JP6435241B2 - Electronic component mounting apparatus and substrate manufacturing method - Google Patents

Description

The present invention relates to an electronic component mounting apparatus for holding an electronic component by a holding unit and mounting the electronic component on a substrate.

In general, in an electronic component mounting apparatus, an electronic component is picked up from a component supply position by a suction nozzle, and in that state, the electronic component is moved to a target coordinate position on the substrate to mount the electronic component on the substrate. ing. In this type of electronic component mounting apparatus, a mark camera for recognizing a reference mark on a board and a parts camera for recognizing an electronic component sucked by a suction nozzle are provided, and images are taken with these mark camera and part camera. By performing image processing on the image, the electronic component can be accurately mounted at a predetermined position on the substrate at a predetermined angular attitude.

However, in the conventional electronic component mounting apparatus, the mark camera and the suction nozzle are arranged in parallel, and there are two axes of the camera optical axis and the nozzle axis. Correction between axes is required. Similarly, since the head position at which the reference mark is imaged by the mark camera and the head position at which the electronic component is actually mounted are different, it is susceptible to heat and the operating distance needs to be corrected. In addition, since the optical axis of the parts camera is different from the nozzle axis of the suction nozzle, a separate correction is required as described above.

Conventionally, what was described in patent document 1 or patent document 2 is known as what solves these subjects. The one described in Patent Document 1 recognizes the common calibration mark 6 by the upper first camera 20 and the lower second camera 21, and then the head formed on the suction head 2 by the first camera 20. While recognizing the reference mark 5, the second camera 21 recognizes the electronic component P sucked by the suction head 2, and then the second camera 21 recognizes the stage reference mark 14 formed on the stage 11. The first camera 21 recognizes the substrate B on the stage 11 and corrects the coordinate position for mounting the electronic component from these recognition results so that the electronic component is accurately mounted at a predetermined position on the substrate. ing. On the other hand, in the device described in Patent Document 2, the upper plate 41 and the lower plate 42 of the suction unit 24 are each made of a transparent material, and the optical axis coincides with the suction nozzle 25 above the suction unit 24. An image recognition camera 31 is arranged to recognize the suction posture of the electronic component 26 sucked by the suction nozzle 25 through the upper plate 41 and the lower plate 42.

JP 2004-146785 A JP 2000-315895 A

In the present invention, the first and second detection means detect an electronic component, and the first detection means is supplied from the component supply device after the holding unit holds the electronic component supplied from the component supply device. Before the electronic component is mounted on the substrate by the holding head, the electronic component is detected by the electronic component mounting apparatus. The electronic component mounting apparatus detects the electronic component supplied from the component supply apparatus. The purpose is to enable accurate mounting at a predetermined position.

In order to solve the above-described problems, the invention according to claim 1 is characterized in that a substrate transfer device provided on a base for carrying in, carrying out and positioning of the substrate, and a movement supported so as to be movable with respect to the base. A table, a component supply device that supplies an electronic component to be mounted on the substrate, and a holding unit that is attached to the movable table and holds the electronic component supplied by the component supply device, and is held by the holding unit. A holding head for mounting the electronic component on the substrate positioned and held by the substrate transfer device, a first detection means provided on the movable table for detecting a reference portion of the substrate, and provided on the base A method for manufacturing a substrate, comprising: a second detection unit that detects an electronic component held by a holding unit; wherein the electronic component is detected by the first detection unit; 2 The electronic component is detected by an output unit, and the first detection unit is configured to detect the electronic component supplied from the component supply device after the holding unit holds the electronic component supplied from the component supply device. The method of manufacturing a substrate performed by the electronic component mounting apparatus, wherein the electronic component supplied from the component supply device is detected before the component is mounted on the substrate by the holding head.

According to the first aspect of the invention configured as described above, the first and second detection means detect the electronic component, and the first detection means holds the electronic component supplied from the component supply device. The electronic component mounting apparatus detects an electronic component supplied from the component supply apparatus after the section is held and before the electronic component supplied from the component supply apparatus is mounted on the substrate by the holding head. The electronic component can be accurately mounted at a predetermined position on the substrate by the substrate manufacturing method performed.

It is a perspective view which shows the electronic component mounting apparatus which shows embodiment of this invention. It is sectional drawing which shows the holding head which concerns on embodiment. It is the perspective view which looked at the holding head from diagonally upward. It is the perspective view which looked at the holding head from diagonally downward. It is a figure which shows the control apparatus which controls an electronic component mounting apparatus. It is a figure which shows the electronic component and board | substrate which were seen with the mark camera.

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus 10 includes a component supply device 20, a board transfer device 30, and a component transfer device 40.

As an example, the component supply apparatus 20 includes a plurality of cassette-type feeders 21 arranged on the base 11 in the X-axis direction. The feeder 21 has a supply reel 23 that is removably attached to a main body frame 22 that is detachably attached to the base 11 and is wound with a tape that houses a large number of electronic components in a row at intervals. . Although not shown in the figure, a motor serving as a drive source for pitch-feeding the tape is incorporated inside the feeder 21, and the tape is fed out one pitch at a time by this motor, and the electronic component housed in the tape is the tip of the feeder 21. The components are sequentially supplied to the component supply position provided in the unit.

The board transport device 30 transports the circuit board B in the X-axis direction and positions and holds the circuit board B at a predetermined position. As an example, the board transport device 30 is composed of a double conveyor type having two rows of transport means 31 and 32 arranged side by side. Yes. Each transport means 31, 32 has a pair of guide rails 33, 34 arranged in parallel on the base 11 so as to face each other in parallel. A pair of conveyor belts (not shown) for supporting and transporting the circuit board B guided by the guide rails 33 and 34 are arranged in parallel on the transport means 31 and 32.

The component transfer device 40 is composed of an XY robot. The XY robot is mounted on the base 11 and disposed above the component supply device 20 and the substrate transport device 30, and extends along the guide rail 41 in the X-axis direction. A Y-axis moving table 43 that is movable in the orthogonal Y-axis direction is provided. The movement of the Y-axis moving table 43 in the Y-axis direction is controlled by a Y-axis servo motor 44 via a ball screw. An X-axis moving table 45 is guided and supported on the Y-axis moving table 43 so as to be movable in the X-axis direction. The X-axis moving of the X-axis moving table 45 is controlled by an X-axis servo motor 46 via a ball screw. The

A component mounting head 47 is attached to the X-axis moving table 45, and as shown in FIG. 2, a lift shaft 48 is attached to the component mounting head 47 in the Z-axis direction (vertical direction) perpendicular to the X-axis and Y-axis directions. It is supported so as to be movable up and down and rotatable around the Z axis. The lift shaft 48 is controlled to move and rotate in the Z-axis direction by a Z-axis servo motor 49 and a θ-axis servo motor 50 (see FIG. 5). A holding head 54 is attached to the lifting shaft 48, and a holding portion 55 including a suction nozzle that sucks and holds the electronic component P on the holding head 54 is held on the rotation axis of the lifting shaft 53.

A camera housing chamber 57 that opens downward is formed at the lower end of the lift shaft 48, and the mark camera 48 is housed in the camera housing chamber 57 so that the camera optical axis coincides with the center of the holding portion 55. ing. The mark camera 48 images a reference mark (not shown) and a local mark B1 (see FIG. 6) provided on the circuit board B from above. The local mark B1 is provided in the vicinity of a component mounting position of a specific electronic component that particularly requires mounting accuracy. When mounting a specific electronic component, the local mark B1 is mounted on the basis of the local mark B1. It has become. A light source 58 that irradiates light downward is disposed in the opening of the camera storage chamber 57 so as to surround the camera optical axis of the mark camera 48.

The holding head 54 has a ring-shaped base portion 54a fixed so as to surround the light source 58 at the lower end of the elevating shaft 48, and a vertical portion 54b extending in the Z-axis direction on the base portion 54a, and the vertical portion A mounting portion 60 having an L-shaped cross section is integrally formed of a horizontal portion 54c extending in the horizontal direction perpendicular to the Z axis so as to cross the center of the lifting shaft 48 from the lower end of 54b. And the attaching part 60 is attached so that the holding | maintenance part 55 may protrude below the horizontal part 54c, and the holding | maintenance part 55 is on the center axis line A1 which corresponds to the center of the raising / lowering axis 48 and the camera optical axis of the mark camera 48. Is provided.

2 denotes a vacuum passage formed in the holding head 54 and the lifting shaft 48. One end of the vacuum passage 63 is connected to a holding hole (suction hole) of the holding portion 55, and the other end is not shown. Connected to a vacuum source.

A parts camera 61 (see FIG. 1) that images the electronic component P sucked and held by the holding unit 55 from below and images the holding state of the electronic component P between the component supply device 20 and the substrate transfer device 30. Is provided. A lighting device 62 is fixed above the parts camera 61.

As shown in FIGS. 2 and 3, an upper reference mark 65 imaged by the mark camera 48 is provided on the upper surface of the horizontal portion 54 c of the mounting portion 60 of the holding head 54, and the lower surface of the horizontal portion 54 c of the mounting portion 60. As shown in FIGS. 2 and 4, a lower reference mark 66 imaged by the parts camera 61 is provided.

Two upper reference marks 65 are provided on the upper surface of the horizontal portion 54c of the mounting portion 60 at a predetermined distance in the extending direction of the horizontal portion 54c. One reference mark (first reference mark) 65A is arranged on the center axis A1 of the holding portion 55, and the other reference mark (second reference mark) 65B is a predetermined distance (designed) in the horizontal direction from the center axis A1. (Dimension) It is arrange | positioned on 2nd axis line A2 spaced apart by d1.

Similarly, two lower reference marks 66 are also provided on the lower surface of the horizontal portion 54c of the mounting portion 60 at a predetermined distance in the extending direction of the horizontal portion 54c. Among these, the first reference mark 66A is disposed on the second axis A2 coaxial with the second reference mark 65B, and the second reference mark 66B is further a predetermined distance (design dimension) in the horizontal direction from the parallel axis. It is arranged on a third axis A3 that is separated by d1.

By recognizing these two upper and lower reference marks 65A, 65B and 66A, 66B, the inclination of the holding head 54 (holding part 55) can be detected, and based on the detected inclination, the holding head 54 (holding part 55). ) Angle can be corrected. However, it is possible to detect the inclination of the holding head 54 by recognizing the shape even if the upper and lower marks have a directional shape, for example, a rectangular shape.

Thus, the upper reference marks 65A and 65B provided on the holding head 54 are imaged by the mark camera 48, and at the same time, the lower reference marks 66A and 66B provided on the holding head 54 are imaged by the parts camera 61, and the image is taken. By performing image processing on the processed image data, the positions of the upper surface side and the lower surface side of the holding head 54 can be associated with each other. That is, the parts camera 61
Therefore, the electronic component to be imaged can be imaged on the same screen as the reference lower reference mark 66, and the lower reference mark 66 is physically associated with the upper reference mark 65 imaged by the mark camera 58. Therefore, the relative positional relationship with the holding unit 55 can be calculated by image processing.

In order to be able to hold various types of electronic components P having different shapes and sizes, a plurality of holding portions 55 are provided in the component mounting head 52 so as to be indexable, or the component mounting head 52 can be attached to and detached from the X-axis moving table 45. It can also be provided.

The electronic component mounting apparatus 10 has a control device 70 as shown in FIG. The control device 70 includes a CPU 71, ROM 72, RAM 73 and a bus 74 for connecting them, and an input / output interface 75 is connected to the bus 74. The input / output interface 75 includes a Y-axis and X-axis servomotors 44 and 46 that move the component mounting head 47 in the Y-axis and X-axis directions, a Z-axis servomotor 49 that moves the lift shaft 48 in the Z-axis direction, and The mounting control means 77 for controlling the θ-axis servomotor 50 that rotates the elevating shaft 48 around the Z-axis, the upper reference mark 65 (65A, 65B) by the mark camera 58, and the lower reference mark 66 by the parts camera 61. (66A, 66B) and the image pickup control means 78 for picking up images of the electronic parts simultaneously, an image processing device 79 for image processing of image data picked up by the mark camera 58 and the parts camera 61, and the like are connected.

Next, the operation of the electronic component mounting apparatus 10 in the above embodiment will be described. Based on a command from the control device 70, the conveyor belt of the substrate transport device 30 is driven, the circuit board B is guided to the guide rail 33 (34), transported to a predetermined position, and positioned and clamped. Next, by driving the Y-axis servo motor 44 and the X-axis servo motor 46, the Y-axis moving table 43 and the X-axis moving table 45 are moved in the Y-axis direction and the X-axis direction, and the component mounting head 47 supplies the components. The device 20 is moved to the component supply position.

In a state where the component mounting head 47 is moved to the component supply position, the holding head 54 is lowered together with the elevating shaft 48 in the Z-axis direction by the Z-axis servomotor 49, and the holding portion 55 attached to the holding head 54 causes the component supply position. The electronic parts supplied to the are held.

Subsequently, the component mounting head 47 is moved to a predetermined coordinate position on the circuit board B by the movement of the Y-axis moving table 43 and the X-axis moving table 45, but passes above the part camera 61 in the middle thereof. By imaging the electronic component P held by the holding unit 55 by the parts camera 61 at the position, the amount of displacement of the electronic component P with respect to the holding unit 55 and the holding posture of the electronic component P are recognized. Then, the electronic component P is mounted at a predetermined position on the circuit board B after correcting the shift amount of the electronic component P and the holding posture of the electronic component P.

In this case, in order to mount the electronic component P on the circuit board B in a short time, if the component mounting head 47 (holding head 54) is passed through the part camera 61 at high speed without stopping, Even if the timing for imaging the electronic component P is adjusted, an imaging shift occurs, but in the present embodiment, the imaging control means is at a predetermined timing while the holding head 54 passes over the parts camera 61. Based on a command from 78 (see FIG. 5), the lower reference mark 66 (66A, 66B) provided on the holding head 54 by the parts camera 61 and the electronic component P held by the holding unit 55 are imaged and recognized. At the same time, the upper reference mark 65 (65A, 65B) provided on the holding head 54 is imaged and recognized by the mark camera 58, thereby holding it. It is possible to associate the upper and lower surface of the horizontal portion 54c of the head 54.

That is, the electronic component P imaged by the parts camera 61 can be recognized on the same screen as the lower reference mark 66 serving as a reference, and the first reference mark 66A of the lower reference mark 66 is recognized by the mark camera 58. The upper reference mark 65 is provided on the same axis A2 as the second reference mark 65B, and the axis A2 is separated from the center axis A1 of the holding portion 55 by a known dimension (design dimension) d1. Is provided. Therefore, based on the first reference mark 66A of the lower reference mark 66 and the second reference mark 65B of the upper reference mark 65, the upper surface side and the lower surface side of the holding head 54 (horizontal portion 54c) can be physically associated. Thus, the relative positional relationship between the electronic component P and the holding unit 55 is calculated by performing image processing on the upper and lower reference marks 65 and 66 and the electronic component P recognized by the mark camera 58 and the parts camera 61. become able to. As a result, it is possible to correct imaging deviation, and the electronic component P can be accurately positioned at the target coordinate position on the circuit board B even when the holding head 54 is passed through the parts camera 61 without stopping. It can be implemented.

Further, by using image information obtained by the imaging of the lower reference mark 66 by the parts camera 61 and the imaging of the upper reference mark 65 by the mark camera 58, the amount of deviation of the optical axes of the parts camera 61 and the mark camera 58 is calculated. Thus, by correcting the coordinate position by the amount of deviation of the optical axis, it is possible to eliminate the influence on the mounting position due to the deviation of the optical axes of the part camera 61 and the mark camera 58.

Furthermore, when mounting an electronic component P that requires particularly mounting accuracy, for example, an electronic component P having bumps on the mounting surface, on the circuit board B, as shown in FIG. The provided local mark B1 is imaged by the mark camera 58 in the same field of view as the upper reference mark 65, and the imaged data is subjected to image processing, whereby the coordinate position and the target for the electronic component P with respect to the local mark B1. It can be accurately mounted on the circuit board B with the posture as described above. Note that Z1 in FIG. 6 indicates an imaging area captured by the mark camera 58.

When the electronic component P held by the holding unit 55 is relatively large, the electronic component P held by the holding unit 55 protrudes from the horizontal portion 54c of the holding head 54 as shown in FIG. The mark camera 58 can simultaneously image the electronic component P and the upper reference mark 65 (65A, 65B). As a result, the mounting state of the electronic component P caused by the lowering of the lifting shaft 48 of the component mounting head 47 can be constantly monitored by the mark camera 58. For example, even when the electronic component is mounted while being tilted downward It is possible to detect and correct the deviation amount.

Further, by utilizing the fact that the electronic component P held by the holding unit 55 can be imaged by the mark camera 58, the electronic component P is confirmed by checking the image data before and after the component mounting by the mark camera 58 by differential image processing or the like. It can be confirmed whether or not the circuit board B is normally mounted. That is, if the electronic component P is normally mounted on the circuit board B, it can be confirmed that a difference is generated by the difference image processing, but if the mounting fails and the electronic component P is brought back, Since no difference is generated by the difference image processing, it is possible to easily confirm the take-out of the electronic component P.

As described above, according to the present embodiment, the upper reference mark 65 imaged by the mark camera 58 is provided on the upper surface side of the holding head 54, and the lower camera side is imaged by the parts camera 61. A lower reference mark 66 is provided, and an imaging control means 78 is provided for simultaneously imaging the upper reference mark 65 by the mark camera 58 and the lower reference mark 66 and the electronic component P by the parts camera 61, respectively.

With this configuration, the parts camera 61 can image the electronic component P on the same screen as the lower reference mark 66, and the lower reference mark 66 is physically connected to the upper reference mark 65 imaged by the mark camera 58. Therefore, it is possible to calculate the relative positional relationship of the electronic component P with respect to the center of the holding unit 55 by performing image processing on the image data captured by the parts camera 61 and the mark camera 58. Based on this, it is possible to correct the coordinate position where the electronic component P is mounted, so that it is possible to eliminate the adverse effects caused by the imaging shift as in the past, and the holding head 54 passes at high speed without stopping on the parts camera 61. Even if it does, it becomes possible to mount the electronic component P in the defined position of the circuit board B correctly.

Moreover, according to the above-described embodiment, the mark camera 58 is arranged at the center position of the holding portion 55 so that the upper reference mark 65 and the local mark B1 provided on the circuit board B can be imaged with one field of view by the mark camera 58. Therefore, when the electronic component P is mounted on the circuit board B, the local mark B1 can be mounted at the target coordinate position while imaging the local mark B1 with the mark camera 58, and the electronic component P can be mounted on the circuit. It becomes possible to accurately mount on the substrate B.

Further, when the size of the electronic component P held by the holding unit 55 can be imaged by the mark camera 58, that is, when it protrudes from the holding head 54, the mounting state of the electronic component P is constantly monitored by the mark camera 58. For example, when the electronic component P is mounted, it can be detected that the electronic component P is lowered obliquely, and the mounting position can be corrected.

In the above-described embodiment, the example in which the upper reference mark 65 and the lower reference mark 66 are provided on the holding head 54 to which the holding portion 55 is attached has been described. However, the upper reference mark 65 and the lower reference mark 66 are It is also possible to provide the holding portion 55 directly.

In the above-described embodiment, the mark camera 58 images the reference mark provided on the circuit board B and the upper reference mark 65 provided on the holding head 54 and the like, and the parts camera 61 applies the image to the holding unit 55. The held electronic component P and the lower reference mark 66 provided on the holding head 54 and the like are imaged, and the upper reference mark 65 by the mark camera 58 and the lower reference mark 66 by the parts camera 61 and the imaging control means 78. The example in which the electronic parts are controlled to be simultaneously imaged has been described. However, the mark camera 58 and the parts camera 61 may be detection means capable of detecting the upper and lower reference marks 65 and 66 and the electronic parts, and are not necessarily limited. It is not limited to cameras.

Similarly, the reference mark and local mark B1 provided on the circuit board B, the upper reference mark 65 and the lower reference mark 66 provided on the holding head 54 and the like are also detected by the above-described detection means (mark camera 58, parts camera 61). The reference portion can be detected by (), and is not necessarily limited to the mark.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention described in the claims. Of course, it is possible.

The electronic component mounting apparatus according to the present invention is used for an apparatus in which an upper reference portion and a lower reference portion provided in a holding head or a holding portion are detected simultaneously by first and second detection means (mark camera, parts camera). Suitable for

DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 20 ... Component supply apparatus, 30 ... Board | substrate conveyance apparatus, 40 ... Component transfer apparatus, 47 ... Component mounting head, 54 ... Holding head, 55 ... Holding part, 58 ... 1st detection means ( Mark camera), 61 ... second detecting means (part camera), 65 ... upper reference part (upper reference mark), 66 ... lower reference part (lower reference mark), 70 ... control device, 77 ... mounting control circuit 78 ... detection control means, B ... substrate, B1 ... local part.

Claims (5)

A substrate transfer device provided on the base for carrying in, carrying out and positioning the substrate;
A movable table supported movably with respect to the base;
A component supply device for supplying electronic components to be mounted on the substrate;
A holding unit that holds the electronic component that is attached to the movable table and that is supplied by the component supply device is provided, and the electronic component held by the holding unit is mounted on the substrate that is positioned and held by the substrate transfer device. A holding head;
First detection means for detecting a reference portion of the substrate provided on the movable table; and second detection means for detecting an electronic component provided on the base and held by the holding portion;
A method for manufacturing the substrate performed by an electronic component mounting apparatus comprising:
The electronic component is detected by the first detection means.
The electronic component is detected by the second detection means.
Detect each
The first detection means includes
After the holding unit holds the electronic component supplied from the component supply device,
Before the electronic component supplied from the component supply device is mounted on the substrate by the holding head,
Detecting the electronic component supplied from the component supply device,
The first detection means detects an upper reference portion for the first detection means provided on the upper surface of the holding head or the holding portion,
Simultaneously with the detection, the second detection means detects the lower reference part for the second detection means provided on the lower surface of the holding head or the holding part,
Image data of the upper reference portion detected by the first detection means, image data of the lower reference portion detected by the second detection means, and image data of the electronic component detected by the first detection means And calculating a relative positional relationship between the electronic component and the holding head or the holding unit by performing image processing on the image data of the electronic component detected by the second detection unit ,
A method for manufacturing the substrate, which is performed by an electronic component mounting apparatus. 2. The method for manufacturing a substrate according to claim 1, wherein the first detection means is a mark camera that detects the electronic component from above. 3. The method of manufacturing the substrate according to claim 1, wherein the second detection unit is a parts camera that detects the electronic component from below. 4. The method of manufacturing a substrate according to claim 1, wherein a coordinate position where the electronic component is mounted is corrected based on a detection result obtained by the first detection unit. . A substrate transfer device provided on the base for carrying in, carrying out and positioning the substrate;
A movable table supported movably with respect to the base;
A component supply device for supplying electronic components to be mounted on the substrate;
A holding unit that holds the electronic component that is attached to the movable table and that is supplied by the component supply device is provided, and the electronic component held by the holding unit is mounted on the substrate that is positioned and held by the substrate transfer device. A holding head;
First detection means for detecting a reference portion of the substrate provided on the movable table; and second detection means for detecting an electronic component provided on the base and held by the holding portion;
An electronic component mounting apparatus comprising:
The electronic component is detected by the first detection means.
The electronic component is detected by the second detection means.
Detect each
The first detection means includes
After the holding unit holds the electronic component supplied from the component supply device,
Before the electronic component supplied from the component supply device is mounted on the substrate by the holding head,
Detecting the electronic component supplied from the component supply device,
The first detection means detects an upper reference portion for the first detection means provided on the upper surface of the holding head or the holding portion,
Simultaneously with the detection, the second detection means detects the lower reference part for the second detection means provided on the lower surface of the holding head or the holding part,
Image data of the upper reference portion detected by the first detection means, image data of the lower reference portion detected by the second detection means, and image data of the electronic component detected by the first detection means And calculating a relative positional relationship between the electronic component and the holding head or the holding unit by performing image processing on the image data of the electronic component detected by the second detection unit ,
An electronic component mounting apparatus.

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