JP6301067B2 - 光学部材、光モジュール - Google Patents
光学部材、光モジュール Download PDFInfo
- Publication number
- JP6301067B2 JP6301067B2 JP2013094707A JP2013094707A JP6301067B2 JP 6301067 B2 JP6301067 B2 JP 6301067B2 JP 2013094707 A JP2013094707 A JP 2013094707A JP 2013094707 A JP2013094707 A JP 2013094707A JP 6301067 B2 JP6301067 B2 JP 6301067B2
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- lens
- optical
- adhesive
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 62
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100119847 Phaeodactylum tricornutum FCPE gene Proteins 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Description
11 基部
11a 面(レンズ側)
11b 面
12 突起(レンズ側)
13 レンズ
14 突起
H 突起高さ(レンズ側)
HB 突起高さ
HL レンズ高さ
d1 間隔(突起12間)
d2 間隔(突起12とレンズ13の間)
dt 閾値
2 VCSEL/PD(光電変換器)
3 FPC(基板)
4 接着層
5 Waveguide
5a ミラー
6 接着層
Claims (5)
- 基部と、
前記基部の面上に形成されたレンズと、
前記基部の面上に前記レンズの中心に対して環状に形成された複数の突起とを含み、
当該複数の突起のうち最も内周側に位置する突起以外の突起には切り欠きが設けられており、
前記複数の突起のうち互いに隣接する突起の間隔は、前記基部上に接着対象部品を接着する接着剤を毛細管現象により突起間に充填させることのできる閾値以下であり、
前記切り欠きの間隔は前記閾値以下であることを特徴とする光学部品。 - 前記突起の高さは前記レンズの焦点距離により定められることを特徴とする請求項1に記載の光学部品。
- 前記複数の突起の形状は、円環、多角環のいずれかであることを特徴とする請求項1に記載の光学部品。
- 前記基部の前記レンズが形成された面と対向する面には第2の複数の突起が形成され、
前記第2の複数の突起のうち互いに隣接する突起の間隔は前記閾値以下であることを特徴とする請求項1乃至3のいずれかに記載の光学部品。 - 光電変換器と、当該光電変換器が載置される基板と、ミラーが形成される光導波路と、請求項1乃至4のいずれかに記載の光学部品とを含み、前記基板と前記光導波路が前記接着対象部品であることを特徴とする光モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094707A JP6301067B2 (ja) | 2013-04-26 | 2013-04-26 | 光学部材、光モジュール |
US14/249,521 US9784932B2 (en) | 2013-04-26 | 2014-04-10 | Optical member and optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094707A JP6301067B2 (ja) | 2013-04-26 | 2013-04-26 | 光学部材、光モジュール |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017227361A Division JP2018036674A (ja) | 2017-11-28 | 2017-11-28 | 光学部材、光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014215557A JP2014215557A (ja) | 2014-11-17 |
JP6301067B2 true JP6301067B2 (ja) | 2018-03-28 |
Family
ID=51941328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013094707A Expired - Fee Related JP6301067B2 (ja) | 2013-04-26 | 2013-04-26 | 光学部材、光モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US9784932B2 (ja) |
JP (1) | JP6301067B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019040011A (ja) * | 2017-08-24 | 2019-03-14 | 富士通コンポーネント株式会社 | 光モジュール |
JP2020008813A (ja) * | 2018-07-12 | 2020-01-16 | 富士通コンポーネント株式会社 | 光モジュール |
US10818828B2 (en) * | 2018-07-23 | 2020-10-27 | Illum Horticulture Llc | Method and apparatus for a low profile light fixture |
WO2020262674A1 (ja) * | 2019-06-28 | 2020-12-30 | 京セラ株式会社 | ミラー装着部材、これを使用した位置計測用ミラー、および露光装置 |
WO2021014680A1 (ja) * | 2019-07-19 | 2021-01-28 | 住友ベークライト株式会社 | 光導波路、接着層付き光導波路、光配線部品および電子機器 |
WO2022145470A1 (ja) * | 2020-12-28 | 2022-07-07 | 京セラ株式会社 | 構造体、これを使用した位置計測用ミラーおよび露光装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080136955A1 (en) * | 1996-09-27 | 2008-06-12 | Tessera North America. | Integrated camera and associated methods |
US6235141B1 (en) * | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
US6096155A (en) * | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
US6071652A (en) * | 1997-03-21 | 2000-06-06 | Digital Optics Corporation | Fabricating optical elements using a photoresist formed from contact printing of a gray level mask |
JP2000199827A (ja) * | 1998-10-27 | 2000-07-18 | Sony Corp | 光導波装置およびその製造方法 |
JP4175780B2 (ja) * | 2001-02-28 | 2008-11-05 | 株式会社リコー | マイクロレンズ付き基板、およびそれを用いた光学機器 |
TW200846715A (en) * | 2006-12-18 | 2008-12-01 | Kolon Inc | Optical sheets |
US7792404B2 (en) * | 2007-11-19 | 2010-09-07 | Corning Incorporated | Glass-based laser ridges for adhesive confinement and related methods |
US20090284837A1 (en) * | 2008-05-13 | 2009-11-19 | Micron Technology, Inc. | Method and apparatus providing uniform separation of lens wafer and structure bonded thereto |
JP5047243B2 (ja) | 2008-09-26 | 2012-10-10 | シャープ株式会社 | 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
US8063975B2 (en) * | 2008-10-29 | 2011-11-22 | Jabil Circuit, Inc. | Positioning wafer lenses on electronic imagers |
JP2010152111A (ja) * | 2008-12-25 | 2010-07-08 | Fuji Xerox Co Ltd | 光導波路、光モジュール、光モジュールの製造方法、および光導波路の製造方法 |
-
2013
- 2013-04-26 JP JP2013094707A patent/JP6301067B2/ja not_active Expired - Fee Related
-
2014
- 2014-04-10 US US14/249,521 patent/US9784932B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20160170160A1 (en) | 2016-06-16 |
US9784932B2 (en) | 2017-10-10 |
JP2014215557A (ja) | 2014-11-17 |
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