JP6402890B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

Light-emitting devices using light-emitting elements such as light-emitting diodes or laser diodes are used in many fields including general lighting such as room lighting, in-vehicle lighting, and backlights for liquid crystal displays. The performance demanded of these light emitting devices is increasing day by day, and there is a demand for light emitting diodes with higher output (high luminance) and lower cost.
Also, light emitting diodes with different specifications are required for light emitting devices, and various types of light emitting diodes are provided.

  For example, as a white light emitting diode, a light emitting device in which a blue light emitting diode and a yellow phosphor (such as a YAG phosphor) are combined is used. The light emitting diode is mounted on the wiring board by face-up mounting in which the growth substrate side of the light emitting diode is the mounting surface and the electrodes of the light emitting diode and the wiring board are connected by wires, or flip chip mounting in which the semiconductor layer side is the mounting surface. The light emitting device is configured by being coated with a resin containing a phosphor.

  Here, the light emitting diode may be arranged on a pedestal called a submount. Patent Document 1 discloses a semiconductor light emitting device including a submount on a substrate, a semiconductor light emitting element face-up mounted on the submount, and a reflector provided around the submount and the semiconductor light emitting element. . In this semiconductor light-emitting device, the position and shape of the submount, light-emitting element, and reflector are defined in a cross section perpendicular to the substrate passing through the center of the semiconductor light-emitting element, thereby improving the light extraction efficiency and providing a high-output light-emitting device. It is intended to provide. The submount can be formed of a semiconductor substrate such as silicon, GaP, or GaAs, a transparent substrate such as glass or sapphire, a conductive material, or the like.

JP 2007-184319 A

  However, when a semiconductor light emitting element is mounted face-up on a submount made of a conductive material, the semiconductor light emitting device may be short-circuited when a wire connecting the semiconductor light emitting element and the substrate contacts the submount. .

In view of the above, an object of the present invention is to provide a highly reliable light-emitting device in which a short circuit is unlikely to occur. It is another object of the present invention to provide a light-emitting device in which an insulating member for preventing a short circuit of the light-emitting device is partially formed to reduce material costs and suppress absorption of light emitted from the light-emitting element.
It is another object of the present invention to provide a method for manufacturing a light emitting device that can easily form an insulating member at a desired position.

In order to solve the above problems, a light-emitting device according to the present invention includes:
A light emitting element;
A positive or negative first conductive member;
A positive or negative second conductive member on which the light emitting element is mounted;
A first wire connecting the light emitting element and the first conductive member;
A sealing member that covers the light emitting element and at least a part of the first conductive member and the second conductive member;
The second conductive member has a protruding portion that protrudes upward from a virtual straight line connecting the wire bonding points connected by the first wire in a cross-sectional view,
An upper surface or a side surface of the protrusion is covered with an insulating member.

Moreover, the light emitting device according to the present invention includes:
A light emitting element;
An element mounting member on which the light emitting element is mounted;
A positive or negative first conductive member spaced apart from the element mounting member, and the other positive or negative second conductive member;
A first wire that connects the light emitting element and the first conductive member; a second wire that connects the light emitting element and the second conductive member;
A sealing member that covers the light emitting element, the element mounting member, and at least a part of the first conductive member and the second conductive member;
The element mounting member protrudes above a virtual straight line connecting wire bonding points connected by the first wire and a virtual straight line connecting wire bonding points connected by the second wire in a sectional view. Having a protrusion to
An upper surface or a side surface of the protrusion is covered with an insulating member.

In addition, a method for manufacturing a light emitting device according to the present invention includes:
A light emitting element, a positive or negative first conductive member, a positive or negative second conductive member on which the light emitting element is mounted, and a first connecting the light emitting element and the first conductive member. In a method for manufacturing a light emitting device, comprising: 1 wire; and a sealing member that covers the light emitting element and at least a part of the first conductive member and the second conductive member.
A first step of preparing the second conductive member formed with a protruding portion protruding upward from a virtual straight line connecting wire bonding points connected by the first wire in a cross-sectional view;
A second step of covering an upper surface or a side surface of the protrusion with an insulating member;
After the second step, the third wire includes a third step of connecting the light emitting element and the first conductive member so that the first wire straddles over the insulating member. And

According to the light emitting device of the present invention, it is possible to provide a highly reliable light emitting device in which a short circuit is unlikely to occur. Furthermore, by partially forming an insulating member that prevents a short circuit of the light-emitting device, a light-emitting device in which material cost is reduced and absorption of light emitted from the light-emitting element is suppressed can be provided.
In addition, it is possible to provide a method for manufacturing a light emitting device in which an insulating member can be easily formed at a desired position.

FIG. 1 is a perspective view showing a configuration of a light emitting device 100A according to Embodiment 1 of the present invention. FIG. 2 is a top view showing the configuration of the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 3A is a cross-sectional view showing the configuration of the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 3B is a partially enlarged view of the vicinity of the protruding portion in FIG. FIGS. 3C to 3D are partial enlarged views illustrating protrusions having shapes different from the protrusions in FIG. FIG. 4 shows a configuration of the light-emitting device 100B according to Embodiment 1 of the present invention, and is a cross-sectional view when a light-emitting element is mounted on an element mounting member. FIGS. 5A and 5B are a cross-sectional view and a partially enlarged view of the vicinity of the protruding portion showing the configuration of the light-emitting device according to Embodiment 1 of the present invention. FIG. 6 is a cross-sectional view showing the configuration of the light emitting device according to Embodiment 1 of the present invention, and is a partially enlarged view in the vicinity of the protrusion. FIG. 7 is a partially enlarged view showing the relationship between the position and thickness of the insulating member covering the upper surface of the protruding portion in the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 8 is a perspective view showing the first step in the method for manufacturing the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 9 is a perspective view showing the second step in the method for manufacturing the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 10 is a perspective view showing a third step in the method for manufacturing the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 11 is a cross-sectional view showing a configuration of a light emitting device 200 according to Embodiment 2 of the present invention. 12 (a) and 12 (b) are cross-sectional views illustrating the second step in the method for manufacturing the light emitting device 200 according to Embodiment 2 of the present invention. FIGS. 13A and 13B are cross-sectional views illustrating the configuration of the light-emitting device according to Embodiment 2 of the present invention, illustrating the shape of the insulating member after the second step. 14A to 14D are top views showing the configuration of the light-emitting device according to Embodiment 2 of the present invention. FIG. 14E is a cross-sectional view showing the second step according to FIG. 14A, and FIG. 14F is a cross-sectional view after the second step of FIG. 14D. 14A to 14D are top views before the sealing member is formed. FIG. 15 is a cross-sectional view illustrating a configuration of a light emitting device 300 according to Embodiment 3 of the present invention. 16A to 16C are cross-sectional views of the light emitting device according to the third embodiment of the invention, and are partial enlarged views illustrating an insulating member having a shape different from that of the insulating member in FIG. 17 (a) and 17 (d) are cross-sectional views showing the configuration of the light emitting device 400 according to Embodiment 4 of the present invention. FIG. 17B and FIG. 17C are partially enlarged views illustrating an insulating member having a shape different from that of the insulating member in FIG. FIG. 17E is a partially enlarged view illustrating an insulating member having a shape different from that of the insulating member in FIG.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, the modes described below exemplify a light emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following embodiments. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the mere illustration unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, terms that indicate a specific direction or position as necessary (for example, “up”, “down”, “right”, “left”, “front”, “back”, and other terms including those terms) However, the use of these terms is to facilitate understanding of the invention, and the technical scope of the present invention is not limited by the meaning of these terms. Note that wires for connecting the light emitting elements are omitted in the cross-sectional view of the drawing so that wire bonding points and the like can be easily seen.

Embodiment 1
FIG. 1 is a perspective view illustrating a configuration of a light emitting device 100A according to the first embodiment. 2 is a top view showing the configuration of the light emitting device 100A according to the first embodiment, and FIG. 3 is a cross-sectional view and a partially enlarged view showing the configuration of the light emitting device 100A according to the first embodiment. Hereinafter, the configuration of the light emitting device 100A according to the first embodiment will be described with reference to FIGS.
The light emitting device 100 </ b> A according to the first embodiment is mounted on the first conductive member 11, the second conductive member 12, the protrusion 12 a provided on the second conductive member, and the second conductive member 12. The light emitting element 3, the first wire 4 connecting the light emitting element 3 and the first conductive member 11, the insulating member 5 covering the upper surface 12b of the protrusion, the light emitting element 3, the first conductive member 11, and And a sealing member 6 that covers at least a part of the second conductive member 12. The sealing member 6 covers a substantially dome-shaped lens portion that covers the upper side of the light emitting element, and the first conductive member 11 and the second conductive member 12 around the lens portion, a support base material that will be described later, and the like. And has a buttocks.

In the light emitting device 100A, the first conductive member 11, the second conductive member 12, and the protrusion 12a have conductivity. The protrusion 12 a is a part of the second conductive member 12, and the wire bonding point B of the light emitting element 3 connected by the first wire 4 and the wire bonding point B of the first conductive member 11 in a cross-sectional view. It protrudes above the virtual straight line A connecting “ The virtual straight line A is a straight line that connects the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 with the shortest distance, and is indicated by a one-dot chain line in FIG.
The insulating member 5 of Embodiment 1 covers the upper surface of the protruding portion 12a, and is formed at least between the first wire 4 and the protruding portion 12a.

  As described above, the upper surface 12b (or the side surface 12c) of the projecting portion 12a is covered with the insulating member 5 so that the first wire 4 and the projecting second conductive member 12 that easily contacts the first wire 4 are projected. The direct contact with the portion 12a can be prevented, and a short circuit of the light emitting device can be prevented. Not only can the first wire 4 be prevented from coming into contact with the projecting portion 12a during the wire bonding process, but also the first wire 4 generated by the pressure applied during the formation of the sealing member, the light emitted from the light emitting element 3, and the heat. It is possible to avoid a short circuit due to the bending. The bending of the first wire 4 means that the first wire 4 swings in the vertical direction (the direction of the first conductive member 11).

As shown in FIG. 4, when the light emitting element 3 is mounted on the non-polar element mounting member 13, the effect of preventing the light emitting device from being short-circuited can be obtained. In the light emitting device 100 </ b> B shown in FIG. 4, the first conductive member in which the light emitting element 3 mounted on the element mounting member 13 is a positive or negative conductive member by the first wire 4 and the second wire 7. 11 and the second conductive member 12 are electrically connected. Note that the element mounting member 13 is disposed separately from the first conductive member 11 and the second conductive member 12.
The element mounting member 13 can be, for example, a heat radiating member for efficiently releasing the heat generated in the light emitting element 3 to the outside. In this case, the protruding portion 13 a includes a virtual straight line A connecting the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11, and the wire bonding point D of the light emitting element 3 and the second conductive point. This is a part of the element mounting member 13 that protrudes above the virtual straight line C that connects the wire bonding point D ′ of the member 12. With such a configuration, when the light emitting device 100B shown in FIG. 4 is connected to the mounting substrate with a conductive adhesive such as solder, the first conductive member 11 exposed on the back surface of the light emitting device 100B, the first The two conductive members 12 and the element continuous members 13 may be electrically connected with solder or the like. In this case, for example, when the first wire 4 and the first conductive member 11 (or the second wire 7 and the second conductive member 12) are in direct contact with each other, the light emitting device is short-circuited. By covering the upper surface and / or the side surface of any one of the protrusions 13a with the member 5, it is possible to prevent a short circuit of the light emitting device. Note that the element mounting member 13 does not have to be a heat dissipation member, has a protruding portion 13a, and is electrically connected to the first conductive member 11 and / or the second conductive member 12 when the light emitting device is mounted. There is no particular limitation as long as it is formed of a member having electrical conductivity and having conductivity. In the light emitting device 100B shown in FIG. 4, the first conductive member 11, the second conductive member 12, and the element mounting member 13 are exposed on substantially the same surface on the mounting surface of the light emitting device. It is configured to be easily connected electrically.
Further, since the insulating member 5 is provided in a part of the second conductive member 12, it can be formed with a small amount of material, and the material cost can be reduced. Furthermore, the absorption of the emitted light from the light emitting element 3 can also be suppressed.

Hereinafter, the light emitting device 100 according to Embodiment 1 will be described. The light emitting device 100B according to the first embodiment has a non-polar element mounting member 13 on which the light emitting element 3 is mounted on the upper surface, and the light emitting element 3 is formed by the first wire 4 and the second wire 7. Except for being connected to the first conductive member 11 and the second conductive member 12, and the protruding portion 13 a being a part of the element mounting member 13, it is possible to have substantially the same configuration as the light emitting device 100 </ b> A. Therefore, the description will be omitted as appropriate, and detailed description will be made mainly with reference to each component of the light emitting device 100A.
<First conductive member 11 and second conductive member 12>
The first conductive member 11 is electrically connected to the light emitting element 3 and functions as a positive or negative electrode for supplying electric power from the outside. The second conductive member 12 is mounted with the light emitting element 3 and has a non-polarity that does not contribute to energization of the light emitting element 3, and a case where the second conductive member 12 is a positive or negative electrode that contributes to energization. Any form can be taken. In the first embodiment, a case where the second conductive member 12 functions as a positive or negative electrode will be described.
I am clear.

  In the present embodiment, the lower surfaces of the first conductive member 11 and the second conductive member 12 are exposed on the lower surface of the light emitting device 100A, and form the outer surface of the light emitting device 100A. The shape and size of the first conductive member 11 and the second conductive member 12 as viewed from above are arbitrarily selected according to the size of the light emitting device and the number and size of the light emitting elements to be mounted. Can do.

(First conductive member 11)
As shown in FIG. 3A, the first conductive member 11 of the first embodiment has a wire bonding point B ′ to which the first wire 4 for conducting the light emitting element 3 is connected on the upper surface. . The upper surface of the first conductive member 11 only needs to have at least an area necessary for the wire bonding, and may have fine irregularities, grooves, holes, and the like. Further, in consideration of adhesiveness with the sealing member 6 and the like, the side surface of the first conductive member 11 may be formed with a protrusion that is inclined or separated from the lower surface.

(Second conductive member 12)
The light emitting element 3 is mounted on the upper surface of the second conductive member 12 with an adhesive or the like. As the adhesive, a conductive adhesive such as solder or an insulating adhesive such as epoxy resin or silicone resin can be appropriately selected and used. The wire bonding point B of the mounted light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 are connected by the first wire 4, so that the light emitting element 3 and the first conductive member 11 are connected. Are electrically connected. The second conductive member 12 may further have a wire bonding point to which the second wire 7 for conducting the light emitting element 3 and the second conductive member 12 is connected. On the side surface of the second conductive member 12, as in the first conductive member 11, a protrusion that is inclined or separated from the lower surface may be formed.

The second conductive member 12 has a protruding portion 12a. The projecting portion 12 a is a second conductive member 12 projecting upward from a virtual straight line A connecting the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 in a sectional view. Is part of. In other words, the protruding portion 12a is on the first wire 4 side of the imaginary straight line A and below the first wire 4, and is formed at least in a region across the first wire 4. Therefore, the protruding portion 12 a is a region that is particularly easy to contact with the first wire 4 in the second conductive member 12. In addition, what exists on the virtual straight line A shall also be included in the protrusion part 12a.
The protrusion 12a is constituted by an upper surface 12b and a side surface 12c as shown in FIG. Further, when the protrusion 12a is composed of two or more surfaces in a cross-sectional view, or when it is formed of a curved surface as shown in FIG. 3C, the closest of the protrusion 12a to the first wire 4 is the closest. A surface above the approaching portion P is referred to as an upper surface 12b, and a surface below the closest approaching portion P is referred to as a side surface 12c. The protrusion 12a may have a notch shape as shown in FIG. 3D, or a plurality of protrusions 12a may be formed.

  As shown in FIG. 3, the second conductive member 12 according to the first embodiment has a base 2A (submount) and a lower part around the base 2A, and the light emitting element 3 is an upper surface of the base 2A. To be implemented. By doing so, compared with the case where the pedestal 2A is not provided, the light emitting unit can be closer to the light emitting surface of the light emitting device 100A, and light extraction can be improved. Furthermore, the flange of the sealing member 6 can prevent the extraction of light emitted from the light emitting element 3 from the side from being lowered.

  As shown in FIG. 3B, the protruding portion 12a of the first embodiment is near the corner 2A ′ formed by the upper surface and the side surface of the base 2A, and the corner 2A ′ is connected to the first wire 4 of the protruding portion 12a. It is the closest closest part P. With such a configuration, a step S is formed between the upper surface of the base 2 </ b> A that is the mounting surface of the light emitting element 3 and the wire bonding point B ′ on the upper surface of the first conductive member 11. Due to the step S, the second conductive member 12 and the first wire 4 are easily in contact with each other. As the level difference S is larger, the possibility that the second conductive member 12 and the first wire 4 are in contact with each other increases, and a short circuit of the light emitting device 100A is likely to occur.

The shape of the pedestal 2 </ b> A according to Embodiment 1 in a top view is substantially rectangular, but can have a desired shape as long as it has at least an area where the light emitting element 3 can be mounted. In the first embodiment, the lower surfaces of the first conductive member 11 and the second conductive member 12 are formed on substantially the same surface and exposed on the lower surface of the light emitting device 100A, and the first conductive member 11 and the second conductive member 11 are exposed. The thickness around the base of the conductive member 12 is substantially the same. With such a configuration, heat released from the light emitting element 3 on the upper surface of the base 2A can be effectively radiated to the outside through the base 2A. However, the height and thickness of the lower surfaces of the first conductive member 11 and the second conductive member 12 may be the same or different.
In the first embodiment, the shape in which the vicinity of the corner 2A ′ of the pedestal 2A formed on the second conductive member 12 is the protruding portion 12a is shown, but the protruding portion 12a does not include the corner 2A ′ of the pedestal 2A. It does not have to be based on the pedestal 2A. Other forms of the protrusion 12a will be described in detail in Embodiments 2 to 4.

  The first conductive member 11 and the second conductive member 12 are formed of a conductive material. The first conductive member 11 and the second conductive member 12 are preferably formed of the same material, but different materials may be used. Specific examples of the material include copper, nickel, palladium, tungsten, chromium, titanium, aluminum, silver, gold, iron, and alloys thereof. In particular, a material that can reflect the light emitted from the light emitting element 3 is preferable, and a light reflecting film such as silver, aluminum, rhodium, gold, copper, or an alloy thereof is provided on the surface of the conductive member. Good. These coatings can be provided by plating, vapor deposition, sputtering, printing, coating, or the like. The first conductive member 11 and the second conductive member 12 are made of an insulating material such as resin or ceramics as long as at least the protruding portion 12a of the second conductive member 12 has conductivity. You may have a support base material.

The first conductive member 11 and the second conductive member 12 in the first embodiment are formed of a lead frame. The lead frame is preferable because the pedestal 2A and a recess 2B described later can be easily formed by processing such as pressing, punching, bending, and etching. The thickness, shape, etc. of the lead frame can be appropriately adjusted in consideration of the desired size, shape, etc. of the light emitting device. The pedestal 2A may be formed by processing the lead frame as described above, but may be formed by separately forming a conductive pedestal and disposing it on the second conductive member 12. Absent.
The first conductive member 11 and the second conductive member 12 are not limited to the lead frame, and may be formed by plating or the like. Since the conductive member formed by plating or the like has less thermal expansion than the lead frame, it is preferable that the conductive member is not easily peeled off from the support base material or the sealing member by heat.

<Light emitting element 3>
The light-emitting element 3 mounted on the second conductive member 12 includes at least a first conductive type (n-type) layer and a second conductive type (p-type) layer, and has a semiconductor multilayer structure having an active layer therebetween. It is preferable. The electrode of the light-emitting element 3 is formed by laminating a semiconductor laminated structure on an insulating substrate, and having a bipolar electrode on the upper surface side of the same surface side electrode structure, and a semiconductor laminated structure on a conductive support substrate. It can be set as the counter electrode structure which laminates | stacks and has an electrode of each polarity on the upper and lower surfaces which are the lamination directions. In the present embodiment, the light emitting element 3 having the same surface side electrode structure is used, the insulating substrate side is bonded to the second conductive member 12, and the wire bonding point B of the light emitting element 3 and the first conductive member are bonded by a wire. The member 11 and the wire bonding point of the second conductive member 12 are electrically connected to each other. Alternatively, a light-emitting element having a counter electrode structure is used, and one electrode surface side of the light-emitting element is bonded to the second conductive member with a conductive adhesive, and the wire bonding point of the light-emitting element and the wire of the first conductive member A bonding point may be connected. Note that the insulating substrate of the light-emitting element 3 may be removed, or a structure in which, for example, another insulating substrate is bonded to the semiconductor stacked structure from which the insulating substrate is removed may be employed. The removal of the substrate can be carried out by mounting or holding on a support, device, submount or the like and peeling, polishing, or LLO (Laser Lift Off).

The light emitting element 3 is preferably a semiconductor light emitting element that outputs light having an arbitrary wavelength. In particular, when a GaN-based compound semiconductor is used, visible light and ultraviolet light having a short wavelength that can excite the phosphor efficiently can be emitted. A specific emission peak wavelength is about 300 nm to 560 nm, preferably about 380 nm to 470 nm. In addition, semiconductor light emitting elements such as ZnSe, InGaAs, and AlInGaP may be used.
The number of the light emitting elements 3 to be mounted may be one or plural, and can be freely selected as appropriate in order to realize desired light emission. Further, the shape and size of the light emitting element 3 are not particularly limited.

<Insulating member 5>
The insulating member 5 is made of an insulating material and covers at least a part of the upper surface 12b or the side surface 12c of the protruding portion 12a of the second conductive member 12 described above. It is preferable that the insulating member 5 covers substantially the entire surface of the protruding portion 12a, so that the contact between the second conductive member 12 and the first wire 4 can be more reliably prevented. What is necessary is just to be formed in the position where 12a and the 1st wire 4 do not contact directly. That is, the insulating member 5 covers at least the protruding portion 12a below the first wire 4 (the region of the protruding portion 12a that faces the first wire 4).

  In the first embodiment, the vicinity of the corner 2A ′ of the base 2A is the protruding portion 12a, and the insulating member 5 covers the upper surface 12b of the protruding portion 12a. As described above, the protrusion 12a that is particularly easily in contact with the first wire 4 in the second conductive member 12 is covered with the insulating member 5, thereby effectively preventing the light emitting device 100A from being short-circuited. it can. Furthermore, since the insulating member 5 can be formed with a small amount of material, the material cost can be reduced, and the absorption of light emitted from the light emitting element 3 by the insulating member 5 can be reduced.

Hereinafter, each of the insulating members 5 covering the upper surface 12b and the side surface 12c of the protruding portion 12a will be described.
The insulating member 5 that covers the upper surface 12b of the protruding portion 12a is preferably formed on the side closer to the side surface 12c of the protruding portion 12a. That is, in Embodiment 1, it is so preferable that it is provided on the corner 2A ′ side of the base 2A. That is, in Embodiment 1, if the insulating member 5 on the upper surface 12b covers the corner 2A ′ of the base 2A that is the closest part P, it is easy to avoid a short circuit of the light emitting device 100A. The insulating member 5 on the upper surface 12b does not have to cover the corner 2A ′. If the thickness is adjusted appropriately and at least part of the upper surface 12b of the protruding portion 12a is covered, the second conductive member 12 is covered. It is possible to avoid contact between the first wire 4 and the first wire 4.

Next, the insulating member 5 that covers the side surface 12c of the protruding portion 12a will be described. The insulating member 5 that covers the side surface 12c of the protruding portion 12a is preferably formed on the side closer to the upper surface 12b of the protruding portion 12a. In particular, when the insulating member 5 is formed only on the side surface 12c as shown in FIG. 5, the insulating member 5 is formed to have a height equal to or higher than the upper surface 12b of the protruding portion 12a. By doing so, the corner 2A ′ of the pedestal 2A is covered, and the second conductive member 12 and the first wire 4 are less likely to be in direct contact. When the insulating member 5 is formed only on the side surface 12c of the projecting portion 12a, the light emitted from the light emitting element 3 can be hardly absorbed. That is, as shown in FIG. 5B, by making the insulating member 5 covering the side surface 12c substantially the same height as the pedestal 2A, extraction of light emitted from the light emitting element 3 to the side is not reduced. It is possible to prevent a short circuit of the light emitting device 100A.
The insulating member 5 that covers the upper surface 12b or the side surface 12c of the protruding portion 12a has been described above. However, the insulating member 5 may cover both the upper surface 12b and the side surface 12c of the protruding portion 12a. The insulating member 5 covering both will be described in detail in the second embodiment.

  As long as the insulating member 5 covers at least a part of the protruding portion 12a, the insulating member 5 may cover the second conductive member other than the protruding portion 12a, and covers the upper surface and side surfaces of the base 2A other than the protruding portion 12a. It does not matter. As shown in FIG. 6, the insulating member 5 that covers the second conductive member other than the protruding portion 12a also has the second conductive member 12 and the first wire 4 adjusted by adjusting the thickness and shape thereof. Needless to say, it has the effect of preventing direct contact.

Although the insulating member 5 can be formed in any thickness and shape, the relationship between the particularly preferable thickness and arrangement of the insulating member 5 will be described below.
When the material of the insulating member 5 is resin, it is preferable that the insulating member 5 is formed with a thickness of at least about 10 to 50 μm or more in order to electrically insulate the protruding portion 12a and the first wire 4 from each other. . In Embodiment 1, the upper end portion Q of the insulating member 5 on the wire bonding point B ′ side connects the corner 2A ′ that is the closest portion P and the upper end portion of the light emitting element 3 on the wire bonding point B ′ side. However, if the height is equal to or higher than the imaginary straight line Y, the contact between the protruding portion 12a and the first wire 4 can be prevented more reliably. The virtual straight line Y is indicated by a two-dot chain line in FIG. That is, it is preferable that the insulating member 5 covering the upper surface 12b of the protruding portion 12a of the first embodiment is thicker as it is located farther from the closest portion P. Similarly, the insulating member 5 covering the upper surface 12b can be made thinner as it is closer to the closest part P (see FIG. 7). Forming the insulating member 5 thin is preferable because it reduces the material cost and further suppresses the absorption of the emitted light from the light emitting element 3.

  The material of the insulating member 5 is preferably a resin, and examples thereof include silicone resin, epoxy resin, phenol resin, fluorine resin, polyolefin resin, polynorbornene resin, BT resin, PPA, PET, PBT and the like. In particular, a silicone resin that is excellent in insulation, heat resistance, and light resistance and has good adhesion to the second conductive member 12 such as metal is preferably used. In addition, glass, an inorganic substance, etc. can also be used. Specifically, a glass plate, a single crystal body, a polycrystal body, an amorphous body, a ceramic body, etc. are mentioned. Furthermore, the insulating member 5 is preferably a white member having high light reflectivity. For example, it is particularly preferable that a reflecting member such as zinc oxide, titanium oxide, aluminum oxide, zirconium oxide, or magnesium oxide is added. Other reflective members may be added to the insulating member 5, and particles having various functions (for example, a diffusing agent, a coloring agent, etc.) may be added. Specific examples include silica, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, barium titanate, iron oxide, chromium oxide, manganese oxide, glass, and carbon black.

Further, the insulating member 5 may contain a phosphor. For example, nitride phosphors and oxynitride phosphors mainly activated by lanthanoid elements such as europium and cerium, more specifically, α or β sialon phosphors activated by europium, various alkalis Earth metal nitride silicate phosphors, lanthanoid elements such as europium, alkaline earth metal halogenapatite phosphors mainly activated by transition metal elements such as manganese, alkaline earth halosilicate phosphors, alkaline earth metals Silicate phosphor, alkaline earth metal halogen borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkaline earth metal nitride Rare earth aluminate mainly activated by lanthanoid elements such as silicon, germanate, cerium, Examples thereof include organic substances and organic complexes mainly activated with lanthanoid elements such as rare earth silicates or europium. In particular, a YAG (Yttrium Aluminum Garnet) phosphor that emits white light when combined with a blue light emitting element is preferably used. Moreover, KSF etc. which are red fluorescent substance can also be used. In addition, phosphors having similar performance and effects can be used as appropriate. As described above, it is preferable to include a phosphor capable of converting the wavelength of at least a part of the light emitted from the light emitting element 3 because the light emitting device 100A can have a desired emission color.
In particular, when the insulating member 5 is a sheet-like resin, the phosphor can be contained in the sheet-like resin. For example, two or more sheet-like resins are prepared, and those sheet-like resins are prepared. Can be sandwiched between. By doing so, it is possible to mitigate deterioration due to heat from the light emitting element even if a phosphor or the like that is relatively weak against heat is used.

<Sealing member 6>
The sealing member 6 covers the light emitting element 3 and is provided so as to cover at least a part of the first conductive member 11 and the second conductive member 12. Protect from moisture, external force, etc. The sealing member 6 may be composed of a plurality of layers. The sealing member 6 composed of a plurality of layers will be described in detail in Embodiment 4.

  The sealing member 6 can be formed by, for example, transfer molding. It is preferable to form the sealing member 6 (the outermost sealing member in the case where the sealing member 6 is composed of a plurality of layers) into an arbitrary shape by transfer molding because desired directivity can be realized. The formation of the sealing member 6 is not limited to transfer molding, and may be formed by a dropping method or the like.

  The material of the sealing member 6 is preferably a translucent resin, such as a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, or a hybrid containing at least one of these resins. Resin or the like is preferably used, and glass may be used. In particular, a silicone resin is preferable because it is excellent in heat resistance and light resistance. Particles having various functions such as a diffusing agent, a colorant, and a phosphor may be added to the sealing member 6. Specifically, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass And carbon black. As the phosphor, the above-mentioned phosphors can be used, and they may be appropriately provided not only in the sealing member but also between the members, or may be allowed to settle.

<Wire>
The light emitting device 100A according to the first embodiment electrically connects the first wire 4 that electrically connects the light emitting element 3 and the first conductive member 11, and the light emitting element 3 and the second conductive member 12. And a second wire 7. When the light emitting element 3 having the counter electrode structure is used, the second wire 7 may not be provided. In addition, the wire which connects between the light emitting elements 3 is abbreviate | omitted in sectional drawing in drawing.
As a material of the wire, gold, copper, silver, platinum, aluminum, or a metal wire of these alloys can be used. In particular, gold that is less likely to break due to stress from the sealing member 6 and is excellent in thermal resistance or the like is preferable. In order to enhance light extraction, it is preferable that at least the surface is made of silver.
The first wire 4 connects the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 and is formed to extend above the insulating member 5. The second wire 7 connects the wire bonding point of the light emitting element 3 and the wire bonding point of the second conductive member 12. The second wire 7 is also preferably formed so as to extend above the insulating member 5.

<Method for Manufacturing Light Emitting Device 100A of Embodiment 1>

  Hereinafter, a method for manufacturing the light emitting device 100A of Embodiment 1 will be described with reference to FIGS.

(First step)
First, a lead frame that is a conductive member of Embodiment 1 is prepared. The lead frame includes a plurality of positive or negative first conductive members 11 and second conductive members 12, and is supported while maintaining a predetermined positional relationship.
The second conductive member 12 is formed to be larger than the first conductive member 11, and a base 2A for mounting the light emitting element 3 is formed on the upper surface. The pedestal 2A according to the first embodiment can be formed in, for example, a substantially rectangular shape having a top view of about 2500 × 2500 μm. The second conductive member 12 can be formed with a thickness of about 350 μm of the pedestal 2 </ b> A and a thickness of about 250 μm around the pedestal 2 </ b> A so as to have a protrusion 12 a described later. Therefore, in the case of the above condition, a step S of about 350 μm is formed between the upper surface of the pedestal 2A serving as the mounting surface of the light emitting element 3 and the upper surface of the first conductive member 11 having the wire bonding point B ′. Exists. The side surface of the pedestal 2A may have an inclination. In addition, you may form the support base material which hold | maintains the 1st conductive member 11 and the 2nd conductive member 12 in a predetermined position as needed.

(Second step)
Next, the part which becomes the protrusion part 12a with the insulating member 5 is covered. In the second step of the first embodiment, a sheet-like resin (for example, about 100 × 2500 μm) formed in advance on the upper surface of the pedestal 2A on the first conductive member 11 side (the side on which the first wire 4 straddles) is formed. Insulating member 5 is formed as shown in FIG. 9 by disposing a sheet-like resin having a thickness of about 50 μm and a Shore A hardness of 41 or the like. When the insulating member 5 is partially formed on the second conductive member 12, it is most preferable to use a sheet-like resin. That is, the sheet-like resin can be processed into a desired shape in advance, and can be easily attached to a desired position and region of the second conductive member 12 without using an adhesive or the like. In addition, although sheet-like resin can be affixed without using an adhesive agent, the direction which adhere | attaches using an adhesive agent can hold the insulating member 5 in a desired position reliably. In addition, the insulating member 5 can be accurately formed on the protrusion 12a by spraying or the like. The insulating member 5 may be formed by discharging a resin whose viscosity is adjusted with a dispenser or the like, or may be formed by adhering an insulating member processed in advance into a desired shape with an adhesive or the like. . It can also be formed by molding, transfer or the like. In addition, it may be formed by printing or a 3D printer.
In the first embodiment, the sheet-like resin is disposed on the upper end of the base 2A so that the insulating member 5 covers the corner 2A ′ of the base 2A. As described above, when the sheet-like resin is used, it is possible to easily form the insulating member 5 at a position difficult to form with the liquid resin.

  Note that this second step may be performed either before or after the step of mounting the light emitting element 3 on the second conductive member 12. In the first embodiment, a semiconductor multilayer structure is stacked on an insulating substrate, the light emitting element 3 having the same electrode structure is used, and the insulating substrate side is mounted on the pedestal 2A with an adhesive. In the first embodiment, for example, the light emitting elements 3 having a top view of about 460 × 460 μm and a thickness of about 150 μm can be used, and nine light emitting elements 3 are mounted in a matrix of 3 rows × 3 columns.

  Here, the protruding portion 12 a is a portion protruding from a virtual straight line A connecting the wire bonding point B on the mounted light emitting element 3 and the wire bonding point B ′ on the first conductive member 11. Accordingly, the distance in the height direction (y-axis direction) between the wire bonding point B on the light emitting element 3 and the wire bonding point B ′ on the first conductive member 11 (for example, the thickness of the light emitting element 3 is about 150 μm + the pedestal). By calculating the thickness (about 350 μm) and the separation distance (about 1600 μm) in the x-axis direction perpendicular to the height direction, the region of the protruding portion 12 a can be defined in a sectional view. That is, according to the above conditions, the protrusion 12a in the cross-sectional view of the first embodiment is a region having an upper surface 12b of about 50 μm and a side surface 12c of about 50 μm including the corner 2A ′ of the pedestal 2A. Sheet-like resin is arrange | positioned so that the lower part which the wire 4 straddles may be coat | covered.

(Third step)
After forming the insulating member 5 in the second step, the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 are connected by the first wire 4 in the third step. Further, the wire bonding point of the light emitting element 3 and the wire bonding point of the second conductive member 12 are appropriately connected by the second wire 7. The first wire 4 is wire-bonded so as to straddle the insulating member 5.
In the first embodiment, a gold wire having a diameter of about 25 μm can be used. For example, for the light emitting elements 3 constituting one row as shown in FIG. 10, the light emitting element 3 adjacent to the electrode of the light emitting element 3 at one end. The same electrodes are sequentially connected by wires, and finally connected from the wire bonding point B of the light emitting element 3 to the wire bonding point B ′ of the first conductive member 11. On the other hand, the other electrodes of the light emitting element 3 are similarly connected sequentially by wires, and finally connected from the wire bonding point of the light emitting element 3 to the wire bonding point of the second conductive member 12. The above wire bonding is performed for all rows, and the positive electrodes and the negative electrodes of all the light emitting elements 3 are electrically connected to the first conductive member 11 and the second conductive member 12, respectively. Not only this but if each light emitting element and each electrically-conductive member can be connected, it can wire-bond suitably freely.

  After the third step, the sealing member 6 that covers the light emitting element 3, the first wire 4, the second wire 7, and part of the first conductive member 11 and the second conductive member 12 is appropriately provided. It is formed by a desired shape and method. The sealing member 6 of Embodiment 1 is formed by transfer molding using a silicone resin, and is formed in a substantially dome shape having a collar portion. In addition, by using a resin having a large contact angle with respect to the conductive member and increasing the viscosity of the resin to increase the amount of dripping, the dome-shaped sealing member 6 formed by transfer molding by the dropping method may be formed. Is possible. Finally, the lead frame and the sealing member 6 are cut into individual pieces for each light emitting device 100A to complete the light emitting device 100A.

When the light emitting device 100A is manufactured as described above, it is possible to prevent the second conductive member 12 and the first wire 4 from coming into direct contact during wire bonding in the third step, and the light emitting device 100A. Can prevent short circuit. Furthermore, since the insulating member 5 can be easily formed on a part of the second conductive member 12, the material cost can be reduced, and the absorption of the emitted light from the light emitting element 3 can be suppressed. .
Although the insulating member 5 and the first wire 4 of the light emitting device 100A are separated from each other, the light emitting element 3 and the first conductive member 11 are electrically connected by the first wire 4, and the first As long as the two conductive members 12 and the first wire 4 are electrically insulated, the insulating member 5 and the first wire 4 may be in contact with each other.

<< Embodiment 2 >>
In the light emitting device 200 according to the second embodiment, as illustrated in FIG. 11, the protrusion 12 a is a part of the recess 2 </ b> B of the second conductive member 12. Furthermore, the insulating member 5 covers the upper surface 12b and the side surface 12c of the protruding portion 12a, that is, the vicinity of the edge 2B ′ of the recess 2B. Other than that, the configuration is substantially the same as that of the light-emitting device 100A of Embodiment 1, and the description thereof is omitted as appropriate.

  The first conductive member 11 and the second conductive member 12 of the second embodiment are lead frames as in the first embodiment. In the second embodiment, the second conductive member 12 has the recess 2B, and the light emitting element 3 is mounted on the bottom surface of the recess 2B. The recess 2B can be formed by bending the lead frame. By forming the recess 2B, the emitted light from the light emitting element 3 can be efficiently reflected upward by the side wall of the recess 2B, and the light extraction of the light emitting device 200 can be improved. In order to reflect light efficiently, the side wall of the recess 2B may be inclined so as to spread upward. In the second embodiment, the lower surface of the first conductive member 11 and the lower surface of the concave portion 2B of the second conductive member 12 are arranged so as to be substantially the same plane, and the first conductive member 11 and the second conductive member 11 Between the conductive members 12, a support base material that supports them is formed.

  The first wire 4 connects the wire bonding point B of the light emitting element 3 mounted in the recess 2 </ b> B and the wire bonding point B ′ of the first conductive member 11. In Embodiment 2, since the bottom surface of the recess 2B, which is the mounting surface of the light emitting element 3, and the top surface of the first conductive member 11 are substantially on the same plane, the difference in height between the wire bonding points BB ′. Substantially corresponds to the thickness of the light emitting element 3. However, since the first wire 4 is configured to straddle the step S due to the side wall of the recess 2B, it is particularly easy to come into contact with the protruding portion 12a.

  The protrusion 12a of the second embodiment is a part of the recess 2B that protrudes above the virtual straight line A (on the first wire 4 side), and the upper surface of the side wall of the recess 2B is the upper surface 12b of the protrusion 12a and the recess 2B. The side surface of the side wall is the side surface 12c of the protruding portion 12a. The insulating member 5 of Embodiment 2 is formed over the upper surface 12b and the side surface 12c of the protrusion 12a as shown in FIG. As described above, it is preferable that the insulating member 5 is provided over the upper surface 12b and the side surface 12c of the protruding portion 12a because the second conductive member 12 and the first wire 4 are difficult to contact directly.

<Method for Manufacturing Light-Emitting Device 200 of Embodiment 2>
Hereinafter, the second step of the method for manufacturing the light emitting device 200 according to Embodiment 2 will be described with reference to FIG. In addition, about the 1st process of preparing the 1st conductive member 11 and the 2nd conductive member 12, and the 3rd process of connecting a light emitting element and a 1st conductive member, 100 A of light-emitting devices of Embodiment 1 are used. Since it can be substantially the same as the manufacturing method, it is omitted as appropriate.

  In the second embodiment, the insulating member 5 is formed over the upper surface 12b and the side surface 12c of the protruding portion 12a. Such an insulating member 5 is formed in the second step by, for example, disposing the sheet-like resin so as to protrude from the upper surface of the side wall of the recess 2B to the opening side of the recess 2B as shown in FIG. it can. That is, a part of the sheet-like resin is disposed on the upper surface of the side wall of the recess 2B, and the remaining part is disposed so as to protrude toward the opening side of the recess 2B. Then, the upper surface 12b and the side surface 12c of the projecting portion 12a are deformed by using the flexibility of the sheet-like resin so as to cover the side surface of the concave portion 2B so as to cover the side surface of the concave portion 2B. Can be formed. Thus, when forming the insulating member 5, the upper surface 12b and the side surface 12c of the protrusion part 12a can be coat | covered, without increasing the number of processes. The sheet-like resin of Embodiment 2 can have a top view of about 100 × 100 μm, a thickness of about 50 μm, and a Shore A hardness of about 41 to 56, for example.

In addition, the insulating member 5 formed over the upper surface 12b and the side surface 12c of the projecting portion 12a is made of sheet-like resin as shown in FIG. 12B. The upper surface 12b of the projecting portion 12a (preferably the end of the upper surface 12b of the projecting portion 12a). It is also possible to form the resin by placing it on the substrate 12, melting it by applying heat, and dripping the molten resin onto the side surface 12 b. If formed in this way, the insulating member 5 can be formed so as to cover the upper surface 12b and the side surface 12c of the protruding portion 12a simultaneously with the step of thermosetting the sheet-like resin.
In the formation of the insulating member 5 by the flexibility of the sheet-like resin or sagging, the insulating member 5 may not be completely in close contact with the side surface 12c as shown in FIG. Moreover, even if it forms so that a part of insulating member 5 may protrude to the opening side of the recessed part 2B like the insulating member 5 shown by FIG.13 (b), the 2nd conductive member 12 and 1st are similarly formed. The wire 4 is difficult to be in direct contact.

  In the second embodiment, the configuration in which the insulating member 5 covers the upper surface 12b and the side surface 12c of the protruding portion 12a is shown. However, as shown in the first embodiment, only the upper surface 12b of the protruding portion 12a is covered. Alternatively, only the side surface 12c may be covered. Further, as long as the insulating member 5 covers at least a part of the protruding portion 12a, the insulating member 5 may cover other than the protruding portion 12a.

  One insulating member 5 or a plurality of insulating members 5 may be formed. For example, the insulating member 5 in FIG. 14A is integrally formed and covers the entire edge 2B 'of the recess 2B. By doing so, the contact between the second conductive member 12 and the wires 4 and 7 can be more reliably prevented, and a highly reliable light-emitting device can be obtained. Furthermore, by providing the integral insulating member 5 around the light emitting element 3, the light emitted from the light emitting element 3 by the insulating member 5 is likely to be absorbed almost uniformly, and the light emitting device 200 with reduced luminance unevenness can be obtained. . In this case, it is more preferable that the thickness of the insulating member 5 is substantially uniform.

For example, as shown in FIG. 14 (e), such an insulating member 5 has a hole that is smaller than the opening of the recess 2 </ b> B in advance, and is molded with a sheet-like resin whose outer periphery is larger than the opening of the recess 2 </ b> B. It can form easily by arrange | positioning so that it may coat | cover. The hole is preferably substantially concentric with the opening of the recess 2B.
Further, if a sheet-like resin having a hole smaller than the opening of the recess 2B and having an outer periphery smaller than the opening of the recess 2B is formed and arranged, the insulating member 5 that covers only the side surface 12c of the protrusion 12a is formed. It is also possible. Furthermore, if a sheet-like resin having a hole larger than the opening of the recess 2B and having an outer periphery larger than the opening of the recess 2B is formed and arranged, only the upper surface 12b of the protruding portion 12a as shown in the first embodiment is provided. It is also possible to form the insulating member 5 covering the film.

  When the first wire 4 and the second wire 7 are provided, the insulating member 5 may be disposed below each wire as shown in FIG. By doing so, the brightness | luminance of a light-emitting device becomes easy to become uniform rather than the case where only the protrusion part which one wire straddles like the insulating member 5 of Embodiment 1. FIG. Furthermore, the insulating member 5 can be formed with less material than the insulating member 5 that covers substantially the entire edge 2B 'as shown in FIG. Moreover, when it has several 1st wire 4 (and 2nd wire 7), you may form several insulation member 5 under each wire like FIG.14 (c). By doing so, the material cost of the insulating member 5 can be further reduced, and further, the absorption of the emitted light from the light emitting element 3 by the insulating member 5 can be suppressed. 14D and 14F, both the insulating member 5 that covers the upper surface 12b of the protrusion 12a and the insulating member 5 that covers the side surface 12c are formed below the wire. May be.

<< Embodiment 3 >>
The light emitting device 300 according to Embodiment 3 has a protruding portion 12a as shown in FIG. The protruding portion 12 a of the third embodiment is a part of the convex portion 2 </ b> C provided between the light emitting element 3 and the first conductive member 11 in the second conductive member 12. The convex portion 2 </ b> C can be provided as a dam for preventing, for example, an adhesive for mounting the light emitting element 3 on the second conductive member 12 from flowing in the direction of the first conductive member 11. In this case, the convex portion 2C can be provided along an end portion of the second conductive member 12 facing the first conductive member 11 in a top view, for example. In addition, as long as it has the protrusion part 12a, you may provide the convex part 2C which has a desired effect suitably. Also, the formation position is not particularly limited as long as it is formed on the second conductive member 12 and in the region where the first wire 4 straddles.
When the projecting portion 12a is composed of the projecting portion 2C, the thickness of the insulating member 5 is adjusted as appropriate and formed on a part of the upper surface 12b of the projecting portion 12a as shown in FIG. Direct contact with the wire 4 can be prevented. Further, the insulating member 5 of the third embodiment may be formed so as to cover the upper surface and the middle of the side surface of the convex portion 2C as shown in FIG. 16A, or as shown in FIG. Alternatively, the projection 2C may be entirely covered. In addition, the insulating member 5 can be formed so as to cover the periphery of the convex portion 2C as shown in FIG. 16C, and can be freely formed as long as it covers at least a part of the protruding portion 12a. it can. Other than that, it can be set as the structure similar to light-emitting device 100A, 200 of Embodiment 1 and Embodiment 2, and description is abbreviate | omitted suitably.

<< Embodiment 4 >>
As shown in FIG. 17, in the light emitting device 400 of Embodiment 4, the sealing member 6 is composed of a plurality of layers. Other than that, it can be set as the structure similar to light-emitting device 100A, 200 of Embodiment 1 and Embodiment 2, and description is abbreviate | omitted suitably.
For example, the light emitting device 400 of Embodiment 4 shown in FIG. 17A includes a first sealing member 6a covering the light emitting element 3 and the base 2A, the first sealing member 6a, and the wires 4 and 7. And a second sealing member 6b covering the surface. Further, in the sealing member 6 shown in FIG. 17B, the concave portion 2B formed by the second conductive member 12 is filled with the first sealing member 6a, and the first sealing member 6a and A second sealing member 6 b that further covers the wires 4 and 7 is formed.

With the two-layer configuration as described above, the first wire 4 is fixed by both the first sealing member 6a and the second sealing member 6b, so that light, heat, and external force from the light emitting element 3 are used. The wire is less likely to be bent, and a short circuit of the light emitting device 400 is less likely to occur. Furthermore, when the phosphor is contained only in the first sealing member 6a, the wavelength conversion of the emitted light from the light emitting element 3 can be performed efficiently, and the wavelength converted light can be extracted with good directivity.
Further, as described above, when the insulating member 5 is formed of a sheet-like resin and contains a phosphor (or the phosphor is sandwiched between a plurality of sheet-like resins), the insulating member 5 is contained in the first sealing member 6a. If the phosphor and the phosphor contained in the insulating member 5 are different, the color rendering property of the light emitting device can be improved. For example, a sheet-like resin in which a blue light emitting element (emission wavelength of about 430 to 490 nm) and / or a green light emitting element (emission wavelength of about 490 nm to 570 nm) or the like is mounted on the pedestal 2A, and a CASN phosphor is contained, When the first sealing member 6a containing the YAG-based phosphor is formed so as to cover the corner 2A ', a light emitting device that emits white light with good color rendering properties can be obtained. In addition, the light emitting color of the light emitting element to be used and the phosphor to be contained in the first sealing member 6a and the insulating member 5 can be freely selected as appropriate to obtain a light emitting device having a desired light emitting color. In addition, when it has the some insulating member 5, you may make each insulating member 5 contain a different fluorescent substance.

Further, when the first sealing member 6a is formed by the dropping method, if the formation range of the insulating member 5 is adjusted, the pedestal 2A formed of metal or the like and the insulating member 5 formed of resin or the like are wetted. By utilizing the difference in sex, the first sealing member 6a can be easily held at a desired position. For example, when the insulating member 5 is formed on the upper surface 12b of the protruding portion 12a along substantially all the corners 2A ′ of the base 2A, the surface tension of the first sealing member 6a works, and the first member as shown in FIG. 1 sealing member 6a can be formed easily. Similarly, as shown in FIG. 17B, the first sealing member 6 is formed at a desired position by forming the insulating member 5 that covers substantially all the edges 2B ′ of the recess 2B. Is possible.
As described above, when the outer edge of the first sealing member 6a is defined by the insulating member 5, it is preferable that the insulating member 5 is integrally formed so as to surround the base 2A or the recess 2B. Further, when the first sealing member 6a covers the protruding portion 12a, the first wire 4 is difficult to bend toward the protruding portion 12a, so that the insulating member 5 is outside the protruding portion 12a (or the protruding portion 12a). It is preferable to form the outer side.

  In the fourth embodiment, the sealing member 6 composed of two layers is shown. However, the sealing member 6 may be composed of two or more layers. Moreover, as shown in FIGS. 17C and 17D, the insulating member 5 may be formed on the side surface 12c of the protrusion 12a (the side surface of the base 2A). With such a configuration, the outer edge of the dropped first sealing member 6a is held by the insulating member 5, so that the first sealing member 6a is formed even on the side surface of the base 2A. By doing so, when the 1st sealing member 6a contains fluorescent substance, the area | region where the light by which wavelength conversion was carried out radiate | emits can be enlarged. Moreover, if it forms in the side surface 12c (side surface of the side wall of the recessed part 2B) of the protrusion part 12a like FIG.17 (e), without making the 1st sealing member 6a flow out from the recessed part 2B, it will be reliably in the recessed part 2B. It is also possible to stay.

  As mentioned above, although several embodiments according to the present invention have been illustrated, the present invention is not limited to the above-described embodiments, and it is needless to say that any embodiment can be used without departing from the gist of the present invention. .

100A, 100B, 200, 300, 400 ... light emitting device 11 ... first conductive member 12 ... second conductive member 13 ... element mounting member 12a ... projecting portion 12b ... upper surface 12c ... (of projecting portion) ) Side surface 2A ... pedestal 2A '... corner 2B ... concave portion 2B' ... edge 2C ... convex portion 2C '... corner 3 ... light emitting element 4 ... first wire 5 ... insulating member 6 ... sealing member 6a ... first sealing Member 6b ... second sealing member 7 ... second wires B, B ', D, D' ... wire bonding points A, C, Y ... virtual straight line P ... closest part Q ... point B 'side of insulating member Upper end S ... step

Claims (10)

A light emitting device having a first conductivity type layer and a second conductivity type layer having a polarity different from that of the first conductivity type layer;
A first conductive member;
A second conductive member comprising a pedestal on which the light emitting element is mounted;
A first wire connecting the first conductive type layer or the second conductive type layer of the light emitting element and the first conductive member;
A sealing member that covers the light emitting element and at least a part of the first conductive member and the second conductive member;
The pedestal has a protruding portion that protrudes upward from a virtual straight line connecting wire bonding points connected by the first wire in a cross-sectional view on at least a part of an upper surface and a side surface of the pedestal,
All of the outer periphery of the upper surface of the pedestal or all of the outer periphery of the side surface including the protruding portion is covered with an insulating member,
The sealing member covers a region surrounded by the insulating member of the pedestal, and covers the light emitting element and a part of the first wire, and a first sealing member,
And a second sealing member that covers the first sealing member and covers another part of the first wire.   The light emitting device according to claim 1, wherein the insulating member includes a reflective member.   The light emitting device according to claim 1, wherein the sealing member has a substantially dome shape having a flange portion. A second wire connecting the light emitting element and the second conductive member;
The light emitting device according to any one of claims 1 to 3, wherein the protruding portion protrudes above a virtual straight line connecting wire bonding points connected by the second wire.   The light emitting device according to claim 1, wherein an upper surface and a side surface of the protruding portion are covered with an insulating member.   The light emitting device according to claim 1, comprising a plurality of the insulating members.   The light emitting device according to claim 1, wherein the insulating member is a resin. A second light emitting element having a first conductive type layer and a second conductive type layer having a polarity different from that of the first conductive type layer; a first conductive member; and a second base on which the light emitting element is mounted. A conductive member; a first wire connecting the first conductive type layer or the second conductive type layer of the light emitting element; and the first conductive member; the light emitting element; and the first conductive member. And a sealing member that covers at least a part of the second conductive member,
In the pedestal, a second protrusion is formed on at least a part of an upper surface and a side surface of the pedestal so as to protrude above an imaginary straight line connecting wire bonding points connected by the first wire in a sectional view. A first step of preparing a conductive member of
A second step of covering the entire outer periphery of the upper surface of the pedestal or the entire outer periphery of the side surface with the insulating member, including the protruding portion;
After the second step, a third step of connecting the light emitting element and the first conductive member so that the first wire straddles above the insulating member;
After the third step, a region surrounded by the insulating member of the pedestal is covered to form a first sealing member that covers the light emitting element and a part of the first wire. Process,
Forming a second sealing member that covers the first sealing member and covers another part of the first wire;
A method for manufacturing a light-emitting device, comprising:   The method for manufacturing a light emitting device according to claim 8, wherein in the second step, the insulating member uses a sheet-like resin.   The method for manufacturing a light-emitting device according to claim 9, wherein, in the second step, heat is applied after the sheet-like resin is arranged.

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