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JP6024599B2 - 多層プリント配線板の製造方法 - Google Patents

多層プリント配線板の製造方法 Download PDF

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Publication number
JP6024599B2
JP6024599B2 JP2013116276A JP2013116276A JP6024599B2 JP 6024599 B2 JP6024599 B2 JP 6024599B2 JP 2013116276 A JP2013116276 A JP 2013116276A JP 2013116276 A JP2013116276 A JP 2013116276A JP 6024599 B2 JP6024599 B2 JP 6024599B2
Authority
JP
Japan
Prior art keywords
resin composition
printed wiring
wiring board
multilayer printed
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013116276A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014007403A (ja
Inventor
賢司 川合
賢司 川合
嘉生 西村
嘉生 西村
中村　茂雄
茂雄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2013116276A priority Critical patent/JP6024599B2/ja
Publication of JP2014007403A publication Critical patent/JP2014007403A/ja
Application granted granted Critical
Publication of JP6024599B2 publication Critical patent/JP6024599B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2013116276A 2012-05-31 2013-05-31 多層プリント配線板の製造方法 Active JP6024599B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013116276A JP6024599B2 (ja) 2012-05-31 2013-05-31 多層プリント配線板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012124031 2012-05-31
JP2012124031 2012-05-31
JP2013116276A JP6024599B2 (ja) 2012-05-31 2013-05-31 多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JP2014007403A JP2014007403A (ja) 2014-01-16
JP6024599B2 true JP6024599B2 (ja) 2016-11-16

Family

ID=49982576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013116276A Active JP6024599B2 (ja) 2012-05-31 2013-05-31 多層プリント配線板の製造方法

Country Status (3)

Country Link
JP (1) JP6024599B2 (zh)
KR (1) KR102039193B1 (zh)
TW (1) TWI657730B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
JP6459279B2 (ja) * 2014-07-31 2019-01-30 味の素株式会社 樹脂シート
JP2016072333A (ja) * 2014-09-29 2016-05-09 日本ゼオン株式会社 積層体の製造方法
JP2016072334A (ja) 2014-09-29 2016-05-09 日本ゼオン株式会社 積層体の製造方法
KR102476862B1 (ko) 2014-10-16 2022-12-14 아지노모토 가부시키가이샤 지지체, 접착 시트, 적층 구조체, 반도체 장치 및 프린트 배선판의 제조 방법
JP6413654B2 (ja) * 2014-11-04 2018-10-31 味の素株式会社 回路基板及びその製造方法
JP6413831B2 (ja) * 2015-02-24 2018-10-31 味の素株式会社 回路基板及びその製造方法
TWI674051B (zh) * 2016-02-15 2019-10-01 美商英特爾股份有限公司 層積體、包含該層積體之多層電路基板及該層積體之製造方法
JP6798140B2 (ja) * 2016-05-10 2020-12-09 昭和電工マテリアルズ株式会社 プリント配線板の製造方法
WO2019044398A1 (ja) 2017-08-31 2019-03-07 リンテック株式会社 樹脂シート、半導体装置、および樹脂シートの使用方法
JP6870544B2 (ja) * 2017-09-04 2021-05-12 味の素株式会社 樹脂組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3670487B2 (ja) * 1998-06-30 2005-07-13 京セラ株式会社 配線基板の製造方法
JP2006317267A (ja) * 2005-05-12 2006-11-24 Hitachi Chem Co Ltd 薄い樹脂層と下地の間の接着強度を測定する方法
US20090104429A1 (en) * 2005-09-15 2009-04-23 Sekisui Chemical Co., Ltd. Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
JP2009073987A (ja) * 2007-09-21 2009-04-09 Ajinomoto Co Inc 高誘電樹脂組成物
KR101960247B1 (ko) * 2007-11-22 2019-03-21 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조 방법
KR100972654B1 (ko) 2007-12-20 2010-07-27 삼성중공업 주식회사 파이프 내부 퍼징장치
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
JP5282487B2 (ja) * 2008-08-28 2013-09-04 住友ベークライト株式会社 多層プリント配線板の製造方法、多層プリント配線板および半導体装置
JP5446473B2 (ja) * 2009-05-29 2014-03-19 味の素株式会社 多層配線基板の製造方法。
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
KR101807901B1 (ko) * 2010-08-10 2017-12-11 히타치가세이가부시끼가이샤 수지 조성물, 수지 경화물, 배선판 및 배선판의 제조 방법

Also Published As

Publication number Publication date
TWI657730B (zh) 2019-04-21
TW201414390A (zh) 2014-04-01
KR20130135106A (ko) 2013-12-10
JP2014007403A (ja) 2014-01-16
KR102039193B1 (ko) 2019-10-31

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