JP4887328B2 - Mounting condition determination method - Google Patents

Description

  The present invention relates to a method for determining a mounting condition for mounting a component on a board, and more particularly to a mounting condition determining method for a production line having a component mounting machine that includes a plurality of transport lanes in parallel for transporting a board.

  In a component mounter that mounts electronic components on a substrate such as a printed wiring board, it is desired to produce a component mounting substrate on which a plurality of components are mounted with a shorter tact. Here, the “tact” is a mounting time which is determined for each component mounting machine and required to mount a plurality of predetermined components on one board.

For example, a component mounter in which a component to be mounted on a board is selected from a plurality of component mounters in which different sets of components are arranged in advance in the component supply unit, and the selected component mounter is selected. There has been proposed a method for producing a plurality of types of component mounting boards with a shorter tact by conveying the board to (see, for example, Patent Document 1). Thereby, the throughput of the production line (the number of produced component mounting boards per unit time) can be improved.
Japanese Patent No. 3391039

  However, when the type of the component mounting board to be produced is changed, the changeover of the parts arranged in the component supply unit of the component mounting machine is performed so that the parts corresponding to the changed board type can be mounted on the board. It is necessary to do. For this reason, the production of the board by the component mounter that is the target of the setup change must be stopped while the setup of the parts is being changed.

  In addition, there is a method of selecting a component mounter as a substrate transfer destination from among a plurality of component mounters, as described in Patent Document 1, so that it is not necessary to replace components. However, in this case, the component mounters that are not selected are in a non-operating state during that time. For this reason, there exists a problem that the operation rate of the whole component mounting machine becomes low. Furthermore, there is a problem that there is a wasteful production space including a component mounting machine in a non-operating state, and area productivity (unit time and the number of boards produced per unit area) is reduced.

  The present invention has been made in order to solve the above-described problems, and within the limited mounting space of the component mounting machine, all of the components mounting machine can be stopped without stopping as much as possible even during setup change. It is an object of the present invention to provide a mounting condition determining method for determining a mounting condition of a component that secures the maximum operating rate of the component mounting machine and that is excellent in area productivity.

  In order to achieve the above object, a mounting condition determination method according to an aspect of the present invention is a production line in which a plurality of component mounters each having a plurality of transfer lanes and mounting components on a board are connected. A mounting condition determination method for determining a mounting condition of a component, wherein each component mounting machine is set to a dedicated machine that is a component mounting machine that mounts components only on a board of one board type. By mounting the number of component types mounted on various types of substrates with the number of component types that can be arranged in the component supply unit provided in each component mounting machine, the components are mounted on the plurality of substrate types. A plurality of component mountings when it is determined that placement is impossible in the placement availability determination step, and the placement availability determination step determines whether or not placement is possible in a component supply unit provided in each component mounting machine Less of the machine A single component mounting machine that places components mounted on a board of a plurality of board types from the dedicated machine to the component supply unit, and mounts components on the boards of the plurality of board types. A shared machine setting step for resetting to the machine, and after the component mounter is reset to the shared machine in the shared machine setting step, components mounted on the boards of the plurality of board types are respectively mounted on the component mounters. And a component type number determining step for determining the number of component types for each board type arranged in each component supply unit.

  After setting the component mounting machine on the production line as a dedicated machine to the maximum, if the parts cannot be arranged in the component supply unit, the dedicated machine is set as a shared machine. For this reason, it is possible to arrange as many dedicated machines with excellent setup change performance as possible on the production line. In a dedicated machine, a component is mounted only on one type of board, and when a board of the board type targeted for component mounting is transferred to the transfer lane assigned to the board type, the component is mounted on the board. Can be performed. In addition, when each board is transported to other transport lanes, each dedicated machine determines that a board type other than the board type targeted for component mounting has been transported, and can carry the board downstream. it can.

  In the production line, when there is a change in the board type to be produced, it is placed in a component cassette or nozzle station arranged in a component supply unit of a component mounter that mounts a component on the board type. It is necessary to change the arrangement of the replacement nozzle, the support pins on the support pin plate, and the like. However, it is not necessary to stop the component mounter even while the operator is performing such a change operation. That is, during this time, a board other than the board type that is the component mounting target is carried into the component mounter, but the dedicated machine can continue the work of carrying out such a board downstream. Therefore, a high operating rate can be ensured without stopping all the component mounting machines even during the setup change.

  Further, since each component mounting machine includes a plurality of transfer lanes, it is possible to produce a plurality of board types on one production line. Therefore, area productivity is also improved.

  Preferably, the mounting condition determination method further includes a tact time required for mounting a predetermined component on one board for each board type in a state where all the component mounting machines are dedicated machines. And a tact determination step for determining whether the predicted tact is less than or equal to a predetermined target tact for each board type, and in the shared device setting step, the prediction is further performed. When there is a board type whose tact exceeds the target tact, at least one of the plurality of component mounting machines is reset from the dedicated machine to the shared machine, and the mounting condition determining method further includes: In the shared machine setting step, after the component mounter is reset to the shared machine, the component mounters in each component mounter are equalized so that the component mounting points are equal among the component mounters. Characterized in that it comprises a component mounting point determination step of determining.

  After setting the component mounting machines on the production line to the dedicated machine to the maximum, if the predicted tact exceeds the target tact, the dedicated machine is reset to the shared machine. For this reason, it is possible to arrange as many dedicated machines with excellent setup change performance as possible on the production line.

  More preferably, the shared machine includes a plurality of component supply units, and in the component type determination step, the shared device is further mounted on a board of one board type in one component supply unit of the shared machine. The number of component types for each board type arranged in each component supply unit is determined so that only the components are arranged.

  In the shared machine, the number of component types is determined so that components of the same board type are collectively arranged in one component supply unit. As a result, the operator only needs to replace the components associated with the change of the board type with respect to one component supply unit. For this reason, the effort of parts replacement can be reduced.

  The present invention can be realized not only as a mounting condition determination method including such characteristic steps, but also as a mounting condition determination device using the characteristic steps included in the mounting condition determination method as means. Alternatively, it can be realized as a program that causes a computer to execute the characteristic steps included in the mounting condition determination method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  A mounting condition determination method according to another aspect of the present invention determines a component mounting condition in a production line each having a plurality of transport lanes and connected to a plurality of component mounters for mounting components on a board. A method for determining mounting conditions, in which all the component mounting machines are dedicated machines, and for each board type, a tact that is a time required for mounting a predetermined component on one board is predicted. A prediction step, a tact determination step for determining whether or not the predicted tact is equal to or less than a predetermined target tact for each substrate type, and when there is a substrate type for which the predicted tact exceeds the target tact. A shared machine setting step in which at least one of the plurality of component mounters is set as the shared machine from the dedicated machine, and the component mounter is installed in the shared machine in the shared machine setting step. After being re-implementation number of parts between component mounting machines as equals, characterized in that it comprises a component mounting point determining step of determining a component mounting points in each component mounting machine.

  After setting the component mounting machines on the production line to the dedicated machine to the maximum, if the predicted tact exceeds the target tact, the dedicated machine is reset to the shared machine. For this reason, it is possible to arrange as many dedicated machines with excellent setup change performance as possible on the production line.

  According to the present invention, within the limited placement space of the component mounter, even when the setup is being changed, the component mounter is stopped as much as possible, and the operation rate of all the component mounters is ensured to the maximum, In addition, it is possible to provide a mounting condition determination method for determining a mounting condition for a component having excellent area productivity.

  Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a component mounting system 10 that realizes a mounting condition determination method according to the present invention.

  The component mounting system 10 is a production line that mounts components on a board to produce a circuit board, and includes a mounting condition determining device 100 and a plurality of component mounting machines 200 (three component mounting machines in the example shown in FIG. 1). And.

  The mounting condition determining apparatus 100 is an apparatus that executes the mounting condition determining method according to the present invention. The mounting condition determining apparatus 100 determines mounting conditions so as to ensure a high operation rate of the component mounting machine in the entire production line and to realize excellent area productivity.

  The component mounter 200 is a device that mounts a component such as an electronic component on a substrate as a part of the component mounting system 10 in accordance with the mounting condition determined by the mounting condition determining device 100.

  Specifically, the plurality of component mounting machines 200 mount components while sending a board from upstream to downstream. That is, first, the upstream component mounter 200 receives a board and mounts the component on the board. Then, the board on which the component is mounted is sent to the component mounter 200 on the downstream side. In this way, the boards are sequentially sent to the component mounting machines 200, and the components are mounted.

  FIG. 2 is a plan view showing the main configuration inside the component mounter 200. Here, the substrate transport direction is the X-axis direction, and the front-rear direction of the component mounter orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction.

  The component mounting machine 200 includes a transport lane 215 and a transport lane 216 for transporting the two boards 21 and 22, respectively, and two mounting units 210a and 210b for mounting components on the two boards. Substrates of different substrate types can be transported on the transport lane 215 and the transport lane 216. Even if the same substrate is used, the front and back surfaces are considered to be different substrate types because the component type, the component mounting position, and the like of the components to be mounted are different.

  The transport lane 215 is disposed on the mounting unit 210a side, and the transport lane 216 is disposed on the mounting unit 210b side so as to be parallel to the X-axis direction.

  The transport lane 215 includes a fixed rail 215a and a movable rail 215b that are parallel to the X-axis direction. The position of the fixed rail 215a is fixed in advance, and the movable rail 215b is movable in the Y-axis direction according to the length of the substrate 21 to be transported in the Y-axis direction.

  Similarly to the transfer lane 215, the transfer lane 216 includes a fixed rail 216a and a movable rail 216b. The position of the fixed rail 216a is fixed in advance, and the movable rail 216b is movable in the Y-axis direction according to the length of the substrate 22 to be transported in the Y-axis direction.

  Further, the substrate 21 and the substrate 22 are independently transferred to the transfer lane 215 and the transfer lane 216, respectively.

  The two mounting units 210 a and 210 b cooperate with each other to perform mounting operations on the substrate 21 and the substrate 22.

  The mounting unit 210a and the mounting unit 210b have the same configuration. That is, the mounting unit 210a includes a component supply unit 211a, a mounting head 213a, a nozzle station 218a, and a component recognition camera (not shown). Similarly, the mounting unit 210b includes a component supply unit 211b, a mounting head 213b, a nozzle station 218b, and a component recognition camera (not shown).

  Here, a detailed configuration of the mounting unit 210a will be described. The detailed configuration of the mounting unit 210b is the same as that of the mounting unit 210a, and the detailed description thereof will not be repeated.

  The component supply unit 211a includes an array of a plurality of component cassettes 212a that store component tapes. The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like. The parts arranged on the part tape are, for example, chips and the like, specifically, 0402 chip parts (chip parts having a size of 0.4 mm × 0.2 mm) and 1005 chip parts (1.0 mm × 0.5 mm). Size chip components). In the following description, it is assumed that a maximum of 30 types of components can be arranged in the component supply unit 211a. However, the number of parts that can be arranged is not limited to this.

  The mounting head 213a can include, for example, a maximum of 10 suction nozzles, and can mount a maximum of 10 components from the component supply unit 211a and mount them on the substrate 21 and the substrate 22.

  The nozzle station 218a is a table on which replacement suction nozzles for accommodating various types of component types are placed.

  The component recognition camera is used for photographing the component sucked by the mounting head 213a and inspecting the suction state of the component two-dimensionally or three-dimensionally.

  When components are mounted on the board, support pins that support the board from the back side are used, and the support pin plates for raising the support pins are located directly below the transfer lanes 215 and 216 (directly below the boards 22 and 21 shown in FIG. 2). ).

  The board production method of the component mounter 200 for mounting on a plurality of board types is roughly divided into two methods, a method called “synchronous mode” and a method called “asynchronous mode”. .

  The “synchronous mode” is a mode in which mounting of components is started after a board is carried into two transport lanes. That is, when the board is loaded only in one lane, the component mounting is not started. In the synchronous mode, the two mounting heads alternately mount components on the two boards. Note that the mounting order of the components by the two mounting heads is determined with respect to the one board, regarding the two boards as one large board. In the case of a component mounter having three or more transfer lanes, a mode in which component mounting is started after a board is loaded into two or more transfer lanes may be set as a synchronous mode.

  The “asynchronous mode” is a mode in which component mounting is started after a board is carried into any one of the plurality of conveyance lanes. In the asynchronous mode, two mounting heads alternately mount components on one board. That is, for example, when the board 21 is first carried into the transport lane 215, the two mounting heads perform a cooperative operation to mount components on the board 21 in the transport lane 215. Next, when the board 22 is carried into the transfer lane 216, the two mounting heads perform a cooperative operation to mount components on the board 22 in the transfer lane 216.

  The board production method by the component mounter 200 described in the present embodiment may be in any mode.

FIG. 3 is a schematic diagram showing the positional relationship between the mounting head 213a and the component cassette 212a.
As described above, for example, a maximum of ten suction nozzles nz can be attached to the mounting head 213a. The mounting head 213a to which the ten suction nozzles nz are attached can suck components from each of a maximum of ten component cassettes 212a at the same time (by one up and down movement).

FIG. 4 is a diagram illustrating an example of a component tape and a reel that contain components.
Components such as chip-type electronic components are accommodated in a storage recess 221a formed in a plurality at a constant interval on the carrier tape 221 shown in FIG. 4, and the cover tape 222 is attached to the upper surface for packaging. . The carrier tape 221 with the cover tape 222 attached in this way is supplied to the user in a taping form wound around the reel 223 by a predetermined quantity. The carrier tape 221 and the cover tape 222 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  The mounting unit 210a of such a component mounting machine 200 moves the mounting head 213a to the component supply unit 211a and causes the mounting head 213a to attract the component supplied from the component supply unit 211a. The mounting unit 210a moves the mounting head 213a onto the component recognition camera at a constant speed, causes the component recognition camera to capture images of all the components sucked by the mounting head 213a, and accurately detects the suction position of the component. Let Further, the mounting unit 210a moves the mounting head 213a to, for example, the substrate 21 and sequentially mounts all the sucked components on the mounting points of the substrate 21. The mounting unit 210a mounts all the predetermined components on the board 21 by repeatedly performing such operations of suction, movement, and mounting by the mounting head 213a. Similarly, the mounting unit 210 a mounts all predetermined components on the board 22.

  Similarly to the mounting unit 210a, the mounting unit 210b also repeatedly performs the operations of suction, movement, and mounting by the mounting head 213b to mount all the predetermined components on the substrate 21 and the substrate 22.

  Then, each of the mounting unit 210a and the mounting unit 210b sucks a component from the component supply unit when the other mounting unit is mounting a component, and conversely, the other mounting unit sucks a component from the component supply unit. When mounting the components, the components are alternately mounted on the substrate 21 and the substrate 22 so as to mount the components. In other words, the component mounter 200 is configured as a so-called alternating component mounter.

  In the present invention, for each component mounting machine 200, a target board on which a component is to be mounted is determined in advance as a mounting condition among the boards 21 and 22. In accordance with this mounting condition, the two mounting units 210a and 210b mount a component only on a board that is a component mounting target. For this reason, the board | substrate which is not made into the mounting object of components among the board | substrate 21 and the board | substrate 22 is not mounted, but the board | substrate is conveyed to the following component mounting machine.

  FIG. 5 is a block diagram showing a functional configuration of the mounting condition determining apparatus 100 in the present embodiment.

  This mounting condition determining apparatus 100 is a computer that performs processing such as determining mounting conditions so as to ensure a high operating rate of component mounting machines in the entire production line and to realize excellent area productivity. is there. The mounting condition determining apparatus 100 includes an arithmetic control unit 101, a display unit 102, an input unit 103, a memory unit 104, a program storage unit 105, a communication I / F (interface) unit 106, and a database unit 107.

  The mounting condition determining apparatus 100 is realized by a general-purpose computer system such as a personal computer executing the program according to the present invention, and is not connected to the component mounting machine 200, but is a stand-alone simulator (for mounting conditions). It also functions as a decision tool. It should be noted that the function of the mounting condition determining apparatus 100 may be provided in the component mounter 200.

  The arithmetic control unit 101 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the program storage unit 105 to the memory unit 104 in accordance with an instruction from an operator or the like. A processing unit that controls each of the components 102 to 107.

  The display unit 102 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 103 is a keyboard, a mouse, or the like. These are mounted condition determination devices under the control of the arithmetic control unit 101. 100 is used for dialogue between an operator and the like.

  The communication I / F unit 106 is a LAN (Local Area Network) adapter or the like, and is used for communication between the mounting condition determining apparatus 100 and the component mounting machine 200. The memory unit 104 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 101.

  The program storage unit 105 is a hard disk or the like that stores various programs that implement the functions of the mounting condition determination apparatus 100. The program is a program for determining a mounting condition by the component mounter 200, and functionally (as a processing unit that functions when executed by the arithmetic control unit 101), a board type assignment unit 105a, an arrangement availability determination unit 105b, A tact prediction unit 105c, a tact determination unit 105d, a shared machine setting unit 105e, a component type number determination unit 105f, a component mounting point determination unit 105g, and a mounting order optimization unit 105h are included.

  The board type assigning unit 105a is a processing unit that assigns a board type to be transported to the transport lane for each transport lane transporting the same board based on target tact data 107c described later.

  The arrangement availability determination unit 105b sets all of the plurality of component mounting machines 200 constituting the production line as a dedicated machine that is a component mounting machine 200 that mounts components only on a board of one board type. This is a processing unit that determines whether or not components mounted on a board of a board type can be placed in the component supply units 211a and 211b provided in each component mounter 200. In the following description, the component mounter 200 that mounts a component only on a board of one board type is called a “dedicated machine”, and the component mounter 200 that mounts a component on a board of a plurality of board types is “ It will be called a “shared machine”.

  The tact predicting unit 105c is a processing unit that predicts a tact that is a time required to mount a predetermined component on one board for each board type in a state where all the component mounting machines are dedicated machines. is there.

  The tact determination unit 105d acquires a target tact that is a target value of the line tact from target tact data 107c described later, and determines whether or not the tact predicted by the tact prediction unit 105c is equal to or less than the acquired target tact. It is a processing part to judge. Here, the “line tact” is the maximum tact among the tacts of each component mounter included in the production line. Further, it is assumed that “tact” is determined for each conveyance lane of the component mounter 200. That is, the line tact indicates the time required to produce one component mounting board on the production line.

  The shared machine setting unit 105e determines that the arrangement possibility determination unit 105b determines that the component cannot be arranged in the component supply units 211a and 211b, or the tact prediction unit 105d exceeds the target tact. If it is determined, the processing unit resets at least one of the plurality of component mounting machines 200 from the dedicated machine to the shared machine.

  The component type number determining unit 105f is provided with components mounted on a plurality of board types on each component mounter 200 after the component mounter 200 is reset to the shared machine in the shared machine setting unit 105e. The processing unit determines the number of component types for each board type arranged in each of the component supply units 211a and 211b so that the component supply units 211a and 211b can be arranged.

  The component mounting point determination unit 105g sets each component mounting machine 200 so that the number of component mounting points becomes equal between the component mounting machines 200 after the sharing machine setting unit 105e sets the component mounting machine 200 as a shared machine again. It is a process part which determines the component mounting point in.

  The mounting order optimizing unit 105h is a processing unit that optimizes the component mounting order in each component mounting machine 200 so that the component mounting time on the board satisfies the target tact.

  The database unit 107 is a hard disk or the like that stores mounting point data 107a, component library 107b, target tact data 107c, and the like, which are data used for mounting condition determination processing by the mounting condition determination apparatus 100.

FIG. 6 is a diagram illustrating an example of the mounting point data 107a.
The mounting point data 107a is a collection of information indicating mounting points of all components to be mounted. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 107b shown in FIG. 7, the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board), and the control data is Restriction information (mounting nozzle type nz that can be used, maximum moving acceleration of the mounting head, etc.) regarding the mounting of the component is shown. The mounting angle θi indicates an angle at which the nozzle that sucks the component of the component type ci should rotate. NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

FIG. 7 is a diagram illustrating an example of the component library 107b.
The component library 107b is a library in which unique information about all component types that can be handled by the component mounter 200 is collected. As shown in FIG. 7, the component library 107b includes a component size for each component type (component name), tact (tact specific to the component type under a certain condition), and other constraint information (for usable suction nozzles nz). Type, recognition method by component recognition camera, speed level of mounting head, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library 107b may include information such as the color and shape of the component.

FIG. 8 is a diagram illustrating an example of the target tact data 107c.
The target tact data 107c is a collection of information indicating the target tact for each transport lane that transports the same substrate. The target tact data 107c includes “transport lane”, “substrate type”, “target tact”, and the like.

  The “transport lane” is a transport lane that is a target for obtaining a target tact. Specifically, the name specifies the transport lane 215 or the transport lane 216. For example, the transportation lane 215 is the F lane, and the transportation lane 216 is the R lane.

  “Substrate type” is the type of the substrate that is transported on the target transport lane. For example, the type of the substrate transported on the F lane which is the transport lane 215 is the substrate type A.

  “Target tact” is a target value of the line tact. For example, the “target tact” of the substrate type A is 100 s (sec). This is a target for producing a substrate of substrate type A at 100 s per sheet.

  FIG. 9 is a flowchart showing an example of the operation of the mounting condition determining apparatus 100 in the present embodiment. In the following description, the mounting conditions of components on the substrates of the substrate types C and D when the substrate types A and B are switched to the substrate types C and D, respectively, after the production of the substrate types A and B in the production line are completed. The method of determination will be described with specific examples. Note that the mounting condition determination method described below can be applied not only at the time of switching board types, but also at the start of production of a board of the first board type on the production line. Also, the present invention can be applied when only one type of substrate can be switched.

  The board type assigning unit 105a determines a transfer lane to which the board type after switching is assigned from the target tact data 107c (S2). For example, from the target tact data 107c shown in FIG. 8, it is determined that the board type C after switching is assigned to the F lane and the board type D is assigned to the R lane.

  Next, when it is assumed that all the component mounting machines 200 constituting the production line are dedicated machines, the arrangement availability determination unit 105b assigns the components mounted on the board of the board type after switching to the component mounting machine 200. It is determined whether or not it can be placed in the component supply units 211a and 211b (S4). FIG. 10 is a diagram for explaining processing for determining whether components can be placed on the component supply units 211a and 211b by the placement determination unit 105b. As shown in FIG. 10A, before board type switching, components are mounted on boards of board types A and B by three component mounters 200 (component mounters MC1, MC2, and MC3 in order from the upstream). Is done. The substrate type A substrate is transported on the F lane, and the substrate type B substrate is transported on the R lane. The component mounters MC1 and MC2 are dedicated machines for mounting components on a board type A board, and the mounting heads 213a and 213b included therein mount components only on the board type A. The component mounter MC3 is a dedicated machine that mounts components on a board of the board type B, and the mounting heads 213a and 213b included in the component mounter MC3 mount components only on the board type B. In addition, 30 types of components can be arranged in the component supply units 211a and 211b of each component mounter 200, respectively. 120 types of components are mounted on the substrate of the substrate type A, and 60 types of components are mounted on the substrate of the substrate type B. Therefore, 60 types of components for board type A are arranged in the component supply units 211a and 211b of the component mounters MC1 and MC2, respectively, and the component supply units 211a and 211b of the component mounter MC3 include 60 types of parts for seed B are arranged. It is assumed that there are 90 types of components mounted on the board types C and D. FIG. 10B is a diagram illustrating the relationship between the number of component types of the substrate types A and B and the number of component types of the substrate types C and D. Only 60 types of components can be arranged in the component supply unit of each component mounter 200. For this reason, in order to mount a component on the board of the board type C by a dedicated machine, two dedicated machines are required. Similarly, in order to mount components on a board of the board type D by a dedicated machine, two dedicated machines are required. That is, four dedicated machines are required to mount components on the board types C and D by the dedicated machine. However, the number of component mounting machines is three. For this reason, if the three component mounting machines 200 are used as dedicated machines, the components of the board types C and D cannot be arranged in the component supply unit.

  Arrangement determination unit 105b determines that components mounted on the board of the board type after switching cannot be arranged in the component supply unit of component mounter 200 while all component mounters 200 are dedicated devices. If it is found (NO in S4), the shared machine setting unit 105e resets one of the dedicated machines as the shared machine (S6). For example, it is assumed that the component mounting machine MC2 is reset from the dedicated machine to the shared machine. Note that the number of component mounting machines 200 to be reset as a shared machine is not limited to one, and may be two or more. Further, two or more dedicated machines may be changed to one shared machine, or one dedicated machine may be changed to two or more shared machines.

  In the production line including the shared machine, the component type number determination unit 105f allows each component supply unit to place the component mounted on the board type after switching in the component supply unit provided in each component mounter 200. The number of component types of components for each board type to be arranged is determined (S8). The number of component types of components mounted on each substrate type can be counted from the mounting point data 107a.

  FIG. 11 is a diagram for explaining the component type determination process (S8). As shown in FIG. 11, the component mounters MC1 and MC3 are dedicated machines, and the component mounter MC2 is a shared machine. The component type number determination unit 105f first determines the number of component types arranged in the component supply unit of the dedicated machine. When attention is paid to the substrate type C, the number of component types of the substrate type C is 90 types. On the other hand, there are 60 types of components that can be arranged in one dedicated machine. For this reason, one (= 90/60) dedicated machine can use all 60 types of components that can be arranged in the component supply unit as components of the board type C. Therefore, as shown in FIG. 11, 60 types of components of the board type C are arranged in the component supply unit of the component mounter MC1. Similarly, 60 types of board type D components are arranged in the component supply unit of the component mounting machine MC3. 30 types of components of the board type C that are not arranged in the component supply unit of the component mounting machine MC1 and 30 types of components of the board type D that are not arranged in the component supply unit of the component mounting machine MC3 are shared machines. It is arranged in a component supply unit of a certain component mounting machine MC2. As shown in FIG. 11, a component of the substrate type C and a component of the substrate type D are arranged in each of the component supply units 211a and 211b. With such an arrangement, the components of the board type C are arranged in both the component supply units 211a and 211b. Therefore, the components are alternately mounted on the board of the board type C by the mounting head 213a and the mounting head 213b. Can be implemented. Similarly, since the components of the board type D are also arranged in both the component supply units 211a and 211b, the components can be alternately mounted on the board of the board type D by the mounting head 213a and the mounting head 213b. . That is, since both the boards of the board types C and D can be mounted with the mounting heads 213a and 213b alternately, the mounting tact can be reduced.

  Next, the component mounting point determination unit 105g distributes the mounting points of the mounting points of the board type after switching so that the mounting points are equal among the component mounting machines (S10). For example, it is assumed that the number of component mounting points for board type C is 300 and the number of component mounting points for board type D is 200. In this case, the number of mounting points of each component mounting machine is obtained as 167 (= (300 + 200) / 3) points. FIG. 12 is a diagram showing a breakdown of the number of mounting points of components mounted by each of the component mounting machines MC1 to MC3. That is, the component mounter MC1 is a dedicated machine for the board type C, and the component mounter MC3 is a dedicated machine for the board type D. For this reason, the number of mounting points of the board type C on the component mounting machine MC1 is 167 points, and the mounting number of the board type D is 0 points. Further, the number of mounting points of the board type D on the component mounting machine MC3 is 167 points, and the mounting number of the board type C is 0 points. Since the component mounter MC2 is a shared machine, the remaining components are mounted. For this reason, the number of mounting points of the board type C is 133 points, and the mounting number of the board type D is 33 points.

  The mounting order optimization unit 105h optimizes the component mounting conditions so that the component mounting time on the board satisfies the target tact under a predetermined constraint condition (S12). Here, the predetermined constraint conditions include the number of dedicated machines and shared machines, the number of types of components arranged in the component supply unit of each component mounter 200, and the number of components mounted on each component mounter 200. It is. Various optimization methods have been proposed so far and are not the main subject of the present application. Therefore, detailed description thereof will not be repeated here.

  Arrangement determination unit 105b determines that components mounted on the board of the board type after switching can be arranged in the component supply unit of component mounting machine 200 while all component mounting machines 200 are dedicated machines. In this case (YES in S4), the tact prediction unit 105c calculates the number of mounting points of each component mounter 200 when all the component mounters 200 are dedicated devices (S14). For example, it is assumed that the number of component mounting points for board type C is 300 and the number of component mounting points for board type D is 200. In addition, it is assumed that the component mounters MC1 and MC2 are set as a dedicated board type C machine, and the component mounter MC3 is set as a dedicated board type D machine. At this time, the mounting points of the component mounting machines MC1 and MC2 are calculated as 150 points (= 300 points / 2 units), respectively, and the mounting point of the component mounting machine MC3 is calculated as 200 points (= 200 points / 1 unit). Is done.

  The tact prediction unit 105c predicts the tact for each board type based on the calculated number of mounting points (S16). For example, it is assumed that the number of mounting points and the tact are proportional, and the mounting speed of components is 1 cps (chip per second). That is, it takes 1 second to mount a component on one mounting point.

  FIG. 13 is a diagram illustrating the relationship between the component mounter and the number of mounting points. FIG. 14 is a diagram illustrating the relationship between the substrate type and the tact, where the vertical axis indicates the substrate type and the horizontal axis indicates the tact. As shown in FIG. 13A, the number of mounting points of the board type C is 150 in the component mounting machines MC1 and MC2. For this reason, as shown in FIG. 14A, the tact time of the substrate type C is calculated as 150 seconds. On the other hand, as shown in FIG. 13A, the mounting number of the board type D is 200 points in the component mounting machine MC3. For this reason, as shown in FIG. 14A, the tact time of the substrate type D is calculated as 200 seconds.

  The tact determining unit 105d determines whether or not the predicted tact is equal to or less than the target tact indicated in the target tact data 107c (S18). The tact 150 seconds for the substrate type C is equal to or less than the target tact 180 seconds, whereas the tact 200 seconds for the substrate type D exceeds the target tact 180 seconds.

  If the predicted tact is not less than or equal to the target tact (NO in S18), one of the three component mounters MC1 to MC3 is set as the shared device again (S20). Here, the dedicated machine for the board type with the smallest predicted tact is set as the shared machine. In the above example, since the board type with the smallest predicted tact is C, the component mounter MC1 or MC2 is reset to the shared machine. After setting the shared machine again, the processes of S10 and S12 are executed. By executing the processing of S10, for example, as shown in FIG. 13B, in the component mounter MC1, 167 components are mounted on the board of the board type C. Further, in the component mounter MC2, 133 points of components are mounted on the substrate type C substrate, and 33 points of components are mounted on the substrate type D substrate. Further, in the component mounter MC3, 167 components are mounted on the board of the board type D. For this reason, as shown in FIG. 14B, the tacts of the substrate types C and D are each 167 seconds, and the target tact is 180 seconds or less.

  If the predicted tact is less than or equal to the target tact (YES in S18), it is not necessary to reset the dedicated machine to the shared machine, and therefore the process of S12 is executed.

  As described above, the component mounting conditions are determined.

FIG. 15 is a flowchart showing the operation of the component mounter 200.
The component mounter 200 mounts components on the board in accordance with the mounting conditions determined by the mounting condition determination apparatus 100.

  The component mounting machine 200 waits until the board is carried in (S32), and when the board is carried in (YES in S32), the control unit (not shown) of the component mounting machine 200 determines that the board loaded is the component. It is determined whether or not the board type is a mounting target (S34). Whether or not the board type is a component mounting target is determined by the difference in the loading lane into which the board is loaded. For example, considering a case where a production line is formed by three component mounting machines 200 as shown in FIG. 11, when a board is carried into the F lane of the component mounting machine MC1, which is a dedicated machine, The component mounter MC1 determines that the board that has been loaded is the board type to be mounted (ie, board type C), and if the board has been loaded into the R lane, the component mounter MC1 It is determined that the printed board is not the board type for component mounting. Similarly, when a board is loaded into the F lane of the component mounter MC2 that is a shared machine, the component mounter MC2 uses the board type (that is, board type C) to which the board is loaded. If it is determined that there is a board and a board is loaded into the R lane, it is determined that the board that has been loaded is a board type (ie, board type D) that is a component mounting target.

  If the board that has been carried in is the board type to be mounted on the component (YES in S34), the component mounter 200 mounts the component on the board and sends it downstream (S36). If the board that has been loaded is not a board type that is a component mounting target (NO in S34), the component mounter 200 sends out the board downstream without mounting the component on the board (S38).

  The component mounter 200 repeatedly executes the above processing (S32 to S38) until the production of all the boards is completed (S40).

  As described above, according to the present embodiment, each component mounting machine, in principle, performs component mounting only on one type of board, and the board of the board type targeted for component mounting is the board type. In the case of being transported to the transport lane assigned to, a component is mounted on the board. Each component mounting machine determines that a board type other than the board type to be mounted by itself has been transferred when the board is transferred to another transfer lane, and carries the board downstream.

  In the production line, if there is a change in the board type to be produced, it is placed on the component cassette or nozzle station that is placed in the component supply unit of the component mounter that mounts the component on the board type. It is necessary to change the replacement nozzles and the support pin arrangement on the support pin plate. However, it is not necessary to stop the component mounter even while the operator is performing such a change operation. That is, during this time, a board other than the board type that is the component mounting target is carried into the component mounting machine, but the component mounting machine can continue the work of carrying out such a board downstream. Therefore, it is possible to ensure a high operating rate of all the component mounters without stopping the component mounters even during the setup change.

  In addition, after setting the component mounter placed on the production line as a dedicated machine to the maximum, the parts cannot be placed in the parts supply unit, or the predicted tact exceeds the target tact. The machine is set as a shared machine again. For this reason, it is possible to arrange as many dedicated machines with excellent setup change performance as possible on the production line.

  Further, since each component mounting machine includes a plurality of transfer lanes, it is possible to produce a plurality of board types on one production line. Therefore, area productivity is also improved.

  The mounting condition determination method according to the present invention has been described above by using the embodiment, but the present invention is not limited to this embodiment.

  For example, in the present embodiment, the component mounter 200 includes two transport rails, but the number of transport rails may be three or more. For example, even when the component mounting machine 200 includes three transport rails, the components may be mounted only on the board transported to the two transport rails. When there are three or more transfer lanes, there may be three or more substrate types.

  In the present embodiment, the component mounter 200 is an alternating component mounter. However, the component mounter 200 is not limited to an alternate component mounter, and is mounted on one board. On the other hand, it may be a component mounter that mounts components with one mounting head.

  In addition, in the determination process of the number of components (S8 in FIG. 9), instead of the component arrangement as shown in FIG. 11, as shown in FIG. 16, the component supply unit 211a of the component mounter MC2 includes a board. Only the type C component may be arranged, and only the board type D component may be arranged in the component supply unit 211b. In this case, the mounting head 213a mounts components only on the substrate type C substrate, and the mounting head 213b mounts components only on the substrate type D substrate. In this way, by arranging components of the same board type together in one component supply unit, it is possible to reduce the trouble of replacing parts when switching board types. That is, for example, when considering the case where the board type A is switched to the board type C, in the example shown in FIG. 11, the operator places both the component supply units 211a and 211b of the component mounter MC2 on the board type C. Parts must be placed. On the other hand, in the example shown in FIG. 16, the operator only has to place the component of the board type C only in the component supply unit 211a of the component mounter MC2. For this reason, in the example shown in FIG. 16, the operator can save the trouble of moving between the component supply units.

  Further, in the determination process (S18 in FIG. 9) as to whether or not to reset the shared machine, the above-mentioned determination is made by comparing the predicted tact with the target tact. If the number of mounting points is unbalanced, the dedicated machine may be reset to the shared machine.

  Further, in the operation of the mounting condition determining apparatus 100 shown in FIG. 9, it is determined whether or not all the components can be mounted on the component supply unit of the component mounting machine (S4), and it is determined that they can be mounted. In this case (YES in S4), it is determined whether or not to reset the dedicated machine to the shared machine by comparing the predicted tact with the target tact (S14 to S18). You may perform the process of S14-S18, without performing. If it is clear that all components can be mounted on the component supply unit of the component mounter, the processing of S14 to S18 may be performed without performing the determination processing of S4.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a mounting condition determination method in a production line having a component mounting machine that includes a plurality of transport lanes in parallel for transporting boards, and in particular, mounting condition determination that can improve the throughput of the entire production line. Applicable to methods.

1 is an external view showing a configuration of a component mounting system according to an embodiment of the present invention. It is a top view which shows the main structures inside a component mounting machine. It is a schematic diagram which shows the positional relationship of a mounting head and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated components. It is a block diagram which shows the function structure of the mounting condition determination apparatus in this Embodiment. It is a figure which shows an example of mounting point data. It is a figure which shows an example of a component library. It is a figure which shows an example of target tact data. It is a flowchart which shows an example of operation | movement of the mounting condition determination apparatus in this Embodiment. It is a figure for demonstrating the judgment processing of the arrangement | positioning availability determination of the component to the component supply part by the arrangement | positioning availability determination part. It is a figure for demonstrating the determination process (S8 of FIG. 9) of the number of parts types. It is a figure which shows the breakdown of the mounting score of the components mounted by each component mounting machine. It is a figure which shows the relationship between a component mounting machine and the number of mounting points. It is a figure which shows the relationship between a board | substrate seed | species and a tact. It is a flowchart which shows operation | movement of a component mounting machine. It is another figure for demonstrating the determination process (S8 of FIG. 9) of the number of parts types.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 21, 22 Board | substrate 100 Mounting condition determination apparatus 101 Operation control part 102 Display part 103 Input part 104 Memory part 105 Program storage part 105a Board | substrate type allocation part 105b Arrangement | positioning availability judgment part 105c Tact prediction part 105d Tact judgment part 105e Share Machine setting unit 105f Component type determination unit 105g Component mounting point determination unit 105h Mounting order optimization unit 106 Communication I / F unit 107 Database unit 107a Mounting point data 107b Component library 107c Target tact data 200, MC1 to MC3 Component mounting machine 210a 210b Mounting units 211a, 211b Component supply units 212a, 212b Component cassettes 213a, 213b Mounting heads 215, 216 Transport lanes

Claims (8)

A mounting condition determination method for determining a mounting condition of a component in a production line each having a plurality of transfer lanes and connecting a plurality of component mounters for mounting a component on a board,
With all the component mounters set to a dedicated machine that is a component mounter that mounts components on only one board type board, the number of parts mounted on each board type board and each part By comparing the number of types of components that can be arranged in the component supply unit provided in the mounting machine, the components mounted on the boards of the plurality of board types are transferred to the component supply unit provided in each component mounting machine. An arrangement possibility determination step for determining whether arrangement is possible;
A component that is mounted on a board of a plurality of board types from the dedicated machine to at least one of the plurality of component mounting machines when it is determined that the placement is impossible in the placement possibility judgment step. And a shared machine setting step for resetting to a shared machine that is a component mounter that mounts components on the boards of the plurality of board types, and
After the component mounter is reset to the sharer in the shared machine setting step, the components mounted on the boards of the plurality of board types can be arranged in the component supply unit provided in each component mounter. And a component type number determination step for determining the number of component types of components for each board type arranged in each component supply unit. The mounting condition determination method further includes:
A tact prediction step for predicting a tact that is a time required to mount a predetermined component on one board for each board type in a state where all the component mounting machines are dedicated machines,
A tact determination step for determining whether the predicted tact is less than or equal to a predetermined target tact for each substrate type;
In the shared machine setting step, when there is a board type whose predicted tact exceeds the target tact, at least one of the plurality of component mounting machines is transferred from the dedicated machine to the shared machine. Reset it,
In the mounting condition determination method, each component mounting machine is further configured so that the number of component mounting points becomes equal between the component mounting machines after the component mounting machine is reset to the sharing machine in the sharing machine setting step. The mounting condition determining method according to claim 1, further comprising: a component mounting point determining step for determining a component mounting point in. The shared machine includes a plurality of component supply units,
In the component type number determining step, the components are arranged in each component supply unit such that only one component mounted on a board of one board type is arranged in one component supply unit of the shared machine. The mounting condition determining method according to claim 1, wherein the number of component types of components for each substrate type is determined. A mounting condition determination method for determining a mounting condition of a component in a production line each having a plurality of transfer lanes and connecting a plurality of component mounters for mounting a component on a board,
A tact prediction step for predicting a tact that is a time required to mount a predetermined component on one board for each board type in a state where all the component mounting machines are dedicated machines,
A tact determination step for determining whether the predicted tact is less than or equal to a predetermined target tact for each substrate type;
A shared machine setting step of resetting at least one of the plurality of component mounting machines from the dedicated machine to the shared machine when there is a board type in which the predicted tact exceeds the target tact;
Component mounting for determining component mounting points in each component mounting machine so that the number of component mounting points becomes equal among the component mounting machines after the component mounting machine is reset to the sharing machine in the sharing machine setting step The mounting condition determining method according to claim 1, further comprising: a point determining step. A mounting condition determining device that determines a mounting condition of a component in a production line each having a plurality of transfer lanes and connected with a plurality of component mounting machines for mounting components on a board,
With all the component mounters set to a dedicated machine that is a component mounter that mounts components on only one board type board, the number of parts mounted on each board type board and each part By comparing the number of types of components that can be arranged in the component supply unit provided in the mounting machine, the components mounted on the boards of the plurality of board types are transferred to the component supply unit provided in each component mounting machine. An arrangement availability determination means for determining whether or not arrangement is possible;
A component that is mounted on a board of a plurality of board types from the dedicated machine to at least one of the plurality of component mounting machines when it is determined that the placement is impossible by the placement availability judging unit. And a shared machine setting means for resetting to a shared machine that is a component mounting machine that mounts components on the boards of the plurality of board types,
After the component mounter is reset to the sharer by the shared machine setting means, components mounted on the board of the plurality of board types can be arranged in a component supply unit provided in each component mounter. And a component type number determining means for determining the number of component types of components for each board type arranged in each component supply unit. A component mounting method for mounting components in a production line, each of which has a plurality of transfer lanes, and a plurality of component mounters for mounting components on a board are connected,
4. For each of the component mounting machines, a component is taken out from a component supply unit in which components of the number of component types determined by the mounting condition determining method according to any one of claims 1 to 3 are arranged, and the extracted component is a substrate. A component mounting method comprising a mounting step for mounting on a component. A component mounter in a production line, each having a plurality of transfer lanes, and a plurality of component mounters for mounting components on a board connected to each other,
A component supply unit in which components of the number of component types determined by the mounting condition determination method according to any one of claims 1 to 3 are arranged,
A component mounting machine comprising: mounting means for taking out a component from the component supply unit and mounting the taken out component on a substrate. A program for determining component mounting conditions in a production line each having a plurality of transfer lanes and connected to a plurality of component mounters for mounting components on a board,
With all the component mounters set to a dedicated machine that is a component mounter that mounts components on only one board type board, the number of parts mounted on each board type board and each part By comparing the number of types of components that can be arranged in the component supply unit provided in the mounting machine, the components mounted on the boards of the plurality of board types are transferred to the component supply unit provided in each component mounting machine. An arrangement possibility determination step for determining whether arrangement is possible;
A component that is mounted on a board of a plurality of board types from the dedicated machine to at least one of the plurality of component mounting machines when it is determined that the placement is impossible in the placement possibility judgment step. And a shared machine setting step for resetting to a shared machine that is a component mounter that mounts components on the boards of the plurality of board types, and
After the component mounter is reset to the sharer in the shared machine setting step, the components mounted on the boards of the plurality of board types can be arranged in the component supply unit provided in each component mounter. And a component type number determining step for determining the number of component types of components for each board type arranged in each component supply unit.

Images