JP2686408B2 - Radiator for module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for a module such as a module power source.

[0002]

2. Description of the Related Art Generally, a module type electric device,
For example, for a module power supply unit, an attenuator unit for harmonics and ripples, a CPU and an IC for driving a motor, a heat sink is attached to the surface of the metal substrate of the module in order to maximize its performance. ing.

As shown in FIG. 4, a typical structure of a power supply module has an input / output lead terminal 3 on one side of a plastic portion 2 of a module 1, and a cutout or a through hole 5 on the other side. It has a metal substrate (radiator portion) 4 provided with. Then, conventionally, the mounting of the module 1 on the printed circuit board 20 and the mounting of the heat sink are performed as follows.

(1) As shown in FIG. 5A, a heat sink 40 is previously attached to the metal substrate 4 of the module 1 with screws 41, and this is mounted on the printed circuit board 20.

(2) As shown in FIG. 5B, after mounting the lead terminals 3 of the module 1 on the printed circuit board 20, a driver is inserted from the hole 20A of the printed circuit board and the screw 41 is used to connect the metallic board of the module. Attach the heat sink 40 to 4.

(3) As shown in FIG. 5C, a hollow spacer 42 is interposed between the metal substrate 4 of the module 1 and the printed circuit board 20 to support it, and a screw 43 is attached from the opposite side of the printed circuit board 20. Insert the screw 43 into the hollow spacer 4
The heat sink 40 is attached by penetrating 2 and fitting it into the screw hole provided in the heat sink 40.

[0007]

However, in the conventional mounting of the heat sink to the module, after mounting the heat sink on the module substrate, the mounted heat sink is fixed to the module substrate with a screw or a clamp member. Therefore, it takes a relatively long time to attach the heat sink.

In addition, in the method of attaching the heat sink by general screw tightening, when the screw tightening is loose, heat does not transfer to the heat sink, the temperature rise of the module becomes large, and in the worst case, it is damaged. is there. Therefore, a worker forgetting to tighten or a variation in tightening often become an important defect and cause a decrease in reliability. In addition, the tightening point is greatly affected by the location of the screw, and may be close to point contact.

Therefore, an object of the present invention is to solve the above problems and to provide a radiator for a module which can be easily attached without using screws or the like, and which does not cause variations in reliability even if operators are different. To provide.

[0010]

In order to achieve the above object, a radiator for a module according to the present invention comprises a module and a heat sink main body assembled on the upper part of the module, and the module is provided on the surface thereof. It has a metal substrate and overhangs in the middle of both sides,
The heat sink body has an inner flat surface that can come into contact with the surface of the metal substrate of the module, and has a notch corresponding to the width of the projecting portion of the module on both sides, which extends downward and hangs on the tip. A plurality of flexible legs having stoppers, and the hooking portion of the heat sink body is hooked on the lower surface of the module while the overhanging portion is fitted in the notch, and the hooking is performed. In this state, the inner flat surface of the heat sink body comes into surface contact with the surface of the metal substrate of the module.

[0011] Preferably, a compound layer or a rubber layer is provided between the metal plate of the module and the inner flat surface of the heat sink body.

[0012]

In the mounting of the radiator according to the present invention, while holding the module between the legs, the legs are slid along the side surface of the module, and the hooking portions at the ends of the legs are hooked on the lower surface of the module. By doing. At this time, the leg portion flexes by the amount of the bulge of the hook portion due to its flexibility and slightly opens,
It returns to a flat state when the hook portion has finished passing through the lower edge of the side surface of the module. Therefore, by simply inserting the legs, the radiator is attached to the module, and at the same time, the surface of the metal plate thereof comes into surface contact with the inner flat surface of the heat sink body.

At the time of this attachment, since the hooking portion of the heat sink body is hooked on the lower surface of the module with the protruding portion fitted in the notch,
Precise positioning can be achieved when attaching the heat sink to the module, and it is possible to prevent the heat sink from sliding and sliding along the surface of the module.

Further, a gap is always formed between the module and the printed circuit board due to the existence of the hook portion, which means that a larger amount of solder can be deposited when the module is mounted. However, there is an advantage that soldering becomes complete and easy.

Further, when a compound layer or a rubber layer is provided between the metal plate of the module and the inner flat surface of the heat sink body, the adhesion between the surfaces is improved, whereby the module and the The thermal conductivity between the radiators is improved.

[0016]

An embodiment of the present invention will be described below with reference to the accompanying drawings. The heat radiator 10 shown in FIG. 1 has a plurality of fins 12 on the outer surface and a heat sink body 11 having an inner surface having a flat surface 13 capable of contacting the surface of the metal substrate 4 of the module 1 as shown in FIG. And the heat sink body 11
And a leg portion 14 that extends downward from both ends and has a hooking portion 15 at the tip. Each leg 14 is divided into two leg pieces 14A and 14B by sandwiching a central cutout 16, and each leg piece 14A and 14B has flexibility in a direction of approaching and separating from another leg piece facing each other. Have
This radiator 10 is, so to speak, a radiator dedicated to a heat sink integrated type module having a hooking portion 15 for mounting, and is entirely made of a material having good thermal conductivity such as aluminum and copper.

As shown in FIG. 2, the module 1 used together with the radiator 10 described above has each side of the metal base plate 4,
Two ends are cut out so that the overhanging portion 4A remains in the center, and the notch 6 is formed so that the amount of overhanging laterally from the plastic portion 2 is small. The width of the overhanging portion 4A in the longitudinal direction is equal to that of the radiator 10
Notch 16 formed between the two leg pieces 14A, 14B of the
Formed substantially equal to the width of the.

Therefore, in order to assemble the radiator 10 to the module 1, the radiator 10 is mounted above the module 1 so that the two divided leg pieces 14A and 14B on both sides of the radiator 10 sandwich the projecting portion 4A of the module 1. The radiator 10 is pushed downward with respect to the module 1 in this state. Then, the module 1 with the flexible leg portions 14A and 14B of the radiator 10 facing each other expanded outward by an amount corresponding to the thickness of the hook portion 15 is formed.
Slide along the plastic part 2 of the
When it goes over the lower end of the leg, it elastically returns and the latching portion 15 automatically engages with the lower surface of the plastic portion 2, and thereafter the leg piece 14
The radiator 10 will not be separated from the module 1 unless a special external force is applied to spread the A and 14B.
Further, the vertical length of each leg piece 14A, 14B of the radiator 10 is such that the heat sink body 11 is flat when the hooking portion 15 at the lower end of each leg piece is engaged with the lower surface of the plastic part 2 of the module 1. The surface 13 is formed in advance so as to make surface contact with the surface of the metal substrate 4 of the module 1.

After the radiator 10 is assembled to the module 1 as described above, the input / output lead terminals 3 of the module 1 are inserted into the holes 22 formed in the printed circuit board 20 as shown in FIG. 3 and soldered. To do. Before assembling the radiator 10 to the module 1 separately, the input / output lead terminals 3 of the module 1 are inserted into the holes 22 formed in the printed circuit board 20 and soldered, and then as described above. The radiator 10 may be attached to the module 1. However, in this case, when the input / output terminal 3 of the module is inserted into the hole 22 of the printed circuit board 20 and soldered, heat is radiated between the lower surface of the plastic part 2 of the module 1 and the upper surface of the printed circuit board 20. Leg 14 of container 10
It is necessary to leave a space into which the hook portions 15 of A and 14B can be inserted.

In the above embodiment, the metal plate 4 of the module 1
Although the inner flat surface 13 of the heat sink body 11 is directly contacted with each other, dimensional errors may actually occur, so apply silicon compound or lay a rubber such as boron on the surfaces to make them adhere to each other. It is preferable to improve the property and improve the heat conduction between the module 1 and the radiator 10. The thickness of the intermediate layer made of the compound or the rubber is sufficient if it is provided with a dimension of at least 0.1 or 0.2 mm for a 1-inch or half-inch module.

[0021]

In summary, according to the present invention, the heat sink body has a plurality of flexible members each having a hooking portion at its tip, extending downward with a notch corresponding to the width of the projecting portion of the module on each side. Since the hook portion of the heat sink main body is hooked on the lower surface of the module with the leg portion of the heat sink fitted in the cutout, accurate positioning is performed when the heat sink is attached to the module. In addition, it is possible to prevent the heat sink from sliding and shifting along the surface of the module.

Further, since a gap is always formed between the module and the printed board due to the existence of the hook portion, more solder may be deposited when the lead terminals of the module are mounted on the printed board. This has the advantage that soldering is complete and easy.

Further, when a compound layer or a rubber layer is provided between the metal plate of the module and the inner flat surface of the heat sink body, the adhesion between the surfaces is improved, whereby the module and The thermal conductivity between the radiators is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a radiator portion of a module radiator according to an exemplary embodiment of the present invention.

2 is a perspective view showing a module portion of the module radiator of FIG. 1. FIG.

FIG. 3 is a cross-sectional view showing a state where a module radiator according to an exemplary embodiment of the present invention is attached to a printed board.

4A and 4B show a general module power supply unit, in which FIG. 4A is a perspective view and FIG. 4B is a side view.

5A to 5C are diagrams showing a conventional method of attaching a heat sink to a module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Module 2 Plastic part 3 Input / output lead terminal 4 Metal board (radiator part) 4A Overhang part 10 Radiator 11 Heat sink body 12 Fin 13 Inner flat surface 14 Leg part 14A, 14B Leg piece 15 Attaching hook part 20 Printed circuit board 22 Locking hole 16 Notch

Claims (2)

(57) [Claims] 1. A module 1 and a heat sink body 11 assembled to the upper portion of the module, the module having a metal substrate 4 on its surface and projecting portions 4A at the intermediate portions on both sides thereof. The heat sink body has an inner flat surface 13 that can be in contact with the surface of the metal substrate of the module, and has a notch 16 corresponding to the width of the projecting portion of the module on both sides and extends downward to extend to the tip. A plurality of flexible legs 14A and 14B having a hooking portion 15, and the hooking portion of the heat sink body is hooked on the lower surface of the module in a state where the overhanging portion is fitted in the notch. A heat radiator for a module, in which the inner flat surface of the heat sink body is in surface contact with the surface of the metal substrate of the module in this latched state. 2. A radiator according to claim 1, wherein a compound layer or a rubber layer is provided between the metal plate of the module and the inner flat surface of the heat sink body.