous body, and the base 20a has a diameter of da 3.988 mm and a length of la 3.0 mm, the enlarged diameter portion 20b has a diameter of db 4.188 mm, a length lb of 1.5 mm, and the diameter reduced portion 20c has a diameter dc3. The length was 0 mm and lc was 8 mm. A step was formed between the base 20a and the enlarged diameter portion 20b and between the base 20a and the reduced diameter portion 20c.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、３０μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 30 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大１５μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 15 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例２）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、各被圧入穴１１は、被圧入穴部１１ａが直径Ｄａ２．４７４ｍｍで深さＬａ２．７ｍｍ、拡径穴部１１ｂが直径Ｄｂ２．５５０ｍｍで深さＬｂ０．９ｍｍ、縮径穴部１１ｃが直径Ｄｃ２．３５０ｍｍで深さＬｃ１０ｍｍであった。
(Example 2)
The base 10 is made of an aluminum alloy (A6061), and each press-fit hole 11 has a diameter of Da 2.474 mm and a depth of La 2.7 mm, and a diameter-enlarged hole portion 11 b of a diameter Db of 2.550 mm. Lb 0.9 mm, diameter reduction hole 11 c had a diameter Dc of 2.350 mm and a depth Lc of 10 mm.
圧入体２０は、、アルミナ多孔質体からなり基部２０ａが直径ｄａ２．４８９ｍｍで長さｌａ２．３８８ｍｍ、拡径部２０ｂが直径ｄｂ２．５１４６ｍｍで長さｌｂ０．６６０ｍｍ、縮径部２０ｃが直径ｄｃ２．０ｍｍで長さｌｃ７．６２ｍｍであった。 The press-fit body 20 is an alumina porous body, and a base 20a has a diameter da 2.489 mm and a length la 2.388 mm, an enlarged diameter portion 20b a diameter db 2.5146 mm and a length lb 0.660 mm, and a diameter reduced portion 20 c a diameter dc2. The length was 0 mm and lc was 7.62 mm.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、１８μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 18 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大１０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 10 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例３）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、拡径穴部１１ｂが直径Ｄｂ２．６３４ｍｍであること以外は、実施例２と同じとした。圧入体２０は、実施例２と同じものを用いた。
(Example 3)
The base 10 was made of an aluminum alloy (A6061), and the same as Example 2 except that the diameter-increased hole 11b had a diameter Db of 2.634 mm. As the press-fit body 20, the same one as in Example 2 was used.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、６０μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 60 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大１０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 10 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例４）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、拡径穴部１１ｂが直径Ｄｂ２．６１４ｍｍであること以外は、実施例２と同じとした。圧入体２０は、実施例２と同じものを用いた。
(Example 4)
The base 10 was made of an aluminum alloy (A6061), and the same as Example 2 except that the diameter-expanded hole 11b had a diameter Db of 2.614 mm. As the press-fit body 20, the same one as in Example 2 was used.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、５０μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 50 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大１５μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 15 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例５）
圧入体２０の素材がアルミナ焼結体であること以外は、実施例２と同じとした。
(Example 5)
The same as Example 2 except that the material of the press-fit body 20 is an alumina sintered body.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、１８μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 18 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大１０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 10 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例６）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、拡径穴部１１ｂが直径Ｄｂ２．５２５ｍｍであること以外は、実施例２と同じとした。圧入体２０は、実施例２と同じものを用いた。
(Example 6)
The base 10 was made of an aluminum alloy (A6061), and the same as Example 2 except that the diameter-increased hole 11b had a diameter Db of 2.525 mm. As the press-fit body 20, the same one as in Example 2 was used.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、５μｍであった。 The clearance s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 5 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大５μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 5 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例７）
基材１０は、ステンレス鋼（ＳＵＳ３０４）であること以外は、実施例２と同じとした。圧入体２０は、実施例２と同じものを用いた。
(Example 7)
The base 10 is the same as that of Example 2 except that it is stainless steel (SUS304). As the press-fit body 20, the same one as in Example 2 was used.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、１８μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 18 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大３０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 30 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（実施例８）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、各被圧入穴１１は、被圧入穴部１１ａが直径Ｄａ３．９６２４ｍｍで深さＬａ３．３０２ｍｍ、拡径穴部１１ｂが直径Ｄｂ４．０２８ｍｍで深さＬｂ１．７７８ｍｍ、縮径穴部１１ｃが直径Ｄｃ３．５０５ｍｍで深さＬｃ１５ｍｍであった。被圧入穴部１１ａと拡径穴部１１ｂとの間には段差を形成し、被圧入穴部１１ａと縮径穴部１１ｃとの間には４５度のテーパ面を形成した。
(Example 8)
The base 10 is made of an aluminum alloy (A6061), and each of the press-fit holes 11 has a diameter Da of 3.9624 mm and a depth of La 3.302 mm, and the diameter enlarged hole 11 b of a diameter Db of 4.028 mm. Lb 1.778 mm, diameter reduction hole 11 c had a diameter Dc of 3.505 mm and a depth Lc of 15 mm. A step was formed between the press-fit hole 11a and the enlarged diameter hole 11b, and a 45 ° tapered surface was formed between the press-fit hole 11a and the diameter reduced hole 11c.
圧入体２０は、アルミナ多孔質体からなり、基部２０ａが直径ｄａ３．９８８ｍｍで長さｌａ３．０ｍｍ、拡径部２０ｂは省略した。縮径部２０ｃが直径ｄｃ３．０ｍｍで長さｌｃ８ｍｍであった。基部２０ａと縮径部２０ｃとの間にはそれぞれ段差を形成した。 The press-fit body 20 is made of an alumina porous body, and the base 20a has a diameter of da 3.988 mm, a length la of 3.0 mm, and the enlarged diameter portion 20b is omitted. The reduced diameter portion 20c had a diameter of dc 3.0 mm and a length lc of 8 mm. A step was formed between the base 20a and the reduced diameter portion 20c.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、２０μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 20 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大１０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 10 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラック、窪みなどの欠陥を発見することはできなかった。 When the surface of the ceramic sprayed film 30 was visually observed, it was not possible to find defects such as cracks and depressions.
（比較例１）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、拡径穴部１１ｂが直径Ｄｂ２．５２４６ｍｍであること以外は、実施例２と同じとした。圧入体２０は、実施例２と同じものを用いた。
(Comparative example 1)
The base 10 was made of an aluminum alloy (A6061), and the same as Example 2 except that the diameter-increased hole 11b had a diameter Db of 2.5246 mm. As the press-fit body 20, the same one as in Example 2 was used.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、５μｍであった。 The clearance s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 5 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大７０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 70 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラックが発生していた。 When the surface of the ceramic sprayed film 30 was visually observed, a crack was generated.
（比較例２）
基材１０は、アルミニウム合金（Ａ６０６１）からなり、拡径穴部１１ｂが直径Ｄｂ２．６５５ｍｍであること以外は、実施例２と同じとした。圧入体２０は、実施例２と同じものを用いた。
(Comparative example 2)
The base 10 is made of an aluminum alloy (A6061), and is the same as Example 2 except that the diameter-increased hole 11b has a diameter Db of 2.655 mm. As the press-fit body 20, the same one as in Example 2 was used.
被圧入穴１１の開口端と圧入体２０の基端との隙間ｓは、７０μｍであった。 The gap s between the open end of the press-fit hole 11 and the proximal end of the press-fit body 20 was 70 μm.
圧入後の基材１０の表面と圧入体２０との基端面との間の段差ｈは、最大３０μｍであった。 The difference in height h between the surface of the base material 10 after press fitting and the base end face of the press-fit body 20 was 30 μm at maximum.
セラミックス溶射膜３０の表面を目視で観察したところ、クラックが発生していた。 When the surface of the ceramic sprayed film 30 was visually observed, a crack was generated.
１０…基材、 １１…被圧入穴、 １１ａ…被圧入穴部、 １１ｂ…拡径穴部、 １１ｃ…縮径穴部、 １１ｄ…拡径穴部、 ２０…圧入体、 ２０ａ…基部、 ２０ｂ…拡径部、 ２０ｃ…縮径部、、 ２１…貫通孔、 ２２…凹部、 ３０…セラミックス溶射膜、 ３１…貫通孔下側端子、 １００…静電チャック（基板支持装置）、 ｓ…隙間。 DESCRIPTION OF SYMBOLS 10 ... Base material, 11 ... Press-fit hole 11a ... Press-fit hole part 11b ... Expansion-diameter hole part 11c ... Reduction-diameter hole part 11d ... Expansion-diameter hole part 20 ... Press-fit body, 20a ... Base, 20b ... 20c: A reduced diameter portion, 21: through hole, 22: recess, 30: ceramic sprayed film, 31: through hole lower terminal, 100: electrostatic chuck (substrate supporting device), s: gap.
Claims (4)
前記被圧入穴は、開口端から連続的又は断続的に縮径しており、
前記圧入体は、前記被圧入穴に圧入された際に前記被圧入穴の縮径した周壁と圧接する部分と、前記部分より大径の部分を基端に有し、前記基材の表面と前記圧入体との基端面との段差は３０μｍ以下であり、
前記被圧入穴の開口端と前記圧入体の基端との隙間は、５μｍ以上６０μｍ以下であることを特徴とする基板支持装置。 A base made of a conductive material, a press-fit body press-fit into a press-fit hole formed in the base material, having a through hole and made of an insulating material, the press-fit body press-fit into the press-fit hole A substrate supporting apparatus comprising: a ceramic sprayed film covering a flush upper surface of the substrate;
The press-fit hole is continuously or intermittently reduced in diameter from the open end,
The press-fit body has, at its proximal end, a portion to be in pressure-contact with the diameter-reduced peripheral wall of the press-fit hole when pressed into the press-fit hole, and a portion larger in diameter than the portion. The step between the press-fit body and the base end surface is 30 μm or less,
The gap between the opening end of the press-fit hole and the base end of the press-fit body is 5 μm or more and 60 μm or less.
前記基材の表面と前記圧入体との基端面との上にセラミックス粉末を溶射してセラミックス溶射膜を形成する工程とを備えたことを特徴とする基板支持装置の製造方法。 The press-fit body is formed by pressing a press-fit body, which has a through hole and is made of an insulating material, into a press-fit hole formed on a base material made of a conductive material so as to continuously or intermittently reduce the diameter from the open end. Partially pressing the peripheral wall of the press-in hole into which the diameter of the press-in hole is reduced, thereby setting the difference in level between the surface of the base and the base end face of the press-in body to 30 μm or less;
And a step of thermally spraying a ceramic powder on the surface of the base and the proximal end face of the press-fit body to form a ceramic sprayed film.
前記被圧入穴は、開口端から連続的又は断続的に縮径しており、
前記圧入体は、前記被圧入穴に圧入された際に前記被圧入穴の縮径した周壁と圧接する部分を有し、前記基材の表面と前記圧入体との基端面との段差は３０μｍ以下であることを特徴とする基板支持装置。
A base made of a conductive material, a press-fit body press-fit into a press-fit hole formed in the base material, having a through hole and made of an insulating material, the press-fit body press-fit into the press-fit hole A substrate supporting apparatus comprising: a ceramic sprayed film covering a flush upper surface of the substrate;
The press-fit hole is continuously or intermittently reduced in diameter from the open end,
The press-fit body has a portion to be in pressure contact with the diameter-reduced peripheral wall of the press-fit hole when pressed into the press-fit hole, and the step between the surface of the base and the base end face of the press-fit body is 30 μm A substrate support apparatus characterized by the following.
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| KR20210072114A (en) * | 2018-11-01 | 2021-06-16 | 램 리써치 코포레이션 | High power electrostatic chuck with features to prevent He hole light-up/arcing |
| JP7324230B2 (en) * | 2018-12-14 | 2023-08-09 | 日本発條株式会社 | plate with channels |
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| US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| JP5331519B2 (en) * | 2008-03-11 | 2013-10-30 | 日本碍子株式会社 | Electrostatic chuck |
| JP5449750B2 (en) * | 2008-11-19 | 2014-03-19 | 株式会社日本セラテック | Electrostatic chuck and manufacturing method thereof |
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