JP2020026088A - Workpiece carrying device, resin carrying device, and resin molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a work transfer device capable of positioning and transferring a work to a molding die with a simplified device configuration. In a work transfer device 1 holding a work W, a transfer device main body 2 is positioned by a positioning part provided on a mold clamping surface of a molding die 6, and a work holding part 3 holds the work W. After moving the workpiece W to the set position provided on the mold surface by the work holding section 3 by moving the workpiece W in the horizontal direction with respect to the positioned transport mechanism main body 2, and/or after the workpiece W is molded from the set position. The work W is received by the work holding unit 3 and carried out from the molding die. [Selection diagram] Fig. 3

Description

  The present invention relates to a work transfer device for loading and unloading a work before and after molding to and from a mold, a resin transfer device for loading and unloading resin before and after molding to and from a mold, and a resin mold having at least one of them. Related to the device.

  In recent years, the thickness of the work has been reduced, and the cavity filled with the mold resin has become thinner, while the resin mold area (work size) has been increasing. In addition, from the viewpoint of increasing the speed of a semiconductor device, products that perform flip-chip connection, in which a semiconductor chip (hereinafter abbreviated as “chip”) is connected to a substrate by bumps without using wires, are increasing. Therefore, it is necessary to perform underfill molding in a narrow gap between the chip and the substrate. There is also a need for exposing the chip surface and performing resin molding because of the need to radiate heat generated by the chip. As an example, a heat radiation effect can be obtained by bonding a heat radiation plate to the exposed surface. Further, in order to reduce the manufacturing cost, a chip size is changed from a strip substrate type having a work size of, for example, 100 × 300 mm or less to a substrate having a wiring pattern formed on a larger semiconductor wafer-like work. Etc. In addition, since there are a number of semiconductor manufacturing methods, for example, a thermoplastic tape was attached to a semiconductor wafer-shaped circular carrier, a chip was further attached on the tape, and the carrier and the tape were peeled off after molding. There is also a so-called eWLB (embedded wafer level ball grid array) for connecting a rewiring layer to the terminal side of the chip later. In this case, there is a demand that the back surface of the chip be exposed and molded in order to enhance the heat radiation effect. In other words, there is a demand for performing resin molding in which a chip is exposed using a carrier having the same circular shape as a semiconductor wafer as a semiconductor wafer. In the future, from the demand for further cost reduction, it is expected that there will be a demand for chip exposure molding of a square large-sized work larger than a circular work.

When the above-described circular work is carried into a mold and clamped at the outer peripheral edge for transfer molding, a resin path (including a runner gate, an overflow gate, an air vent, etc.) intersects with the end of the work, so that the molding resin In order to prevent the mold resin from leaking into the work end face, the work end face needs to be aligned with the opposite mold end face to eliminate the gap as much as possible.
However, since the work is circular, it is difficult to position the work by moving the work toward the end face of the mold. A technique has been proposed in which one end surface of a rectangular strip substrate is pushed and moved in the configuration on the mold side so that the opposite end surface is brought into contact with the end surface of the pot insert and aligned (Patent Document 1: JP-A-2015-51557). Gazette).

JP 2015-51557 A

  In the case of chip-exposed wafer type molding with flip-chip type chip connection, it is necessary to resin mold the cavity area with a small thickness and large area, and the compression molding cannot increase the resin pressure. However, it is suitable for molding by increasing the resin pressure to a narrow area.

  However, when resin-molding a so-called eWLB type work by transfer molding, many chips are mounted on the work near the end face of the circular cavity, so voids and unfilled areas between chips on the outer periphery of the work and under the chips are created. It is necessary not to leave it. Also, it is desired to make the gate width as wide as possible in order to maintain a good resin injection balance. However, since the work has a circular shape, unlike a rectangular substrate having a flat end surface, the amount of overhang that forms a resin path by a pot piece disclosed in Patent Literature 1 (cavity is higher than the work end by the pot piece) The length of the overlap to the edge) is too large. In addition, since the work is circular, even when a width shifting mechanism is provided on the mold side as shown in Patent Document 1 and the end surface of the work is pushed by a plurality of moving pieces, the work is pushed because the end surface is a curved surface. However, misalignment is likely to occur.

  DISCLOSURE OF THE INVENTION The disclosure applied to some embodiments described below is intended to solve the above-described problem, and an object of the disclosure is to position a work and / or a resin on a mold with a simplified device configuration. Provide a work transfer device and a resin transfer device that can be transferred as a product, and can prevent the mold resin from wrapping around the work end surface regardless of the shape of the work, and can mold a chip-exposed type semiconductor product that is flip-chip connected with high quality It is an object of the present invention to provide a resin molding apparatus capable of performing the above-mentioned steps.

The disclosure regarding some embodiments described below includes at least the following configuration.
That is, a work transfer device that carries in a work into a mold, and performs at least one transfer operation of carrying out the formed work from the mold, and is provided on a mold clamping surface of the mold. A transfer device main body that is positioned with respect to the mold die by the positioning unit, and a work holding unit provided on the transfer device main body and holding the work, wherein the work holding unit holds the work. The transfer device main body positioned on the die clamping surface is provided so as to be movable in the horizontal direction.
According to the above configuration, in the work transfer device holding the work, the transfer device body is positioned by the positioning portion provided on the mold clamping surface of the mold, and the work holding portion is positioned while holding the work. By moving the work horizontally with respect to the transfer device main body, the work is positioned at the set position provided on the mold surface by the work holding unit, and is carried in and / or the molded work is moved from the set position to the work holding unit. It can be received and taken out of the mold.

What is claimed is: 1. A work transfer device for carrying a work into a mold die and carrying out the formed work from the mold die, wherein the positioning part is provided on a mold clamping surface of the mold die with respect to the mold die. And a work holding unit provided on the transfer device main body and holding the work, wherein the work holding unit is positioned on the mold clamping surface while holding the work. It is characterized in that it is provided so as to be movable in the horizontal direction with respect to the transporting device main body.
According to the above configuration, it is possible to position the work at the set position provided on the mold surface by the work holding unit, carry in the work, receive the molded work from the set position at the work holding unit, and carry out the work from the mold. it can.

What is claimed is: 1. A resin transfer device for transferring a mold resin to a mold die and carrying out unnecessary resin from the mold after molding, wherein a positioning portion provided on a mold clamp surface of the mold is used to position the mold resin relative to the mold. The transfer device main body, which is positioned, and a resin holding portion provided on the transfer device main body and capable of holding the mold resin supplied to the mold and the unnecessary resin after molding, respectively, The portion is provided so as to be movable in the horizontal direction with respect to the transfer device main body positioned on the mold clamping surface.
According to the above configuration, it is possible to supply the mold resin to the predetermined position provided on the mold surface by the work holding unit, receive the unnecessary resin separated from the molded work by the work holding unit, and carry out the unnecessary resin from the mold. it can.

  A work transfer device that transfers a work and a mold resin to a mold, and unloads the formed work and unnecessary resin from the mold, and includes a positioning unit provided on a mold clamping surface of the mold. A transfer device main body that is positioned with respect to the mold die, a work holding unit provided on the transfer device main body and holding the work, and the mold provided to the transfer device main body and supplied to the mold die A resin holding portion capable of holding a resin and unnecessary resin after molding, respectively, wherein the resin holding portion is a first resin holding portion for holding the mold resin supplied to the mold, and A second resin holding portion for holding the unnecessary resin is provided so as to be alternately movable to a carry-in / carry-out position of the transfer device main body.

  According to the above configuration, the work holding unit positions the work at the set position provided on the mold surface, carries in the work, receives the molded work from the set position at the work holding unit, and unloads the work from the mold. In addition to the above, the resin holding section holds the molding resin by the first resin holding section by alternately moving the first resin holding section and the second resin holding section to the loading / unloading position of the transfer device main body. The resin is supplied to the mold, and the unnecessary resin after molding can be held by the second resin holding portion and carried out of the mold. Therefore, the apparatus configuration can be simplified by using both the mold loading and unloading operations of the work and the resin.

  When the first resin holding portion and the second resin holding portion are provided so as to be movable in a horizontal direction with respect to a direction in which the transfer device main body enters the mold, the first resin holding portion is provided at the time of the work loading operation. By carrying out the operation of carrying in the mold resin according to the above, and carrying out the operation of carrying out the unnecessary resin by the second resin holding portion at the time of carrying out the work, it is possible to perform switching by the same work carrying device. Therefore, the transport device main body can be arranged compactly without increasing in size in the mold entry direction.

The first resin holding unit holds a solid resin, a powdery resin, a granular resin, a mold resin of any one form of a liquid resin, and the second resin holding unit sucks and holds a molded product cal. Is preferred.
Thereby, various forms of mold resin can be carried in by the first resin holding portion, and the molded product cull after molding can be carried out by the second resin holding portion.

  The work and the mold resin carried in from any of the above-described work transfer devices are clamped and resin-molded by the first mold and the second mold of the mold, and the molded work and unnecessary resin are removed. A resin molding device that is carried out by the work transfer device, wherein the work is configured to be a moving passage of air or mold resin connected to a cavity recess formed in any of the first mold and the second mold. A movable piece having a bridging portion arranged to be overlapped at an end thereof and supported so as to be separated from the mold clamping surface when the mold is opened is provided. The work is separated from the clamp surface, the work held by the work transfer device is horizontally moved to the set position where the work is overlapped with the bridging portion, and the work is delivered and transferred. The movable piece the work end sandwiched by the said bridge portion is pushed down, characterized in that it is clamped.

As a result, the work held by the work transfer device is separated from the mold clamping surface and the work is horizontally transferred to the set position overlapping the bridge of the movable piece, and the work is transferred. Even a shaped work can be positioned by the work holding part and transferred to the mold.
In addition, the movable piece is pushed down by the mold closing operation, and the work end is sandwiched and clamped by the bridging portion. Therefore, it is possible to prevent the mold resin from wrapping around the work end face.

The movable piece may be any one of a pot piece, a runner gate piece, and an air vent piece formed so that the bridge portion is connected to the cavity recess.
Thus, whether the mold is a transfer mold or a compression molding, accurate positioning with respect to the mold is performed irrespective of the shape of the work, and no resin leakage occurs at the end of the work.

A plurality of support pins are provided at a set position where the work is transferred so as to be able to advance and retreat from a mold surface, and the work transfer device is moved to a position where a work end surface overlaps the movable piece and is at a protruding position. Delivered to the support pin.
Thus, when the work is transferred to the mold, the work is not damaged by sliding on the mold surface.

  The work and the molding resin are loaded into the mold die having the first mold and the second mold by the work transfer device and clamped, and the resin is molded, and the formed work and unnecessary resin are transferred to the work transfer device. A resin molding method for unloading from the mold die, wherein the mold clamping surface of the first die of the opened mold die is aligned with a transfer device main body; A set position where a movable piece biased and supported so as to be separated from the first mold clamping surface when the mold is opened and a work end overlapping the work holding portion which holds the work movably provided in the first mold clamping surface. Moving the workpiece and the molding resin from the workpiece holding unit to the first mold clamping surface; closing the mold and closing the mold; A step of clamping the piece so as to overlap the end of the work, and heating and curing the mold resin filled in the cavity recess; and the step of opening the first mold and the second mold when the mold is opened. A step in which the piece is separated from the first mold clamping surface to separate the work and unnecessary resin after molding, and a step of holding and holding the work by the work transfer device and sucking and holding the unnecessary resin; And carrying out the molded product and the unnecessary resin from the mold while holding the molded product and the unnecessary resin.

According to the resin molding method, the work and the mold resin can be held and carried into the mold using the same work transfer device, and the molded work and the unnecessary resin can be carried out of the mold while being separated. Therefore, the device configuration can be simplified.
In addition, when the work transfer device is carried into the mold, the work is separated from the mold clamping surface, and the work is horizontally transferred to the set position where the work is overlapped with the bridge portion of the movable piece. In addition, even for a circular work, the work can be positioned by the work holding portion and transferred to the mold. Further, since the movable piece is pressed down by the mold closing operation and clamped so as to overlap with the work end, it is possible to prevent the mold resin from going around the work end face.

A work transfer device and a resin transfer device capable of positioning and transferring a work and / or a resin to a mold with a simplified device configuration can be provided.
It is possible to provide a resin molding apparatus capable of preventing the mold resin from wrapping around the work end surface regardless of the shape of the work and capable of molding a high-quality flip-chip connected chip-exposed semiconductor product.

FIG. 4 is a cross-sectional explanatory view of a work and a resin tablet supply centering on a molding die of a resin molding apparatus by transfer molding. FIG. 2 is an explanatory diagram of a resin molding step showing a loading operation of a work and a mold resin following FIG. 1. FIG. 3 is an explanatory view of a resin molding step showing a loading operation of a work and a mold resin following FIG. 2. FIG. 4 is an explanatory diagram of a resin molding process showing a mold closing operation and a mold opening operation following FIG. 3. FIG. 5 is an explanatory diagram of a resin molding process showing the unloading operation of a molded article and unnecessary resin following FIG. 4. FIG. 6 is an explanatory diagram of a resin molding process showing an unloading operation of a molded article and unnecessary resin following FIG. 5. FIGS. 7A and 7B are a plan view and a cross-sectional view for explaining the reason why the work transfer is performed by the work transfer device. FIG. 8A is an upper mold plan view, and FIG. 8B is a lower mold plan view. It is explanatory drawing which shows the positioning operation of the workpiece | work with respect to a pot position. FIG. 10A is a plan view of the work transfer device during the carry-in operation, and FIG. 10B is a plan view of the work transfer device during the carry-out operation. FIG. 11A is a cross-sectional explanatory view of a resin molding apparatus using a runner gate as a movable piece, and FIG. 11B is a cross-sectional explanatory view of a resin molding apparatus using an air vent and a runner gate as a movable piece. It is sectional drawing of the resin molding apparatus for compression molding which uses an air vent as a movable piece.

  Hereinafter, preferred embodiments of a work transfer device according to the present invention and a resin molding device and a method including the same will be described in detail with reference to the accompanying drawings. In addition, the term “mold” refers to an upper mold and a lower mold supported by a mold base, respectively, and refers to a mold excluding a mold opening / closing mechanism (press device). Further, when referring to a resin molding device, it is a device having at least a mold and a mold opening / closing mechanism for opening and closing the mold (pressing device such as an electric motor and a screw shaft or a toggle link mechanism; not shown). For automation, the apparatus is provided with a resin transfer device or a work transfer device, and a work unloading device after molding. In the case of transfer molding, a transfer mechanism for operating a plunger inserted into the pot, and a decompression mechanism for forming a decompression space in the mold when the mold is closed are provided. Hereinafter, the configuration of the mold will be mainly described. In addition, the work W is assumed to be a case in which a semiconductor wafer-like circular shape on which chips are mounted is resin-molded, but the work W is not particularly limited to a circle, and may be a square or a rectangle. The mold will be described as an example in which the lower mold is a movable mold and the upper mold is a fixed mold. However, the upper mold may be a movable mold and the lower mold may be a fixed mold, or both may be movable molds.

  First, FIG. 1B and FIG. 1B show an example of a work transfer device 1 that is used in a resin molding apparatus and transfers a work and a mold resin to a mold, and carries out a molded work and unnecessary resin from the mold. This will be described with reference to FIGS.

  The transfer apparatus main body 2 is provided with a work holding portion 3 that holds the outer peripheral end portion of the work at a plurality of places and a resin holding portion 4 that can hold the mold resin R1 and the unnecessary resin R2 after molding. A plurality of positioning blocks 2a are provided on the transfer device main body 2, and positioning with respect to the mold clamping surface is performed by a positioning portion (lock block) provided on the mold clamping surface of the mold as described later. You.

Also, as shown in FIG. 10A, the work holding unit 3 is provided with chuck jaws 3a at four positions at 90 degrees along the outer periphery of the work so as to be openable and closable so as to hold a circular work W. ing. Although the chuck claws are provided at four positions, the number thereof is not limited as long as they can be stably sandwiched and conveyed. A notch W1 for positioning is provided on the outer periphery of the circular work W. In the work holding portion 3, the positioning pin 3b is locked in the notch portion W1 so that the work W is stopped and positioned and held.
Further, the work holding unit 3 is provided so as to be movable in at least one of the X direction and the Y direction orthogonal to each other with respect to the transfer device main body 2. In the present embodiment, the work holding section 3 is moved in and out of the carry-in / out position (see FIG. 10A) and the transfer position (see FIG. 10 (b)). The delivery position is a position where the work center of the transfer device main body 2 and the work center of the lower die 8 overlap. The carry-in / carry-out position is a position offset from the delivery position to a position where the work end does not hit the bridging portion 8e1 of the pot piece 8e when the work W moves up and down as described later.
Further, a cleaning brush 2b is provided on the front side of the transfer device main body 2 in the mold entry direction. When the cleaning brush 2b is operated, the surface of the mold can be cleaned when the work transfer device 1 moves into and out of the mold.

  According to the above configuration, in the work transfer device 1 holding the work W and the mold resin R1, the transfer device main body 2 is positioned by the positioning portion provided on the mold clamping surface of the mold, and the work holding portion 3 is moved to the X position. By moving the work W in at least one of the -Y directions (horizontal direction), the work W and the mold resin R1 can be positioned and supplied to the mold in the work loading operation of the work transfer device 1.

  In FIGS. 10A and 10B, a resin holding unit 4 is provided in the transfer apparatus main body 2 along with the work holding unit 3. The resin holding unit 4 includes a first resin holding unit 4a that holds a mold resin R1 supplied to a mold and a second resin holding unit 4b that holds an unnecessary resin R2 after molding. It is provided so as to be alternately movable to the carry-out position (pot hole 8e2). In this embodiment, the first resin holding part 4a is provided with a cylindrical storage part 4a1 for holding a solid resin (tablet-like resin) and a shutter 4a2 for opening and closing the bottom part. The second resin holding portion 4b is provided with a suction pad 4b1. The suction pad 4b1 is suctioned by air by a suction device (not shown) to suck and hold the unnecessary resin R2 after resin molding. The unnecessary resin R2 may be sucked by the suction pad 4b1, but may be gripped by a chucking claw mechanism.

  The first resin holding part 4a and the second resin holding part 4b are arranged in a direction perpendicular to the direction of entry into the mold to the carry-in / out position (pot-corresponding position) of the transfer device main body 2 (transverse direction of the transfer device main body 2). : Y direction). Note that the transfer device main body 2 may be provided so as to be movable in the longitudinal direction (X direction). As a result, during the work carrying-in operation (see FIG. 10B), the operation of carrying in the mold resin R1 (tablet resin) into the mold by the first resin holding portion 4a is performed, and at the time of the work carrying-out operation (see FIG. ) Can be performed by switching the unloading operation of the unnecessary resin R1 (molded product) from the mold by the second resin holding portion 4b.

  According to the above configuration, the work holding unit 3 can hold the work W before and after molding, and the resin holding unit 4 includes the first resin holding unit 4a that holds the mold resin R1 supplied to the mold, The second resin holding portion 4b for holding the unnecessary resin R2 (molded product cull) after molding and the carry-in / out position (pot hole 8e2: see FIG. 1A) of the transfer device main body 2 are provided so as to be alternately movable. Therefore, the work and the resin before and after molding can be loaded and unloaded by the same work transfer device.

  The first resin holding portion 4a may hold any one of the mold resin R1 among the powder resin, the granular resin, and the liquid resin in addition to the solid resin. Thus, regardless of which type of resin is used, the common work transfer device 1 can carry out the loading / unloading operation of the resin together with the work W. In the case of a liquid resin, a syringe may be used.

Next, the configuration of the resin molding device 5 will be described with reference to FIGS.
1A and 1B illustrate a resin molding device 5 for transfer molding. It should be noted that the mold opening / closing mechanism is omitted, and the description will focus on the configuration of the mold 6.
The molding die 6 clamps the work W and the molding resin R1 carried in from the above-described work transfer device 1 by an upper die 7 (first die) and a lower die 8 (second die) to form a resin. The molded article W and the unnecessary resin R2 after being molded are unloaded by the work transfer device 1.

First, the configuration of the upper die 7 will be described. In FIG. 1 (a), an upper die block 7b is suspended from the upper die base 7a in an annular shape along the outer peripheral edge thereof. An upper lock block 7c for positioning with the lower die 8 protrudes from the lower end surface of the upper die block 7b. As shown in FIG. 8A, on two pairs of opposing sides of the upper block 7b, upper lock blocks 7c (convex blocks) are respectively arranged on a center line passing through the center of the work W. Note that the lock block does not necessarily need to be arranged on the center line passing through the center of the work W, and may be provided at least on each side.
In the upper die space surrounded by the upper die block 7b, a rectangular upper die clamper 7d and a circular upper die cavity piece 7e are suspended from and supported by the upper die base 7a via a coil spring 7f. (See FIGS. 1A and 8A). An upper mold cavity recess 7n is formed by an upper mold cavity piece 7e (cavity bottom) and an upper mold clamper 7d (cavity side) surrounding the same.

  An upper mold cull 7g and an upper mold runner gate 7h connected thereto are engraved on the clamp surface (lower end surface) of the upper mold clamper 7d so as to be connected to the upper mold cavity recess 7n. A plurality of upper air vent grooves 7i connected to the upper mold cavity recess 7n are formed on the opposite side of the upper mold runner gate 7h and the work via the upper mold cavity recess 7n of the upper mold clamper 7d. A shut-off pin 7j is attached to each upper air vent groove 7i so as to be openable and closable. The shut-off pin 7j is assembled in the upper mold base 7a in a state of being urged downward via a coil spring 7k. Thereby, the tip (lower end face) of the shut-off pin 7j is supported at a position substantially flush with the groove bottom of the upper die air vent groove 7i.

  The release film F is sucked and held by suction holes (not shown) and covers the upper die clamping surface including the upper die cavity recess 7n and the resin path connected thereto. This is because in order to expose and mold the surface of the semiconductor chip T mounted on the work W, it is necessary to cover the surface with the release film F sucked and held in the upper mold cavity recess 7n. The release film F may be either a long film continuous in a long shape between reels or a single-sheet film cut in accordance with the size of the upper clamp surface. The release film F has a thickness of about 50 μm and has heat resistance, is easily peeled from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP film, A single-layer or multilayer film containing fluorine-impregnated glass cloth, polypropylene film, polyvinylidene chloride or the like as a main component is suitably used.

Next, the configuration of the lower die 8 will be described.
A lower mold block 8a is annularly supported along the outer peripheral edge of the lower mold base (not shown in FIG. 1A). A lower lock block 8b (two pairs of rectangular parallelepiped blocks or one concave block) for positioning with the upper die 7 is provided on the upper end surface of the lower die block 8a. As shown in FIG. 8B, concave portions 8c of the lower lock block 8b are respectively arranged on opposing sides of the lower die block 8a on a center line passing through the center of the work W. It is not always necessary to dispose the lock block on a center line passing through the center of the work W, and it is sufficient to provide the lock block on at least each side. If the upper lock block 7c and the lower lock block 8b mesh with each other, the side Anywhere.
Therefore, the upper die lock block 7c engages with the concave portion 8c of the lower die lock block 8b, whereby the upper die 7 and the lower die 8 are aligned and clamped.

  A sealing material 8d is annularly fitted into the clamp surface of the lower die block 8a. The lower mold block 8a is in contact with the opposing clamp surface of the upper mold block 7b to seal the space in the mold. In the lower die block 8a, a pot piece 8e (movable piece) is urged upward with respect to the lower die base by a coil spring 8s with respect to the lower die base and is floatingly supported. The upper end of the pot piece 8e comprises a flat mold parting surface and a bridging portion 8e1, and a pot hole 8e2 is formed substantially at the center. The pot hole 8e2 has a cylindrical shape in which the mold resin R1 is loaded, and a plunger 8f is inserted into the pot hole 8e2 so as to be able to move up and down.

  In a mold space surrounded by the lower mold block 8a, a circular work support block 8g is supported and fixed to the lower mold base. The upper end surface of the work support block 8g is supported such that the height is lower than the upper end surface of the lower mold block 8a around the work support block 8g by a height corresponding to the plate thickness of the work W. As a result, the work W is placed in the set recess 8h formed by the work support block 8g and the lower mold block 8a surrounding the work support block 8g. The set recess 8h can also serve as positioning for placing the workpiece W, but the positioning pin 8t (see FIG. 8B) corresponding to the positioning V notch provided on the workpiece W is erected from the lower die 8. Thus, the set portion does not necessarily need to be a concave portion.

  7 (a) and 7 (b), a bridging portion 8e1 is formed at the upper end of the pot piece 8e so as to overlap the upper end of the work W placed in the set recess 8h in an overhang shape. Have been. The bridge portion 8e1 is provided at a position facing the upper mold runner gate 7h, and is formed in a wedge shape so that the plate thickness becomes thinner toward the outer peripheral edge from the pot side. As a result, the mold resin R1 passes between the bridge portion 8e1, which is the upper end surface of the pot piece 8e, and the upper mold runner gate 7h and fills the upper mold cavity recess 7n. And no resin leakage occurs due to straddling. Although the runner and the gate groove forming the upper mold runner gate 7h are provided on the upper mold side in this example, they may be provided on the bridge portion 8e1 side or on both sides. Since the boundary between the upper mold runner gate 7h and the cavity is a gate, the cross-sectional shape is tapered so that a gate break described later can be easily performed.

  Further, as shown in FIG. 8B, the work W has a large number of chips T arranged near the circular end. Since the mold area is thin and has a large area, it is necessary to ensure the injection balance of the resin so that no unfilled area of the mold resin R1 is formed in the horizontal gap between the chips T and the gap under the chip T. For this reason, in consideration of the filling property of the mold resin R1, the runner gate width G (see FIG. 7A) on the tip side (the connection side gate between the cavity and the runner) connected to the cavity is desired to be as wide as possible. It has a tapered shape in which the width G increases toward the cavity. When the pot piece 8e is superimposed on the circular work W in plan view, the overhang amount L of the bridge portion 8e1 (the length of the overlap from the work overlapping end of the pot piece 8e to the outer peripheral end of the work: FIG. 7B) See)). Therefore, when the upper and lower molds are closed, a resin path is formed between the upper end surface of the pot piece 8e and the upper mold runner gate 7h.

  Further, the bridging portion 8e1 of the pot piece 8e is separated from the lower die clamping surface in the mold opened state (see FIG. 1A), and the work end surface held by the work transfer device 1 is located below the bridging portion 8e1. After the setting recess 8h is positioned (see FIG. 3B), the work W is clamped to the mold 6 by overlapping the bridge 8e1 so as to overlap the outer peripheral end of the work. As described above, the work W is positioned not only by the die structure but also by the work transfer device W. Since the work W is particularly circular, a moving piece such as a conventional rectangular board width shifting mechanism is used. In order to push the end of the work toward the pot side by using, the amount of movement (the amount of overhang L of the bridging portion 8e1) is large due to the large size of the work W, which is likely to cause displacement and rotation of the work W. is there. The lower die 8 may be provided with a positioning pin 8t corresponding to a V-notch for positioning provided on the workpiece W to perform rotation prevention and positioning (see FIG. 8B).

  In FIG. 1A, the work support block 8g is provided with a plurality of suction holes 8i for sucking and holding the work W placed in the set recess 8h. The suction holes 8i are connected to a suction device (not shown). Further, a plurality of support pins 8j that can move through the work support block 8g are provided. The support pin 8j is provided movably at a position where the pin tip protrudes from the bottom of the set recess 8h and at a position where the pin tip retreats into the work support block 8g. When the work W held by the work transfer device 1 is transferred to the set recess 8h, the tip ends of the plurality of support pins 8j are protruded from the set recess 8h so that the work W is received by the support pins 8j. Passed. Thus, when the work W is positioned on the mold, the work W is not damaged by sliding with the mold surface. Note that the support pins 8j may be omitted.

  Further, a suction hole 8k is provided at a position radially inside the seal member 8d of the lower mold block 8a and opposed to the upper mold overflow cavity 7r (see FIGS. 8A and 8B). The suction hole 8k is connected to a suction device (not shown). In a state where the work W is clamped to the mold 6, air is sucked through the suction hole 8 k, so that air remaining in the upper mold cavity concave portion 7 n is discharged through the upper mold air vent groove 7 i and resin molding is performed. The occurrence of is prevented.

  According to the above configuration, when the work W held by the work transfer device 1 is carried into the mold 6, the work W is positioned in a state where the work end surface is slid to a position overlapping the bridging portion 8 e 1 of the pot piece 8 e. Since the workpiece W is transferred to the lower die 8 (setting recess 8h), accurate positioning with respect to the mold 6 is performed regardless of the shape of the work W, and resin leakage does not occur at the end of the work.

Here, an example of a work loading / unloading operation by the work transfer device 1 and an example of a resin molding operation by the resin molding device 5 will be described with reference to FIGS.
FIG. 1A shows a state where the mold 6 is opened. A release film F (a long film or a single-wafer film) is supplied to the clamp surface of the upper die 7. In the lower die 8, the pot piece 8e is in a state of being urged upward such that the bridge portion 8e1 is separated from the lower die block 8a.

  FIG. 1B illustrates a process in which the work W and the tablet resin R1 are carried into the opened mold die 6 by the work transfer device 1. The work W is held at its outer peripheral end by the chuck claws 3a of the work holding unit 3, and the tablet resin R1 is held by the resin holding unit 4 (first resin holding unit 4a). The positioning block 2a of the transfer device main body 2 is aligned with the concave portion 8c of the lower mold lock block 8b. The work W held by the work holding unit 3 is held at a position offset from the set recess 8h because the work holding unit 3 is at the carry-in / out position. Further, the work W and the tablet resin R1 may be carried in by different transporting devices instead of the same transporting device.

  Next, as shown in FIG. 2A, the work transfer device 1 is lowered toward the clamp surface of the lower die 8, and the positioning block 2a of the transfer device main body 2 is fitted into the concave portion 8c of the lower die lock block 8b. Then, the transfer apparatus main body 2 is positioned with respect to the lower mold 8. Thus, the cylindrical storage portion 4a1 of the resin holding portion 4 is concentrically positioned just above the pot hole 8e2.

As shown in FIG. 2B, the work holding unit 3 holding the work W is moved laterally from the loading / unloading position to the delivery position. At this time, the work W moves horizontally to a position overlapping the position below the bridge portion 8e1 of the pot piece 8e. As a result, the outer peripheral end of the work W is aligned with the set recess 8h.
Further, the tablet resin R1 is loaded from the resin holder 4 into the pot hole 8e2 of the pot piece 8e. Specifically, the shutter 4a2 that closes the bottom of the cylindrical storage portion 4a1 is opened to drop the tablet resin R1 into the pot hole 8e2.

As shown in FIG. 3A, the tip of the support pin 8j inserted into the work support block 8g is projected from the bottom of the set recess 8h, and the work W is released by opening the chuck claw 3a of the work holding unit 3. Transfer to the support pin 8j.
Next, as shown in FIG. 3B, after the work transfer device 1 rises from the lower die 8, it retracts outside the mold 6. The work W is stored in the set recess 8h by being retracted into the work support block 8g by the support pin 8j, and is sucked and held in the suction hole 8i. The release film F is held by suction on the clamp surface of the upper die 7.

  As shown in FIG. 4A, for example, the lower die 8 rises with respect to the upper die 7 to close the mold 6. When air suction is started from the suction hole 8k and the upper mold block 7b and the lower mold block 8a sandwich the sealing material 8d, a reduced pressure space is formed in the upper mold cavity recess 7n through the upper mold air vent groove 7i. The work W is clamped by the upper mold clamper 7d, and the surface of the chip T is pressed against the upper mold cavity piece 7e via the release film F. The plunger 8f is raised to fill the mold resin R1 melted in the pot hole 8e2 into the upper mold cavity recess 7n through the upper mold cul 7g and the upper mold runner gate 7h. When the mold is closed again when the resin comes close to the air vent, the tip of the shut-off pin 7j relatively protrudes from the upper mold clamper 7d, shuts off the upper air vent groove 7i, and stops the flow of resin and air. . The mold resin R1 in the cavity concave portion 7n in which the flow has stopped is kept under pressure while being heated and pressurized and hardened.

When the curing of the mold resin is completed, the mold 6 is opened as shown in FIG. The pot piece 8e is moved by the bias of the coil spring 8s (see FIG. 8B) so that the bridge portion 8e1 is separated from the lower mold block 8a. The pot piece 8e is not limited to the coil spring 8s, but may be moved upward by a separately driven cylinder or motor. The work W is still suction-held in the setting recess 8h. As a result, the unnecessary resin R2 (molded product cull) on the pot piece 8e is separated from the molded product (package portion) by a gate break and rises. Since the release film F is suction-held on the clamp surface of the upper mold 7, it is easily separated from the resin. Since the height position of the plunger 8f has not changed, the unnecessary resin R2 is released from the tip of the plunger with the upward movement of the pot piece 8e. Further, the unnecessary resin R2 on the pot piece 8e may be released by being moved upward until the plunger 3g pushes up the unnecessary resin R2 from below. This plunger upward movement may be performed when the second resin holding portion 4b of the work transfer device 1 is disposed on the unnecessary resin R2 to prevent the unnecessary resin R2 from jumping out.
After the mold 6 is opened, the work transfer device 1 enters the mold. Specifically, the transporting apparatus main body 2 enters the position where the lower die 8 can be aligned. The work holding section 3 is at the work transfer position and the chuck pawl 3a is open. In addition, the resin holder 4 has moved to a position where the second resin holder 4b faces the pot hole 8e2 as shown in FIG. 10A.

  As shown in FIG. 5A, the support pin 8j rises from the work support block 8g and pushes up the work W from the set recess 8h while supporting the work W at the tip of the pin. In this state, the work transfer device 1 is lowered to hold the outer peripheral end of the work W with the chuck claws 3a of the work holding unit 3 and to remove the unnecessary resin R2 (molded product card) with the suction pad 4b1 of the second resin holding unit 4b. ) Is held by adsorption. At this time, the plunger 8f may be lifted to push up the unnecessary resin R2 from the upper surface of the pot piece 8e to positively release the mold. When the work transfer device 1 is raised in this state, the outer peripheral end of the work W and the bridge 8e1 of the pot piece 8e interfere with each other. Then, the support pin 8j is lowered, and the work holding unit 3 holding the work W is moved laterally from the transfer position shown in FIG. 5A to the carry-in / out position separated from the pot piece 8e shown in FIG. 5B. . Thereby, the outer peripheral end of the work W and the bridge portion 8e1 of the pot piece 8e do not overlap in the height direction.

As shown in FIG. 6, the work transfer device 1 is lifted while the work holding unit 3 holds the work W and the second resin holding unit 4b (suction pad 4b1) holds the unnecessary resin R2 (molded product cull), Retreat outside the mold 6. At this time, the cleaning brush 2b provided on the transport device main body 2 descends to the lower mold clamping surface, rotates the brush, and evacuates while removing the resin residue by rubbing the lower mold surface and sucking air. The release film F sucked and held on the clamp surface of the upper die 7 is released and released, and is replaced with a new release film F. In the case of a long release film, it is fed horizontally and replaced with a new part.
The work W carried out of the mold 6 by the work transfer device 1 and the unnecessary resin R2 are separated and collected.

According to the resin molding method, the work W and the mold resin R1 held by the work transfer device 1 are held and carried into the mold 6 and the molded mold W and the unnecessary resin R2 are separated while the mold W is separated. 6, the transport device configuration can be simplified.
Further, when loading the workpiece transfer device 1 into the mold 6, the workpiece W is slid from the loading / unloading position to the transfer position corresponding to the set recess 8 h to a position overlapping the bridge portion 8 e 1 of the pot piece 8 e in the height direction. Since the work W is transferred to the lower die 8 (set recess 8h) in a state of being slid, accurate positioning with respect to the mold die 6 is not limited to the shape of the work W, not only a rectangular work but also a circular work. Is performed, and no resin leakage occurs at the end of the work.

In the above-described embodiment, the work W is assumed to be a circular semiconductor wafer. However, the work W is not limited to a circular shape, and may be a strip-shaped substrate or a large-sized (square or rectangular) substrate. Further, the pot provided for the lower die 8 is provided at one place for the pot piece, but a plurality of pots may be arranged in one pot piece, or may be provided in a plurality of rows. Although only one pot piece 8e is shown, a plurality of pot pieces 8e may be provided for the work W.
Further, the work holding unit 3 provided in the work transfer device 1 can be moved between the carry-in / out position and the transfer position in the longitudinal direction of the transfer device main body 2, but depending on the arrangement of the pot pieces 8e, as shown in FIG. As shown, it may be provided so as to be movable in the XY directions according to the arrangement of the pot holes 8e2. Further, the work W may be moved obliquely, not only in the X-Y direction, as long as the work holder 3 can move in the horizontal direction. In any case, if the work W moves vertically during the mold setting, it interferes with the pot piece 8e. It would be good if things could be avoided.

FIG. 11A is a cross-sectional view of a resin molding apparatus having a movable runner gate piece 8n (movable piece) with a fixed pot instead of the pot piece 8e as a movable piece in another embodiment. The same members as those in the above-described embodiment are denoted by the same reference numerals, and the description will be referred to. Since the configurations of the work transfer device 1 and the upper die 7 are the same, the configuration of the lower die 8 will be mainly described.
A cylindrical fixed pot 8m is assembled to the lower die block 8a of the lower die 8, and a plunger 8f is inserted therein. A lower runner gate piece 8n is provided between the pot 8m and the set recess 8h so as to be able to move up and down. The lower runner gate piece 8n is connected and supported at the upper end of a lifting rod 8p that penetrates the lower block 8a. The lower mold runner gate piece 8n is urged upward by a coil spring (not shown) when the mold is opened.
The upper surface of the lower mold runner gate piece 8n forms a resin path between the upper mold cull 7g and the upper mold runner gate 7h facing each other. In particular, a bridge portion 8n1 is formed on the upper surface of the work W placed in the set recess 8h so as to overlap with the upper runner gate 7h and face the surface facing the upper runner gate 7h. Both ends of the bridging portion 8n1 are formed in a wedge shape such that the outer peripheral end connected to the upper mold cavity concave portion 7n and the outer peripheral end connected to the pot 8m become thinner.

  FIG. 11B is a cross-sectional explanatory view of the resin molding apparatus further provided with a lower bridge air vent piece 8q connected to the upper cavity recess and the upper air vent groove as a movable piece in FIG. 11A. A cylindrical fixed pot 8m is assembled to the lower die block 8a of the lower die 8, and a plunger 8f is inserted therein. A lower mold runner gate piece 8n is provided between the pot 8m of the lower mold block 8a and the set recess 8h so as to be able to move up and down. The lower runner gate piece 8n is connected and supported at the upper end of a lifting rod 8p that penetrates the lower block 8a. The lower mold runner gate piece 8n is urged upward by a coil spring (not shown) when the mold is opened.

  The upper surface of the lower mold runner gate piece 8n forms a resin path between the upper mold cull 7g and the upper mold runner gate 7h facing each other. In particular, a bridging portion 8n1 is formed on the upper surface of the work W placed in the set recess 8h so as to overlap with the upper runner gate 7h. Both ends of the bridging portion 8n1 are formed in a wedge shape such that the outer peripheral end connected to the upper mold cavity concave portion 7n and the outer peripheral end connected to the pot 8m become thinner.

Further, the upper mold clamper 7d is carved with an upper mold bridge air vent groove 7m connected to the upper mold cavity recess 7n and the upper mold air vent groove 7i. At a position facing the upper bridge air vent groove 7m of the lower die block 8a, a lower bridge air vent piece 8q (movable piece) is provided so as to be able to move up and down. The lower bridge air vent piece 8q is connected to and supported by the upper end of a lifting rod 8p penetrating the lower block 8a. When the mold is opened, the lower bridge air vent piece 8q is urged upward by a coil spring (not shown) or the like. The upper surface of the lower bridge air vent piece 8q forms an air vent path with the opposing upper bridge air vent groove 7m. In particular, a bridging portion 8q1 that overlaps and is arranged in an overhang shape is formed at the upper end portion of the work W placed in the setting recess 8h. Both ends of the bridging portion 8q1 are formed in a wedge shape so that the plate thickness becomes thinner toward the outer peripheral end portion connected to the upper mold cavity concave portion 7n and further toward the upper mold overflow cavity 7r side end portion.
As described above, in the configuration in which the lower runner gate piece 8n and the lower bridge air vent piece 8q are arranged on both sides of the setting recess 8h, the work holding portion 3 of the work transfer device 1 is arranged in the short direction of the transfer device main body 2. The workpiece W is slid in the direction perpendicular to the plane of FIG. 11B to position the work W and the set recess 8h, and the work W is delivered.

Although the above-described resin molding apparatus 5 uses the mold 6 for transfer molding, the resin molding apparatus 5 having the mold 6 for compression molding may be used.
The resin molding device 5 shown in FIG. 12 has a configuration in which the configuration of the lower die 8 in the configuration of the mold 6 in FIG. That is, the configuration of the upper mold 7 'in FIG. 12 is obtained by inverting the configuration of the lower mold 8 in FIG. The configuration of the lower die 8 'is different from that of the lower die base 8' and the lower die block 8b '. Hereinafter, different configurations will be described.

In the lower die 8 ', a lower die block 8b' is annularly supported on the lower die base 8a 'along the outer peripheral edge. A lower mold lock block (not shown) for positioning with the upper mold 7 'protrudes from the upper end surface of the lower mold block 8b'.
In the lower die space surrounded by the lower die block 8b ', an annular lower die clamper 8d' is floatingly supported on the lower die base 8a 'via a coil spring 8f'. A lower mold cavity piece 8e 'is supported and fixed to the lower mold base 8a' by being surrounded by the lower mold clamper 8d '. A lower mold cavity recess 8r is formed by a lower mold cavity piece 8e '(cavity bottom) and a lower mold clamper 8d' (cavity side) surrounding the lower mold cavity piece 8e '.

  A lower die bridge air vent groove 8m 'connected to the lower die cavity recess 8r is formed in the clamp surface (upper end surface) of the lower die clamper 8d'. The lower bridge air vent groove 8m 'is further connected to a plurality of lower die air vent grooves 8i'. A shut-off pin 8j 'is attached to each lower die air vent groove 8i so as to be openable and closable. The shut-off pin 8j 'is assembled in the lower die base 8a' while being urged upward via a coil spring 8k '. Thus, the tip (upper surface) of the shut-off pin 8j 'is supported at a position substantially flush with the bottom of the lower air vent groove 8i'. It is preferable that the release film F is suction-held on the lower mold clamping surface including the lower mold cavity recess 8r.

  While holding the work W in the work holding unit 3, the work transfer device 1 enters the mold 6 (in the left-right direction on the paper surface of FIG. 12) and causes the set recess 7h 'of the upper mold 7' to suction-hold. The work holding unit 3 slides in the short direction of the transfer apparatus main body 2 (perpendicular to the plane of FIG. 12) and overlaps the outer peripheral end of the work W such that the upper bridge air vent pieces 7q 'each overhang. And is carried in the direction perpendicular to the plane of FIG. The work holding unit 3 may hold the work W with the chuck claws 3a, and may also hold the work W while holding the work W by pressing the work W against the set recess 7h '. Since there is a possibility that resin residue may adhere to the surface of the upper die bridge air vent piece 7q 'in the work transfer device 1, a cleaning mechanism is not required, but it is preferable.

In addition, the mold resin R1 (for example, granular resin, powdery resin, liquid resin, etc.) may be supplied to the lower mold cavity recess 8r by the work transfer device 1, or the mold resin R1 may be supplied by another resin transfer and supply device. May be conveyed, or only the unnecessary resin R2 after molding may be taken out by another resin conveying and discharging device. In the compression molding, when the unnecessary resin R2 after the molding is not allowed to flow into the overflow cavity, the work W and the resin are taken out integrally. In addition, although the lower cavity compression molding die has been described as an example, in the case of the upper cavity compression molding die, the resin R1 may be placed on the work and simultaneously loaded into the die by the work transfer device. Further, a mold formed with upper and lower cavity concave portions may be used.
Furthermore, both the resin (R1, R2) before and after molding may be supplied and taken out separately from the work transfer device 1 by one resin transfer device. Further, although the supply and removal of the work are performed by the same work transfer device, the supply and the removal may be performed by separate work transfer devices. In any case, the work transfer device according to the present invention is used to supply and remove a work to and from the mold surface on the side where the movable piece of the mold exists, and to supply the same surface work of the mold and carry out the same surface work. Is effective, and the resin transport device is effective when the resin supply and unloading on the mold surface are the same mold surface.

  REFERENCE SIGNS LIST 1 work transfer device 2 transfer device main body R1 mold resin R2 unnecessary resin 2a positioning block 2b cleaning brush W work W1 notch portion 3 work holding portion 3a chuck jaw 3b positioning pin 4 resin holding portion 4a first resin holding portion 4a1 tubular storage Part 4a2 Shutter 4b Second resin holding part 4b1 Suction pad 5 Resin molding device 6 Mold 7, 7 ′ Upper die 7a Upper die base 7b Upper die block 7c Upper die lock block 7d Upper die clamper 7e Upper die cavity piece 7f Coil Spring 7g Upper mold cul 7h Upper mold runner gate 7i Upper air vent groove 7j, 8j 'Shut-off pin 7k, 8f', 8k ', 8s Coil spring 7m Upper bridge air vent groove 7n Upper cavity recess 7r Upper mold -Overflow cavity F Release film 8, 8 'Lower die 8a' Lower die base 8a, 8b 'Lower die block 8b Lower die lock block 8c Depression 8d, 7d' Sealing material 8d 'Lower die clamper 8e Pot piece 8e' Lower die Cavity piece 8e1, 8n1, 8q1 Bridge section 8e2 Pot hole 8f, 7j 'Plunger 8g, 7g' Work support block 8h, 7h 'Set recess 8i, 7i' Suction hole 8i 'Lower air vent groove 8j, j' Support pin 8k, 7k 'Suction hole 8m Pot 8m' Lower bridge runner gate groove 8n Lower runner gate piece 8p, 7p 'Elevating rod 7q' Upper bridge runner gate piece 8q Lower bridge air vent piece 8r Lower cavity recess

Claims (10)

A work transfer device that carries in the work into the mold, and performs at least one transfer operation of transferring the formed work from the mold.
A transfer device main body in which positioning with respect to the mold die is performed by a positioning portion provided on a mold clamp surface of the mold die,
A work holding unit provided on the transfer device main body and holding the work,
The work transfer device, wherein the work holding unit is provided so as to be movable in a horizontal direction with respect to the transfer device main body positioned on the mold clamping surface while holding the work. A work transfer device that carries the work into the mold, and carries out the formed work from the mold.
A transfer device main body in which positioning with respect to the mold die is performed by a positioning portion provided on a mold clamp surface of the mold die,
A work holding unit provided on the transfer device main body and holding the work,
The work transfer device, wherein the work holding unit is provided so as to be movable in a horizontal direction with respect to the transfer device main body positioned on the mold clamping surface while holding the work. A resin transport device that carries a mold resin into a mold, and carries out unnecessary resin from the mold after the molding,
A transfer device main body in which positioning with respect to the mold die is performed by a positioning portion provided on a mold clamp surface of the mold die,
A resin holding portion provided on the transfer device main body, the resin holding portion being capable of holding the mold resin supplied to the mold and unnecessary resin after molding, respectively.
The resin transfer device, wherein the resin holding portion is provided so as to be movable in a horizontal direction with respect to the transfer device main body positioned on the mold clamping surface. A work transfer device that carries the work and the mold resin into the mold, and carries out the molded work and unnecessary resin from the mold.
A transfer device main body in which positioning with respect to the mold die is performed by a positioning portion provided on a mold clamp surface of the mold die,
A work holding unit provided on the transfer device main body and holding the work;
A resin holding portion provided on the transfer device main body, the resin holding portion being capable of holding the mold resin supplied to the mold and unnecessary resin after molding, respectively.
The resin holding unit includes a first resin holding unit that holds the mold resin supplied to the mold and a second resin holding unit that holds unnecessary resin after molding. A work transfer device characterized in that the work transfer device is provided so as to be able to move alternately.   The workpiece transfer device according to claim 4, wherein the first resin holding portion and the second resin holding portion are provided so as to be movable in a horizontal direction with respect to a direction in which the transfer device main body enters the mold.   The first resin holding unit holds a solid resin, a powdery resin, a granular resin, a mold resin of any one form of a liquid resin, and the second resin holding unit sucks and holds a molded product cal. The work transfer device according to claim 4 or claim 5. A work and a mold resin carried in from the work transfer device according to any one of claims 4 to 6, which are clamped with a first mold and a second mold of the mold, and resin-molded. A resin molding device that unloads the formed work and unnecessary resin by the work transfer device,
A mold provided with a bridging portion which is arranged so as to overlap with the end of the work so as to be a moving passage of air or mold resin connected to a cavity recess formed in any of the first mold and the second mold; When the mold is opened with respect to the clamp surface, it has a movable piece that is supported to move upward so as to be separated from it,
The movable piece is separated from the mold clamp surface in the mold opened state, and the work holding portion is moved to a set position where the end of the work held by the work transfer device overlaps the bridging portion to receive the work. A resin molding apparatus, wherein the movable piece is pushed down by a mold closing operation, and the end of the work is sandwiched and clamped by the bridge portion.   The resin molding apparatus according to claim 7, wherein the movable piece is any one of a pot piece, a runner gate piece, and an air vent piece formed so that the bridge portion is connected to the cavity recess.   A plurality of support pins are provided at a set position where the work is transferred so as to be able to advance and retreat from a mold surface, and the work transfer device is moved to a position where a work end surface overlaps the movable piece and is at a protruding position. The resin molding device according to claim 7, wherein the resin molding device is transferred to the support pin. The work transfer device transfers the work and the molding resin to the mold die having the first mold and the second mold by the work transfer device and clamps the resin. The formed work and unnecessary resin are transferred to the work transfer device. A resin molding method for unloading from the mold by the method,
A step of aligning the mold clamping surface of the first mold and the transfer device body in the opened mold,
A movable piece and a work end, which are supported upward so as to be separated from the first mold clamp surface when the mold is opened, to a work holding portion that holds a work movably provided in the transfer device body. Horizontally moving to a set position where
Transferring the work and the mold resin from the work holding portion to the first mold clamping surface,
Closing the mold, clamping the movable piece so as to overlap with the end of the workpiece, and heating and curing the mold resin filled in the cavity recess;
When opening the first mold and the second mold, the movable piece is separated from the clamp surface of the first mold to separate the molded workpiece and unnecessary resin,
A step of holding the work by the work transfer device and holding the unnecessary resin by suction,
A step of carrying out the work transfer device from the mold while holding the molded product and the unnecessary resin,
A resin molding method comprising:

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