JP6237826B2 - Package, light emitting device, and manufacturing method thereof - Google Patents

Description

  The present disclosure relates to a package, a light emitting device, and a manufacturing method thereof.

In the market for backlights, lighting, in-vehicle components, displays, etc., there is a strong demand for downsizing, high efficiency, high output, high reliability, and so on. Is provided. In particular, backlights for mobile use have been reduced in thickness, and accordingly, light emitting devices have also been reduced in thickness. In order to meet these demands on the market, various light emitting devices are provided.
A conventional light emitting device includes a reflective layer on a ceramic package or a resin package, and the light extraction efficiency is increased by the reflective layer (see, for example, Patent Document 1 and Patent Document 2). The reflection layer described above is formed by a method such as vapor deposition, sputtering, or coating using a mask.

JP 2008-160032 A JP 2014-158011 A

In the method using the mask, in a small light emitting device or package having a pair of leads, since the area between the leads is a minute area, it is difficult to align the mask, and the reflective layer is accurately formed between the leads. Difficult to do.
In addition, when a mask is not used, for example, when a reflective layer is formed by coating, it is difficult to form the reflective layer in an area where the reflective layer is necessary because the reflective layer material flows after coating the reflective layer material. In addition, there is a possibility that unevenness occurs in the thickness of the reflective layer.

  Therefore, an embodiment according to the present disclosure provides a package and a light-emitting device including a reflective film arranged with high accuracy, and methods for manufacturing the same.

  A package according to an embodiment of the present disclosure includes a pair of leads disposed on a bottom surface of a recess, a first resin body that forms a sidewall of the recess, a second resin body disposed between the pair of leads, A reflective film covering an inner surface of the side wall of the recess and an upper surface and a lower surface of the second resin body;

  A light emitting device according to an embodiment of the present disclosure includes the package and a light emitting element disposed on at least one of the pair of leads on the bottom surface of the recess of the package.

  A package manufacturing method according to an embodiment of the present disclosure includes a pair of leads disposed on a bottom surface of a recess, a first resin body that forms a side wall of the recess, and a second resin disposed between the pair of leads. A step of preparing a resin molded body comprising a body, a step of forming a reflective film on at least the entire bottom surface of the concave portion and the inner surface of the side wall of the concave portion, and the concave portion in the resin molded body on which the reflective film is formed. Peeling the reflective film formed on the pair of leads.

  A method of manufacturing a light emitting device according to an embodiment of the present disclosure includes a pair of leads disposed on a bottom surface of a recess, a first resin body that forms a side wall of the recess, and a second disposed between the pair of leads. A step of preparing a resin molded body comprising a resin body, a step of forming a reflective film on at least a bottom surface of the concave portion and an entire inner surface of a side wall of the concave portion, and the resin molded body on which the reflective film is formed, Separating the reflective film formed on the pair of leads in the recess, and placing a light emitting element on at least one of the pair of leads from which the reflective film has been peeled.

  A ceramic package according to an embodiment of the present disclosure includes a pair of wires disposed on a bottom surface of a recess, a first ceramic body that forms a sidewall of the recess, and a second ceramic body disposed between the pair of wires. And a reflective film covering the inner surface of the side wall of the recess and the upper and lower surfaces of the second ceramic body.

  A package and a light emitting device according to an embodiment of the present disclosure include a reflective film arranged with high accuracy. In addition, the package manufacturing method and the light emitting device manufacturing method according to the embodiment of the present disclosure can form a reflective film arranged with high accuracy.

It is a figure which shows the outline of the light-emitting device which concerns on 1st Embodiment, and is a perspective view which shows a light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on 1st Embodiment, and is a top view of a light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on 1st Embodiment, and is the III-III cross-sectional view of FIG. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a top view of a lead frame. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a top view of a resin molding. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is VI-VI cross-section arrow line view of FIG. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a figure which shows an example of the formation method of a reflecting film. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a top view of a resin molding provided with a reflecting film. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is the IX-IX cross-sectional arrow view of FIG. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a figure which shows an example of the method of peeling a reflecting film. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a top view of the resin molding from which the reflecting film was peeled. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is a XII-XII cross-sectional arrow view of FIG. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is sectional drawing of the resin molding in which the light emitting element was mounted. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 1st Embodiment, and is sectional drawing of the resin molding in which the light emitting element was covered with the 3rd resin body. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is sectional drawing of the resin molding which covered the light emitting element with the insulating film. It is a figure which shows the outline of the manufacturing process of the light-emitting device which concerns on 3rd Embodiment, and is a top view of another resin molding. It is a figure which shows the outline of the light-emitting device which concerns on 4th Embodiment, and is a perspective view which shows a light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on 4th Embodiment, and is a front view which shows a light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on 4th Embodiment, and is the XIX-XIX cross-sectional arrow view of FIG. It is a figure which shows the outline of the light-emitting device which concerns on 5th Embodiment, and is a top view of a light-emitting device. It is a figure which shows the outline of the light-emitting device which concerns on 5th Embodiment, and is a XXI-XXI cross-sectional arrow view of FIG. It is sectional drawing which shows the outline of the light-emitting device which concerns on 6th Embodiment.

  Hereinafter, a manufacturing method of a package and a manufacturing method of a light-emitting device, and a package and a light-emitting device showing an example of an embodiment will be described. Note that the drawings referred to in the following description schematically show the present embodiment, and therefore, the scale, interval, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There may be. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and detailed description is abbreviate | omitted suitably.

(First embodiment)
<Configuration of light emitting device>
This will be described with reference to the drawings. FIG. 1 is a diagram schematically illustrating the light emitting device according to the first embodiment, and is a perspective view illustrating the light emitting device. FIG. 2 is a diagram schematically illustrating the light emitting device according to the first embodiment, and is a top view of the light emitting device. FIG. 3 is a diagram illustrating an outline of the light emitting device according to the first embodiment, and is a cross-sectional view taken along the line III-III in FIG. 2.
The light emitting device 1 according to the first embodiment includes a package 20 including a first resin body 24 and a second resin body 25, a light emitting element 30, a third resin body 40, and a wire 50.

<Package structure>
The package 20 includes a lead 23, a first resin body 24, a second resin body 25, and a reflective film 27. The lead 23, the first resin body 24, and the second resin body 25 are integrally formed. Yes.
The overall shape of the package 20 is a substantially rectangular parallelepiped whose upper surface side is square. The package 20 has a lower surface 20a, a side surface 20b, and an upper surface 20c as outer surfaces. The height, length, and width of the package 20 are not particularly limited, and can be appropriately selected according to the purpose and application. The shape of the package 20 may be a polygonal shape such as a substantially cube or a substantially hexagonal column.

  Here, the lower surface 20a of the package 20 is a mounting surface with respect to an external mounting substrate or the like. The lower surface 20 a includes a reflection film 27 formed on the lower surface of the first resin body 24 and the lower surface 25 b of the second resin body 25, and leads 23 exposed from the reflection film 27. The leads 23 on the lower surface 20 a are exposed from the reflective film 27 except for the peripheral side portion (the lower surface of the first resin body 24) of the package 20 and the portion where the second resin body 25 is spaced apart.

  The side surface 20 b of the package 20 includes a first resin body 24 and leads 23 exposed at the corners of the first resin body 24. The leads 23 on the side surface 20 b are exposed in a rectangular shape at the four corners of the package 20. Note that the first resin body 24 and the lead 23 are formed on substantially the same surface on the side surface 20b.

  The upper surface 20c of the package 20 is formed in a rectangular shape in a plan view and includes a concave portion 26 opened upward in the center. On the upper surface 20c side, on the peripheral upper surface of the opening 26c of the recess 26, the inner surface 26b of the recess 26, and the upper surface 25a of the second resin body 25 disposed between the pair of leads 23 on the bottom surface 26a of the recess 26, A reflective film 27 is provided.

[Concave]
A lead 23 is exposed on the bottom surface 26 a of the recess 26, and the light emitting element 30 is placed on the lead 23. A side wall 26 d of the recess 26 is constituted by the first resin body 24. The outer surface of the side wall 26 d constitutes the side surface 20 b of the package 20.
A smooth slope may be provided on the inner surface 26b of the side wall 26d, or fine irregularities may be provided on the surface to scatter light.
The recess 26 has a circular opening 26c in plan view. The shape of the opening 26c is shown as a circle, but may be a substantially elliptical shape, a substantially polygonal shape, or the like. In addition, the recess 26 has a shape in which the inner surface 26b of the side wall 26d extends toward the opening 26c.

[Lead]
The lead 23 is disposed on the bottom surface 26 a of the recess 26. The leads 23 are spaced apart so as to form a pair of positive and negative. The pair of leads 23 and 23 correspond to an anode electrode and a cathode electrode, respectively, meaning that the respective conductivity is different.

  The length, width, and thickness of the lead 23 are not particularly limited, and can be appropriately selected according to the purpose and application. The material of the lead 23 is preferably copper or a copper alloy, for example. The outermost surface of the lead 23 is preferably covered with a highly reflective metal material such as silver or aluminum.

In the present embodiment, the lead 23 exposed on the bottom surface 26 a of the recess 26 and the lead 23 on the lower surface 20 a of the package 20 are plated.
Since the upper surface of the lead 23 (the bottom surface 26a of the recess 26) is plated, the reflectance of light from the light emitting element 30 can be increased.
Further, since the bottom surface of the lead 23 (the lower surface 20a of the package 20) is plated, the bonding strength with a conductive member such as solder increases.
In the present embodiment, the surface of the lead 23 exposed from the side surface 20b is not plated. The reason for not being plated is that this surface uses the state of the cut surface that appears when the package 20 is separated as described later.

[First resin body, second resin body]
The first resin body 24 fixes the lead 23 and constitutes a side wall 26 d of the recess 26. The second resin body 25 is disposed between the pair of leads 23 and 23. The first resin body 24 and the second resin body 25 are integrally formed of the same resin. Hereinafter, the resin constituting the first resin body 24 and the second resin body 25 is referred to as a first resin.
Examples of the first resin include a thermoplastic resin and a thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, or the like can be used.
In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, a urethane resin, an acrylate resin, or the like can be used.
In order to efficiently reflect light on the inner surface 26b of the side wall 26d of the recess 26, the first resin may contain a light reflecting member. For example, titanium oxide, zinc oxide, zirconium oxide, aluminum oxide, silicon oxide, glass filler, silica, magnesium oxide, antimony oxide, aluminum hydroxide, barium sulfate, magnesium carbonate, and barium carbonate are relatively stable against moisture. Moreover, it is preferable because of its high refractive index and excellent thermal conductivity.

[Reflective film]
The reflective film 27 is provided on the upper surface side and the lower surface side of the first resin body 24 and the second resin body 25. Specifically, the reflective film 27 is provided so as to cover at least the inner surface 26b of the side wall 26d of the recess 26 and the upper surface 25a and the lower surface 25b of the second resin body 25. Since the amount of light from the light emitting element 30 is relatively large in the portion where the reflective film 27 is formed, providing the reflective film 27 can particularly contribute to improving the light extraction efficiency from the front direction of the light emitting device 1. . The exposed pair of leads 23 is not covered with the reflective film 27.

  In the present embodiment, the first resin body 24 is not covered with the reflective film 27 on the side surface 20 b of the package 20. The reason for this is that, as will be described later, the state of the cut surface that appears when the package 20 is separated into pieces is used as it is.

  The reflective film 27 is a thin film containing particles of a light reflecting member. The reflective film 27 can be formed by drying a dispersion in which particles of a light reflecting member are dispersed in an organic solvent. The content of the light reflecting member in the dispersion can be set to 1 to 30% by weight, for example.

  The organic solvent is not particularly limited. For example, ethanol, isopropyl alcohol, xylene, toluene, acetone, tervineol, diethylene glycol monobutyl ether, hexane, tridecane, propylene glycol monomethyl ether acetate (PGMEA), methyl isobutyl ketone (MIBK), methyl ethyl ketone, and the like. Can be mentioned. The organic solvent may be used as one or more mixed solutions in order to adjust the wettability with the substrate.

Examples of the light reflecting member include metal oxides such as TiO ₂ (titanium oxide), Al ₂ O ₃ (aluminum oxide), ZrO ₂ (zirconium oxide), and ZnO (zinc oxide), glass filler, and SiO ₂ (silicon oxide). A material having a high refractive index in the visible light region such as a white pigment is preferred. The refractive index is preferably 1.4 to 2.8, and more preferably 1.5 to 2.8. Among these, titanium oxide having a high refractive index is preferable because good reflectivity can be obtained in the visible light region. The reflectivity of the first resin body 24 and the second resin body 25 on which the reflection film is formed of the light reflecting member is preferably such that the reflectivity of visible light is 70% or more, or 80% or more. In particular, the reflectance is preferably 70% or more, or 80% or more in the wavelength region emitted from the light emitting element. The amount of white pigment such as titanium oxide contained in the light reflecting member may be 50% by weight or more and 95% by weight or less, and is preferably 60% by weight to 95% by weight, but is not limited thereto.

  The particles of the light reflecting member are more preferably nanoparticles having an average particle diameter of 1 to 1000 nm, preferably 5 to 300 nm, more preferably 10 to 200 nm. By using the nanoparticles, the reflective film 27 having a high reflectance can be formed with a thin film, which is suitable for making the light emitting device 1 thin. Since the nanoparticle dispersion is dried to form the reflective film 27, a dense film that does not easily peel off from the surfaces of the first resin body 24 and the second resin body 25 can be obtained. Therefore, a highly reliable light-emitting device 1 can be configured.

  As the particle diameter of the nanoparticles, it is preferable that the average particle diameter is 1 to 100 nm so that good light reflectivity and good adhesion with the first resin body 24 and the second resin body 25 are obtained. The thickness is particularly preferably 1 to 50 nm.

Note that in this specification, the particle diameter of the nanoparticles is an average value of particle diameters measured by a laser diffraction method. For the size of the particles, the number reference (number distribution) to be measured is used.
In addition, the light reflecting member contained in the reflective film 27 and the light reflecting member contained in the first resin body 24 and the second resin body 25 may be the same type of material or different types of materials. Moreover, the particle diameters of these substances may be the same or different.

In a light emitting device having a short side length of the outer edge of the package in a plan view of, for example, about 100 to 200 μm, if the thickness of the reflective film provided in the recess for mounting the light emitting element is about 10 μm, As a result, the recess is narrowed. Therefore, only a relatively small and low-output light emitting element can be placed in the recess, and as a result, the light emitting device emits light relatively darkly.
Further, the wire 50 straddling between the leads on the bottom surface of the concave portion on which the light emitting element is placed is provided with a reflective film on the resin portion disposed between the leads. When the reflective film is thick, the shape of the wire 50 is smooth. Can no longer be provided. If the reflective film has a thickness of about 10 μm, the wire 50 has a sharp and bent shape. Therefore, the third resin body 40 contracts or expands due to heat, so that the stress of the wire 50 is increased due to stress. There are concerns about breakage, disconnection, peeling of the connecting portion, and the like.
Therefore, in the package 20 of this embodiment, the average thickness T of the reflective film 27 is 10 to 1000 nm, preferably 10 to 500 nm, so that it can be formed with a stable film thickness and good reflectivity can be obtained. More preferably, the thickness is particularly preferably 50 to 200 nm. Thereby, since the light emitting device 1 can place the relatively large and high output light emitting element 30 in the recess 26 of the package 20, it can emit light relatively brightly. Further, by setting the reflective film 27 formed on the upper surface 25a of the second resin body 25 to a film thickness within the above range, the shape of the wire 50 straddling the leads 23, 23 at the bottom surface 26a of the recess 26 can be made smooth. It can be maintained in a bent shape. In addition, when forming the reflective film 27, a thin film of about 10 to 500 nm can be easily formed by drying a dispersion containing nanoparticles at a high concentration.

  When the package 20 is soldered, for example, to an external mounting substrate, a solder layer is bonded to the lower surface 20 a of the package 20. If the reflective film 27 is not provided on the surface of the second resin body 25, the light transmitted through the second resin body 25 is absorbed by the solder layer and cannot be extracted outside. On the other hand, since the package 20 of the present embodiment includes the reflective film 27 on the upper surface 25a and the lower surface 25b of the second resin body 25, the light absorption by the second resin body 25 is suppressed. Even if a small amount of light is absorbed by the second resin body 25, it is reflected upward by the reflective film 27 on the lower surface 25b of the second resin body 25, so that the light extraction efficiency can be increased.

[Light emitting element]
The light emitting element 30 is disposed on at least one of the pair of leads 23 on the bottom surface 26 a of the recess 26 of the package 20. The light emitting element 30 is electrically connected to the lead 23 via the wire 50. The shape and size of the light emitting element 30 used here are not particularly limited. As the luminescent color of the light emitting element 30, the thing of arbitrary wavelengths can be selected according to a use. For example, a GaN-based or InGaN-based light-emitting element can be used as a blue light-emitting element (light having a wavelength of 430 to 490 nm). The _{InGaN-based, In X Al Y Ga 1-} X-Y N (0 ≦ X ≦ 1,0 ≦ Y ≦ 1, X + Y <1) , or the like can be used. The light emitting element 30 can be a face-up structure or a face-down structure.

[Third resin body]
The third resin body 40 covers the light emitting element 30 and the like mounted in the recess 26 of the package 20. The third resin body 40 is provided to protect the light emitting element 30 and the like from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 30 and the like.
Hereinafter, the resin constituting the third resin body 40 is referred to as a third resin. Examples of the third resin include a thermosetting resin, for example, a transparent material such as a silicone resin, an epoxy resin, and a urea resin. In addition to such a material, a filler such as a phosphor or a substance having a high light reflectance can also be included in order to have a predetermined function.

  The third resin can facilitate the color tone adjustment of the light emitting device 1 by mixing phosphors, for example.

As the filler to be contained in the third resin, for example, a material having a high light reflectance such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO can be suitably used. For the purpose of cutting undesired wavelengths, for example, organic or inorganic coloring dyes or coloring pigments can be used.

[Wire]
The wire 50 is a conductive wiring for electrically connecting the electronic component such as the light emitting element 30 and the protection element and the lead 23. Examples of the material of the wire 50 include metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), Al (aluminum), and alloys thereof. It is preferable to use Au excellent in thermal conductivity and the like. In addition, the thickness of the wire 50 is not specifically limited, It can select suitably according to the objective and a use.

[Others]
The light emitting device 1 may be provided with a Zener diode as a protective element. The Zener diode can be placed on the lead 23 on the bottom surface 26 a of the recess 26 apart from the light emitting element 30. Further, the Zener diode may be mounted on the lead 23 on the bottom surface 26a of the recess 26, and the light emitting element 30 may be mounted thereon.

  Since the package 20 and the light emitting device 1 according to the present embodiment include the reflective film 27 arranged with high accuracy, the light from the light emitting element and the phosphor is reflected more than before, and the light is directed toward the light emitting upper surface. It can be taken out. The light emitting device 1 can increase the light extraction efficiency and improve the luminous flux.

[Method for Manufacturing Light Emitting Device]
Below, the case where it manufactures with the form of the aggregate substrate by which the some board | substrate corresponding to several light-emitting devices is arrange | positioned at array form is demonstrated. The manufacturing method of the light emitting device according to the first embodiment includes a step of preparing a resin molded body as a collective substrate, a step of forming a reflective film, a step of peeling off a part of the reflective film, and a light emitting element. A step of covering the light-emitting element with the third resin, and a step of dividing into individual pieces.

<Process for preparing resin molding>
FIG. 4 is a diagram schematically showing the manufacturing process of the light emitting device according to the first embodiment, and is a plan view of the lead frame. FIG. 5 is a diagram showing an outline of a manufacturing process of the light emitting device according to the first embodiment, and is a plan view of a resin molded body. FIG. 6 is a diagram illustrating an outline of the manufacturing process of the light emitting device according to the first embodiment, and is a cross-sectional view taken along the line VI-VI in FIG. 5.

  The resin molded body 21 includes a lead frame 22 and a resin portion 29, and includes a plurality of concave portions 26 corresponding to a plurality of light emitting devices. Through holes 22a are formed in the lead frame 22 in a predetermined pattern. The predetermined pattern is divided into two lead areas so as to form different electrodes when separated into individual pieces, and surrounds the lead area while holding the two leads. In order to divide into pieces along the through hole 22a, a linear shape is preferable. The lead frame 22 can be a flat metal plate, but can also be a metal plate provided with steps or irregularities. The lead frame 22 is obtained by punching or etching a flat metal plate.

  The through holes 22a are formed so that the leads 23 form a pair of positive and negative when the resin molded body 21 is separated into the package 20. Further, the through hole 22a is formed so as to reduce an area for cutting the lead 23 when the resin molded body 21 is cut. For example, the through holes 22 a are provided in the lateral direction so as to form a pair of positive and negative leads 23. The width of the elongated through hole (the width W between the pair of leads 23, 23) is preferably 1 mm or less, for example, 500 to 800 μm because the package can be reduced in size. Moreover, the through-hole 22a is provided in the position corresponded to the cut-out part at the time of dividing the resin molding 21 into pieces. However, a part of the lead frame 22 is connected so that a part of the lead frame 22 does not fall off or the lead 23 is exposed to the side surface 20b of the package 20. For example, in order to dice the resin molded body 21 using a dicing blade 90 (see FIG. 14), it is preferable that the through holes 22a are linearly formed vertically and horizontally or diagonally. The space between the through holes 22a and 22a corresponding to the portion to be diced is a single package 20.

  The lead frame 22 is formed using, for example, a good electrical conductor such as copper or copper alloy. Further, in order to increase the reflectance of light from the light emitting element 30, metal plating such as silver or aluminum can be applied. Although it is preferable to perform metal plating before sandwiching between the upper mold and the lower mold, such as after the through hole 22a is provided or after the etching process, before the lead frame 22 is integrally molded with the resin portion 29. Metal plating can also be given to this.

  The lead 23 in the lead frame 22 means a portion corresponding to the lead 23 after molding, and means a state after being separated into pieces. The lead 23 is disposed on the bottom surface 26a of the recess 26 when separated. The resin part 29 means a part corresponding to the first resin body 24 and the second resin body 25 after molding, and means a state before being singulated. Among these, the 1st resin body 24 forms the side wall 26d of the recessed part 26 when it is separated into pieces. The second resin body 25 is disposed between the pair of leads 23 when separated.

The process of manufacturing the resin molded body 21 includes the following processes (1) to (5), for example.
(1) A flat lead frame 22 having a through hole 22a is prepared.
(2) The lead frame 22 is sandwiched between the upper mold and the lower mold of the mold mold that is divided vertically.
(3) The material of the resin part 29, that is, the first resin containing a light reflecting member such as titanium oxide is poured into the mold.
(4) The injected first resin is cured or solidified.
(5) The molded product is taken out from the mold and the injection trace of the first resin is excised.
In addition, when using a thermosetting resin as 1st resin, it is preferable to manufacture by a transfer mold. In this case, heat treatment is performed in an oven in order to cure the thermosetting resin. The resin molded body 21 can also be formed by injection molding, compression molding, or extrusion molding.

<Step of forming a reflective film>
FIG. 7 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the first embodiment, and is a diagram illustrating an example of a method of forming a reflective film. FIG. 8 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the first embodiment, and is a plan view of a molded substrate including a reflective film. FIG. 9 is a diagram illustrating an outline of the manufacturing process of the light emitting device according to the first embodiment, and is a cross-sectional view taken along the line IX-IX in FIG. 8.

  In the step of forming the reflective film 27, the reflective film 27 is formed on the entire surface of at least the bottom surface 26a of the recess 26 and the inner surface 26b of the side wall 26d of the recess 26 in the package 20 when separated. Here, the bottom surface 26 a of the recess 26 is a portion corresponding to the upper surface 25 a of the second resin body 25 in the package 20 when separated.

  In this embodiment, the prepared resin molded body 21 is immersed in an organic solvent 71 that is a dispersion liquid of a light reflecting member, and then dried to form the reflective film 27. The immersion time and the drying time can be appropriately set so that the reflective film 27 having an average thickness T of 10 to 300 nm is formed on the resin molded body 21. As the organic solvent 71, a slurry in which the particles (nanoparticles) of the light reflecting member are dispersed in the organic solvent is used. The organic solvent 71 mainly contains a metal oxide having a particle size of 1 to 100 nm. The nanoparticles are preferably titanium oxide.

  By coating the resin molded body 21 with the slurry in which the nanoparticles are dispersed in the organic solvent in this way, the complicated shape of the package can be followed, and the dense reflective film 27 can be formed with high accuracy. That is, by forming the reflective film 27 on the resin molded body 21 with the dispersion liquid of the light reflecting member, for example, selective to the insulating portions such as the upper surface 25a and the lower surface 25b of the second resin body 25 inside the recess 26. In addition, the reflective film 27 including the light reflecting member can be formed.

  Hereinafter, the resin molded body after the reflection film 27 is formed is referred to as a resin molded body 21b. The resin molded body 21b has a reflection film 27 formed on the entire surface thereof. That is, the reflective film 27 is formed on all the surfaces of the lead 23, the first resin body 24, and the second resin body 25 in the package 20 when separated into pieces.

<Step of removing a part of the reflective film>
FIG. 10 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the first embodiment, and is a diagram illustrating an example of a method of peeling the reflective film. FIG. 11 is a diagram illustrating an outline of the manufacturing process of the light emitting device according to the first embodiment, and is a plan view of the molded substrate from which the reflective film has been peeled off. FIG. 12 is a diagram illustrating an outline of the manufacturing process of the light emitting device according to the first embodiment, and is a cross-sectional view taken along the line XII-XII in FIG. 11.

  The step of peeling off some of the reflective films 27 is a step of peeling off the reflective films formed on the pair of leads 23 in the recess 26 in the resin molded body 21b. In this step, first, the resin molded body 21b is immersed in an electrolytic solution, and a current is passed through the resin molded body 21b. For example, an electrolytic deburring device can be used.

  The electrolytic deburring device includes an electrolytic bath 80 and an electric circuit, and the electrolytic bath 80 is filled with a predetermined electrolytic solution 81. A cathode plate 83 is connected to the cathode of the power source 82, an anode plate 84 is connected to the anode of the power source 82, and the cathode plate 83 and the anode plate 84 are immersed in the electrolytic solution 81. The plurality of cathode plates 83 and anode plates 84 are arranged in a grid, for example, in an insulated state, and each cathode plate 83 also has a function of holding an electrolytic treatment object. The lead frame 22 of the resin molded body 21 b is electrically connected to the cathode plate 83. The resin molded body 21 b is held by the cathode plate 83 in a state where the entire resin molded body 21 b is immersed in the electrolytic solution 81.

When the switch 85 of the electrolytic deburring device is turned on, hydrogen is generated on the cathode side by electrolysis. The current value to be applied to the resin molded body 21b may be a general current value of an electrolytic deburring device. However, in order to efficiently remove an unnecessary part of the reflection film 27 while leaving the necessary reflection film 27. , it is preferable to be energized at a current density of ^{500A / m 2 ~3000A / m 2} . More, ^{preferably, 1000A / m 2 ~2500A / m} 2.

  In the case of electrolytic deburring, since a potential is generated in the portion of the reflective film 27 formed on the lead 23, hydrogen is generated and the reflective film 27 on the surface peels off. Since no potential is generated in the portion of the reflective film 27 formed on the first resin body 24 and the second resin body 25, hydrogen is not generated and the reflective film 27 on the surface does not peel off.

  A direct current and an alternating current may be alternately supplied to the resin molded body 21b. In this case, the period during which the direct current is applied is longer than the period during which the alternating current is applied. Thus, by providing a period during which hydrogen is not generated during the period during which hydrogen is generated, the force for peeling the reflective film 27 can be suppressed. As a result, it is possible to prevent the necessary reflective film 27 from being pulled and peeled off by the unnecessary reflective film 27 in the vicinity thereof.

  The step of peeling off some of the reflective films 27 includes a step of removing the reflective film floating on the pair of leads 23 and 23 of the resin molded body 21c after electrolytic deburring. In this step, for example, a water jet can be used. Thereby, it is possible to improve the reliability of mounting electronic components such as the light emitting element 30 and wire bonding, which will be described later. Through the steps so far, it is possible to form an assembly of the package 20 provided with the reflection film 27 having a complicated shape, high accuracy, and a dense high reflectance on the surface of the resin portion. Here, the shape of the lead 23 exposed from the first resin body 24 is composed of a circle and a straight line. The reflective film 27 can be formed with high accuracy.

  Hereinafter, the resin molded body after the unnecessary part of the reflection film 27 is removed is referred to as a resin molded body 21c. When the resin molded body 21c is singulated, the package 20 shown in FIG. 1 is obtained. In the package 20, the reflective film 27 is formed on the inner surface 26 b of the side wall 26 d of the recess 26 up to the boundary with the lead 23, and is formed on the upper surface 25 a and the lower surface 25 b of the second resin body 25 up to the boundary with the lead 23. ing. Further, the reflective film 27 is formed on the lower surface of the first resin body 24 up to the boundary with the lead 23 on the lower surface 20 a of the package 20. Further, a reflective film 27 is formed along the boundary between the first resin body 24 and the lead 23.

<The process of mounting a light emitting element>
FIG. 13 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the first embodiment, and is a cross-sectional view of a molded substrate on which the light emitting element is placed. In the step of placing the light emitting element 30, the light emitting element 30 is placed on at least one of the pair of leads 23 and 23 disposed in the recess 26 of the resin molded body 21 c. Here, since the light emitting element 30 is assumed to have a face-up structure, a die bond resin is applied to the place where the light emitting element 30 is mounted on the lead 23, the light emitting element 30 is mounted, and then the die bond resin is applied. To cure, heat treatment in an oven.

  In addition, the manufacturing method of the light-emitting device 1 may have the process of mounting a protective element. In this case, the Ag paste agent is applied to the place where the protective element is mounted in the recess 26 of the resin molded body 21c, and then the protective element is mounted and heat-treated in an oven in order to cure the Ag paste agent.

  In the method for manufacturing the light emitting device 1, the light emitting element 30 and the lead 23 are then electrically connected by the conductive wire 50 using a wire bonding apparatus. When the protective element is placed, the protective element and the lead are electrically connected. Hereinafter, the resin molded body after the light emitting element 30 is mounted is referred to as a resin molded body 21d.

<Process for covering light emitting element with third resin>
FIG. 14 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the first embodiment, and is a cross-sectional view of a resin molded body in which the light emitting element is covered with a third resin body. In the step of covering the light emitting element with the resin, the third resin is applied to the resin molded body 21d from above the light emitting element 30 using, for example, a resin coating device. In addition to the thermosetting resin, the third resin can contain at least one of a phosphor, an inorganic filler, and an organic filler. Following application, heat treatment is performed in an oven to cure the third resin.

  The filling amount of the third resin may be an amount that covers the electronic components such as the light emitting element 30 and the wires 50. In order to minimize the filling amount of this material, the surface of the third resin body 40 is formed into a substantially flat shape as illustrated. When the third resin body 40 has a lens function, the surface of the third resin body 40 may be raised so as to have a bullet shape or a convex lens shape. Hereinafter, the resin molded body after the third resin body 40 is formed is referred to as a resin molded body 21e.

<Individualization process>
The singulation step is a step of cutting the resin molded body 21e to obtain an individual light emitting device. Through holes 22a are formed in a predetermined pattern in the lead frame 22 of the resin molded body 21e, and the resin molded body 21e is cut at a position passing through the other through holes 22a except for the through holes 22a arranged in the recess 26. To do. For example, the resin molded body 21e is attached to a dicing sheet, and the resin portion 29 and the lead frame 22 of the resin molded body 21e are simultaneously cut with a dicing blade 90.

  According to the manufacturing method of the package and the light emitting device according to the present embodiment, the prepared resin molded body 21 is immersed in the organic solvent 71 which is a dispersion liquid of the light reflecting member without using a mask, and is reflected on the whole. After the film 27 is formed, a part of the unnecessary reflection film 27 is removed, so that the reflection film 27 can be formed in a necessary area.

  Further, in the above manufacturing method, if the resin molded body 21B having the reflection film 27 formed on the entire surface is immersed in an electrolytic solution and a direct current is passed through the resin molded body 21b connected to the cathode, lead is generated due to the generation of hydrogen. Unnecessary reflection film 27 can be easily removed from above 23. Therefore, for example, the reflective film 27 can be accurately formed up to the boundary with the lead 23 also in a minute area such as the upper surface 25a and the lower surface 25b of the second resin body 25 disposed between the leads 23 and 23. In addition, the reflective film 27 can be formed along the boundary between the first resin body 24 and the lead 23.

(Second Embodiment)
FIG. 15 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the second embodiment, and is a cross-sectional view of a resin molded body in which the light emitting element is covered with an insulating film. The method for manufacturing a light emitting device according to this embodiment further includes a step of covering the light emitting element with an insulating film after the step of placing the light emitting element and before the step of covering the light emitting element with the third resin. Also good.

  When the wire 50 is used after the light emitting element 30 is placed, the insulating film 60 is preferably formed after the wire 50 is provided. In the present embodiment, the insulating film 60 is formed on the light emitting element 30 and the wire 50 in the resin molded body 21d after the light emitting element 30 is mounted.

The insulating film 60 is preferably provided so as to cover almost the entire upper surface of the resin molded body 21d. As a material of the insulating film 60, a light-transmitting material is preferable, and it is preferable to mainly use an inorganic compound. Specifically, oxidation of Al ₂ O ₃ , SiO ₂ , TiO ₂ , ZrO ₂ , ZnO, Nb ₂ O ₅ , MgO, In ₂ O ₃ , Ta ₂ O ₅ , HfO ₂ , SeO, Y ₂ O _3, etc. And nitrides such as SiN, AlN, and AlON, and fluorides such as MgF ₂ . These may be used alone or in combination. Alternatively, it may be laminated.

The film thickness of the insulating film 60 is preferably thin so as not to cause light loss due to multiple reflection at the interface of the third resin body 40 / insulating film 60 and the interface of the insulating film 60 / lead 23.
The film thickness of the insulating film 60 is thinner than the film thickness of the third resin body 40. The thickness of the insulating film 60 is substantially constant. Although the preferable range of the film thickness is somewhat different depending on the type of material used for the insulating film 60, the film thickness of the insulating film 60 is preferably about 1 nm to 300 nm, more preferably 5 nm to 100 nm. When the insulating film 60 is a multilayer, it is preferable that the film thickness of the entire layer be within this range.

Such an insulating film 60 can be formed by an atomic layer deposition (ALD) method, a sputtering method, a vapor deposition method, or the like. Among these, the ALD method is preferable because the formed film is dense, the shape having a step (unevenness) is high, and a film having a uniform thickness can be formed. In particular, a film made of Al ₂ O ₃ formed by the ALD method is preferable because it has a high barrier property against an atmosphere such as moisture. Thereby, for example, discoloration of silver plating on the lead 23 can be effectively suppressed.

(Third embodiment)
FIG. 16 is a diagram illustrating an outline of a manufacturing process of the light emitting device according to the third embodiment, and is a plan view of another resin molded body. In the method for manufacturing a package and a light emitting device according to this embodiment, for example, a resin molded body 21C shown in FIG. 16 may be prepared. The resin molded body 21 </ b> C includes a lead frame 22 </ b> C and a plurality of resin portions 29 </ b> C corresponding to individual packages, and each resin portion 29 </ b> C includes a recess 26. Since the resin portion 29C is separated into pieces in the resin molded body 21C, only the lead frame 22C is cut in the separation step.

The lead frame 22 </ b> C is a plate-like member and has a through hole 223 having a predetermined shape around the recess 26. The through holes 223 are formed so that the leads 23 form a pair of positive and negative when the resin molded body 21C is separated. The lead frame 22 </ b> C includes a frame body 220 that surrounds the periphery of the through hole 223, a suspension lead 221, and a hanger lead 222.
The suspension lead 221 protrudes from the frame body 220 toward the through hole 223 and is connected to the lead 23. The suspension lead 221 is a part for supporting the resin portion 29C and the leads 23 and 23 on the frame body 220, and is separated when being separated into individual pieces.
The hanger lead 222 protrudes from the frame body 220 toward the through hole 223 and is disposed so as to be orthogonal to the suspension lead 221. The hanger lead 222 is a part for supporting the resin part 29C at its tip part and is not cut. In addition, after singulation, the package can be easily removed from the lead frame 22C by protruding the base end portion of the hanger lead 222 with a predetermined jig.

  When the step of forming the reflection film using the resin molded body 21C is performed, the reflection film 27 is also formed on the side surface 20b in addition to the upper surface 20c of the resin portion 29C. That is, the entire surface of the first resin body 24 and the second resin body 25 is covered with the reflective film 27 in the package when separated into pieces. Therefore, a package and a light emitting device in which the reflective film 27 is formed also on the side surface 20b can be manufactured. Thereby, even if a slight amount of light is absorbed by the first resin body 24 from the inner surface 26b of the side wall 26d of the recess 26, it is reflected by the reflective film 27 on the side surface 20b of the package, so that the light extraction efficiency can be increased.

(Fourth embodiment)
<Configuration of light emitting device>
FIG. 17 is a diagram schematically illustrating the light emitting device according to the fourth embodiment, and is a perspective view illustrating the light emitting device. FIG. 18 is a diagram schematically showing the light emitting device according to the fourth embodiment, and is a front view showing the light emitting device. FIG. 19 is a diagram schematically illustrating the light emitting device according to the fourth embodiment, and is a cross-sectional view taken along the line XIX-XIX in FIG. The light emitting device 1B includes a package 20B, a light emitting element 30B, a third resin body 40, and a wire 50. In the light emitting device 1B, the shapes of the package 20B and the light emitting element 30B are different from those of the light emitting device 1 according to the first embodiment. Below, the same code | symbol is attached | subjected to the same structure as the light-emitting device 1 which concerns on 1st Embodiment, and description is abbreviate | omitted. The light emitting element 30B is different from the light emitting element 30 according to the first embodiment in that the light emitting element 30B is formed in a horizontally long rectangle in plan view.

  The package 20B has a substantially rectangular parallelepiped shape whose outer shape is formed flat in the Z-axis direction that is the thickness direction of the light-emitting device 1B, and is preferably used as a light source for a backlight of a liquid crystal display. Suitable for type implementation. The package 20B includes a lead 23, a first resin body 24, a second resin body 25, and a reflective film 27. The lead 23, the first resin body 24, and the second resin body 25 are integrally molded. Yes. The 1st resin body 24 has the recessed part 26 opened to the front side (minus direction of a Y-axis) of the light-emitting device 1B. That is, the side wall 26 d of the recess 26 is constituted by the first resin body 24.

  In the package 20B, the recess 26 has a horizontally long opening in front view. More specifically, the opening has an octagonal shape in which the central portion of the lower side of the rectangle swells downward in a trapezoidal shape when viewed from the front. The bottom surface 26a of the recess 26 has an elongated shape that is a horizontally long octagon. A pair of leads 23, 23 are provided on the bottom surface 26 a of the recess 26 so as to be exposed, and the light emitting element 30 </ b> B is mounted on one of the leads 23.

  A smooth slope may be provided on the inner surface of the side wall 26d of the recess 26, or fine irregularities may be provided on the surface to scatter light. In addition, you may comprise by the surface substantially perpendicular | vertical with respect to the bottom face 26a of the recessed part 26, without providing an inclination. Of the side wall 26d of the recess 26, the upper wall portion 26e and the lower wall portion 26f provided to face each other in the thickness direction (Z-axis direction) of the light emitting device 1B are formed thinner than the other wall portions. . That is, the upper wall portion 26e and the lower wall portion 26f are formed thinner than two side wall portions provided to face each other in the width direction (X-axis direction) of the light emitting device 1B. The pair of leads 23 provided on the bottom surface 26 a of the recess 26 are provided so as to protrude from the outer surface side of the lower wall portion 23 d, bend further, and extend along the lower surface of the first resin body 24.

The package 20B is a gate for injecting a resin material into a mold when the first resin body 24 and the second resin body 25 are formed by injection molding on the back surface (minus direction of the Y-axis) of the light emitting device 1B. Traces of are formed. The gate mark is formed by the first resin body 24 and is covered with the reflective film 27. The second resin body 25 is disposed between the pair of leads 23 and 23. In the second resin body 25, a reflective film 27 is provided on the front surface (upper surface 25a) of the light emitting device 1B (the positive direction of the Y axis). In the first resin body 24, the inner surface 26 b of the side wall 26 d of the recess 26 and the surface of the package 20 B including the surface around the opening 26 c of the recess 26 are covered with the reflective film 27. The recess 26 is filled with a third resin body 40.
The light emitting device 1B can be manufactured in the form of a collective substrate as in the first embodiment. The lead frame is molded and then cut, and then a predetermined portion of the lead frame is bent to form external connection terminal portions of the leads 23 and 23 of the package 20B.

  The light emitting device 1B is provided with leads 23 and 23 so as to be suitable for side view type mounting. Further, the package 20B is configured to be thinner as the side-view type light emitting device 1B. Since the side-view type package has a thin side wall provided in the thickness direction, the side-view type light emitting device tends to leak light in the thickness direction. However, in the light emitting device 1B, the entire resin body is covered with the reflective film 27, and the inner surface and the outer surface of the upper wall portion 26e and the lower wall portion 26f are also covered with the reflective film 27. Therefore, the light leaking from the thin wall portion can be reduced and the luminous flux can be improved.

(Fifth embodiment)
<Configuration of light emitting device>
FIG. 20 is a diagram schematically illustrating the light emitting device according to the fifth embodiment, and is a top view of the light emitting device. FIG. 21 is a diagram schematically illustrating the light emitting device according to the fifth embodiment, and is a cross-sectional view taken along the line XXI-XXI in FIG. 20. The light emitting device 1C includes a package 20C, a light emitting element 30, a third resin body 40, and a wire 50. In the light emitting device 1C, the shape of the package 20C is different from that of the light emitting device 1 according to the first embodiment. Below, the same code | symbol is attached | subjected to the same structure as the light-emitting device 1 which concerns on 1st Embodiment, and description is abbreviate | omitted.

  The package 20 </ b> C includes an element mounting portion 28 on the bottom surface 26 a of the recess 26. The package 20 </ b> C includes an element mounting portion 28 in addition to the pair of leads 23 and 23. The element mounting portion 28 is a land portion (die pad portion) to which the light emitting element 39 is bonded. The light emitting element 30 is placed on the element mounting portion 28 and is electrically connected to the pair of leads 23 and 23, respectively.

In the present embodiment, the element mounting portion 28 is made of the same conductive material as that of the lead 23. However, since the light emitting element 30 is energized from the pair of leads 23, 23, the element mounting portion 28 is not energized. For example, in the lead frame 22C shown in FIG. 16, such an element mounting portion 28 is deformed into a shape in which one hanger lead 222 corresponding to one package is extended and disposed in a gap between the pair of leads 23 and 23. Thus, it can be formed.
In addition, when the element mounting part 28 is comprised, for example with resin members, such as an epoxy resin and a silicone resin, you may make it form this element mounting part 28 on any one lead 23, for example.

(Sixth embodiment)
<Configuration of light emitting device>
FIG. 22 is a cross-sectional view schematically illustrating a light emitting device according to the sixth embodiment. The light emitting device 1D includes a ceramic package 20D, a light emitting element 30, a third resin body 40, and a wire 50. In the light emitting device 1D, the shape and material of the ceramic package 20D are different from those of the light emitting device 1 according to the first embodiment. Below, the same code | symbol is attached | subjected to the same structure as the light-emitting device 1 which concerns on 1st Embodiment, and description is abbreviate | omitted.

  The overall shape of the ceramic package 20D is a substantially rectangular parallelepiped, and a recess 26 is provided on the upper surface. The ceramic package 20D includes a second ceramic body 140 and a first ceramic body 130 provided thereon. The first ceramic body 130 and the second ceramic body 140 are formed by laminating one or a plurality of insulating sheets.

Examples of the material of the first ceramic body 130 and the second ceramic body 140 include ceramics. For ceramics, the main material is preferably selected from alumina (Al ₂ O ₃ ), aluminum nitride (AlN), mullite, and the like. A ceramic substrate can be obtained by adding a sintering aid or the like to these main materials and sintering. Low temperature co-fired ceramics can also be used.

  In order to reflect light efficiently, the ceramic base material contains a material having high light reflectance (for example, a white filler such as titanium oxide). Moreover, wiring of various pattern shapes can be applied at the stage of the green sheet before firing. After the ceramic material is fired, a metal material is disposed on the underlayer by plating or sputtering using gold, silver, copper, or aluminum as a material.

  The second ceramic body 140 is substantially plate-shaped, and a hole is formed in the first ceramic body 130. The second ceramic body 140 and the first ceramic body 130 are laminated to form the recess 26. The first ceramic body 130 forms the side wall 26 d of the recess 26. In the recess 26, a pair of wirings 110 and 120 are arranged apart from each other so as to extend from the bottom surface 26a to the lower surface of the ceramic package 20D. A second ceramic body 140 is disposed between the pair of wirings 110 and 120. When used as the light emitting device 1D, the wirings 110 and 120 correspond to an anode electrode and a cathode electrode. The light emitting element 30 is placed on the wiring 110, for example. Further, an element electrode (not shown) provided on the upper surface of the light emitting element 30 and the wirings 110 and 120 are connected to each other by a wire 50. The light emitting element 30 is sealed with the third resin body 40.

  The outer side of the lower surface of the ceramic package 20D is a surface on the side mounted on an external substrate. On the lower surface side of the ceramic package 20D, wirings 112 and 122 continuous from the wirings 110 and 120 via the wirings 111 and 121, respectively, are provided. That is, the wirings 112 and 122 are connected to the two element electrodes of the light emitting element 30 through the wirings 110 and 120, respectively. In addition, it is preferable that the outermost surfaces of the wirings 110 and 120 disposed in the recess 26 are covered with a metal material having a high reflectance such as silver.

  The reflective film 27 covers the inner surface 26 b of the side wall 26 d of the recess 26. The reflective film 27 covers the top surface of the second ceramic body 140, specifically, the portion disposed between the wiring 110 and the wiring 120 on the bottom surface 26 a of the recess 26. Further, the reflective film 27 covers the lower surface of the second ceramic body 140, specifically, the portion disposed between the placement wiring 112 and the wiring 122 on the lower surface of the ceramic package 20D. Further, the reflective film 10 covers the upper surface of the first ceramic body 130, specifically, the surface around the opening 26 c of the recess 26. The light emitting device 1D can be manufactured in the form of a collective substrate, as in the first embodiment.

  In order to confirm the performance of the light emitting device of the present invention, the following experiment was conducted. A light emitting device having the same shape as the light emitting device 1 (hereinafter referred to as Example 1) was manufactured. The manufacturing method of the light-emitting device of Example 1 is as follows.

  A resin molded body 21 as a collective substrate was prepared. The lead frame 22 of the resin molded body 21 is made of a copper alloy and has a surface plated with silver. The material of the first resin body 24 was an epoxy resin containing 10% by weight of titanium oxide as a light reflecting member. The second resin body 25 was also an epoxy resin containing 10% by weight of titanium oxide. The titanium oxide used for the first resin body 24 and the second resin body 25 has an average particle diameter of 0.2 μm. For the reflection film, a slurry of a dispersion (15 wt%) using toluene as an organic solvent and titanium oxide having a particle diameter of 30 nm as a light reflection member was prepared.

In the step of forming the reflective film, the resin molded body 21 was immersed in this slurry and then dried to produce the resin molded body 21b on which the reflective film 27 was formed. And in the process of peeling one part reflective film, the electrolytic deburring apparatus was prepared and it supplied with electricity at the current density of 1500 A / m < ² > to the resin molding 21b by using water as electrolyte solution. And the resin burr | flash and reflection film which floated on the resin molding 21c taken out from the electrolytic vessel 80 were removed with the water jet. As the light emitting element 30, a GaN-based blue light emitting element having a peak wavelength of 450 nm was used. Furthermore, a silicone resin containing a YAG phosphor was used as the third resin body 40. The reflective film 27 did not remain on the lead frame 22, which is a metal part, and the reflective film 27 was disposed only on the first resin body 24.

  The planar size of the completed light emitting device of Example 1 is 3 mm × 3 mm, and the width W between the pair of leads 23 and 23 is 600 μm. Hereinafter, a light emitting device manufactured in the same manner without performing the step of forming the reflective film is referred to as Comparative Example 1.

<Results of color comparison>
As a result of an experiment using the chromaticity measuring device, the light emitting devices of Comparative Example 1 and Example 1 had a color tone in which both the x value and the y value in the xy chromaticity value were 0.34. It can be concluded that the difference in color tone due to the presence or absence of the reflective film 27 can be ignored.

<Results of light flux comparison>
As a result of the experiment using the light beam measuring device, the light beam measured for Example 1 was 101% when the light beam measured for Comparative Example 1 was taken as 100%. The effect of increasing the luminous flux by 1% by the reflection film 27 was confirmed.

  As described above, the package, the light emitting device, and the manufacturing method thereof according to the embodiments of the present disclosure have been specifically described. However, the gist of the present invention is not limited to these descriptions, and the description of the claims Should be interpreted widely. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

  The light emitting device according to the present embodiment includes a backlight source of a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guides, and further an image reading in a digital video camera, a facsimile, a copier, a scanner, etc. It can be used for various light sources such as a device and a projector device.

1, 1B, 1C, 1D Light emitting device 20, 20B, 20C, Package 20D Ceramic package 20a Bottom surface 20b Side surface 20c Top surface 21, 21C Resin molded body 21b, 21c, 21d, 21e Resin molded body 22 Lead frame 22a Through hole 22C Lead frame 220 Frame 221 Hanging lead 222 Hanger lead 223 Notch portion 23 Lead 24 First resin body (resin portion)
25 Second resin body (resin part)
25a upper surface 25b lower surface 26 recess 26a bottom surface 26b inner surface 26c opening 26d side wall 26e upper wall portion 26f lower wall portion 27 reflecting film 28 element mounting portion 29, 29C resin portion 30 light emitting element 40 third resin body 50 wire 60 insulating film 70 container 71 Organic Solvent 80 Electrolytic Cell 81 Electrolyte 82 Power Source 83 Cathode Plate 84 Anode Plate 85 Switch 90 Dicing Blade 110, 120 Wiring 130 First Ceramic Body 140 Second Ceramic Body T Average Thickness of Reflecting Film

Claims (24)

A pair of leads disposed on the bottom surface of the recess;
A first resin body forming a sidewall of the recess;
A second resin body disposed between the pair of leads;
A package comprising a reflective film covering an inner surface of a side wall of the recess and an upper surface and a lower surface of the second resin body.   2. The package according to claim 1, wherein the first resin body has an entire surface around the opening of the recess covered with the reflective film.   The package according to claim 1, wherein the first resin body and the second resin body are entirely covered with the reflective film.   The said reflecting film is formed to the boundary with the said lead on the inner surface of the side wall of the said recessed part, and is formed to the boundary with the said lead on the upper surface and lower surface of the said 2nd resin body. The package according to any one of the above.   The package according to claim 1, wherein an average thickness of the reflective film is 10 to 1000 nm.   The package according to claim 1, wherein the reflective film mainly contains a metal oxide having a particle diameter of 1 to 100 nm.   The package according to claim 6, wherein the metal oxide is titanium oxide.   The first resin body and the second resin body include at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. The package according to any one of 7 above.   The package as described in any one of Claims 1 thru | or 8 further equipped with the element mounting part which mounts a light emitting element. A pair of wires disposed on the bottom surface of the recess;
A first ceramic body forming a sidewall of the recess;
A second ceramic body disposed between the pair of wires;
A ceramic package comprising: an inner surface of a side wall of the concave portion; and a reflective film that covers an upper surface and a lower surface of the second ceramic body. A package according to any one of claims 1 to 8,
And a light emitting device disposed on at least one of the pair of leads on the bottom surface of the recess of the package. A package according to claim 9;
A light emitting device having a light emitting element mounted on the element mounting portion on the bottom surface of the recess of the package and electrically connected to the pair of leads. The ceramic package according to claim 10;
And a light emitting element disposed on at least one of the pair of wirings on a bottom surface of the concave portion of the ceramic package.   The light-emitting device according to claim 11, further comprising a third resin body that covers the light-emitting element and is disposed in the recess. Preparing a resin molded body comprising a pair of leads disposed on the bottom surface of the recess, a first resin body forming a side wall of the recess, and a second resin body disposed between the pair of leads; ,
Forming a reflective film on at least the bottom surface of the recess and the entire inner surface of the sidewall of the recess;
Have a, a step of removing the reflective film the reflective film is formed on the pair of leads of the recess in the resin molded body formed,
The step of peeling off the reflective film is a method of manufacturing a package in which a resin molded body on which the reflective film is formed is immersed in an electrolytic solution and current is passed through the resin molded body . The package manufacturing method according to claim 15 , wherein the current is a direct current . The step of peeling the reflective film includes
The resin molded article reflecting film is ^formed, a step of energizing at a current density of ^{500A / m 2 ~3000A / m 2} ,
The method for manufacturing a package according to claim 16 , further comprising a step of removing the reflective film floating on the pair of leads of the resin molded body. The step of forming the reflective film, the prepared resin molding of claims 15 to 17 is immersed in an organic solvent in which the metal oxide having a particle size of 1~100nm is included in the main The manufacturing method of the package as described in any one of Claims. The method of manufacturing a package according to any one of claims 15 to 18 , wherein in the step of forming the reflective film, a reflective film having an average thickness of 10 to 1000 nm is formed on the prepared resin molded body. . Preparing a resin molded body comprising a pair of leads disposed on the bottom surface of the recess, a first resin body forming a side wall of the recess, and a second resin body disposed between the pair of leads; ,
Forming a reflective film on at least the bottom surface of the recess and the entire inner surface of the sidewall of the recess;
Peeling the reflective film formed on the pair of leads in the recess in the resin molded body on which the reflective film is formed;
Placing a light emitting element on at least one of the pair of leads from which the reflective film has been peeled , and
The step of peeling off the reflective film is a method of manufacturing a light emitting device in which a resin molded body on which the reflective film is formed is immersed in an electrolytic solution and current is supplied to the resin molded body . The manufacturing method of the light-emitting device according to claim 20 , further comprising a step of covering the light-emitting element with a third resin after the step of placing the light-emitting element. 21. The method for manufacturing a light emitting device according to claim 20 , further comprising a step of covering the light emitting element with an insulating film and covering the insulating film with a third resin after the step of placing the light emitting element. 23. The method for manufacturing a light emitting device according to claim 22 , wherein the thickness of the insulating film is thinner than the thickness of a third resin body made of the third resin. Method of manufacturing a light emitting device according to the insulation thickness of a film according to claim 22 or claim 23 which is substantially constant.

Images