JP6275939B2 - Electronic component mounting system - Google Patents

Description

  The present invention relates to an electronic component mounting system.

  The component mounting head is a device for mounting an electronic component on a substrate fixed to a preset mounting area. In recent years, a technique for improving efficiency by accessing a plurality of component mounting heads simultaneously or alternately on the same substrate is known. When a plurality of component mounting heads are accessed in parallel with respect to the same substrate, a region (interference region) where all the component mounting heads can enter is formed on the substrate. In order to avoid the collision of the component mounting head in this interference area, priority (priority to the interference area) is set so that one component mounting head can enter the interference area among the plurality of component mounting heads. It is necessary to prohibit the entry of the other component mounting head into the interference area, while giving the authority to enter and perform component mounting work. However, if the entry into the interference area is restricted by simply giving superiority or inferiority to a plurality of component mounting heads, the waiting time of the component mounting heads with no priority is increased, and the processing efficiency is lowered. Thus, techniques for reducing the tact time while regulating interference have been proposed.

  For example, in Patent Document 1 previously proposed by the applicant, the interference area is dynamically recalculated every time one component mounting head finishes the mounting operation of one component so that the interference area becomes narrower. Technology has been proposed. With this method, each time component mounting progresses, the interference area is dynamically recalculated and set narrower, increasing the opportunity for multiple component mounting heads to access the same board at the same time. It is possible to reduce the overall tact time while preventing the problem.

  Further, another patent document 2 previously proposed by the applicant of the present application describes that while one component mounting head is performing a component mounting operation in an interference region with the highest degree of interference, the other component mounting head causes interference. A method is disclosed in which another avoidable coordinate is allocated to ensure a parallel work opportunity. Both component mounting heads are alternately given priority in an interference region with a high degree of interference. The component mounting head to which the priority is given is completed in order from the work in the interference area where the degree of interference is high. Therefore, also in the method of Patent Document 2, the possibility of interference decreases as the mounting of components proceeds, and accordingly, the opportunity for both component mounting heads to simultaneously mount components on the same substrate increases. The overall tact time can be shortened while preventing interference.

  In the prior arts disclosed in Patent Documents 1 and 2, a plurality of component mounting heads are accessed on the same substrate, and component mounting is processed in parallel. Therefore, in principle, the mounting timing of the component mounting head does not deviate. Therefore, if a combination suitable for each board is set in a set of a plurality of component mounting heads, it is possible to increase the ratio of parallel work in avoiding interference and all component mounting work in a suitable mounting order. It was.

JP 2011-23616 A JP 2011-124357 A

  As described above, each of the prior arts disclosed in Patent Documents 1 and 2 presupposes that a plurality of component mounting heads are alternately given priority and components are mounted in a region having a high degree of interference. .

  However, in recent years, there is an increasing demand for a dual lane system in which a pair of lanes that are adjacent to each other in parallel and each individually carry a substrate are provided. In the dual lane method, a component mounting head is provided for each lane. A part of the mounting area where each component mounting head mounts an electronic component overlaps so that each component mounting head can enter. In the overlapping portion of the mounting area, an interference area where each component mounting head can interfere is set.

  In a dual lane system, the timing at which a substrate is transported often varies between one lane and the other lane. For this reason, there is a possibility that the combination of the sequence (mounting sequence) for mounting the electronic components between the component mounting head to which priority is given and the component mounting head to which priority is not given may be out of order. As a result, even if the above-described prior art is adopted for the dual lane system, if the mounting sequence does not match, the tact time becomes long, and the processing efficiency may be lowered.

  The present invention has been made in view of the above-described problems. In a facility in which two lanes are adjacent to each other in parallel and a component mounting head having an adjacent region of both lanes as an interference region is provided in each lane, the component mounting is performed. An object of the present invention is to provide an electronic component mounting system capable of improving the overall tact time while preventing interference between the heads.

In order to solve the above problems, the present invention is provided in the first lane, the first lane and the second lane, which are installed in parallel and adjacent to each other, each of which individually carries a substrate, The board transported to the first lane is stopped, the first mounting area for mounting electronic components, and the board provided in the second lane and transported to the second lane are stopped to A second mounting area for mounting components; a first component mounting head that is provided in the first lane and mounted on the substrate stopped in the first mounting area; and is provided in the second lane. A second component mounting head for mounting an electronic component on a substrate stopped in the second mounting area, and a region in which a part of the first mounting area and a part of the second mounting area overlap each other; Component mounting head and the second component An interference region where any mounting head can enter, and from when the first component mounting head and the second component mounting head pick up the electronic component to mounting the electronic component picked up on the substrate on the corresponding lane A storage unit for storing information about a task whose operation is a unit, an order of a plurality of tasks assigned to the first component mounting head based on the information stored in the storage unit, and the second component mounting Control means for respectively controlling the order of a plurality of tasks assigned to the head, and the storage unit has a unique order over the entire two boards on which electronic components are simultaneously mounted in the first lane and the second lane. The first component mounting head and the second component mounting head store a value related to a priority order in which the component mounting operation is preferentially executed. The storage unit stores information on a replacement priority indicating a degree of priority of the task when the priority is switched, and the replacement priority is the unimplemented task. The component mounting head to which the task is assigned is set so as to give priority to the component mounting head that enters the interference area most frequently, and the storage unit includes the operating range of the first component mounting head and the second component mounting head. An operating range is stored for each corresponding task, and the control means executes the first component mounting when executing one of the tasks of the first component mounting head and the second component mounting head. It is determined for each task whether one of the head and the second component mounting head has stopped mounting electronic components, and at the time of the determination, the first component mounting head is determined. When either one of the second component mounting head and the second component mounting head stops mounting the electronic component, the interference region is applied to the one component mounting head based on the replacement priority regardless of the priority. When the one component mounting head is in operation and the other component mounting head that has been stopped resumes the component mounting operation, the priority order is selected. The electronic component mounting system is characterized in that tasks are executed in order from the other component mounting head. In this aspect, two lanes are adjacent to each other in parallel, the component mounting heads provided in the respective lanes are operated in the mounting areas of both lanes, and electronic components are mounted on the substrate simultaneously. The mounting sequence of each component mounting head is controlled by the control means. For example, when determining the mounting sequence of the first component mounting head, the control means gives priority to the task in which the first component mounting head enters the interference area most frequently in the operation state in which the second component mounting head is stopped. To choose. Similarly, when determining the mounting sequence of the second component mounting head, in the operation state in which the first component mounting head is stopped, the task in which the second component mounting head enters the interference area most frequently is preferentially selected. To do. Thus, when the timing of component mounting operations executed by the first component mounting head and the second component mounting head is different, it is necessary to enter the interference area most frequently in an operating situation where there is no risk of interference. Electronic components are mounted in order starting from a certain task. Therefore, as the mounting operation proceeds, the possibility of interference with either the first component mounting head or the second component mounting head decreases. Therefore, it is possible to shorten the tact time by increasing the ratio of the parallel work in the all component mounting work.

  Further, for example, when the control means determines the mounting sequence of the first component mounting head, and the second component mounting head stops mounting the electronic component, the task to be executed by the first component mounting head Among these, the mounting sequence is determined so that the tasks having the highest replacement priority are processed in order. Similarly, when the control means determines the mounting sequence of the second component mounting head, when the first component mounting head stops mounting the electronic component, of the tasks to be executed by the second component mounting head The mounting sequence is determined so that processing is performed in order from the highest replacement priority. Thus, by determining the mounting sequence based on the replacement priority, selection from a plurality of tasks is facilitated, and the processing is quickened.

  In the electronic component mounting system according to a preferred aspect, the control means determines an execution order of the tasks based on a value related to the priority order in an operation state where all the component mounting heads are operating. In this aspect, since both component mounting heads can be operated based on a suitable mounting sequence stored in the storage unit, even when both component mounting heads mount electronic components in parallel, component mounting It is possible to shorten the tact time by increasing the ratio of parallel processing to the entire work.

In the electronic component mounting system according to a preferred aspect, when the one component mounting head is in operation , the control unit restarts the component mounting operation when the other component mounting head has been stopped. The task is executed in order from the other component mounting head based on the value related to the priority order. In this aspect, for example, when the second component mounting head that has been stopped when the first component mounting head is operating resumes the component mounting operation, the control means is used when determining the mounting sequence of the second component mounting head. Starts the mounting sequence from the second component mounting head based on the priorities stored in advance in the storage unit. Similarly, when the first component mounting head that has been stopped when the second component mounting head is operating resumes the component mounting operation, when determining the mounting sequence of the first component mounting head, the control means The mounting sequence is started from the first component mounting head based on the priority order stored in the storage unit. Therefore, when resetting the mounting sequence for both component mounting heads to perform parallel work, the arithmetic processing for changing the mounting sequence becomes unnecessary as much as possible, and the mounting sequence can be changed quickly. . As a result, the mounting sequence of the electronic components can be changed in real time during the component mounting operation, and a suitable mounting sequence can be set according to the operation status of both component mounting heads. Moreover, since the mounting sequence is started from the other component mounting head, the task assigned to the component mounting head whose start is delayed is preferentially processed. As a result, it is possible to reduce the deviation of the mounting sequence as much as possible.

  As described above, according to the present invention, in the driving situation where there is no possibility of interference, the electronic components are mounted in order from the task that needs to enter the interference area most frequently. In the task to be performed, the possibility of interference with the other of the first component mounting head and the second component mounting head is reduced. Therefore, there is a remarkable effect that it is possible to shorten the tact time by increasing the ratio of the parallel work in the all component mounting work.

It is a figure which shows schematic structure of the component mounting system (an example of the mounting system of an electronic component) which concerns on one Embodiment of this invention, (A) is a plane schematic diagram, (B) is a side cross-sectional schematic diagram. It is a block diagram which shows schematic structure of the component mounting system which concerns on embodiment of FIG. FIG. 2 is an entity diagram (ER diagram) showing a structure of a database as a storage area stored in data storage means of the component mounting system of FIG. 1. 4 is a view table showing a setting example according to the ER diagram of FIG. 3. FIG. 5 is a schematic plan view schematically showing a component mounting position corresponding to FIG. 4. It is a flowchart which shows the example of a setting of a mounting sequence. It is a flowchart which shows the example of control of the component mounting operation | work which concerns on embodiment of FIG. FIG. 8 is a view table illustrating an example of a result when FIG. 7 is executed based on the settings of FIGS. 4 and 5. FIG. FIG. 8 is a view table showing another result when FIG. 7 is executed based on the settings of FIGS. 4 and 5 as an example. 10 is a schematic plan view schematically showing a mounting sequence based on the example of FIG.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  A component mounting system 10 shown in FIG. 1 is of a dual lane type including two sets of first and second mounting units UA and UB. The first and second mounting units UA and UB (see FIG. 2) are provided on a rectangular base 11 for each of two lanes 1 and 2 (first and second lanes). In the following description, the horizontal direction parallel to the lanes 1 and 2 is the X-axis direction, the horizontal direction orthogonal to the X-axis direction is the Y-axis direction, and the vertical direction is the Z-axis direction. Further, from one end in the X-axis direction (the right side in FIG. 1A) to the other end side (the left side in FIG. 1A) is assumed to be the substrate transport direction, and one end side in the Y-axis direction (below the lower side in FIG. 1A). Side) is assumed to be the front.

The lanes 1 and 2 are embodied by the first and second substrate transfer devices 12 and 14. The first and second substrate transfer devices 12 and 14 include a pair of belt conveyors 12a, 14a, 12b, and 14b that are parallel to each other, a non-illustrated transfer motor, a transmission mechanism that transmits the power of the transfer motor, and the like. It has. By driving the conveyors 12a, 14a, 12b, and 14b synchronously, the first and second substrate transport devices 12 and 14 support the printed circuit board P while supporting the sides of the printed circuit board P. The printed circuit board P is temporarily stopped in the mounting area MA shown in FIG. 1A by the board stop device (not shown ) , and the printed circuit board P is held in the mounting area MA, and then the electronic components are mounted. Work is to be done. In order to stop the printed circuit board P carried in by the first and second substrate transfer devices 12 and 14 in the mounting area MA, a predetermined position inside both the conveyors 12a, 14a, 12b and 14b is omitted as a substrate stop device. A stopper is provided. This stopper is displaceable between a state of projecting on both conveyors 12a, 14a, 12b and 14b and a state of being immersed under both conveyors 12a, 14a, 12b and 14b. (See FIG. 2). Further, in the mounting area MA, there is a substrate holding device (not shown) made up of push-up pins or the like for holding the printed circuit board P stopped by the stopper from the first and second substrate transfer devices 12 and 14. The substrate positioning device is constituted by the stopper and the substrate holding device.

The base 11 is a rectangular structure in plan view. In the central portion of the base 11, a mounting area MA is set for each of the first and second mounting units UA and UB. The mounting area MA is an area (range) where the first and second component mounting heads 30 and 40 described later mount electronic components. Further, in the Y-axis direction central portion where a part of the mounting area MA (first mounting area) of the first mounting unit UA and a part of the mounting area MA (second mounting area) of the second mounting unit UB overlap. , An interference area A that is set symmetrically about the center line along the X-axis direction is set. The interference area A is an area into which both first and second component mounting heads 30 and 40 described later can enter.

The base 11 is provided with a component supply section (not shown) arranged on both sides of the corresponding first and second substrate transport apparatuses 12 and 14 for each of the first and second mounting units UA and UB. . The component supply unit includes multiple rows of tape feeders. Each tape feeder stores electronic components such as ICs, transistors, capacitors and the like at predetermined intervals, leads the held tape from the reel to the component take-out section, and the components are mounted by first and second component mounting heads 30 and 40 described later. The tape is intermittently fed by a ratchet type feeding mechanism as it is picked up .

  In addition, the base 11 is provided with a pair of structures 20 that face each other along the X-axis direction. The structure 20 is formed in a gate type including leg portions 21 erected at the four corners of the base 11 and beam portions 22 connecting the leg portions 21 along the Y-axis direction. A Y-axis rail 21 a is laid on the upper surface of each beam portion 22. Both Y-axis rails 21a are laid back and forth along the Y-axis direction. Both Y-axis rails 21a guide end portions of a pair of X beams 23 and 24 provided for the first and second mounting units UA and UB, respectively. The X beams 23 and 24 extend along the X-axis direction. One X beam 23 and 24 is provided for each lane 1 and 2. The respective X beams 23 and 24 are connected to the Y-axis rail 21a via sliders 23a and 24a. Further, the slider 23 a of one X beam 23 is provided with a damper 23 b facing the slider 24 a of the other X beam 24. The damper 23b is interposed between the sliders 23a and 24a when the two X beams 23 and 24 come close to each other, and restricts the X beams 23 and 24 from coming into contact with each other.

  The first and second mounting units UA and UB are provided with Y-axis servomotors 25 (see FIG. 2) for driving the corresponding X beams 23 and 24, respectively. One Y-axis servomotor 25 (see FIG. 2) is provided for each beam portion 22. Each Y-axis servomotor 25 (see FIG. 2) can reciprocate the corresponding X beams 23 and 24 back and forth.

  X-axis rails (not shown) are provided on the surfaces where the X beams 23 and 24 oppose each other in the front-rear direction. The first and second component mounting heads 30 and 40 are attached to each X-axis rail for each of the first and second mounting units UA and UB. Each X beam 23, 24 is provided with an X-axis servomotor 26 that drives the corresponding first and second component mounting heads 30, 40 along the X-axis direction.

  In the present embodiment, the servo motors 25 and 26 described above constitute a drive mechanism that drives first and second component mounting heads 30 and 40 described below. By this drive mechanism, the first and second component mounting heads 30 and 40 move on a plane set at a substantially central portion of the base 11 along the X-axis direction and the Y-axis direction, and supply components (not shown). An electronic component can be picked up from the portion and mounted on the printed circuit board P in the mounting area MA.

  The first and second component mounting heads 30 and 40 are provided with one or a plurality of suction nozzles 31 and 41 so as to be movable up and down. Further, as shown in FIG. 2, the first and second component mounting heads 30 and 40 are equipped with a Z-axis servo motor 27 for raising and lowering the suction nozzles 31 and 41 and an R-axis servo motor 28 for rotating the suction nozzle, respectively. Has been.

  Next, as a stationary imaging means for imaging a specific part of the printed board P from above when the printed board P stops in the mounting area MA, a first board camera 61 (first camera) and a second board camera 62 are used. A (second camera) is suspended from a fixed position of the base 11 for each of the first and second mounting units UA and UB. The first board camera 61 is in a position where the downstream corner portion can be imaged when the printed board P is stopped in the mounting area MA, and the second board camera 62 is when the printed board P is stopped in the mounting area MA. Are arranged at positions where the middle part of the one side can be imaged.

  Each of the first and second mounting units UA and UB is equipped with a component recognition camera 63 on the base 11. The camera 63 images the suction component after component mounting by the first and second component mounting heads 30 and 40. Based on the image captured by the camera 63, the component mounting system 10 can check the shift of the component mounting position.

  Each of the first and second component mounting heads 30 and 40 is equipped with a moving camera 64 that captures fiducial marks (board recognition marks) attached to the printed circuit board P. The moving camera 64 is composed of a CCD or the like arranged downward on the side of the corresponding first and second component mounting heads 30 and 40, and moves together with the first and second component mounting heads 30 and 40. It is supposed to be.

  Similar to the known mounting machine, both the first and second mounting units UA and UB are provided with sensors (indicated generically as SN in FIG. 2) for detecting required parameters of the respective units.

  Next, the control unit 100 that controls both the first and second mounting units UA and UB in an integrated manner will be described.

  Referring to FIG. 2, control unit 100 is constituted by a CPU or the like, and includes an arithmetic processing unit 101 connected to an external display unit 110, and data storage means for storing various data for board transfer, component mounting, and the like. 102, a mounting program storage unit 103 that stores a mounting program, a motor control unit 104 that controls each motor, an external input / output unit 105, a server communication unit 106, and an image processing unit 107.

  The arithmetic processing unit 101 manages arithmetic processing for executing a mounting program necessary for mounting electronic components on the printed circuit board P.

  The data storage means 102 stores data necessary for executing the installed program, a data collection (referred to as a table), and the like.

  The installed program storage unit 103 stores an installed program executed by the arithmetic processing unit 101.

  The motor control unit 104 controls the motors 25 to 28 based on signals from encoders provided in the motors 25 to 28 and a target value given from the arithmetic processing unit 101.

  The external input / output unit 105 is connected to various sensors SN such as sensors for detecting the loading and unloading of the printed circuit board P as input elements, and to the stopper driving unit 16 as an output element. In addition to this, a conveyance drive mechanism, a conveyor interval adjustment drive mechanism, and the like, which are not shown, are also connected to the external input / output unit 105.

  The server communication unit 106 performs communication with a server that controls the plurality of component mounting systems 10, data update, and the like.

  The image processing unit 107 is connected to the first board camera 61, the second board camera 62, the component camera 63, and the moving camera 64, and takes in signals indicating images from these cameras 61 to 64 to obtain a predetermined image. Processing is performed, and the image data is sent to the arithmetic processing unit 101.

  The display unit 110 is provided with a pointing device such as a display and a keyboard, and the operator controls the control unit 100 based on the execution status of the programs of the first and second mounting units UA and UB or displayed information. On the other hand, it has a function that can be operated to input information such as various data and commands.

  Next, the details of the data stored in the data storage unit 102 will be described with reference to FIG.

  Referring to FIG. 3, the data storage means 102 stores a database 120 as a storage area. The data in the database 120 is controlled by the control unit 100 by a database management system (DBMS) (not shown). It has come to be offered.

The database 120 includes a component mounting head table 121 that stores information about the first and second component mounting heads 30 and 40, a board table 122 that stores information about the printed circuit board P, and a mounting sequence table that stores information about the mounting sequence. 123 and a mounting sequence detail table 124 are included. These tables 121 to 124 are a collection of data called entities. The tables 121 to 124 are generally composed of columns called attributes (hereinafter, attributes are indicated by {}) and rows called tuples (hereinafter, tuple values are indicated by ""). Logically configured in a matrix. An attribute refers to an item (for example, {sequence number} {head number} { interference flag } or the like) set in the tables 121 to 124 (see FIG. 4). A tuple refers to a collection of information (instances) for each row. In the figure, (PK) represents a primary key and (FK) represents a foreign key. The primary key is an attribute that uniquely identifies a row in the tables 121 to 124. The foreign key has the same value as the primary key, and is used to refer to data in the table having the primary key. Furthermore, the arrows in the figure indicate the relationship (relationship) between the tables, and indicate that the foreign key in the table on the end point side of the arrow refers to the primary key in the table on the start point side of the arrow. ing.

  The component mounting head table 121 is a table that stores information about the first and second component mounting heads 30 and 40. The component mounting head table 121 includes {head number} that uniquely identifies the first and second component mounting heads 30 and 40 as a main key. In {head number}, the model numbers of the first and second component mounting heads 30 and 40 (for example, “HD001” and “HD002” shown in FIG. 4) are registered. In the component mounting head table 121, items for storing various parameters necessary for controlling the first and second component mounting heads 30 and 40 are set for each model number.

  The substrate table 122 is a table that stores information related to the printed circuit board P. The substrate table 122 includes {substrate product number} that uniquely identifies the printed circuit board P as a main key. In {Substrate part number}, the model number of the printed circuit board P (for example, “BD00234”, “BD00456”, etc. shown in FIG. 4) is registered. In the board table 122, items (in the example shown, {width, length}, etc.) for storing information related to the board necessary for mounting electronic components are set for each model number.

  Next, the mounting sequence table 123 is a table that stores information related to the mounting sequence of the first and second component mounting heads 30 and 40. Here, the mounting sequence defines a task execution order of the first and second component mounting heads 30 and 40. The task is a first unit in which an operation from when the first and second component mounting heads 30 and 40 pick up an electronic component until the electronic component picked up on the printed circuit board P on the corresponding lane is mounted is a unit. The work of the second component mounting heads 30 and 40 is referred to.

The mounting sequence table 123 includes {lane 1 board product number, lane 2 board product number, interference area, sequence number, head number, interference flag , replacement priority, priority}. View table shown in FIG. 4, of these {lane 1 substrate part, lane 2 substrate part, sequence number, head number, interference flag, replacement priority, priority} is a specific example of setting.

  The primary key of the mounting sequence table 123 is {lane 1 board product number, lane 2 board product number}. {Lane 1 board product number} is an item for storing information of the printed circuit board P on which electronic components are mounted in the lane 1. Further, {lane 2 board product number} is an item for storing information on the printed circuit board P on which electronic components are mounted in the lane 2. As is apparent from this table configuration, in this embodiment, the mounting sequence is set for each combination of the printed circuit board P processed in the lane 1 and the printed circuit board P processed in the lane 2. For example, in the example of FIG. 4, when the board part number “BD00234” is processed in lane 1 and the board part number “BD00456” is processed in lane 2, an optimal mounting sequence is set for the combination of these two printed circuit boards P. It can be set for each task.

  {Interference area} is an item for storing the distance in the Y-axis direction of the area into which both the first and second component mounting heads 30 and 40 can enter.

  As shown in FIG. 1A, an interference area A is set in the mounting area MA in which the first and second component mounting heads 30 and 40 can move. It is necessary to avoid the collision of the second component mounting heads 30 and 40. On the other hand, the necessity for the first and second component mounting heads 30 and 40 to move to the interference area A differs depending on the type of the printed circuit board P on which the electronic components are mounted. Therefore, in the mounting sequence table 123 according to the present embodiment, information on the printed circuit board P on which the electronic component is mounted on the lane 1 and information on the printed circuit board P on which the electronic component is mounted on the lane 2 are obtained from the substrate table 122, respectively. The mounting sequence can be set according to the combination of both printed circuit boards P. By providing this {interference area} in the mounting sequence table 123, the range of the interference area A can be individually set in the data storage unit according to the combination of the printed circuit boards P. As a method for setting a value stored in {interference area}, a predetermined default value is determined as the range of interference area A, and a common default value is set to {interference area} for all combinations of printed circuit boards P. You may make it preserve | save. Further, the value of {interference area} is recalculated and updated every time one component mounting head 30 (or 40) finishes one task so that the interference area becomes narrower. Good.

  {Sequence number} is an item for storing a value indicating the order of the mounting sequence determined for each {lane 1 board product number, lane 2 board product number}. In the present embodiment, the sequence number is a value obtained by numbering the order of the entire tasks in order from the first using the printed circuit board P in lane 1 and the printed circuit board P in lane 2 as one printed circuit board. In the present embodiment, the ascending order of values set in {sequence number} (the order in ascending order) is the mounting sequence of the first and second component mounting heads 30 and 40.

  {Head number} is an item set in the external key for specifying the first and second component mounting heads 30 and 40 that execute the corresponding task. In {head number}, the value of {head number} is stored for each mounting sequence determined by {lane 1 board product number, lane 2 board product number}. For example, in the case of FIG. 4 (when the values of {lane 1 board product number, lane 2 board product number} are “BD00234” and “BD00456”, respectively), the {head number} value related to the odd sequence number is “HD002”. It becomes. Further, the value of {head number} relating to an even sequence number is “HD001”. As described above, it is possible to identify the first and second component mounting heads 30 and 40 that execute the task for each mounting sequence determined by {lane 1 board product number, lane 2 board product number}. .

The { interference flag } is an item for storing information for identifying whether or not the first and second component mounting heads 30 and 40 move to the interference area. { Interference flag } is realized by, for example, a Boolean attribute. In the present embodiment, “TRUE” is set in the case where the first and second component mounting heads 30 and 40 enter the interference area, and “FALSE” (or Null) is set in the case where the first and second component mounting heads 30 and 40 do not enter. With reference to FIG. 4 and FIG. 5, for example, a case where the order of task mounting sequences is shown but circle numbers 1 to 10 are determined will be described. As shown in FIG. 5, in lane 1, it is shown that the component mounting head “HD001” needs to enter the interference area A when executing tasks of sequence numbers 8, 4, and 10. ing. Lane 2 indicates that the component mounting head “HD002” needs to enter the interference area A when executing the tasks of sequence numbers 1 and 5.

{Replacement priority} is an item for saving information indicating the degree of priority for a task whose { interference flag } value is set to "TRUE". Referring to FIGS. 4 and 5, in lane 1, the degree (distance) of entering the interference area A increases in the order of sequence numbers 8, 4, and 10. Therefore, in the example shown in the figure, the value of {replacement priority} is set to “3”, “2”, and “1” in order of the sequence numbers of 8, 4, and 10. Similarly, in lane 2, the degree (distance) of entering the interference area A increases in the order of sequence numbers 1 and 5. Therefore, in the example shown in the figure, the value of {replacement priority} is set to “2” and “1” in order of the sequence numbers 1 and 5.

  {Priority} is an item for storing information regarding the order in which one of the component mounting head 30 and the component mounting head 40 processes a task. In the present embodiment, the value of {priority order} is set to a unique order for the entire tasks of both the first and second component mounting heads 30 and 40. As will be described in detail later, the mounting sequence may be changed in a predetermined case regardless of the value of {priority order}. In the present embodiment, the right to preferentially enter the interference area (referred to as “priority right”, hereinafter the same) is determined based on the value set in this {priority order}. It has become.

  The mounting sequence specification table 124 is a table for specifying coordinates for each of the suction nozzles 31 and 41 of the first and second component mounting heads 30 and 40. The mounting sequence detail table 124 includes {nozzle number, X coordinate, Y coordinate} in addition to {lane 1 substrate product number, lane 2 substrate product number} for associating with the mounting sequence table 123.

  Each of the above-described tables 121 to 124 shows a logical structure. Physically, a plurality of tables may be mounted on the same data file, or a plurality of one data table may be provided. It may be implemented in the data file.

  Next, a processing method for determining values stored in the mounting sequence table 123 and the mounting sequence detail table 124 described above will be described.

  With reference to FIGS. 5 and 6, in the present embodiment, the entire printed circuit board P carried into the lanes 1 and 2 is regarded as one printed circuit board, and the components of each printed circuit board P are combined. The arrangement is determined (step S1). Next, according to the specifications of the first and second component mounting heads 30 and 40 for mounting electronic components on the printed circuit board P, the heads are grouped for each task, and a mounting sequence is determined for each grouped task ( Step S2). Next, an operation time calculation (simulation) is executed based on the mounting sequence determined in step S2 (step S3). Thereafter, the simulation result is verified to determine whether or not there is room for improvement (step S4). At this stage, when a mounting sequence that is considered to have no room for improvement is determined, values are stored in {sequence number, head number} of the mounting sequence table 123, and the first and second components corresponding thereto are stored. The details of the mounting heads 30 and 40 are stored in each item of the mounting sequence detail table 124. The setting processes S1 to S3 described above are performed manually by the operator, but a method of automatically calculating a predetermined argument as a parameter may be employed.

Next, by referring to the values stored in the mounting sequence table 123 and the mounting sequence detail table 124, the maximum operating lines (first and second component mountings) of the first and second component mounting heads 30 and 40, respectively. The distance at which the heads 30 and 40 move most to the other side in the Y-axis direction is set (step S5). This maximum operating line is a value that can be obtained by calculation. In order to speed up the processing of the control unit 100, an item {maximum operating line} is provided in the mounting sequence table 123 to store the calculated value. Also good. Next, based on the value of the maximum operating line, it is determined whether the first and second component mounting heads 30 and 40 enter the interference area A for each mounting sequence for which the sequence number is determined (step S6). . If the maximum operating line includes the interference area A (YES in step S6), that is, if the first and second component mounting heads 30 and 40 need to enter the interference area A, the mounting sequence table 123 is used. The value of { interference flag } is set to “TRUE” (step S7). If the maximum operating line does not include the interference area A (NO in step S6), that is, if the first and second component mounting heads 30 and 40 do not need to enter the interference area A, the mounting sequence The value of { interference flag } in the table 123 is set to “FALSE” (step S8). Although simplified in FIG. 6, the processing in steps S <b> 6 to S <b> 8 is executed for all tasks (that is, all tuples stored in the mounting sequence table 123).

Then, for all tasks, after the processing of step S6 to step S8 is completed, this time, for those whose { interference flag } value is "TRUE", the maximum operating line descends (in descending order of value) {replacement The priority level is set to a large value (step S9). For example, in the case of the example as shown in FIG. 5, the maximum operation line is increased in order of No. 8, No. 4, No. 10 in Lane 1. Therefore, in step S9, the value of {replacement priority} in the mounting sequence table 123 is set to “3, 2, 1” in the order of No. 8, 4, 10 (see FIG. 4). Similarly, in lane 2, the maximum operation line increases in the order of No. 1 and No. 5. Accordingly, in step S9, the value of {replacement priority} in the mounting sequence table 123 is set to “2, 1” in the order of No. 1 and No. 5 (see FIG. 4). For a task whose { interference flag } value is “FALSE”, the {replacement priority} value of the task is set to “0”.

  When executing the mounting process, the control unit 100 generates a data set as shown in FIG. 8 or FIG. 9 on the memory in order to manage the transaction, and sets the sequence number, head number, etc. related to the mounted task. It is configured to store for each task.

  Next, a specific example in which component mounting is performed in the present embodiment when information regarding a task is set as shown in FIG. 4 will be described with reference to FIG. In the following description, based on the control shown in FIG. 7, the first component mounting head 30 is also referred to as its own device, and the second component mounting head 40 is also referred to as the counterpart. The relationship between the own machine and the other party is exactly the same when the first component mounting head 30 is the other party and the second component mounting head 40 is the own machine.

  First, referring to FIG. 1, FIG. 3, and FIG. 7, the control unit 100, when the printed circuit board P is carried into the mounting area MA of any mounting unit UA or UB, the values of the mounting sequence table 123, etc. , It is determined whether or not there is a component that needs to be mounted on the printed circuit board P (step S20). Here, if the mounting of all the electronic components has been completed, the mounting program shown in FIG. 7 is ended, and the unloading operation of the printed circuit board P is started.

  On the other hand, if there is an electronic component to be mounted on the printed circuit board P (or remains) in step S20, the control unit 100 determines, for example, the mounting sequence of the own device (first component mounting head 30). At this time, it is determined whether or not the other party (second component mounting head 40) is operating (step S21).

If it is determined in step S21 that the counterpart (second component mounting head 40) is in operation (YES in step S21), the control unit 100 determines based on the {priority} value (see FIG. 4). Then, the minimum value of the sequence number related to the next unexecuted task (also referred to as an unmounted sequence number) is selected as N number (step S22), and priority is set for the component mounting head 30 related to the Nth sequence number. (Step S23).

  Further, when the counterpart (second component mounting head 40) is stopped in the determination in step S21 (NO in step S21), the control unit 100 starts the mounting operation by the stopped component mounting head 40. It is determined whether (or restart) can be performed (step S24). If the stopped component mounting head 40 can resume the mounting operation (YES in step S24), the control unit 100 determines whether the component mounting head 40 has a priority to give priority to the component mounting head 40. Among the mounting sequence numbers, the minimum value is selected as the Nth number (step S25), the process proceeds to step S23, and priority is set to the component mounting head 40 related to the Nth unmounted sequence number.

Next, when the stopped component mounting head 40 cannot resume the mounting operation (NO in step S24), the control unit 100 is involved in the mounting sequence set in {sequence number} of the mounting sequence table 123. First, the task with the highest replacement priority value is selected from the unmounted sequence numbers (step S27). Thereby, when determining the mounting sequence of the own machine (first component mounting head 30), if the other party (second component mounting head 40) is stopped, there is a high possibility of preferentially interfering with the other party. Since the processing can proceed in order from the area, both the first and second component mounting heads 30 and 40 continue to operate in parallel even when the other party (second component mounting head 40) operates thereafter. Is possible. As shown in step S27, replacing the task of the mounting sequence is also called swapping. In the process of step S27, the value of the swapped sequence number is selected as N, and then step S23 is executed to set the priority to the first component mounting head 30 related to the Nth sequence number. As a result, the control unit 100 continues to give priority to the first component mounting head 30 currently in operation .

  After executing Step S23, the control unit 100 executes an interference area A setting process for the selected sequence number (Step S30). The setting process of the interference area A may be an operation of simply reading the value of the {interference area} related to the sequence number selected from the mounting sequence table 123, or may dynamically interfere in the current component mounting situation. It may be a process of resetting the area.

Next, the control unit 100 determines whether or not the other party (second component mounting head 40) is operating in the interference area A (step S31). If the other party (second component mounting head 40) is operating in the interference area A (YES in step S31), the control unit 100 further moves between the operating component mounting head 40 and It is determined whether any of the first and second component mounting heads 30 and 40 can work preferentially (step S32). This determination is executed based on the priority setting process set in step S23. If the component mounting head 30 of the own machine, which is the control target of the mounting sequence, has priority (in the case of YES in step S32), the control unit 100 determines that the own unit (component mounting head 30). Then, the component suction process is executed (step S33). Thereafter, the component-recognizing camera 63 recognizes the suction position of the component (step S34), and provides the recognition result to the process of correcting the misalignment during mounting. The own machine (component mounting head 30) then shifts to component mounting processing (step S35).

  When the component mounting process in step S35 is completed, the control unit 100 proceeds to step S20 and repeats the above-described process.

Next, when it is determined in step S31 that the other party (second component mounting head 40) is operating outside the interference area A (NO in step S31), the control unit 100 is the same as in step S27. Then, the task with the highest replacement priority value is selected from the unmounted sequence numbers (step S36). Thereafter, the process proceeds to step S33, and the above-described processing is executed. As a result, even when component mounting operations are performed in parallel, in a driving situation where there is no possibility of interference, a task that preferentially increases the amount of movement to the interference area A is preferentially processed, so that subsequent components In the mounting work, it is possible to reduce the tact time by increasing the ratio of the parallel processing to the entire component mounting work.

  Further, when the counterpart of the component mounting head 30 (40) to be controlled in the mounting sequence has priority in the determination in step S32 (in the case of NO in step S32), the control unit 100 further Then, it is determined whether or not there is a task that can mount an electronic component outside the interference area, that is, a task having a value of “replacement priority” of “0” among tasks to be processed by the own device ( Step S37). If there is such a task, both the first and second component mounting heads 30 and 40 will start even if the own device starts the component mounting processing in parallel with the component mounting processing of the counterpart (second component mounting head 40). This is because there is no possibility of interference. If there is a task whose {exchange priority} value is “0” in the determination in step S37 (YES in the determination in step S37), the control unit 100 selects and implements the sequence number associated with the task. The sequence is changed (step S38), and then the process proceeds to step S33 and thereafter. Through the processing as described above, in this embodiment, both the first and second component mounting heads 30 and 40 can be operated in parallel as much as possible.

  Furthermore, in the determination in step S37, if there is no task having a value of “replacement priority” of “0” (NO in the determination in step S37), the control unit 100 is a control target of the mounting sequence. The component mounting head 30 (40) is retracted out of the interference area and waits for the other party (second component mounting head 40) to finish the current component mounting process (step S39). By this control, it is possible to reliably prevent interference between both the first and second component mounting heads 30 and 40.

  With the above processing, when both the first and second component mounting heads 30 and 40 are operating in parallel, the component mounting processing can be performed in parallel based on a preset preferable mounting sequence. In addition, when the other party (second component mounting head 40) is stopped, the operable component mounting head 30 (40) is preferentially operated, and moreover, it is prioritized from an area where interference is likely to occur. It becomes possible to proceed with the mounting of electronic components.

  For example, in the example shown in FIG. 8, when the own machine is the component mounting head 30 and the other party is the component mounting head 40, when the other party (second component mounting head 40) completes the first sequence number, printing is performed. The case where the carrying-out of the board | substrate P is illustrated is illustrated.

In the case of the example shown in FIG. 8, while the other party is executing the task related to the first sequence number, the control unit 100 performs the implementation sequence table illustrated in FIG. From the data of 123, a task related to the second sequence number is selected. Accordingly, the component mounting head 30 of the own machine executes a task related to the second sequence number. When this task is completed and the determination in step S21 in FIG. 7 is executed again, when the counterpart (second component mounting head 40) is carrying out the printed board P, the counterpart (second component mounting head) is executed. 40) can be determined to be stopped. Therefore, the control unit 100 assigns the task related to the sequence number 8 to the component mounting head 30 of its own device in step S27. As a result, the component mounting head 30 of the own machine preferentially executes the task with the highest degree of interference, so as the mounting operation of the component mounting head 30 progresses, the mounting operation simultaneously with the counterpart (second component mounting head 40). It is possible to increase the operating rate of both the first and second component mounting heads 30 and 40 and improve the processing speed. In the example of FIG. 8, after the counterpart (second component mounting head 40) starts carrying out the printed board P, the component mounting head 30 of its own device performs all tasks (8th, 4th, 10th, 6th). In this example, the tasks related to the sequence numbers are executed in descending order of replacement priority.

  In the example shown in FIGS. 9 and 10, in the same setting example as in FIGS. 4 and 5, for the first two tasks, the installation work of the printed circuit board P is executed by the counterpart mounting unit UB, and the component mounting head Since the component mounting head 30 of its own machine was preferentially executing tasks 8 and 4 because 40 was executing a stop, when the task of No. 4 was being executed, This is an example of returning to the original mounting sequence because the component mounting head 40 has started the component mounting operation.

  First, in the first to second tasks, since the counterpart (second component mounting head 40) is carrying in the printed circuit board P, the control unit 100 determines in step S21 that the counterpart (second component mounting head). 40) is determined to be stopped. Therefore, in step S27 of FIG. 7, tasks are assigned to the component mounting head 30 of the own machine in descending order of replacement priority. As a result, the component mounting head 30 of the own device executes the tasks related to the sequence numbers of Nos. 8 and 4 having a high replacement priority.

  When the other party (second component mounting head 40) resumes operation while the component mounting head 30 of this machine is executing the task related to the sequence number 4, the control unit 100 determines that the other party (second Also for the two-component mounting head 40), the mounting sequence is determined based on the flowchart of FIG. At this timing, a determination of YES is made in step S24 of FIG. 7, and step S25 is executed. As a result, the first sequence number to be executed by the counterpart (second component mounting head 40) is set to 1. As a result, the component mounting head 40 that has been mounted again can be operated in parallel with the own machine.

Next, when the component mounting head 30 of the own machine finishes the task relating to the sequence number 4 and executes the next task, the counterpart (second component mounting head 40) is in operation. 100 executes processing from step S21 to step S22 in FIG. For this reason, the task having the second sequence number is executed by the process of step S22.

While the component mounting head 30 of the own machine is executing the task related to the second sequence number, the control unit 100 finishes the task related to the first sequence number by the counterpart (second component mounting head 40). Assign the next task. At this timing, since the component mounting head 30 of the own machine is in operation , step S22 is executed, and the counterpart (second component mounting head 40) executes the task related to the third sequence number.

Further, in the situation where step S22 is executed, even if the mounting sequence is changed and the mounting order jumps, the task with the lowest numbered priority among the unmounted tasks is selected. After the other party (second component mounting head 40) finishes the task related to the sequence number, the other party (second component mounting head 40) continues to execute the task related to the fifth sequence number. . In this way, both the first and second component mounting heads 30 and 40 can execute parallel work at a high operating rate.

  As described above, according to the present embodiment, the two lanes 1 and 2 are adjacent to each other in parallel, and the first and second lanes 1 and 2 provided in the lanes 1 and 2 in the mounting area MA of both lanes 1 and 2 are described. The two-component mounting heads 30 and 40 are operated, and electronic components are mounted on the printed circuit board P in parallel. The mounting sequences of the first and second component mounting heads 30 and 40 are information related to tasks stored in the data storage means 102 as storage units (specifically, stored in the data tables 121 to 124 shown in FIG. 3). Is controlled by the control unit 100 as a control means. In the present embodiment, for example, when the mounting sequence of the first component mounting head 30 is determined, the interference region A is determined in the operation state in which the second component mounting head 40 that is the counterpart stops the mounting of the electronic component. The mounting sequence of the first component mounting head 30 is determined so as to preferentially select the task that enters the most. Similarly, when determining the mounting sequence of the second component mounting head 40, the task that enters the interference area A most preferentially in the driving situation in which the first component mounting head 30 stops mounting the electronic components. Thus, the mounting sequence of the second component mounting head 40 is determined.

  Thus, when one component mounting head (for example, the first component mounting head 30) and the counterpart (for example, the second component mounting head 40) have different timings for mounting the electronic components on the printed circuit board P, In an operating situation where there is no risk of interference, electronic components are mounted in order from the task that needs to enter the interference area A most frequently. Accordingly, as the mounting operation progresses, the possibility of interfering with the other one of the first component mounting head and the second component mounting head 30, 40 in the subsequent task decreases. Therefore, it is possible to shorten the tact time by increasing the ratio of the parallel work in the all component mounting work.

  In the present embodiment, when the control unit 100 determines the mounting sequence of one of the first component mounting head 30 and the second component mounting head 40, the counterpart (for example, the second component mounting head 40) In an operating situation where mounting of electronic components is stopped, among the unmounted tasks, the component mounting head to which the task is assigned needs to enter the interference area. Accordingly, tasks to be executed are assigned in order from the task with the highest replacement priority that determines the replacement priority of the mounting sequence. Therefore, in the present embodiment, for example, when the control unit 100 determines the mounting sequence of the first component mounting head 30 and the second component mounting head 40 stops mounting the electronic component, the first component mounting is performed. Among the tasks to be executed by the head 30, the mounting sequence is determined so as to be processed in order from the highest replacement priority. Similarly, when the control unit 100 determines the mounting sequence of the second component mounting head 40, the second component mounting head 40 executes when the first component mounting head 30 stops mounting the electronic component. Among the tasks that should be performed, the mounting sequence is determined so that the tasks having the highest replacement priority are processed in order. Thus, by determining the mounting sequence based on the replacement priority, selection from a plurality of tasks is facilitated, and the processing is quickened.

  In the present embodiment, the data storage means 102 has a database 120 as a storage area for storing information used for control of the control unit 100. The database 120 includes electronic components in two lanes 1 and 2 at the same time. An item ({sequence number}) for storing a value (sequence number) for determining a mounting sequence over the two printed circuit boards P to be mounted, and among the plurality of tasks, the component mounting head to which the task is assigned is an interference region Enter the interference area A among the items set to be necessary to enter the interference area A by the item ({interference flag}) for identifying what needs to enter A and the {interference flag}. Including an item ({replacement priority}) that determines the priority of replacement of the mounting sequence according to the degree to which the control unit 10 , In the operating conditions for selecting tasks for most enters the interference region A priority, based on the value of {replacement priority} database 120, and selects the task priority. Therefore, in the present embodiment, for example, when the control unit 100 determines the mounting sequence of the first component mounting head 30, the first component mounting head 40 stops the mounting of the electronic component. When preferentially selecting a task that enters the interference area A most preferentially with respect to the component mounting head 30, the task is preferentially selected based on the value of {replacement priority} set in the database 120. be able to. When the control unit 100 determines the mounting sequence of the second component mounting head 40, when the first component mounting head 30 stops mounting the electronic component, the second component mounting head 40 is placed in the interference region A. The same applies when a task that enters the most is preferentially selected. In this way, by storing predetermined information such as the value of {replacement priority} in the database 120 as a storage area, arithmetic processing for changing the mounting sequence is made unnecessary as much as possible. , Can quickly change the mounting sequence. As a result, the mounting sequence of the electronic components can be changed in real time during the component mounting operation, and a suitable mounting sequence can be set according to the operation status of both component mounting heads.

  In the present embodiment, the data storage means 102 stores in advance the priority order in which the first and second component mounting heads 30 and 40 preferentially execute the component mounting work in {priority order} of the database 120. Therefore, the control unit 100 determines a mounting sequence based on the value of {priority} in an operation situation where both the first and second component mounting heads 30 and 40 are operating. For this reason, in this embodiment, since both component mounting heads can be operated based on a suitable mounting sequence stored in the data storage means 102, both the first and second component mounting heads 30 and 40 are in parallel. Even when electronic components are mounted, it is possible to shorten the tact time by increasing the ratio of parallel processing to the entire component mounting operation.

Further, in this embodiment, the data storage means 102 sets the value of {priority} so as to determine a unique order over the entire two printed circuit boards P on which electronic components are simultaneously mounted in the two lanes 1 and 2. When one of the first component mounting head 30 and the second component mounting head 40 is in operation and the other restarts the component mounting operation from the stopped state, the control unit 100 stores { Based on the value of the priority order}, the mounting sequence is started in order from the other. For this reason, in the present embodiment, for example, when the second component mounting head 40, which has been stopped when the first component mounting head 30 is operating , resumes the component mounting operation, the mounting of the second component mounting head 40 is performed. When determining the sequence, the control unit 100 starts the mounting sequence in order from the second component mounting head 40 based on the value of {priority} stored in the data storage unit 102 in advance. Similarly, when determining the mounting sequence of the first component mounting head 30 when the first component mounting head 30, which has been stopped when the second component mounting head 40 is operating , resumes the component mounting operation. The control unit 100 starts the mounting sequence in order from the first component mounting head 30 based on the value of {priority} stored in the data storage unit 102 in advance. Therefore, when resetting the mounting sequence for both the first and second component mounting heads 30 and 40 to perform parallel work, the arithmetic processing for changing the mounting sequence becomes unnecessary as quickly as possible. The mounting sequence can be changed. As a result, the electronic component mounting sequence can be changed in real time during the component mounting operation, and a suitable mounting sequence can be set according to the operating conditions of both the first and second component mounting heads 30 and 40. It becomes possible. Moreover, since the mounting sequence is started in order from the counterpart (second component mounting head 40), the task assigned to the component mounting head 40 whose start is delayed is preferentially processed. As a result, it is possible to reduce the deviation of the mounting sequence as much as possible.

  As described above, according to the present embodiment, the electronic components are mounted in order from the task that needs to enter the interference area A most frequently in the driving situation where there is no possibility of interference. In the task to be performed, the possibility of interfering with either one of the first component mounting head and the second component mounting head 30, 40 is reduced. Therefore, there is a remarkable effect that it is possible to shorten the tact time by increasing the ratio of the parallel work in the all component mounting work.

  The present invention is not limited to the embodiment described above.

  For example, some steps can be omitted when the flowchart of FIG. 7 is executed. Specifically, depending on the setting of {priority order} in the mounting sequence table 123, both the first component mounting head 30 and the second component mounting head 40 can simultaneously execute the component mounting work in all tasks. There is a case. In such a case, when any one of step S22, step S25, or step S27 is executed, the process immediately proceeds to step S33, and a component suction operation or the like may be executed.

  The replacement priority may be registered in advance as data, or may be calculated according to the progress of the component mounting work.

  In addition, it goes without saying that various modifications can be made without departing from the scope of the present invention.

1 lane (example of 1st lane)
2 lanes (example of 2nd lane)
DESCRIPTION OF SYMBOLS 10 Component mounting system 30 1st component mounting head 40 2nd component mounting head 31, 41 Adsorption nozzle 100 Control unit (an example of a control means)
102 Data storage means (an example of a storage unit)
121 Component mounting head table 122 Substrate table 123 Mounting sequence table 124 Mounting sequence detail table A Interference area
MA mounting area (first mounting area, second mounting area)
P Printed circuit board UA First mounting unit UB Second mounting unit

Claims (3)

A first lane and a second lane installed in parallel and adjacent to each other to form a pair, each of which individually transports a substrate;
A first mounting area that is provided in the first lane and stops the board conveyed to the first lane to mount an electronic component;
A second mounting area provided in the second lane for stopping the board conveyed to the second lane and mounting an electronic component;
A first component mounting head that is provided in the first lane and mounts an electronic component on a substrate stopped in the first mounting area;
A second component mounting head which is provided in the second lane and mounts an electronic component on a substrate stopped in the second mounting area;
An area where a part of the first mounting area and a part of the second mounting area overlap, and an interference area where both the first component mounting head and the second component mounting head can enter,
Stores information related to a task with a unit of operation from when the first component mounting head and the second component mounting head pick up an electronic component to when the electronic component picked up on a substrate on a corresponding lane is mounted. A storage unit;
Control means for controlling the order of a plurality of tasks assigned to the first component mounting head and the order of a plurality of tasks assigned to the second component mounting head based on information stored in the storage unit And
The storage unit determines whether the first component mounting head and the second component mounting head determine a unique order over the two substrates on which electronic components are mounted simultaneously in the first lane and the second lane. Stores values related to the priority for executing component mounting work with priority.
The storage unit stores information related to a replacement priority indicating a degree of priority for a task when the priority is replaced,
The replacement priority is set so as to give priority to the component mounting head to which the task is assigned among the unmounted tasks, which enters the interference area most frequently.
The storage unit is for storing the operating range of the second component mounting head and operating range of the first component mounting head for each corresponding said task,
In the case where the control means executes the task of either the first component mounting head or the second component mounting head, the other of the first component mounting head and the second component mounting head is an electronic component. It is determined for each task whether or not the implementation of is stopped,
When either one of the first component mounting head and the second component mounting head stops the electronic component mounting at the time of the determination, the one component mounting head is based on the replacement priority regardless of the priority order. Preferentially select the task that enters the interference area with respect to the component mounting head preferentially, and when the one component mounting head is in operation , the other component mounting head that has been stopped When the operation is resumed, the task is executed in order from the other component mounting head based on the priority order. The electronic component mounting system according to claim 1,
The electronic component mounting system according to claim 1, wherein the control means determines an execution order of the tasks based on the priority in an operation situation where all the component mounting heads are operating. In the electronic component mounting system according to claim 1 or 2,
When the other component mounting head that has been stopped resumes the component mounting operation when the one component mounting head is in operation , the control means determines whether the other component mounting head is based on the priority order value. The electronic component mounting system is characterized in that the task is executed in order from the component mounting head.