JP5772013B2 - Suspension board - Google Patents

Description

  The present invention relates to a suspension substrate, and more particularly to a suspension substrate that prevents disconnection of a second wiring layer provided above a first wiring layer.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate has a plurality of wiring layers and a plurality of connection terminals provided in the vicinity of the mounting area on which the magnetic head slider is mounted, and each connection terminal is connected to the wiring layer. These connection terminals are respectively connected to slider pads of the magnetic head slider, so that data is transferred to the magnetic head slider.

  In recent years, with the increase in capacity of HDDs and the increase in information transmission speed, it has been required to increase the number of wirings in a suspension substrate, to make them finer, and to stack them. For example, Patent Document 1 discloses a suspension for which characteristic impedance of a wiring pattern is reduced by alternately arranging a first line and a second line of a first wiring pattern and a third line and a fourth line of a second wiring pattern. A substrate is disclosed. Patent Document 2 discloses a suspension substrate in which crosstalk is reduced by changing the arrangement of wiring patterns and adjusting the distance between a plurality of wirings.

  In such a conventional suspension board, it is necessary to change the arrangement of the wirings from the arrangement order of the electrode pads used for connection to the external circuit. For this reason, one wiring is formed so as to straddle the other wiring. The For example, in Patent Document 1, the first line is divided in a region where the first line and the third line on the first insulating layer intersect, and the third line is disposed so as to pass through the divided part of the first line. . The divided first line includes a first connection layer provided on the second insulating layer covering the third line, and a second connection that penetrates the second insulating layer and connects the first line and the first connection layer. Connected by layers. That is, the first line straddles the third line by the first connection layer and the second connection layer.

Moreover, in patent document 2, the 1st wiring and the 2nd wiring are provided on the 1st insulating layer, and the 2nd insulating layer which covers a 2nd wiring in the area | region where a 1st wiring and a 2nd wiring cross | intersect is provided. . The first wiring straddles the second wiring with the second insulating layer interposed therebetween. That is, the first wiring is formed on the second insulating layer in the region straddling the second wiring, and is formed on the first insulating layer in the other regions.

The wiring (connection layer) on the second insulating layer is provided by forming a resist on the second insulating layer and patterning, and forming a metal film by electrolytic copper plating or the like in the resist opening. In the conventional suspension substrate as described above, the wiring (connection layer) formed on the second insulating layer has a certain width.

  In such a conventional suspension substrate, the second insulating layer has a shape that follows the step formed by the surface of the wiring formed on the first insulating layer and the surface of the first insulating layer, and the surface of the second insulating layer. Unevenness occurs in When a sputtering layer made of copper (Cu) or the like is formed on the concavo-convex surface of the second insulating layer, and a resist is formed on the sputtering layer, light that sensitizes the resist due to the concavo-convex is exposed when the resist is exposed. The light does not enter the second insulating layer at a right angle, the light is scattered, and the resist remains in a portion where the resist must be opened. If the resist remains, particularly when the wiring is miniaturized, the wiring (connection layer) having a constant width cannot be formed on the second insulating layer, and the wiring may be disconnected.

JP 2010-114366 A JP 2004-133888 A

  An object of the present invention is to provide a suspension substrate that can prevent disconnection of a second wiring layer provided on a first wiring layer with an insulating layer interposed therebetween and improve electrical characteristics.

  A suspension substrate according to an aspect of the present invention includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring layer provided on the first insulating layer, and the first wiring layer. A suspension substrate comprising a second insulating layer provided on the second insulating layer and a second wiring layer provided on the second insulating layer, wherein the second wiring layer is interposed via the second insulating layer. An overlapping portion including at least a portion located above the first wiring layer, wherein the second wiring layer has a line width wider than that of other portions of the second wiring layer in the overlapping portion; A wide portion is included.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the second wiring layer crosses non-parallel to the first wiring layer.

  In the suspension substrate according to one aspect of the present invention, it is preferable that the second wiring layer has a portion continuous in parallel with the first wiring layer on the first wiring layer.

  The suspension substrate according to one aspect of the present invention further includes a pair of additional first wiring layers provided on the first insulating layer, wherein the second wiring layer includes one additional first wiring layer and the other. It is preferable to function as a jumper line connecting the additional first wiring layer.

  In the suspension substrate according to an aspect of the present invention, the second wiring layer includes a second overlapping portion including a portion located above the additional first wiring layer via the second insulating layer, In the second overlapping portion, it is preferable that the line width of the second wiring layer further includes a wide portion wider than the line width of the other portion of the second wiring layer.

  In the suspension substrate according to the aspect of the present invention, it is preferable that a line width of the other portion of the second wiring layer in the second overlapping portion is substantially equal to a line width of the wide portion.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the wide portion is provided above an end portion in the line width direction of the first wiring layer.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the second wiring layer has a side cross-sectional shape having a step in the overlapping portion.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the line width of the wide portion is 1.2 times or more the line width of the other portion of the second wiring layer.

  In the suspension substrate according to an aspect of the present invention, the sum of the thickness of the first wiring layer and the thickness of the second insulating layer on the first wiring layer is T1, and the overlap of the second wiring layer is When the thickness of the second insulating layer below the other part excluding the part is T2, it is preferable that T1−T2 <12 μm is satisfied, and the line width of the wide part is 10 μm or more.

In the suspension substrate according to an aspect of the present invention, it is preferable that the first wiring layer has a thickness of 3 μm to 12 μm and a line width of 5 μm to 200 μm.

  According to the present invention, in the overlapping portion including a portion where the second wiring layer is located above the first wiring layer via the second insulating layer, the second wiring layer is another portion of the second wiring layer. By having a wider portion with a wider line width than this, disconnection of the second wiring layer can be prevented. Further, by changing the arrangement of the wiring patterns, the electrical characteristics can be improved as compared with the conventional suspension board.

It is a top view of the board | substrate for suspensions concerning embodiment of this invention. It is sectional drawing of the board | substrate for suspensions concerning the embodiment. It is a top view of the board | substrate for suspensions concerning the embodiment. It is sectional drawing of the board | substrate for suspensions concerning the embodiment. It is a top view which shows an example of the suspension in the embodiment. It is a top view which shows an example of the suspension with a head in the embodiment. It is a top view which shows an example of the hard disk drive in the same embodiment. FIG. 5D is a process drawing that describes the manufacturing method of the suspension substrate according to the embodiment. FIG. 9 is a process drawing following FIG. 8. FIG. 10 is a process diagram following FIG. 9. FIG. 11 is a process diagram following FIG. 10. FIG. 12 is a process diagram following FIG. 11. FIG. 13 is a process drawing following FIG. 12. FIG. 14 is a process diagram following FIG. 13. FIG. 15 is a process diagram following FIG. 14. FIG. 16 is a process drawing following FIG. 15. FIG. 17 is a process drawing following FIG. 16. FIG. 18 is a process drawing following FIG. 17. FIG. 19 is a process drawing following FIG. 18. FIG. 20 is a process drawing following FIG. 19. It is a top view which shows the wide part by a modification. It is a top view which shows the wide part by a modification. It is a top view which shows the wide part by a modification. It is a top view which shows the wide part by a modification. It is a top view which shows the wide part by a modification. It is a top view which shows the overlap part by a modification. It is a top view which shows the overlap part by a modification. It is a top view which shows the overlap part by a modification. It is sectional drawing along the DD line | wire of FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a plan view of a suspension substrate 1 according to an embodiment of the present invention. As shown in FIG. 1, the suspension substrate 1 includes a mounting region 2 on which a slider (not shown) is mounted as viewed from above, an electrode pad 3, and a plurality of wiring layers that connect the mounting region 2 and the electrode pad 3. (First wiring layer 10 and second wiring layer 12). FIG. 1 is a simplified plan view showing a suspension substrate 1. In FIG. 1, a plurality of wiring layers are indicated by a single line. Although two electrode pads 3 are shown in FIG. 1, the number of electrode pads 3 corresponding to the wiring layer is actually provided. The electrode pad 3 is used for connection between the suspension substrate 1 and an external circuit.

  FIG. 2 shows a cross section taken along line AA of FIG. That is, in the AA sectional view of FIG. 1 shown in FIG. 2, the suspension substrate 1 is provided on the metal substrate 20, the first insulating layer 22 provided on the metal substrate 20, and the first insulating layer 22. First wiring layer 10 (10R, 10W), second insulating layer 24 provided on first insulating layer 22 and first wiring layer 10, and second wiring provided on second insulating layer 24 The layer 12 (12R, 12W) and the protective layer 26 provided on the second insulating layer 24 and the second wiring layer 12 are included.

  In FIG. 2, a pair of first wiring layers 10 and a pair of second wiring layers 12 are shown. Each second wiring layer 12 is provided above the corresponding first wiring layer 10, and each second wiring layer 12 has a portion extending in parallel to the corresponding first wiring layer 10. For example, when the first wiring layer 10R is a reading wiring, the first wiring layer 10W is a writing wiring, the second wiring layer 12R is a writing wiring, and the second wiring layer 12W is a reading wiring, crosstalk is reduced. Transmitted signal can be transmitted. Although FIG. 2 shows an example in which two first wiring layers 10 (10R, 10W) and two second wiring layers 12 (12R, 12W) are provided, the first wiring layer 10 and the second wiring layer 12 are shown. One or more of each may be provided.

  As shown in FIG. 2, in the suspension substrate 1, the second insulating layer 24 has a shape following a step generated by the surface of the first insulating layer 22 and the surface of the first wiring layer 10. Unevenness occurs on the surface. This unevenness makes it difficult to form the second wiring layer 12 on the second insulating layer 24.

  FIG. 3 is a plan view showing wiring layers (first wiring layer 10 and second wiring layer 12) in region B of FIG. In FIG. 3, illustration of elements other than the wiring layer (the metal substrate 20, the first insulating layer 22, the second insulating layer 24, the protective layer 26, etc.) is omitted. As shown in FIG. 3, in the region B, the second wiring layer 12 is provided so as to cross the first wiring layer 10 in a non-parallel manner and straddle the first wiring layer 10. FIG. 3 shows an example in which the second wiring layer 12 forms about 45 ° on the plane with respect to the first wiring layer 10.

  As shown in FIG. 3, the suspension substrate 1 is provided with an overlapping portion 14 in which the second wiring layer 12 is located above the first wiring layer 10. In the overlapping portion 14, the second wiring layer 12 has a wide portion 16 whose line width W 1 is wider than the line width W 2 of other portions of the second wiring layer 12 when viewed from the plane.

  FIG. 4 shows a cross section taken along the line CC of FIG. The suspension substrate 1 includes a metal substrate 20, a first insulating layer 22 provided on the metal substrate 20, a first wiring layer 10 provided on the first insulating layer 22, a first insulating layer 22, and a first insulating layer 22. A second insulating layer 24 provided on one wiring layer 10; a second wiring layer 12 provided on the second insulating layer 24; and a protective layer 26 provided so as to cover the second wiring layer 12. Have.

  The second wiring layer 12 is provided so as to straddle the first wiring layer 10 via the second insulating layer 24. As described above, the second insulating layer 24 has a shape that follows the steps generated by the surface of the first insulating layer 22 and the surface of the first wiring layer 10, and irregularities are generated on the surface of the second insulating layer 24. The second wiring layer 12 is provided on the uneven surface of the second insulating layer 24, and has a side sectional shape with a step in the overlapping portion 14.

  As shown in FIG. 4, the second insulating layer 24 is inclined above the edge portion (line width direction end) E of the first wiring layer 10. In the present embodiment, since the second wiring layer 12 above the edge portion E of the first wiring layer 10 is the wide portion 16 having a wide line width, the second wiring layer in the inclined portion of the second insulating layer 24 is used. Accordingly, the second wiring layer 12 can be stably formed. This makes it possible to manufacture a suspension substrate with excellent data transmission.

Further, by forming the second wiring layer 12 straddling the first wiring layer 10, the arrangement of the wiring patterns can be changed. As a result, the arrangement can be changed stably without disconnecting the wiring pattern, and the degree of freedom in routing the wiring can be improved.

  3 and 4, the sum of the thickness of the first wiring layer 10 and the thickness of the second insulating layer 24 on the first wiring layer 10 is T1, and a portion other than the overlapping portion 14 of the second wiring layer 12 (overlapping portion). It is preferable that T1−T2 <12 μm is satisfied, where T2 is the thickness of the second insulating layer located below (other portions excluding 14). When the step (T1-T2) formed in the second insulating layer 24 is 12 μm or more, the resist opening is accurately formed when patterning the resist for forming the second wiring layer 12 on the second insulating layer 24. It is because it becomes difficult to form.

Here, T1 is the total of the thickness of the first wiring layer 10 and the maximum thickness of the second insulating layer 24 on the first wiring layer 10, for example. T2 is the thickness of the second insulating layer 24 at a position where the surface of the second insulating layer 24 becomes flat away from the first wiring layer 10 by a predetermined distance, for example. The position where the surface of the second insulating layer 24 becomes flat is, for example, the thickness of the second insulating layer 24 (the distance between the upper surface of the first insulating layer 22 and the upper surface of the second insulating layer 24) is minimized. Position. Note that the second insulating layer 24 has a taper shape or a step shape at the end in the left-right direction in FIG. 4 (a portion that is not shown in FIG. 4 and is left and right when viewed from the first wiring layer 10). When the thickness is reduced, the thickness of the second insulating layer 24 is minimized at the end portion. Therefore, in such a case, it is preferable that the minimum thickness of the second insulating layer 24 in the region excluding the end portion is T2. Further, the average value of the minimum thickness of the second insulating layer 24 in the left direction in FIG. 4 and the minimum thickness of the second insulating layer 24 in the right direction as viewed from the first wiring layer 10 may be T2.

The line width W1 of the wide portion 16 is preferably 10 μm or more, and preferably satisfies 1.2 × W2 <W1 <3 × W2. The reason why W1 <3 × W2 is set is that if the wide portion 16 is formed to be excessively large, the impedance or the like may be adversely affected.

The first wiring layer 10 preferably has a thickness of 3 μm to 12 μm and a line width of 5 μm to 200 μm. If the thickness of the first wiring layer 10 is too thin, signal transmission becomes difficult. If the thickness is too thick, the rigidity of the suspension substrate 1 becomes strong, and it becomes difficult to bend the suspension substrate 1. Further, if the line width of the first wiring layer 10 is too small, signal transmission becomes difficult, and if it is too large, it becomes difficult to increase the number of wirings of the first wiring layer 10 within a limited wiring formation region.

In addition, the second wiring layer 12 is preferably the wide portion 16 up to a place where the second insulating layer 24 becomes flat (a position where the thickness of the second insulating layer 24 is minimized).

  Next, each component of the suspension substrate 1 will be described.

  The electrode pad 3 includes, for example, a nickel (Ni) plating layer formed on the wiring layers 10 and 12 and a gold (Au) plating layer formed on the Ni plating layer.

  The material of the metal substrate 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel.

  The material of the first wiring layer 10 and the second wiring layer 12 is not particularly limited as long as the material has desired conductivity, but it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used.

  The material of the first insulating layer 22 and the second insulating layer 24 is not particularly limited as long as it has a desired insulating property. For example, it is preferable to use polyimide (PI). The material of the first insulating layer 22 and the second insulating layer 24 can be a photosensitive material or a non-photosensitive material.

  As a material of the protective layer 26, it is preferable to use a resin material, for example, polyimide (PI). The material of the protective layer 26 can be a photosensitive material or a non-photosensitive material.

  Next, the suspension 41 in the present embodiment will be described with reference to FIG. The suspension 41 shown in FIG. 5 is provided on the surface (lower surface) opposite to the suspension substrate 1 and the mounting area 2 of the suspension substrate 1 described above, and a slider 52 (see FIG. And a load beam 42 for holding (see FIG. 7).

  Next, the suspension with head 51 in the present embodiment will be described with reference to FIG. A suspension 51 with a head shown in FIG. 6 has the above-described suspension 41 and a slider 52 mounted on the mounting area 2 of the suspension substrate 1 and provided with a plurality of slider pads.

  Next, the hard disk drive 61 in the present embodiment will be described with reference to FIG. A hard disk drive 61 shown in FIG. 7 has a case 62, a disk 63 that is rotatably attached to the case 62 and stores data, a spindle motor 64 that rotates the disk 63, and a desired flying height on the disk 63. And a suspension 51 with a head including a slider 52 for writing and reading data to and from the disk 63. Among them, the suspension with head 51 is attached to the case 62 so as to be movable, and the voice coil motor 65 for moving the slider 52 of the suspension with head 51 along the disk 63 is attached to the case 62. An arm 66 is connected between the suspension 51 with head and the voice coil motor 65.

  Next, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described with reference to the process diagrams shown in FIGS. 8 to 20, (a) shows a cross section corresponding to FIG. 2, (b) shows a cross section corresponding to FIG. 4, and (c) shows a plane corresponding to FIG.

  First, as shown in FIG. 8, a metal substrate 20 on which polyimide is laminated as the first insulating layer 22 is prepared.

  Next, as shown in FIG. 9, a chromium (Cr) and Cu sputtering layer 30 is formed on the first insulating layer 22.

  Next, as shown in FIG. 10, resists 31 and 32 are formed on the upper surface of the sputtering layer 30 and the lower surface of the metal substrate 20. Then, the resist 31 is patterned into a pattern corresponding to the first wiring layer 10 by using a photolithography method.

  Next, as shown in FIG. 11, a metal film 33 made of copper is formed in the opening of the resist 31 by electrolytic copper plating.

  Next, as shown in FIG. 12, the resists 31 and 32 are removed.

  Next, as shown in FIG. 13, the exposed portion of the sputtering layer 30 is removed. Thereby, the first wiring layer 10 having the sputtering layer 30 and the metal film 33 is formed.

  Next, as shown in FIG. 14, a resin material for forming an insulating layer is applied on the first insulating layer 22 and the first wiring layer 10 so as to cover the first wiring layer 10. The resin material is a polyimide precursor varnish. Then, the polyimide precursor varnish is thermally dried to form the second insulating layer 24. The second insulating layer 24 has a shape that follows a step generated by the surface of the first insulating layer 22 and the surface of the first wiring layer 10, and unevenness is generated on the surface of the second insulating layer 24.

  Next, as shown in FIG. 15, a chromium (Cr) and Cu sputtering layer 34 is formed on the second insulating layer 24.

  Next, as shown in FIG. 16, resists 35 and 36 are formed on the upper surface of the sputtering layer 34 and the lower surface of the metal substrate 20. Then, the resist 35 is patterned into a pattern corresponding to the second wiring layer 12 using a photolithography method. In FIG. 16A, the resist 35 is patterned so as to form an opening parallel to the first wiring layer above the first wiring layer 10. In FIGS. 16B and 16C, the first wiring layer 10 is orthogonal or non-parallel on the plane, and the overlapping portion located above the first wiring layer 10 and the line width in the vicinity thereof are different from each other. The resist 35 is patterned so as to form an opening that is wider than the line width of the portion.

  As shown in FIGS. 16B and 16C, since the second insulating layer 24 is inclined above the edge portion E of the first wiring layer 10, the light for exposing the resist 35 is not incident at a right angle. , The light scatters. However, since this inclined portion is an opening having a wider line width than the other portions, the resist 35 can be prevented from remaining and a desired opening can be formed.

  Next, as shown in FIG. 17, a metal film 37 made of copper is formed in the opening of the resist 35 by electrolytic copper plating.

  Next, as shown in FIG. 18, the resists 35 and 36 are removed.

  Next, as shown in FIG. 19, the exposed portion of the sputtering layer 34 is removed. Thereby, the second wiring layer 12 having the sputtering layer 34 and the metal film 37 is formed. Since a desired opening is formed in the steps shown in FIGS. 16B and 16C, the second wiring layer 12 straddling the first wiring layer 10 is formed as shown in FIGS. 19B and 19C. Can be stably formed without disconnection.

  Next, as shown in FIG. 20, a resin material for forming a protective layer is applied on the second insulating layer 24 and the second wiring layer 12 so as to cover the second wiring layer 12. The resin material is a polyimide precursor varnish. Then, the polyimide precursor varnish is thermally dried to form the protective layer 26. In addition, illustration of the protective layer 26 is abbreviate | omitted in FIG.20 (c).

  Although the subsequent steps are not shown, the end portions of the first wiring layer 10 and the second wiring layer 12 are exposed, and Ni plating and Au plating are performed to form connection terminals connected to the electrode pads 3 and the slider 52. . Thereafter, a patterned resist is formed on the lower surface of the metal substrate 20, the metal substrate 20 is etched using a corrosive liquid such as a ferric chloride aqueous solution from the opening of the resist, and the resist is removed. The suspension substrate 1 is obtained.

  The load beam 42 is attached to the lower surface of the suspension substrate 1 obtained in this way, and the suspension 41 shown in FIG. 5 is obtained. A slider 52 provided with a plurality of slider pads is mounted on the mounting area 2 of the suspension 41 to obtain a suspension 51 with a head shown in FIG. In this case, the slider pad of the slider 52 is connected to a connection terminal provided at the end of each wiring layer 10, 12. Further, the suspension 51 with the head is attached to the case 62 of the hard disk drive 61 to obtain the hard disk drive 61 shown in FIG.

  When data is read and written in the hard disk drive 61 shown in FIG. 7, the slider 52 of the suspension 51 with the head is moved along the disk 63 by the voice coil motor 65, and the disk 63 rotated by the spindle motor 64 is moved. Keep close to the desired flying height. As a result, data is transferred between the slider 52 and the disk 63 via the slider pad and the connection terminal. During this time, electrical signals are transmitted by the wiring layers 10 and 12 connected between the mounting region 2 of the suspension substrate 1 and the electrode pads 3.

  As described above, according to the present embodiment, the second wiring layer 12 straddling the first wiring layer 10 has the line width W1 in the overlapping portion 14 positioned above the first wiring layer 10 as viewed from the plane. The wide portion 16 is wider than the line width W2 of the other part of the two wiring layers 12. As a result, the first insulating layer 22 includes at least the inclined portion of the second insulating layer 24 having a concavo-convex shape following the step generated by the surface of the first insulating layer 22 and the surface of the first wiring layer 10 and is formed on the periphery thereof. The disconnection of the two wiring layers 12 can be prevented, and the second wiring layers 12 can be stably formed. In addition, since the arrangement can be changed stably without disconnecting the wiring pattern, the degree of freedom in routing the wiring pattern can be improved. Conventionally, it has been difficult to stably form a wiring pattern that generates an overlapping portion. However, according to the present invention, a wiring layer having excellent electrical characteristics can be formed even in a wiring pattern having an overlapping portion. Therefore, the degree of freedom of wiring has been greatly improved.

  (Variation of Wide Part) In the above embodiment, as shown in FIG. 3, the wide part 16 has a planar rectangular shape, but the shape of the wide part 16 is not limited to this. 21 to 25 show modified examples of the wide portion 16. Similar to FIG. 3, in FIG. 21 to FIG. 25, illustration of elements other than the wiring layer (the metal substrate 20, the first insulating layer 22, the second insulating layer 24, the protective layer 26, etc.) is omitted.

  For example, as shown in FIG. 21, the wide portion 16 may have an elliptical shape. Alternatively, as shown in FIGS. 22 to 25, two wide portions 16 located above both edges of the first wiring layer 10 may be provided. Each of the wide portions 16 shown in FIGS. 22 to 25 has a triangular shape, a rectangular shape, a semicircular shape, and a trapezoidal shape at both ends in the line width direction of the second wiring layer 12. When the second wiring layer 12 crosses the first wiring layer 10 at an angle, as shown in FIG. 24, a wide portion 16 in which both ends in the line width direction of the second wiring layer 12 are semicircular and It is preferable to do. Regardless of the angle at which the first wiring layer 10 and the second wiring layer 12 cross each other, the wide portion 16 is positioned above the edge of the first wiring layer 10 in the overlapping portion, and the second wiring layer 12 is stabilized. This is because it can be formed.

  Note that the formation of the wide portion 16 shown in FIGS. 22 to 25 requires higher resist resolution than the formation of the wide portion 16 shown in FIGS. 3 and 21. Therefore, the wide portion 16 shown in FIGS. 3 and 21 can be manufactured more easily than the wide portion 16 shown in FIGS.

  (Modification of Overlapping Portion) In the above embodiment, as shown in FIGS. 3 and 4, the second wiring layer 12 straddles the first wiring layer 10 so as to cross the first wiring layer 10 in a non-parallel plane. However, the arrangement of the first wiring layer 10 and the second wiring layer 12 is not limited to this.

  For example, as shown in FIGS. 26 and 27, the second wiring layer 12 may be configured to have a portion that continues in parallel on the first wiring layer 10. In FIG. 26 and FIG. 27, illustration of elements other than the wiring layer (metal substrate 20, first insulating layer 22, second insulating layer 24, protective layer 26, etc.) is omitted. In FIG. 26, the first wiring layer 10 that extends directly below the second wiring layer 12 with the second insulating layer 24 interposed therebetween is bent halfway, and in FIG. 27, the first wiring layer 10 with the second insulating layer 24 interposed therebetween. The second wiring layer 12 extending upward is bent halfway. With such a configuration, the degree of freedom of wiring can be further increased. Moreover, when the 1st wiring layer 10 and the 2nd wiring layer 12 play the role of a differential wiring, the impedance of wiring can be controlled.

In FIG. 26, the portion where the first wiring layer 10 is bent corresponds to the overlapping portion 14, and in this region, the second wiring layer 12 is formed on the inclined surface of the second insulating layer 24, and thus the second wiring layer 12. Wide portion 16 is provided.

In FIG. 27, the bent portion of the second wiring layer 12 corresponds to the overlapping portion 14. In this region, the second wiring layer 12 is formed on the inclined surface of the second insulating layer 24. A wide portion 16 of the layer 12 is provided. In FIG. 27, the planar circular wide portion 16 is provided.

  Alternatively, as shown in FIG. 28, the second wiring layer 12 connects one of the pair of additional first wiring layers 10a and 10b provided on the first insulating layer 22 (see FIG. 29) to the other. It may function as a jumper line. By using the jumper line, it is possible to route complicated wiring, and the degree of freedom of wiring can be further increased. In FIG. 28, elements other than the wiring layer (the metal substrate 20, the first insulating layer 22, the second insulating layer 24, the protective layer 26, etc.) are omitted.

  FIG. 29 shows a cross section taken along the line DD of FIG. As shown in FIGS. 28 and 29, the suspension substrate 1 includes a metal substrate 20, a first insulating layer 22 provided on the metal substrate 20, and a pair of additional elements provided on the first insulating layer 22. A first wiring layer 10 provided on the first wiring layers 10a and 10b and the first insulating layer 22 and passing between the pair of additional first wiring layers 10a and 10b, the first insulating layer 22, and the first wiring The second insulating layer 24 provided on the layer 10, the additional first wiring layers 10a and 10b, the second wiring layer 12 provided on the second insulating layer 24, and the second insulating layer 24, Vias 18a and 18b connecting the two wiring layers 12 and the additional first wiring layers 10a and 10b are provided. In addition, illustration of the protective layer provided so that the 2nd wiring layer 12 may be covered is abbreviate | omitted.

  As shown in FIG. 29, in the suspension substrate 1, the second insulating layer 24 has a level difference caused by the surface of the first insulating layer 22, the surface of the first wiring layer 10, and the surfaces of the additional first wiring layers 10 a and 10 b. The shape follows, and irregularities are generated on the surface of the second insulating layer 24. The second insulating layer 24 is inclined above the edge portion E of the first wiring layer 10 and above the edge portions Ea and Eb of the additional first wiring layers 10a and 10b.

As shown in FIG. 28, in the suspension substrate 1, the second wiring layer 12 is located above the first wiring layer 10 and the second wiring layer 12 is located above the additional first wiring layers 10a and 10b. 2nd overlapping parts 14a and 14b located in are provided. In the overlapping portion 14 and the second overlapping portions 14a, 14b, the second wiring layer 12 has a wider width portion 16, 16a, 16b, the line width of which is wider than the line width of other portions of the second wiring layer 12 when viewed from the plane. have.

The second wiring layer 12 above the edge portion E of the first wiring layer 10 is a wide portion 16 having a wide line width, and the second wiring layer 12 above the edge portions Ea and Eb of the additional first wiring layers 10a and 10b is formed. Since the wide portions 16a and 16b have a wide line width, at least the inclined portion of the second insulating layer 24 is included, and disconnection of the second wiring layer 12 as a jumper line formed on the periphery thereof is prevented. The second wiring layer 12 can be stably formed, and the reliability of the second wiring layer 12 can be improved.

  In the configuration shown in FIG. 28, the line width of the second wiring layer 12 other than the wide portions 16, 16a, 16b may be made as wide as the line widths of the wide portions 16, 16a, 16b.

Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Mounting area | region 3 Electrode pad 10, 10R, 10W 1st wiring layer 10a, 10b Additional 1st wiring layer 12, 12R, 12W 2nd wiring layer 14 Overlapping part 14a, 14b 2nd overlapping part 16, 16a, 16b Wide portions 18a, 18b Via 20 Metal substrate 22 First insulating layer 24 Second insulating layer 26 Protective layer 30 Sputtering layers 31, 32, resist 33 Metal film 34 Sputtering layers 35, 36 Resist 37 Metal film 41 Suspension 42 Load beam 51 Suspension with head 52 Slider 61 Hard disk drive 62 Case 63 Disk 64 Spindle motor 65 Voice coil motor 66 Arm

Claims (7)

A metal substrate;
A first insulating layer provided on the metal substrate;
A first wiring layer provided on the first insulating layer;
A second insulating layer provided on the first wiring layer;
A second wiring layer provided on the second insulating layer;
A pair of additional first wiring layers provided on the first insulating layer;
A suspension substrate comprising:
The second wiring layer functions as a jumper line that connects one additional first wiring layer and the other additional first wiring layer,
Said second wiring layer, the portion located above the first wiring layer through the second insulating layer and including at least overlapping portion, above the additional first wiring layer through the second insulating layer A second overlapping portion including a portion located ,
The wide portion in which the line width of the second wiring layer in the overlapping portion and the second overlapping portion is wider than the line width of the other portion of the second wiring layer between the overlapping portion and the second overlapping portion. Each of the suspension substrates is characterized by comprising:   The suspension substrate according to claim 1, wherein the second wiring layer crosses non-parallel to the first wiring layer. The wide part suspension substrate according to claim 1 or 2, characterized in that provided above the line width direction end portion of the first wiring layer. The second wiring layer, suspension substrate according to any one of claims 1 to 3, characterized in that it has a side sectional shape having a step at the overlapping portion. The line width of the wide portion, the suspension board according to any one of claims 1 to 4, wherein the at second least 1.2 times the line width of the other portions of the wiring layer. The sum of the thickness of the first wiring layer and the thickness of the second insulating layer on the first wiring layer is T1, and the second wiring layer below the other portion excluding the overlapping portion is the first. 6. The suspension substrate according to claim 5 , wherein when the thickness of the two insulating layers is T2, T1−T2 <12 μm is satisfied, and the line width of the wide portion is 10 μm or more. The thickness of the first wiring layer is 3μm or 12μm or less, suspension substrate according to claim 5 or 6, wherein the line width is 5μm or more 200μm or less.

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