JP6098255B2 - Surface mount type piezoelectric oscillator - Google Patents

Description

  The present invention relates to a surface-mount piezoelectric oscillator in which a piezoelectric vibration element and an integrated circuit element are mounted on an insulating base, and particularly to improve the package structure of a surface-mount piezoelectric oscillator.

  A piezoelectric oscillator using a piezoelectric vibration element such as a quartz diaphragm can stably obtain a highly accurate oscillation frequency, and is therefore used in various fields as a reference frequency source for electronic devices and the like. In a surface-mounted piezoelectric oscillator, a ceramic multilayer substrate is used as an insulating base, an integrated circuit element such as an oscillation circuit is disposed in a housing portion of the base, and a crystal diaphragm is supported and fixed above the integrated circuit element. , Hermetically sealed with a lid. Such a configuration has a relatively small number of parts due to customization of a one-chip integrated circuit element incorporating an inverter amplifier (oscillation amplifier) such as a C-MOS, contributing to cost reduction. Yes.

  In such a surface mount type piezoelectric oscillator, since it can be reduced in size and height as compared with wire bonding, as shown in Patent Document 1, a pad of an integrated circuit element is formed on a wiring pattern of a ceramic base housing portion. Recently, flip-chip bonding is frequently performed by ultrasonic thermocompression bonding using metal bumps such as gold.

JP 2001-291742 A

  By the way, there are various materials for circuit boards on which the surface-mounted piezoelectric oscillator as described above is mounted by soldering. Depending on this material, a difference in thermal expansion occurs between the package and the circuit board, and stress is also generated in the solder joining the package and the circuit board, so that cracks may occur. In particular, when a ceramic material such as alumina is used as the package and a glass epoxy substrate is used as the circuit board, the thermal expansion coefficient of the circuit board is larger than the thermal expansion coefficient of the package, and fatigue damage from solder is caused. It tends to occur. Further, when an impact is applied to the package and the circuit board, there is a problem that peeling occurs from a solder crack portion.

  With respect to such a solder crack problem, it is becoming difficult to cope with the reduction in the area of the external terminal as the surface-mounted piezoelectric oscillator is downsized. In particular, in a piezoelectric oscillator that has a large number of functioning external terminals and a variety of roles for each functioning external terminal as compared to a piezoelectric vibrator, not only the area of the external terminal but also the role of each external terminal. Since there is a restriction on the arrangement according to the current situation, it is becoming more difficult to deal with the situation.

  Accordingly, in order to solve the above-described problems, an object of the present invention is to provide a more reliable surface-mount piezoelectric oscillator that can cope with solder cracks while reducing the size.

In order to achieve the above object, according to a first aspect of the present invention, there is provided a piezoelectric vibration in which an integrated circuit element incorporating an oscillation amplifier and a pair of excitation electrodes connected to the integrated circuit element are formed. An element and a rectangular ceramic substrate are stacked to form a storage portion and an exterior portion, and a plurality of wiring patterns formed in the storage portion and an external portion formed in the exterior portion and connected to a part of the wiring pattern There are insulating bases having terminals, and six external terminals are formed at the center of the square and long side on the bottom surface of the base exterior portion, and on one long side of the bottom surface of the base exterior portion. In the two corners in contact with each other, a power external terminal and an output external terminal as mounting external terminals are formed to face each other, and in a state separated from one long side of the bottom surface of the exterior portion of the base, Between the external terminal for power supply and the external terminal for output Includes a first measurement external terminal connected to the excitation electrode of the piezoelectric vibration element on the output side of the oscillation amplifier of the integrated circuit element, and one long side of the bottom surface of the exterior portion of the base A data input / output terminal for data adjustment of the integrated circuit element is formed on the side surface in the long side direction of the base exterior portion in a state separated from the base, and the other length of the bottom surface of the base exterior portion is formed. In the two corners in contact with the side, a grounding external terminal as an external terminal for mounting and another external terminal are formed facing each other, and in a state separated from the other long side of the bottom surface of the exterior portion of the base A data control terminal for data adjustment of the integrated circuit element is formed between the ground external terminal and the other external terminal, and is separated from the other long side of the bottom surface of the exterior portion of the base In the state, the long side direction of the exterior part of the base A second measurement external terminal connected to the excitation electrode of the piezoelectric vibration element on the input side of the oscillation amplifier of the integrated circuit element is formed on the side surface, and a bonding material is used for the mounting external terminal. In addition to bonding to the circuit board wiring pattern, the data control terminal is also bonded to only the ground wiring pattern of the circuit board using a bonding material.

With the above configuration, the data control terminal for data adjustment of the integrated circuit element, which is used only in the manufacturing stage of the surface mount piezoelectric oscillator and is not necessary on the user side when used as a product, is a wiring pattern for grounding a circuit board Since a connection material is used for the connection, an unnecessary voltage is not applied to the data control terminal , so that the data of the integrated circuit element is not rewritten. The product can be used not only as a mounting external terminal necessary on the user side as a surface-mounted piezoelectric oscillator, but also as an external terminal for reinforcing the connection when the data control terminal is mounted on a circuit board. In other words, even if the data control terminal is unstable in a state where data can be input and output at the time of manufacture, the external terminal for stable joint reinforcement that cannot rewrite data when the data control terminal is mounted on a circuit board Can be reused as It is not necessary to provide an external terminal for reinforcing the connection separately, and the role of each functioning external terminal is not changed, and it is possible to deal with restrictions on arrangement of the external terminals according to the standard. As described above, it is possible to obtain a more reliable external terminal connection structure that can cope with solder cracks while reducing the size.

  In addition, a power supply external terminal and an output external terminal are opposed to each other at two corners in contact with one long side of the bottom surface of the base exterior portion, and the base is between the external terminals. A first measurement external terminal connected to the excitation electrode of the piezoelectric vibration element on the output side of the oscillation amplifier of the integrated circuit element in a state separated from one long side of the bottom surface of the exterior portion of the integrated circuit element; The excitation electrode of the piezoelectric vibration element on the input side of the oscillation amplifier of the integrated circuit element is disposed on the side surface in the long side direction of the base exterior part while being separated from the other long side of the bottom surface of the base exterior part. Is connected to the input side (gate side G) of the oscillation amplifier that is likely to amplify unwanted noise and adversely affect the electrical characteristics of the piezoelectric oscillator. Whether the second measurement external terminal is external It can be a high power supply external terminal influence of noise to place the output external terminal position distant. For this reason, it becomes possible to suppress the bad influence by unnecessary noise as much as possible, and the bad influence of the unnecessary radiation noise by the alternating current and high frequency signal which flow through an output line can also be reduced. In particular, when the surface-mounted piezoelectric oscillator is miniaturized, the positions of forming external terminals and wiring patterns are increasingly limited, and the output external terminal, power supply external terminal, second measurement external terminal, However, in the present invention, the adverse effect of unnecessary noise can be suppressed without impeding the downsizing of the surface mount piezoelectric oscillator.

  In addition, a pair of external adjustment terminals and a pair of measurement external terminals (first measurement external terminal and second measurement external terminal) formed on the bottom and side surfaces of the exterior portion of the base are the exterior of the base. Are formed in a state of being separated from each long side (one side and the other side) of the bottom surface of the unit, so that an adjustment external terminal and a measurement external terminal having various functions can be achieved while corresponding to the miniaturization of the surface mount type piezoelectric oscillator. Thus, they do not interfere with each other and do not adversely affect the manufacturing of the oscillator or after it has been commercialized. In addition, it is possible to deal with restrictions on arrangement of external terminals having functions.

  As described above, the present invention can cope with solder cracks while corresponding to downsizing, and it is an electric circuit that is less susceptible to the adverse effects of noise on a surface-mounted piezoelectric oscillator having an oscillation circuit configuration with a built-in oscillation amplifier. It is possible to provide a more reliable surface-mount piezoelectric oscillator with excellent mechanical characteristics.

FIG. 1 is a diagram showing an oscillation circuit applied to the present invention. FIG. 2 is a schematic cross-sectional view showing a mounting state of the surface mount piezoelectric oscillator showing the embodiment of the present invention on a circuit board. FIG. 3 is a bottom view of the surface mount piezoelectric oscillator showing the embodiment of the present invention. FIG. 4 is a plan view before sealing the lid of the surface-mount piezoelectric oscillator showing the embodiment of the present invention. FIG. 5 is a plan view of a single base of a surface mount piezoelectric oscillator showing an embodiment of the present invention. FIG. 6 is a schematic circuit diagram of a surface-mounted piezoelectric oscillator showing an embodiment of the present invention.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings by taking a surface-mounted crystal oscillator (surface-mounted piezoelectric oscillator) using a ceramic multilayer base as an example.

  The surface-mount crystal oscillator 6 includes a base 1 (hereinafter referred to as a base) made of an insulating ceramic multilayer substrate having a recess having an opening at the top, an integrated circuit element 2 housed in the base, and the same The piezoelectric vibration element 3 is housed in the upper part of the base, and the lid 4 is joined to the opening of the base. In this surface-mounted crystal oscillator, the base 1 and the lid 4 are bonded and hermetically sealed using a sealing material 5 to form a surface-mounted crystal oscillator 6. Hereinafter, each configuration of the surface mount crystal oscillator 6 will be described.

  The base 1 of the ceramic multilayer substrate is a rectangular parallelepiped as a whole, and the bottom 11 of a rectangular plate in a plan view made of a ceramic material such as alumina, which is the lowermost layer, and the plane of the ceramic material of the intermediate layer laminated on the bottom 11 A bank-shaped body (exterior section 14) having a concave section and having a storage section 10 is composed of a bank-shaped bank section 12 and a bank-shaped bank section 13 in the top layer of ceramic material. . The storage unit 10 includes a first storage unit 10a (lower storage unit) and a second storage unit 10b (upper storage unit), in which the integrated circuit element 2 and the piezoelectric vibration element 3 are stored. The ceramic multilayer substrate is not limited to a base having a three-layer structure as in the present embodiment, and may be composed of four or more layers according to the structure of the storage portion of the base.

  The upper surface (end surface) of the bank portion 13 that is the uppermost layer of the base 1 of the ceramic multilayer substrate is flat, and is a bonding region (metal film) 13a with the lid 4 described later. The junction region 13a is composed of a metallized layer made of a metallized material such as tungsten or molybdenum, a nickel layer laminated on the metallized layer, and a gold layer laminated on the nickel layer. Tungsten or molybdenum is integrally formed at the time of ceramic firing by metallization technology by utilizing thick film printing technology, and nickel layer and gold layer are plated on the metallization layer in this order.

  Casters C1, C2, C3, and C4 that extend in the vertical direction are formed on the four corners of the outer peripheral wall of the base 1, and a half length that extends in the vertical direction is formed at a part of the center of the long side of the outer peripheral wall of the base 1. Circular castellations C5 and C6 are respectively formed. The castellation has a configuration in which an arc-shaped or semi-ellipsoidal cutout is formed in the vertical direction with respect to the outer peripheral wall of the base. The junction region 13a is formed on the bottom side of the base by at least one of a conductive via (not shown) and a wiring pattern (not shown) formed above the castellation to vertically connect the base bank portions 12 and 13 to each other. It is electrically derived to a part of the external terminal pad GT3. By connecting the external terminal pad GT3 to the ground, a metal lid, which will be described later, is grounded via the bonding region 13a, the conductive via, the wiring pattern above the castellation, etc., and the electromagnetic shielding effect of the surface-mount crystal oscillator Can be obtained.

  Inside the base 1, the lower surface is constituted by the bank portion (side wall portion) 12, and a first storage portion 10 a for storing the integrated circuit element 2 is formed. A holding base 10c that protrudes and holds an end portion of a piezoelectric vibration element, which will be described later, and a pillow part 10d that faces the holding base via the first storage part are formed. A second storage portion 10b formed by the bank portion (side wall portion) 13 is formed above the first storage portion 10a.

  On the upper surface of the bottom 11 (the inner bottom surface of the first storage portion 10a) which is the lowermost layer of the base 1 of the ceramic multilayer substrate, as shown in FIG. The wiring patterns H11 to H18 are formed side by side.

  Six external terminals GT are formed at the four corners and at the center of the long side on the lower surface of the bottom portion 11 (the bottom surface of the base exterior portion) which is the lowermost layer of the base 1 of the ceramic multilayer substrate. Specifically, as shown in FIG. 3, the four external terminals are configured as mounting external terminals GT1, GT2, GT3, and GT4. The mounting external terminals GT1, GT2, GT3, and GT4 are respectively connected to the side surface of the bottom portion 11 (the side surface of the ceramic substrate of the bottom layer) of the base 1 through four corner castellations C1, C2, C3, and C4. Further, lead-out electrodes GT11, GT21, GT31, and GT41 are formed.

  For example, in this embodiment, the mounting external terminal GT1 is a power supply external terminal (VCC), the mounting external terminal GT2 is an output external terminal (OUT), the mounting external terminal GT3 is a grounding external terminal (GND), and mounting. The external terminal GT4 is another external terminal, and is configured as any one of an output control external terminal (OE), a frequency control external terminal (VCONT), an NC external terminal, and the like.

  In addition, two corners in contact with the long side 16 (one long side) of the bottom surface of the bottom portion 11 (the bottom surface of the base exterior portion) are a mounting external terminal GT1 as a power external terminal (VCC) and an output external terminal. The mounting external terminal GT2 as a terminal (OUT) is formed to face the two corners that are in contact with the long side 15 (the other long side) of the bottom surface of the bottom portion 11 (the bottom surface of the base exterior portion). A mounting external terminal GT3 as a grounding external terminal (GND) and a mounting external terminal GT4 as another external terminal are formed to face each other. The mounting external terminals GT1, GT2, GT3, and GT4 are electrically led to the wiring patterns H11, H12, H13, and H14 via the routing electrodes GT11, GT21, GT31, and GT41.

  Of the pair of external terminals at the center of the long side of the bottom surface of the bottom portion 11, the one close to the long side 15 (between the mounting external terminal GT3 and the mounting external terminal GT4) is connected to the wiring pattern H17 and integrated later. The circuit element 2 is configured as one adjustment external terminal GT7 for data adjustment. Of the pair of external terminals at the center of the long side, the one close to the long side 16 (between the mounting external terminal GT1 and the mounting external terminal GT2) is connected to the wiring pattern H26 on the second output side, which will be described later. The first measurement external terminal GT8 is used for measuring the characteristics of the piezoelectric vibration element directly connected to one of the excitation electrodes of the piezoelectric vibration element 3.

  In this embodiment, the adjustment external terminal GT7 is configured as a data input / output external terminal (IO) for inputting / outputting data to / from the integrated circuit element, and is separated from the long side 15 of the bottom surface of the bottom portion 11 toward the center of the bottom portion 11. It is formed in a state. The first measurement external terminal GT8 corresponds to the output side of the oscillation amplifier of the integrated circuit element 2 in FIG. 1 and is connected to one excitation electrode 31 of the piezoelectric vibration element 3 to be described later, and the long side of the bottom surface of the bottom 11 It is formed in a state of being separated from 16 toward the center of the bottom 11. The external terminals GT7 and GT8 are electrically led to any of the plurality of wiring patterns H1 through conductive vias V1 and V2 penetratingly connected to the upper part.

  Part of castellations C5 and C6 are formed at the center of a pair of long sides of the bank portion 12 which is an intermediate layer of the base 1 of the ceramic multilayer substrate. The upper part of the castellation at the center of the long side of the bank portion 12 is connected to the wiring pattern H25 on the second input side and directly connected to one of excitation electrodes of the piezoelectric vibration element 3 described later. This is configured as a second measurement external terminal GT5 for measuring the characteristics of the connected piezoelectric vibration element. Of the upper portion of the castellation at the center of the long side of the bank portion 12, the portion close to the long side 16 is connected to the wiring pattern H18 and serves as the other adjustment external terminal GT6 for data adjustment of the integrated circuit element 2 to be described later. Composed.

  In this embodiment, the second measurement external terminal GT5 corresponds to the input side of the oscillation amplifier of the integrated circuit element 2 in FIG. 1 and is connected to the other excitation electrode 32 of the piezoelectric vibration element 3 to be described later. It is formed in a state of being separated from the long side 15 of the lower surface. The adjustment external terminal GT6 is configured as a data control external terminal (CS) for controlling input / output of data to / from the integrated circuit element, and is formed in a state separated from the long side 16 on the lower surface of the bottom portion 11. Since these external terminals GT5 and GT6 are formed only on the upper surface of the bank portion 12 as an intermediate layer, the long sides 15 and 16 on the lower surface of the bottom portion 11 and the junction region ( It is formed in a state separated from the (metal film) 13a.

  By contacting a contact probe of a piezoelectric vibration element characteristic device with the measurement external terminals GT5 and GT8, the characteristic of the piezoelectric vibration element 3 described later can be measured.

  On the upper surface of the bank portion 12 (the bottom surface of the second storage portion 10b), which is an intermediate layer of the base 1 of the ceramic multilayer substrate, a holding base 10c for mounting a piezoelectric vibration element 3 described later is formed. On the upper surface, a second input-side wiring pattern H25 and a second output-side wiring pattern H26 connected to a piezoelectric vibration element 3 described later are formed. The holding table 10 c is configured by a part of the bank portion 12 projecting toward the storage unit 10. The second input-side wiring pattern H25 is electrically led out to the first input-side wiring pattern H15 through a conductive via V3 penetratingly connected to the lower part. The second output-side wiring pattern H26 is electrically derived to the first output-side wiring pattern H16 through a conductive via V4 penetratingly connected to the lower part.

  The base 1 configured as described above is formed using a known ceramic lamination technique or metallization technique. Mounting external terminals GT1, GT2, GT3, GT4, routing electrodes GT11, GT21, GT31, GT41, measuring external terminals GT5, GT8, adjusting external terminals GT6, GT7, wiring patterns H11, H12, H13, H14, H15, H16, H17, H18, H25, and H26 have a structure in which a nickel plating layer and a gold plating layer are formed on the upper surface of a metallized layer made of tungsten, molybdenum, or the like, similarly to the formation of the bonding region 13a.

  The integrated circuit element 2 mounted on the inner bottom surface of the first storage portion 10a is a one-chip integrated circuit element incorporating an inverter amplifier (oscillation amplifier) such as a C-MOS. As shown in FIG. An oscillation circuit is configured together with the piezoelectric vibration element 3. A plurality of pads P are formed on the bottom surface side of the integrated circuit element 2. In the integrated circuit element 2, a plurality of pads P of the integrated circuit element 2 and wiring patterns H11 to H18 formed on the base 1 are connected by, for example, FCB through metal bumps C such as gold. In this embodiment, a configuration in which metal bumps are used as an example is exemplified, but wire bonding may be used.

  At this time, the pad P corresponding to the power supply of the integrated circuit element 2 is connected to the power supply wiring pattern H11 connected to the mounting external terminal GT1 (power supply external terminal). The pad P corresponding to the output of the integrated circuit element 2 is connected to the output wiring pattern H12 connected to the mounting external terminal GT2 (output external terminal). The pad P corresponding to the grounding portion of the integrated circuit element 2 is connected to the grounding wiring pattern H13 connected to the mounting external terminal GT3 (grounding external terminal). The other pad P of the integrated circuit element 2 is connected to another wiring pattern H14 connected to the mounting external terminal GT4 (other external terminal). A pad P corresponding to data input / output of the integrated circuit element 2 is connected to a data input / output wiring pattern H17 connected to the adjustment external terminal GT7 (data input / output external terminal (IO)). A pad P corresponding to data input / output control of the integrated circuit element 2 is connected to a data input / output control wiring pattern H18 connected to the adjustment external terminal GT6 (data control external terminal (CS)). 1 corresponds to the output side of the oscillation amplifier of the integrated circuit element 2 in FIG. 1, and a pad P connected to an excitation electrode 31 of the piezoelectric vibration element 3 to be described later is connected to a first measurement external terminal GT8. To the wiring pattern H16 on the output side. 1 corresponds to the input side of the oscillation amplifier of the integrated circuit element 2 in FIG. 1, and the pad P connected to the excitation electrode 32 of the piezoelectric vibration element 3 described later is connected to the second external terminal for measurement GT5. To the wiring pattern H15 on the side.

  Above the integrated circuit element 2, the piezoelectric vibration element 3 is mounted at a predetermined interval in the second storage portion 10 b that is the same space of the storage portion 10. The piezoelectric vibration element 3 is, for example, a rectangular AT-cut quartz crystal diaphragm, and a rectangular excitation electrode 31 and this extraction electrode are formed on the surface thereof, and a rectangular excitation electrode 32 and this extraction electrode are formed on the back surface thereof. The pair of excitation electrodes 31 and 32 are formed to face each other on the front and back surfaces. These electrodes include, for example, a laminated thin film composed of a chromium or nickel base electrode layer, a silver or gold intermediate electrode layer, and a chromium or nickel upper electrode layer, a chromium or nickel base electrode layer, and silver Alternatively, it is a laminated thin film composed of a gold upper electrode layer. Each of these electrodes can be formed by a thin film forming means such as a vacuum deposition method or a sputtering method.

  The piezoelectric vibration element 3 and the base 1 are bonded using, for example, a silicone-based conductive resin adhesive (conductive bonding material) S that is in the form of a paste and contains fine metal pieces such as silver filler. As shown in FIG. 2, the conductive resin adhesive S is applied to a part of the upper surface of the wiring patterns H25 and H26, and the conductive resin adhesive S is disposed between the piezoelectric vibration element 3 and the holding base 10c. By interposing them in and curing them, they are joined together electromechanically. As described above, one end portion of the piezoelectric vibration element 3 is joined to the holding base 10c of the base while the opposite other end portion of the piezoelectric vibration element 3 is joined to the base holding base 10c while providing a gap from the bottom surface of the first storage portion 10a of the base 1. Held. In this embodiment, a configuration in which bonding is performed using a silicone-based conductive resin adhesive is taken as an example, but other conductive resin adhesive, metal bumps, metal plating bumps, or the like may be used as the conductive bonding material. .

  At this time, the extraction electrode connected to the excitation electrode 31 of the piezoelectric vibration element 3 corresponds to the output side of the oscillation amplifier of the integrated circuit element 2 in FIG. 1 and is connected to the first external terminal for measurement GT8. To the wiring pattern H26 on the output side. The extraction electrode connected to the excitation electrode 32 of the piezoelectric vibration element 3 corresponds to the input side of the oscillation amplifier of the integrated circuit element 2 in FIG. 1 and is connected to the second measurement external terminal GT5. To the wiring pattern H25.

  The lid 4 that hermetically seals the base 1 has a configuration in which a metal brazing material (sealing material) is formed on a core material made of, for example, Kovar. The sealing material 5 made of this metal brazing material is joined to the joining region (metal film) 13 a of the base 1. The plan view outline of the metal lid 4 is substantially the same as or slightly smaller than the outline of the ceramic base.

  The joint area 13a of the base 1 in which the integrated circuit element 2 and the piezoelectric vibration element 3 are housed in the storage portion 10 is covered with a metal lid 4, and the sealing material 5 of the metal lid 4 and the base are joined. The surface-mounted crystal oscillator 6 is completed by melt-curing the region 13a and performing hermetic sealing.

  As shown in FIG. 2, the surface-mounted crystal oscillator 6 configured in this way is bonded to the wiring pattern 71 of the circuit board 7 using a bonding material 8 such as solder. That is, the mounting external terminals GT1, GT2, GT3, and GT4 (only GT1 and GT2 are shown in FIG. 1) are bonded to the wiring pattern 71 of the circuit board 7 using the bonding material 8. The adjustment external terminal GT7 is also bonded to the ground wiring pattern 72 of the circuit board 7 by using the bonding material 8.

  According to the above embodiment, the surface mount crystal oscillator 6 that has been commercialized is used not only in the mounting external terminals GT1, GT2, GT3, GT4 necessary on the user side, but also in the manufacturing stage of the surface mount crystal oscillator. For adjustment, the adjustment external terminal GT7 which is not necessary on the user side can be used as an external terminal for joint reinforcement when the circuit board 7 is mounted.

  In this embodiment, the adjustment external terminal GT7 is configured as a data input / output external terminal (IO), and the adjustment external terminal GT6 is configured as a data control external terminal (CS). By applying a specific voltage, specific adjustment data can be input to the data input / output external terminal (IO). Therefore, the adjustment external terminal GT6 (data external control external terminal (CS)) is a side surface of the exterior portion 14 of the surface-mount type crystal resonator 6 that does not face the mounting surface of the circuit board 7, and is formed on the lower surface of the bottom portion 11. It is formed in a state of being separated from the long side 16 and the junction region (metal film) 13a of the bank portion 13 which is the uppermost layer. Therefore, a specific voltage is not applied from the outside (circuit board 7) to at least the adjustment external terminal GT6 (data external control external terminal (CS)) after being mounted on the circuit board 7. The data of the integrated circuit element 2 is not rewritten.

  Note that the present invention is not limited to the above configuration, and the data control external terminal (CS) may be replaced with the adjustment external terminal GT7, and the data input / output external terminal (IO) may be replaced with the adjustment external terminal GT6. Also in this case, since the adjustment external terminal GT7 is connected to the ground wiring pattern 72 of the circuit board 7 using the bonding material 8, an unnecessary voltage is not applied to the adjustment external terminal GT7. The data of the integrated circuit element 2 is not rewritten.

  In other words, even a miniaturized surface-mount crystal oscillator is unstable in a state where data can be input / output at the time of manufacture, as well as the external terminals GT1, GT2, GT3, and GT4 that are required after the commercialization. Even when the adjustment external terminal GT7 is mounted on the circuit board, the adjustment external terminal GT7 can be reused as an external terminal for stable joint reinforcement in which data cannot be rewritten. There is no need to separately provide an external terminal for reinforcing joints other than the mounting external terminal and the adjustment external terminal. Further, it is possible to cope with the layout restrictions of the external terminals according to the standard without changing the roles of the respective mounting external terminals and adjusting external terminals that function. As described above, solder cracks can be dealt with while reducing the size, and a more reliable external terminal connection structure can be obtained.

  Further, in addition to the above form, it is not necessary for commercialization on the user side, corresponds to the output side of the oscillation amplifier of the integrated circuit element 2, and is connected to one excitation electrode 31 of the piezoelectric vibration element 3 described later. The first measurement external terminal GT8 for measuring the characteristics of the piezoelectric vibration element may be used as an external terminal for bonding reinforcement when being mounted on the circuit board 7. In this case, in order not to adversely affect the characteristics of the surface-mounted crystal oscillator, it is preferable to connect to a non-connection pattern (NC pattern) formed on the circuit board 7.

  In addition, the adjustment external terminals GT6 and GT7 and the measurement external terminals GT5 and GT8 are formed in a state of being separated from the long side of the bottom surface of the base exterior portion, thereby reducing the size of the surface mount crystal oscillator. While corresponding to each other external terminals having each function (mounting external terminal and adjustment external terminal, adjustment external terminal and measurement external terminal, measurement external terminal and mounting external terminal, adjustment with mounting external terminal The external terminal for measurement and the external terminal for measurement) will not interfere with each other, and will not adversely affect the oscillator when it is manufactured or after it is commercialized. In addition, it is possible to deal with restrictions on arrangement of external terminals having functions.

  Further, the bonding material 8 also crawls up to the lead-out electrodes GT11, GT21, GT31, and GT41, and can be used as a part for recognizing the bonding reinforcement and the application state of the bonding material 8 when mounted on the circuit board 7.

  According to the above-described embodiment, the input side wiring pattern (on the first input side) connected to the input side (gate side G) of the oscillation amplifier that easily amplifies unnecessary noise and easily adversely affects the electrical characteristics of the piezoelectric oscillator. The wiring pattern H15, the second input-side wiring pattern H25), and the second measurement external terminal GT5 are connected to the power supply line (pad P corresponding to the power supply of the integrated circuit element 2) that is highly influenced by external noise. Mounting external terminal GT1 for power supply via the wiring pattern H11) and an output line (mounting external terminal GT2 for output from the pad P corresponding to the output of the integrated circuit element 2 via the output wiring pattern H12) Etc.). For this reason, it becomes possible to suppress the bad influence by unnecessary noise as much as possible, and the bad influence of the unnecessary radiation noise by the alternating current and high frequency signal which flow through the said output line can also be reduced.

  In particular, when the surface-mount type piezoelectric oscillator is downsized, the positions where external terminals and wiring patterns are formed are increasingly limited, and the output line, the power supply line, the input-side wiring pattern, and the second measurement are used. Although the distance from the external terminal GT5 is shortened and the adverse effect thereof is more easily affected, the present invention can suppress the adverse effect of unnecessary noise without hindering the downsizing of the surface-mount piezoelectric oscillator.

In the above-described embodiment, an AT cut quartz crystal vibrating plate is used as the piezoelectric vibrating element. However, the present invention is not limited to this, and a tuning fork type quartz vibrating piece may be used. Further, although quartz is used as the piezoelectric vibration element, the present invention is not limited to this, and a piezoelectric single crystal material such as piezoelectric ceramics or LiNbO ₃ may be used. That is, any piezoelectric vibration element can be applied. In addition, although the example in which the piezoelectric vibration element is cantilevered is taken as an example, a configuration in which both ends of the piezoelectric vibration element are retained may be employed. Moreover, although the silicone type conductive resin adhesive is taken as an example of the conductive bonding material, other conductive resin adhesives may be used, and bump materials, brazing materials, etc. of metal bumps and metal plating bumps may be used.

  In this embodiment, the piezoelectric vibration element 3 and the integrated circuit element 2 are used. However, the present invention is not limited to this, and the number of piezoelectric vibration elements 3 can be arbitrarily set. In addition to 2, other circuit components may be mounted. That is, the setting of the member mounted on the base can be changed according to the application. Further, the electrical connection between the integrated circuit element and the base is not limited to the flip chip bonding method, and a wire bonding method or the like may be employed. Although an oscillation circuit configuration using a one-chip integrated circuit element incorporating a C-MOS inverter amplifier as an oscillation amplifier is taken as an example, an oscillation circuit configuration including other oscillation amplifiers may be used.

  In this embodiment, sealing with a metal brazing material is taken as an example. However, the present invention is not limited to this, and seam sealing, beam sealing (for example, laser beam, electron beam), glass sealing, etc. Can be applied.

  Further, in this embodiment, the surface mount type piezoelectric oscillator has a stacked arrangement in which the integrated circuit element 2 is accommodated on the inner bottom surface of the base 1 having a recess opened only at the upper part, and the piezoelectric vibration element 3 is accommodated on the upper surface. However, the integrated circuit element 2 is housed on the inner bottom surface of the lower concave portion of the base having the concave portion whose upper and lower portions are open, and the piezoelectric vibration element 3 is housed on the inner bottom surface of the upper concave portion. You may apply to things.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  The present invention can be applied to a surface mount type piezoelectric vibration oscillator.

DESCRIPTION OF SYMBOLS 1 Base 2 Integrated circuit element 3 Piezoelectric vibration element 4 Lid 5 Sealing material 6 Surface mount type crystal oscillator 7 Circuit board 8 Bonding material S Conductive resin adhesive (conductive bonding material)
C Metal bump V Conductive via

Claims (1)

A surface mount piezoelectric oscillator,
An integrated circuit element with a built-in oscillation amplifier;
A piezoelectric vibration element having a pair of excitation electrodes connected to the integrated circuit element;
A rectangular ceramic substrate is laminated to form a storage portion and an exterior portion, and a plurality of wiring patterns formed in the storage portion, and external terminals formed in the exterior portion and connected to a part of the wiring pattern And has an insulating base
Six external terminals are formed in the center of the four corners and the long side on the bottom surface of the exterior portion of the base,
In two corners in contact with one long side of the bottom surface of the exterior portion of the base, a power supply external terminal as an external terminal for mounting and an output external terminal are formed to face each other.
The piezoelectric vibration element on the output side of the oscillation amplifier of the integrated circuit element between the power supply external terminal and the output external terminal in a state of being separated from one long side of the bottom surface of the exterior portion of the base A first measurement external terminal connected to the excitation electrode is formed,
A data input / output terminal for data adjustment of the integrated circuit element is formed on the side surface in the long side direction of the base exterior portion while being separated from one long side of the bottom surface of the base exterior portion. ,
In the two corners in contact with the other long side of the bottom surface of the exterior portion of the base, a grounding external terminal as an external terminal for mounting and other external terminals are formed facing each other.
A data control terminal for data adjustment of the integrated circuit element is formed between the ground external terminal and the other external terminal in a state separated from the other long side of the bottom surface of the exterior portion of the base. And
In the state separated from the other long side of the bottom surface of the base exterior portion, the side surface in the long side direction of the base exterior portion is excited on the input side of the oscillation amplifier of the integrated circuit element. A second measuring external terminal connected to the electrode is formed;
The surface mounting is characterized in that a bonding material is used for bonding to the external terminals for mounting, and a bonding material is also used for bonding the data control terminals to only the wiring pattern for grounding of the circuit board. Type piezoelectric oscillator.

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