JP5668784B2 - Suspension board with support frame - Google Patents

Description

  The present invention relates to a suspension substrate with a support frame that can cut a suspension substrate from a support frame with high productivity and has a high degree of design freedom of the suspension substrate.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required.

  A suspension substrate (flexure) used in an HDD is usually formed at one end portion, formed at a recording / reproducing element mounting area for mounting a recording / reproducing element such as a magnetic head slider, and at the other end portion. It has an external circuit board connection area for connecting to the external circuit board, and a wiring layer for connecting the recording / reproducing element mounting area and the external circuit board connection area. The suspension substrate usually has a basic structure in which a metal support substrate, an insulating layer, and a wiring layer are laminated in this order.

  For example, it is known that a plated portion is provided on the surface of the terminal portion of the wiring layer for the purpose of preventing deterioration and improving connection reliability. Patent Document 1 discloses a method for manufacturing a printed circuit board in which a part of a plating lead (plating wire) is removed by etching. On the other hand, Patent Document 2 discloses a printed circuit board having a wiring pattern formed on a base insulating layer so as to be electrically connected to a metal supporting board in a first grounding portion, and includes Is provided at the separation portion of the metal support substrate. Patent Document 3 discloses a suspension substrate in which terminal portions of a wiring layer are disposed laterally with respect to the longitudinal direction of the suspension substrate.

JP 2009-272549 A JP 2010-171040 A US Patent Application Publication No. 2002/0053590

  As the functionality of HDDs increases, the number of wiring layers required for a suspension board is increasing. For this reason, the number of terminal portions also increases, and it is necessary to devise arrangement of the terminal portions. On the other hand, in the manufacture of the suspension substrate, as will be described later, a sheet (suspension substrate with a support frame) in which a plurality of suspension substrates and a support frame are integrated is manufactured. Thereafter, the suspension substrate is cut from the support frame to obtain individual suspension substrates. For example, if the terminal portions are arranged in a horizontal manner to be described later and the plating wires are made common, the common plating wire-containing structure described later is likely to be deformed, and the suspension substrate may not be cut from the support frame with high productivity. In addition, in order to prevent deformation of the structure containing the common plating line, it is assumed that the width of the metal support board of the structure containing the common plating line is increased overall. The degree becomes lower.

  The present invention has been made in view of the above circumstances, and provides a suspension substrate with a support frame that can cut the suspension substrate from the support frame with high productivity and has a high degree of design freedom of the suspension substrate. Main purpose.

  In order to solve the above problems, in the present invention, a suspension with a support frame has a suspension substrate and a support frame, and the suspension substrate and the support frame are integrated in an internal opening region of the support frame. The suspension substrate includes a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer, wherein the wiring layer is a terminal. Each of the plurality of terminal portions coincides with the short direction of the suspension substrate, and the plurality of terminal portions are arranged in parallel along the longitudinal direction of the suspension substrate. The support frame includes the metal support substrate, the insulating layer formed on the metal support substrate, and a conductor layer formed on the insulating layer, and supports the support toward the inner opening region. The common plated wire-containing structure is formed from the metal supporting substrate, the insulating layer formed on the metal supporting substrate, the insulating layer formed on the insulating layer, and the conductor. A common plating line portion formed continuously from the layer, a connection wiring portion for connecting the common plating line portion and the plurality of terminal portions is formed, and the common plating wire-containing structure The metal support substrate is formed continuously from the metal support substrate of the support frame, and further, a root portion formed on the support frame side and the opposite side of the support frame are formed on the side. Provided is a suspension substrate with a support frame, comprising a tip portion having a width narrower than a width of a root portion.

  According to the present invention, since the metal support substrate of the common plating wire-containing structure has the root portion, the deformation of the common plating wire-containing structure can be prevented, and the suspension substrate can be cut from the support frame with high productivity. it can. Furthermore, since the metal support substrate of the common plated wire-containing structure includes a tip portion having a width smaller than the width of the root portion, the degree of freedom in designing the suspension substrate can be increased.

  In the said invention, it is preferable that a disconnection part is formed in the said connection wiring part, and the said board | substrate for suspension and the said common plating wire containing structure are isolate | separated. This is because the number of cuts necessary for manufacturing the suspension substrate can be reduced.

  The suspension substrate with a support frame of the present invention has an effect that the suspension substrate can be cut from the support frame with high productivity and the design freedom of the suspension substrate is high.

It is a schematic plan view which shows an example of the board | substrate for suspensions with a support frame of this invention. It is a schematic diagram which shows an example of the board | substrate for suspensions in this invention. It is a schematic plan view explaining the board | substrate for suspensions with a support frame of this invention. FIG. 4 is a schematic plan view showing only the metal support substrate in FIG. 3. It is a schematic plan view for demonstrating the effect of this invention. It is a schematic plan view for demonstrating the effect of this invention. It is a schematic plan view explaining the metal support substrate in this invention. It is a schematic plan view explaining the metal support substrate in this invention. It is a schematic diagram explaining the board | substrate for suspensions with a support frame of this invention. It is a schematic diagram explaining the board | substrate for suspensions with a support frame of this invention. It is a schematic diagram explaining the board | substrate for suspensions with a support frame of this invention. It is a schematic diagram explaining the board | substrate for suspensions with a support frame of this invention. It is a schematic diagram explaining the disconnection part in this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions with a support frame of this invention.

  Hereinafter, the suspension substrate with a support frame of the present invention will be described in detail.

  The suspension substrate with a support frame of the present invention includes a suspension substrate and a support frame, and the suspension substrate with a support frame in which the suspension substrate and the support frame are integrated in an internal opening region of the support frame. The suspension substrate includes a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer, and the wiring layer has a terminal portion. Each of the plurality of terminal portions coincides with the short direction of the suspension substrate, and the plurality of terminal portions are arranged in parallel along the longitudinal direction of the suspension substrate. Comprises the metal support substrate, the insulating layer formed on the metal support substrate, and a conductor layer formed on the insulating layer, and is formed from the support frame toward the inner opening region. A common plated wire-containing structure is formed, and the common plated wire-containing structure is formed on the metal support substrate, the insulating layer formed on the metal support substrate, and the conductor layer. A common plating line portion continuously formed from the connecting plating portion for connecting the common plating wire portion and the plurality of terminal portions, and the common plating wire-containing structure. The metal support substrate is formed continuously from the metal support substrate of the support frame, and further, a root portion formed on the support frame side, and a base portion formed on the opposite side of the support frame. And a tip portion having a width narrower than the width of the portion.

  FIG. 1 is a schematic plan view showing an example of a suspension frame-equipped suspension substrate according to the present invention. For convenience, the description of the insulating layer and the cover layer is omitted. A suspension substrate 200 with a support frame shown in FIG. 1 includes a plurality of suspension substrates 100 and a support frame 110, and a plurality of suspension substrates 100, the support frame 110, and the like are formed in an internal opening region 120 of the support frame 110. Are integrated.

  FIG. 2 is a schematic view showing an example of a suspension substrate in the present invention. 2A is a schematic plan view of the suspension substrate, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A. In FIG. 2A, illustration of the insulating layer and the cover layer is omitted for convenience. A suspension substrate 100 shown in FIG. 2A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / reproducing device. A plurality of wiring layers 103a to 103d for electrically connecting the element mounting region 101 and the external circuit board connection region 102; The wiring layer 103a and the wiring layer 103b are a pair of wiring layers. Similarly, the wiring layer 103c and the wiring layer 103d are also a pair of wiring layers. One of these two wiring layers is a writing wiring layer, and the other is a reading wiring layer. 2B, the suspension substrate 100 includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, and a wiring layer 3 formed on the insulating layer 2. And a cover layer 4 formed so as to cover the wiring layer 3.

FIG. 3 is a schematic plan view for explaining the suspension frame-equipped suspension substrate of the present invention, and FIG. 4 is a schematic plan view showing only the metal support substrate in FIG. In FIG. 3, the cover layer is not shown for convenience. As shown in FIG. 3, the wiring layer includes a routing portion 3a connected to an element connecting terminal portion (not shown), and a terminal portion 3b connected to the routing portion 3a (for example, an external circuit board connecting terminal portion). And have. The longitudinal directions x of the plurality of terminal portions 3b coincide with the short direction Y of the suspension substrate, and the plurality of terminal portions 3b are arranged in parallel along the longitudinal direction X of the suspension substrate. Further, the common plated wire containing structure 111 is formed from the support frame 110 toward the inner opening region. As shown in FIGS. 3 and 4, the common plated wire-containing structure 111 includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, and an insulating layer 2. A common plating line portion 3d formed continuously from the layer 3e. In addition, as shown in FIG. 3, a connection wiring portion 3c for connecting the common plating wire portion 3d and the plurality of terminal portions 3b is formed. As shown in FIG. 4, the metal support substrate 1 of the common plated wire-containing structure 111 is formed continuously from the metal support substrate 1 of the support frame 110 and is further formed on the support frame 110 side. It is a root portion 11a has, the support frame 110 and a distal portion 11b having a narrow width _{W 2} than the width _{W 1} of the formed opposite the base portion 11a.

  According to the present invention, since the metal support substrate of the common plating wire-containing structure has the root portion, the deformation of the common plating wire-containing structure can be prevented, and the suspension substrate can be cut from the support frame with high productivity. it can. Furthermore, since the metal support substrate of the common plated wire-containing structure includes a tip portion having a width smaller than the width of the root portion, the degree of freedom in designing the suspension substrate can be increased.

  Here, as shown in FIG. 5, in the conventional suspension substrate with a support frame, a plurality of plating wire portions 3 f are respectively formed on the plurality of terminal portions 3 b, and each plating wire portion 3 f is connected to the support frame 110. It was connected to the conductor layer 3e. On the other hand, there is an advantage that the suspension substrate can be downsized by changing the plurality of plated wire portions 3f in FIG. 5 to the common plated wire portions 3d as shown in FIG. 6A. On the other hand, when the common plated wire portion 3d is employed, a cut for making the plurality of terminal portions 3b independent (cut at CL1) and a cut for separating the suspension substrate 100 from the support frame 110 (at CL2) Cut) is required. For example, the plurality of terminal portions 3b and the common plating wire portion 3d are separated by cutting at CL1, but the stress at the time of cutting is concentrated on the root portion 11a shown in FIG. 6B. As a result, the metal support substrate 1 of the common plated wire containing structure 111 may be deformed so as to protrude in the thickness direction (z-axis direction). Due to the presence of the deformed metal support substrate 1, the suspension frame-equipped suspension substrate cannot be stably installed in a mold used at the time of cutting (for example, at the time of cutting at CL1), and productivity may be reduced.

On the other hand, in the present invention, as shown in FIG. 4 described above, the metal support substrate 1 of the common plated wire-containing structure 111 has a root portion having a width W ₁ larger than the width W ₂ of the tip end portion 11b. 11a is provided, the deformation of the common plated wire containing structure 111 can be prevented, and the suspension substrate 100 can be cut from the support frame 110 with high productivity. If the width of the base portion 11a and the tip portion 11b are both increased, the deformation of the common plated wire-containing structure 111 itself can be prevented, but the common plated wire-containing structure 111 is enlarged and the degree of freedom in designing the suspension substrate is increased. There is a problem of being lowered. In contrast, the metal supporting board 1 common plated wire containing structure 111, since with a tip 11b having a narrow width W ₂ than the width W ₁ of the root portion 11a, increasing the design flexibility of the suspension substrate can do.

  Further, in the present invention, since the common plated wire portion is formed, there is an advantage that the size can be reduced as compared with the case where a plurality of plated wire portions 3f are provided as shown in FIG. Furthermore, since the common plated wire-containing structure in the present invention is not included in the suspension substrate after cutting and remains in the support frame, the suspension substrate can be reduced in this respect as well.

  Further, in the present invention, as illustrated in FIG. 3 described above, the terminal portion 3b is formed so that the longitudinal direction x of the terminal portion 3b coincides with the short direction Y of the suspension substrate. The “longitudinal direction of the suspension substrate” means, for example, a direction parallel to a center line connecting a plurality of reference holes in the center of the suspension substrate, and the “short direction of the suspension substrate” means A direction perpendicular to the longitudinal direction of the substrate. The term “coincidence” in the present invention is a concept that includes not only strict parallelism but also a case of intersecting at a certain angle (for example, within a range of ± 30 °). In the present invention, as illustrated in FIG. 3 described above, the plurality of terminal portions 3b are arranged in parallel along the longitudinal direction X of the suspension substrate (lateral arrangement). The term “along” in the present invention is a concept that includes not only strict parallelism but also a case of intersecting at a certain angle (for example, within a range of ± 30 °).

As described above, since the plurality of terminal portions are arranged horizontally, there is an advantage that deformation of the terminal portions can be prevented even if the number of wiring layers is increased. As the functionality of HDDs increases, the number of wiring layers required increases, and as a result, the number of terminal portions also increases. When the longitudinal direction of the terminal portion is made to coincide with the longitudinal direction of the suspension substrate and a plurality of terminal portions are arranged in parallel along the short direction of the suspension substrate (vertical arrangement), the number of terminal portions increases as the number of terminal portions increases. Therefore, it is necessary to reduce the width (length in the short direction) of the terminal portion, which causes a problem that the terminal portion is likely to be deformed. On the other hand, according to the present invention, the suspension board may be slightly longer in the longitudinal direction as the number of terminal parts is increased, but the width of the terminal part (the length in the short direction) is sufficient. Therefore, there is an advantage that deformation of the terminal portion can be prevented.
Hereinafter, the suspension substrate with a support frame of the present invention will be described separately for the member of the suspension substrate with a support frame and the configuration of the suspension substrate with a support frame.

1. First, members of the suspension substrate with a support frame of the present invention will be described. The suspension substrate with a support frame of the present invention has a suspension substrate and a support frame. The suspension substrate has at least a metal support substrate, an insulating layer, a wiring layer, and a wiring plating portion, and the support frame has at least a metal support substrate, an insulating layer, and a conductor layer.

  The material of the metal support substrate in the suspension substrate and the support frame is preferably a metal having a spring property, and specific examples include stainless steel. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The insulating layers in the suspension substrate and the support frame are each formed on the metal support substrate. The material of the insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. In addition, the material of the insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The wiring layer in the suspension substrate is formed on the insulating layer. The material of the wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be cited, and copper (Cu) is particularly preferable. Moreover, the material of the wiring layer may be rolled copper or electrolytic copper. The thickness of the wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 5 μm to 12 μm.

  Examples of the wiring layer include a writing wiring layer, a reading wiring layer, a heat assist wiring layer, an actuator element wiring layer, a power supply wiring layer, a flight height control wiring layer, a ground wiring layer, and a noise shield. Examples thereof include a wiring layer and a wiring layer for preventing crosstalk.

  Moreover, it is preferable that the plating part is formed in the one part surface of a wiring layer. This is because the deterioration (corrosion or the like) of the wiring layer can be prevented by providing the plating portion. In particular, in the present invention, it is preferable that a plating portion is formed in the terminal portion of the wiring layer. Although the kind of plating part is not specifically limited, For example, Au plating, Ni plating, Ag plating, Cu plating etc. can be mentioned. Especially, it is preferable that Ni plating and Au plating are formed from the surface side of the wiring layer. The thickness of the plating portion is, for example, in the range of 0.1 μm to 4 μm.

  The conductor layer in the support frame is formed on the insulating layer. The material of the conductor layer is usually composed of the same material as the wiring layer. The preferable range of the thickness of the conductor layer is the same as the preferable range of the thickness of the wiring layer. In particular, in the present invention, the thickness of the conductor layer and the thickness of the wiring layer are preferably the same.

  The suspension substrate in the present invention preferably has a cover layer covering the wiring layer. This is because deterioration (for example, corrosion) of the wiring layer can be prevented. Examples of the material for the cover layer include a resin, and among them, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer on the wiring layer is preferably in the range of 2 μm to 30 μm, for example, and more preferably in the range of 2 μm to 10 μm. Further, the support frame in the present invention may have a cover layer on the conductor layer.

2. Next, the configuration of the suspension substrate with a support frame according to the present invention will be described. The wiring layer according to the present invention has terminal portions, the longitudinal directions of the plurality of terminal portions respectively coincide with the short direction of the suspension substrate, and the plurality of terminal portions are arranged in parallel along the longitudinal direction of the suspension substrate. Is done. The definitions of these descriptions are as described above.

  It is preferable that the terminal part in this invention is a terminal part connected with the terminal part of an external circuit board. This is because the number of terminals connected to the external circuit board is increasing as the function of the HDD is increased. In addition, the terminal part in this invention may be a test terminal part (test pad) which contacts the electrode for performing the electrical test | inspection of the board | substrate for suspensions. As the form of the terminal portion, a form in which only the surface opposite to the insulating layer is exposed, a form in which both the insulating layer side and the opposite side are exposed (flying leads), a form in which only the surface on the insulating layer side is exposed, etc. Can be mentioned. Although the shape of a terminal part is not specifically limited, For example, rectangular shapes, such as a square (The length of a longitudinal direction and the short direction is the same) and a rectangle, can be mentioned. For example, when the terminal portion is a flying lead, the length in the longitudinal direction is, for example, in the range of 100 μm to 600 μm, and preferably in the range of 200 μm to 500 μm. On the other hand, the length in the short direction is, for example, in the range of 50 μm to 300 μm, and preferably in the range of 100 μm to 200 μm. Moreover, the number of terminal parts is in the range of 4 to 12, for example.

  In the present invention, the common plated wire-containing structure is formed from the support frame toward the inner opening region. This common plated wire-containing structure usually includes a metal support substrate, an insulating layer formed on the metal support substrate, and a common plated wire portion formed on the insulating layer and continuously formed from the conductor layer. Have.

The metal support substrate of the structure containing the common plating wire is formed continuously from the metal support substrate of the support frame, and further, the base portion formed on the support frame side and the opposite side of the support frame are formed. And a tip portion having a width smaller than the width of the root portion. As shown in FIG. 4, the width of the root portion 11a and _{W 1,} if the width of the tip portion 11b has a _{W 2, W 1} is, for example, 300μm or more, preferably in the range of 300μm~1000μm More preferably, it is in the range of 300 μm to 800 μm. It is because it can prevent that a common plating line containing structure will deform | transform so that it may protrude in a thickness direction (z-axis direction) if it is the said range. On the other hand, _{W 2} is, for example, 200μm or less, preferably in the range of 50Myuemu～150myuemu, and more preferably in a range of 60Myuemu～100myuemu. This is because the degree of freedom in designing the suspension substrate can be maintained within the above range. The difference between W ₁ and W ₂ is preferably, for example, 100 μm or more, and more preferably in the range of 100 μm to 900 μm.

  The planar view shape of the metal support substrate of the common plated wire-containing structure is not particularly limited as long as it has the above-described root portion and tip portion. As an example of the shape in plan view, as shown in FIG. 7A, a substantially triangular shape whose width continuously decreases from the base portion 11a toward the tip portion 11b can be exemplified. Of the sides connecting the base portion 11a and the tip portion 11b, the side 11x facing the suspension substrate 100 is preferably formed along the longitudinal direction of the suspension substrate 100. Further, as another example of the shape in plan view, as shown in FIG. 7B, the width is held substantially the same from the root portion 11a toward the tip portion 11b, and the inner angle θ is less than 180 °. A substantially trapezoidal shape whose width continuously decreases from the change point P can be given. As still another example of the shape in plan view, as shown in FIG. 7C, the width continuously decreases from the root portion 11a toward the tip portion 11b, and the internal angle θ is less than 180 °. A substantially trapezoidal shape whose width continuously decreases again through the point P can be given. Further, as shown in FIG. 7 (d), the width continuously decreases from the root portion 11a toward the tip end portion 11b, and after the change point P where the inner angle θ is greater than 180 °, the width is continuously increased again. The decreasing shape can be mentioned. In the present invention, the width of the metal support substrate of the common plated wire-containing structure may be continuously decreased or may be decreased stepwise. Two or more change points P may exist.

  In addition, the suspension substrate and the support frame in the present invention are preferably connected by an arbitrary member. Among them, in the present invention, as shown in FIG. 8A, a connecting portion 1 a in which the metal support substrate 1 of the suspension substrate 100 and the metal support substrate 1 of the support frame 110 are formed of the metal support substrate 1. It is preferable that the metal support substrate 1 of the suspension substrate 100 and the metal support substrate 1 of the common plated wire-containing structure 111 are not connected. This is because, for example, a cut at CL1 in FIG. 6A (a cut for making the plurality of terminal portions 3b independent) is facilitated. On the other hand, when importance is attached to the prevention of deformation, as shown in FIG. 8B, the metal support substrate 1 of the suspension substrate 100 and the metal support substrate 1 of the common plated wire-containing structure 111 are metal supported. You may be connected by the connection part 1b comprised from the board | substrate 1. FIG. Further, when it is important to reduce the number of cuts necessary for manufacturing the suspension substrate, as shown in FIG. 8C, the metal support substrate 1 of the suspension substrate 100 and the common plated wire-containing structure The metal support substrate 1 of 111 is connected by a connecting portion 1b composed of the metal support substrate 1, and the metal support substrate 1 of the suspension substrate 100 and the metal support substrate 1 of the support frame 110 are not connected. Also good.

  Moreover, the common plated wire containing structure usually has an insulating layer and a common plated wire portion. Although the planar view shape of the insulating layer and the common plating line portion is not particularly limited, as shown in FIG. 3, it may be substantially the same shape or substantially similar shape to the metal support substrate of the common plating wire-containing structure. preferable. This is because the root portion is further reinforced.

  In the present invention, a connection wiring portion for connecting the common plating wire portion and the plurality of terminal portions is formed. That is, the plating wires of the plurality of terminal portions are shared by the connection wiring portion and the common plating wire portion. In the present invention, as shown in FIG. 3, the connection wiring portion 3 c is preferably formed along the short direction Y of the suspension substrate 100. Moreover, it is preferable that the connection wiring part 3c is connected to the short side of the terminal part 3b.

  Specific examples of the suspension substrate with a support frame of the present invention will be described with reference to FIGS. FIG. 9A is a schematic plan view of a suspension substrate with a support frame, and FIG. 9B is a cross-sectional view taken along line AA in FIG. 9A. In FIG. 9A, the cover layer is not shown for convenience. These matters are the same in FIG. 10 and FIG. In FIG. 9, the suspension substrate 100 and the common plating wire containing structure 111 are connected by the connection wiring portion 3 c and the insulating layer 2. In FIG. 10, the suspension substrate 100 and the common plated wire containing structure 111 are connected only by the connection wiring portion 3c. 9B and 10B, an opening is formed in the cover layer 4. In the present invention, the suspension substrate 100 and the common plated wire-containing structure 111 are attached to the cover layer 4. You may connect with. In FIG. 11, the disconnection portion 3α is formed in the connection wiring portion 3c, and the suspension substrate 100 and the common plating wire-containing structure 111 are connected only by the insulating layer 2.

  In the present invention, it is preferable that a disconnection portion is formed in the connection wiring portion, and the suspension substrate and the common plating wire-containing structure are separated. This is because the number of cuts necessary for manufacturing the suspension substrate can be reduced. “Separated” means a state that does not require a cut for separation. Therefore, usually, the metal support substrate, the insulating layer, and the cover layer are also separated between the suspension substrate and the common plated wire-containing structure.

FIG. 12 is a schematic diagram illustrating a suspension substrate with a support frame having a disconnection portion. FIG. 12A is a schematic plan view of a suspension substrate with a support frame, and FIG. 12B is a cross-sectional view taken along line AA of FIG. In FIG. 12A, the cover layer is not shown for convenience. As shown in FIGS. 12A and 12B, the disconnection portion 3α is formed in the connection wiring portion 3c, and the suspension substrate 100 and the common plating wire-containing structure 111 are separated. Therefore, the suspension substrate can be obtained only by the cut for separating the suspension substrate 100 from the support frame 110 (cut at CL), and there is an advantage that the manufacturing efficiency of the suspension substrate is improved. In addition, when such a disconnection part is provided, since the cut in CL1 in FIG. 6A becomes unnecessary, stress concentration on the root part 11a due to the cut in CL1 does not occur. However, if the width of the root portion 11a is small, similarly, the metal support substrate 1 of the common plated wire-containing structure 111 may be deformed so as to protrude in the thickness direction (z-axis direction). ), The suspension substrate with a support frame cannot be stably installed on the mold used for cutting at CL, and productivity may be reduced. On the other hand, in the present invention, as shown in FIG. 4 described above, the metal support substrate 1 of the common plated wire-containing structure 111 has a root portion having a width W ₁ larger than the width W ₂ of the tip end portion 11b. 11a is provided, the deformation of the common plated wire containing structure 111 can be prevented, and the suspension substrate 100 can be cut from the support frame 110 with high productivity.

FIG. 13 is a schematic diagram for explaining a disconnection portion in the present invention. Fig.13 (a) is a schematic plan view of the disconnection part in this invention, FIG.13 (b) is AA sectional drawing of Fig.13 (a). In FIG. 13A, the description of the cover layer and the plated portion is omitted for convenience. As shown in FIG. 13 (a), if the length of the disconnection unit 3α was _{L 1,} it is preferable that _{L 1} is 100μm or more, preferably in the range of 100 m to 300 m. This is because the terminal portion 3b and the common plating wire portion 3d can be reliably disconnected within the above range.

  Further, as shown in FIG. 13B, the cover layer 4 is preferably formed on the connection wiring part 3c on the suspension substrate 100 side with respect to the disconnection part 3α. This is because an external device (not shown) can be prevented from coming into contact with the connection wiring portion 3c, and static electricity of the external device can be prevented from being transmitted to an element such as a recording / reproducing element via the connection wiring portion 3c. .

Furthermore, it is preferable that the end portion 41 of the cover layer 4 in the disconnection portion 3α protrudes from the end portion 31 of the connection wiring portion 3c on the suspension substrate 100 side in the disconnection portion 3α. This is because it is possible to further prevent the static electricity of the external device from being transmitted to an element such as a recording / reproducing element via the connection wiring portion 3c. The end portion 41 of the cover layer 4, and the distance between the end portion 31 of the connection wiring portion 3c was _{L 2,} it is preferable that _{L 2} is 10μm or more, more preferably 20μm or more, 30 microns to More preferably, it is in the range of 50 μm. Moreover, it is preferable that the end 21 of the insulating layer 2 in the disconnection portion 3α protrudes from the end 31 of the connection wiring portion 3c on the suspension substrate 100 side in the disconnection portion 3α. This is because it is possible to further prevent the static electricity of the external device from being transmitted to an element such as a recording / reproducing element via the connection wiring portion 3c. The end portion 21 of the insulating layer 2, when the distance _{L 3} between the end portion 31 of the connection wiring portion 3c, _{L 3} is preferably at 20μm or more, more preferably 30μm or more, 40 microns to More preferably, it is in the range of 80 μm.

  In the present invention, the support frame may have one internal opening region, or the support frame may have two or more internal opening regions. The internal opening region preferably has two or more suspension substrates.

  Next, a method for manufacturing the suspension frame-equipped suspension substrate of the present invention will be described. The manufacturing method of the suspension frame-equipped suspension substrate of the present invention is not particularly limited as long as it is a method capable of obtaining the above-described suspension frame-equipped suspension substrate. FIG. 14 is a schematic cross-sectional view showing an example of a method for producing a suspension substrate with a support frame according to the present invention. Note that FIG. 14 corresponds to the AA cross-sectional view of FIG. 12A, similarly to FIG.

  In FIG. 14, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 14A). Next, the conductive member 3A is patterned by wet etching to form a patterned wiring layer 3 and a conductor layer (not shown) of the support frame (FIG. 14B). At this time, patterning by wet etching is simultaneously performed on the metal support substrate 1A to form the metal support substrate 1 having an opening for forming a disconnection portion. Next, the cover layer 4 is formed on the wiring layer 3 (FIG. 14C). At this time, in order to separate the suspension substrate and the common plating wire-containing structure, the cover layer 4 is not formed at the position where the disconnection portion is formed. Next, wet etching is performed on the insulating member 2A to form the insulating layer 2 having an opening for forming a disconnected portion (FIG. 14D). Next, the wiring layer 3 at the position where the disconnection portion is formed is protected with a resist 7, and the plating portion 5 is formed by feeding power from the wiring layer 3 (FIG. 14E). Next, wet etching is performed on the wiring layer 3 exposed from the metal support substrate 1 and the insulating layer 2 to form a disconnection portion 3α (FIG. 14F). At this time, it is preferable to perform wet etching on the metal support substrate 1 and simultaneously perform external processing of the metal support substrate 1. Thereby, a suspension substrate with a support frame is obtained.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 14A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thereby, a wiring layer was formed from the conductor member, and a metal support substrate having an opening was formed from the metal support member (FIG. 14B).

Thereafter, a polyimide precursor solution was coated on the patterned wiring layer with a die coater, and a cover layer was formed by predetermined patterning (FIG. 14C). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was wet-etched to form an insulating layer having an opening (FIG. 14D). Next, the opening was protected with a resist, and a plated portion was formed by electrolytic Au plating on the terminal portion of the wiring layer (FIG. 14E). Finally, using the ferric chloride solution, etching of the wiring layer exposed from the opening and external processing of the metal support substrate were performed (FIG. 14F). As a result, a suspension substrate with a support frame was obtained. When W ₁ and W ₃ shown in FIG. 4 were measured, W ₁ was 450 μm and W ₂ was 70 μm. Further, when L ₁ , L ₂ and L ₃ shown in FIG. 13 were measured, L ₁ was 200 μm, L ₂ was 40 μm, and L ₃ was 60 μm.

  DESCRIPTION OF SYMBOLS 1 ... Metal support substrate, 1a ... Connection part, 1b ... Connection part, 2 ... Insulating layer, 3 ... Wiring layer, 3 (alpha) ... Disconnection part, 3a ... Lead-out part, 3b ... Terminal part, 3c ... Connection wiring part, 3d ... Common plated wire portion, 3e ... conductor layer, 3f ... plated wire portion, 4 ... cover layer, 5 ... plated portion, 6 ... via portion, 7 ... resist, 11a ... root portion, 11b ... tip portion, 100 ... suspension substrate 101 ... Recording / reproducing element mounting region, 102 ... External circuit board connection region, 103 ... Wiring layer, 110 ... Support frame, 111 ... Common plated wire containing structure, 120 ... Internal opening region

Claims (4)

A suspension substrate with a support frame, comprising a suspension substrate and a support frame, wherein the suspension substrate and the support frame are integrated in an internal opening region of the support frame;
The suspension substrate has a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
Having a plurality of terminal portions connected to the wiring layer;
The support frame includes the metal support substrate, the insulating layer formed on the metal support substrate, and a conductor layer formed on the insulating layer,
A common plated wire-containing structure is formed from the support frame toward the inner opening region,
The common plated wire-containing structure is formed on the metal support substrate, the insulating layer formed on the metal support substrate, the insulating layer, and continuously formed from the conductor layer of the support frame. A common plated wire portion,
A connection wiring portion for connecting the common plating wire portion and the plurality of terminal portions is formed, and the connection wiring portion is formed along a short direction of the suspension substrate,
The metal support substrate of the common plated wire-containing structure is formed continuously from the metal support substrate of the support frame, is formed along the longitudinal direction of the suspension substrate , and further, the support A suspension substrate with a support frame, comprising: a base portion formed on a frame side; and a tip portion formed on a side opposite to the support frame and having a width narrower than a width of the root portion. A suspension substrate with a support frame, comprising a suspension substrate and a support frame, wherein the suspension substrate and the support frame are integrated in an internal opening region of the support frame;
The suspension substrate has a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
The wiring layer has a terminal portion,
The plurality of terminal portions are arranged in parallel along the longitudinal direction of the suspension substrate,
The support frame includes the metal support substrate, the insulating layer formed on the metal support substrate, and a conductor layer formed on the insulating layer,
A common plated wire-containing structure is formed from the support frame toward the inner opening region,
The common plated wire-containing structure is formed on the metal support substrate, the insulating layer formed on the metal support substrate, the insulating layer, and continuously formed from the conductor layer of the support frame. A common plated wire portion,
A connection wiring portion for connecting the common plating wire portion and the plurality of terminal portions is formed,
The metal support substrate of the common plated wire-containing structure is formed continuously from the metal support substrate of the support frame, is formed along the longitudinal direction of the suspension substrate , and further, the support A suspension substrate with a support frame, comprising: a base portion formed on a frame side; and a tip portion formed on a side opposite to the support frame and having a width narrower than a width of the root portion.   3. The suspension substrate with a support frame according to claim 1, wherein a disconnection portion is formed in the connection wiring portion, and the suspension substrate and the common plating wire-containing structure are separated from each other. . The metal support substrate of the suspension substrate and the metal support substrate of the common plated wire-containing structure are connected by a connecting portion configured from the metal support substrate,
The suspension substrate with a support frame according to claim 1 or 2, wherein the metal support substrate of the suspension substrate and the metal support substrate of the support frame are not connected to each other.

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