JP6446282B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a substrate or the like.

  Conventionally, many component mounting apparatuses for mounting electronic components on a substrate have been used. For example, Patent Document 1 describes a component mounting apparatus including a head unit that has a suction nozzle that sucks a component and is movable in two axial directions.

  In this component mounting apparatus, a mark attached to the head unit is photographed by a component recognition camera that recognizes a component shift by capturing an image of the sucked component. The photographing data and reference data measured in advance are compared, and a deviation amount between the position of the head unit and the photographing reference position of the component recognition camera is detected. The mounting accuracy of the component is improved by correcting the mounting position of the component based on the amount of deviation (for example, paragraph [0015] in the specification of Patent Document 1).

JP 2004-71891 A

  When the picked-up part is photographed as described above, the accuracy of the stop position of the head part is important, and a technique capable of easily and accurately stopping the head part is required.

  In view of the circumstances as described above, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of easily and accurately stopping a head unit at a predetermined position.

In order to achieve the above object, a component mounting apparatus according to an aspect of the present invention includes a head unit, a first imaging unit, a moving mechanism, and a correction unit.
The head portion includes a holding portion that holds a plurality of components and a through hole.
The first imaging unit can photograph a subject arranged at a predetermined position.
The moving mechanism moves the head unit to the predetermined position and stops it.
The correction unit corrects the stop position of the head unit moved by the moving mechanism based on the image of the through-hole photographed by the imaging unit.

  In this component mounting apparatus, the through hole of the head portion is photographed, and the stop position of the head portion is corrected based on the photographed image. Thereby, the head part can be moved to a predetermined position and stopped easily with high accuracy.

The moving mechanism may stop the head unit at a first position where the plurality of parts held by the holding unit are photographed. In this case, the correction unit may correct the stop position of the head unit stopped at the first position.
Since the stop position of the head portion is corrected, it is possible to detect a shift in the holding position of a plurality of components with high accuracy. Thereby, mounting accuracy can be improved.

The moving mechanism may stop the head unit at a second position where the through hole is photographed. In this case, the correction unit may calculate an error of the stop position of the head unit based on the image of the through hole, and calculate a correction value for correcting the calculated error.
A correction value is calculated based on an image captured with the head portion stopped at the second position. The stop position of the head unit can be corrected with high accuracy using the correction value.

The correction unit may calculate an error of the stop position based on an edge of the through hole included in the image of the through hole.
This makes it possible to calculate the stop position error with high accuracy.

The head unit may include a second imaging unit including a camera and a member in which the through hole is formed. In this case, the member may be arranged such that the through hole is located on the optical axis of the camera.
The second imaging unit can recognize the position of the board or the like on which the component is mounted, and the mounting accuracy of the component can be improved. The stop position of the head portion can be easily and accurately corrected using the through hole formed in the second imaging portion.

The head portion may include one or more light sources for illumination arranged around the through hole on the opposite side of the member to the side facing the camera.
Since the light source for illumination is arranged around the through hole, an image of the substrate or the like can be taken clearly. As a result, the mounting accuracy can be improved.

The through hole may be formed at a position where the plurality of parts held by the holding unit are not photographed when the head unit is stopped at the second position.
As a result, the stop position can be corrected with high accuracy based on the image of the through hole.

The through hole may be formed at a position where the plurality of parts held by the holding portion are photographed when the head portion is stopped at the second position. In this case, the first and second positions may be set at the same position. The correction unit may correct the stop position of the head unit stopped at the second position.
For example, depending on the size of the component to be sucked, the shape of the through hole, etc., it is possible to execute the correction of the stop position based on an image in which a plurality of components and the through hole are simultaneously captured. As a result, it is possible to detect the component shift and correct the stop position based on the same image, thereby simplifying the processing.

A component mounting method according to an aspect of the present invention includes moving and stopping a head unit that holds a plurality of components to a predetermined position.
An image of the through hole of the head unit stopped at the predetermined position is taken by the imaging unit.
A correction value for correcting the stop position of the head unit is calculated based on the photographed image of the through hole.
Thereby, the stop position of the head part can be corrected easily and accurately.

The component mounting method may further include a correction step, a detection step, and a mounting step.
In the correcting step, the stop position of the head unit stopped at a position where a plurality of parts held by the head unit are photographed is corrected using the correction value.
In the detecting step, a plurality of parts held by the head unit are photographed by the imaging unit, and a shift in the holding position of the parts is detected based on the photographed image.
The mounting step mounts the plurality of components on a mounting target based on the detected displacement of the holding position.
Thereby, it is possible to mount the component on the mounting object with high accuracy.

  As described above, according to the present invention, it is possible to easily and accurately stop the head unit at a predetermined position. Note that the effects described here are not necessarily limited, and may be any of the effects described in the present disclosure.

It is a typical front view which shows the structural example of the component mounting apparatus which concerns on one Embodiment. It is a typical top view of the component mounting apparatus shown in FIG. It is a typical side view of the component mounting apparatus shown in FIG. It is a schematic diagram which shows the structural example of a mounting head. It is a perspective view which shows the specific structural example of a mounting head. It is a block diagram which shows the structure of the control system of a component mounting apparatus. It is a figure for demonstrating the detection of the shift | offset | difference of the adsorption position of an electronic component. It is a flowchart which shows the process example of correction | amendment of a stop position. It is a schematic diagram which shows the stop position of the mounting head when correction | amendment of a stop position is performed. It is a schematic diagram which shows the structural example of the mounting head which concerns on other embodiment.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

[Configuration of component mounting equipment]
FIG. 1 is a schematic front view showing a configuration example of a component mounting apparatus according to an embodiment of the present invention. 2 is a plan view of the component mounting apparatus 100 shown in FIG. 1, and FIG. 3 is a side view thereof.

  The component mounting apparatus 100 includes a frame 10, a mounting head 20 that holds an electronic component (not shown) and mounts the electronic component on a circuit board (hereinafter simply referred to as a substrate) W that is a mounting target, and a mounting on which a tape feeder 35 is mounted. A unit 40, a transport unit 50 for holding and transporting the substrate W, and a component camera 60. The mounting head 20 corresponds to a head unit according to the present embodiment.

  The frame 10 includes a base 11 provided at the bottom and a plurality of support columns 12 fixed to the base 11. For example, two X beams 13 are provided on the top of the plurality of support columns 12 so as to extend along the X axis in the figure.

  For example, a Y beam 14 is bridged between two X beams 13 along the Y axis, and a mounting head 20 is connected to the Y beam 14. The X beam 13 and the Y beam 14 are provided with an X axis moving mechanism and a Y axis moving mechanism (not shown), and the mounting head 20 can move along the X axis and the Y axis by operating these.

  The mounting head 20, the X-axis moving mechanism, and the Y-axis moving mechanism operate as the mounting unit 65. Of these, the X-axis and Y-axis moving mechanisms constitute the moving mechanism according to the present embodiment. Each of the X-axis and Y-axis moving mechanisms is typically configured by a ball screw driving mechanism, but may be other mechanisms such as a belt driving mechanism.

  In the present embodiment, two Y beams 14 are bridged between the X beams 13, and one mounting head 20 is connected to each Y beam 14. By providing the two mounting heads 20 in this manner, productivity can be improved. The two mounting heads 20 are driven along the X-axis and Y-axis directions independently of each other. The number of mounting heads 20 is not limited.

  Assuming that the Y-axis direction in the drawing is the front-rear direction of the component mounting apparatus 100, the mounting portion 40 is disposed on the front side (lower side in FIG. 2) of the component mounting apparatus 100. A plurality of tape feeders 35 are arranged and attached to the attachment portion 40 along the X-axis direction. For example, 40 to 70 tape feeders 35 can be mounted on the mounting portion 40. One tape feeder 35 can accommodate, for example, about 100 to 10,000 electronic components.

  The tape feeder 35 is a cassette type feeder, and a carrier tape is wound around a reel. The carrier tape contains electronic components such as capacitors, resistors, LEDs, and IC packaging. By feeding the carrier tape in step feed, electronic components are supplied one by one through the supply window 36. A plurality of electronic components mounted on the board are supplied by the plurality of tape feeders 35.

  As shown in FIG. 3, the transport unit 50 is disposed on a support base 15 fixed to the frame 10. The transport unit 50 includes two guide rails 51 and 52 that extend along the X-axis direction that is the arrangement direction of the plurality of tape feeders 35. The substrate W1 is transported by the guide rail 51, and the substrate W2 is transported by the guide rail 52.

  As shown in FIG. 2, the two substrates W1 and W2 are transported to a predetermined position in the right region R of the transport unit 50 in the Y-axis direction, and electronic components are mounted by the mounting head 20R. Also in the region L on the left side of the transport unit 50, the two substrates W1 and W2 are transported to predetermined positions and mounted by the other mounting head 20L.

  FIG. 4 is a schematic diagram illustrating a configuration example of the mounting head 20. 4A is a side view of the mounting head 20, and FIG. 4B is a view of the mounting head 20 as viewed from below. FIG. 5 is a perspective view illustrating a specific configuration example of the mounting head 20.

  The mounting head 20 includes a holding unit 21 that holds a plurality of components, and a camera unit 26. In the present embodiment, the camera unit 26 is fixed to the Y beam 14, and the holding unit 21 is detachably attached to the camera unit 26. During the component mounting operation, the camera unit 26 and the holding unit 21 move together.

  The holding unit 21 includes a base portion 22, a rotation drive portion 23, and a turret 24. The base portion 22 is a portion attached to the camera unit 26 and holds the rotation driving portion 23 on the lower side. The rotation drive unit 23 rotates the turret 24 connected to the lower end. For example, a rotation shaft provided in the rotation drive unit 23 is rotated by a motor or the like, and the rotational force is transmitted to the turret 24. In addition, any configuration for rotating the turret 24 may be used.

  The turret 24 has a substantially circular shape when viewed from below, and rotates (rotates) with an axis extending in the Z-axis direction as a central axis of rotation. A plurality of suction nozzles 25 are arranged along the circumferential direction of the turret 24. The suction nozzle 25 is attached to the turret 24 such that the length direction is along the Z-axis direction. The turret 24 corresponds to a holding part in this embodiment.

  The suction nozzle 25 takes out and holds the electronic component from the carrier tape by the action of vacuum suction. The suction nozzle 25 can be driven up and down to suck the electronic component and to mount the electronic component on the substrate W (W1 and W2). In the present embodiment, eight suction nozzles 25 are arranged, but the number of suction nozzles 25 is not limited.

  As the turret 24 rotates, one suction nozzle 25 is disposed above the supply window 36 of the tape feeder 35. In this state, the suction nozzle 25 descends and accesses the supply window 36 to suck the electronic component. By rotating the turret 24 in order, the electronic components can be adsorbed to each of the plurality of adsorbing nozzles 25 continuously in one step.

  At the time of mounting on the substrate, the mounting head 20 is moved onto the substrate W (W1 and W2), and the suction nozzle 25 is lowered to perform mounting. Also at this time, by rotating the turret 24 in order, a plurality of electronic components can be mounted continuously in one process.

  The camera unit 26 includes a substrate camera 27, a base unit 28 that holds the substrate camera 27, an illumination unit 29, and a connection unit 30 that connects the base unit 28 and the illumination unit 29. The base portion 28 is connected to the base portion 22 of the holding unit 21. The substrate camera 27 is arranged so that the photographing optical axis L is along the Z-axis direction.

  The camera unit 26 corresponds to a second imaging unit in the present embodiment. As the substrate camera 27, for example, a digital camera such as a CCD camera or a CMOS camera is used.

  The connecting portion 30 is connected to the lower portion of the base portion 28 and is disposed so as to surround the photographing optical axis L. In the example shown in FIG. 5, the connection portion 30 is also configured with a portion connected to the holding unit 21. The structure of the base | substrate part 28 and the connection part 30 is not limited, These may be comprised integrally.

  The illumination unit 29 is connected to the lower end of the connection unit 30. The illumination unit 29 has an LED substrate 32 in which a through hole 31 is formed. On the lower surface side of the LED substrate 32, a plurality of LEDs 33 are arranged around the through hole 31 as one or more light sources for illumination. The LED substrate 32 corresponds to a member in which a through hole is formed in the present embodiment. The lower surface side of the LED substrate 32 corresponds to the opposite side of the side facing the substrate camera 27 (= upper surface side).

  When a through hole is formed in the holding member that holds the LED substrate 32 and the position of the through hole and the position of the through hole 31 of the LED substrate 32 are matched, the holding member and the LED substrate 32 are used to A member according to an embodiment may be configured.

  As shown in FIGS. 4B and 5, the illumination unit 29 is attached to the connection unit 30 so that the through hole 31 is disposed on the photographing optical axis L. That is, the positional relationship between the substrate camera 27 and the LED substrate 32 is set so that the photographing optical axis L passes through the through hole 31.

  The shape of the through hole 31 viewed from the Z-axis direction is a substantially circular shape centered on the position of the photographing optical axis L. The size (diameter) of the through-hole 31 is set to a size that does not include the edge (edge) 34 of the through-hole 31 in the imaging region (imaging field of view) of the substrate camera 27. Therefore, an image of the area below the through hole 31 and included in the through hole 31 is taken by the board camera 27.

  The camera unit 26 is used for detecting the position of the substrate W. The holding head 20 is disposed above the transport unit 50, and an image of the substrate W is taken from above by the substrate camera 27. Thereby, the alignment mark provided on the substrate W is photographed, and the position of the substrate W is detected based on the position of the alignment mark in the photographed image. By detecting the position of the substrate W, the electronic component can be mounted on the substrate W with high accuracy.

  The plurality of LEDs 33 emit illumination light when the alignment mark is photographed. In the present embodiment, since the plurality of LEDs 33 are arranged around the substantially circular through-hole 31, the illumination light can be irradiated evenly on the substrate W. As a result, the image of the alignment mark can be taken clearly, and the component mounting accuracy can be improved. The shape and size of the through hole 31 are not limited and may be designed as appropriate.

  Returning to FIG. 2, the component camera 60 is disposed between the transport unit 50 and the mounting unit 40. One component camera 60 is disposed in each of the left and right regions R and L, and photographs the mounting heads 20R and 20L, respectively. The configuration and operation of the two component cameras 60 are substantially equal to each other.

  The component camera 60 photographs the suction nozzle 25 that sucks the electronic component from the lower side. For example, when the electronic component is sucked by the suction nozzle 25, the mounting head 20 is moved and the suction nozzle 25 is carried above the component camera 60. And the electronic component hold | maintained at the suction nozzle 25 with the components camera 60 is image | photographed from the downward side.

  As the component camera 60, for example, a digital camera such as a CCD camera or a CMOS camera is used. The component camera 60 functions as a first imaging unit that can capture an image of a subject placed at a predetermined position. In the present embodiment, the predetermined position is a position within an imaging region (imaging field of view) set above the component camera 60.

  FIG. 6 is a block diagram showing the configuration of the control system of the component mounting apparatus 100. This control system has a main controller 5 (or a host computer). The main controller 5 is electrically connected to the mounting unit 40, the tape feeder 35, the board camera 27, the component camera 60, the transport unit 50, the mounting unit 65, the input unit 6, and the display unit 7.

  The main controller 5 has functions of a computer such as a CPU, a RAM, and a ROM, and functions as a control unit that controls the operation of each block of the component mounting apparatus 100. The main controller 5 may be realized by a device such as a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array) or other ASIC (Application Specific Integrated Circuit).

  Each moving mechanism and the mounting head 20 of the mounting unit 65 are provided with motors (not shown) mounted thereon and drivers for driving these motors. The main controller 5 outputs control signals to these drivers, so that the driver drives each moving mechanism and the mounting head 20 according to the control signals.

  For example, each X-axis and Y-axis moving mechanism is provided with a positioning mechanism such as a linear scale. The main controller 5 outputs position information (for example, coordinate values) on the X axis and the Y axis to each movement mechanism on the X axis and the Y axis. Each moving mechanism moves the mounting head 20 to a predetermined position and stops it based on the received position information.

  The photographing operations of the component camera 60 and the board camera 27 are also controlled by the main controller 5. The main controller 5 detects the displacement of the suction position (holding position) of the sucked electronic component, the position of the substrate W to be mounted, and the like based on the photographed image. In the present embodiment, the stop position of the mounting head 20 is corrected based on the image taken by the component camera 60. In this case, the main controller 5 functions as a correction unit according to the present embodiment.

  The input unit 6 is a device that is operated by the operator, for example, so that the operator inputs information necessary for the mounting process to the main controller 5. The display unit 7 is a device that displays information input through the input unit 6 by an operator, information necessary for the input operation, and other necessary information, for example.

[Correction of stop position of mounting head]
As the operation of the component mounting apparatus 100, correction of the stop position of the mounting head will be mainly described. For this purpose, detection of the displacement of the suction position of the electronic component will be described first. FIG. 7 is a diagram for explaining this, and is a schematic diagram showing the mounting head 20 disposed above the component camera 60. In FIG. 7, in order to simplify the illustration, the base portion 22, the turret 24 and the suction nozzle 25 of the holding unit 21, and the illumination portion 29 and the through hole 31 of the camera unit 26 are shown. The same applies to FIGS. 9 and 10 referred to later.

  When the detection of the displacement of the electronic component suction position is executed, the mounting head 20 is moved to a first position, which is a predetermined position above the component camera 60, and stopped. The first position is a predetermined position and is a position where the entire turret 24 is included in the imaging region of the component camera 60. In the present embodiment, the substantially circular area shown in FIG. 7 becomes the imaging area P, and the center of the turret 24 is aligned with the center position of the imaging area P.

  While the mounting head 20 is stopped at the first position, a plurality of electronic components sucked by the suction nozzle 25 are photographed by the component camera 60. Based on the photographed image, a shift in the suction position of the electronic component is detected. The method for detecting the displacement of the suction position based on the captured image is not limited, and any image processing technique such as edge detection is used.

  When the mounting head 20 is stopped at the first position, position information corresponding to the first position is output from the main controller 5. The mounting head 20 is moved by the X-axis and Y-axis moving mechanisms based on the position information. At this time, the mounting head 20 may be stopped at a position shifted from the first position. For example, such a problem occurs when a linear scale or the like provided in each moving mechanism is deformed due to aging or thermal expansion.

  If the stop position of the mounting head 20 is shifted, it is difficult to properly detect the shift of the suction position. Since the mounting of the electronic component is executed based on the detected displacement of the suction position, the accuracy of the component mounting is deteriorated if the displacement of the suction position is not properly detected. Therefore, in the present embodiment, correction of the stop position described below is executed.

  FIG. 8 is a flowchart illustrating an example of processing for correcting the stop position. FIG. 9 is a schematic diagram showing the stop position of the mounting head 20 when the stop position is corrected. First, the mounting head 20 is moved to a second position, which is a predetermined position above the component camera 60 (step 101).

  The second position is a predetermined position, and is a position where the through hole 31 of the illumination unit 29 is included in the imaging region P of the component camera 60. As shown in FIG. 9, in the present embodiment, the center of the through hole 31 is aligned with the center position of the imaging region P. If the through hole 31 can be photographed, another position may be set as the second position.

  The through-hole 31 of the illumination unit 29 is photographed by the component camera 60 (step 102). In the photographed image of the through hole 31, the outside of the through hole 31, that is, the region where the plurality of LEDs 33 and the like are arranged is photographed in a substantially white color. The inside of the through hole 31, that is, the area where the board camera 27 is located is photographed in a substantially black color. The boundary (boundary) between the substantially white portion and the substantially black portion is the edge of the through hole 31.

  Pattern matching is executed between the image of the through hole 31 and the reference image (step 103). The reference image is an image captured in advance by calibration or the like, and is an image captured by the component camera 60 in a state where the mounting head 20 is properly stopped at the second position. The calibration is executed, for example, when the component mounting apparatus 100 is shipped from the factory, and the captured reference image is stored in a memory (not shown) in the main controller 5.

  A deviation between the edge of the through hole 31 in the reference image and the edge of the through hole 31 in the captured image is calculated as a stop position error, and a correction value for correcting the stop position error is obtained. Calculated (step 104). The correction value is calculated for each of the X axis and the Y axis. The specific algorithm for pattern matching is not limited.

  The method for calculating the correction value based on the photographed image of the through hole 31 is not limited, and for example, a method other than pattern matching may be executed. Moreover, it is not limited to the case where a reference image is used. For example, information on the position of the edge of the through hole 31 in the image is calculated and compared with information on the position of the edge serving as a reference. Thereby, the correction value may be calculated.

  When the mounting head 20 is moved to the first position shown in FIG. 7, position information obtained by adding a correction value to the position information corresponding to the first position is output. Thereby, the mounting head 20 can be appropriately stopped at the first position. This makes it possible to detect the displacement of the suction position with high accuracy, and to improve the mounting accuracy of the electronic component.

  As described above, in the present embodiment, the through hole 31 of the LED substrate 32 of the illumination unit 29 provided in the mounting head 20 in advance is photographed. The stop position of the mounting head 20 is corrected based on the photographed image of the through hole 31. As a result, the mounting head 20 can be moved and stopped to a predetermined position (first position or the like) easily and accurately.

  For example, when an alignment mark or the like is formed on the mounting head or the component camera in order to correct the mounting position of the mounting head, a member or the like in which the alignment mark is formed at a predetermined position is required, which increases costs.

  On the other hand, in this embodiment, since the through-hole 31 of the LED board 32 is utilized, an increase in cost can be prevented. When calibration or the like is performed, the stop position can be corrected with high accuracy regardless of the accuracy of the position where the through hole 31 is formed.

  In the present embodiment, the turret 24 and the through hole 31 are arranged apart from each other in the XY plane direction. Therefore, as shown in FIG. 7, when the mounting head 20 is photographed at the first position, the through hole 31 is not photographed. On the other hand, as shown in FIG. 9, when the mounting head 20 is photographed at the second position, the turret 24 is not photographed. That is, in the present embodiment, the through hole is formed at a position where the plurality of electronic components sucked by the suction nozzle 25 are not photographed when the mounting head 20 is stopped at the second position.

  As a result, for example, even when a large electronic component or an electronic component with an extended wiring or lead is adsorbed, it is possible to sufficiently prevent a part of the electronic component from overlapping the through hole 31. Can do. As a result, the correction value can be calculated with high accuracy based on the image of the through hole 31.

<Other embodiments>
The present invention is not limited to the embodiment described above, and other various embodiments can be realized.

  FIG. 10 is a schematic diagram illustrating a configuration example of a mounting head according to another embodiment. In the mounting head 120, a through hole 131 formed in the vicinity of the turret 124 is used. That is, in the present embodiment, the through hole 131 is formed at a position where a plurality of sucked electronic components are photographed when the mounting head 120 is stopped at the second position for correcting the stop position. Accordingly, when the mounting head 120 is photographed at the second position, both the through hole 131 and the plurality of electronic components are photographed.

  For example, when pattern matching or the like is performed based on the edge of the through-hole 131 in the image, the correction value is appropriately set based on the other part of the edge even if the wiring of the electronic components slightly overlaps. It may be possible to calculate. Therefore, if the size, type, presence / absence of wiring, etc., the length of wiring, etc. are known, even if there is an overlap, if it is within the allowable range in calculating the correction value, the turret A through hole 131 may be formed in the vicinity of 124. In addition, it is also possible to suppress the influence of the overlapping of electronic components by appropriately setting the shape of the through hole 131.

  When the through-hole 131 is formed in the vicinity of the turret 124, the image captured at the second position is not only an image for correcting the stop position of the mounting head unit 120, but also the displacement of the suction position of the electronic component Can be used as an image for detecting. That is, in the present embodiment, the same position can be set as the first and second positions.

  Thereby, the detection of the displacement of the suction position and the calculation of the correction value of the stop position can be executed simultaneously without moving the mounting head 120. That is, based on the same image, it is possible to detect a component shift and correct the stop position. As a result, the component mounting process can be reduced, and the processing time can be shortened. When alignment marks are used, it is very difficult to recognize the marks if the wirings overlap even a little.

  In the above, the through hole of the LED board was used for correcting the stop position. However, the present invention is not limited to this, and other through holes formed in the mounting head may be used. For example, through holes used for other purposes such as a through hole for blowing air and a through hole for guiding illumination light can be used as appropriate.

  A through hole may be formed for correcting the stop position. Even in this case, as described above, it is possible to exhibit the effect of allowing a slight overlap of wirings and the like as compared with the case where the alignment mark is used. It is also possible to use a notch-shaped through hole partially cut away.

  Of the characteristic parts according to the present invention described above, it is possible to combine at least two characteristic parts. That is, the various characteristic parts described in each embodiment may be arbitrarily combined without distinction between the embodiments. The various effects described above are merely examples and are not limited, and other effects may be exhibited.

L ... Optical axis W ... Circuit board 5 ... Main controller 20, 120 ... Mounting head 24, 124 ... Turret 25 ... Suction nozzle 27 ... Substrate camera 29 ... Illumination part 31, 131 ... Through-hole 32 ... LED board 33 ... LED
60 ... component camera 65 ... mounting unit 100 ... component mounting apparatus

Claims (9)

A head portion having a holding portion and a through hole for holding a plurality of components;
A first imaging unit capable of photographing a subject arranged at a predetermined position;
A moving mechanism for moving the head portion to the predetermined position and stopping it;
A correction unit that corrects the stop position of the head unit moved by the moving mechanism based on the image of the through-hole photographed by the first imaging unit ;
The head unit has a second imaging unit including a camera and a member in which the through hole is formed,
The member is arranged so that the through hole is located on the optical axis of the camera.
Component mounting equipment. The component mounting apparatus according to claim 1,
The moving mechanism stops the head unit at a first position where the plurality of parts held by the holding unit are photographed,
The correction unit corrects a stop position of the head unit stopped at the first position. The component mounting apparatus according to claim 2,
The moving mechanism stops the head unit at a second position where the through-hole is photographed,
The correction unit calculates an error of a stop position of the head unit based on an image of the through hole, and calculates a correction value for correcting the calculated error. The component mounting apparatus according to claim 3,
The correction unit calculates an error of the stop position based on an edge of the through hole included in the image of the through hole. The component mounting apparatus according to any one of claims 1 to 4 ,
The said head part has one or more light sources for illumination arrange | positioned around the said through-hole on the opposite side of the side which opposes the said camera of the said member. The component mounting apparatus according to claim 3,
The through hole is formed at a position where the plurality of components held by the holding unit are not photographed when the head unit is stopped at the second position. The component mounting apparatus according to claim 3,
The through hole is formed at a position where the plurality of parts held by the holding portion are photographed when the head portion is stopped at the second position.
The first and second positions are set at the same position;
The correction unit corrects the stop position of the head unit stopped at the second position.
Component mounting equipment. A head unit that holds a plurality of components, the head unit including a camera and a member in which a through hole is formed, and configured so that the through hole of the member is positioned on the optical axis of the camera. Move to the position to stop,
Taking an image of the through hole of the head unit stopped at the predetermined position by the imaging unit,
A component mounting method for calculating a correction value for correcting the stop position of the head unit based on the photographed image of the through hole. The component mounting method according to claim 8 , further comprising:
Using the correction value to correct the stop position of the head unit stopped at a position where a plurality of parts held by the head unit are photographed;
Photographing a plurality of components held by the head unit by the imaging unit, detecting a shift in the holding position of the components based on the captured image,
A component mounting method for mounting the plurality of components on a mounting object based on the detected displacement of the holding position.

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