JP7098378B2 - Parts mounting machine - Google Patents

Description

The technique disclosed herein relates to a component mounting machine that mounts electronic components on a substrate.

In a component mounting machine that mounts an electronic component on a substrate, the electronic component is attracted by a nozzle, the electronic component is moved to a predetermined position on the substrate, and the electronic component is mounted on the substrate. In a component mounting machine, it is necessary to accurately mount electronic components on a board. For example, the component mounting machine disclosed in Patent Document 1 includes a photographing device that photographs the upper surface of the substrate from above the substrate. In the component mounting machine of Patent Document 1, after the electronic component is mounted on the substrate, the photographing device is moved above the position where the electronic component is mounted to photograph the electronic component and the upper surface of the substrate. Then, it is confirmed from the captured image whether or not the electronic component is mounted at an accurate position.

Japanese Unexamined Patent Publication No. 2016-76110

In a component mounting machine, in order to accurately mount an electronic component on a board, it is necessary to suck the electronic component at an accurate position with respect to the nozzle and to accurately position the nozzle with respect to the substrate. .. Since the component mounting machine of Patent Document 1 is provided with a photographing device for photographing the upper surface of the substrate, the position of the nozzle with respect to the substrate can be determined from the image obtained by photographing the substrate. However, it cannot be determined whether or not the electronic component is attracted to the correct position with respect to the nozzle. That is, it is not possible to photograph the surface to be adsorbed of the electronic component (for example, the upper surface of the electronic component) while being adsorbed by the nozzle, and as a result, whether or not the electronic component is adsorbed at an accurate position with respect to the nozzle. I can't even judge. Therefore, after mounting the electronic component on the board, it is only possible to confirm the mounting position of the electronic component on the board after the fact. This specification discloses a technique for accurately mounting a component on a substrate.

The component mounting machine disclosed in the present specification mounts electronic components on a substrate. The component mounting machine has a nozzle equipped with a suction surface that attracts electronic components at one end, an optical sensor arranged in a direction substantially orthogonal to the axis of the nozzle, and the electronic components attracted to the nozzle. A first light source that irradiates a surface with light, and an optical member that is arranged on the other end side of the nozzle with respect to the adsorption surface and changes the optical path of the reflected light reflected by the surface to be attracted by the electronic component adsorbed by the nozzle. , A moving device that moves the sensor relative to the nozzle in the axial direction of the nozzle. A moving device capable of moving the sensor to a position where the surface to be attracted by the electronic component can be detected by receiving light is provided.

In the above-mentioned component mounting machine, an optical member is arranged between one end and the other end of the nozzle, and the sensor can move relative to the nozzle in the axial direction of the nozzle. As a result, the surface of the electronic component to be adsorbed can be detected by the sensor. That is, the surface to be adsorbed by the electronic component can be detected while the electronic component is adsorbed on the nozzle. Therefore, the suction position of the electronic component with respect to the nozzle can be determined, the electronic component can be positioned at an accurate position when the electronic component is mounted on the substrate, and the electronic component can be accurately mounted on the substrate.

The figure which shows the schematic structure of the component mounting machine which concerns on Example. FIG. 1 is a cross-sectional view taken along the line II-II of FIG. It is an enlarged view of the main part III of FIG. 1, and shows the state that the light receiving surface of a sensor is located at the position (that is, the first position) facing the side surface of the electronic component adsorbed by the nozzle. It is an enlarged view of the main part III of FIG. 1, and shows the state which the light receiving surface of a sensor is located at the position facing the prism (that is, the 2nd position). FIG. 4 is a cross-sectional view taken along the line VV of FIG. A block diagram showing the function of the control device. The flowchart which shows an example of the process of mounting a defect-free electronic component in a predetermined position.

The main features of the examples described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims at the time of filing. It's not a thing.

In the component mounting machine disclosed in the present specification, the moving device can further move the sensor to a position where the side surface of the electronic component attracted to the nozzle faces the sensor and the side surface of the electronic component can be detected by the sensor. You may. According to such a configuration, the side surface of the electronic component can be detected by the sensor. Therefore, since the side surface of the electronic component and the surface to be adsorbed can be detected by the same sensor, the number of components can be reduced.

The component mounting machine disclosed in the present specification is arranged at a position away from the electronic component attracted to the nozzle when viewed from the light receiving surface of the sensor when the side surface of the electronic component is positioned at a detectable position, and is placed on the nozzle. A second light source that irradiates the adsorbed electronic component with light may be further provided. According to such a configuration, the second light source irradiates the electronic component adsorbed on the nozzle with light. Therefore, the sensor can easily detect the boundary between the side surface of the electronic component adsorbed on the nozzle and the nozzle.

In the component mounting machine disclosed in the present specification, the end portion of the optical member on the suction surface side may be separated from the suction surface. According to such a configuration, the optical member and the suction surface of the nozzle are separated from each other, so that when the electronic component is attracted to the nozzle, the electronic component attracted to the nozzle and the optical member are separated from each other. As a result, the sensor detects the optical member and the electronic component in a separated state. Therefore, it is possible to suitably detect whether or not a crack or the like is generated on the side surface of the electronic component.

In the component mounting machine disclosed in the present specification, the mobile device is a position where the mounting surface of the substrate can be detected by the sensor receiving the reflected light reflected from the mounting surface of the substrate and whose optical path is changed by the optical member. In addition, the sensor may be movable. According to such a configuration, the moving device moves the sensor, so that the sensor can detect the mounting surface of the substrate via the optical member. Therefore, the position of the nozzle with respect to the substrate can be detected, and the electronic component can be more accurately positioned at the mounting position.

In the component mounting machine disclosed herein, the optical member may be attached to a nozzle. The optical member may be arranged so that a part of the optical member overlaps the nozzle when viewed along the axis of the nozzle and the center of the optical member is located on the sensor side of the axis of the nozzle. According to such a configuration, by attaching the optical member to the nozzle, the position of the optical member with respect to the suction surface of the nozzle can be fixed. On the other hand, when the optical member is fixed to the nozzle, a part of the reflected light from the surface to be attracted by the electronic component adsorbed by the nozzle is blocked by the nozzle and cannot be detected by the sensor. Therefore, by arranging the optical member so that the center of the optical member is located on the sensor side from the axis of the nozzle, the range of the surface to be attracted by the electronic component that can be detected by the sensor can be increased.

In the component mounting machine disclosed herein, the nozzle may adsorb the electronic component so that the center of the electronic component is located closer to the sensor than the axis of the nozzle when viewed along the axis of the nozzle. .. The portion of the surface to be adsorbed by the electronic component that is adsorbed by the nozzle cannot be detected by the sensor. Therefore, by attracting the electronic component so that the center of the electronic component is located on the sensor side from the axis of the nozzle, the range of the surface to be attracted by the electronic component that can be detected by the sensor can be increased.

Hereinafter, the component mounting machine 10 according to the embodiment will be described. The component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter. Usually, the component mounting machine 10 is installed side by side with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.

As shown in FIGS. 1 and 2, the component mounting machine 10 includes a plurality of component feeders 12, a feeder holding unit 14, a head unit 22, a sensor unit 30, a light source unit 38, a head unit 22, and a sensor unit. A moving device 18 for moving the 30 and the light source unit 38, a substrate conveyor 20, a control device 44, and a touch panel 46 are provided. A PC 8 configured to be able to communicate with the component mounting machine 10 is arranged outside the component mounting machine 10. Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a wound tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders that randomly accommodate the above.

The feeder holding portion 14 includes a plurality of slots, and the component feeder 12 can be detachably installed in each of the plurality of slots. The feeder holding portion 14 may be fixed to the component mounting machine 10 or may be detachable from the component mounting machine 10.

The moving device 18 moves the head unit 22, the sensor unit 30, and the light source unit 38 between the component feeder 12 and the circuit board 2. As an example, the moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X and Y directions, and the head unit 22, the sensor unit 30, and the light source unit 38 are fixed to the moving base 18a. Has been done.

The board conveyor 20 is a device for carrying in, positioning, and carrying out the circuit board 2. As an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

The head unit 22 is fixed to the moving base 18a and moves integrally with the moving base 18a. The head unit 22 includes a mounting head 16, a nozzle 6, and a prism 24. The mounting head 16 is fixed to the moving base 18a. The mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a. The nozzle 6 is detachably attached to the mounting head 16. The nozzle 6 attracts the electronic component 4. The mounting head 16 can move the nozzle 6 in the Z direction (here, the vertical direction), and causes the nozzle 6 to approach and separate from the component feeder 12 and the circuit board 2. The mounting head 16 can mount the electronic component 4 sucked on the nozzle 6 on the circuit board 2 while sucking the electronic component 4 from the component feeder 12 by the nozzle 6. The mounting head 16 is not limited to the one having a single nozzle 6, and may have a plurality of nozzles 6.

The prism 24 will be described with reference to FIGS. 4 and 5. As shown in FIG. 4, the prism 24 is detachably attached to the nozzle 6. The position where the prism 24 is attached is an intermediate position between the tip end and the base end of the nozzle 6. The prism 24 is arranged so as to change the optical path L1 of the light reflected on the upper surface of the electronic component 4 adsorbed by the nozzle 6 to the side of the nozzle 6. That is, the prism 24 has a facing surface facing the upper surface of the electronic component 4 (also referred to as a lower end surface 24a (horizontal horizontal plane in FIG. 4)) and a facing surface facing the light receiving surface 34a of the sensor 34 (vertical in FIG. 4). It has a vertical surface) and an inclined surface connecting these two facing surfaces. The direction in which the optical path L1 of the light reflected on the upper surface of the electronic component 4 by the inclined surface of the prism 24 is orthogonal to the axis of the nozzle 6 from the direction along the axis of the nozzle 6 (Z direction in FIG. 4) (FIG. 4). It is changed to (Y direction). In this embodiment, the direction of the optical path L1 is changed by using the prism 24, but the configuration is not limited to this. For example, the direction of the optical path L1 may be changed by using a mirror. Since the prism 24 is attached at an intermediate position between the tip end and the base end of the nozzle 6, its lower end surface 24a (the end surface on the −Z direction side in FIG. 4, that is, the upper surface of the electronic component 4 adsorbed by the nozzle 6). The end face on the side) is arranged at a position away from the upper surface of the electronic component 4 attracted to the nozzle 6. As shown in FIG. 5, a part of the prism 24 overlaps with the nozzle 6 when viewed along the axial direction of the nozzle 6 (Z direction in FIG. 5). Further, the center of the prism 24 is located on the sensor unit 30 side (+ Y direction side in FIG. 5) with respect to the axis of the nozzle 6 when viewed along the axis direction of the nozzle 6. The position of the center of the prism 24 in the X direction coincides with the position of the axis of the nozzle 6 in the X direction.

The sensor unit 30 will be described with reference to FIGS. 3 and 4. As shown in FIGS. 3 and 4, the sensor unit 30 is fixed to the moving base 18a and moves integrally with the moving base 18a. The sensor unit 30 includes a sensor support portion 32, a sensor 34, and a first light source 36 (see FIG. 6). The sensor support portion 32 is fixed to the moving base 18a. The sensor 34 is fixed below the sensor support portion 32. The sensor 34 is an optical sensor, and the light receiving surface 34a is arranged so as to face the side surface of the nozzle 6. The first light source 36 is installed in the sensor 34 (not shown in FIGS. 3 and 4) and irradiates light toward the side surface of the nozzle 6.

The sensor 34 detects the side surface of the electronic component 4 adsorbed on the nozzle 6, the upper surface of the electronic component 4 adsorbed on the nozzle 6, and the upper surface of the circuit board 2. Specifically, by driving the mounting head 16 in the Z direction (vertical direction in the figure), the side surface of the electronic component 4 attracted to the nozzle 6 faces the light receiving surface 34a of the sensor 34 (position shown in FIG. 3). Hereafter, when this position is also referred to as “first position”), the sensor 34 detects the side surface of the electronic component 4 attracted to the nozzle 6. By detecting the side surface of the electronic component 4, it is possible to detect whether or not a defect such as a crack has occurred in the electronic component 4. As shown in FIG. 5, in this embodiment, the nozzle 6 attracts a substantially rectangular electronic component 4. The electronic component 4 is attracted to the nozzle 6 so that one of the four vertices is closest to the light receiving surface 34a of the sensor 34 when viewed in a plan view. By attracting the electronic component 4 to the nozzle 6 in this way, the sensor 34 can detect two of the four side surfaces of the electronic component 4, and as will be described later, the four vertices of the four vertices when viewed in a plan view. Three of them can be detected. Therefore, the sensor 34 can detect many parts of the side surface of the electronic component 4, and can efficiently detect defects in the electronic component 4.

Further, when the prism 24 is positioned at a position facing the light receiving surface 34a of the sensor 34 (the position shown in FIG. 4, hereinafter, this position is also referred to as a "second position") by driving the mounting head 16. , The sensor 34 detects the upper surface of the electronic component 4 and the upper surface of the circuit board 2 adsorbed on the nozzle 6. The upper surface of the electronic component 4 attracted to the nozzle 6 is detected by the sensor 34 as shown below. The light emitted from the first light source 36 is reflected by the prism 24 and is changed from the direction orthogonal to the axial direction of the nozzle 6 to the direction along the axial direction of the nozzle 6. Then, the light reflected by the prism 24 is applied to the upper surface of the electronic component 4 adsorbed by the nozzle 6. The reflected light from the upper surface of the electronic component 4 is reflected by the prism 24, and is changed from the direction along the axial direction of the nozzle 6 to the direction orthogonal to the axial direction of the nozzle 6. Then, the reflected light from the upper surface of the electronic component 4 reflected by the prism 24 is detected by the sensor 34. A component mark 4a (see FIG. 5) for alignment is provided on the upper surface of the electronic component 4. By detecting the upper surface of the electronic component 4 using the sensor 34, the component mark 4a on the electronic component 4 is detected. As a result, the position of the electronic component 4 with respect to the nozzle 6 (specifically, the position of the component mark 4a) is detected, and the position of the nozzle 6 is adjusted so that the detected component mark 4a is located at a predetermined position. , The electronic component 4 can be mounted at an accurate position. In this embodiment, the component mark 4a is detected by using the sensor 34, but a landmark (that is, a mark) such as a bump provided on the electronic component 4 may be detected.

Similarly, the sensor 34 detects the upper surface of the circuit board 2. Specifically, the light from the first light source 36 is irradiated to the upper surface of the circuit board 2 via the prism 24, and the reflected light from the upper surface of the circuit board 2 is irradiated to the light receiving surface 34a of the sensor 34 via the prism 24. Ru. Then, the upper surface of the circuit board 2 is detected by the sensor 34. A substrate mark 2a (see FIG. 5) for alignment is provided on the upper surface of the circuit board 2. By detecting the upper surface of the circuit board 2 using the sensor 34, the board mark 2a on the circuit board 2 is detected. By adjusting the position of the nozzle 6 so that the positional relationship between the detected substrate mark 2a and the component mark 4a becomes a predetermined positional relationship, the electronic component 4 is mounted at a more accurate position on the circuit board 2. can do. The sensor 34 may be provided with a focus adjustment mechanism in order to more accurately detect the substrate mark 2a on the upper surface of the circuit board 2 using the sensor 34. Further, the sensor 34 may be configured to be movable in the Y direction so that the distance between the sensor 34 and the prism 24 can be changed in order to focus on the upper surface of the circuit board 2.

Further, as described above, the center of the prism 24 is located closer to the sensor unit 30 than the axis of the nozzle 6 when viewed along the axis direction of the nozzle 6. As a result, the area shielded by the nozzle 6 is reduced, and the range of the upper surface of the electronic component 4 and the upper surface of the circuit board 2 that can be detected by the sensor 34 can be increased. In addition, as shown in FIG. 5, in this embodiment, the center of the electronic component 4 is on the sensor unit 30 side (+ Y direction side in FIG. 5) from the axis of the nozzle 6 when viewed along the axis direction of the nozzle 6. ) Is located. By attracting the electronic component 4 to the nozzle 6 in this way, the range of the upper surface of the electronic component 4 and the upper surface of the circuit board 2 that can be detected by the sensor 34 can be increased.

Further, as described above, the electronic component 4 is attracted to the nozzle 6 so that one of the four vertices is closest to the light receiving surface 34a of the sensor 34 when viewed in a plan view. Since the component marks 4a, bumps, and the like are often arranged at the corners of the upper surface of the electronic component 4, many component marks 4a, bumps, and the like can be detected. Further, by attracting the electronic component 4 to the nozzle 6 in this way, the region where the prism 24 and the electronic component 4 do not overlap becomes large when viewed in a plan view. By setting the substrate mark 2a to be located in this region, it is possible to facilitate the detection of the substrate mark 2a by the sensor 34 while the electronic component 4 is attracted to the nozzle 6.

As shown in FIGS. 3 and 4, the light source unit 38 is fixed to the moving base 18a and moves integrally with the moving base 18a. The light source unit 38 is arranged on the side opposite to the sensor 34 with respect to the nozzle 6 (in FIG. 3 and FIG. 4, the −Y direction side of the nozzle 6). That is, the light source unit 38 is arranged at a position away from the nozzle 6 and the electronic component 4 adsorbed on the nozzle 6 when viewed from the light receiving surface 34a of the sensor 34. The light source unit 38 includes a light source support portion 40 and a second light source 42. The light source support portion 40 is fixed to the moving base 18a. The second light source 42 is fixed below the light source support portion 40. The second light source 42 irradiates light toward the side surface of the nozzle 6 and the light receiving surface 34a of the sensor 34 (that is, toward the + Y direction in FIGS. 3 and 4). When the nozzle 6 is located at the first position (that is, when the nozzle 6 is located at the position shown in FIG. 3), the second light source 42 has a side surface opposite to the side surface of the electronic component 4 facing the sensor 34 (FIG. 3). In No. 3, the side surface on the −Y direction side) and the light receiving surface 34a of the sensor 34 are irradiated with light. By irradiating the light from the second light source 42, the sensor 34 can easily detect the side surface of the nozzle 6 and the side surface of the electronic component 4. That is, a region that receives light from the second light source 42 (a region that is not shielded by the nozzle 6 or the electronic component 4) and a region that cannot receive light from the second light source 42 (a region that is shielded by the nozzle 6 or the electronic component 4). ) Is emphasized, and the side surface of the nozzle 6 and the side surface of the electronic component 4 can be easily detected. Further, as described above, the lower end of the prism 24 and the upper surface of the electronic component 4 adsorbed on the nozzle 6 are separated from each other. As a result, the upper edge of the side surface of the electronic component 4 can be easily detected by the sensor 34, and the defect on the side surface of the electronic component 4 can be detected more accurately.

As shown in FIG. 6, the mounting head 16, the moving device 18, the first light source 36, and the second light source 42 are connected to the control device 44, and the control device 44 moves with the mounting head 16. The device 18, the first light source 36, and the second light source 42 are controlled. Further, a sensor 34 is connected to the control device 44, and information on the side surface of the electronic component 4 detected by the sensor 34, information on the upper surface of the electronic component 4, and information on the upper surface of the circuit board 2 are input. The information input to the control device 44 is stored in a memory (not shown). The touch panel 48 is a display device that provides various information to the operator, and is a user interface that receives instructions and information from the operator.

FIG. 7 is a flowchart showing an example of the mounting process of the component mounting machine 10. In the component mounting machine 10 of this embodiment, the electronic component 4 is attracted by the nozzle 6 to mount the electronic component 4 at the mounting position on the circuit board 2. At this time, it is necessary to mount the electronic component 4 having no defects such as cracks, and it is necessary to accurately mount the electronic component 4 at a predetermined position on the circuit board 2. Hereinafter, a process of accurately mounting the defect-free electronic component 4 at a predetermined position on the circuit board 2 will be described.

As shown in FIG. 7, first, the control device 44 moves the nozzle 6 adsorbing the electronic component 4 to the first position (S12). The movement of the nozzle 6 to the first position is performed by the following procedure. First, the control device 44 moves the moving base 18a so that the nozzle 6 is located above the electronic component 4 supplied from the component feeder 12. Next, the control device 44 moves the mounting head 16 downward and attracts the electronic component 4 to the nozzle 6. Next, the control device 44 moves the mounting head 16 upward in a state where the electronic component 4 is attracted to the nozzle 6. Next, the control device 44 moves the moving base 18a so that the electronic component 4 attracted to the nozzle 6 is located above the predetermined mounting position. Until the moving base 18a is moved above the predetermined mounting position, the control device 44 is positioned so that the side surface of the electronic component 4 is located at a position facing the light receiving surface 34a of the sensor 34 (that is, the first position). In addition, the mounting head 16 is driven to move the nozzle 6 in the axial direction.

Next, the control device 44 acquires information on the side surface of the electronic component 4 detected by the sensor 34 (S14). The acquired information is stored in a memory (not shown) of the control device 44.

Next, the control device 44 determines whether or not the electronic component 4 has a defect based on the detection result of the side surface of the electronic component 4 acquired in step S14 (S16). Specifically, the control device 44 compares the shape of the side surface of the normal electronic component 4 stored in the memory in advance with the shape of the side surface of the electronic component 4 acquired in step S14, and calculates the difference between the two. .. Then, when the calculated difference is equal to or more than a preset threshold value, it is determined that the electronic component 4 has a defect, and when it is less than the threshold value, it is determined that the electronic component 4 has no defect. For example, if a crack or the like is generated on the side surface of the electronic component 4, the thickness of the electronic component 4 increases. Therefore, it is determined whether or not the electronic component 4 has a defect depending on whether or not the increment of the thickness of the electronic component 4 is equal to or greater than the threshold value.

When the electronic component 4 is defective (YES in step S16), the control device 44 replaces the electronic component 4 attracted to the nozzle 6 (S18). Specifically, the control device 44 discards the electronic component 4 currently adsorbed on the nozzle 6 in a defective box (not shown). Then, the control device 44 attracts another electronic component 4 supplied from the component feeder 12 to the nozzle 6. After that, the process returns to step S12, and the processes of steps S12 to S16 are repeated.

On the other hand, when the electronic component 4 has no defect (NO in step S16), the control device 44 moves the nozzle 6 to the second position (S20). Specifically, the control device 44 moves the mounting head 16 downward to a position where the prism 24 faces the light receiving surface 34a of the sensor 34 (that is, the second position).

Next, the control device 44 acquires information on the upper surface of the electronic component 4 detected by the sensor 34 (S22). As described above, the sensor 34 detects the upper surface of the electronic component 4 attracted to the nozzle 6 via the prism 24. When the sensor 34 detects the upper surface of the electronic component 4, the sensor 34 detects the component mark 4a provided on the upper surface of the electronic component 4. The acquired information is stored in a memory (not shown) of the control device 44.

Next, the control device 44 adjusts the position of the nozzle 6 based on the component mark 4a detected in step S22 (S24). In step S12, the control device 44 moves the moving base 18a so that the electronic component 4 attracted to the nozzle 6 is located above the predetermined mounting position. That is, assuming that the electronic component 4 is correctly attracted to the nozzle 6, the moving base 18a is moved to the circuit board 2. Therefore, if the electronic component 4 is not correctly attracted to the nozzle 6, the electronic component 4 will be located above the position deviated from the accurate mounting position. Therefore, the control device 44 adjusts the position of the nozzle 6 so that the position of the component mark 4a detected in step S22 coincides with the position of the component mark 4a in the accurate mounting position. As a result, the electronic component 4 can be positioned at an accurate mounting position.

Next, the control device 44 acquires the information on the upper surface of the circuit board 2 detected by the sensor 34 (S22). As described above, the sensor 34 detects the upper surface of the circuit board 2 via the prism 24. When the sensor 34 detects the upper surface of the circuit board 2, the sensor 34 detects the board mark 2a provided on the upper surface of the circuit board 2. The acquired information is stored in a memory (not shown) of the control device 44. In this embodiment, the information on the upper surface of the electronic component 4 and the information on the upper surface of the circuit board 2 are acquired separately in steps S22 and S26, but both may be acquired at the same time. When the sensor 34 is provided with a focus adjustment mechanism, the control device 44 adjusts the focus so that the substrate mark 2a can be detected, and then inputs the information on the upper surface of the circuit board 2 detected by the sensor 34. You may get it.

Next, the control device 44 readjusts the position of the nozzle 6 based on the substrate mark 2a detected in step S26 (S28). The position of the circuit board 2 may shift, for example, when the circuit board 2 is transported into the component mounting machine 10. Therefore, in the control device 44, the relationship between the position of the board mark 2a detected in step S26 and the position of the component mark 4a detected in step S22 is the position of the board mark 2a and the component mark in the accurate mounting position. The position of the nozzle 6 is readjusted so as to match the relationship between the positions of 4a. As a result, the electronic component 4 can be positioned at the mounting position more accurately.

Although specific examples of the disclosed techniques have been described in detail in the present specification, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples exemplified above. Further, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

2: Circuit board 4: Electronic component 6: Nozzle 8: PC
10: Parts mounting machine 12: Parts feeder 14: Feeder holding part 18: Moving device 20: Board conveyor 22: Head unit 30: Sensor unit 32: Sensor support part 34: Sensor 36: First light source 38: Light source unit 40: Light source Support 42: Second light source 44: Control device 46: Touch panel

Claims (8)

It is a component mounting machine that mounts electronic components on a board.
A nozzle having a suction surface for sucking the electronic component at one end thereof,
An optical sensor arranged in a direction substantially orthogonal to the axis of the nozzle,
A first light source that irradiates the surface to be adsorbed of the electronic component adsorbed by the nozzle with light,
An optical member arranged on the other end side of the nozzle with respect to the suction surface and changing the optical path of the reflected light reflected by the suction surface of the electronic component sucked by the nozzle.
A moving device that moves the sensor relative to the nozzle in the axial direction of the nozzle, and is reflected by the surface of the electronic component attracted to the nozzle and whose optical path is changed by the optical member. A moving device capable of moving the sensor to a position where the surface to be attracted of the electronic component can be detected by receiving light with the sensor is provided .
The optical member is attached to the nozzle and
A part of the optical member overlaps the nozzle when viewed along the axis of the nozzle, and the center of the optical member is arranged so as to be located on the sensor side of the axis of the nozzle. There is a component mounting machine. A plurality of alignment marks are provided on the upper surface of the electronic component.
The component mounting machine according to claim 1, wherein at least two of the plurality of marks are arranged so as to be located on the sensor side of the axis of the nozzle when the electronic component is attracted by the nozzle. The surface to be adsorbed by the electronic component is substantially rectangular and has a substantially rectangular shape.
The nozzle sucks the electronic component so that one of the four vertices of the outer peripheral surface of the electronic component is closest to the light receiving surface of the sensor when the electronic component is viewed in a plan view. The component mounting machine according to 1 or 2. The moving device has the side surface of the electronic component attracted to the nozzle facing the sensor, and can further move the sensor to a position where the side surface of the electronic component can be detected by the sensor. The component mounting machine according to any one of 3 . When the side surface of the electronic component is located at a detectable position, the electronic component is arranged at a position away from the electronic component adsorbed by the nozzle when viewed from the light receiving surface of the sensor, and the electronic component adsorbed by the nozzle emits light. The component mounting machine according to claim 4 , further comprising a second light source for irradiating the light. The component mounting machine according to claim 4 or 5 , wherein the end portion of the optical member on the suction surface side is separated from the suction surface. The moving device further moves the sensor to a position where the mounting surface of the substrate can be detected by receiving the reflected light reflected from the mounting surface of the substrate and whose optical path is changed by the optical member. The component mounting machine according to any one of claims 1 to 6 , which is possible. Any of claims 1 to 7 , wherein the nozzle attracts the electronic component so that the center of the electronic component is located on the sensor side of the axis of the nozzle when viewed along the axis of the nozzle. The component mounting machine described in item 1.

Images