JP5986888B2 - Sheet peeling device - Google Patents

Description

The present invention relates to a sheet peeling equipment for peeling the adhesive sheet stuck on an adherend.

  Conventionally, in a semiconductor manufacturing process, after a predetermined process, an adhesive sheet attached to the surface of a wafer is peeled off by a peeling device. Such an adhesive sheet peeling apparatus has been proposed in which a peeling tape is bonded to an end of the adhesive sheet, and the peeling sheet is pulled from the wafer by pulling the peeling tape (for example, , See Patent Document 1).

JP 2006-100728 A

  However, in the peeling apparatus described in Patent Document 1, if the peeling force between the wafer and the adhesive sheet is larger than necessary, the peeling tape may be peeled off from the adhesive sheet or the peeling tape may be cut when the peeling tape is pulled. In other words, there is a problem of causing a peeling failure.

An object of the present invention is to provide a sheet peeling equipment that can reliably peel off the adhesive sheet from the adherend.

In order to achieve the above object, a sheet peeling apparatus according to the present invention is a sheet peeling apparatus for peeling an adhesive sheet affixed to an adherend, a feeding means for feeding a peeling tape, and the fed peeling machine. Affixing means for affixing a tape to the adhesive sheet, a moving means for moving the adherend and the peeling tape relative to each other, and a vibration applying means for applying vibration to a peeling portion between the adherend and the adhesive sheet with the door, said vibrating means, the adhesive sheet is employed the configuration in which the amplitude adjusting means is that provided for adjusting the amplitude of the vibration in accordance with the peel length peeled from the adherend.

Sheet peeling equipment of the present invention, there is provided a sheet peeling apparatus for peeling the adhesive sheet stuck on an adherend, sticking and feeding means for feeding a peeling tape, the fed-out the peeling tape to the adhesive sheet A vibration applying means, a moving means for moving the adherend and the peeling tape relative to each other, and a vibration applying means for applying vibration to a peeled portion between the adherend and the adhesive sheet. The means vibrates the driving device that holds the peeling tape attached to the adhesive sheet to apply vibration to the peeling portion .

  According to the sheet peeling apparatus and the peeling method of the present invention as described above, in order to impart vibration to the peeling portion between the adhesive sheet and the adherend, the peeling force of the adhesive sheet can be reliably weakened by the vibration, The adhesive sheet can be reliably peeled from the adherend. That is, in the peeling portion between the adhesive sheet and the adherend, when viewed microscopically, as shown in FIG. 4A, the adhesive of the adhesive sheet stretches and sticks like a thread, so that the peeling force is increased. It depends (becomes larger). At this time, when vibration is applied to the peeling portion, as shown in FIG. 4B, the adhesive stretched by the vibration is cut and the peeling force is reduced.

  At this time, if the amplitude adjusting means is provided, the peeled adhesive sheet portion becomes longer as the peeling progresses, and the vibration applied by the vibration applying means is absorbed by the deformation (elongation) of the adhesive sheet, and the peeling is performed. It is possible to suppress the vibration from being transmitted to the portion, and to reliably apply the vibration to the peeled portion.

The side view which shows the sheet peeling apparatus which concerns on embodiment of this invention. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus of FIG. The partial side view which shows a modification. (A), (B) is a figure when peeling an adhesive sheet.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment and other embodiments to be described later, for example, when directions such as up, down, left, right, front, and back are shown without giving a reference figure, FIG. Based on the normal direction (the direction in which the assigned number is the appropriate direction), the top, bottom, left, and right directions are parallel to the page, and the front is the front direction perpendicular to the page and the back Is the back direction perpendicular to the page.

  In FIG. 1, a sheet peeling apparatus 1 is an apparatus for peeling an adhesive sheet AS attached to one surface (upper surface) of a wafer WF as an adherend, and removes the wafer WF through a suction port (not shown). Table 2 as support means for adsorbing and holding from the surface (lower surface) side, feeding means 3 for feeding the peeling tape PT, sticking means 4 for sticking the fed peeling tape PT to the adhesive sheet AS, and wafer WF And a moving means 5 for relatively moving the peeling tape PT, and a vibration applying means 6 for applying vibration to the peeling portion AS1 (see FIG. 2B) between the wafer WF and the adhesive sheet AS. Yes.

  Here, the peeling portion AS1 is a portion where peeling occurs between the adhesive sheet AS and the wafer WF, and the position is changed from the peeling start side to the peeling end side in accordance with the relative movement of the wafer WF and the peeling tape PT. It is the part that moves toward. Further, “applying vibration to the peeled portion” includes a case where vibration is directly and indirectly applied. Indirect application may be a case where vibration is applied to the peeling portion AS1 via the peeling tape PT, the adhesive sheet AS, or the table 2.

  The feeding means 3 is biased to the left by a support roller 3A, a plurality of guide rollers 3B, a coil spring 3C and a rod 3D supported by a heat-sensitive adhesive tape as a peeling tape PT. A tape receiving plate 3G having a cutter groove 3F and a slider 3I of a linear motor 3H as a driving device, supported by a vibration applying means 6 and driven by a pair of gripping claws 3J. A chuck cylinder 3K as a device and a cutter blade 3N supported by an output shaft 3M of an air cylinder 3L as a drive device are configured and supported by a frame 3P.

  The sticking means 4 includes a pressing head 43 supported by an output shaft 42 of a linear motor 41 as a driving device, and a heating means 44 such as a coil heater or an infrared irradiation device for heating the lower end of the pressing head 43. .

  The moving means 5 is composed of a linear motor 51 as a driving device that supports the table 2 with its slider 52.

  The vibration applying unit 6 includes a vibrator 61 and an amplitude adjusting unit (not shown) that can adjust the amplitude of vibration according to the length of the adhesive sheet AS peeled from the wafer WF. The vibrator 61 is provided so as to be able to apply vibration to the chuck cylinder 3K with a predetermined amplitude and frequency. For example, an unbalanced structure in which an eccentric weight is attached to a rotation shaft of a piezoelectric type using a piezoelectric element or a rotary type electric motor. Mass type, electrodynamic type that uses the force generated by passing current through the drive coil, and well-known ultrasonic vibration generator, electric motor and known vibrator using air, etc. As long as it can directly or indirectly impart vibration to the peeling portion AS1.

Next, the peeling operation of the adhesive sheet AS in this embodiment will be described.
First, when the state shown in FIG. 1 is set as an initial state, and the wafer WF is placed at a predetermined position of the table 2, the table 2 sucks and holds the wafer WF through a suction port (not shown). Next, the feeding means 3 drives the linear motor 3H, presses the left wall of the tape receiving plate 3G with the right wall of the lower gripping claw 3J, positions the peeling tape PT between the gripping claws 3J, and moves the chuck cylinder 3K. Driven and grips the peeling tape PT with the gripping claws 3J. Next, the feeding means 3 drives the linear motor 3H and moves the chuck cylinder 3K to the left, thereby pulling the peeling tape PT a predetermined length and stopping.

  Next, the sticking means 4 drives the linear motion motor 41, and as shown in FIG. 2A, the pressing head 43 is lowered, and the peeling tape PT is pressed against the adhesive sheet AS at the lower end thereof, and then the heating means. 44 is driven and the lower end of the pressing head 43 is heated to bond the peeling tape PT to the end of the adhesive sheet AS. Thereafter, when the feeding means 3 drives the air cylinder 3L and lowers the cutter blade 3N into the cutter groove 3F to cut the peeling tape PT, the sticking means 4 and the feeding means 3 become the linear motion motor 41 and the air cylinder 3L. To return the pressing head 43 and the cutter blade 3N to the initial state.

  Next, the moving means 5 and the vibration applying means 6 drive the linear motor 51 and the vibrator 61 to move the table 2 to the left and apply vibration to the chuck cylinder 3K as shown in FIG. Thus, vibration is applied to the peeling portion AS1 via the gripping claws 3J, the peeling tape PT, and the adhesive sheet AS. As a result, as shown in FIG. 4B, the portion AD1 where the adhesive of the adhesive sheet AS stretches and sticks like a thread is cut by vibration, so that the separation portion AS1 can be separated from the wafer WF without applying vibration. Compared to FIG. 4A in which the adhesive sheet AS is peeled off, the peeling force of the adhesive sheet AS is lowered, and the whole is peeled from the wafer WF.

  Here, when the peeled adhesive sheet AS part becomes longer as the peeling of the adhesive sheet AS proceeds, the vibration applied by the vibrator 61 is absorbed by the elongation of the adhesive sheet AS, and no vibration is applied to the peeled part AS1. (Not communicate). In such a case, the vibration applying means 6 drives an amplitude adjusting means (not shown). For example, if the length of the peeled adhesive sheet AS portion is doubled, the peeled adhesive is doubled. By adjusting the amplitude of the vibrator 61 in proportion to the length of the sheet AS portion, the amplitude applied to the peeling portion AS1 can be set to a predetermined size (width), and the peeling portion AS1 is surely peeled off. The force can be reduced to peel the entire adhesive sheet AS. It should be noted that the degree of amplitude adjustment with respect to the length of the peeled adhesive sheet AS portion in the amplitude adjusting means may be set to any size according to the experience value of the operator.

  Thereafter, the adhesive sheet AS peeled off from the wafer WF is discarded in a collection box (not shown), the feeding means 3 and the moving means 5 drive the linear motor 3H and the linear motor 51, and the chuck cylinder 3K and the table 2 are in the initial state. Then, the wafer WF from which the adhesive sheet AS has been peeled is transferred to the next process by a transfer means (not shown), and thereafter the same operation as described above is repeated.

According to the above embodiment, the following effects are obtained.
That is, since vibration is applied to the peeling portion AS1 between the adhesive sheet AS and the wafer WF, the peeling force can be reliably weakened by the vibration, and the adhesive sheet AS can be reliably peeled from the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. Descriptions in the names of members excluding some or all of the limitations such as are included in the present invention.

For example, as shown in FIG. 3, an arm 62 and a roller 63 supported by the vibrator 61 of the vibration applying means 6 may be employed to apply vibration to the top of the peeling portion AS1 or in the vicinity of the top thereof. A vibrator may be disposed inside 63. In FIG. 3, the wafer WF and the peeling tape PT are moved relative to each other at the same speed in the opposite direction so that the peeling portion AS1 does not move. However, the wafer WF and the peeling tape are not moved. When only one of the PTs moves, an appropriate driving device that moves the vibration applying means 6 in the direction in which the peeling portion AS1 moves may be employed.
Further, the vibrator 61 may be arranged inside the table 2, or may be arranged on both the feeding means 3 side and the table 2 side, and it is arbitrary in which part the vibrator 61 is provided.
Furthermore, the slider 3I and the slider 52 may be configured to vibrate by controlling the operation of the linear motor 3H and the linear motor 51, and the slider 3I and the slider 52 themselves may move in the peeling direction while vibrating. .
Further, the moving means may be configured to move the chuck cylinder 3K while the table 2 is fixed, or may be configured to move both the table 2 and the chuck cylinder 3K.

Further, even when the adhesive sheet AS that does not cause a problem of elongation during peeling is employed, the amplitude and frequency of vibration may be changed.
Further, when the peeling of the adhesive sheet AS proceeds and the length in the direction orthogonal to the peeling direction changes as in the case of the wafer WF, for example, the amplitude is increased from the start of peeling to the center of the wafer WF. The amplitude may be gradually increased, and after passing through the center of the wafer WF, the amplitude may be controlled to be gradually decreased.
Moreover, you may provide the vibration direction adjustment means which can change a vibration direction by changing the attachment direction of the vibrator | oscillator 61 arbitrarily. The vibration direction to be applied to the peeling portion AS1 may be a direction along the peeling direction, a direction with an angle up, down, left, or right with respect to the peeling direction, or an arc direction, which are arbitrarily combined. It may be a direction. In other words, the vibration direction may be arbitrarily determined for the implementation.
Further, the amplitude adjusting means adjusts the amplitude of the vibrator 61 without being proportional to the length of the peeled adhesive sheet AS part, or adjusts the amplitude regardless of the length of the peeled adhesive sheet AS part. For example, when the length of the peeled adhesive sheet AS portion is doubled, the amplitude may be squared or the amplitude may be adjusted according to the peeled time.
Further, a frequency changing means capable of changing the frequency of the vibrator 61 may be adopted. In this case, for example, it is proportional to the length of the peeled adhesive sheet AS portion, the frequency is adjusted without being proportional, the frequency is adjusted according to the peeling time, or, for example, the wafer WF is bonded. When the peeling of the sheet AS proceeds and the length in the direction orthogonal to the peeling direction changes, for example, from the start of peeling to the center of the wafer WF, the frequency is gradually reduced or increased, and the wafer WF After passing through the center, the frequency may be controlled to gradually increase or decrease.

  Furthermore, the material, type, shape, etc. of the peeling tape PT, the adhesive sheet AS, and the adherend in the present invention are not particularly limited. For example, the peeling tape PT and the adhesive sheet AS are not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. Further, such a peeling tape PT and adhesive sheet are, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, and a cover on the upper surface of the base sheet. There may be three or more layers such as having a layer, or a so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer. The intermediate layer may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, earthenware, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. It may be any sheet, film, tape or the like in shape.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet peeling apparatus 3 Feeding means 4 Sticking means 5 Moving means 6 Vibration imparting means AS adhesive sheet PT peeling tape PT1 peeling part WF wafer (adhered body)

Claims (2)

A sheet peeling device for peeling an adhesive sheet attached to an adherend,
A feeding means for feeding out the peeling tape;
A sticking means for sticking the fed-off peeling tape to the adhesive sheet;
Moving means for relatively moving the adherend and the peeling tape;
Comprising vibration imparting means for imparting vibration to a peeled portion between the adherend and the adhesive sheet ;
It said vibrating means, the sheet peeling apparatus, wherein the adhesive sheet that has been provided with amplitude adjustment means for adjusting the amplitude of the vibration in accordance with the peel length peeled from the adherend. A sheet peeling device for peeling an adhesive sheet attached to an adherend,
A feeding means for feeding out the peeling tape;
A sticking means for sticking the fed-off peeling tape to the adhesive sheet;
Moving means for relatively moving the adherend and the peeling tape;
Comprising vibration imparting means for imparting vibration to a peeled portion between the adherend and the adhesive sheet;
It said vibrating means, said adhesive sheet affixed to the peeling tape characteristics and be Resid over preparative peeling apparatus that imparts vibration to the stripping portion of the driving apparatus is vibrated to grip the.

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