JP6307374B2 - Mold, molding apparatus, and method for manufacturing molded product - Google Patents

Description

  The present invention relates to a technique effective when applied to a molding die, a molding apparatus, and a method of manufacturing a molded product.

  Japanese Unexamined Patent Publication No. 2014-39065 (hereinafter referred to as “Patent Document 1”) uses an upper mold and a lower mold in which a cavity recess is formed, so that a plurality of semiconductor elements are evenly formed in a molding region as a workpiece. A technique for forming a resin part in which these semiconductor elements are sealed on a mounted substrate is described. In this technique, the outer peripheral region of the substrate held by suction on the upper die is clamped by the lower die while using the support pins that support the substrate, and therefore no resin portion is formed in the outer peripheral region of the substrate.

JP 2014-39065 A

  For example, from a substrate (molded product) sealed using the technique described in Patent Document 1, a product (semiconductor device) separated for each semiconductor element is taken out. Here, as one measure for improving the productivity of the product and reducing the product cost, it is conceivable to increase the number of products obtained from one molded product. For example, it is considered that the surface and side surfaces of a substrate are sealed in a cavity recess (hereinafter referred to as “full mold”), and a plurality of semiconductor elements are mounted on the entire surface of the substrate, thereby increasing the number of products obtained. It is done. However, when considering full molding using the technique described in Patent Document 1, the lower mold support pins cannot be used, and the substrate is simply held by suction with the upper mold. (Especially, large ones or thick ones) may fall. And the manufacturing yield of a molded product (product) will fall by the damage (a crack, a chip, etc.) to a board | substrate by dropping. In order to prevent the substrate from falling, it is conceivable to provide a chuck on the upper die in addition to the support pins. However, when full molding is performed, the long film is continuously pulled out and the upper die and the substrate are attached. It is not possible to use an upper film supply mechanism disposed between the two.

  In addition, when performing full molding, it may be difficult to apply a desired resin pressure (molding pressure) evenly within the substrate surface. For example, in a substrate on which a plurality of semiconductor elements are unevenly mounted in a molding region as a workpiece, the resin pressure (resin density) applied to the region where the semiconductor elements are present and the region where the semiconductor elements are absent is different. Therefore, as a mechanism for adjusting the resin pressure in the cavity recess, for example, a transfer mechanism including a pot and a plunger inserted in the pot may be provided outside the cavity recess. However, by providing this mechanism, it is necessary to further provide a runner (resin passage) that leads from the pot to the cavity recess and an overflow cavity that accommodates excess resin from the cavity recess. For this reason, after molding, before the next process, it is necessary to remove unnecessary resin remaining in the runner and overflow cavity from the molded product, resulting in decreased productivity of the molded product and increased manufacturing cost of the molded product. Resulting in.

  The objective of this invention is providing the technique which can improve the productivity of a molded article. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. A molding die according to an embodiment of the present invention includes a workpiece holder that holds a workpiece, an upper die on which the workpiece is disposed via the workpiece holder, and a cavity recess that closes the mold and accommodates the workpiece The lower mold comprises a cavity block that forms the bottom of the cavity recess, an overflow block that surrounds the cavity block, and a clamper block that surrounds the overflow block, and the cavity block and the The clamper block is provided so as to be able to move back and forth relatively in the mold opening / closing direction, the overflow block is provided so as to be able to move back and forth in the mold opening / closing direction, and the work holder is larger than the opening of the cavity recess in plan view, A tape that is clamped by the upper mold and the lower mold and to which the workpiece is attached is provided. And features. According to this, since a mechanism for adjusting the resin pressure (an overflow block capable of moving back and forth) is provided in the cavity recess, it is not necessary to remove the resin from the molded product, and the productivity of the molded product can be improved.

  In addition, the molding die according to one embodiment of the present invention includes an upper mold and a lower mold, one of the upper mold and the lower mold on which the workpiece is arranged using a workpiece holder that holds the workpiece, and the upper mold and the lower mold. Among them, the other mold having a cavity recess filled with a resin for sealing the work, and a pressure reducing mechanism for reducing the pressure between the upper mold and the lower mold, the work holder, The tape is larger than the opening of the cavity recess in a plan view, clamped by the upper mold and the lower mold, and attached with the work, and the one mold is decompressed by the decompression mechanism, thereby the tape And a tape adsorbing mechanism that adsorbs and holds the material against the force to be peeled off from the one mold. According to this, it is possible to improve the productivity of the molded product while preventing voids and unfilling in the molded product and preventing the production yield of the molded product from being lowered.

  Here, it is more preferable that the upper mold on which the workpiece is disposed is provided around the mold surface and includes a chuck for holding the workpiece holder on the upper mold. According to this, it is possible to prevent the workpiece from falling from the upper mold. The work holder further includes a frame body having an opening, and the tape is held by the frame body so that the work adhered to the tape is positioned in the opening in a plan view. It is more preferable. According to this, the frame body can be easily transported using the work transport jig. In addition, the first and second frame bodies that can be disassembled are provided, and the first frame body includes the first frame body and the second frame body so that the outer peripheral edge of the tape is sandwiched between the first frame body and the second frame body. More preferably, the two frames are fitted together to hold the tape. According to this, it can be set as the state which tensioned the tape.

  In addition, the work holder is configured so that the opening of the frame body matches the opening of the clamper block, and the tape is in close contact with the mold surface of the upper mold on which the work is disposed. More preferably, the tape and the frame body are clamped by the lower mold clamper block. According to this, the work can be arranged (set) on the upper mold via the tape in the frame body. Further, the work holder has an opening of the frame body larger than the clamper block, and the upper mold and the lower mold in a state in which the tape is in close contact with the upper mold surface where the work is disposed. It is more preferable that the tape is clamped by the clamper block. According to this, since the frame body is disposed outside the clamper block, it is possible to clamp only the tape without clamping the frame body. The upper mold on which the workpiece is disposed includes a housing portion that accommodates the frame body on a mold surface, and the work holder accommodates the frame body in the housing portion and More preferably, the tape is clamped by the upper mold and the lower mold clamper block in a state where the tape is in close contact with the mold surface. According to this, since the frame body (holding structure) does not protrude, the lower mold structure can be simplified.

  Also, a molding apparatus using a molding die, a transport unit that transports the workpiece before resin sealing combined with the workpiece holder, a press unit that resin-seals the workpiece with the molding die, It is more preferable to include a storage unit that stores a molded product that is the resin-sealed workpiece.

  Further, in the method for manufacturing a molded product using the molding die, the upper die and the lower die are brought close to each other from a state where the molding die is opened, and the upper die and the lower die are Clamping the workpiece holder with a clamper block, forming a cavity including the cavity recess, enclosing the resin in the cavity, and further bringing the upper mold and the lower mold close to each other More preferably, the method includes a step of filling the cavity with the resin.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the molding die concerning one embodiment of the present invention, productivity of a molded product can be improved.

It is a principal part schematic sectional drawing of the shaping die concerning Embodiment 1 of the present invention. FIG. 2 is a schematic cross-sectional view of a main part of a molding die in operation following FIG. 1. FIG. 3 is a schematic cross-sectional view of a main part of a molding die in operation following FIG. 2. FIG. 4 is a schematic cross-sectional view of a main part of a molding die in operation following FIG. 3. FIG. 5 is a schematic cross-sectional view of a main part of a molding die in operation following FIG. 4. It is typical sectional drawing of various workpiece | work, (a) is a semiconductor wafer, (b) is a chip mounting carrier, (c) is a semiconductor element, (d) shows an LED element mounting carrier. It is principal part typical sectional drawing of the shaping die concerning Embodiment 2 of this invention. It is principal part typical sectional drawing of the shaping die concerning Embodiment 3 of this invention. It is a principal part schematic sectional drawing of the shaping die concerning Embodiment 4 of the present invention. FIG. 10 is a schematic cross-sectional view of a main part of the molding die in operation following FIG. 9. It is the schematic of the compression molding apparatus of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
First, the configuration of a molding die 10 (molding die mechanism) that performs compression molding in the present embodiment will be described with reference to FIGS. 1 to 5 are schematic cross-sectional views of the main part of the molding die 10 during the operation (during the manufacturing process of the molded product) in the present embodiment, and the edge of the cavity recess 13 that forms the cavity C by closing the mold. Only the vicinity (the right side of the drawing (not shown) corresponds to the center side of the molding die 10) is shown.

  The molding die 10 includes a workpiece holder 50 that holds a workpiece W (for example, a semiconductor wafer), an upper mold 11 on which the workpiece W is disposed via the workpiece holder 50, and a workpiece that is closed by a mold. And a lower mold 12 having a cavity recess 13. The molding die 10 is configured to be openable and closable, for example, with the upper die 11 as a fixed die and the lower die 12 paired therewith as a movable die. A known press mechanism (not shown) is used for opening and closing the mold. The molding die 10 includes a heater (not shown) inside and is configured to be heated to a predetermined temperature (for example, 180 ° C.). In such a molding die 10, the cavity recess 13 is closed to form a cavity C when the mold is closed, and molding is performed by thermosetting the resin R filled in the cavity C (see FIG. 5). .

  In the molding die 10, the work holder 50 is a tape 51 having an adhesive surface on one side that is larger than the opening of the cavity recess 13 in plan view (for example, adhesive tape that is peeled off by heat or ultraviolet rays, for example). An ultraviolet release sheet may be used) and a frame body 53 having an opening 52 (for example, a ring frame made of stainless steel). The workpiece W is affixed to the center of the lower surface of the tape 51. The tape 51 is held by the frame body 53 so that the workpiece W is positioned in the opening 52. In other words, the frame body 53 is attached to the outer peripheral portion around the center portion of the tape 51. Since the tape 51 is larger than the opening of the cavity recess 13, it is clamped by the upper mold 11 and the lower mold 12. Further, the frame body 53 can be used as a work conveyance jig, and by holding the frame body 53 holding the work W attached to the tape 51 with the conveyance hand 101a, for example, from the outside of the mold to the inside of the mold It is easy to convey (supply) to the substrate, and productivity can be improved. Further, since it is not necessary to directly hold the workpiece W, even if the frame body 53 is partially held, the workpiece W is not distorted and can be stably conveyed. Further, even a workpiece W that is extremely thin and has a large deflection due to its own weight or is difficult to be partially held can be held flat and stably conveyed.

  In the molding die 10, the upper die 11 includes an upper die block 14. The upper mold block 14 is fixedly assembled to the lower end surface of a base block (not shown) of the upper mold 11. Further, the upper mold 11 includes an upper mold suction holding mechanism that sucks and holds the work holder 50 on the mold surface 11a. The upper die holding and holding mechanism includes a suction device 15 (for example, a vacuum pump) provided outside the die, one end opened to the die surface 11a, and the other end connected (communication) to the suction device 15 to hold the workpiece. And a suction path 16 for sucking the tool 50. With such a configuration, the tape 51 of the workpiece holder 50 arranged (set) on the mold surface 11 a is operated via the suction path 16 by functioning as a tape suction mechanism in the present invention and driving the suction device 15. Can be adsorbed and held (see FIG. 2). In addition, as the suction path 16, as shown in the figure, it may be configured to have a pipe line that opens at a plurality of locations on the mold surface 11a, or an arbitrary digging or pear ground from a small number of openings. You may make it adsorb | suck by air suction through the dent of the mold surface 11a.

  The upper mold 11 includes a chuck mechanism that holds the work holder 50 by sandwiching the outer periphery of the upper mold 11. This chuck mechanism includes a plurality of chucks 17 (hook-like claw portions) arranged at predetermined intervals provided around the mold surface 11a. The chuck 17 is rotatably provided on the upper mold 11 so as to protrude from the mold surface 11a. By rotating the chuck 17, the frame body 53 of the work holder 50 placed (set) on the mold surface 11 a can be hooked and held (see FIG. 2). According to this, it is possible to prevent the workpiece W from falling from the upper mold 11. The chuck may have a configuration in which the holding state is switched by sliding in the horizontal direction in addition to the configuration in which the holding state is switched by rotating the claw portion. For example, by placing an inclined surface on the top of the chuck facing downward and pressing upward to set the workpiece W on the upper mold, the inclined surface of the top is pushed at the corner of the frame body 53, It is good also as a structure made to open | release. In this case, when the workpiece W is removed from the upper mold 11, it can be opened and closed by pushing the inclined surface at the top with a carry-out device (not shown).

  In this embodiment, since the tape 51 is used as the work holder 50, for example, a long film is continuously pulled out and placed between the upper mold 11 and the work W, and the film is perforated by suction. Such an upper film supply / adsorption mechanism is not required. Therefore, the upper die 11 is provided with a chuck mechanism, and the chuck 17 can hold (chuck) the outer peripheral portion (end portion) of the work holder 50 (the tape 51 or the frame body 53).

  In the molding die 10, the lower die 12 includes a base block 20, a cavity block 21, an overflow block 22, and a clamper block 23. A cavity block 21 is assembled to the upper end surface of the base block 20. Further, a through-cylinder-like or annular (hereinafter referred to as “through-cylinder-like”) overflow block 22 that surrounds the cavity block 21 via an elastic member 24 (for example, a coil spring) is provided on the upper end surface of the base block 20 in the mold opening / closing direction. It is assembled to be able to move forward and backward. Further, a clamper block 23 such as a through cylinder surrounding the overflow block 22 is assembled to the upper end surface of the base block 20 via an elastic member 25 (for example, a coil spring) so as to be movable back and forth in the mold opening / closing direction.

  In the present embodiment, in order to perform compression molding, the cavity block 21 and the clamper block 23 are provided so as to be able to move forward and backward relative to the mold opening / closing direction. The cavity block 21 and the clamper block 23 are components of the cavity recess 13, the upper end surface of the cavity block 21 forms the bottom of the cavity recess 13, and the inner peripheral surface of the clamper block 23 such as a through cylinder is a cavity recess. 13 side parts are constituted. In this embodiment, as a pressure regulating mechanism for adjusting the resin pressure in the cavity C (cavity recess 13), the overflow block 22 is provided inside the clamper block 23 such as a through cylinder so as to be movable back and forth in the mold opening / closing direction. It is done. The overflow block 22 is used substantially as a constituent member of the cavity recess 13 (a part of the cavity recess 13) similarly to the cavity block 21. Therefore, the cavity C (cavity recess 13) is larger than the workpiece W in plan view (accommodates the workpiece W) and corresponds to the cavity block 21, and the overflow block around the cavity block 21 in plan view. 22 includes a second space region (which becomes a so-called overflow cavity). In the present embodiment, since the overflow cavity (corresponding to the second space region) by the pressure adjusting mechanism is provided in the cavity recess 13, the resin amount and the resin pressure are adjusted by adjusting the thickness of the resin R in the overflow cavity region. Adjustment is possible. For this reason, for example, by supplying more resin R than the necessary amount for simply sealing the workpiece W as the resin R in the overflow cavity region, sealing with a desired thickness can be performed while applying an appropriate resin pressure. It becomes possible. Further, the resin R in the region of the overflow cavity is continuously connected in the side surface direction of the workpiece W. For this reason, it is not necessary to remove the resin of the overflow cavity from the molded product to prevent the fall, such as a configuration in which a separate overflow cavity connected to the cavity via a runner is provided, and the molded product Wm (FIG. 11) can be improved.

  In the present embodiment, the work holder 50 aligns the opening of the clamper block 23 and the opening of the frame body 53. For example, the workpiece W is positioned in the cavity C by matching the center of the opening of the clamper block 23 with the center of the opening of the frame body 53. At this time, the tape 51 and the frame body 53 are clamped by the clamp block 23 of the upper mold 11 and the lower mold 12 in a state where the tape 51 is in close contact with the mold surface 11a of the upper mold 11 (FIG. 4, FIG. 5). Since at least the tape 51 is clamped, resin leakage can be prevented, so the frame body 53 does not necessarily have to be clamped. Thus, even if the workpiece holder 50 has the frame body 53, the workpiece W can be arranged (set) on the mold surface 11 a of the upper mold 11 via the tape 51. Further, when the frame body 53 is not clamped, the clamper block 23 is provided with a recess for escaping the frame body 53 so that the penetrating portion of the frame body 53 is larger than the outer shape of the clamper block 23. . For example, in the configuration shown in FIGS. 4 and 5, the inner peripheral surface of the opening 52 of the frame body 53 forms the side portion of the cavity recess 13 together with the inner peripheral surface of the clamper block 23. That is, the depth (height) of the cavity recess 13 can be adjusted by changing the thickness of the frame body 53.

  Further, the lower mold 12 includes a lower mold suction holding mechanism that sucks and holds the release film F on the mold surface 12a. The lower mold suction and holding mechanism includes suction devices 26 and 27 (for example, vacuum pumps) provided outside the mold, one end opened on the mold surface 12a, and the other end connected to the suction devices 26 and 27 (communication). And suction paths 30 and 31 for sucking the release film F. By driving the suction devices 26 and 27, the release film F disposed on the mold surface 12a can be sucked and held via the suction paths 30 and 31 (see FIG. 2). The suction path 30 includes, for example, a clearance between the outer peripheral surface of the cavity block 21 and the inner peripheral surface of the overflow block 22 and a clearance between the outer peripheral surface of the overflow block 22 and the inner peripheral surface of the clamper block 23. For this reason, the lower mold suction holding mechanism includes, for example, a seal member 32 (for example, an O-ring) provided between the cavity block 21 and the overflow block 22 and on the base block 20 side, and the overflow block 22 and the clamper block. 23 and a seal member 33 (for example, an O-ring) provided on the base block 20 side.

  Further, as shown in FIG. 3, for example, the molding die 10 includes a chamber decompression mechanism that decompresses the inside of the die (between the upper die 11 and the lower die 12) as a chamber. The chamber decompression mechanism includes a chamber block 34 such as a through cylinder surrounding the upper block 14, and a chamber block 35 such as a through cylinder surrounding the clamper block 23. The chamber block 34 is fixedly assembled to the lower end surface of the base block (not shown) of the upper mold 11. The chamber block 35 is fixedly assembled to the upper end surface of the base block 20 of the lower mold 12. The chamber pressure reducing mechanism includes a seal member 36 (for example, an O-ring) provided on the upper end surface of the chamber block 35, a pressure reducing device 37 (for example, a vacuum pump) provided outside the mold, and one end inside the mold. The other end is connected (communicated) with the decompression device 37 and includes a decompression path 38 for decompressing the chamber. The seal member 36 is used when the upper mold 11 and the lower mold 12 are close to each other and the space surrounded by the chamber blocks 34 and 35, that is, the chamber is sealed (formed). By driving the decompression device 37, the chamber formed inside the mold is decompressed via the decompression path 38 as shown in FIG.

  As the chamber pressure reducing mechanism, it is only necessary to reduce the pressure between the upper mold 11 and the lower mold 12 as the inside of the mold, and the chamber blocks 34 and 35 and the seal member 36 other than those described above can be employed. For example, a seal member 36 is provided on either side of the chamber blocks 34 and 35 that are configured to be movable up and down while maintaining a sealed state, and the seal members 36 are crushed by the chamber blocks 34 and 35 by closing the mold. The sealed state may be maintained. Moreover, it is good also as a structure which has the chamber blocks 34 and 35 which can isolate | separate from the block (base) in which the upper mold | type 11 and the lower mold | type 12 were each assembled | attached, and can be opened and closed separately.

  Next, the operation of the molding die 10 according to the present embodiment (including a setup method for setting the workpiece W) will be described, and a method for manufacturing a molded product Wm using the molding die 10 will be described. First, as shown in FIG. 1, with the mold 10 opened, the cavity block 21 is moved relative to the clamper block 23 so that the upper end surface of the cavity block 21 is at the standby position. deep. As a result, the upper end surface of the cavity block 21 is lower than the upper end surface of the clamper block 23 with respect to the upper end surface of the base block 20. The upper end surface of the overflow block 22 may be higher than the upper end surface of the cavity block 21 as long as it is lower than the upper end surface of the clamper block 23 with reference to the upper end surface of the base block 20 (see FIG. 1). It may be in the same or lower order. In other words, the standby position of the upper end surface of the overflow block 22 may be flush with the upper end surface of the cavity block 21, may be protruded, or may be depressed. The position of the standby position of the upper end surface of the overflow block 22 with respect to the upper end surface of the cavity block 21 is arbitrarily set according to the specifications regarding the thickness of the molded product Wm, the amount of resin R to be used, and the like. However, it can be easily changed by adjusting the height of the elastic member 24 and the overflow block 22, for example.

  Further, the suction devices 15, 26, 27 and the decompression device 37 can be driven while the molding die 10 is opened. Moreover, the workpiece | work W hold | maintained by the workpiece holder 50 is carried in into a metal mold | die using a loader (not shown). Moreover, resin R is arrange | positioned on the center part of the release film F, and resin R is carried in with a release film F inside a metal mold | die.

  The release film F is a film material having heat resistance that can withstand the heating temperature of the molding die 10 and is easily peeled off from the die surface 12a of the lower die 12, and having flexibility and extensibility. Used. Specifically, as the release film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are suitable. As the resin R supplied onto the release film F, for example, a liquid, powder, or sheet is used. For example, it can be supplied using a dispenser equipped with a syringe that can be filled and injected with a liquid resin, or a dispenser equipped with a trough capable of supplying powdered resin in a surface by vibrating with an electromagnetic feeder. Further, the sheet-like resin can be supplied after peeling off a protective sheet provided for preventing deterioration such as oxidation. It should be noted that a resin that is difficult to increase or decrease in a small amount, such as a sheet-like resin, can be appropriately molded by adopting a configuration that allows overflow as in this embodiment. When such a resin R is conveyed together with the release film F, since the resin R is not supplied onto the release film F inside the mold, the preparation time for each molding die 10 can be shortened, The scattering of the powdered resin R in the mold and the heating of the dispenser can be suppressed. Of course, the resin R may be supplied onto the release film F inside the mold.

  Subsequently, as shown in FIG. 2, the workpiece W is placed (set) on the die surface 11 a of the upper die 11 through the workpiece holder 50 in a state where the molding die 10 is opened. Further, the resin R is disposed (set) in the cavity recess 13 of the lower mold 12 in a state where the molding die 10 is opened. Specifically, in the upper mold 11, the work holder 50 holding the work W is first sucked to the mold surface 11 a by sucking the tape 51 of the work holder 50 entirely from the suction path 16. And by rotating the chuck | zipper 17, it hold | maintains so that the frame 53 of the workpiece holder 50 adsorbed | sucked to the metal mold | die surface 11a may be hooked. Thereby, the workpiece | work W is reliably arrange | positioned, without falling on the metal mold | die surface 11a. In this case, the workpiece W is positioned and set in the upper mold 11 by fitting a pin (not shown) (for example, a pin provided in the upper mold 11) and a hole (for example, a through hole provided in the frame body 53). can do. At this time, after positioning the work holder 50 on the mold surface 11a of the upper mold 11, positioning is performed by driving the suction device 15 and then attracting the tape 51 to the mold surface 11a. Can be fixed. Further, such pins and holes are preferably provided at positions where the tape 51 is not interposed.

  In the lower mold 12, first, the release film F is disposed so as to cover the mold surface 12 a including the inner surface of the cavity recess 13, and the release film F is sucked from the suction paths 30, 31, thereby The release film F is adsorbed along the stepped corner portion. At this time, since the resin R is arranged at the center of the release film F, the resin R is arranged on the upper end surface of the cavity block 21 in the cavity recess 13 via the release film F. Since the molding die 10 is heated to a predetermined temperature by the built-in heater, the resin R is melted from a location in contact with the inner bottom surface of the cavity recess 13. In the present embodiment, since the chuck 17 that holds the work holder 50 is provided on the outer periphery of the release film F, distortion (wrinkle) of the release film F due to interference of the chuck 17 can be prevented.

  For example, when a plurality of chucks are provided at a predetermined interval in order to directly hold the workpiece W, the chucks are inevitably arranged at positions where the chucks overlap with the clamper block for the convenience of the number of packages to be taken by the workpiece W. In this case, since the chuck needs to be accommodated in the clamper block when the workpiece is clamped, the chuck 17 is partially pushed into the release film F attached to the clamper block, so that the release film F is distorted ( Wrinkles). On the other hand, in this embodiment, since it clamps via the tape 51 and the frame body 53 of uniform thickness over the perimeter, generation | occurrence | production of distortion (wrinkle) to the above-mentioned release film F is prevented. be able to.

  Subsequently, as shown in FIG. 3, the upper die 11 and the lower die 12 are brought close to each other from the state in which the molding die 10 is opened, and the seal member 36 provided on the upper end surface of the chamber block 35 is placed in the chamber. The lower end surface of the block 35 is brought into contact (that is, a seal ring touch). Thereby, a chamber (sealed space) is formed inside the mold. At this time, since the decompression device 37 is driven, the chamber is decompressed via the decompression path 38 and can be in any deaeration state. Thus, even if the lower surface side of the tape 51 of the workpiece holder 50 is in a reduced pressure state, in this embodiment, not only the chuck 17 but also the upper surface of the tape 51 is entirely adsorbed to the mold surface 11a. Therefore, the tape 51 to which the workpiece W not directly held by the chuck 17 is attached does not hang down.

  Subsequently, as shown in FIG. 4, the upper die 11 and the lower die 12 are further brought closer to each other, and the upper die 11 and the clamper block 23 of the lower die 12 are taped to the work holder 50 via the release film F. 51 and the frame body 53 are clamped. As a result, the opening of the cavity recess 13 is closed by the upper mold 11, whereby a cavity C including the cavity recess 13 is formed, and the resin R is included in the cavity C. Note that by providing an air vent (not shown) in the clamper block 23, the cavity recess 13 can be depressurized even after the release film F is clamped.

  Subsequently, as shown in FIG. 5, the upper die 11 and the lower die 12 are further brought close to each other (clamping is performed), and the resin R is filled into the cavity C. Specifically, when the molding die 10 is clamped, the elastic member 25 is compressed and the clamper block 23 moves toward the base block 20 while being urged. The cavity block 21 moves relative to the clamper block 23. At this time, the position of the upper end surface of the cavity block 21 in the cavity recess 13 is changed from a deep standby position to a shallow molding position, and a gap (first space region) between the upper end surface of the cavity block 21 and the workpiece W or the tape 51 is formed. Narrow. As a result, the resin R disposed on the upper end surface of the cavity block 21 is pressed against the workpiece W. In this case, for example, when the resin R is supplied only on the cavity block 21, the resin R pressed against the workpiece W is substantially a gap between the upper end surface of the overflow block 22 surrounding the cavity block 21 and the tape 51. Flow into a large overflow cavity (second space region). The resin R that has flowed into the overflow cavity is pressed by the upper end surface of the overflow block 22 that moves forward and backward by the elastic member 24. Therefore, the resin R in the cavity C is filled with the resin R while the resin pressure in the cavity C is adjusted by the overflow block 22 (more specifically, the elastic member 24). Thus, in the present embodiment, the overflow block 22 that can move forward and backward is provided as a mechanism for adjusting the resin pressure in the cavity C. The resin R may be supplied not only on the cavity block 21 but also on the overflow block 22. In this case, the resin does not flow into the overflow cavity, but the resin pressure in the cavity C can be adjusted while suppressing the resin flow.

  Next, the resin R filled in the cavity C is thermally cured for a predetermined time in a state where the resin R is held (final mold closed state). Next, the mold 10 is opened, the upper mold 11 and the lower mold 12 are released, the sealed work W is taken out of the mold, and then the tape 51 is removed from the sealed work W. And release film F. Also at this time, since the frame body 53 can be grasped and peeled off, the tape 51 can be easily peeled from the sealed workpiece W. In the configuration of the present embodiment, the edge portion of the release film F is overlapped with the frame body 53 in the sealed workpiece W. For this reason, the edge part of the release film F overlaid with the frame body 53 which does not have adhesiveness can be easily hold | gripped and peeled.

  Furthermore, by performing thermosetting (post-cure) for a predetermined time as post-processing, a molded product Wm in which the workpiece W is sealed (full molded) with the resin R (resin sealing portion) is completed. Thus, the molded product Wm can be manufactured using the molding die 10 having the cavity recess 13 of the lower mold 12.

  Here, a specific example of the workpiece W to be resin-sealed will be described with reference to FIG. 6A and 6B are schematic cross-sectional views of various workpieces W, where FIG. 6A is a semiconductor wafer Wa, FIG. 6B is a chip mounting carrier Wb, FIG. 6C is a semiconductor element Wc, and FIG. 6D is an LED element mounting carrier Wd. Are shown together with the workpiece holder 50. That is, in the molding die 10 according to the present embodiment such as FIG. 1, the semiconductor wafer Wa is applied as the workpiece W, but the present invention is not limited thereto, and may be a chip mounting carrier Wb or the like. These workpieces W may have a circular shape or a rectangular shape in plan view. Depending on the shape of the workpiece W, the shape of each part of the molding die 10 described above is determined.

  As shown in FIG. 6A, when the workpiece W is the semiconductor wafer Wa, for example, the back surface of the semiconductor wafer Wa on which bumps and pillars (not shown) are arranged is attached on the tape 51. Then, the frame body 53 is affixed on the tape 51 so that the semiconductor wafer Wa is positioned in the opening 52. The work W may be pasted after the frame body 53 is pasted on the tape 51. In the work holder 50 for holding the semiconductor wafer Wa, the lower surface side of the tape 51 is disposed (set) on the mold surface 11a of the upper mold 11 and is resin-sealed on the upper surface side of the figure exposed from the opening 52. The wafer Wa is fully molded.

  Further, the workpiece W to be fully molded may be a chip mounting carrier Wb. As shown in FIG. 6B, in the chip-mounted carrier Wb, for example, a plurality of semiconductor elements 55 (semiconductor chips) are mounted on a carrier 54 in an n-row × m-column matrix (matrix). As the carrier 54, a wiring board (for example, a glass epoxy board), a semiconductor wafer, a lead frame, or the like can be applied as a plate-like member on which a semiconductor element is mounted. It may be a temporary carrier such as a stainless plate or a glass plate on which is temporarily mounted. Further, the planar shape of the carrier 54 may be a circle or a rectangle. Further, the chip to be mounted may be an actuator element or a sensor element in addition to a semiconductor element such as a memory or LED, or a passive element.

  Further, the workpiece W to be fully molded may be a plurality of semiconductor elements Wc (semiconductor elements 55) or chips themselves. As shown in FIG. 6C, the plurality of semiconductor elements Wc are disposed and sealed directly in a matrix on the tape 51 without using a member such as the wafer Wa or the carrier 54. Note that after the plurality of semiconductor elements Wc are fully molded, a wiring structure (rewiring layer) is formed on the surface from which the tape 51 is peeled.

  The molding die 10 can also be applied to a workpiece W having a shape different from that of the workpiece W described above. For example, as shown in FIG. 6 (d), when the workpiece W is an LED element mounting carrier Wd, a dome-shaped (hemispherical) lens is formed only for the LED element while exposing the exposed electrode on the surface of the carrier. There are times when you want to. Even in such a case, the present invention can be applied. That is, the LED element mounting carrier Wd is affixed on the tape 51. In the LED element mounting carrier Wd, a plurality of LED elements 57 are mounted on the carrier 56 in a matrix. As the carrier 56, for example, a metal substrate or the like can be applied. Here, a large number of lens forming apertures 51 a are formed in the tape 51 at positions corresponding to the mounted LED elements 57 to form lenses in a matrix, and the tape 51 is formed on the LED element mounting surface of the carrier 56. Is pasted. In this case, as shown in the figure, on the carrier 56, only the lens molding position including the LED element mounting position is exposed from the tape 51.

  Then, the frame body 53 is affixed on the tape 51 so that the carrier 56 is positioned in the opening 52. Alternatively, the frame body 53 may be pasted on the tape 51 in advance, and the lens formation opening 51a may be perforated with the tape 51 held. In the work holder 50 that holds the LED mounting carrier Wd, the frame body 53 is arranged (set) on the mold surface 11 a of the upper mold 12 without sandwiching the tape 51, and is exposed from the opening hole 51 a on the lower surface side of the tape 51. A lens is molded with respect to the LED element 57. In this case, in such a lower mold 12 for sealing, the cavity block 21 is provided with a lens cavity recess (for example, a hemispherical shape) at a position where the opening hole 51a is disposed, and the LED element 57 is provided with the lens cavity. A hemispherical lens is resin-molded with respect to the LED element 57 by sealing in a state of entering the recess. In order to easily peel off unnecessary resin other than the lens portion after such sealing, it is preferable to mold the resin R other than the lens portion as thin as possible. Thereby, the resin R other than the lens portion can be peeled from the workpiece W simply by peeling the tape 51.

(Embodiment 2)
In the first embodiment, the case where the work holder 50 includes the tape 51 and the frame body 53 has been described. On the other hand, in this embodiment, the case where the workpiece holder 50 does not include the frame body 53 will be described with reference to FIG. FIG. 7 is a schematic cross-sectional view of a main part of the molding die 10 in the present embodiment. Note that the chamber decompression mechanism is omitted in the drawings of the following embodiments including FIG.

  The workpiece holder 50 according to the present embodiment includes only the tape 51 that is larger than the opening of the cavity recess 13 in a plan view and is clamped by the upper mold 11 and the lower mold 12. The workpiece holder 50 is carried in from the outside of the mold with the workpiece W attached to the tape 51. Then, the tape 51 of the work holder 50 is attracted to the mold surface 11a. Then, by rotating the chuck 17, the tape 51 of the work holder 50 attracted to the mold surface 11 a is held so as to be hooked. Thereby, the workpiece | work W is arrange | positioned (set) on the metal mold | die surface 11a. Also in this embodiment, the same effects as those of the first embodiment can be obtained in that the tape 51 is provided.

(Embodiment 3)
In the first embodiment, the case where the upper mold 11 and the lower mold 12 clamp the tape 51 and the frame body 53 of the work holder 50 with the clamper block 23 has been described. On the other hand, in this embodiment, the case where only the tape 51 is clamped will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view of a main part of the molding die 10 in the present embodiment.

  The work holder 50 according to the present embodiment includes a tape 51 and a frame body 53 having an opening 52 that is larger than the clamper block 23 in plan view. The workpiece holder 50 is carried in from the outside of the mold with the workpiece W attached to the tape 51. Then, the tape 51 of the work holder 50 is attracted to the mold surface 11a. And by rotating the chuck | zipper 17, it hold | maintains so that the frame 53 of the workpiece holder 50 adsorbed | sucked to the metal mold | die surface 11a may be hooked. Thereby, the workpiece | work W is arrange | positioned (set) on the metal mold | die surface 11a. Then, the upper mold 11 and the lower mold 12 are brought close to each other in a state where the tape 51 is in close contact with the mold surface 11 a of the upper mold 11. Since the frame body 53 is disposed outside the clamper block 23, only the tape 51 is clamped by the clamper block 23 of the upper mold 11 and the lower mold 12. Also in this embodiment, the same effect can be obtained for the same configuration as that of the first embodiment. Further, since the frame body 53 is not clamped by the clamper block 23, it is easy to manage the sealing thickness of the workpiece W, the resin pressure, and the mold design.

(Embodiment 4)
In the first embodiment, the case where the frame body 53 is provided on the lower surface (the surface on which the workpiece W is attached) of the tape 51 in the workpiece holder 50 has been described. On the other hand, in this embodiment, the case where the frame body 53 is provided on the upper surface (surface attracted by the mold surface 11a) side of the tape 51 will be described with reference to FIG. 9 and FIG. 9 and 10 are schematic cross-sectional views of the main part of the molding die 10 in the present embodiment.

  The workpiece holder 50 according to the present embodiment includes a tape 51 and a ring-shaped frame body 53 having an opening 52. And the upper mold | type 11 which concerns on this embodiment is provided with the accommodating part 63 which becomes a ring-shaped (annular) dent so that the flame | frame body 53 may be accommodated in the metal mold | die surface 11a. In the work holder 50, the opening of the frame body 53 is larger than the overflow block 22 in a plan view. The frame body 53 includes a ring-shaped first frame body 60 and a second frame body 61, and is configured to be disassembled. In the frame body 53, the second frame body 61 is fitted into the recess 62 of the first frame body 60 so that the outer peripheral edge of the tape 51 is sandwiched between the first frame body 60 and the second frame body 61. The tape 51 is held. Specifically, the second frame body 61 is pasted on the surface of the tape 51 on which the workpiece W is pasted (the lower surface in the figure), and the outer peripheral edge of the tape 51 is the first frame body 60 and the second frame body. The first frame body 60 is assembled so as to be sandwiched by 61. At this time, the outer periphery of the tape 51 is dropped into the recess 62 of the first frame body 60. Then, the second frame body 62 is fitted into the recess 62. According to this, it is possible to make the central portion of the tape 51 more stretched. In the tape 51 held in such a tensioned state, the workpiece W is stuck so as to be positioned at a predetermined position in the opening 52. Thereby, it is possible to prevent the tape 51 from being bent due to the weight of the workpiece W.

  As shown in FIG. 9, the work holder 50 is carried in from the outside of the mold with the work W attached to the tape 51. As shown in FIG. 10, the work holder 50 accommodates the frame body 53 in the accommodating portion 63 and the tape 51 is attracted to the mold surface 11 a of the upper mold 11. And by rotating the chuck | zipper 17, it hold | maintains so that the frame 53 of the workpiece holder 50 adsorbed | sucked to the metal mold | die surface 11a may be hooked. Thereby, the workpiece | work W is arrange | positioned (set) on the metal mold | die surface 11a. Then, the upper mold 11 and the lower mold 12 are brought close to each other in a state where the tape 51 is in close contact with the mold surface 11 a of the upper mold 11. As a result, the tape 51 is clamped between the upper die 11 and the clamper block 22 of the lower die 12. According to this, since the frame body 53 (the holding structure) does not protrude from the lower surface of the tape 51, the structure of the lower mold 12 can be simplified. Also in this embodiment, the same effect can be obtained for the same configuration as that of the first embodiment. In addition, since the frame body 53 is not clamped by the clamper block 23, the sealing thickness of the workpiece W can be easily managed.

  Note that the molding die 10 of each of the above embodiments may be used as a compression molding apparatus by itself using a known press, and has a configuration as shown in FIG. 11 and can be automatically molded. It may be incorporated in 100 and used. In the figure, a conveyance route for the workpiece W or the like is indicated by a one-dot chain line, and members indicated by reference numerals in parentheses are conveyed at a predetermined timing.

  This compression molding apparatus 100 is an example of a compression molding apparatus according to the present invention, and includes a conveyance unit 101 that conveys between each part, a workpiece W before resin sealing, and a workpiece W combined with a workpiece holder 50. A workpiece supply unit 102 configured to be able to supply, a workpiece supply unit 103 configured to receive the resin R and supply the resin R and supply the entire release film, the workpiece W or the resin R conveyed by the conveyance unit 101, and the like The press part 104 which receives resin and is sealed with the molding die 10, the process of removing the release film F and the work holder 50 from the work W sealed with resin in the press part 104, the inspection process of the molded product Wm, and the post-molding heating process A post-processing unit 105 that performs post-processing such as (post-cure), and a molded product storage unit 106 that stores the molded product Wm that has been post-processed. Obtain. It should be noted that the functions of the respective units may be combined or separated, the layout and the number may be changed, and the presence or absence of other configurations is not limited to those described above, and other configurations may be employed.

  Further, as a characteristic operation in such a compression molding apparatus 100, in the configuration shown in the figure, in the work supply unit 102, for example, the frame body 53 is attached to the adhesive surface of the tape 51 cut out to a predetermined length. An arbitrary position and an arbitrary number of workpieces W are attached so as to align with the frame body 53. Needless to say, a configuration may be adopted in which the workpiece W on which such affixing is performed outside is directly accommodated in the workpiece supply unit 102. And these are conveyed to the press part 14 by the conveyance part 101 provided with conveyance mechanisms, such as a multi-indirect robot and a linear guide, for example.

  Also, the resin-sealed workpiece W (molded product Wm) is conveyed to the post-processing unit 105 together with the tape 51 and the release film F, and the tape 51 and the release film F are peeled off. In addition, the peeling process of the tape 51 and the release film F from the molded product Wm may be performed in the press part 104 (molding die 10). On the other hand, after being separated from the tape 51, the frame body 53 used for molding is cleaned and cooled, and returned to the work supply unit 102 by the transport unit 101 so that it can be reused.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  Further, for example, in the first embodiment, in the configuration in which the cavity block and the clamper block are assembled so as to be relatively movable in the mold opening / closing direction, the cavity block is fixed to the base block and the clamper block is moved. Explained the case. Not limited to this, the cavity block can be moved relative to the base block to fix the clamper block, or both the cavity block and the clamper block can be moved.

  Instead of the tape 51 as described above, a perforated tape opened with a predetermined width to be attached at the outer peripheral position of the workpiece W may be used. According to this, it is possible to simplify the peeling by reducing the amount of peeling of the tape, or even if there is unevenness in the center of the back surface of the work W, it can be stably stuck regardless of this, It is also possible to prevent a situation where the back surface of the workpiece W is damaged by the force peeled off by the tape. Further, when using such a tape, a digging for absorbing the difference in thickness between the outer periphery of the work W to which the tape is attached and the inside thereof is provided at the outer peripheral position of the upper mold, and the inner peripheral portion protrudes. It is good also as an upper type which becomes a step shape.

  In addition, as one aspect of the invention described in the present specification, not only the configuration as described above, but the upper mold 11 on which the workpiece W is arranged using the workpiece holder 50 that holds the workpiece W, and the resin R In the molding die 10 including the lower mold 12 having the cavity recess 13 to be supplied and the pressure reducing mechanism for reducing the pressure between the upper mold 11 and the lower mold 12, the upper mold 11 is decompressed by the pressure reducing mechanism. It is good also as a structure provided with the tape adsorption | suction mechanism which adsorbs and hold | maintains against the force which makes the tape 51 peel from the upper mold | type 11. FIG. In this case, as in the above-described embodiment, the tape 51 is unintentionally peeled off from the upper mold 11 due to the reduced pressure for preventing the occurrence of voids and the like, and the work W comes into contact with the lower mold 12 side. Can be prevented. In order to achieve such an effect, the overflow block 22 surrounding the cavity block 21 is not necessarily configured to be surrounded by the clamper block 23. Further, a corresponding effect can be obtained even if the upper mold 11 is provided with the cavity recess 13 and the work holder 50 is set on the lower mold 12 so as to be upside down.

  Further, the overflow block 22 does not necessarily have an annular structure that surrounds the outer periphery of the cavity block 21, and may be any configuration that can move up and down at a position that surrounds the cavity block 21. For example, the outer peripheral shape of the cavity block 21 may be configured to be partially recessed in plan view, and may be provided as a block that is accommodated in the recessed portion. In this case, by providing a plurality of such blocks at equal intervals, for example, the same effect as the configuration in which the annular overflow block 22 is arranged can be achieved at a low cost.

  Moreover, as the workpiece | work W, although the various structures as shown in FIG. 6 were demonstrated, it is not limited to these. For example, the workpiece W can be of any size. For example, it is not limited to a strip shape of about 70 mm × 240 mm like a so-called interposer substrate, but may have a larger size, for example, one side of 500 mm or more. Further, the number of workpieces can be set freely, and a configuration may be adopted in which a plurality of workpieces W that are attached to the tape 51 in a matrix of one or more rows and multiple columns are collectively molded. As an example, in the case of a rectangular cavity C with sides of 500 mm, 12 pieces of 70 mm × 240 mm strip-shaped workpieces W are arranged in 2 rows × 6 columns with an appropriate gap and are fully molded at once. Can be manufactured with high productivity. Of course, in the case of the cavity C having such a size, one rectangular work W of 18 inches (about 450 mm) square can be fully molded. Therefore, various types of molding can be performed with a single cavity C configuration (molding die) by changing the arrangement and number of the workpieces W on the tape 51. According to such a configuration, productivity is extremely high, and various types of molding can be performed while preventing generation of unnecessary resin and reducing the amount of resin used. Furthermore, it is good also as a metal mold | die structure which provides the cavity recessed part 13 by the number of the workpiece | work W instead of the structure which provides the one cavity recessed part 13 with respect to several workpiece | work W. FIG.

DESCRIPTION OF SYMBOLS 10 Molding die 11 Upper mold | type 11a Mold surface 12 Lower mold | type 13 Cavity recessed part 50 Work holder 51 Tape W Workpiece | work

Claims (10)

A workpiece holder for holding the workpiece;
An upper mold on which the workpiece is arranged via the workpiece holder;
A lower mold having a cavity recess to close the mold and accommodate the workpiece,
The lower mold includes a cavity block that forms the bottom of the cavity recess, an overflow block that surrounds the cavity block, and a clamper block that surrounds the overflow block. Provided relatively movable back and forth, the overflow block is provided movable back and forth in the mold opening and closing direction,
The work die is provided with a tape that is larger than the opening of the cavity recess in a plan view, is clamped by the upper die and the lower die, and is attached to the workpiece. The molding die according to claim 1,
The upper mold on which the workpiece is disposed includes a chuck that is provided around a mold surface and holds the workpiece holder on the upper mold. The molding die according to claim 1 or 2,
The workpiece holder further includes a frame body having an opening as an inner portion of the frame,
The tape is held on the frame body so that the work adhered to the tape is positioned in the opening in a plan view. In the molding die according to claim 3,
The frame body includes first and second frame bodies that can be disassembled, and a hollow portion of the first frame body so that an outer peripheral edge of the tape is sandwiched between the first frame body and the second frame body. The second frame body is fitted together to hold the tape. The molding die according to claim 3 or 4,
The work holder has the opening of the frame body aligned with an opening as an inner portion surrounding the overflow block in the clamper block, and the tape is brought into close contact with the upper mold surface on which the work is disposed. In this state, the tape and the frame body are clamped by the upper die and the lower die clamper block. The molding die according to claim 3 or 4,
The workpiece holder has an opening of the frame body larger than the clamper block, and the tape of the upper mold and the lower mold is in close contact with the upper mold surface where the workpiece is disposed. The tape is clamped by the clamper block. The molding die according to claim 3 or 4,
The upper mold on which the workpiece is disposed includes a housing portion that houses the frame body on a mold surface,
In the state where the frame body is housed in the housing portion and the tape is in close contact with the mold surface of the upper mold, the work holder holds the tape between the upper mold and the lower mold clamper block. Clamped. A molding apparatus using the molding die according to any one of claims 1 to 7,
A transport unit for transporting the work before resin sealing combined with the work holder;
A press part for resin-sealing the workpiece with the molding die;
A molding apparatus comprising: a storage unit that stores a molded product that is the resin-sealed workpiece. A method for producing a molded article using the molding die according to any one of claims 1 to 7,
The upper mold and the lower mold are brought close to each other from the state where the molding die is opened, the work holder is clamped by the upper mold and the clamper block of the lower mold, and the cavity recess is formed. Forming a cavity including the resin, and encapsulating a resin in the cavity;
And a step of bringing the upper mold and the lower mold close to each other and filling the cavity with the resin. Among the upper mold and the lower mold, one mold in which the workpiece is arranged via a workpiece holder that holds the workpiece,
Of the upper mold and the lower mold, the other mold having a cavity recess filled with a resin for sealing the workpiece,
A pressure reducing mechanism for reducing the pressure between the upper mold and the lower mold,
The work holder is larger than the opening of the cavity recess in plan view, is clamped by the upper mold and the lower mold, and includes a tape to which the work is attached.
The one mold includes a tape adsorbing mechanism that adsorbs and holds the tape against a force of peeling the tape from the one mold by being depressurized by the depressurization mechanism ,
The molding die having a suction path for sucking the tape in a state of being held by a frame body having an opening as an inner portion of the frame .

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