JP5806586B2 - Outlet unit - Google Patents

Description

  The present invention relates to an outlet unit, and more particularly, to an outlet unit including a current sensor that detects a current value.

  2. Description of the Related Art Conventionally, an apparatus that measures power consumption of a device connected to an outlet and monitors the power consumption of the device is known. For example, Patent Document 1 discloses a power measurement device that includes an outlet portion and a power measurement circuit that measures the power consumption of an electric appliance connected to the outlet portion.

  Moreover, in patent document 2, the watt hour meter provided with the housing | casing which detects and displays electric power used based on the supply current to the load apparatus connected to this outlet port, and the load body connected to this outlet port is disclosed. Has been.

JP-A-8-184616 JP 2001-66330 A

  As disclosed in Patent Documents 1 and 2, although devices for monitoring the amount of power of devices connected to an outlet have existed in the past, normally used coil-type current sensors are large in size and small in size. Has not been realized.

  Then, an object of this invention is to provide the outlet unit which enables size reduction.

An outlet unit for solving the above problems includes a plurality of outlet units configured to be connectable to a device, and a plurality of current sensors attached to each of a predetermined number of outlet units among the plurality of outlet units. , based on the values detected by each current sensor, viewed contains an arithmetic unit, a for calculating the state of use of electric power of each outlet portion, said current sensor, while being constituted by using a magnetic sensor, current A signal substrate having a sensor substrate and an IC chip, wherein the current sensor substrate has a primary conductor having a U-shaped current path, a support portion for supporting a signal processing IC having a built-in magnetoelectric conversion element, and a lead terminal. A terminal-side member, and the current path is disposed close to the support portion so as not to overlap the support portion in plan view, and the support portion in side view. Has a height and a substrate for different current sensors, the IC chip is placed on the supporting portion, having a magneto-electric transducer for detecting the magnetic flux generated from current flowing through the current path.

  Examples of the current sensor include a shunt resistor, a coil-type current sensor, and a current sensor using a magnetic sensor. The current sensor may be capable of measuring a direct current and an alternating current. In this case, a more suitable outlet unit is configured such that the offset voltage of the DC component can be detected. Alternatively, the current sensor may be configured using a magnetic sensor. In this case, there is no power loss caused by the shunt resistor, and no heat is generated, which is more preferable.

  According to the present invention, the outlet unit can be downsized.

It is a figure which shows the structural example of the outlet unit in 1st Embodiment. It is a figure which shows an example of the external appearance of the outlet unit in 1st Embodiment. It is a figure which shows the structural example of the current sensor in 1st Embodiment. It is a figure which shows an example of the side surface and cross section in the current sensor of FIG. It is a figure which shows the example of application of an outlet unit. In 1st Embodiment, it is a figure which shows an example of the positional relationship of each current sensor in an outlet unit. In 1st Embodiment, it is a figure which shows the example of installation of a magnetic shield when a magnetic shield is given to the outlet part. It is a perspective view which shows the example of the branch breaker to which the magnetic shield was given. It is a figure which shows the modification 1 of a current sensor. It is sectional drawing of the current sensor along the XX line of FIG. It is a figure which shows the modification 2 of a current sensor. It is a figure which shows an example of the side surface and cross section in the current sensor of FIG. It is a figure which shows the modification 3 of a current sensor.

<First Embodiment>
Hereinafter, an embodiment of the outlet unit of the present invention will be described with reference to the drawings. The outlet unit 100 according to the embodiment is for calculating the amount of power used by a device connected to each outlet unit from the current values of current sensors attached to a plurality of outlet units, such as a power strip. It is an outlet unit.

[Configuration of outlet unit]
FIG. 1 is a diagram illustrating a configuration example of an outlet unit 100 according to the first embodiment.

  As shown in FIG. 1, the outlet unit 100 includes a plurality of outlet portions 11a, 11b, 11c, and 11d, and a plurality of current sensors 12a and 12b connected between the outlet portions 11a to 11d and the power plug 13. , 12c, 12d and an arithmetic unit 14 for inputting the output values of the current sensors 12a to 12d.

  1 shows the case where the current sensors 12a to 12d are provided corresponding to the outlet portions 11a to 11d, respectively, a predetermined number of outlets (for example, a part of the total number of outlet portions). A current sensor may be provided corresponding to only the part.

  In FIG. 1, the power plug 13 is configured to be plugged into, for example, an AC 100V circuit. When the power plug 13 is inserted into the electric circuit, power is supplied from the electric circuit.

  Each outlet part 11a-11d is comprised so that an apparatus can be connected. In the example of FIG. 1, the shape of the outlet portion is, for example, a two-pole plug, but may be a three-pole plug with a ground wire. Examples of the device include a lighting fixture, a refrigerator, an air conditioner, and a washing machine.

  Each current sensor 12a-12d can detect each load current value of outlet part 11a-11d. As each of the current sensors 12a to 12d, for example, various types of current sensors such as a shunt resistor, a coil-type current sensor, and a current sensor using a magnetic sensor can be applied. It is preferable to apply a current sensor using a magnetic sensor that can detect both and generates little heat or loss of power. Among these, it is preferable to use a current sensor that uses a magnetic sensor that does not have a magnetic core because it is easy to achieve downsizing of the outlet unit 100. The configuration of each of the current sensors 12a to 12d will be described in detail later.

  In addition, the current sensors 12a to 12d are connected to the arithmetic device 14, and the arithmetic device 14 inputs values from the current sensors 12a to 12d according to the load current flowing through the devices connected to the respective outlets. ing. Thereby, the number of arithmetic devices and the number of current sensors are not the same, and the number of arithmetic devices (in FIG. 1, for example, one of the arithmetic devices 14) is the same as the number of current sensors (in FIG. 4) of 12d. The ratio of the number of arithmetic devices and the number of current sensors is not limited to the above example of 1: 4. In the ratio of the number of arithmetic devices to the number of current sensors, when the ratio of the number of arithmetic devices is 1, the ratio of the number of current sensors may be 2 or more. In this case, for example, if the ratio of the number of current sensors is 4 or more, there is an effect that the scale of the peripheral circuit and the area of the printed circuit board can be greatly reduced.

[Configuration of arithmetic unit]
The computing device 14 computes the power usage state of each device connected to the outlet units 11a to 11d based on the values detected by the current sensors 12a to 12d. Examples of power usage include instantaneous power, integrated power consumption, electricity charges, and load current values.

  The arithmetic device 14 is configured by, for example, an LSI (Large Scale Integration), and includes an AC / DC circuit, a memory, a processor, and the like.

  The memory may hold temperature characteristic data of the current sensor, for example, and the processor may correct the output value of the current sensor based on the temperature characteristic data. In this case, since the output value of the current sensor is corrected, the arithmetic device 14 can obtain a more accurate power usage state and obtain a preferable result.

  In the present embodiment, a case has been described in which one arithmetic device 14 is configured to monitor signals from the plurality of current sensors 12a to 12d. However, this configuration is adopted, and the arithmetic device 14 has high accuracy. The correction circuit may be provided. In this case, it is not necessary to provide a high-accuracy correction circuit for each of the current sensors 12a to 12d, so that the total outlet unit can be optimized and the outlet unit system can be downsized.

  In order for one arithmetic unit 14 to read signals from the plurality of current sensors 12a to 12d, for example, a multiplexer may be used to exchange the signals by serial communication, or a plurality of analog signals may be processed in parallel. May be.

  If the signals from the current sensors 12a to 12d are digitized by an AD converter built in the calculation device 14 and subjected to temperature correction or the like, power calculation can be performed with high accuracy.

  In FIG. 1, the case where one arithmetic device 14 monitors (monitors) signals from the plurality of current sensors 12 a to 12 d has been described. However, for example, a plurality of arithmetic devices monitor signals from the plurality of current sensors. You may comprise. In this case, the ratio between the number of arithmetic units and the number of current sensors is set to 1: m (m = 2 or more). In the present embodiment, the computing device 14 supplies power to the current sensors 12a to 12d, for example. With such a configuration, the calculation device 14 performs power calculation based on the signal from each current sensor in conjunction with the power supply fluctuation of the current sensors 12a to 12d, and the power fluctuation to the current sensors 12a to 12d. Even when this occurs, it is possible to calculate power with higher accuracy. The power supply to the current sensors 12a to 12d is not limited to the configuration shown in FIG. 1, but a power supply circuit (such as a regulator) that is not affected by peripheral noise is provided, and a configuration that is performed from the power supply circuit is applied. You can also.

  FIG. 2 is a diagram illustrating an application mode of the outlet unit 100. As shown in FIG. 2, the above-described outlet unit 100 can be applied as a four-port power strip.

[Configuration of current sensor]
Next, the configuration of the current sensors 12a to 12d of the present embodiment will be described with reference to FIG. 3 and FIG. In the present embodiment, the current sensors 12a to 12d use magnetic sensors and will be described by taking a configuration without a magnetic core as an example. However, other current sensors can be applied. However, the current sensors 12a to 12d of the present embodiment are current sensors that do not cause power loss or heat generation, and are preferable because the size of the outlet unit 100 can be minimized.

  In the case of the current sensors 12a to 12d of the present embodiment, the thickness can be set to about 0.5 to 3 mm, for example, so that the current sensors 12a to 12d can be installed in the outlet unit 100. Therefore, it is possible to greatly contribute to downsizing of the outlet unit 100 as a whole.

  In the following description, each current sensor is referred to as the current sensor 200 in the description common to each of the current sensors 12a to 12d.

  FIG. 3 is a diagram illustrating a configuration example of the current sensor 200. 4A and 4B are diagrams showing an example of a side surface and a cross section of the current sensor 200 in FIG. 3, wherein FIG. 4A is a side view of the current sensor 200, and FIG. 4B is a cross-sectional view taken along line IIIB-IIIB in FIG. Indicates.

  As shown in FIG. 3, the current sensor 200 includes a primary conductor 210 having a U-shaped current path 210A, a support portion 220A for supporting a magnetoelectric conversion element 230A such as a Hall element, and a signal terminal side having a lead terminal 220B. The member 220 and the IC chip 230 having the magnetoelectric conversion element 230A that is disposed on the support portion 220A and detects magnetic flux generated from the current flowing through the current path 210A are provided. The current sensor 200 is formed by molding the primary conductor 210, the signal terminal side member 220, and the IC chip 230 with the resin 240. A portion excluding the IC chip 230 and the resin 240 is a current sensor substrate.

  The current path 210A is disposed close to the support portion 220A so as not to overlap the support portion 220A in plan view. Further, as can be seen from the side view of FIG. 4A and the cross-sectional view of FIG. 4B, the current path 210A is different in height from the support portion 220A in the side view.

  When the current to be measured flows through the current path 210A, the magnetic flux density is increased near the center inside the U-shaped current path 210A and the current detection sensitivity is improved. Therefore, the magnetoelectric conversion element 230A has the U of the current path 210A in plan view. It is arranged inside the letter shape. Further, the IC chip 230 protrudes from the support portion 220A in a side view and overlaps with the current path 210A in a plan view.

  In the current sensor 200, the signal terminal side member 220 has a stepped portion 220C between the support portion 220A and the lead terminal 220B. For example, the step part 220 </ b> C of about 20 to 100 μm can be provided by forming the signal terminal side member 220. Thereby, a clearance is obtained between the current path 210 </ b> A and the IC chip 230. This clearance guarantees insulation between the primary conductor 210 and the IC chip 230, and allows a high breakdown voltage to be maintained inside the package. When the stepped portion 220C does not exist, the conductive path 210A of the primary conductor 210 and the IC chip 230 come into contact with each other, and even if an insulating sheet is pasted on the back surface of the IC chip 230, the dielectric strength is low and the dielectric breakdown is likely to occur. End up. As an improvement measure, an insulating sheet may be pasted on the primary conductor 210 in advance.

  In the current sensor 200, since the primary conductor 210 and the back surface of the IC chip 210 connected to 0 V of the power source used in the signal processing circuit face each other, the IC circuit formed on the surface of the IC chip 210 is primary. Since the structure is shielded from the conductor 210 and voltage noise contained in the current source to be measured flowing through the primary conductor 210 can be effectively cut off without using a new part, the outlet unit 100 is downsized. This is a more suitable current sensor.

  In addition, the current sensor 200 outputs not only an output proportional to the current to be measured flowing in the current path but also an ambient temperature signal of the current sensor 200, so that the arithmetic device 14 considers the temperature characteristics of the current sensor 200. And high-precision power calculation is possible. When the current values flowing through the outlet portions 11a to 11d are different, the internal temperatures of the current sensors 200 provided in the outlet portions 11a to 11d differ as a result of the difference in the amount of heat generated. Compared with the case where uniform temperature correction is taken into consideration for each current sensor 200, a highly accurate power calculation can be realized by obtaining the ambient temperature signal of each current sensor 200.

  As described above, according to the outlet unit 100 of the present embodiment, the computing device 14 is connected to the current sensors 12a to 12d, and is connected to the outlet portions 11a to 11d based on the output values of the current sensors. The power usage state of the device can be calculated. In addition, in this case, since the ratio between the number of the arithmetic devices 14 and the number of the current sensors 12a to 12d can be 1: many (for example, 4 in the example of FIG. 1), the outlet unit 100 can be downsized. it can.

  Note that the application example of the outlet unit 100 is not limited to the example illustrated in the present embodiment. For example, the outlet unit 100A shown in FIG. 5 is embedded in a wall or the like, and has, for example, three outlet portions 21a, 21b, and 21c. Outlet parts 21 a to 21 c are connected by a power cable in pipe 300.

[Positional relationship of each current sensor in the outlet unit]
Next, the positional relationship between the current sensors 12a to 12d in the outlet unit 100 will be described with reference to FIG.

  FIG. 6 is a diagram illustrating an example of a positional relationship between the current sensors 12a to 12d in the outlet unit.

  In the example of FIG. 6, the current sensors 12 a to 12 d of the adjacent outlets are arranged so that their attachment positions are different from each other. For example, the deviation between the centers of the current sensors 12b and 12c is the distance d. Thereby, it becomes possible to reduce the influence of the leakage magnetic flux generated from the adjacent outlet. In this embodiment, when the distance d is set to 5 mm or more, for example, the influence of the leakage magnetic flux can be almost ignored from the simulation result.

  Furthermore, each current sensor 12a-12d may give a magnetic shield.

  FIG. 7 is a diagram showing an installation example of the magnetic shield when the outlet unit 100 is magnetically shielded. FIG. 7A shows a case where the magnetic shield 203 is provided on one side surface of the outlet portion 11a, and FIG. ) Shows the case where the magnetic shields 203 and 204 are provided on both sides of the outlet 11a, (c) shows the case where the magnetic shield 205 is provided so as to cover the current sensor 12a, and (d) shows the entire inner surface of the outlet 11a. Shows the case where the magnetic shield 206 is provided.

  As shown in FIG. 7, the above-described magnetic shields 203, 204, 205, and 206 are applied to a part or all of the outlet 11 a by attaching a magnetic shield sheet, for example. In addition to the magnetic shield sheet, it may be composed of a thin magnetic plate such as iron or silicon steel plate. Note that the position of the magnetic shield sheet is not limited to the above-described example as long as the magnetic noise of disturbance is not generated in the current sensor.

  FIGS. 8A and 8B are perspective views showing an example of an outlet provided with a magnetic shield, where FIG. 8A shows a case where the magnetic shield 203 is provided on one side surface of the outlet portion, and FIG. 8B shows both sides of the frame frame of the outlet. The case where the magnetic shields 203 and 204 are applied to the surface is shown. 8A shows an example displayed in FIG. 7A, and FIG. 8B corresponds to the example displayed in FIG. 7B.

  As shown in FIG. 8, in the outlet portion, the shield effect is obtained by providing magnetic shields 203 and 204 on one side surface or both side surfaces.

  As described above, according to the outlet unit 100 of the present embodiment, the current sensor and the magnetic shield can be provided in the outlet unit 100.

  Next, modifications 1, 2, and 3 of the current sensor 200 will be described.

(Modification 1)
FIG. 9A is a diagram illustrating a first modification of the current sensor 200 of FIG. A current sensor 600 shown in FIG. 9A is the same as the current sensor 200 except for the IC chip 630. When the IC chip 630 is arranged on the support portion 220A, the first magnetoelectric conversion element 630A is arranged inside the U-shape of the current path 210A in plan view, and the second magnetoelectric conversion element 630B is It is designed to be disposed outside the U-shape of the current path 210A and in a position close to the current path 210A. FIG. 10 is a cross-sectional view taken along line XX in FIG. The magnetic flux density at the position of the first magnetoelectric conversion element 630A generated by the current flowing through the primary conductor 210 is B1s, and the magnetic flux density at the position of the second magnetoelectric conversion element 630B is B2s. If the magnetic flux densities generated by the external magnetic noise are B1n and B2n, the outputs Vo1 and Vo2 of the first magnetoelectric conversion element 630A and the second magnetoelectric conversion element 630B are
Vo1 = k1 × (B1s + B1n) + Vu1
Vo2 = k2 × (−B2s + B2n) + Vu2
It becomes. Here, k1 and k2 are sensitivity coefficients of the respective magnetoelectric conversion elements, and Vu1 and Vu2 are offset values of the respective magnetoelectric conversion elements.

Here, it is assumed that variations in the characteristics of both magnetoelectric transducers are extremely small, and k1 = k2 = k and Vu1 = Vu2 hold.
Since the distance between both magnetoelectric conversion elements is short, the value of Vo1−Vo2 when approximated to B1n = B2n is the output voltage Vo.
Vo = Vo1−Vo2 = k × (B1s + B2s)
Thus, noise due to the external magnetic field disappears, and a larger signal is obtained than in the case of only the first magnetoelectric conversion element 630A inside the U-shape, leading to an improvement in sensitivity of the current sensor.

FIG. 9B shows an example in which three magnetoelectric conversion elements are used as another modification of the current sensor 200 shown in FIG. The current sensor 700 is the same as the current sensor 200 except for the IC chip 730. When the IC chip 730 is arranged on the support portion 220A, the first magnetoelectric conversion element 730A is arranged inside the U-shape of the current path 210A in plan view, and the second magnetoelectric conversion element 730B and the second magnetoelectric conversion element 730B are arranged. The third magnetoelectric conversion element 730C is designed to be disposed outside the U-shaped ends of the current path 210A and in a position close to the current path 210A. The magnetic flux density at the position of the third magnetoelectric conversion element 730C generated by the current flowing through the primary conductor 210 is B3s, and the magnetic flux density generated at the position of the third magnetoelectric conversion element 730C by external magnetic noise is B3n. .
Here, it is assumed that k1 = k2 = k3 = k and Vu1 = Vu2 = Vu3 are satisfied, and the distance between the three magnetoelectric conversion elements is close, so that B1n = B2n = B3n is approximate. If the value of Vo1- (Vo2 + Vo3) / 2 is the output voltage Vo,
Vo = Vo1− (Vo2 + Vo3) / 2 = k × (B1s + (B2s + B3s) / 2)
As with the two cases, noise due to the external magnetic field disappears and the sensitivity of the current sensor is improved, and even when the positional relationship between the primary conductor 210 and the IC chip 730 is displaced in the arrangement direction of the three magnetoelectric transducers. Thus, the fluctuation level of the output Vo can be suppressed as much as possible.

  In addition, if the current path can be configured to surround the magnetoelectric conversion element, a U-shaped current path that is one form of the U-shaped current path may be used for the current path 210A.

(Modification 2)
FIG. 11 is a diagram illustrating a second modification of the current sensor 200. The current sensor 800 shown in FIG. 11 is different from the current sensor 200 shown in FIG. 3 in that, instead of the IC chip 230 protruding from the support portion 220A in side view, the support portion 820A of the signal terminal side member 220 is notched 820A. , And the current path 210 </ b> A protrudes into the notch 820 </ b> A ′ in plan view. Therefore, although the IC chip 230 does not protrude, the IC chip 230 and the current path 210A overlap in plan view. FIG. 12A shows a side view and FIG. 12B shows a cross-sectional view. Although the current path 210A having a different height in the side view as compared with the first embodiment protrudes into the notch portion 820A ′ in the plan view, the processing of the stamping mold of the lead frame is slightly complicated. Thus, a degree of freedom is provided in the arrangement of the magnetoelectric conversion elements in the IC chip, and the magnetoelectric conversion elements can be arranged on the inner side of the IC chip. Therefore, it is possible to reduce the influence on the offset due to stress. Further, since the bonding area between the support portion and the IC chip is increased, the IC chip can be supported more stably, and it can be said that the manufacturing process has a margin.

  Similar to the above-described embodiment, the IC chip 230 may be an IC chip 630 having two magnetoelectric conversion elements or an IC chip 730 having three magnetoelectric conversion elements.

(Modification 3)
FIG. 13 is a diagram illustrating a third modification of the current sensor 200. In the current sensor 300 shown in FIG. 13, unlike the current sensor 200 in FIG. 3, a magnetoelectric conversion element 330 </ b> A such as a Hall element is not included in the IC chip 330 and is provided separately. The current sensor 300 of this embodiment has a hybrid structure with an IC.

  The support portion 220A includes a first support portion 220A ′ inserted into the U-shaped opening 210C and a second support portion 220A ″ adjacent to the first support portion 220A ′ and not inserted into the opening portion 210C. The first support portion 220A ′ is provided with a magnetoelectric conversion element 330A that detects a magnetic flux induced from the current flowing through the current path 210A, and the second support portion 220A ″ has a magnetoelectric conversion element 330A. An IC chip 330 for processing the output signal from is disposed. The magnetoelectric conversion element 330A is disposed inside the U shape of the current path 210A in plan view.

  In the current sensor 300 according to the present embodiment, only the magnetoelectric conversion element 330A is disposed, the first support portion 220A ′ inserted into the opening 210C of the current path 210A, and the IC chip 330 for signal processing are disposed. It is divided into the second support portion 220A ″ that is not inserted into the opening 210C, and a highly sensitive compound semiconductor magnetic sensor such as InSb, InAs, GaAs, etc. is used as the magnetoelectric conversion element 330A. Thereby, the current flowing through the current path 210A Measurement accuracy can be improved.

  In addition, since only the magnetic field conversion element 330A, not the IC chip 330, needs to be inserted into the opening 210C, the U-shaped current path 210A can be made small and the overall length can be shortened. When the current path 210A is reduced in size, the magnetic field concentration inside the U-shape increases, so that the detection sensitivity of the current can be improved and the influence of heat generation can be reduced.

  In the third modification, the primary conductor 210 and the magnetoelectric conversion element 330A are not two-dimensionally overlapped when viewed from the top surface of the current sensor, and the distance between the primary conductor 210 and the magnetoelectric conversion element 330A is widened. Higher withstand voltage can be ensured. In addition, since the IC chip 330 made of a fine process is further away from the primary conductor 210, the influence of noise generated from the primary conductor 210 can be reduced, and the influence of heat generation due to current flowing through the primary conductor 210 can be reduced. Therefore, reliability is further increased. Therefore, the current sensor 300 is a current sensor more suitable for realizing a small outlet unit.

  As described above, the embodiment and the first to third modifications have been described in detail. However, the specific configuration is not limited thereto, and the design can be changed within a range not departing from the gist of the present invention or applied to other uses. Is also included.

  For example, although the current sensor 200 has been described with reference to a configuration capable of measuring a direct current and an alternating current, for example, it may be configured to be capable of measuring only a direct current or only an alternating current. Alternatively, the current sensor 200 may be configured using a magnetic sensor other than the Hall sensor.

  The number of outlet portions of the outlet units 100 and 100A can be changed. Or although current sensor 12a-12d was explained taking the case where it was connected to arithmetic unit 14 by wire as an example, for example, wireless connection may be sufficient.

11a to 11d, 21a to 21c Outlet portion 12a to 12d Current sensor 14 Arithmetic device 100, 100A Outlet unit 210 Primary conductor 210A Current path 220 Signal terminal side member 220A Support portion 220B Lead terminal 220C Stepped portion 230 IC chip 230A Magnetoelectric conversion element 630 IC chip

Claims (12)

A plurality of outlets configured to be connectable to the device;
Among the plurality of outlet parts, a plurality of current sensors attached to each of a predetermined number of outlet parts,
Based on the value detected by each current sensor, a computing device that computes the power usage state of each outlet unit;
Only including,
The current sensor is configured using a magnetic sensor, and includes a current sensor substrate and an IC chip.
The current sensor substrate includes a primary conductor having a U-shaped current path, a signal terminal side member having a support portion and a lead terminal for supporting a signal processing IC having a built-in magnetoelectric conversion element, and the current The path is disposed close to the support portion so as not to overlap the support portion in plan view, and has a current sensor substrate having a height different from that of the support portion in side view,
The outlet unit , wherein the IC chip includes a magnetoelectric conversion element that is disposed on the support and detects a magnetic flux generated from a current flowing through the current path . A plurality of outlets configured to be connectable to the device;
Among the plurality of outlet parts, a plurality of current sensors attached to each of a predetermined number of outlet parts,
Based on the value detected by each current sensor, a computing device that computes the power usage state of each outlet unit;
Including
The current sensor is configured using a magnetic sensor, and a compound semiconductor is used for a magnetoelectric conversion element, and is configured in a hybrid structure with a signal processing IC. The current sensor substrate has a U-shaped current path. A primary conductor; a first support part for supporting the magnetoelectric conversion element; a second support part for supporting the signal processing IC; and a signal terminal side member having a lead terminal. A magneto-electric transducer having a current sensor substrate disposed adjacent to the first support portion so as not to overlap the first support portion when viewed, and detecting a magnetic flux generated from a current flowing through the current path features and to Turkey down St. units to have a. The outlet unit according to claim 1 or 2 , wherein the current sensor is capable of measuring a direct current and an alternating current.   The outlet unit according to claim 1, wherein the current sensor also outputs an ambient temperature signal. The outlet unit according to claim 1 or 2 , wherein the current sensor has a thickness of 0.5 mm to 3 mm. The outlet unit according to claim 1 or 2 , wherein the current sensor does not have a magnetic core. The current sensor uses a compound semiconductor as a magnetoelectric conversion element and is configured in a hybrid structure with an IC for signal processing. The current sensor substrate supports a primary conductor having a U-shaped current path and the magnetoelectric conversion element. And a signal terminal side member having a lead terminal and a second support part for supporting the signal processing IC, and the current path is connected to the first support part in a plan view. And a current sensor substrate disposed adjacent to the first support portion so as not to overlap, and further comprising a magnetoelectric conversion element for detecting a magnetic flux generated from a current flowing through the current path. The outlet unit according to 1 . 3. The outlet unit according to claim 1, wherein when a plurality of outlets are connected and attached, the current sensors in adjacent outlets are arranged so that their attachment positions are different from each other. The outlet unit according to claim 1 or 2 , wherein the outlet is magnetically shielded. The arithmetic unit, outlet unit according to claim 1 or 2, characterized in that it comprises an AD converter circuit. The outlet according to claim 1 or 2 , wherein the arithmetic device includes a memory that holds temperature characteristic data of the current sensor, and is configured to correct an output of the current sensor based on the temperature characteristic data. unit. The arithmetic unit, outlet unit according to claim 1 or 2, characterized in that supply power to the current sensor.

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