JP5663151B2 - Component mounting method and component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting method and a component mounting apparatus in which a plurality of head units access the same substrate and mount components.

  2. Description of the Related Art Conventionally, as a component mounting apparatus for mounting electronic components on a substrate, a device having a plurality of head units called mounting heads, working heads, and the like having a suction nozzle is known (for example, Patent Document 1). In the apparatus described in Patent Document 1, a plurality of mounting heads (corresponding to the “head unit” of the present invention) picks up electronic components housed in a component supply unit independently of each other by a suction nozzle and transfers them onto a substrate. And mounted at a predetermined mounting point. Accordingly, the mounting operation can be performed in parallel by a plurality of mounting heads, which has the advantage of improving the mounting efficiency.

  Here, simply having a plurality of mounting heads does not always improve the mounting efficiency. This is because the plurality of mounting heads cannot be freely mounted without any correlation with each other, and there are various constraints. For example, if a plurality of mounting heads simultaneously access the same substrate, mutual interference may occur. Therefore, only one mounting head is allowed to access the substrate at the same timing, and other mounting heads. Needs to wait at a predetermined retreat position. This causes a dead time due to the waiting of the mounting head in the mounting operation, which causes a delay in mounting tact time. Therefore, the apparatus described in Patent Document 1 has an exclusive area in which only one mounting head on the substrate is allowed to be accessed for each mounting turn in which the mounting head makes a round trip between the substrate and the component supply unit. It was set. As described above, since the exclusive area is optimized for each mounting turn, it is possible to reduce the mounting tact time by eliminating useless waiting time of the mounting head.

Japanese Patent Laying-Open No. 2007-053271 (0027, 0028, FIG. 5)

  However, in each mounting turn, after a plurality of electronic components are picked up from the component supply unit by the mounting head, they are collectively transported above the substrate and further mounted in different positions on the substrate in a predetermined order. There are many things. In this case, the exclusive area may change substantially as the component mounting progresses during one mounting turn. However, in the conventional device, the exclusive region is exclusive until the mounting turn is completed and the next mounting turn is entered. The area remains fixed. Therefore, in the component mounting device with multiple head units that are mounted at different positions on the board after a plurality of parts are transported to the top of the board at once, mounting is done without wasteful waiting time of the head unit. There is a demand for shortening tact time.

  The present invention has been made in view of the above problems, and an object thereof is to provide a component mounting method and a component mounting apparatus that allow a plurality of head units to access the same substrate and perform component mounting efficiently. To do.

In a first aspect of the component mounting method according to the present invention, a plurality of components picked up from a component supply unit are collectively transported above a substrate carried into a predetermined mounting position, and then the plurality of components are mutually connected on the substrate. A component mounting method that has a plurality of head units that perform an operation of mounting at different mounting points as one turn, and that the plurality of head units access the same substrate to mount components, and achieve the above object Therefore, only one head unit among the plurality of head units is allowed to access the exclusive area of the substrate as a priority head unit, and the number of units smaller than the number of parts collectively transported by the priority head unit is used as the priority head. Each time the unit mounts a unit number of parts on the board, the exclusive area is reviewed and before and after the priority head unit mounts the unit number of parts. Comparing an exclusive area, reconfigure the exclusive area only when the exclusive region is narrowed, the whole of the components which are transported to above the substrate by the priority head unit is mounted on a substrate, the priority of one head unit One head unit is released and the next turn is executed, and the priority head unit is replaced with another head unit as the priority head unit in response to the priority right release of one head unit . Further, the second aspect of the component mounting method according to the present invention is a method in which a plurality of components picked up from a component supply unit are collectively transported above a substrate carried into a predetermined mounting position, and then the plurality of components are mounted on the substrate. A component mounting method having a plurality of head units to be mounted on different mounting points on the upper surface, wherein the plurality of head units access the same substrate and mount components, and one head among the plurality of head units Only the unit is allowed to access the exclusive area of the board as a priority head unit, and all the parts to be mounted on the board are divided into multiple mounting groups, and for each mounting group, the mounting points of all parts mounted in the mounting group The exclusive area is set based on the mounting information on the unit, and the number of units less than the number of parts that are collectively conveyed by the priority head unit is set as the priority head. Each time a unit with a unit number of parts is mounted on the board, the exclusive area is reviewed, and the exclusive area before and after the priority head unit mounts the unit number of parts is compared, and the exclusive area is reset only when the exclusive area becomes narrower. It is characterized by doing.

In addition, the first aspect of the component mounting apparatus according to the present invention is capable of independently reciprocating between the upper part of the board carried into the predetermined mounting position and the component supply unit in order to achieve the above object. A plurality of head units provided, and a head control unit that controls the operation of the plurality of head units. Each of the plurality of head units collectively places a plurality of components picked up from a component supply unit above the substrate. The operation of mounting a plurality of components on different mounting points on the substrate after carrying is executed as one turn, and the head control unit uses only one head unit among the plurality of head units as a priority head unit, and is an exclusive area of the substrate. The number of units is set to a number smaller than the number of parts that are collectively conveyed by the priority head unit, and the priority head unit is based on the number of parts. Each time it is mounted, the exclusive area is reviewed, the exclusive area before and after the priority head unit has mounted the number of parts is compared, and the exclusive area is reset only when the exclusive area is narrowed. When all of the components transported upward are mounted on the board, the priority of one head unit is released, and the next turn is executed by one head unit, and the priority of one head unit is released. Thus , the priority head unit is replaced with another head unit as the priority head unit. A second aspect of the component mounting apparatus according to the present invention is a plurality of head units provided so as to be independently reciprocally movable between the upper part of the board carried into a predetermined mounting position and the component supply unit. And a head control unit that controls the operation of the plurality of head units, and each of the plurality of head units transports the plurality of components picked up from the component supply unit to the upper side of the substrate collectively. Mounted on different mounting points on the board, the head control unit allows access to the exclusive area of the board with only one head unit as the priority head unit among the multiple head units, and all components to be mounted on the board Is divided into multiple mounting groups, and for each mounting group, an exclusive area is set based on mounting information on the mounting points of all components mounted in the mounting group, The number of units less than the number of parts that are transported by the previous head unit is used as the number of units. Each time the priority head unit mounts the number of parts on the board, the exclusive area is reviewed and the priority head unit mounts the number of units. The exclusive areas before and after the comparison are compared, and the exclusive area is reset only when the exclusive area becomes narrow.

  In the invention (component mounting method and component mounting apparatus) configured as described above, only the priority head unit among the plurality of head units is permitted to access the exclusive area. Therefore, a plurality of head units can access the same substrate and mount components while reliably preventing mutual interference of the head units. In addition, the exclusive area is performed every time the priority head unit mounts a smaller number of parts on the board than the number of parts that are collectively conveyed by the priority head unit. As described above, since the optimization by reviewing the exclusive area is frequently performed, it is possible to reduce the waiting time for the head units other than the priority head unit. Here, the number of units is set to “1”, that is, the exclusive area is always optimized by reexamining the exclusive area every time the priority head unit mounts one component on the board, and component mounting is performed with excellent efficiency. It can be performed.

  In addition, the exclusive area before and after the priority head unit mounts the number of parts may be compared, and the exclusive area may be reset only when the exclusive area becomes narrow. In this case, the exclusive head area is waiting in an area other than the exclusive area. Other head units (head units other than the priority head unit) can be mounted in an area that is newly outside the exclusive area immediately after resetting, or until the immediate position of the exclusive area immediately after resetting It can move and shorten the moving distance to the next mounting point. As a result, the time required for component mounting can be shortened.

  Further, when all of the components transported above the substrate by the priority head unit are mounted on the substrate, the priority head unit may be replaced, thereby making it possible to streamline the mounting operation. The time required to mount all the desired components, that is, the mounting tact time can be further shortened.

  The exclusive area can be set as follows, and thereafter, the same effect as described above can be obtained by reviewing the exclusive area for each unit mounting of the number of units by the priority head unit. For example, the exclusive area may be set based on the size information related to the size of the board before mounting the first component on the board carried into the mounting position. Further, the exclusive area may be set based on mounting information regarding mounting points of all components to be mounted on the substrate before mounting the first component on the substrate carried into the mounting position. In addition, for each turn that makes a round trip between the component supply unit and the board, an exclusive area may be set based on mounting information regarding mounting points of all components mounted in the turn. Further, all components to be mounted on the board may be divided into a plurality of mounting groups, and for each mounting group, an exclusive area may be set based on mounting information regarding mounting points of all components mounted in the mounting group.

  The mounting information is attached to the board such as a local fiducial mark for indicating the mounting position of the component on the board and a block fiducial mark for recognizing the blocks partitioned in the board. The position information of the mark is included.

  According to the present invention, since the exclusive area is reviewed every time the priority head unit mounts a smaller number of parts on the board than the number of parts that are collectively conveyed by the priority head unit, the exclusive area is optimally frequent. And component mounting is performed in the optimized state. As a result, the time required for the head units other than the priority head unit to stand by can be shortened, and component mounting can be performed efficiently.

1 is a perspective view showing an overall configuration of a surface mounter as an embodiment of a component mounting apparatus according to the present invention. It is a top view of the surface mounting machine shown in FIG. It is a side view of the surface mounting machine shown in FIG. It is a block diagram which shows the electric constitution of the surface mounter shown in FIG. It is a flowchart which shows operation | movement of a head unit. It is a flowchart which shows operation | movement of a head unit. It is a flowchart which shows operation | movement of a head unit. It is a figure which shows typically an example of operation | movement of the surface mounter shown in FIG. It is a figure which shows typically an example of operation | movement of the surface mounter shown in FIG. It is a figure which shows typically an example of operation | movement of the surface mounter shown in FIG. It is a flowchart which shows operation | movement of other embodiment of the component mounting apparatus concerning this invention. It is a figure which shows typically the operation example of another embodiment of the component mounting apparatus concerning this invention.

  FIG. 1 is a perspective view showing the overall configuration of a surface mounter as an embodiment of a component mounting apparatus according to the present invention. FIG. 2 is a plan view of the surface mounter shown in FIG. FIG. 3 is a side view of the surface mounter shown in FIG. FIG. 4 is a block diagram showing an electrical configuration of the surface mounter shown in FIG. As shown in FIGS. 1 and 2, the surface mounter 100 is an example of the “board” of the present invention by moving the first head unit 3 and the second head unit 4 in the X direction and the Y direction, respectively. This is a device for mounting components on a printed circuit board 1 (see FIG. 2).

  As shown in FIG. 2, the surface mounter 100 includes a substrate transport conveyor 2 extending in the X direction, and a first head unit 3 and a second head unit 4 that are movable in the XY direction above the substrate transport conveyor 2. ing. The substrate transport conveyor 2, the first head unit 3, and the second head unit 4 are each disposed on a base 5. A plurality of tape feeders 6 are arranged in the X direction as component supply units for supplying components at both ends of the base 5 on the Y direction side.

  The board transport conveyor 2 is configured to transport the printed circuit board 1 carried in from a transport path (not shown) in the X direction and place the printed circuit board 1 at a predetermined mounting position. Moreover, the board | substrate conveyance conveyor 2 has the function to carry out the printed circuit board 1 which the mounting operation was complete | finished. In the present embodiment, the printed circuit board 1 is carried in from the X1 direction side (upstream side) of the board conveyance conveyor 2 by a conveyance path (not shown), and is carried out to a conveyance path (not shown) on the X2 direction side (downstream side) after the mounting operation. Is done.

  As shown in FIGS. 1 to 3, the first head unit 3 and the second head unit 4 have the same configuration. The first head unit 3 (second head unit 4) picks up components from a component take-out portion 6a (see FIG. 2) described later of the tape feeder 6 and also puts components on the printed circuit board 1 on the substrate transport conveyor 2. Has the function to implement. Note that the components include small electronic components such as semiconductor integrated circuit devices, transistors, capacitors, and resistors.

  Further, as shown in FIGS. 1 and 2, the first head unit 3 and the second head unit 4 are configured to be linearly movable in the X direction along head unit support portions 31 and 41 extending in the X direction, respectively. Yes. Specifically, as shown in FIG. 2, the head unit support portion 31 (head unit support portion 41) includes a ball screw shaft 31a (41a) extending in the X direction and a servo motor 31b that rotates the ball screw shaft 31a (41a). (41b) and a guide rail (not shown) in the X direction. Moreover, the field coil arrange | positioned in the vicinity of the stator 72 (refer FIG. 1 and 2) provided in the fixed rail part 70 mentioned later in each both ends of the head unit support part 31 and the head unit support part 41. A mover 73 is attached.

  The first head unit 3 has a ball nut 32 that is screwed onto the ball screw shaft 31a. The second head unit 4 has a ball nut 42 that is screwed onto the ball screw shaft 41a. As a result, the first head unit 3 (second head unit 4) has the head unit support portion 31 (41) that is rotated by the ball screw shaft 31a (41a) by the servo motor 31b (41b) (X-axis motor). Is moved in the X direction.

  Each of the head unit support portions 31 and 41 is configured to be movable in the Y direction along a pair of fixed rail portions 70 extending in the Y direction so as to straddle the substrate transport conveyor 2. Moreover, as shown in FIGS. 1-3, the both ends of the X direction of the head unit support part 31 (41) formed so that it may extend in a X direction are respectively the other head unit support part 41 (31) side ( It has a protruding portion 311 (411) protruding in the Y2 (Y1) direction). Specifically, the protruding portions 311 (411) at both ends of the head unit support portion 31 (41) protrude in the Y2 (Y1) direction from the first head unit 3 (second head unit 4), respectively. . In addition, dampers 312 extending to the head unit support part 41 side (Y2 direction) are attached to the protrusions 311 of the head unit support part 31, respectively.

  The pair of fixed rail portions 70 are configured to be commonly used for the head unit support portions 31 and 41, respectively. Further, as shown in FIGS. 1 to 3, the pair of fixed rail portions 70 includes a guide rail 71 that supports both end portions of the head unit support portion 31 (41) so as to be movable in the Y direction, and a fixed rail portion. A stator 72 (see FIGS. 1 and 2) made of a plurality of permanent magnets arranged along the Y direction is provided on the inner side surface of 70. That is, the linear motor 7 (Y-axis motor) is configured by the mover 73 provided at both ends of the head unit support part 31 (41) and the stator 72 of the fixed rail part 70. As a result, the head unit support portion 31 (41) is linearly movable in the Y direction along the guide rail 71 by supplying a current to the mover 73 formed of a field coil. That is, the first head unit 3 (second head unit 4) can be moved in the XY directions on the base 5 by the head unit support portion 31 (41) and the linear motor 7.

  The first head unit 3 (second head unit 4) is moved above the tape feeder 6 (component supply position) in the Y1 direction (Y2 direction) by the linear motor 7 when adsorbing components. By moving in the X direction along the head unit support portion 31 (41), the suction nozzle 35 (45) is configured to be disposed above the predetermined component extraction portion 6a. Further, when mounting components, the first head unit 3 (second head unit 4) is moved above the printed circuit board 1 by the linear motor 7 and X along the head unit support portion 31 (41). The suction nozzle 35 (45) is configured to be located at a predetermined mounting position on the surface of the printed circuit board 1 by being moved in the direction.

  In addition, the first head unit 3 (second head unit 4) first holds a plurality of components by obtaining a plurality of components from the component extraction unit 6a at the component supply position and then moving in the Y2 (Y1) direction. The printed circuit board 1 is moved upward (with suction). The first head unit 3 (second head unit 4) is configured to mount a plurality of components at predetermined mounting points on the surface of the printed circuit board 1 while repeating movement in the X direction, the Y direction, and the Z direction. ing. When the mounting operation is completed, the first head unit 3 (second head unit 4) is moved in the Y1 (Y2) direction to move again from above the printed circuit board 1 to the component supply position (above the tape feeder 6). Returned, the component acquisition (suction) operation is executed from the component take-out unit 6a. In the present embodiment, the operation in which each head unit 3, 4 performs component mounting by reciprocating between the substrate 1 and the tape feeder 6 is defined as “one turn”.

  As shown in FIG. 2, the first head unit 3 and the second head unit 4 are each provided with ten suction nozzles 35 and 45 arranged in a row in the X direction. The suction nozzle 35 (45) is provided for sucking and mounting components. The first head unit 3 (second head unit 4) includes a negative pressure generator 351 (see FIG. 4) that generates a negative pressure state at the tip of the suction nozzle 35 (45), and a suction nozzle 35 (45). And a lifting device such as a servo motor 352 (Z-axis motor) (see FIG. 4) for moving the motor in the vertical direction (Z direction). Each suction nozzle 35 (45) can suck and hold components supplied from the tape feeder 6 using the negative pressure generated by the negative pressure generator 351.

  Further, each suction nozzle 35 (45) is configured to carry parts and the like in a state where it is raised with respect to the first head unit 3 (second head unit 4). Further, each suction nozzle 35 (45) is configured to suck the component from the tape feeder 6 and mount it on the printed circuit board 1 while being lowered with respect to the first head unit 3 (second head unit 4). It is configured. Each suction nozzle 35 (45) is configured to be rotatable about its axis by a nozzle rotating device such as a servo motor 353 (R-axis motor) (see FIG. 4). Thereby, in the surface mounting machine 100, it is possible to adjust the attitude | position (direction in a horizontal surface) of the components hold | maintained at the front-end | tip of a nozzle by rotating the adsorption nozzle 35 (45).

  In addition, as shown in FIG. 2, the X2 direction side portion of the first head unit 3 and the X1 direction side portion of the second head unit 4 have components sucked by the suction nozzles 35 and 45, respectively. Component imaging units 36 and 46 for detecting the posture are attached. The component imaging unit 36 (46) is configured to detect the orientation of the component using a line sensor. The component imaging unit 36 (46) is configured to image the lower surface of the component held by the suction nozzle 35 (45) from below. The component imaging unit 36 (46) is attached to be movable in the X direction (the direction in which the ten suction nozzles 35 (45) are arranged) with respect to the first head unit 3 (second head unit 4). It has been. Accordingly, the component imaging unit 36 (46) can sequentially capture the lower surface of the component held by the ten suction nozzles 35 (45) of the first head unit 3 (second head unit 4) from the lower direction. Is possible.

  In addition, substrate imaging units 37 and 47 are attached to the side of the first head unit 3 on the X1 direction side and the side of the second head unit 4 on the X2 direction side, respectively. The board imaging unit 37 (47) is constituted by a CCD area camera. Moreover, the board | substrate imaging part 37 (47) is comprised so that the downward direction may be imaged from the 1st head unit 3 (2nd head unit 4). The board imaging unit 37 (47) is configured to acquire the reference point of the mounting position of the component by imaging the board mark (board fiducial mark) provided on the surface of the printed board 1 when the component is mounted. Has been.

  As shown in FIG. 4, the surface mounter 100 further includes a control unit 101, and is configured such that each operation of the surface mounter 100 is controlled by the control unit 101. In the present embodiment, the control unit 101 Functions as a “head controller” that controls the first head unit 3 and the second head unit 4. The control unit 101 includes a main control unit 102, a drive control unit 103, a valve control unit 104, an image processing unit 105, and a storage unit 106. The control unit 101 includes a display unit 107 such as a liquid crystal display device and an input unit 108 such as a keyboard.

  The main control unit 102 is configured by a CPU or the like that executes logical operations, and based on a mounting program (not shown) stored in the ROM of the storage unit 106, the substrate transport conveyor 2 is connected via the drive control unit 103. The operation of the first head unit 3 and the second head unit 4 is controlled. The main control unit 102 controls the component imaging unit 36 (46) and the board imaging unit 37 (47) of the first head unit 3 (second head unit 4) via the image processing unit 105, respectively. It is configured. The main control unit 102 is configured to control a negative pressure generator 351 provided in the first head unit 3 (second head unit 4) via the valve control unit 104. Thereby, the main control unit 102 can control the suction operation of the component by the suction nozzle 35 (45).

  Here, in the present embodiment, the main control unit 102 reads the board data (not shown) stored in the storage unit 106 and relates to the size of the printed circuit board 1 to be mounted, the board mark position, and the component mounting point. It is comprised so that the mounting information to be acquired may be acquired. Then, the main control unit 102 sets the exclusive area based on the mounting information related to the mounting points of all the components to be mounted on the printed circuit board 1. This “exclusive area” is set in order to prevent mutual interference between the first head unit 3 and the second head unit 4, and only one of the head units 3 and 4 can access the exclusive area as a priority head unit. Allowed. Thus, the head units 3 and 4 can access the same printed circuit board 1 and mount components while reliably preventing mutual interference between the head units 3 and 4. Details thereof will be described later with reference to FIGS.

  Further, the main control unit 102 is configured to perform an on / off switching operation of the priority flag of each head unit 3 (4) in order to set the priority head unit. That is, the “priority flag” is a flag for setting the priority head unit. In this embodiment, the main control is triggered by mounting all components held in the priority head unit on the printed circuit board 1. The unit 102 turns off the priority flag of the priority head unit and then turns on the priority flag of the other head unit.

  Based on the control signal output from the main control unit 102, the drive control unit 103 is a motor (servo motor 31b (X-axis motor), linear motor 7 (Y-axis motor), suction nozzle) of each part of the first head unit 3. The servo motor 352 (Z-axis motor) of the lifting device 35 and the servo motor 353 (R-axis motor) of the nozzle rotating device of the suction nozzle 35 are controlled. Further, the drive control unit 103 is configured to control the driving of the motors of the respective units of the second head unit 4 in the same manner as the first head unit 3.

  Further, the drive control unit 103 is configured to control driving of motors (drive motor, rotation motor, and transfer motor) of each unit of the substrate transfer conveyor 2 based on a control signal output from the main control unit 102. ing. Signals from the encoders of these servo motors are output to the main control unit 102 via the drive control unit 103.

  The image processing unit 105 is configured to read out an imaging signal at a predetermined timing from the component imaging unit 36 (46) and the board imaging unit 37 (47) based on a control signal output from the main control unit 102. ing. The image processing unit 105 is suitable for recognizing components, board marks, block fiducial marks, local fiducial marks, nozzle change information, and the like by performing predetermined image processing on the read imaging signals. It is configured to generate image data.

  The storage unit 106 includes a ROM (Read Only Memory) that stores a program for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. Further, the storage unit 106 stores a mounting program for manufacturing a predetermined printed circuit board 1 and board data such as dimensions of the printed circuit board 1 to be mounted, reference mark positions, and component mounting points. .

  The tape feeder 6 is an example of the “component supply unit” of the present invention, and holds a reel (not shown) around which a tape that holds a plurality of components at a predetermined interval is wound. The tape feeder 6 is configured to send out a tape for holding a component by rotating a reel. And the tape feeder 6 is comprised so that components may be supplied from the component extraction part 6a of the front-end | tip of the tape feeder 6 by sending out a tape.

  Next, in the surface mounting machine 100 configured as described above, an operation in which the two head units 3 and 4 access the same printed circuit board 1 to perform component mounting will be described. Here, after describing the operation flow of the head units 3 and 4 with reference to FIGS. 5 to 7, a specific operation example based on the operation flow will be described with reference to FIGS. 8 to 10.

  5 to 7 are flowcharts showing the operation of the head unit. Since the operations of the head units 3 and 4 controlled by the control unit 101 are basically the same, the operation of the first head unit 3 will be mainly described here. The main control unit 102 of the control unit 101 reads out the board data stored in the storage unit 106, and based on the mounting information related to the mounting points of all the parts to be mounted on the printed circuit board 1 (board mounting information), The symbol ER in FIG. 8A is set (step S1). And the control unit 101 controls each part of the tape feeder 6 by the side of the 1st head unit 3 and the 1st head unit, and performs the following operation | movement.

  In step S <b> 2, a plurality of components are attracted to the first head unit 3 according to the board data. That is, the first head unit 3 moves above the tape feeder 6 that accommodates the above components, and acquires (sucks) the components from the component take-out portion 6a of the tape feeder 6. By performing this operation once or a plurality of times, parts for one turn, for example, “5” parts in a specific example described later, are acquired (sucked).

  Further, the control unit 101 recognizes the posture of the component sucked by the suction nozzle 35 of the first head unit 3 based on the image-processed signal with respect to the imaging signal from the component imaging unit 36 (step S3). When the first head unit 3 confirms that the component for one turn is securely held by suction, the control unit 101 prints the printed circuit board based on the image-processed signal from the image pickup signal from the board image pickup unit 37. 1 recognizes a substrate mark (substrate fiducial mark) previously attached to 1 (step S4). Based on this recognition result, the reference point of the component mounting position is acquired. In the next step S5, the components for one turn held by the first head unit 3 are collectively transported above the printed circuit board 1, and in turn based on the mounting information regarding the mounting points of the respective components included in the circuit board data. Is mounted on the printed circuit board 1 (mounting process for one turn).

  FIG. 6 is a flowchart showing the mounting process for one turn. In this mounting process, as shown in FIG. 6, the mounting point of the component to be mounted next is selected from the component group that has not been mounted on the printed circuit board 1 (step S50). Then, it is determined whether or not the selected mounting point is located within the exclusive area ER (FIG. 8) (step S51). If the selected mounting point is located within the exclusive area ER, the priority flag of the first head unit 3 is confirmed, that is, whether or not the first head unit 3 is a “priority head unit”. Confirmation (step S52). As a result, when the priority flag of the first head unit 3 is in the off state and entry into the exclusive area ER is prohibited (“NO” in step S53), the position is close to the exclusive area ER (standby position). After the first head unit 3 is moved (step S54), the process returns to step S51. That is, as described later, the exclusive area ER is narrowed, and the selected mounting point is out of the narrowed exclusive area ER, or until the priority flag of the first head unit 3 is turned on, the narrowed exclusive area ER Move to a nearby position and wait at that position. On the other hand, if it is determined in step S53 that the first head unit 3 can enter the exclusive area ER, the priority flag of the first head unit 3 is set to the on state (step S55).

  If the mounting point selected in step S51 is out of the exclusive area ER or is in the exclusive area ER but the first head unit 3 is the “priority head unit”, the process proceeds to step S56, and in step S50. A part is mounted on the selected mounting point (1 point mounting). When this one-point mounting is completed, the exclusive area ER is reviewed (step S57).

  FIG. 7 is a flowchart showing the exclusive area review process. In this review process, the exclusive area ER is recalculated based on the mounting information related to the unmounted points that currently exist in the exclusive area ER (step S571). This corresponds to the fact that the exclusive area ER may be narrowed by mounting one point (step S56). The recalculation method of the exclusive area ER is not limited to this. For example, regardless of whether the exclusive area ER is inside or outside the exclusive area ER, the exclusive area ER is based on the mounting information related to the mounting point of the unmounted component at the present time. May be recalculated.

  Then, it is determined whether or not the recalculated exclusive area ER is narrower than the exclusive area ER before the completion of mounting one point (step S56) (step S572). As a result of the determination, the exclusive area ER is reset to the result after recalculation only when the exclusive area ER is narrowed by mounting one point in step S56 (step S573). That is, for each point mounting process, the exclusive region ER is reset only when the exclusive region ER before and after the single point mounting is compared and the exclusive region ER becomes narrower.

  When the review process of the exclusive area ER is completed in this way, as shown in FIG. 6, it is determined whether or not all components for one turn sucked by the first head unit 3 are mounted on the printed circuit board 1 (step S58). ). Then, while the mounting of all the components on the printed circuit board 1 is not completed, the process returns to step S50 and the above series of processing is repeated. On the other hand, when it is confirmed that all components are mounted on the printed circuit board 1 (“YES” in step S58), if the priority flag of the first head unit 3 is on, the priority flag is set. Switching to the off state (step S59) completes the mounting process.

  When the mounting process for one turn is completed, as shown in FIG. 5, it is determined whether all the components to be mounted on the printed circuit board 1 are mounted on the printed circuit board 1 (step S6). While remaining, the process returns to step S2 to continue component mounting.

  In the first head unit 3, component mounting is performed as described above, but the same processing is also performed in the second head unit 4. Here, in order to make the operation of the surface mounter 100 more clear, for example, as shown in FIGS. 8 to 10, five components are mounted on the printed circuit board 1 by the first head unit 3. A case where five components are mounted on the printed circuit board 1 by the two-head unit 4 will be exemplified, and one embodiment of the component mounting method according to the present invention will be described in further detail.

  8-10 is a figure which shows typically an example of operation | movement of the surface mounter shown in FIG. In these drawings, a symbol combining a circle and a number represents a component to be mounted on the substrate 1 by the first head unit 3, and a symbol combining a triangle and a number is mounted on the substrate 1 by the second head unit 4. It represents the parts that should be. The numbers indicate the mounting order. A broken line represents a mounting point of each component, a symbol without hatching represents a component before mounting, and a symbol with hatching represents a mounted component. Furthermore, a symbol with a letter “priority” attached to a square mark indicates that the priority flag is in an on state, and that the head unit with the symbol is a priority head unit.

(1) Initial setting of exclusive area ER: FIG. 8 (a)
In this specific example, there are 10 parts to be mounted on the printed circuit board 1, and the exclusive area ER is set based on the mounting information related to the mounting points of these parts (board total mounting information) (FIG. 8 ( a)). The first head unit 3 among the head units 3 and 4 is set to “priority head unit”. Each head unit 3, 4 sucks and holds five parts from the tape feeder 6 as parts for one turn. Further, in the head unit 3 (4), the component imaging unit 36 (46) detects the posture of each component, and based on the detection result, confirms the suction and holding of the component for one turn, and the board imaging unit 37 (47). ) To recognize the board mark (board fiducial mark) on the printed circuit board 1 and obtain the reference point of the component mounting position. In this case, the priority head unit is already set before picking up the component, but the setting timing is not limited to this, and for example, (a) immediately after picking up the component, (b) immediately after recognizing the component, or (c ) Immediately after the substrate fiducial mark is recognized.

(2) One-point mounting operation: FIG. 8 (b)
When the preparation for the mounting process is completed in this way, the first head unit 3 mounts the components one by one in the numerical order indicated by the circles at the corresponding position on the printed circuit board 1, that is, the mounting point of the component ( 1-point mounting operation by the first head unit 3). In this specific example, although the mounting point of the component to be mounted on the printed circuit board 1 by the first head unit 3 (the component having “1” in the circle) is located in the exclusive area ER, Since the head unit 3 is a priority head unit, the head unit 3 enters the exclusive area ER as it is and mounts the component.

  On the other hand, the second head unit 4 mounts the components one by one in the order of the numbers given to the triangle marks, at the corresponding position on the printed circuit board 1, that is, at the mounting point of the component (1 by the second head unit 4). Point mounting operation). However, since the second head unit 4 is not a priority head unit, the one-point mounting operation is restricted when the mounting point of the component is in the exclusive area ER. However, when the mounting point of the component is outside the exclusive region ER, the mutual interference between the head units 3 and 4 cannot occur, and the one-point mounting operation by the second head unit 4 is executed as it is. For example, as shown in FIG. 8B, the mounting point of the component to be mounted by the second head unit 4 (the component with “1” added to the triangle mark) is outside the exclusive region ER. In parallel with the one-point mounting operation by the unit 3, the second head unit 4 mounts the component (a component with a triangle mark “1”) on the printed circuit board 1.

(3) Review of exclusive area ER: FIG. 8 (c)
When component mounting by the first head unit 3 is executed once, the exclusive area ER is recalculated based on the review of the exclusive area ER, that is, based on the unmounted mounting points constituting the exclusive area ER. In this specific example, as shown in FIG. 4B, the unmounted points that currently exist in the exclusive area ER are
-Mounting points for components to be mounted by the first head unit 3 Mounting points for components marked with "2"
Mounting points for parts marked with “3”
Mounting points for parts marked with “4” on the circle,
-Mounting points of components to be mounted by the second head unit 4 Mounting points of components with a triangle mark "2",
Mounting points for parts with a triangle mark “3”,
Mounting points for parts with a triangle mark of “4”,
The mounting point of the component with “5” on the triangle mark,
A total of 7 points. Then, when the exclusive area ER for preventing mutual interference between the head units 3 and 4 is recalculated based on the unmounted mounting points by the head units 3 and 4, recalculation as shown in FIG. The exclusive area ER thus made is narrower than the exclusive area ER immediately before the one-point mounting operation by the first head unit 3 (see FIG. 5B). Therefore, in this specific example, the exclusive area ER is reset to the recalculated one and updated.

(4) One-point mounting operation: FIG. 8 (d)
Next, as shown in FIG. 4D, the first head unit 3 mounts the next component, that is, the component with the circle mark “2” on the printed circuit board 1 in the same manner as described above (first head 1 point mounting operation by unit 3). On the other hand, the mounting point of the component to be mounted next by the second head unit 4, that is, the component marked with “2” in the triangle mark exists in the exclusive area ER before the above resetting (updating). However, as a result of the exclusion area ER being narrowed by the resetting (updating), the exclusion area ER is out of the exclusion area ER. Accordingly, the second head unit 4 mounts the second component on the printed circuit board 1 (one point by the second head unit 4) in the same manner as the first component (the component with the triangle mark “1”). Mounting operation).

(5) Review of exclusive area ER: FIG. 9 (a)
In addition, in response to the mounting of the second component (the component with “2” in a circle) by the first head unit 3, the unmounted mounting point by both the head units 3 and 4 in the same manner as described above. As a result, the exclusive area ER is reviewed, and as a result, the exclusive area ER is narrowed (FIG. 9A).

(6) One-point mounting operation: FIG. 9 (b)
As shown in FIG. 4B, the first head unit 3 mounts the next component, that is, a component having a circle with “3” on the printed circuit board 1 in the same manner as described above (the first head unit 3 1 point mounting operation). On the other hand, the mounting point of the component to be mounted next by the second head unit 4, that is, the component marked with “3” in the triangle mark exists in the exclusive area ER even after the resetting (updating). Yes. For this reason, in order to avoid interference with the first head unit 3, the one-point mounting operation by the second head unit 4 is prohibited. However, there is no interference with the first head unit 3 outside the exclusive region ER, and the second head unit 4 can move freely. Therefore, in a specific example, during the one-point mounting operation by the first head unit 3, the second head unit 4 moves to a position near the exclusive area ER (standby position) and stands by. This movement shortens the moving distance of the second head unit 4 to the component mounting point, and when the second head unit 4 can mount the component, the mounting operation of the component by the second head unit 4 is performed. Can be shortened.

(7) Review of exclusive area ER: FIG. 9 (c)
In addition, in response to the mounting of the third component (the component with “3” in a circle) by the first head unit 3, an unmounted mounting point by both the head units 3 and 4 in the same manner as described above. As a result, the exclusive area ER is reviewed, and as a result, the exclusive area ER is narrowed (FIG. 9C).

(8) One-point mounting operation: FIG. 9 (d)
Next, as shown in FIG. 4D, the first head unit 3 mounts the next component, that is, a component with a circle mark “4” on the printed circuit board 1 in the same manner as described above (first head 1 point mounting operation by unit 3). On the other hand, the mounting point of the component to be mounted next by the second head unit 4, that is, the component with “3” added to the triangle mark, exists in the exclusive area ER before the above resetting (updating). However, as a result of the exclusion area ER being narrowed by the resetting (updating), the exclusion area ER is out of the exclusion area ER. Accordingly, the second head unit 4 mounts the third component on the printed circuit board 1 in the same manner as the first and second components (components with “1” or “2” added to the triangle mark) (second component). 1 point mounting operation by the head unit 4).

(9) Review of exclusive area ER: FIG. 10 (a)
Further, the exclusive area ER is reviewed in the same manner as described above in response to the mounting of the fourth component (the component with “4” in a circle) by the first head unit 3, and as a result, The exclusive area ER has been eliminated (FIG. 10A).

(10) One-point mounting operation: FIG. 10 (b)
Next, as shown in FIG. 5B, the first head unit 3 mounts the next component, that is, the component with the circle mark “5” on the printed circuit board 1 in the same manner as described above (first head 1 point mounting operation by unit 3). On the other hand, the second head unit 4 mounts the next component, that is, the component with the triangle mark “4” on the printed board 1 in the same manner as described above (one-point mounting operation by the second head unit 4).

(11) Release of priority: FIG. 10 (c)
In the first head unit 3, all the components for one turn are mounted on the printed circuit board 1, so the priority flag of the first head unit 3 is switched to the off state to release the priority, and the first head unit 3 moves to the tape feeder 6 side. Wait until the component mounting by the second head unit 4 is completed. In addition, when the components which should be mounted in the printed circuit board 1 remain by the 1st head unit 3, the component adsorption | suction for 1 turn is started again. On the other hand, in response to the priority right release of the first head unit 3, the priority right flag of the second head unit 4 is turned on and the second head unit 4 is set as the priority head unit ((c) in the figure). In this way, priority switching is executed.

(12) One-point mounting operation: FIG. 10 (d)
Although the component mounting by the first head unit 3 has been completed, the components remain in the second head unit 4, so the second head unit 4 has the last component, that is, the component with the triangle mark “5” as described above. It mounts on the printed circuit board 1 similarly to (one point mounting operation by the 2nd head unit 4). Thereafter, similarly to the first head unit 3, it moves to the tape feeder 6 side.

  As described above, according to the present embodiment, only the priority head unit having priority among the two head units 3 and 4 is allowed to access the exclusive area ER of the printed circuit board 1. 4 mutual interference can be reliably prevented. In addition, although head units that do not have priority cannot mount components in the exclusive area ER, it is possible to mount components in areas other than the exclusive area ER. Components 3 and 4 can access the same printed circuit board 1 to mount components. Moreover, the exclusive area ER is reviewed and optimized every time the one-point mounting operation by the priority head unit is executed. Therefore, compared to the conventional device in which the exclusive area ER is fixed while mounting a part for one turn on the board, the time for the head unit having no priority to wait outside the exclusive area ER can be shortened. it can. As a result, component mounting can be performed with excellent efficiency.

  The exclusive area ER is reviewed by comparing the exclusive area ER before and after the one-point mounting operation by the priority head unit, and the exclusive area ER is reset only when the exclusive area ER is narrowed. Since the exclusive area ER is optimized in such a direction that the exclusive area ER narrows in this way, each time the exclusive area ER is reset, the possibility of component mounting by a head unit that does not have priority increases. Can increase the efficiency. In addition, as shown in FIG. 9B, in parallel with the exclusion area ER narrowing, when the head unit that does not have priority is moved to the vicinity of the reset exclusion area ER and waited, The distance required for the unit to move to the next mounting point is reduced, and the time required for the next component mounting can be shortened.

  In addition, since the priority head unit is configured to replace the priority head unit when all the components for one turn are mounted on the printed circuit board 1, the mounting work can be rationalized. The time required for component mounting, that is, the mounting tact time can be further reduced.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the exclusive area ER is initially set based on the mounting information related to the mounting points of all the parts to be mounted on the printed circuit board 1 (board full mounting information). It is not limited to this. For example, as shown in FIG. 11, the exclusive area ER may be initially set for each turn. In other words, the exclusive region ER is initially set based on the mounting information (1-turn mounting information) related to the mounting points of all components in one turn (step S11), and thereafter, for one turn as in the previous embodiment. You may comprise so that mounting processing may be performed. In this case, after the mounting process for one turn is completed, it is determined whether or not all components to be mounted on the printed circuit board 1 are mounted on the printed circuit board 1 (step S6). In the meantime, the process returns to step S11 to perform a series of processes. In the embodiment configured as described above, the same operation and effect as in the previous embodiment can be obtained.

  In the embodiment shown in FIG. 11, the initial setting of the exclusive area ER is performed for each turn. However, before the first component is mounted on the printed circuit board 1 carried into the mounting position, each turn is set in advance. Each exclusive area ER may be calculated and stored in the storage unit 106, and the exclusive area ER may be read from the storage unit 106 every turn.

  In the above embodiment, the initial setting of the exclusive area ER is performed based on the board total mounting information and the one-turn mounting information. In addition, the exclusive area ER is initially set based on the size information regarding the size of the printed circuit board 1. May be. In this case, similarly to the embodiment shown in FIG. 5, the exclusive area ER may be set based on the size information before mounting the first component on the printed circuit board 1 carried into the mounting position.

  In addition to board mounting information and 1-turn mounting information, all parts to be mounted on the printed circuit board 1 are divided into a plurality of mounting groups, and each mounting group has mounting points related to the mounting points of all parts mounted in the mounting group. The exclusive area ER may be initialized based on the information.

  In the above-described embodiment, the information related to the position where the component is mounted on the printed circuit board 1 has been described as the mounted information. However, the mark related to the mounting point of the component such as the local fiducial mark or the block fiducial mark is printed circuit board. In this case, it is desirable to include information related to these marks in the mounting information. Hereinafter, a case where the local fiducial mark is attached to the printed circuit board 1 will be described as an example.

  FIG. 12 is a diagram schematically showing another example of the operation of the surface mounter shown in FIG. In addition, the mounting points (positions where numbers are attached to the dotted circles and triangles) of the respective components in FIG. 8A are exactly the same as those in FIG. Only the point that two local fiducial marks LM are attached in association with the mounting point to which “1” is attached is different from the previous specific example. These local fiducial marks LM are recognition marks for accurately mounting a component to be first mounted by the first head unit 3 (a component having a circle marked with “1”). That is, in the surface mounter 100, the mounting point on the board may be slightly deviated from the normal position due to the positional deviation of the printed board 1 or the relative position of the printed wiring pattern on the printed board 1. Therefore, a recognition mark associated with a mounting point, that is, a local fiducial mark LM, is attached to the printed circuit board 1 in advance, and the local fiducial mark LM is imaged prior to mounting the component on the printed circuit board 1. Then, the positional deviation of the mounting point is corrected based on the imaging result.

  In the specific example shown in FIG. 12, in order to image these local fiducial marks LM by the substrate imaging unit 37, the first head unit 3 needs to move above the local fiducial marks LM. Therefore, in the specific example shown in FIG. 12, the exclusive area ER is set based on these including the position of the part as well as the position of the local fiducial mark LM as the mounting point. For this reason, as is clear from the comparison between FIG. 8A and FIG. 12A, the initial exclusive region ER corresponding to the amount including the local fiducial mark LM in the mounting point is shown in FIG. It is wider than the specific example, and reaches the mounting point of the component to be mounted first by the second head unit 4 (the component with the triangle mark “1”). Therefore, while the first head unit 3 mounts the first component, that is, the component with the circle mark “1” on the printed circuit board 1 (one-point mounting operation by the first head unit 3), the second head unit 4 The one-point mounting operation is not executed, and the second head unit 4 moves to a position near the exclusive area ER and stands by (FIG. 12B).

When component mounting by the first head unit 3 is executed once, the exclusive area ER is recalculated based on the review of the exclusive area ER, that is, based on the unmounted mounting points constituting the exclusive area ER. In this specific example, as shown in FIG. 5B, the unmounted points currently existing in the exclusive area ER are the mounting points of the parts with “1” in the circle and the local points associated with the mounting points. Excluding fiducial mark LM,
-Mounting points for components to be mounted by the first head unit 3 Mounting points for components marked with "2"
Mounting points for parts marked with “3”
Mounting points for parts marked with “4” on the circle,
-Mounting points of components to be mounted by the second head unit 4 Mounting points of components with a triangle mark "1",
The mounting point of the component with “2” on the triangle mark,
Mounting points for parts with a triangle mark “3”,
Mounting points for parts with a triangle mark of “4”,
The mounting point of the component with “5” on the triangle mark,
A total of 8 points. Then, when the exclusive area ER for preventing mutual interference between the head units 3 and 4 is recalculated, the recalculated exclusive area ER is one point by the first head unit 3 as shown in FIG. It is narrower than the exclusive area ER (see FIG. 5B) immediately before the mounting operation. Therefore, in this specific example, the exclusive area ER is reset to the recalculated one and updated. Since the subsequent processing is basically the same as the previous specific example (FIGS. 8C to 10), description thereof is omitted here.

  As described above, also in the embodiment (specific example) shown in FIG. 12, the exclusive area ER is reviewed and optimized every time the one-point mounting operation by the priority head unit is executed, as in the above embodiment. Therefore, it is possible to perform component mounting with excellent efficiency. Other functions and effects are the same as those in the above embodiment.

  In the above-described embodiment, the present invention is applied to the surface mounter 100 having the two head units 3 and 4. However, the present invention has three or more head units, and each head unit is mounted on the same substrate. The present invention can be applied to a component mounting apparatus and a component mounting method for accessing and mounting components.

  Further, in the above embodiment, component mounting is performed with the “number of units” of the present invention being “1”, that is, the exclusive area ER is reviewed for each component, but from the number of components included in one turn Alternatively, two or more numbers may be set as the unit number.

DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 3, 4 ... Head unit 6 ... Tape feeder (component supply part)
100 ... Surface mounter (component mounter)
101... Control unit (head controller)
102: Main control unit (head control unit)
ER ... Exclusive area LM ... Local fiducial mark

Claims (10)

As the different one turn the operation of mounting the mounting points of the plurality of components on the substrate after transporting a plurality of components picked up from the component supply portion above the loaded wafer to a constant mounting position Tokoro collectively A component mounting method for executing, comprising a plurality of head units, wherein the plurality of head units access the same substrate and mount components.
Only one head unit of the plurality of head units is allowed to access the exclusive area of the substrate as a priority head unit,
The number of units smaller than the number of parts collectively transported by the priority head unit is set as the unit number, and the exclusive area is reviewed each time the priority head unit mounts the unit number of the parts on the substrate,
Compare the exclusive area before and after mounting the unit number of parts by the priority head unit, and reset the exclusive area only when the exclusive area narrows,
When all of the components conveyed above the substrate by the priority head unit are mounted on the substrate, the priority of the one head unit is released and the one head unit performs the next turn. A component mounting method comprising: replacing a priority head unit with another head unit as the priority head unit in response to release of priority of the one head unit .   The exclusive area is set based on the size information regarding the size of the board before mounting the first part on the board carried into the mounting position, and the unit number of parts mounted by the priority head unit The component mounting method according to claim 1, wherein the exclusive area is reviewed.   The exclusive area is set based on mounting information on mounting points of all components to be mounted on the substrate before mounting the first component on the substrate carried into the mounting position, and the unit by the priority head unit The component mounting method according to claim 1, wherein the exclusive area is reviewed for each number of component mountings.   For each turn that makes a round trip between the component supply unit and the substrate, the exclusive area is set based on mounting information on mounting points of all components mounted in the turn, and the number of units by the priority head unit is set. The component mounting method according to claim 1, wherein the exclusive area is reviewed for each component mounting. A plurality of head units that collectively mount a plurality of components picked up from a component supply unit on a different mounting point on the substrate after being conveyed above the substrate carried into a predetermined mounting position A component mounting method in which the plurality of head units access the same substrate and mount components.
Only one head unit of the plurality of head units is allowed to access the exclusive area of the substrate as a priority head unit,
Dividing all components to be mounted on the board into a plurality of mounting groups, for each mounting group, setting the exclusive area based on mounting information on mounting points of all components mounted in the mounting group,
The number of units smaller than the number of parts collectively transported by the priority head unit is set as the unit number, and the exclusive area is reviewed each time the priority head unit mounts the unit number of the parts on the substrate,
A component mounting method comprising: comparing the exclusive areas before and after mounting the unit number of components by the priority head unit, and resetting the exclusive area only when the exclusive area is narrowed.   The component mounting method according to claim 5, wherein the priority head unit is replaced when all of the components transported above the substrate by the priority head unit are mounted on the substrate.   The component mounting method according to any one of claims 3 to 6, wherein the mounting information includes position information of marks attached to the board.   The component mounting method according to claim 1, wherein the number of units is one. A plurality of head units provided so as to be independently reciprocated between the upper part of the substrate carried into a predetermined mounting position and the component supply unit;
A head control unit that controls operations of the plurality of head units,
Each of the plurality of head units performs an operation of mounting the plurality of components on different mounting points on the substrate after collectively transporting the plurality of components picked up from the component supply unit above the substrate. Run as a turn,
The head control unit permits access to the exclusive area of the substrate by using only one head unit among the plurality of head units as a priority head unit, and is smaller in number than the number of components that are collectively conveyed by the priority head unit. The exclusive area is reviewed each time the priority head unit mounts the unit number of the parts on the substrate, and the exclusive area before and after the priority head unit mounts the unit number of the parts. The exclusive area is reset only when the exclusive area is narrowed, and when all of the components conveyed above the board by the priority head unit are mounted on the board, the one head unit releases the priority, the priority solution of the one of the head unit with executing the next turn in the one of the head unit Component mounting apparatus characterized by the other head units corresponding performs interchange of priority head unit according to the priority head unit. A plurality of head units provided so as to be independently reciprocated between the upper part of the substrate carried into a predetermined mounting position and the component supply unit;
A head control unit that controls operations of the plurality of head units,
Each of the plurality of head units is mounted at different mounting points on the substrate after the plurality of components picked up from the component supply unit are collectively conveyed above the substrate,
The head control unit permits access to the exclusive area of the substrate by using only one head unit of the plurality of head units as a priority head unit, and divides all components to be mounted on the substrate into a plurality of mounting groups. For each mounting group, the exclusive area is set based on mounting information on mounting points of all components mounted in the mounting group, and the unit number is a number smaller than the number of components collectively transported by the priority head unit, Each time the priority head unit mounts the unit number of the parts on the substrate, the exclusive area is reviewed, and the priority head unit compares the exclusive area before and after the unit number of the parts are mounted. A component mounting apparatus, wherein the exclusive area is reset only when the exclusive area becomes narrow.

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