JP5144548B2 - Mounting condition determination method - Google Patents

Description

  The present invention relates to a mounting condition determination method for determining a mounting condition for a component mounter including a plurality of transport conveyors arranged in parallel, and more particularly to processing related to selection of a production mode that is a kind of mounting condition.

  Conventionally, there is a component mounter as a device for mounting an electronic component (hereinafter simply referred to as “component”) on a substrate such as a printed wiring board.

  In recent years, there is a component mounting machine that includes a plurality of transfer conveyors arranged in parallel, and performs component mounting in parallel with a substrate transferred by each of these transfer conveyors. That is, there is a component mounter that has a plurality of lanes that are transport paths for mounting components on a board and executes component mounting operations in parallel.

  By using a component mounting machine having a plurality of lanes, it is possible to increase the number of component mounting boards produced per unit area compared to using a component mounting machine having only one lane.

  Further, for example, when focusing on one mounting head of a component mounting machine having a plurality of lanes, when component mounting is finished on a board on a certain lane, the other lane is not waited for the next board on that lane. The mounting of components on the upper board can be started.

  That is, it is possible to reduce the time consumed for transporting the substrate. In other words, the waiting time of the mounting head can be reduced.

  A technology related to such a component mounter having a plurality of lanes is also disclosed. For example, a technique for a production line in which a plurality of component mounters having two mounting heads and two lanes are connected is disclosed (for example, see Patent Document 1).

  According to this technique, whether to use each of the two lanes of each component mounting machine as a mounting stage for mounting components or as a bypass for performing only conveyance is controlled by a program.

This makes it possible for the subsequent substrate to pass the preceding substrate without providing a bypass-dedicated substrate transport mechanism, and it is possible to cope with various mounting forms.
JP 2003-204191 A

  The production mode when producing a component mounting board with a component mounting machine having two mounting heads and two transport conveyors includes the two mounting heads, the board on which these two mounting heads are the target of component mounting, It is roughly divided into two according to the relationship.

  Specifically, components are mounted on each of the two mounting heads only on the board that is transported by the transport conveyor closer to the component supply unit of the component supply source of the two transport conveyors. The component mounter can be operated so that Such a production mode is called an independent mode, for example.

  FIG. 17A is a diagram for explaining an independent mode in a component mounter having two lanes.

  In the component mounter shown in FIG. 17A, two lanes for component mounting are formed by two conveyors, which are a first lane and a second lane, respectively.

  In addition, the mounting head on the first lane side receives components from only the component supply unit on the first lane side. Further, the mounting head on the second lane side receives components supplied only from the component supply unit on the second lane side. This is the same even in the alternating mode, which is another production mode described later.

  In the independent mode, the mounting head on the first lane side mounts components only on the board placed on the board placement area on the first lane. Further, the mounting head on the second lane side mounts components only on the board placed on the board placement area on the second lane.

  FIG. 17B is a diagram for explaining an alternating mode in a component mounter having two lanes.

  In the alternating mode, the mounting head on the first lane side and the mounting head on the second lane side alternately mount components on the board on the first lane. In addition, these mounting heads alternately mount components on the board on the second lane.

  Each of the independent mode and the alternating mode has characteristics that are advantageous in terms of production efficiency, and it cannot be generally said which one should be adopted.

  For example, in the case of the independent mode, each mounting head has a feature that it is only necessary to mount a component only on a board close to the component supply unit of the component supply source, and the movement distance of each mounting head is relatively short.

  Further, in the alternate driving mode, there is a feature that the other mounting head can mount the component on the substrate on the mounting head side while the one mounting head sucks the component. That is, there is a feature that the operating efficiency of each mounting head can be improved.

  Therefore, before starting the production of the component mounting board, it is necessary to determine on a case-by-case basis whether the independent mode or the alternating mode is suitable for the scheduled component mounting operation.

  For this reason, conventionally, such a judgment is mostly dependent on, for example, a rule of thumb of a skilled operator, and this leads to a situation where the judgment is different when the operator is changed.

  Such a situation can be a major factor that causes a decrease in production efficiency, contrary to the requirement to produce a large number and types of component mounting boards in the shortest possible time.

  Here, the conventional technique described in Patent Document 1 is a technique that makes it possible to change the order of boards transported on two lanes when component mounting work on two lanes is performed asynchronously. It is.

  In other words, this is a technique for controlling the order of board transport when the component mounter is operated in the alternating mode, and does not provide a solution to the problem of which mode should be selected.

  In the present invention, in consideration of the above-mentioned conventional problems, either the independent mode or the alternating mode is appropriate before the component mounter including two transfer conveyors arranged in parallel starts production of the component mount board. It is an object of the present invention to provide a mounting condition determination method for quantitatively determining whether or not the above is true.

  In order to achieve the above object, a mounting condition determination method according to the present invention includes two mounting heads, two component supply units that supply components to the two mounting heads, and a parallel connection between the two component supply units. A mounting condition determination method for determining mounting conditions of a component mounting machine capable of performing component mounting work on a board transported on each of the two transport conveyors in parallel. An acquisition step of acquiring mounting information including data related to a board or a component used in a component mounting operation scheduled to be performed by the component mounting machine; and the two transfer conveyors to the two mounting heads An alternate beating mode in which components are alternately mounted on each of both substrates conveyed by the method, and the two conveying conveyors in each of the two mounting heads. Of the independent modes in which the component is mounted only on the board conveyed by the conveyance conveyor closer to the component supply unit that is the component supply source of the component to each mounting head, the production mode which is scheduled is the component The determination step of determining whether the mounting operation is suitable using the mounting information acquired in the acquisition step, and the component mounting operation scheduled in the determination step of the alternating mode and the independent mode. And a selection step of selecting the one determined to be suitable as the production mode of the component mounting machine.

  As described above, according to the mounting condition determination method of the present invention, mounting information including information related to a component and a board used in a scheduled component mounting operation is acquired. Further, a production mode suitable for the scheduled component mounting operation is selected from the acquired mounting information among the independent mode and the alternating mode.

  That is, according to the mounting condition determination method of the present invention, a production mode suitable for a scheduled component mounting operation is selected by quantitative judgment using objective facts about various elements used in the component mounting operation. be able to.

  Thereby, before starting the production of the component mounting board, it is possible to determine whether the independent mode or the alternating mode is appropriate as the production mode of the component mounting machine without depending on the operator.

  In the obtaining step, mounting information including board information, which is information relating to the board conveyed to each of the two conveying conveyors, is obtained. In the determining step, the board information is used to obtain mounting information in the case of the independent mode. When one of the two mounting heads is present, the other is not allowed to enter, and at least a part of each of the two substrates conveyed by the two conveyance conveyors, or both the substrates, It is determined whether or not a portion where each mounting position exists is placed for component mounting, and at least a part of each of the both boards or a portion where the mounting position exists is placed within the restriction region. In this case, it may be determined that the alternating mode is suitable for the scheduled component mounting operation.

  Thereby, for example, when there is a limited area in the independent mode due to the structure of the component mounting machine, a production mode suitable for the dimensions or mounting positions of each board is selected in consideration of the limited area.

  In addition, each of the two component supply units can be provided with one or more component storage means in which a plurality of types of components are stored, and in the acquisition step, the component is conveyed to each of the two conveyors. Mounting information including board information indicating a type of a component to be mounted on a board and supply unit information indicating an attribute of a component storage unit corresponding to each of the two component supply units, and in the determination step, Using the board information and the supply unit information, the common parts that are the types of parts to be mounted in common on the board transported to one transport conveyor and the board transported to the other transport conveyor are It is determined whether or not both of the component supply units can supply, and when only one of the two component supply units can supply the common component, the alternating mode is the scheduled It may be determined to be suitable for the component mounting operation to be.

  Thereby, it is quantitatively determined from the acquired information whether or not both component supply units can supply the common component. Further, based on this quantitative determination, an appropriate production mode is selected for the component mounting operation.

  The supply unit information is a component storage unit corresponding to each of the two component supply units, and indicates the type of component storage unit attached to or attachable to each of the two component supply units. Information is included as the attribute, and in the determination step, the component storage means storing the common component is attached to only one of the two component supply units from the board information and the supply unit information. Alternatively, when it is determined that attachment is possible, only one of the two component supply units may determine that the common component can be supplied.

  In this way, by using the standard of whether component storage means such as a component cassette in which common components are stored is actually attached to or can be attached to both component supply units, both component supply units Is accurately determined whether or not common parts can be supplied.

  Further, the supply unit information further includes, as the attribute, information indicating the number of component storage units that can be attached to each of the two component supply units, which can be used for the scheduled component mounting operation, and the determination step. Then, when the supply unit information indicates that the number of usable component storage units storing the common component is 1, it is determined that the supply unit information can be attached to only one of the two component supply units. You may do that.

  Thereby, from the changing attribute of the usable number of the component storage means, the possibility of the arrangement of the common component in both component supply units at that time is accurately determined. For example, the number of parts cassettes in which common parts are stored can vary depending on individual sites or times. Therefore, the production mode can be selected more realistically by determining the possibility of arranging common parts in both parts supply units using the usable number of parts storage means.

  Further, each of the two mounting heads can be attached with one or more nozzles for mounting the sucked components on the substrate, and in the obtaining step, the components to be mounted on the substrate transported to the two transport conveyors, respectively. Component information indicating the type of nozzle and the type of nozzle that can be mounted on the board, and mounting information including nozzle information indicating the type of nozzle corresponding to each of the two mounting heads In the step, using the component information and the nozzle information, a common component that is a type of component that should be mounted in common on a substrate conveyed to one conveyance conveyor and a substrate conveyed to the other conveyance conveyor, It is determined whether both of the two mounting heads can be mounted on the board, and only one of the two mounting heads can mount the common component on the board. If it is, it may be the alternate beating mode is determined to be suitable for the component mounting operations that are the expected.

  Thereby, it is quantitatively determined from the acquired information whether or not both mounting heads can mount the common component. Further, based on this quantitative determination, an appropriate production mode is selected for the component mounting operation.

  Furthermore, the present invention can be realized as a mounting condition determining apparatus that executes characteristic processing steps in the mounting condition determining method of the present invention. Further, the present invention can be realized as a component mounter that includes the mounting condition determination device of the present invention and performs component mounting according to the determination.

  Furthermore, the present invention can be realized as a program for causing a computer to execute the characteristic processing steps in the mounting condition determination method of the present invention, or can be realized as a storage medium such as a CD-ROM storing the program, It can also be realized as an integrated circuit. The program can also be distributed via a transmission medium such as a communication network.

  The present invention relates to a component mounting machine including two mounting heads, two component supply units that supply components to the two mounting heads, and two transport conveyors arranged in parallel between the two component supply units. Before starting production of a component mounting board, it is possible to provide a mounting condition determination method for quantitatively determining which one of the independent mode and the alternating mode is appropriate.

  Specifically, for the determination in the present invention, information related to a board or a component, which is an element used for component mounting work scheduled to be performed by the component mounter, is used. Therefore, a production mode suitable for executing the component mounting work is determined.

  Furthermore, the selection of the production mode by the mounting condition determination method of the present invention can be performed before the start of the production of the component mounting board. Thereby, before the said start, preparations, such as allocation of the component to a component supply part, according to the selected production mode, can be performed and production can be started.

  Therefore, there is no need to change from the independent mode to the alternating mode or vice versa during the production of the component mounting board. That is, during production of the component mounting board, for example, it is not necessary to perform complicated control accompanying a change in the production mode such as a change in the component suction order of each mounting head.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the structure of the component mounting machine 200 in the embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a schematic diagram showing an outline of a component mounter 200 in the embodiment.
As shown in FIG. 1, a component mounter 200 according to the embodiment is a component mounter that can perform component mounting operations on two substrates in parallel.

  Specifically, the component mounting machine 200 includes two lanes that are transport paths for mounting components on a board by including two transport conveyors. In addition, components are mounted on respective boards transported on two lanes by two mounting heads.

FIG. 2 is a schematic top view showing the configuration of the component mounter 200 in the embodiment.
As shown in FIG. 2, the component mounter 200 has a mounting head 104 and a mounting head 107 that face each other as a mechanism for mounting the component on each substrate that is conveyed, and components that supply components to these. A supply unit 106 and a component supply unit 109 are provided.

  Furthermore, the component mounting machine 200 includes a first conveyor 101 and a second conveyor 102 that are arranged in parallel between the component supply unit 106 and the component supply unit 109.

  As shown in FIG. 2, in the component mounter 200, the first conveyor 101 forms a front (F) lane that is a lane on the front side (lower side in FIG. 2). Further, the second conveyor 102 forms a rear (R) lane which is a rear lane (upper side in FIG. 2).

  Each of the first conveyor 101 and the second conveyor 102 can change its own width according to the width of the substrate to be transported (the length of the substrate in the Y-axis direction).

  Specifically, the first conveyor 101 includes a fixed rail 101a and a movable rail 101b, and the width of the first conveyor 101 can be changed by moving the movable rail 101b in the Y-axis direction.

  Similarly, the second conveyor 102 includes a fixed rail 102a and a movable rail 102b, and the width of the second conveyor 102 can be changed by moving the movable rail 102b in the Y-axis direction.

  Since the widths of the first conveyor 101 and the second conveyor 102 are variable as described above, the component mounting machine 200 can mount components on substrates of various dimensions.

  In each of the F lane and the R lane, the substrate is transferred from the left side of FIG. 2 that is the upstream side toward the right side of FIG. 2 that is the downstream side.

  One or more nozzles can be attached to both the front mounting head 104 and the rear mounting head 107. Further, when a plurality of nozzles are attached, a plurality of components can be sucked together.

  Further, the mounting head 104 mounts the component sucked from the component supply unit 106 on the substrate. The mounting head 107 mounts the component sucked from the component supply unit 109 on the substrate.

  In the present embodiment, each of the component supply unit 106 and the component supply unit 109 can be attached with one or more component cassettes storing a plurality of one type of components.

  The mounting head 104 can move along the beam 105 in the X-axis direction, and the mounting head 107 can move along the beam 108 in the X-axis direction. Furthermore, each of the beam 105 and the beam 108 can move independently in the Y-axis direction.

  With this configuration, each of the mounting head 104 and the mounting head 107 moves on the XY plane within a predetermined range independently of each other.

  By moving the mounting head 104 and the mounting head 107 in this way, components can be mounted on the two substrates conveyed to the substrate placement area by the first conveyor 101 and the second conveyor 102.

  In addition, the component mounter 200 can employ either the independent mode or the alternating mode as a production mode when producing the component mounting board.

  The independent mode means that only the board conveyed to the mounting head 104 and the mounting head 107 by the transport conveyor close to the component supply unit, which is the component supply source, of the first conveyor 101 and the second conveyor 102, respectively. Is a production mode that implements

  That is, in the independent mode, the mounting head 104 mounts components only on the board conveyed by the first conveyor 101 close to the component supply unit 106 that is a component supply source to the mounting head 104. In addition, the mounting head 107 mounts components only on the board conveyed by the second conveyor 102 close to the component supply unit 109 that is a supply source of the components to the mounting head 107.

  The alternate driving mode is a production mode in which the mounting head 104 and the mounting head 107 are alternately mounted with components on both substrates conveyed by the first conveyor 101 and the second conveyor 102.

  For example, two substrates carried on the F lane and the R lane are assumed to be an F substrate and an R substrate as shown in FIG. In this case, the combination of the substrate and the mounting head in each of the independent mode and the alternating driving mode is as follows.

  In the independent mode, only the front mounting head 104 mounts components on the F board, and only the rear mounting head 107 mounts components on the R board.

  In the alternate driving mode, the mounting head 104 and the mounting head 107 alternately mount components on both the F substrate and the R substrate.

  In addition, the component mounter 200, as a production mode related to the board transport mode, is a synchronous mode for synchronizing the carry-out of the board after the component mounting between the respective conveyors, and the board carry-in and board delivery after the component mounting. Asynchronous mode in which each of the conveyors is independently performed can be employed.

  The relationship between the synchronous mode and the asynchronous mode, and the independent mode and the alternating mode is as follows.

  In the synchronous mode, in principle, the front mounting head 104 mounts components on the F board, and the rear mounting head 107 mounts components on the R board. That is, the independent mode is executed.

  This is because the movement distance of the mounting head 104 and the mounting head 107 in the Y-axis direction is shorter in the independent mode than in the alternating mode, and as a result, the production tact is shortened.

  In the asynchronous mode, in principle, the mounting head 104 and the mounting head 107 alternately mount components on both the F substrate and the R substrate. That is, the alternating mode is executed.

  This is because when the mounting head 104 and the mounting head 107 are operated in the alternating mode, the mounting work interruption period due to the suction operation of the components of the mounting head 104 and the mounting head 107 is short, resulting in a reduction in production tact. It is.

  For example, it is assumed that the F substrate and the R substrate are transported in the asynchronous mode, and the mounting head 104 and the mounting head 107 are operated in the independent mode. In this case, only the mounting head 104 is mounted on the F substrate. Therefore, the mounting operation on the F substrate is interrupted while the mounting head 104 is sucking the component. At this time, if the R substrate is not on the mounting stage, a wasteful waiting time is generated in the mounting head 107.

  However, when the mounting head 104 and the mounting head 107 are operated in the alternating mode, the mounting head 107 can mount the component on the F substrate while the mounting head 104 is sucking the component. Therefore, the interruption of the component mounting operation for the F board can be minimized.

  Even if the combination of the F board and the R board, the mounting head 104, and the mounting head 107 in the synchronous mode is other than the above, it is possible to mount components on the board. However, from the viewpoint of production efficiency, the above combination is adopted as a combination suitable for the synchronous mode.

  FIG. 3 is a schematic diagram showing the positional relationship between the mounting head 104 and the component supply unit 106. One or more nozzles can be attached to the mounting head 104 as described above, and in the present embodiment, up to eight nozzles can be attached.

  In addition, eight nozzles are arranged in four rows of four nozzles arranged in one row. Therefore, it is possible to simultaneously pick up components from each of up to four component cassettes 110 (by one up and down movement).

  In the present embodiment, each component cassette 110 is loaded with one component reel PT. The component reel PT is a state in which a component tape storing a plurality of one type of components is wound, and components are supplied from the component reel PT to the component mounting machine 200 via the component cassette 110.

  Each of the plurality of component cassettes 110 is an example of a component storage unit in the mounting condition determination method of the present invention. Further, instead of the component cassette 110, a component feeder, a component tray, or the like may be used as the component storage means.

  In addition, the mounting head 107 has the same configuration as the mounting head 104, and can absorb components from each of the plurality of component cassettes 110 set in the component supply unit 109 and mount them on the substrate.

  FIG. 4 is a functional block diagram showing a main functional configuration of the component mounter 200 in the embodiment.

  As shown in FIG. 4, the component mounter 200 includes a mounting condition determination device 220, a mounting information storage unit 130, and a mechanism control unit 140 in addition to the mechanism unit 150 including the mounting head 104 and the like.

  The mounting condition determination device 220 is a device that determines the mounting conditions of the component mounting machine 200. In the present embodiment, a production mode that is a kind of mounting condition is determined.

  Specifically, before the start of a series of component mounting operations, a production mode suitable for the component mounting operation is selected from the independent mode and the alternating mode.

  As illustrated in FIG. 4, the mounting condition determination device 220 includes a communication unit 221, an acquisition unit 222, a determination unit 223, and a selection unit 224.

  The communication unit 221 is a processing unit for exchanging information between the mounting condition determination device 220 and other components in the component mounter 200 and external devices.

  The acquisition unit 222 is a processing unit that acquires various types of mounting information including information related to a board or a component used for a component mounting operation scheduled to be performed by the component mounting machine 200.

  In the present embodiment, the acquisition unit 222 acquires board data 130a and the like stored in the mounting information storage unit 130 as the various types of mounting information.

  The mounting information storage unit 130 is a storage device that stores board data 130a, a component library 130b, supply unit data 130c, and nozzle data 130d.

  Various types of mounting information stored in the mounting information storage unit 130 will be described later with reference to FIGS.

  The determination unit 223 is an example of a processing unit that executes a determination step in the mounting condition determination method of the present invention. Specifically, the determination unit 223 uses the mounting information acquired by the acquisition unit 222 to determine which of the independent mode and the alternating mode is the production mode suitable for the scheduled component mounting operation. It is.

  The selection unit 224 is an example of a processing unit that executes a selection step in the mounting condition determination method of the present invention. Specifically, the selection unit 224 is a processing unit that selects, as the production mode of the component mounter 200, the production mode that is determined to be suitable for the component mounter 200 by the determination unit 223.

  The mounting condition determination device 220 gives various instructions to the mechanism control unit 140 so that the component mounting machine 200 operates in the production mode determined by such selection.

  The mechanism control unit 140 controls the operation of the mounting head 104 and the mounting head 107 included in the mechanism unit 150 in accordance with these instructions.

  Note that the processing of the communication unit 221, the acquisition unit 222, the determination unit 223, and the selection unit 224 included in the mounting condition determination device 220 according to the embodiment includes, for example, a central processing unit (CPU), a storage device, and information input / output. It is realized by a computer having an interface for performing.

  For example, the CPU acquires the mounting information via the interface. The CPU further determines the suitability of each production mode for the component mounting operation, selects the production mode based on the determination result, and the like. Such processing of the computer is realized, for example, when the computer executes the program of the present invention.

FIG. 5 is a diagram illustrating an example of a data configuration of the board data 130a in the embodiment.
The board data 130a is an example of board information in the mounting condition determination method of the present invention, and is data including information on various boards that are to be mounted by the component mounter 200 as shown in FIG. .

  Specifically, the substrate data 130a includes the length (L) and width (W) values (unit: mm) of each of the plurality of types of substrates. Further, the type and number of components to be mounted per board for each board type are included.

  The length (L) of the substrate is the length in the substrate transport direction, that is, the length in the X-axis direction, and the width (W) of the substrate is the length in the Y-axis direction of the substrate.

  Although not shown in FIG. 5, the board data 130a also includes information indicating the types of components to be mounted for each type of board and their mounting positions.

  The above-mentioned “type of board” is specified by the mounting position of the component or the type of component to be mounted. That is, even if two boards are physically separated, they are of the same type as long as the types and positions of the components to be mounted are the same.

  Further, even if the board is physically a single board, the board is a double-sided board on which components are mounted on both sides, and if the type or mounting position of the parts to be mounted on each side differs, Depending on which side the component is mounted on, it is handled as a different type of board.

  FIG. 6 is a diagram illustrating an example of a data configuration of the component library 130b according to the embodiment.

  As shown in FIG. 6, the component library 130 b is a library in which unique information about each of a plurality of component types that can be handled by the component mounter 200 is collected.

  Specifically, the part library 130b includes part dimensions for each part type (part name), tact (tact specific to the part type under a certain condition), and other constraint information (usable nozzle types, part recognition). Camera recognition method, maximum acceleration ratio of mounting head, etc.) and appearance data of each component.

  FIG. 7 is a diagram illustrating an example of a data configuration of the supply unit data 130c in the embodiment.

  As shown in FIG. 7, the supply unit data 130 c is data including various types of information about the component cassette 110, the component supply unit 106, and the component supply unit 109, which are information related to components.

  Specifically, the component cassette data indicating the attribute of the component cassette 110 storing the components used for the scheduled component mounting operation, and the mounting width indicating the maximum total mounting width of the component supplying unit 106 and the component supplying unit 109 Data and are included.

  As shown in FIG. 7, the component cassette data includes a cassette ID, a component name, a mounting pitch, and a stock quantity for each component cassette 110.

  The cassette ID is an identifier that identifies the type of the component cassette 110. The component name is information for identifying the type of component stored in the component cassette 110. The mounting pitch is a value indicating a width necessary for mounting the component cassette 110 to the component supply unit 106 or the component supply unit 109.

  The stock quantity is the stock quantity of the component cassette 110. That is, it is the number of the component cassettes 110 that can be used for component mounting work by the component mounting machine 200. In addition, the number of stocks can be updated by communicating with an external device, for example.

  For example, the component cassette 110 with the cassette ID “C16” stores a plurality of components called LLCCAP, and when the component cassette 110 is attached to the component supply unit 106 or the component supply unit 109, a width of “42 mm” is required. is there.

  Since the stock quantity is “1”, it can be attached only to either the component supply unit 106 or the component supply unit 109.

  The attachment width data includes a value indicating the maximum total attachment width when the component cassette 110 is attached to each of the component supply unit 106 and the component supply unit 109.

  Note that “F” in the attachment width data means the component supply unit 106 that is the front-side component supply unit, and “R” means the component supply unit 109 that is the rear-side component supply unit.

  In the attachment width data shown in FIG. 7, the maximum total attachment width is “567 mm” for both the component supply unit 106 and the component supply unit 109.

  That is, in the component supply unit 106 and the component supply unit 109, 567 ÷ 21 = 27 component cassettes 110 can be mounted if both component cassettes 110 have a mounting pitch of 21 mm.

  In addition, for example, 21 component cassettes 110 having an attachment pitch of 21 mm and 21 component cassettes 110 having an attachment pitch of 42 mm can be attached to the component supply unit 106 and the component supply unit 109.

  FIG. 8 is a diagram illustrating an example of a data configuration of the nozzle data 130d in the embodiment.

  As shown in FIG. 8, the nozzle data 130 d is data that includes information about the nozzle that sucks the component, which is information related to the component. Specifically, the nozzle data 130d includes information indicating the type and number of nozzles attached to the mounting head 104 and the mounting head 107.

  The mounting head [F] means the mounting head 104 that is the front mounting head, and the mounting head [R] means the mounting head 107 that is the rear mounting head.

  For example, the nozzle data 130d shown in FIG. 8 indicates that the mounting head 107 has two S nozzles and two L nozzles attached thereto.

  Further, the contents of the nozzle data 130d are updated by, for example, the mechanism control unit 140 when the nozzles of the mounting head 104 and the mounting head 107 are attached, removed, or replaced.

  The mounting condition determination apparatus 220 according to the embodiment uses the various mounting information stored in the mounting information storage unit 130 to determine which of the independent mode and the alternating mode is to be performed by the component mounting machine 200. It can be judged whether it is suitable for work.

  Next, the operation or processing of the component mounter 200 and the mounting condition determination device 220 in the embodiment will be described with reference to FIGS.

First, a basic process of the mounting condition determining apparatus 220 will be described with reference to FIG.
FIG. 9 is a flowchart illustrating a basic processing flow related to the production mode selection by the mounting condition determining apparatus 220 according to the embodiment.

  First, the acquisition unit 222 of the mounting condition determination apparatus 220 acquires mounting information including data related to a board or a component used for a planned component mounting operation from the mounting information storage unit 130 via the communication unit 221 ( S10).

  Specifically, the acquisition unit 222 acquires the board data 130a, the component library 130b, the supply unit data 130c, and the nozzle data 130d from the mounting information storage unit 130.

  For each of the board data 130a, the component library 130b, and the supply unit data 130c, not all the information is acquired, but only the parts used for the scheduled component mounting work or the parts related to the board are acquired. Also good.

  Using the mounting information, the determination unit 223 determines which one of the independent mode and the alternating mode is suitable for the component mounting work (S20). Details of the suitability determination process will be described later with reference to FIGS.

  The selection unit 224 selects the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S30).

  That is, when it is determined that the independent mode is more suitable for the component mounting work (independent in S20), the independent mode is selected (S31). If it is determined that the alternate placement mode is more suitable for the component mounting work (alternate placement in S20), the alternate placement mode is selected (S32).

  The suitability determination process (S20) corresponds to the process in the determination step in the mounting condition determination method of the present invention, and the process (S30) for selecting the production mode is the selection step in the mounting condition determination method of the present invention. It corresponds to the processing in.

  The mounting condition determination device 220 gives various instructions to the mechanism control unit 140 so that the component mounting machine 200 operates in the production mode determined by such selection.

  The mechanism control unit 140 controls the operation of the mechanism unit 150 in accordance with an instruction from the mounting condition determination device 220.

  FIG. 10 is a flowchart illustrating a detailed processing flow related to the production mode selection by the mounting condition determining apparatus 220 according to the embodiment.

The details of the production mode suitability determination process by the determination unit 223 will be described with reference to FIG.
First, the determination unit 223 places the board for component mounting in the restricted area of the component mounting machine 200 in the independent mode from the dimensions of the board to be mounted in the component included in the acquired board data 130a. It is determined whether or not (S21).

  Here, the restricted area is an area in which when one of the mounting head 104 and the mounting head 107 exists, the other is not allowed to enter.

  This is an area provided to prevent the mounting head 104 and the mounting head 107 from interfering with each other, and is also referred to as an interference area.

  The determination unit 223 acquires the position information of the restricted area in the component mounter 200 from the mechanism control unit 140, for example. Further, the determination unit 223 can capture the positional relationship between the board and the restricted area from the acquired position information and the width dimension of the board indicated in the board data 130a.

  Since the movable ranges of the mounting head 104 and the mounting head 107 are different between the independent mode and the alternating mode, this limited region is also different in each mode.

  FIG. 11 is a diagram illustrating an example of a limited region in the alternate beating mode according to the embodiment.

  In the alternate driving mode, each of the mounting head 104 and the mounting head 107 has a wide range of movement because components are mounted on both the F substrate and the R substrate.

  Therefore, as shown in FIG. 11, for example, when the mounting head 107 enters the restricted area sandwiched between dotted lines, the mounting head 104 is prohibited from entering the restricted area until the mounting head 107 moves out of the restricted area. Is done.

  Similarly, when the mounting head 104 enters the restricted area, entry of the mounting head 107 into the restricted area is similarly prohibited.

  On the other hand, in the independent mode, the mounting head 104 may mount components only on the F substrate, and the mounting head 107 may mount components only on the R substrate. For this reason, the movable ranges of the mounting head 104 and the mounting head 107 are narrower than in the alternating mode.

  Therefore, the restricted area in the independent mode is smaller than the restricted area in the alternating mode.

  FIG. 12A and FIG. 12B are diagrams illustrating examples of restricted areas in the independent mode. FIG. 12A shows a state in which neither the F substrate nor the R substrate is placed in the restricted area because the F substrate and the R substrate are relatively small.

  FIG. 12B shows a state in which both the F substrate and the R substrate are both placed in the restricted area because the F substrate and the R substrate are relatively large.

  When the widths of the F substrate and the R substrate are as shown in FIG. 12A, the mounting head 104 that moves to mount the component on the F substrate and the mounting that moves to mount the component on the R substrate There is no interference with the head 107.

  That is, the mechanism control unit 140 only needs to control the mounting head 104 and the mounting head 107 so that components are mounted on the boards in charge of the mounting head 104 and the mounting head 107, and does not need to perform control in consideration of the position of each other.

  Therefore, when the F board and the R board are not placed in the restricted area, the determination unit 223 performs a primary determination that the independent mode is suitable for the component mounting work (not in S21).

  However, as shown in FIG. 12B, the F substrate and the R substrate are relatively wide substrates. Therefore, at least a part of each of the F substrate and the R substrate is placed in the restricted region. Assuming that In this case, there is a possibility that the mounting head 104 and the mounting head 107 interfere with each other.

  Therefore, as shown in FIG. 12B, when the at least part of both boards is placed on the restricted area in the independent mode, the determination unit 223 is suitable for the component mounting work. (It is S21).

  The selection unit 224 selects the alternating mode as the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S32).

  For example, when the distance in the Y-axis direction between the first conveyor 101 and the second conveyor 102 is sufficiently large, or the variable width of the first conveyor 101 and the second conveyor 102 is small, the F substrate and the R Assume that the substrate is not close enough to interfere with the mounting heads. In this case, there is no restriction area in the independent mode. However, in this embodiment, it is assumed that there is a limited area in the case of the independent mode.

  Further, even when a part of each of the F substrate and the R substrate is located in the restricted region, if the mounting position does not exist in the restricted region, the mounting head 104 and the mounting head 107 are not in the restricted region. Components are not mounted inside. Therefore, interference between the mounting head 104 and the mounting head 107 does not occur.

  Therefore, for example, information indicating the mounting positions of the F board and the R board is obtained from the board data 130a, and the production mode is determined depending on whether or not the portion including the mounting positions of the F board and the R board is placed in the restricted area. It may be judged whether or not.

  That is, when it is determined that the portion including the mounting position of each of the F board and the R board is placed within the restricted region, it may be determined that the alternate mounting mode is suitable for the component mounting work scheduled. .

  If the determination unit 223 makes a primary determination that the independent mode is suitable for the component mounting operation (not S21), the determination unit 223 further determines the first conveyor 101 from the arrangement state or possibility of arrangement of the components and nozzles. Supply of components of the type (hereinafter referred to as “common components”) to be mounted in common on the F substrate conveyed to the second conveyor 102 and the R substrate conveyed to the second conveyor 102 and mounting on the substrate are both It is determined whether it is possible on the lane side (S22).

  Specifically, the determination unit 223 first uses the board data 130a and the supply unit data 130c acquired by the acquisition unit 222 to determine whether both the component supply unit 106 and the component supply unit 109 can supply a common component. Judge whether or not.

  Further, the determination unit 223 uses the component library 130b and the nozzle data 130d acquired by the acquisition unit 222 to determine whether both the mounting head 104 and the mounting head 107 can mount the common component on each substrate. To do.

  If the determination unit 223 determines that the supply of the common component and the mounting on the board are possible in both lanes, the determination unit 223 determines that the independent mode is suitable for the component mounting operation (possible in S22).

  The selection unit 224 selects the independent mode as the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S31).

  In addition, when the determination unit 223 determines that at least one of the supply of the common component and the mounting on the board is not possible in at least one of both lanes, the determination unit 223 determines that the alternating mode is suitable for the component mounting operation. (Not possible in S22).

  The selection unit 224 selects the alternating mode as the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S32).

  FIG. 13 is a diagram illustrating an example of component arrangement in the component mounter 200. FIG. 14 is a diagram illustrating another example of component placement in the component mounter 200.

  A specific example of the determination process performed by the determination unit 223 as to whether or not both the component supply unit 106 and the component supply unit 109 can supply a common component will be described with reference to FIGS. 13 and 14.

  Note that symbols a to e and α, β, and γ shown in FIGS. 13 and 14 represent the types of components. Each of a to e is a small part, and each of α, β, and γ is a large part.

  First, as shown in FIG. 13, the components to be mounted on the F substrate are a, b, c, d, and e, and the components to be mounted on the R substrate are a, c, α, β, and γ. Assume a case.

  In this case, a and c are common components that need to be mounted on both the F substrate and the R substrate.

  The determination unit 223 refers to the substrate data 130a regarding the F substrate and the R substrate acquired by the acquisition unit 222. Thereby, these common components and the components used for each substrate other than the common components are specified.

  Considering that components are mounted on such F and R boards in an independent mode, a, b, c, d, e are arranged in the component supply unit 106, and a, c are arranged in the component supply unit 109. , Α, β, γ need to be arranged.

  Here, each of a, b, c, d, and e is a small component, and the mounting pitch of the component cassette 110 that stores these components is a relatively small value.

  For example, the maximum total mounting width of the component supply unit 106 is “100”, and the mounting pitch of the component cassettes 110 for a, b, c, d, and e is “15”. In this case, the total mounting pitch of these five component cassettes 110 is “75”. Accordingly, the determination unit 223 can attach all necessary component cassettes 110 to the component supply unit 106, including the component cassette 110 in which common components are stored (hereinafter referred to as “common component cassette 110”). It is judged that.

  On the other hand, each of α, β, and γ, which are essential components only for the R board, to be supplied by the component supply unit 109 is a large component, and the mounting pitch of the component cassette 110 that stores these components is a relatively large value. It is.

  Therefore, the two component cassettes 110 that store the common components a and c may not be attached to the component supply unit 109.

  For example, the maximum total mounting width of the component supply unit 109 is “100”, and the mounting pitch of the component cassettes 110 for α, β, and γ is “30”.

  In this case, the determination unit 223 subtracts the total “90” of the mounting pitches of the component cassettes 110 of α, β, and γ, which are component cassettes 110 of components other than the common component, from the maximum total mounting width of “100”. . Thereby, “10” which is the remaining mounting width is calculated.

  Further, the determination unit 223 compares “10” that is the remaining mounting width with “15” that is the mounting pitch of each of the component cassettes 110 of a and c. Accordingly, it is determined that the component cassettes 110 a and c cannot be attached to the component supply unit 109.

  Accordingly, the determination unit 223 determines that only the component supply unit 106 can supply common components.

  As described above, the determination unit 223 determines whether or not the common component cassette 110 can be attached to both the component supply unit 106 and the component supply unit 109 in consideration of the dimension of the component cassette 110 called the attachment pitch.

  Here, even if the common component cassette 110 can be dimensionally attached to both the component supply unit 106 and the component supply unit 109, it is determined whether or not there is a common component cassette 110 that can be used. There is a problem.

  Therefore, the determination unit 223 further determines whether it can be attached to both the component supply unit 106 and the component supply unit 109 in consideration of the number of common component cassettes 110 that can be used.

  It should be noted that either the determination of the attachment possibility of the common component cassette 110 from the viewpoint of dimensions or the determination of the attachment possibility of the common component cassette 110 from the viewpoint of the usable number may be first. .

  For example, as shown in FIG. 14, it is assumed that the components to be mounted on the F substrate are a, d, e, and f, and the components to be mounted on the R substrate are a, b, and c.

In this case, a is a common component that needs to be mounted on both the F substrate and the R substrate.
Under such assumptions, when components are mounted on the F board and the R board in the independent mode, a, d, e, and f are arranged in the component supply unit 106, and a, b are arranged in the component supply unit 109. , C need to be arranged.

  However, when only one component cassette 110 can be prepared, specifically, when the number of inventory of the component cassette 110 a shown in the supply unit data 130c is 1, the component supply unit 106 and the component supply unit 109 are used. The component cassette 110 of a cannot be attached to both.

  That is, the determination unit 223 specifies the number of stocks of the common component cassette 110 from the supply unit data 130 c acquired by the acquisition unit 222. Further, if the stock quantity is “1”, it is determined that the component cassette 110 of “a” can be attached to only one of the component supply unit 106 and the component supply unit 109.

  Accordingly, the determination unit 223 determines that only one of the component supply unit 106 and the component supply unit 109 can supply the common component.

  Here, if the component mounter 200 is operated in the independent mode in the component arrangement state shown in FIG. 13 or FIG. 14, the component mounter 200 is once attached to the board on which the component arrangement is complete. All necessary parts can be mounted just by passing.

  Specifically, all of the necessary components are mounted on the F board in the case of FIG. 13 and the R board in the case of FIG.

  However, in any case, all the necessary components are not mounted on the other board only by passing the component mounting machine 200 once. For this reason, it is necessary to input the component mounter 200 again and mount an unmounted component.

  Alternatively, it is necessary to connect another component mounter downstream of the component mounter 200 and mount an unmounted component on this component mounter.

  That is, operating the component mounter 200 in the independent mode when the combination of the component arrangement state and the board is the combination shown in FIG. 13 or FIG. 14 is not significant from the viewpoint of time or economy. Absent.

  Therefore, when only one of the component supply unit 106 and the component supply unit 109 can supply the common component, the determination unit 223 indicates that the alternating mode is suitable for component mounting work on the F substrate and the R substrate. Judgment (impossible in S22 of FIG. 10).

  In other words, even if two common component cassettes 110 can be prepared, the determination unit 223 cannot be attached to either the component supply unit 106 or the component supply unit 109 in dimension, and the alternate beating mode is the F substrate. And the R board are determined to be suitable for component mounting work.

  Further, even if the determination unit 223 can attach the common component cassette 110 to both the component supply unit 106 and the component supply unit 109 in terms of dimensions, when only one common component cassette 110 can be prepared, It is determined that the alternating mode is suitable for component mounting work on the F board and the R board.

  The determination unit 223 can prepare two common component cassettes 110 from the board data 130a and the supply unit data 130c, and can be attached to both the component supply unit 106 and the component supply unit 109 in terms of dimensions. If it is determined, the nozzle determination process is performed next.

  Specifically, based on the types of nozzles attached to the mounting head 104 and the mounting head 107, the mounting head 104 can suck the common component and mount it on the F substrate, and the mounting head 107 sucks the common component and R It is determined whether or not it can be mounted on the board.

  FIG. 15 is a diagram illustrating an example of an arrangement state of nozzles of the mounting head 104 and the mounting head 107.

  As shown in FIG. 15, it is assumed that the components to be mounted on the F substrate are c, α, and β, and the components to be mounted on the R substrate are a, b, and α. In this case, α is a common component that needs to be mounted on both the F substrate and the R substrate.

  Further, as shown in the figure, it is assumed that the mounting head 104 has two L nozzles and two S nozzles, and the mounting head 107 has eight S nozzles. .

The L nozzle is a nozzle for large parts, and the S nozzle is a nozzle for small parts.
The determining unit 223 refers to the nozzle data 130d acquired by the acquiring unit 222, and identifies the type and number of these nozzles attached to the mounting head 104 and the mounting head 107, respectively.

  Under the above assumption, the mounting head 104 can be sucked and mounted on the F substrate, whether it is a large component or a small component. However, only the S nozzle for small parts is attached to the mounting head 107.

  Therefore, the mounting head 104 can mount the common component α on the F substrate, but the mounting head 107 cannot mount the common component α on the R substrate.

  In other words, when the component mounter 200 is operated in the independent mode in the case of such a combination of the nozzle arrangement state and the substrate, all the necessary components can be passed through the F substrate only by passing the component mounter 200 once. Will be implemented. However, not all of the necessary components are mounted on the R board only by passing the component mounting machine 200 once.

  Therefore, it is necessary to perform the component mounting operation on the R board again by the component mounter 200 or another component mounter. In other words, selecting the independent mode in such a case is not significant from a time or economic viewpoint.

  Accordingly, when only one of the mounting head 104 and the mounting head 107 can mount the common component on the board, the determination unit 223 determines that the alternating mode is suitable for the component mounting operation (FIG. 10). Not possible at S22).

  Further, when both the mounting head 104 and the mounting head 107 can mount a common component on the board, the determination unit 223 determines that the independent mode is suitable for the component mounting work (possible in S22 in FIG. 10). .

  The selection unit 224 selects either the alternating mode or the independent mode as the production mode of the component mounting machine 200 according to the determination result of the determination unit 223.

  The mounting condition determination device 220 gives various instructions to the mechanism control unit 140 so that the component mounting machine 200 operates in the production mode determined by such selection.

  The component mounter 200 receives a production start instruction from an operator or an external device, or triggered by the mechanism control unit 140 receiving a production mode instruction from the mounting condition determination device 220. The operation in the production mode determined by the apparatus 220 is started.

  The determination as to whether or not both the mounting head 104 and the mounting head 107 can mount the common component described with reference to FIG. 15 is performed using the component supply unit 106 and the component supply described with reference to FIGS. 13 and 14. The determination may be made prior to determining whether both of the units 109 can supply common parts.

  Further, the processing shown in FIG. 10 is based on the premise that the component mounter 200 can adopt both the synchronous mode and the asynchronous mode.

  However, when it is known in advance that the component mounter 200 does not operate in the synchronous mode, that is, when it is assumed that the asynchronous mode is adopted, the component mounter 200 is operated in the alternating mode as described above. It is advantageous from the viewpoint of production efficiency.

  Therefore, when the asynchronous mode is assumed, the determination regarding the restricted area (S21) may be omitted. Further, in this case, instead of determining whether or not the independent mode is appropriate (S22), it is determined whether or not the alternating mode is appropriate, for example, whether a component to be mounted on the R board is arranged in the component supply unit 106 on the F lane side. What is necessary is just to process.

  When it is assumed that the component mounting machine 200 adopts the synchronous mode, in the process shown in FIG. 10, at least a part of each of the F board and the R board is placed in the restricted area (in S21). Yes), the alternating mode is selected (S32).

  However, even when at least a part of each of the F substrate and the R substrate is both placed in the restricted region, the alternating hit mode is controlled by controlling to avoid interference between the mounting head 104 and the mounting head 107. Although it is one embodiment, the mounting head 104 and the mounting head 107 can be operated in a modified alternating driving mode (described later) in which the basic alternating driving mode is partially modified.

  For example, when one of the mounting head 104 and the mounting head 107 enters the restricted area, the other performs control such as stopping the mounting of the component on the board and waiting at a predetermined position outside the restricted area. It is possible.

  FIG. 16 is a diagram illustrating an example of exclusive operation control for the mounting head 104 and the mounting head 107.

  For example, as shown in FIG. 16, while the mounting head 104 is mounting a component on the F substrate, the mounting head 107 is caused to perform a component suction operation. After that, the mounting head 107 causes the mounting head 104 to perform a component suction operation while mounting the component on the R substrate.

  In other words, when the mounting head 104 and the mounting head 107 alternately perform component mounting operations, the mounting head 104 mounts components only on the F substrate while the mounting head 104 mounts components only on the R substrate while maintaining the characteristics of the alternating mode. The mounting head 104 and the mounting head 107 are operated in a mode that incorporates the feature of the independent mode of mounting a component (hereinafter referred to as “deformation alternate hitting mode”). As a result, interference between the mounting head 104 and the mounting head 107 is always prevented.

  Therefore, when the synchronous mode is a prerequisite, such as when the number of production in the F lane and the number of production in the R lane are the same in the production plan, what is the relationship between the restricted area and each board? Regardless of whether or not it is such, it may be determined that the deformation alternating mode is suitable for the component mounting operation.

  The alternate beating mode that is not the deformation alternate beating mode is a mode in which two mounting heads alternately mount components on the F substrate and two mounting heads alternately mount components on the R substrate. That is. Such an operation of the two mounting heads is a basic operation of the alternating driving mode.

  Further, when at least a part of each of the F board and the R board is placed in the restricted area (S21), the components are arranged so that the mounting head 104 and the mounting head 107 do not enter the restricted area at the same time. It may be possible to optimize the mounting order in consideration of the mounting position.

  Such countermeasures such as optimization of the mounting order make it possible to mount components on both boards in the independent mode in the state shown in FIG.

  However, if it is assumed that both the synchronous mode and the asynchronous mode are adopted, another problem such as a delay in processing or occurrence of complication may occur due to the adoption of the modified independent mode, for example. Therefore, in the present embodiment, the production mode is determined in consideration of the possibility that both the mounting head 104 and the mounting head 107 enter the restricted area at the same time.

  As described above, the mounting condition determination device 220 uses the information such as the board data 130a and the component library 130b before the component mounter 200 starts the component mounting operation, and either the independent mode or the alternating mode is scheduled. It is possible to determine whether it is suitable for the component mounting work to be performed.

  In other words, the mounting condition determining device 220 acquires information such as the type and dimensions of the components and the elements such as the board used for the scheduled component mounting work, and processes the information to obtain the independent mode and the alternating mode. Select one of them.

  Therefore, the mounting condition determination device 220 can determine a production mode suitable for a scheduled component mounting operation by a quantitative determination without depending on the operator.

  In the present embodiment, the determination unit 223 determines whether the common component cassette 110 can be attached to the component supply unit 106 and the component supply unit 109. It is determined whether or not both can supply common parts.

  However, the determination unit 223 can supply the common component by both the component supply unit 106 and the component supply unit 109 depending on whether or not the common component cassette 110 is attached to both the component supply unit 106 and the component supply unit 109. It may be determined whether or not.

  In other words, the component arrangement state at the time of this determination may be confirmed, and the production mode may be determined according to the arrangement state.

  For example, when the determination unit 223 determines which of the independent mode and the alternating driving mode is suitable for the component mounting operation to be started thereafter, the acquisition unit 222 at that time, the component supply unit 106 and the component supply unit 109 For example, information indicating the type and number of component cassettes 110 attached to is acquired from the component mounter 200.

  The determination unit 223 determines whether the common component cassette 110 is attached to the component supply unit 106 and the component supply unit 109 from this information and the board data 130a.

  When it is determined from these pieces of information that the common component cassette 110 is attached to only one of the component supply unit 106 and the component supply unit 109, the determination unit 223 is suitable for the component mounting operation. Judge that

  When it is determined that the common component cassette 110 is attached to both the component supply unit 106 and the component supply unit 109, the determination process for the nozzle described above is performed next.

  The mounting condition determination apparatus 220 can determine an appropriate production mode also by such information processing.

  Further, when determining that the common component cassette 110 is attached to only one of the component supply unit 106 and the component supply unit 109, the determination unit 223 determines that the alternating mode is suitable for the component mounting operation. Instead, it may be determined whether or not the common component cassette 110 can be attached to both the component supply unit 106 and the component supply unit 109.

  For example, it is assumed that the determination unit 223 determines that the common component cassette 110 is attached only to the component supply unit 106.

  In this case, it means that the common component cassette 110 is not attached to the component supply unit 109 at the time of this determination. However, if there is a dimensional margin in which the common component cassette 110 can be attached to the component supply unit 109 and the number of stocks of the common component cassette 110 is one or more, the common component cassette 110 also exists in the component supply unit 109. Can be attached.

  In this case, the determination unit 223 refers to the supply unit data 130c and determines whether the common component cassette 110 can be attached to the component supply unit 109 in terms of dimensions and quantity.

  If the determination unit 223 determines that the common component cassette 110 can be attached to the component supply unit 109, the determination unit 223 further performs a determination process for the nozzle.

  When the determination unit 223 determines that both the mounting head 104 and the mounting head 107 can mount the common component on the board, the selection unit 224 selects the independent mode as the production mode of the component mounting machine 200.

  In this case, for example, the mounting condition determination device 220 displays that the independent mode is possible by attaching the common component cassette 110 to the component supply unit 109 on the display device included in the component mounter 200.

  Thereby, the operator of the component mounting machine 200 can produce the component mounting board by operating the component mounting machine 200 in the independent mode by attaching the common component cassette 110 to the component supply unit 109.

  Further, for example, when the determination unit 223 determines that the component supply unit 109 has no dimensional allowance for mounting the common component cassette 110, the determination unit 223 determines that the component mounting operation to be started at that time It may be confirmed whether or not an unnecessary component cassette 110 is attached to the component supply unit 109.

  In this case, the determination unit 223 determines whether or not the common component cassette 110 can be attached when the unnecessary component cassette 110 is removed from the component supply unit 109, and whether or not the common component cassette 110 can be attached, Judgment is made by comparing the mounting pitch of the common component cassette 110.

  Further, when it is determined that the common component cassette 110 can be attached by removing the unnecessary component cassette 110 from the component supply unit 109, the mounting condition determination device 220 is, for example, a display device included in the component mounter 200. A message to that effect is displayed.

  As a result, the operator of the component mounting machine 200 removes the unnecessary component cassette 110 from the component supply unit 109 and attaches the common component cassette 110 to the component supply unit 109, thereby operating the component mounting machine 200 in the independent mode. The production of component mounting boards can be performed.

  Further, in the present embodiment, the determination unit 223 determines whether or not a kind of nozzle (hereinafter referred to as “common nozzle”) capable of attracting common components to the mounting head 104 and the mounting head 107 and mounting them on the substrate is attached. Thus, both the mounting head 104 and the mounting head 107 determine whether or not a common component can be mounted on the substrate.

  However, the determination unit 223 can mount the common component on the substrate by both the mounting head 104 and the mounting head 107 depending on whether or not the common nozzle can be mounted on both the mounting head 104 and the mounting head 107. It may be determined whether or not.

  For example, as shown in FIG. 15, when the mounting nozzle 107 does not have an L nozzle, it is not determined that the alternating mode is suitable for the component mounting work. It is confirmed by communicating with the component mounter 200 whether or not the L nozzle is held in a station (not shown).

  Further, the determination unit 223 determines whether or not the mounting head 107 can mount necessary components on the R board even when the nozzle is replaced.

  For example, it is assumed that in order to attach one L nozzle to the mounting head 107, it is necessary to remove three S nozzles.

  In this example, since eight S nozzles are attached to the mounting head 107, even when three S nozzles and one L nozzle are exchanged, the mounting head 107 is a, b, α All of the above can be mounted on the R substrate.

  Therefore, when the L nozzle is held in the nozzle station, the mounting condition determination device 220 instructs the mechanism control unit 140 to set the three S nozzles at predetermined positions attached to the mounting head 107 to the L Replace with nozzle.

  Alternatively, as in the parts cassette data (see FIG. 7), the nozzle data 130d includes the types of nozzles that can be attached to the mounting head 104 and the mounting head 107, and the number of stocks (numbers that can be used) for each type. Keep it.

  Further, when the L nozzle is not attached to the mounting head 107, it is determined whether or not the L nozzle can be attached to the mounting head 107 by checking the nozzle data 130d.

  For example, if the number of L nozzles in stock is 1, a display indicating that the independent mode is possible is displayed on the display device included in the component mounter 200 by attaching the L nozzles to the mounting head 107.

  Thereby, the operator of the component mounting machine 200 can produce a component mounting board by operating the component mounting machine 200 in the independent mode by attaching the L nozzle to the mounting head 107.

  The mounting condition determination apparatus 220 can determine an appropriate production mode also by such information processing.

  Further, in the present embodiment, the mounting condition determining device 220 is provided in the component mounting machine 200, and the production mode is determined for only the component mounting machine 200.

  However, the mounting condition determining device 220 may be realized as a device independent of the component mounting machine 200. In addition, various types of data regarding components, boards, and the like used for the component mounting work performed by each of the plurality of component mounters may be acquired to determine the production mode of the plurality of component mounters.

  In this case, since various data used in common by a plurality of component mounters can be used in common, the total amount of data required for determining the production mode for the plurality of component mounters is reduced.

  In addition, as described above, depending on the structure of the component mounter, there may be no restriction area in the independent mode. Therefore, in this case, the mounting condition determining apparatus 220 does not have to determine the relationship between the restricted area and the board (S21 in FIG. 10).

  In addition, it is clear that all necessary components are arranged in both the component supply unit 106 and the component supply unit 109, and necessary nozzles are attached to both the mounting head 104 and the mounting head 107. If it is clear that it is clear, it is not necessary to determine whether or not to supply and mount common components (S22 in FIG. 10).

  INDUSTRIAL APPLICABILITY The present invention can be used as a method for determining an optimum mounting condition for a component mounting machine including two transport conveyors arranged in parallel. Specifically, the present invention can determine a production mode suitable for a scheduled component mounting operation among the independent mode and the alternating mode based on quantitative determination. Therefore, it is particularly useful as a mounting condition determination method or the like for improving the production efficiency when the production of component mounting boards is performed in parallel. The present invention is also useful as a mounting condition determining device that determines such mounting conditions.

FIG. 1 is a schematic diagram showing an outline of a component mounter in the embodiment. FIG. 2 is a schematic top view showing the lane configuration of the component mounter in the embodiment. FIG. 3 is a schematic diagram illustrating a positional relationship between the mounting head and the component supply unit in the embodiment. FIG. 4 is a functional block diagram showing a main functional configuration of the component mounter in the embodiment. FIG. 5 is a diagram illustrating an example of a data configuration of substrate data in the embodiment. FIG. 6 is a diagram illustrating an example of a data configuration of a part library according to the embodiment. FIG. 7 is a diagram illustrating an example of a data configuration of supply unit data in the embodiment. FIG. 8 is a diagram illustrating an example of a data configuration of nozzle data according to the embodiment. FIG. 9 is a flowchart showing a flow of basic processing relating to production mode selection by the mounting condition determining apparatus according to the embodiment. FIG. 10 is a flowchart showing a detailed processing flow related to the production mode selection by the mounting condition determining apparatus according to the embodiment. FIG. 11 is a diagram illustrating an example of a limited region in the alternate beating mode according to the embodiment. FIG. 12A is a diagram showing a state in which neither the F substrate nor the R substrate is placed in the restricted region in the independent mode, and FIG. 12B is the inside of the restricted region in the independent mode. FIG. 6 is a diagram illustrating a state in which a part of each of the F substrate and the R substrate is placed on the substrate. FIG. 13 is a diagram illustrating an example of component arrangement in the component mounter according to the embodiment. FIG. 14 is a diagram illustrating another example of component placement in the component mounter of the embodiment. FIG. 15 is a diagram illustrating an example of a nozzle arrangement state in each mounting head according to the embodiment. FIG. 16 is a diagram illustrating an example of exclusive operation control for two mounting heads in the embodiment. FIG. 17A is a diagram for explaining an independent mode in a conventional component mounting machine having two lanes, and FIG. 17B is an alternating mode in a conventional component mounting machine having two lanes. It is a figure for demonstrating.

101 First conveyor 101a, 102a Fixed rail 101b, 102b Movable rail 102 Second conveyor 104, 107 Mounting head 105, 108 Beam 106, 109 Component supply unit 110 Component cassette 130 Mounting information storage unit 130a Substrate data 130b Component library 130c Supply unit Data 130d Nozzle data 140 Mechanism control unit 150 Mechanism unit 200 Component mounting machine 220 Mounting condition determination device 221 Communication unit 222 Acquisition unit 223 Determination unit 224 Selection unit

Claims (10)

The two conveying conveyors, comprising two mounting heads, two component supplying units that supply components to the two mounting heads, and two conveying conveyors arranged in parallel between the two component supplying units A mounting condition determination method for determining a mounting condition of a component mounter capable of performing component mounting work on a board conveyed to each in parallel,
An acquisition step of acquiring mounting information including data related to a board or a component used in a component mounting operation scheduled to be performed by the component mounter;
The alternate mounting mode in which the two mounting heads alternately mount components on both substrates transported by the two transport conveyors, and each of the two mounting heads of the two transport conveyors. The component mounting operation in which the production mode of the independent mode in which the components are mounted only on the substrate conveyed by the conveyance conveyor closer to the component supply unit that is the component supply source to each mounting head is the scheduled component mounting operation. Determining step using the mounting information acquired in the acquisition step,
A selection step of selecting, as the production mode of the component mounter, one of the alternating mode and the independent mode that is determined to be suitable for the scheduled component mounting operation in the determination step. Condition determination method. In the obtaining step, mounting information including board information, which is information relating to the board conveyed to each of the two conveyance conveyors, is obtained.
In the determination step, if the substrate information is used in the independent region and one of the two mounting heads exists in the restricted region in the independent mode, the other permits entry. the non the limited area that is, at least a portion of each substrate both carried by two carrier conveyors, or portions, each of the mounting positions the substrate of the both are present, are mounted to the component mounting And determining whether or not at least a part of each of both the boards or a part where a mounting position exists is placed in the restricted area, the alternating mode is suitable for the scheduled component mounting operation. The mounting condition determination method according to claim 1, wherein the mounting condition is determined. Each of the two component supply units can be attached with one or more component storage means in which a plurality of types of components are stored,
In the acquisition step, board information indicating the type of component to be mounted on the board to be transported to each of the two transport conveyors, and supply unit information indicating the attribute of the component storage means corresponding to each of the two component supply sections Get implementation information including
In the determination step, the board information and the supply unit information are used to share components of a type that should be mounted in common on the board transported to one transport conveyor and the board transported to the other transport conveyor. When it is determined whether or not both of the two component supply units can supply a component, and only one of the two component supply units can supply the common component, the alternating mode is set to the predetermined mode. The mounting condition determining method according to claim 1, wherein the mounting condition is determined to be suitable for a component mounting operation to be performed. The supply unit information is information indicating the type of component storage means that is a component storage unit corresponding to each of the two component supply units, is attached to or can be attached to each of the two component supply units. Including as the attribute,
In the determining step, from the board information and the supply unit information, the component storage means storing the common component is attached to only one of the two component supply units, or the two components The mounting condition determining method according to claim 3, wherein when it is determined that it can be attached to only one of the supply units, only one of the two component supply units determines that the common component can be supplied. . The supply unit information further includes, as the attribute, information indicating the number of component storage units that can be attached to each of the two component supply units, which can be used for the scheduled component mounting operation,
In the determination step, when the supply unit information indicates that the number of usable component storage means storing the common components is 1, the supply unit information can be attached to only one of the two component supply units. The mounting condition determining method according to claim 4, wherein the mounting condition is determined to be present. Each of the two mounting heads can be attached with one or more nozzles for mounting the adsorbed component on the substrate,
In the obtaining step, the component information indicating the type of component to be mounted on the substrate conveyed to each of the two conveyors, the type of nozzle capable of mounting the component on the substrate, and the two mounting heads Acquire mounting information including nozzle information indicating the type of nozzle corresponding to each,
In the determination step, a common component that is a type of component that should be mounted in common on the substrate conveyed to one conveyance conveyor and the substrate conveyed to the other conveyance conveyor, using the component information and the nozzle information. Determining whether both of the two mounting heads can be mounted on the board, and when only one of the two mounting heads can mount the common component on the board, The mounting condition determining method according to claim 1, wherein the mounting condition is determined to be suitable for a scheduled component mounting operation. The two conveying conveyors, comprising two mounting heads, two component supplying units that supply components to the two mounting heads, and two conveying conveyors arranged in parallel between the two component supplying units A mounting condition determination device for determining mounting conditions of a component mounter that can perform component mounting work on a board to be transported in parallel,
An acquisition means for acquiring mounting information including data related to a board or a component used in a component mounting operation scheduled to be performed by the component mounter;
The alternate mounting mode in which the two mounting heads alternately mount components on both substrates transported by the two transport conveyors, and each of the two mounting heads of the two transport conveyors. The component mounting operation in which the production mode of the independent mode in which the components are mounted only on the substrate conveyed by the conveyance conveyor closer to the component supply unit that is the component supply source to each mounting head is the scheduled component mounting operation. Determining means for determining whether it is suitable using the mounting information acquired by the acquiring means;
A mounting unit comprising: a selection unit that selects, as the production mode of the component mounter, one of the alternating mode and the independent mode that is determined to be suitable for the scheduled component mounting operation by the determination unit. Condition determining device. The two conveying conveyors, comprising two mounting heads, two component supplying units that supply components to the two mounting heads, and two conveying conveyors arranged in parallel between the two component supplying units A component mounter that can perform component mounting operations on the boards to be transported in parallel,
The mounting condition determining device according to claim 7,
Control means for controlling the operation of the two mounting heads to control the component mounting machine to operate in the production mode selected by the mounting condition determining device in the alternate mode and the independent mode. Machine. The two conveying conveyors, comprising two mounting heads, two component supplying units that supply components to the two mounting heads, and two conveying conveyors arranged in parallel between the two component supplying units A method for mounting components on a board with a component mounting machine capable of performing in parallel the component mounting work on the boards transported to each,
The component is mounted on the board on each of the two mounting heads according to the production mode selected by the mounting condition determining method according to any one of claims 1 to 6 among the independent mode and the alternating mode. A component mounting method including a mounting step. The two conveying conveyors, comprising two mounting heads, two component supplying units that supply components to the two mounting heads, and two conveying conveyors arranged in parallel between the two component supplying units A program for determining mounting conditions of a component mounter capable of performing component mounting operations on the boards to be conveyed in parallel,
An acquisition step of acquiring mounting information including data related to a board or a component used in a component mounting operation scheduled to be performed by the component mounter;
The alternate mounting mode in which the two mounting heads alternately mount components on both substrates transported by the two transport conveyors, and each of the two mounting heads of the two transport conveyors. The component mounting operation in which the production mode of the independent mode in which the components are mounted only on the substrate conveyed by the conveyance conveyor closer to the component supply unit that is the component supply source to each mounting head is the scheduled component mounting operation. Determining step using the mounting information acquired in the acquisition step,
A selection step of selecting, as the production mode of the component mounter, the one determined to be suitable for the scheduled component mounting operation in the determination step, of the alternating mode and the independent mode; A program to be executed.

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