JP5715388B2 - Electronic circuit and heat sink mounting detection method - Google Patents

Description

  The present invention relates to an electronic circuit that detects mounting of a heat sink, and a heat sink mounting detection method.

  Conventionally, a heat sink has been used in order to promote heat dissipation of a component that generates heat. The heat sink is attached to a component that generates heat, and the heat sink dissipates heat to lower the temperature of the component. For this heat sink, a metal such as aluminum or copper having a high thermal conductivity is generally used.

  A metal heat sink not only lowers the temperature of the component but also eliminates the effects of static electricity and magnetism. For example, Patent Document 1 discloses that a conductive heat sink is grounded with a ground wire to prevent static electricity from entering the circuit board. Patent Document 2 discloses that a grounding piece is coupled to a heat sink made of metal and grounded. Patent Document 3 discloses that the surrounding circuit elements are not affected by the magnetism generated by the coil or transformer by surrounding the coil or transformer with a heat sink having the same potential as the ground potential. ing.

Japanese Patent Laid-Open No. 9-180891 JP 2010-16323 A JP-A-6-60989

  However, even when the above-described conventional technology is used, if the heat sink is not properly mounted on the component, there is a problem that the heat dissipation function of the heat sink and the removal function for removing the influence of static electricity and magnetism are not sufficiently exhibited. . For example, if the heat sink is not properly attached to an IC (Integrated Circuit), there is a risk that the IC will run out of heat, causing damage or fire.

  An object of the present invention is to provide an electronic circuit that can easily detect whether or not a heat sink is properly attached to a component, and a heat sink attachment detection method.

In order to solve the above problems, the first technical means of the present invention is one in which when a conductive heat sink is mounted on a component, it is arranged at a position connectable to the heat sink and a predetermined voltage is applied. A substrate having the above first heat sink connection portion and a second heat sink connection portion that is disposed at a position where the heat sink can be connected to the heat sink when the heat sink is mounted on the component, and the potential is maintained at the ground potential. When,
Detecting a potential of the first heat sink connecting portion, and determining whether the heat sink is connected to the first heat sink connecting portion and the second heat sink connecting portion based on a detection result of the potential; a connection determination section for outputting a result, an electronic circuit Ru wherein the connection determination unit, be a plurality of the first heat sink connection portion, the detection result of the potential in each of the first heat sink connection portion Based on this combination, different setting signals of the electronic circuit, components incorporated in the electronic circuit, or a device in which the electronic circuit is incorporated are output.

According to a second technical means of the present invention, when a conductive heat sink is mounted on a component, it is arranged at a position connectable to the heat sink, and one or more first heat sink connections to which a predetermined voltage is applied. And a substrate having a second heat sink connection portion disposed at a position connectable to the heat sink when the heat sink is mounted on the component and maintaining a potential at a ground potential, and the first heat sink connection A connection for detecting a potential of a portion, determining whether the heat sink is connected to the first heat sink connection portion and the second heat sink connection portion based on a detection result of the potential, and outputting the determined result comprising a determining unit, wherein the connection determination unit, especially that on the basis of the detection result of the potential to further determine whether the heat sink is attached to the normal direction To.

According to a third technical means of the present invention, when a conductive heat sink is mounted on a component, the one or more first heat sink connection portions disposed at positions where the heat sink can be connected to the heat sink, and the heat sink is the component. A heat sink attachment detecting method in an electronic circuit, wherein the first heat sink connection portion is provided in an electronic circuit having a second heat sink connection portion that is arranged at a position connectable to the heat sink and is maintained at a ground potential. When a predetermined voltage is applied to the first heat sink connection portion, a potential detection step for detecting the potential of the first heat sink connection portion, and the heat sink is connected to the first heat sink connection based on the detection result of the potential in the potential detection step. A connection determination step for determining whether or not the second heat sink connection portion and the second heat sink connection portion are connected, and the connection determination step. Kicking viewed including an output step, an outputting a determination result, the connection determination step, the first heat sink connection portion is a plurality of, based on a combination of the detection result of the potential in each of the first heat sink connection portion The electronic circuit, a component incorporated in the electronic circuit, or a different setting signal of the device in which the electronic circuit is incorporated is output .
According to a fourth technical means of the present invention, when a conductive heat sink is mounted on a component, the one or more first heat sink connection portions are arranged at positions where the heat sink can be connected to the component, and the heat sink is the component. A heat sink attachment detecting method in an electronic circuit, wherein the first heat sink connection portion is provided in an electronic circuit having a second heat sink connection portion that is arranged at a position connectable to the heat sink and is maintained at a ground potential. When a predetermined voltage is applied to the first heat sink connection portion, a potential detection step for detecting the potential of the first heat sink connection portion, and the heat sink is connected to the first heat sink connection based on the detection result of the potential in the potential detection step. A connection determination step for determining whether or not the second heat sink connection portion and the second heat sink connection portion are connected, and the connection determination step. Wherein an output step of outputting the kick determination result, wherein the connection determination step based on the detection result of the potential, the heat sink is characterized in that it further determines whether or not it is attached to a normal direction.

  According to the present invention, when a conductive heat sink is mounted on a component, a predetermined voltage is applied to one or more first heat sink connection portions arranged at a position connectable to the heat sink, and the heat sink is applied to the component. Whether the potential of the second heat sink connecting portion arranged at a position where it can be connected to the heat sink is maintained at the ground potential when it is mounted, and whether the heat sink is connected to the first heat sink connecting portion and the second heat sink connecting portion. Since it is determined by detecting the potential of the first heat sink connection portion, it is possible to easily detect whether the heat sink is properly attached to the component.

It is a figure which shows the electronic circuit which concerns on Example 1 of this invention. It is a figure explaining the connection of a heat sink and a heat sink connection part. It is a figure which shows the electronic circuit which concerns on Example 2 of this invention. It is a figure explaining an example of the judgment processing by a connection judgment part. It is a figure explaining the attachment direction of the heat sink shown in FIG. It is a figure explaining the determination process by the connection determination part in a modification.

  Hereinafter, an electronic circuit according to an embodiment of the present invention will be described. Hereinafter, as an example, a case where the component to which the heat sink is attached is an IC (Integrated Circuit) will be described. The IC includes a central processing unit (CPU), a system-on-a-chip (SOC), a digital signal processor (DSP), a microcomputer, and the like. Note that the present invention can also be applied to a case where a heat sink is attached to a component other than an IC.

  FIG. 1 is a diagram illustrating an electronic circuit 1 according to a first embodiment of the invention. As shown in FIG. 1, the electronic circuit 1 includes a substrate 10, an IC 11, a power supply voltage application terminal 12, a resistor 13, heat sink connection parts 14 a and 14 b, and a connection determination part 15.

  The substrate 10 is a substrate on which components such as the IC 11 are mounted. In the example of FIG. 1, each component such as the IC 11 is mounted on one substrate 10, but each component does not necessarily have to be mounted on one substrate 10. The IC 11 is an integrated circuit that performs control and calculation of other devices. For example, the IC 11 receives a signal indicating a determination result as to whether or not the heat sink 20 is properly attached to the IC 11 from the connection determination unit 15. Then, the IC 11 controls a display device (not shown) and displays a warning on the display device when the heat sink 20 is not properly attached to the IC 11. Alternatively, the IC 11 controls a speaker device (not shown) and causes the speaker device to output a warning sound.

  The power supply voltage application terminal 12 is a terminal to which the power supply voltage Vin is applied. The resistor 13 is a resistor provided between the power supply voltage application terminal 12 and the heat sink connection portion 14a. The heat sink connection portions 14 a and 14 b are terminals arranged so as to be connectable to the heat sink 20 when the conductive heat sink 20 is mounted on the IC 11. Here, the heat sink connection portion 14a is connected to the power supply voltage application terminal 12, and the potential level thereof is set to “High” (Vin). The heat sink connection portion 14b is grounded, and the potential level thereof is set to “Low” (GND (ground)).

  FIG. 2 is a diagram illustrating the connection between the heat sink 20 and the heat sink connection portions 14a and 14b. FIG. 2 shows an example of the configuration of the heat sink 20 (cross section obtained by cutting the heat sink 20 along the dotted line A-A ′ in FIG. 1). The heat sink 20 includes radiation fins 21a to 21f, a base portion 22, mounting pins 23a and 23b, and metal gaskets 24a and 24b.

  The radiating fins 21a to 21f are radiating plates that dissipate heat into the air. The radiation fins 21 a to 21 f are provided on the base portion 22 in parallel with each other. The heat radiation fins 21a to 21f are formed of a metal having a high thermal conductivity such as aluminum or copper, for example. The base portion 22 is a portion that serves as a base on which the radiation fins 21a to 21f are installed. The base portion 22 is formed of a conductive material. For example, the base portion 22 is formed of a metal having a high thermal conductivity such as aluminum or copper, like the heat radiation fins 21a to 21f.

  The attachment pins 23 a and 23 b are pins for attaching the heat sink 20 to the substrate 10. The mounting pins 23a and 23b are formed of a non-conductive material such as plastic. The metal gaskets 24a and 24b are gaskets formed of a conductive metal material. The metal gaskets 24a and 24b are in contact with the base portion 22 and the heat sink connection portions 14a and 14b when the heat sink 20 is mounted on the IC 11, and are electrically connected between the base portion 22 and the heat sink connection portions 14a and 14b. Connect to.

  Returning to the description of FIG. 1, the connection determination unit 15 detects the potential level of the heat sink connection unit 14a, and the heat sink 20 is connected to the heat sink connection unit 14a and the heat sink connection unit 14b using the detection result of the potential level. It is a processing unit that determines whether or not the result has been determined and outputs the determined result. The connection determination unit 15 is configured by, for example, an IC. The connection determination unit 15 includes a potential level detection unit 15a that detects the potential level of the heat sink connection unit 14a.

  When the heat sink 20 is properly attached to the IC 11, the metal gaskets 24a and 24b of the heat sink 20 come into contact with the base portion 22 and the heat sink connection portions 14a and 14b, and the potential level of the heat sink connection portion 14a is set to the heat sink connection portion 14b. Similarly to the potential level, “Low” (GND (ground)).

  On the other hand, when the heat sink 20 is not properly attached to the IC 11, that is, when the metal gaskets 24a and 24b of the heat sink 20 are not in contact with the base portion 22 or the heat sink connection portions 14a and 14b, the potential of the heat sink connection portion 14a. The level is “High” (Vin), similar to the potential level of the power supply voltage application terminal 12.

  For this reason, when the potential level detection unit 15a detects that the potential level of the heat sink connection unit 14a is “Low”, the connection determination unit 15 is connected to the heat sink connection unit 14a and the heat sink connection unit 14b. Determine that connected. That is, the connection determination unit 15 determines that the heat sink 20 is properly attached to the IC 11. Then, the connection determination unit 15 outputs a signal indicating that the heat sink 20 is properly attached to the IC 11 to the IC 11.

  On the other hand, when the potential level detection unit 15a detects that the potential level of the heat sink connection unit 14a is “High”, the connection determination unit 15 is not connected to the heat sink connection unit 14a or the heat sink connection unit 14b. Is determined. That is, the connection determination unit 15 determines that the heat sink 20 is not properly attached to the IC 11. Then, the connection determination unit 15 outputs a signal indicating that the heat sink 20 is not properly attached to the IC 11 to the IC 11.

  As described above, in the first embodiment, the connection determination unit 15 determines whether or not the heat sink 20 is connected to the heat sink connection units 14a and 14b by measuring the potential of the heat sink connection unit 14a, and the determination result. Therefore, it is possible to easily detect whether or not the heat sink 20 is properly attached to the IC 11.

  In the first embodiment, the mounting pins 23a and 23b are formed of a non-conductive material, and the mounting pins 23a and 23b are provided with metal gaskets 24a and 24b, so that the heat sink 20 and the heat sink connecting portions 14a and 14b are electrically connected. However, the heat sink 20 and the heat sink connection portions 14a and 14b may be electrically connected using another method.

  For example, the attachment pins 23a and 23b may be formed of a conductive metal material. In this case, when the heat sink 20 is attached to the IC 11, the mounting pins 23 a and 23 b come into contact with the base portion 22 and the heat sink connection portions 14 a and 14 b and electrically connect the base portion 22 and the heat sink connection portions 14 a and 14 b. Connect. The potential level of the heat sink connection 14a is “Low”.

  On the other hand, when the heat sink 20 is not properly attached to the IC 11, such as when the mounting pins 23a and 23b are detached from the heat sink 20 or the electronic circuit 10, the potential level of the heat sink connection portion 14a is “High”. Therefore, the connection determination unit 15 detects whether or not the heat sink 20 is connected to the heat sink connection units 14a and 14b by detecting the potential level of the heat sink connection unit 14a, that is, whether the heat sink 20 is properly attached to the IC 11. Whether or not can be detected appropriately.

  Further, it is not always necessary to use the mounting pins 23a and 23b in order to connect the heat sink 20 to the heat sink connecting portions 14a and 14b. It suffices that the heat sink 20 and the heat sink connection portions 14a and 14b have such a structure.

  For example, when the heat sink 20 is mounted on the IC 11, conductive base portions that contact the heat sink connection portions 14 a and 14 b and electrically connect the heat sink 20 and the heat sink connection portions 14 a and 14 b are provided on the base portion 22 of the heat sink 20. It is good. In this case, the heat sink 20 and the IC 11 may be bonded with an adhesive, for example.

  In the first embodiment, the case where there are two heat sink connection portions 14a and 14b has been described. However, two or more heat sink connection portions may be provided. In this case, for example, a metal gasket is provided on each mounting pin of the heat sink, and when the potential level of the heat sink connection portion is not all “Low”, the connection determination unit 15 is not properly attached to the IC 11. May be determined.

  In the first embodiment, the case where the electronic circuit 1 detects whether or not the heat sink 20 is properly attached to the IC 11 has been described. However, the electronic circuit may further set a device in which the electronic circuit is incorporated. . In the second embodiment, in addition to detecting the mounting state of the heat sink, a process for setting a device in which an electronic circuit is incorporated will be described.

  FIG. 3 is a diagram illustrating the electronic circuit 2 according to the second embodiment of the present invention. As shown in FIG. 3, the electronic circuit 2 includes a substrate 30, an IC 31, a power supply voltage application terminal 32, resistors 33 a to 33 c, heat sink connection units 34 a to 34 d, and a connection determination unit 35.

  The substrate 30 is a substrate on which components such as the IC 31 are mounted. In the example of FIG. 3, each component such as the IC 31 is mounted on one substrate 30, but each component does not necessarily have to be mounted on one substrate 30. The IC 31 is an integrated circuit that performs control and computation of other devices. For example, the IC 31 receives a signal indicating a determination result as to whether or not the heat sink 40 is properly attached to the IC 31 from the connection determination unit 35. Then, the IC 31 controls a display device (not shown) to display a warning on the display device when the heat sink 40 is not properly attached to the IC 31. Alternatively, the IC 31 controls a speaker device (not shown) and causes the speaker device to output a warning sound.

  The power supply voltage application terminal 32 is a terminal to which the power supply voltage Vin is applied. The resistors 33a to 33c are resistors provided between the power supply voltage application terminal 32 and the heat sink connection portions 34a to 34c, respectively. The heat sink connection portions 34 a to 34 d are terminals arranged so as to be connectable to the heat sink 40 when the conductive heat sink 40 is attached to the IC 31. Here, the heat sink connection 34d is grounded, and its potential level is set to “Low” (GND (ground)). Further, the heat sink connection portions 34a to 34c are connected to the power supply voltage application terminal 12, and the potential level thereof is set to “High” (Vin).

  Here, the heat sink 40 includes mounting pins 41a to 41d, similar to the heat sink 20 described in FIG. The attachment pins 41 a to 41 d are pins for attaching the heat sink 40 to the electronic circuit 30. The mounting pins 41a to 41d are formed of a nonconductive material such as plastic.

  Further, as will be described later, in order to set an apparatus in which the electronic circuit 2 is incorporated, the mounting pins 41a to 41d may or may not be provided with metal gaskets 42a to 42d, respectively. In the example of FIG. 3, metal gaskets 42a to 42d are provided on all the mounting pins 41a to 41d.

  The metal gaskets 42a to 42d are gaskets formed of a conductive metal material. When the heat sink 40 is mounted on the IC 31, the metal gaskets 42a to 42d are in contact with the conductive heat sink 40 and the heat sink connection portions 34a to 34d, and electrically connect the heat sink 40 and the heat sink connection portions 34a to 34d. Connect.

  The connection determination unit 35 detects the potential level of the heat sink connection units 34a to 34c, and uses the detection result of the potential level to determine whether the heat sink 40 is connected to the heat sink connection units 34a to 34d. It is a processing unit that determines what setting has been made for the device in which the circuit 2 is incorporated, and outputs the determined result. The connection determination unit 35 is configured by, for example, an IC. The connection determination unit 35 includes potential level detection units 35a to 35c that detect the potential levels of the heat sink connection units 34a to 34c, respectively.

  FIG. 4 is a diagram for explaining an example of determination processing by the connection determination unit 35. FIG. 4 shows the potential levels of the heat sink connection portions 34 a to 34 c detected by the potential level detection portions 35 a to 35 c and the determination results by the connection determination portion 35. In addition, the metal gasket 42d is provided in the attachment pin 34d of the heat sink 40, and the metal gaskets 42a to 42c are provided in at least one of the attachment pins 41a to 41c. Therefore, when the heat sink 40 is appropriately attached to the IC 31, at least one of the potential levels of the heat sink connection portions 34a to 34c becomes “Low”.

  As shown in FIG. 4, when the potential levels of the heat sink connection portions 34 a to 34 c are all “High”, the connection determination unit 35 has a connection abnormality in which the heat sink 40 is not connected to the heat sink connection portions 34 a to 34 d. It is determined that That is, the connection determination unit 35 determines that the heat sink 40 is not properly attached to the IC 31. In this case, the connection determination unit 35 outputs a signal indicating that the heat sink 40 is not properly attached to the IC 31 with respect to the IC 31.

  When the potential levels of the heat sink connection portions 34a to 34c are “High”, “High”, and “Low”, respectively, “High”, “Low”, “Low”, and “High”, “Low”, “High” ”,“ Low ”,“ Low ”,“ High ”,“ Low ”,“ Low ”,“ Low ”,“ Low ”,“ High ”,“ Low ”, or“ Low ” In the case of “High”, “High”, and “High”, the connection determination unit 35 determines that the device is “model 1”, “model 2”, “model 3”, “model 4”, “model 5”, “model 6”. Or a setting signal indicating that setting is performed using the setting information of “model 7”.

  Examples of the setting information “model1” to “model7” include a paper feed interval of a copier in which the electronic circuit 2 is incorporated. In this case, correspondence between “model 1” to “model 7” and the paper feed interval, such as “model 1” is a sheet / minute, “model 2” is b sheet / minute, “model 3” is c sheet / minute, etc. Assume that the copier stores the relationship in advance. Then, the copier that has received the setting signal output from the connection determination unit 35 sets the paper feed interval of the copier to a sheet / min, b sheet / min, c sheet / min, or the like according to the received setting signal. Set.

  In order to set the potential levels of the heat sink connection portions 34a to 34c to “High”, “High”, and “Low”, the metal gaskets 42c and 42d may be provided on the mounting pins 41c and 41d. In addition, in order to set the potential levels of the heat sink connection portions 34a to 34c to “High”, “Low”, and “Low”, the metal gaskets 42b, 42c, and 42d are provided on the mounting pins 41b, 41c, and 41d, respectively. That's fine.

  Similarly, by providing or not providing the metal gaskets 42a to 42d on the mounting pins 41a to 41d, the potential levels of the heat sink connection portions 34a to 34c can be set in various combinations, and the connection determination unit 35 is accordingly set accordingly. Any of the setting information “model1” to “model7” can be selected.

  Here, the paper feed speed of the copier in which the electronic circuit 2 is incorporated is set based on the detection results of the potential levels of the heat sink connection portions 34a to 34c. For example, the operating frequency of the IC 31 or the electronic circuit 2 is set. It is good also as setting of the components incorporated in the electronic circuit 2 and the electronic circuit 2, such as a setting. Also in this case, the correspondence between “model 1” to “model 7” and the operating frequency is preliminarily set to an external device (not shown) such that “model 1” is a GHz, “model 2” is b GHz, “model 3” is c GHz, and so on. ) Is memorized.

  The connection determination unit 35 determines whether the setting information is “model1” to “model7” by detecting the potential level by the heat sink connection units 34a to 34c, and outputs the determined result to the external device as a setting signal. . The external device that has received this setting signal sets the operating frequency of the IC 31 or the electronic circuit 2 to aGHz, bGHz, cGHz, or the like according to the received setting signal.

  As described above, in the second embodiment, the connection determination unit 15 detects the potential level of the heat sink connection units 34 a to 34 c, thereby detecting the mounting state of the heat sink 40, the copying machine, the IC 31, and the electronic circuit 2. Therefore, in addition to the electronic component for detecting the mounting state of the heat sink 40, the electronic circuit 2 is not provided with an electronic component for setting the copying machine, the IC 31, and the electronic circuit 2, but these settings are made. It can be performed. In addition, since the electronic component for setting the copy machine, the IC 31, and the electronic circuit 2 is not separately provided, the mounting area of the electronic component does not increase.

  Also, when developing a product such as a copy machine, if the electronic circuit 2 is separately provided with an electronic component for detecting a potential level made up of a resistor or the like and the copy machine is set, the resistance is changed when the setting is changed. It may take time for the soldering work. However, in the electronic circuit 2 of the second embodiment, the setting information can be easily changed by providing or not providing the metal gaskets 42a to 42c on the mounting pins 41a to 41c of the heat sink 40, so that the work efficiency is improved. be able to.

  In the second embodiment, the case where the number of the heat sink connection portions 34a to 34d is four has been described. However, the number of the heat sink connection portions may be three or more. Also in this case, by providing or not providing a metal gasket at each heat sink connection portion, the potential level of each heat sink connection portion can be set in various combinations, and various setting information is selected by the connection determination unit 35 accordingly. Can be made.

  In the second embodiment, in addition to the detection of the mounting state of the heat sink, the electronic circuit, the device in which the electronic circuit is incorporated, or the component to be incorporated in the electronic circuit is set. It may be detected. Below, the modification which detects the attachment direction of a heat sink is demonstrated. FIG. 5 is a diagram for explaining the mounting direction of the heat sink 40 shown in FIG. 3. FIG. 5 shows a heat sink 40 and a cooling fan 50.

  The cooling fan 50 is a fan that is provided in a housing of the apparatus in which the electronic circuit 2 is incorporated, and cools the inside of the housing by discharging high-temperature air inside the housing to the outside of the housing. The heat sink 40 includes heat radiation fins 43a to 43f that dissipate heat into the air. Similarly to the heat sink 20 shown in FIG. 2, the heat radiation fins 43 a to 43 f are provided on the heat sink 40 in parallel with each other.

  As shown in FIG. 5, when the direction of the air flow discharged from the cooling fan 50 is the direction 51 parallel to the mutually parallel surfaces of the radiating fins 43 a to 43 f, the air smoothly flows on the heat sink 40. Therefore, the heat dissipation effect is increased. On the other hand, when the direction of the air flow is a direction perpendicular to the surfaces parallel to each other of the radiating fins 43a to 43f, the air flow is blocked by the radiating fins 43a to 43f, and the heat radiating effect is reduced. .

  In this modification, the connection determination unit 35 shown in FIG. 3 detects the mounting direction of the heat sink 40 and performs a process of issuing a warning when the mounting direction is incorrect. That is, when the direction of the air flow generated by the function of the cooling fan 50 is the direction 51 perpendicular to the mutually parallel surfaces of the radiation fins 43a to 43f, the connection determination unit 35 has the wrong mounting direction of the heat sink 40. Issue a warning as if

  Specifically, the connection determination unit 35 detects the mounting direction of the heat sink 40 as follows. For example, as shown in FIG. 5, metal gaskets 42b, 42c, and 42d are provided on the mounting pins 41b, 41c, and 41d of the heat sink 40, respectively, and no metal gasket is provided on the mounting pin 41a. Such a heat sink 40 is attached to the IC 31 of the electronic circuit 2 shown in FIG.

  And the connection determination part 35 detects the electric potential level of the heat sink connection parts 34a-34c, and determines whether the heat sink 40 was connected with the heat sink connection parts 34a-34d using the detection result of the electric potential level. Then, it is determined whether or not the mounting direction of the heat sink 40 is normal, and the determined result is output to the IC 31.

  FIG. 6 is a diagram for explaining determination processing by the connection determination unit 35 in the present modification. As shown in FIG. 6, in this modification, there are seven combinations of potential levels of the heat sink connection portions 34a to 34c. Since no metal gasket is provided on the mounting pin 41a, the potential levels of the heat sink connection portions 34a to 34c cannot all be “Low”. Therefore, the case where all the potential levels of the heat sink connection portions 34a to 34c are “Low” is excluded.

  First, the potential levels of the heat sink connection portions 34a to 34c may all be “High”. In this case, it is conceivable that the mounting direction of the heat sink 40 is wrong, and the mounting pin 41a not provided with the metal gasket is disposed at the position of the heat sink connecting portion 34d. It is also conceivable that the heat sink 40 is not properly connected to the heat sink connection portions 34a to 34d.

  Therefore, the connection determination unit 35 determines that the mounting direction of the heat sink 40 is abnormal, or that a connection abnormality has occurred in which the heat sink 40 is not connected to the heat sink connection units 34a to 34d. Then, the connection determination unit 35 sends a signal to the IC 31 indicating that the installation direction of the heat sink 40 is abnormal or the heat sink 40 is not properly attached to the IC 31. Output.

  Further, when the potential levels of the heat sink connection portions 34a to 34c are “High”, “High”, and “Low”, respectively, “High”, “Low”, “High”, or “Low”, It may be “High” or “High”. In this modification, since there is only one mounting pin (mounting pin 41a) without a metal gasket, when there are two heat sink connection portions 34a to 34c having a potential level of “High”, the heat sink 40 becomes the heat sink. It is considered that the connection portions 34a to 34d are not properly connected.

  Therefore, the connection determination unit 35 determines that a connection abnormality has occurred in which the heat sink 40 is not connected to the heat sink connection units 34a to 34d. Then, the connection determination unit 35 outputs a signal indicating that the heat sink 40 is not properly attached to the IC 31 to the IC 31.

  In addition, the potential levels of the heat sink connection portions 34a to 34c may be “High”, “Low”, and “Low”, respectively. In this case, the attachment pin 41a not provided with the metal gasket is disposed at the position of the heat sink connection portion 34a, and the attachment direction of the heat sink 40 becomes appropriate. In addition, the potential levels of the heat sink connection portions 34a to 34c may be “Low”, “Low”, and “High”, respectively. In this case, the mounting pin 41a not provided with the metal gasket is disposed at the position of the heat sink connecting portion 34c, and the mounting direction of the heat sink 40 is appropriate.

  Therefore, the connection determination unit 35 determines that the mounting direction of the heat sink 40 is normal. Then, the connection determination unit 35 outputs a signal indicating that the mounting direction of the heat sink 40 is normal to the IC 31.

  In addition, the potential levels of the heat sink connection portions 34a to 34c may be “Low”, “High”, and “Low”, respectively. In this case, it is conceivable that the mounting direction of the heat sink 40 is wrong, and the mounting pin 41a not provided with the metal gasket is arranged at the position of the heat sink connecting portion 34b.

  Therefore, the connection determination unit 35 determines that the mounting direction of the heat sink 40 is abnormal. And the connection determination part 35 outputs the signal which shows that the attachment direction of the heat sink 40 is abnormal to IC31.

  The IC 31 receives the signal output from the connection determination unit 35, and according to the received signal, a warning indicating that the mounting direction of the heat sink 40 is abnormal or that the heat sink 40 is not properly attached to the IC 31. Is displayed on a display device (not shown). Alternatively, a warning sound indicating that the mounting direction of the heat sink 40 is abnormal or a warning sound indicating that the heat sink 40 is not properly attached to the IC 31 is output to a speaker device (not shown).

  In the above modification, the mounting direction of the heat sink is detected in addition to the detection of the mounting state of the heat sink. However, it is incorporated in the apparatus or electronic circuit in which the electronic circuit as described in FIGS. The setting of parts may be further performed. For example, in the example illustrated in FIG. 6, the potential levels of the heat sink connection portions 34 a to 34 c are “High”, “Low”, and “Low”, and “Low”, “Low”, and “High”, respectively. In this case, it is determined that the mounting direction of the heat sink 40 is normal.

  That is, since there are two normal mounting directions, one of them (for example, when the potential level is “High”, “Low”, and “Low”, respectively) is associated with the setting information “model1”, and the other ( For example, the potential level may be “Low”, “Low”, and “High”) may be associated with the setting information “model2”.

  The setting information “model1” and “model2” includes, for example, the paper feed interval of a copier in which the electronic circuit 2 is incorporated as described with reference to FIG. Specifically, it is assumed that the setting information “model1” and “model2” are information indicating the paper feed interval, such as a sheet / minute and b sheet / minute, respectively.

  In this case, the connection determination unit 35 determines whether the setting information is “model1” or “model2” by detecting the potential levels of the heat sink connection units 34a to 34c, and uses the determined result as a setting signal as a setting signal. Output to. The copier that has received this setting signal sets the paper feed interval to a sheet / minute or b sheet / minute in accordance with the received setting signal. Thereby, in addition to the detection of the mounting state of the heat sink and the detection of the mounting direction of the heat sink, it is possible to set an electronic circuit, a component incorporated in the electronic circuit, or a device in which the electronic circuit is incorporated.

  In Examples 1 and 2, it is determined whether or not the heat sink is properly attached to the component. However, when the heat sink is no longer necessary, the heat sink is properly removed from the component. The electronic circuits 1 and 2 illustrated in FIG. 1 or 3 may be detected.

  Specifically, when the heat sink 20 in the example of FIG. 1 is appropriately removed from the IC 11, the potential level of the heat sink connection portion 14 a becomes “High”. Therefore, the connection determination unit 15 that has detected the potential level determines that the heat sink 20 has been properly removed from the IC 11. Further, when the heat sink 40 in the example of FIG. 3 is appropriately removed from the IC 31, the potential levels of the heat sink connection portions 34a to 34c are all “High”. Therefore, the connection determination unit 35 that has detected these potential levels determines that the heat sink 40 has been properly removed from the IC 31.

  On the other hand, when the potential level of the heat sink connection portion 14 a in the example of FIG. 1 is “Low”, the connection determination unit 15 that detects the potential level determines that the heat sink 20 is not removed from the IC 11. Further, in the example of FIG. 3, when there are heat sink connection portions 34 a to 34 c whose potential level is “Low” among the heat sink connection portions 34 a to 34 c, the connection determination unit 35 that detects the potential level has the heat sink 20 connected to the IC 11. It is determined that it has not been removed.

  Then, the connection determination units 15 and 35 in the example of FIG. 1 or 3 output the determination results to the ICs 11 and 31. The ICs 11 and 31 that have received the determination result control a display device (not shown) and display a warning on the display device when the heat sinks 20 and 40 are not properly removed from the ICs 11 and 31. Alternatively, the ICs 11 and 31 control a speaker device (not shown) and cause the speaker device to output a warning sound. In this manner, the electronic circuits 1 and 2 in the example of FIG. 1 or 3 can detect that the heat sinks 20 and 40 are not properly removed from the ICs 11 and 31.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and corrections can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1, 2 ... Electronic circuit 10, 30 ... Board | substrate, 11, 31 ... IC (Integrated Circuit), 12, 32 ... Power supply voltage application terminal, 13, 33a-33c ... Resistance, 14a, 14b, 34a-34d ... Heat sink connection , 15, 35... Connection determination unit, 15 a, 35 a to 35 c, potential level detection unit, 20, 40 ... heat sink, 21 a to 21 f, 43 a to 43 f, radiating fin, 22, base part, 23 a, 23 b, 41 a to 41 d ... mounting pins, 24a, 24b, 42a to 42d ... metal gaskets.

Claims (4)

When a conductive heat sink is mounted on a component, it is arranged at a position where it can be connected to the heat sink, and one or more first heat sink connections to which a predetermined voltage is applied, and the heat sink is mounted on the component. A substrate having a second heat sink connection portion disposed at a position connectable to the heat sink and having a potential maintained at a ground potential,
Detecting a potential of the first heat sink connecting portion, and determining whether the heat sink is connected to the first heat sink connecting portion and the second heat sink connecting portion based on a detection result of the potential; a connection determination section for outputting a result, an electronic circuit Ru provided with,
The connection determination unit includes a plurality of the first heat sink connection units, and the electronic circuit, a component incorporated in the electronic circuit based on a combination of the detection results of the potential in each first heat sink connection unit, or An electronic circuit that outputs different setting signals of a device in which the electronic circuit is incorporated. When a conductive heat sink is mounted on a component, it is arranged at a position where it can be connected to the heat sink, and one or more first heat sink connections to which a predetermined voltage is applied, and the heat sink is mounted on the component. A substrate having a second heat sink connection portion disposed at a position connectable to the heat sink and having a potential maintained at a ground potential,
Detecting a potential of the first heat sink connecting portion, and determining whether the heat sink is connected to the first heat sink connecting portion and the second heat sink connecting portion based on a detection result of the potential; A connection determination unit for outputting the result
The connection determination unit further determines whether or not the heat sink is mounted in a normal direction based on the detection result of the potential. One or more first heat sink connections arranged in a position connectable to the heat sink when a conductive heat sink is attached to the component, and connected to the heat sink when the heat sink is attached to the component A heat sink attachment detection method in an electronic circuit having a second heat sink connection disposed at a possible position and maintained at ground potential,
A potential detecting step of detecting a potential of the first heat sink connecting portion when a predetermined voltage is applied to the first heat sink connecting portion;
A connection determination step of determining whether or not the heat sink is connected to the first heat sink connection portion and the second heat sink connection portion based on the detection result of the potential in the potential detection step;
An output step of outputting a determination result in the connection determination step,
In the connection determination step, there are a plurality of the first heat sink connection portions, and the electronic circuit, a component incorporated in the electronic circuit based on a combination of detection results of the potential in each first heat sink connection portion, or A heat sink attachment detection method characterized by outputting different setting signals for a device in which the electronic circuit is incorporated. One or more first heat sink connections arranged in a position connectable to the heat sink when a conductive heat sink is attached to the component, and connected to the heat sink when the heat sink is attached to the component A heat sink attachment detection method in an electronic circuit having a second heat sink connection disposed at a possible position and maintained at ground potential,
A potential detecting step of detecting a potential of the first heat sink connecting portion when a predetermined voltage is applied to the first heat sink connecting portion;
A connection determination step of determining whether or not the heat sink is connected to the first heat sink connection portion and the second heat sink connection portion based on the detection result of the potential in the potential detection step;
An output step of outputting a determination result in the connection determination step,
The connection determination step further includes determining whether or not the heat sink is mounted in a normal direction based on the detection result of the potential.

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