JP6024226B2 - Flexure substrate for suspension - Google Patents

Description

  The present invention relates to a suspension flexure substrate used in a hard disk drive (HDD), and more particularly to a suspension flexure substrate excellent in strength of a connection terminal portion.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed. Increasing information transmission speed is required.

  A hard disk drive is a magnetic disk that is a magnetic recording medium, a spindle motor that rotates the magnetic disk at high speed, a magnetic head that reads or writes information on the magnetic disk, and each component that moves it while holding it with high precision. Drive control circuit and signal processing circuit.

  A component called a magnetic head suspension that supports a magnetic head used in this hard disk drive is generally called a so-called wireless suspension in which a signal line such as a copper wiring is formed directly on a stainless spring. Wiring integrated type (flexure) is adopted.

  Here, the wiring usually has a connection terminal portion for electrical connection with a magnetic head or an external circuit. Conventionally, a good electrical connection is made on the surface of the connection terminal portion. Therefore, a metal plating layer such as Ni (nickel) or Au (gold) is formed.

  In addition, as such connection terminal portions, so-called flying leads that are used not only on one side but also on both sides of a conductor pattern are becoming widespread in recent years in order to cope with higher density and downsizing of electronic and electrical devices. is there.

22 and 23 are explanatory views illustrating an example of the configuration of the connection terminal portion having a flying lead. FIG. 22 is a schematic plan view, and FIG. 23 is a cross-sectional view taken along line GG in FIG.
As shown in FIGS. 22 and 23, a metal support substrate 200 made of SUS or the like, a first insulating layer 300 formed on the metal support substrate 200, and a wiring formed on the first insulating layer 300 In the suspension flexure substrate including the layer 400 and the second insulating layer 500 that covers the wiring layer 400, the connection terminal portion 700 having the flying lead 450 opens the metal support substrate 200 and the first insulating layer 300. The back surface of the wiring layer 400 is exposed, the second insulating layer 500 is opened to expose the surface of the wiring layer 400, and a metal plating layer is provided on one or both sides of the exposed wiring layer 400 as necessary. Is formed.
And the connection terminal part 700 which has such a flying lead 450 is connected with an external terminal by applying ultrasonic vibration using a bonding tool etc., for example.

  However, in the connection terminal portion 700 having such a flying lead 450, since both surfaces of the wiring layer 400 are exposed, ultrasonic waves are easily transmitted and suitable for bonding by ultrasonic vibration, but physical strength. The edge of the opening of the first insulating layer 300 and the second insulating layer 500, that is, at the portion where the first insulating layer 300 and the second insulating layer 500 and the wiring layer 400 of the connection terminal portion intersect with the wiring layer 400 is weak. There is a problem that the stress is concentrated and the wiring layer 400 is easily disconnected.

  Therefore, as shown in FIG. 24, a suspension that secures strength by increasing the width of the wiring layer 400 at a portion where the first insulating layer 300 and the second insulating layer 500 intersect with the wiring layer 400 of the connection terminal portion 700. A flexure substrate has been proposed (Patent Document 1). Patent Document 1 also proposes a method of reinforcing the wiring layer 400 by protruding the first insulating layer 300 and the second insulating layer 500.

  Further, the metal support substrate 200, the first insulating layer 300, and the second insulating layer 500 are opened obliquely with respect to the wiring layer 400, and the stress applied to the edge portion of the opening is dispersed to reduce the stress concentration. Has been proposed (Patent Document 2).

JP 2003-31915 A JP2011-198402A

  However, as described in Patent Document 1, in the method of increasing the width of the wiring layer at the opening edge of the connection terminal portion where the flying lead is formed, the interval between the wiring layers cannot be reduced, It is disadvantageous for miniaturization. In addition, since the distance between the wiring layers cannot be reduced, there is a problem in that the insulation reliability between the wiring layers cannot be maintained when the number of wirings increases in the future.

  Further, in the method of reinforcing the flange lead with the protruding portion of the insulating layer as described in Patent Document 1, the distance between the joint portion joined by the bonding tool and the base of the flying lead is shortened. As a result, there is a problem that it is difficult to reduce the stress generated at the opening edge of the insulating layer of the flying lead, which can generate the greatest stress during bonding.

  In addition, in the method of opening the insulating layer obliquely with the insulating layer as described in Patent Document 2, the length of the exposed flying lead is shorter than when the insulating layer is opened perpendicular to the flying lead. Although slightly longer, there is a problem that the effect of stress dispersion is small.

  The present invention has been made in view of the above circumstances, and even when the wiring is miniaturized or densified, while ensuring the wiring strength of the connection terminal portion and effectively preventing disconnection, the external It is an object of the present invention to provide a suspension flexure substrate that can ensure connection reliability with a terminal.

  In order to solve the above problems, a flexure substrate for suspension according to the present invention includes a metal supporting substrate, an insulating layer on the metal supporting substrate, a wiring layer on the insulating layer, and an insulating layer and a protective layer on the wiring layer. A suspension flexure substrate having a connection terminal portion in which the metal support substrate, the insulating layer, and the protective layer are all open, and the front and back sides of the wiring layer and the side surfaces in the line width direction are exposed; In the periphery of the connection terminal portion, one or both of the insulating layer and the protective layer has a receding region that does not exist on the side of the wiring layer in plan view, and between the receding region and the wiring layer, A non-retreating region in which a layer provided with a retreating region exists is interposed.

  In the suspension flexure substrate according to the present invention, the receding region is provided separately on both sides of the wiring layer in a plan view.

  In the flexure substrate for suspension according to the present invention, a plurality of the wiring layers are provided on the insulating layer, and the receding region disposed between the wiring layers adjacent to each other around the connection terminal portion. In the meantime, a remaining portion in which a layer provided with the receding region exists is provided.

  In the flexure substrate for suspension according to the present invention, the area of the receding region of the protective layer in plan view is larger than the area of the receding region of the insulating layer.

  In the flexure substrate for suspension according to the present invention, the area of the receding region of the insulating layer in plan view is larger than the area of the receding region of the protective layer.

  In the suspension flexure substrate according to the present invention, the opening of the metal support substrate in a plan view includes the opening of the insulating layer in the connection terminal portion and the receding region.

  In the flexure substrate for suspension according to the present invention, at least a part of the receding region of the insulating layer and at least a part of the receding region of the protective layer penetrate each other in a stacking direction by overlapping each other in plan view. A region is formed.

  ADVANTAGE OF THE INVENTION According to this invention, it can relieve | moderate that the stress by the ultrasonic wave at the time of terminal connection concentrates on the specific part of a wiring layer, and can provide the flexure board | substrate for suspensions which a wiring layer does not disconnect or generate | occur | produce easily.

It is the schematic which shows an example of the flexure board | substrate for suspensions of this invention. It is an enlarged plan view which shows an example of the connection terminal part in the flexure board | substrate for suspensions of this invention. It is a top view which shows the example of the retreat area | region in the connection terminal part shown in FIG. It is sectional drawing which shows an example of the connecting terminal part shown in FIG. 2 and FIG. It is a top view which shows the example of the shape of the retreat area | region in the connection terminal part shown in FIG. It is a top view which shows the other example of the retreat area | region in the connection terminal part shown in FIG. It is sectional drawing which shows the method of joining the flexure board | substrate for suspensions of this invention to the terminal of an external circuit. It is an enlarged plan view which shows the other example of the connection terminal part in the flexure board | substrate for suspensions of this invention. It is a top view which shows the example of the retreat area | region in the connection terminal part shown in FIG. It is sectional drawing which shows an example of the connecting terminal part shown in FIG. 8 and FIG. It is the top view and sectional drawing explaining the manufacturing method of the flexure substrate for suspensions of this invention. FIG. 12 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 11. It is the top view and sectional drawing explaining the process of following FIG. FIG. 14 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 13. It is the top view and sectional drawing explaining the process following FIG. FIG. 16 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 15. FIG. 17 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 16. FIG. 18 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 17. It is the top view and sectional drawing explaining the process of following FIG. FIG. 20 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 19. FIG. 21 is a plan view and a cross-sectional view illustrating a process following the process in FIG. 20. It is a top view which shows the connection terminal part in the conventional flexure board | substrate for suspensions. It is sectional drawing which shows the connection terminal part in the conventional flexure board | substrate for suspensions. It is a top view which shows the other form of the connection terminal part in the conventional flexure board | substrate for suspensions.

  Hereinafter, the flexure substrate for suspension of the present invention will be described in detail.

  FIG. 1A is a schematic plan view of a suspension flexure substrate according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX in FIG. The flexure substrate 1 includes a metal support substrate 2, an insulating layer 3 provided on the metal support substrate 2, a plurality of wiring layers 4 provided on the insulating layer 3, and a protective layer provided on the wiring layer 4. And 5. In FIG. 1A, since the wiring layer 4 is shown in a simplified manner, for example, the number of wiring layers in the XX section is shown as one, but the number of wirings is not limited to this. For example, FIG. As shown in (b), there may be two in the XX section, or a two-layer structure with two upper and lower portions.

  One end of the wiring layer 4 is connected to the slider head installation region 6 and the other end is connected to the connection terminal portion 7. The connection terminal portion 7 is joined to the terminal 101 of the external circuit 100 by ultrasonic bonding (see FIG. 7).

  FIG. 2 is an enlarged plan view of the vicinity of the connection terminal portion 7 in the first embodiment of the present invention. 2A is a plan view seen from the protective layer 5 side, and FIG. 2B is a plan view seen from the metal support substrate 2 side (or the insulating layer 3 side). FIG. 3 is an enlarged view of the receding region 80 and the vicinity thereof (region A in FIG. 2B). 4A is a sectional view including the connection terminal portion 7 corresponding to the BB position in FIG. 3 and the vicinity thereof, and FIG. 4B is a connection corresponding to the CC position in FIG. It is sectional drawing containing the terminal part 7 and its vicinity. 2 to 4, the connection terminal portion 7 is a region in which all of the metal support substrate 2, the insulating layer 3, and the protective layer 5 are opened. In this region, the front and back of the wiring layer 4 and the side surface 4a in the line width direction thereof. Is exposed. That is, for example, in FIG. 2B, a region X indicated by a broken line is the connection terminal portion 7. In the connection terminal portion 7, the wiring layer 4 forms a flying lead, and other metal layers such as gold plating are provided on one side or both sides as necessary in order to improve the connectivity with the terminal 101 of the external circuit 100. You may have. In the connection terminal portion 7, a rectangular metal support opening 25 is provided in the metal support substrate 2, a rectangular insulating layer opening 35 is provided in the insulating layer 3, and a rectangular protective layer is provided in the protective layer 5. An opening 55 is provided. The wiring layer 4 is exposed at the connection terminal portion 7 by the metal support opening 25, the insulating layer opening 35, and the protective layer opening 55. The line width direction side surface 4a is a side surface extending in the longitudinal direction of the wiring layer 4 in a plan view (for example, in FIG. 2), and is located on both sides in the line width direction orthogonal to the longitudinal direction. Used to mean side.

  On the other hand, in the periphery (outer periphery) of the connection terminal portion, the insulating layer 3 has a receding region 80 where the insulating layer 3 does not exist. In the receding region 80, the end 31 of the insulating layer 3 recedes in a direction away from the connection terminal portion on the side of the wiring layer 4 in plan view. In FIG. 2 thru | or FIG. 4, in the protective layer 5, there is no part which the edge part 51 recedes in the direction away from a connection terminal part.

  As shown in FIGS. 2 and 3, the receding region 80 is provided separately on both sides of the wiring layer 4 in plan view. Thereby, the stress applied to the wiring layer 4 can be more effectively reduced over the line width direction of the wiring layer 4. The metal support substrate receding region 80 is not limited to being provided separately on both sides of the wiring layer 4, and may be provided only on one side of the wiring layer 4. Even in this case, the stress applied to the wiring layer 4 can be effectively relieved.

  Between the receding region 80 and the wiring layer 4, a non-retreating region 82 where the insulating layer 3 exists is interposed. Thus, the receding region 80 is separated from the wiring layer 4 in plan view. In the form shown in FIG. 3, there is no receding region 80 in the portion overlapping the wiring layer 4. Thereby, the strength of the insulating layer 3 that supports the wiring layer 4 is ensured.

  2 to 4, the protective layer 5 is opened so as to include the connection terminal portion 7 and the receding region 80. That is, the protective layer opening 55 is formed so as to include the insulating layer opening 35 and the receding region 80. In addition, the metal supporting board 2 is opened so as to include the protective layer opening 55. That is, the metal support substrate opening 25 is formed so as to include the insulating layer opening 35 and the receding region 80. This is to prevent the wiring layer 4 and the metal support substrate 2 from coming into contact with each other and short-circuiting when bonding the wiring layer 4 in the connection terminal portion 7.

  As shown in FIG. 3, in the periphery (outer periphery) of the connection terminal portion 7, the insulating layer residual portion 37 in which the insulating layer 3 exists between the receding regions 80 disposed between the wiring layers 4 adjacent to each other. Is provided. Thereby, the strength of the insulating layer 3 that supports the connection terminal portion 7 is secured. In addition, since each receding region 80 is interposed between the portion of the insulating layer 3 on the wiring layer 4 and the insulating layer residual portion 37, the occurrence of defects such as disconnection or deformation of the wiring layer 4 is further suppressed. doing.

  FIG. 5 is a diagram showing an example of the shape of the receding region 80. The shape of the end portion 31 of the receding region 80 (or the insulating layer 3) may be trapezoidal as shown in FIG. 3, or extends in a band shape as shown in FIGS. 5 (a) and 5 (b). The tip may be semicircular (FIG. 5A), the tip may be polygonal (FIG. 5B), or may be rectangular as a whole as shown in FIG. 5C. Furthermore, it may be semicircular as a whole as shown in FIG. 5 (d), or may be elliptical as shown in FIG. 5 (e).

  In FIG. 5, the receding region 80 has an end shape that does not have a vertex as shown in FIGS. 5 (a), 5 (d), and (e), or a shape that has a large interior angle as shown in FIG. 5 (b). Some are preferred. If there are no vertices as shown in FIGS. 5A, 5D, and 5E, stress concentration at the vertices can be avoided during ultrasonic bonding. This is because the stress concentration at the apex becomes very small if the shape is large. The receding length L of the receding region 80 (the maximum length of the receding region 80 in the direction orthogonal to the line width direction of the wiring layer 4) is not particularly limited, but is 0.5% of the line width of the wiring layer 4. About 2 times is preferable. If the receding length L of the receding region 80 is too small with respect to the line width of the wiring layer 4, the effect of making the wiring layer 4 difficult to break or deform is hardly exhibited. This is because an adverse effect on the strength of the insulating layer 3 that supports the substrate can be considered. Although the line width of the wiring layer 4 is not specifically limited, For example, the range of 10 micrometers-200 micrometers is mentioned. If the line width of the wiring layer 4 is too small, the conductivity may be deteriorated. If the line width of the wiring layer 4 is too large, the suspension flexure substrate may not be sufficiently densified. Because.

  In addition, the retreat area | region 80 is not restricted to the example shown in FIG. 3, For example, it can also arrange | position in the position as shown in FIG. Here, FIG. 6 is a diagram showing another example of the arrangement of the receding regions 80 shown in FIG. In FIG. 6, the receding region 80 is provided with a non-retreating region 82 interposed between the wiring layer 4 and the wiring region 4. Due to the receding region 80 provided on the wiring layer 4, the surface of the wiring layer 4 on the insulating layer 3 side is exposed, and in the receding region 80, the boundary line between the exposed portion and the unexposed portion of the wiring layer 4 is elongated. When the wiring layer 4 is connected to the terminal 101 of the external circuit 100 by ultrasonic bonding, stress concentration on the wiring layer 4 is alleviated and defects such as disconnection and deformation of the wiring layer 4 are generated. Can be suppressed.

  As shown in FIG. 7A, when connecting the wiring layer 4 to the external circuit 100, the protective layer 5 is brought into contact with the external circuit 100, and the wiring layer 4 is connected to the terminal 101 of the external circuit 100 by the bonding tool 110. Pushed in. At this time, since the insulating layer 3 is provided with the receding region 80, the wiring layer 4 is bent from a portion intersecting with the edge 55a of the protective layer opening 55 (an edge extending in a direction orthogonal to the wiring layer 4). Can do. This alleviates stress concentration at the portion intersecting the edge 35a of the insulating layer opening 35 of the wiring layer 4 (the edge extending in the direction orthogonal to the wiring layer 4), and the wiring layer 4 is disconnected or deformed. The occurrence of defects can be suppressed. In this case, after the wiring layer 4 is pushed by the bonding tool 110, the repulsive force to return to the shape before the insulating layer 3 is pushed can be reduced, and the wiring layer 4 and the terminal 101 of the external circuit 100 can be reduced. Bonding reliability can be improved. Further, as shown in FIG. 7B, the metal support substrate 2 can be brought into contact with the external circuit 100 to ultrasonically bond the wiring layer 4 to the terminal 101 of the external circuit 100. Also in this case, the wiring layer 4 intersects with a portion intersecting with the edge 55a of the protective layer opening 55 or with an edge 25a of the metal support substrate opening 25 (an edge extending in a direction perpendicular to the wiring layer 4). It is possible to bend from the portion, to relieve stress concentration on the portion intersecting the edge 35a of the insulating layer opening 35 of the wiring layer 4, and to suppress the occurrence of defects such as disconnection and deformation of the wiring layer 4. it can.

  FIG. 8 is an enlarged plan view of the vicinity of the connection terminal portion 7 in the second embodiment of the present invention. 8A is a plan view seen from the protective layer 5 side, and FIG. 8B is a plan view seen from the metal support substrate 2 side (or the insulating layer 3 side). FIG. 9 is an enlarged view of the receding region 80 and the vicinity thereof (region A in FIG. 2B). 10A is a cross-sectional view including the connection terminal portion 7 corresponding to the DD position in FIG. 9 and the vicinity thereof, and FIG. 10B is a connection corresponding to the EE position in FIG. It is sectional drawing containing the terminal part 7 and its vicinity. 8 to 10, the same reference numerals are given to portions common to FIGS. 2 to 4, and the description thereof is omitted. In the present embodiment, the protective layer 5 has a receding region 81 in which the protective layer 5 does not exist in the periphery (outer periphery) of the connection terminal portion in the same manner as the receding region 80. The part 51 is retracted in a direction away from the connection terminal part. That is, the receding region 81 is provided separately on both sides of the wiring layer 4 in plan view. Thereby, the stress applied to the wiring layer 4 can be more effectively reduced over the line width direction of the wiring layer 4. The receding region 81 of the protective layer 81 is not limited to being provided separately on both sides of the wiring layer 4, and may be provided only on one side of the wiring layer 4. Even in this case, the stress applied to the wiring layer 4 can be effectively relieved.

  A part of the receding region 81 of the protective layer 5 forms a penetrating region 85 penetrating in the stacking direction by overlapping with a part of the receding region 80 of the corresponding insulating layer 3 in plan view. Thereby, the concentration of stress on the wiring layer 4 is further relaxed. Further, a non-retreat region 83 where the protective layer 5 exists is interposed between the receding region 81 and the wiring layer 4. The entire receding region 80 of the insulating layer 3 and the corresponding receding region 81 of the protective layer 5 may form the penetrating region 85.

  In this embodiment, as shown in FIG. 9, the position of the edge 35 a of the insulating layer opening 35 and the position of the edge 55 a of the protective opening 55 do not match. This is because the stress concentration is alleviated by shifting the positions of the edges of the insulating layer 3 and the protective layer 5. 8 to 10, the area of the receding region 81 of the protective layer 5 (the portion where the protective layer 5 does not exist) is larger than the area of the receding region 80 of the insulating layer 3 (the portion where the insulating layer 3 does not exist). It is getting bigger. Here, as described later, the receding region 80 of the insulating layer 3 is formed by etching after the protective layer 5 including the receding region 81 is formed. Thereby, when the receding region 80 of the insulating layer 3 is formed, the protective layer 5 can be prevented from being etched again, and the shape of the receding region 81 can be maintained. However, the present invention is not limited to this, and the area of the receding region 80 of the insulating layer 3 may be larger than the area of the receding region 81 of the protective layer 5. As a result, the stress applied to the wiring layer 4 can be more effectively relieved by providing the recess region 80 having a larger area in the insulating layer 3 that is generally thicker than the protective layer 5. In this case, the material forming the protective layer 5 is different from the material forming the insulating layer 3 in order to prevent the protective layer 5 from being etched when the insulating layer 3 is etched. Is preferred.

  8 to 10, the edge 55 a of the protective layer opening 55 is formed so as to be farther from the connection terminal portion 7 than the edge 35 a of the insulating layer opening 35. However, the edge 35 a of the insulating layer opening 35 may be formed so as to be farther from the connection terminal portion 7 than the edge 55 a of the protective layer opening 55. In the latter case, it is possible to alleviate stress concentration at a portion intersecting the edge 35a of the insulating layer opening 35 of the wiring layer 4 at the time of ultrasonic bonding, and the risk of disconnection and deformation of the wiring layer 4 can be reduced. .

  The shape of the end portion 51 of the receding region 81 (or the protective layer 5) may be formed in the same manner as the shape of the end portion 31 of the insulating layer 3 described in the first embodiment. Further, the shape of the end 51 of the protective layer 5 and the shape of the end 31 of the insulating layer 3 may be the same or different.

  Further, similarly to the insulating layer residual portion 37, the protection layer 5 exists in the periphery (outer periphery) of the connection terminal portion 7 and between the receding regions 81 arranged between the adjacent wiring layers 4. A layer remainder 57 is provided. Thereby, the intensity | strength of the protective layer 5 which supports the connection terminal part 7 is ensured. In addition, since each receding region 81 is interposed between the protective layer 5 portion on the wiring layer 4 and the protective layer residual portion 57, the occurrence of defects such as disconnection and deformation of the wiring layer 4 is further suppressed. can do.

  Next, a method for manufacturing a flexure substrate for suspension according to the present invention will be described.

  11 to 21 are views showing an example of a manufacturing method of the flexure substrate for suspension according to the first embodiment. 11 to 21, (a) is a plan view seen from the upper surface (protective layer side) of the flexure substrate, (b) is a plan view seen from the lower surface (metal support substrate side) of the flexure substrate, and (c) is It is FF sectional drawing in (a) and (b) (sectional drawing in the part used as a wiring layer).

  First, as shown in FIG. 11, a substrate material 9 including a metal supporting substrate 2, an insulating layer 3, a seed layer 40 and a metal plating layer 41 is prepared. The metal support substrate 2 is preferably a SUS material, but is not particularly limited as long as it has a desired rigidity. Examples of the insulating layer 3 include polyimide. However, the insulating layer 3 is not particularly limited as long as it has insulating properties. Examples of the seed layer 40 include nickel (Ni), chromium (Cr), and copper (Cu) formed by sputtering, but are not particularly limited as long as the metal plating layer 41 can be formed on the layer. . The seed layer 40 is a layer that forms the wiring layer 4 integrally with the metal plating layer 41 after the wiring layer 4 is formed.

  Next, as shown in FIG. 12, resist layers 90 and 91 are formed so as to cover the metal plating layer 41 and the metal support substrate 2, respectively, and further patterned. Examples of the method for forming the resist layers 90 and 91 include a method of laminating a dry film resist and a method of applying a liquid resist by a method such as spin coating or slit coating. As a patterning method for the resist layers 90 and 91, for example, a so-called photolithography method in which a resist is exposed using a photomask on which a desired pattern is formed and then developed is used. By the patterning, a portion of the resist layer 90 where the wiring layer 4 is not formed is removed, and a portion of the resist layer 91 where the metal support substrate 2 is opened is removed.

  Next, as shown in FIG. 13, the wiring layer 4 is formed by performing chemical etching on the portion of the seed layer 40 and the metal plating layer 41 where the resist layer 90 is not present. Chemical etching is also performed on the portion where the resist layer 91 does not exist, so that the metal support substrate opening 25 is formed. After the etching, the resists 90 and 91 are peeled off (FIG. 14).

  Next, as shown in FIG. 15, the protective layer 5 is formed so as to cover the insulating layer 3 and the wiring layer 4. Although the same material as the insulating layer 3 can be used for the protective layer 5, it is not limited to this.

  Next, as shown in FIG. 16, a resist layer 92 is formed so as to cover the surface on the protective layer 5 side, and a resist layer 93 is formed so as to cover the surface on the metal support substrate side, and further patterning is performed. A method similar to the method for forming the resist layers 90 and 91 described above can be applied to the method for forming the resist layers 92 and 93 and the patterning method. Here, the patterning shape of the resist layer 92 is a rectangular pattern straddling a plurality of wiring layers 4 (metal plating layers 41) arranged in parallel in a plan view. Further, the area of the protective layer opening 55 (see FIG. 18) after the protective layer 5 is opened is made smaller than that of the metal support substrate opening 25 in plan view. By patterning, a portion of the resist layer 92 where the protective layer 5 is opened is removed.

  Next, as shown in FIG. 17, the portion of the protective layer 5 where the resist layer 92 is not formed is removed, and then the resist layer 92 and the resist layer 93 are removed (FIG. 18). As a method for removing the protective layer 5, for example, when the protective layer 5 is formed of a polyimide material, etching with an organic alkaline solution or plasma etching may be used.

  Next, as shown in FIG. 19, a resist layer 94 is formed so as to cover the surface on the protective layer 5 side, and a resist layer 95 is formed so as to cover the surface on the metal support substrate 2 side, and further patterning is performed. . The formation method and patterning method of the resist layers 94 and 95 are the same as the formation method and patterning method of the resist layers 90 to 93 described above. Here, the patterning shape of the resist layer 95 includes a rectangular pattern straddling a plurality of wiring layers 4 (metal plating layers 41) arranged in parallel in a plan view, and a receding pattern connected to the outer periphery of the rectangular pattern corresponding to the receding region 80. , Keep the shape connected continuously. In addition, the insulating layer opening 35 (see FIG. 21) after the insulating layer 3 is opened has a smaller area in plan view than the protective layer opening 55 and the metal support substrate opening 25. By patterning, the portion of the resist layer 95 where the insulating layer 3 is opened is removed.

  Next, as shown in FIG. 20, a portion of the insulating layer 3 where the resist layer 95 is not formed is removed. As a method for removing the insulating layer 3, for example, when the insulating layer 3 is formed of a polyimide material, the same method as described in the method for removing the protective layer 5 can be used.

  Next, as shown in FIG. 21, the resist layer 94 and the resist layer 95 are removed, and the flexure substrate for suspension according to the present invention is obtained.

  The manufacturing method of the suspension flexure substrate according to the present invention has been described above, but the manufacturing method is not limited to this.

  Hereinafter, the present invention will be described more specifically with reference to examples.

  A metal support substrate made of SUS material, an insulating layer made of polyimide, a seed layer made of a sputtering layer of nickel (Ni), chromium (Cr), copper (Cu), and a metal plating layer made of a copper plating layer Laminated substrate materials were prepared, and a dry film resist was bonded to both sides thereof. Subsequently, the dry film resist was patterned by exposure and development. The patterning shape was a wiring pattern shape on the metal plating layer side, and a rectangular opening shape including the connection terminal portion on the metal support substrate side. Thereafter, the metal plating layer and the metal supporting substrate were etched using ferric chloride solution, and the seed layer where the exposed metal plating layer was removed was removed. As a result, a wiring layer was formed on the insulating layer, and a rectangular opening was formed in the metal support substrate.

  Subsequently, a protective layer made of polyimide was formed on the surface on which the wiring layer was formed, and a resist was formed so as to cover it. A resist was also formed on the surface of the metal support substrate. Next, the resist was subjected to patterning by exposure and development. The patterning pattern of the resist on the protective layer side was a rectangular pattern having the same center position as the opening of the metal support substrate, and the area was smaller than the opening of the metal support substrate. Thereafter, the protective layer was etched using an organic alkali solution. Thereby, the connection terminal part was exposed among the surfaces by the side of the protective layer of a wiring layer.

  Subsequently, a resist was formed so as to cover the surface on the protective layer side and the surface on the metal support substrate side, and patterning by exposure and development was performed on the resist. As for the patterning pattern of the resist on the metal support substrate side, the rectangular pattern having the same center position as the opening of the metal support substrate and the receding pattern connected to the outer periphery of the rectangular pattern corresponding to the receding region were continuously connected. The shape is smaller than the opening of the protective layer and the opening of the metal support substrate. Thereafter, the insulating layer was etched using an organic alkali solution. As a result, the front and back surfaces were exposed in part of the wiring layer, and flying leads were formed. Thereafter, the surface of the wiring layer on the side connected to the external circuit was gold-plated to obtain a flexure substrate for suspension in the present invention.

  In addition, said embodiment is an illustration and this invention is not limited to said embodiment. That is, the present invention can be applied to the connection terminal portion 7 of the suspension flexure substrate 1 in FIG. 1, for example, in the slider head grounding region 6, the suspension flexure substrate 1 and the slider head (not shown). The present invention can also be applied to terminals that are electrically connected to the terminal. In other words, a device having substantially the same configuration as the technical idea described in the claims of the present invention and having the same function and effect is included in the technical scope of the present invention in any case. Is done.

DESCRIPTION OF SYMBOLS 1 ... Flexure substrate for suspension 2 ... Metal support substrate 3 ... Insulation layer 4 ... Wiring layer 4a ... Line width direction side surface 5 ... Protective layer 6 ... Slider head installation area 7 ... Connection terminal part 9 ... Substrate material 25 ... Metal support substrate opening Part 25a ... Edge 31 ... End part (of insulating layer) 35 ... Insulating layer opening 35a ... Edge 37 ... Insulating layer remaining part 40 ... Seed layer 41 ... Metal plating layer 51 ... End part (of protective layer) 55 ... Protective layer Opening 55a ... Edge 57 ... Protective layer remaining part 80 ... Recessed area (on insulating layer side) 81 ... Recessed area (on protective layer side) 82 ... Non-retracted area (on insulating layer side) 83 ... (On protective layer side) Non-retreat area 85 ... penetrating area 90 ... resist layer 91 ... resist layer 92 ... resist layer 93 ... resist layer 94 ... resist layer 95 ... resist layer 100 ... external circuit 10 ... terminal 110 ... bonding tool 200 ... metal substrate 300 ... insulating layer 400 ... wiring layer 450 ... flying leads 500 ... protective layer 700 ... connection terminal portions L ... retracted length

Claims (6)

A suspension flexure substrate having a metal support substrate, an insulating layer on the metal support substrate, a wiring layer on the insulating layer, and a protective layer on the insulating layer and the wiring layer,
The metal support substrate, the insulating layer, and the protective layer are all open, and have a connection terminal portion in which the front and back of the wiring layer and the side surface in the line width direction are exposed,
In the periphery of the connecting terminal portion bi towards the insulating layer and the protective layer has a retraction area that does not exist on the side of the wiring layer in plan view,
Between the receding region and the wiring layer, a non-receding region in which a layer provided with the receding region exists is interposed ,
At least a part of the receding region of the insulating layer and at least a part of the receding region of the protective layer overlap each other in a plan view to form a penetrating region penetrating in the stacking direction. Flexure substrate for suspension.   The suspension flexure substrate according to claim 1, wherein the receding region is provided separately on both sides of the wiring layer in plan view. A plurality of the wiring layers are provided on the insulating layer,
In the periphery of the connection terminal portion, a remaining portion in which a layer provided with the receding region exists is provided between the receding regions arranged between the wiring layers adjacent to each other. The flexure substrate for suspension according to claim 2.   The suspension flexure substrate according to any one of claims 1 to 3, wherein an area of the receding region of the protective layer in plan view is larger than an area of the receding region of the insulating layer.   The suspension flexure substrate according to any one of claims 1 to 3, wherein an area of the receding region of the insulating layer in plan view is larger than an area of the receding region of the protective layer.   The opening of the metal support substrate in plan view includes the opening of the insulating layer in the connection terminal portion and the receding region, according to any one of claims 1 to 5. Flexure substrate for suspension.