JP5467980B2 - Electronic equipment control device - Google Patents

Description

  The present invention relates to an electronic device control apparatus including a bus bar assembly that is a resin-molded electronic circuit board.

  As is well known, a bus bar assembly is generally used as a resin-molded electronic circuit board in an electronic device control apparatus such as a vehicle, for example, as described in Patent Document 1 below. It has been.

  In brief, the bus bar assembly includes a substrate body integrally provided with a resin material, a strip-shaped bus bar that is a metal conductor fixed integrally to the upper surface of the substrate body, and a lower surface side of the substrate body. It is mainly composed of a plurality of electronic components such as held relay circuits and capacitors.

  In the resin-molded bus bar assembly, the substrate main body and the bus bar are usually integrally formed by injection molding, and the electronic component housing portion that is the same resin material as the substrate main body is also integrally formed at the same time. It has become.

Japanese Patent Laid-Open No. 2002-134956

  By the way, in the bus bar assembly, the amount of the bus bar becomes dominant by arranging a plurality of bus bars which are metal conductors having a small heat shrinkage rate on one end surface side in order to reduce the thickness of the entire control device. On the other hand, on the other end surface side, an electronic component is mounted, so that the amount of the resin material having a large thermal contraction rate is dominant.

  For this reason, when the bus bar assembly is molded and then removed from the mold, the entire bus bar assembly is bent and deformed into a curved shape with a convex shape on the upper surface side (warp deformation) due to the difference in thermal shrinkage between the upper surface side and the lower surface side. There is a risk of it.

  The present invention has been devised in view of the technical problem of the bus bar assembly in the conventional electronic device control apparatus, and provides a bus bar assembly capable of suppressing warpage deformation of the entire bus bar assembly after molding.

In the invention according to claim 1 of the present invention, in particular, a boss portion having a screw insertion hole formed integrally therewith is provided on the outer peripheral portion on one end surface side of the substrate body, and a resin material is formed on the outer surface of each boss portion. While providing a raised portion integrally, the height of each of the raised portions is formed lower than the height of the boss portion,
A concave housing portion for housing and holding an electronic component is formed on the other end surface side of the substrate body, and a thinned portion is formed on the other end surface side and in the vicinity of the housing portion .

The invention according to claim 2 of the present application is characterized in that the built-up portion on the one end face side is formed by a rising wall joined to a boss portion through which the screw insertion hole is formed .

According to the present invention, while integrally provided with a padding portion on the outer surface of the ball scan portion provided on one end surface side of the substrate main body to form an accommodating portion for accommodating holding the electronic component on the other end face side of the substrate main body In addition, by forming the thinned portion on the other end surface side and in the vicinity of the accommodating portion, the difference in thermal shrinkage between the both end surface sides after molding is reduced, and the warp deformation of the bus bar assembly is effectively performed. It becomes possible to suppress.
In particular, since the build-up portion is coupled to the outer surface of the boss portion of the same resin material, a large amount of contraction deformation can be obtained.
And since the said build-up part was formed lower than the height of the said boss | hub part, interference with other members, such as a control board, can be suppressed, for example.
Furthermore, since each said thinning part was formed in the other end side and the vicinity of the above-mentioned storage part, it is almost not influenced by contraction deformation of each storage part, and can also control deformation of the storage part itself, The electronic component can be accommodated easily, and electrical influences caused by pressure contact with the electronic component can be avoided.

It is a disassembled perspective view which shows the electronic device control apparatus which concerns on this invention. It is an overhead view which shows the bus-bar assembly provided to this embodiment. It is a top view of the bus bar assembly. FIG. 4 is a sectional view taken along line AA in FIG. 3. It is the B section expanded sectional view of Drawing 4. It is a mimetic diagram showing the bus bar assembly of this embodiment in section. It is a schematic diagram which shows the conventional bus-bar assembly in cross section. It is a schematic diagram which shows the curvature deformation of the conventional bus-bar assembly.

  Hereinafter, an embodiment in which an electronic device control device according to the present invention is applied to, for example, an electronic control device for an automobile brake system will be described in detail with reference to the drawings.

  Although the brake system electronic control device is not specifically illustrated as a whole, one end is fixed to a partition wall that partitions the engine room and the passenger compartment, and a master cylinder that is a tandem cylinder is provided at the other end. A drive mechanism; and an electronic device control unit (ECU) that is provided integrally with an upper end portion of the drive mechanism and controls an electric actuator included in the drive mechanism.

  The ECU 1 includes an electronic circuit 2 housed between an ECU casing 01 and a cover 02, as shown in FIG.

  The ECU casing 10 is formed in a bottomed box shape with an upper end opened by an aluminum alloy material, and the cover 02 that closes the upper end opening at the upper end of the outer periphery via a seal member 03 is fixed by a plurality of screws 04. It has come to be. A female connector 9 having one end connected to a battery power source is attached to one end of the ECU casing 01 via a seal member 05, and a circular hole 06 formed on the other side. A breathing filter 07 is fitted and fixed to the.

  The electronic circuit 2 includes a power board 3 for supplying electric power to the stator of the electric motor, a filter assembly (bus bar assembly) 4 that is a support having a filter electronic circuit for removing energization noise, And a control board 5 which is a circuit board for controlling the driving of the motor.

  The power board 3 is formed in a substantially rectangular thin plate shape by a synthetic resin material, and includes a plurality of semiconductor elements which are electronic components, a plurality of DC output terminal pins, an AC input terminal, and three motor three-phase terminals 6a to 6c. In addition, the lead frame 7 is provided so as to project upward.

  The bus bar assembly 4 is integrally resin-molded by injection molding, and as shown in FIGS. 2 to 4, a substrate body 10 that is a substantially monolithic support formed of a synthetic resin material, A plurality of bus bars 11 which are metal conductors integrally disposed and fixed on one end surface (upper surface 10a in the figure) side of the substrate body 10 and the other end surface (lower surface 10b in the figure) side of the substrate body 10 are formed. The housing portion 12 is a holding portion for mounting and holding electronic components.

  The substrate body 10 is formed in an irregular rectangular shape, and is a cylindrical boss portion that is vertically formed through a screw insertion hole 13a through which a fixing screw 20 described later is inserted at six corners of the outer peripheral portion 10c. 13 are integrally provided, and a plurality of terminal pins 14 and the like are provided so as to protrude upward at predetermined positions.

  Further, a built-up portion 15 extending along the outer peripheral portion is integrally provided on the outer peripheral portion on the upper surface 10 a side of the substrate body 10.

  As shown in FIGS. 2 to 4, the build-up portion 15 is formed in a rising wall plate shape by a resin material integral with the substrate body 10, and the height thereof does not interfere with the control substrate 5. It is formed lower than the boss part 13. Further, one end portion 15a in the longitudinal direction of the built-up portion 15 is coupled to the outer peripheral surface of one of the boss portions 13, and the other end portion appropriately prevents the connection of the terminal pin 14 or the like. Is set to a predetermined length.

  Further, as shown in FIG. 5, a different built-up portion 16 is integrally provided at the upper end portion of the partition wall 10d disposed between the bus bars 11, and this built-up portion 16 has a transverse cross section of approximately L. The character shape or the cross section is a simple rectangular shape.

  The bus bars 11 are each formed in a band shape having a constant width, and are disposed in a meandering or rectangular shape on the upper surface 10a of the substrate body 10, and the upper surfaces of the bus bars 11 are exposed.

  As shown in FIG. 4 and FIG. 6 schematically showing other parts, each of the accommodating portions 12 includes a relay circuit, a common mold coil, a normal mode coil, and a plurality of large and small capacitors as components of the filter electronic circuit. It is formed in a concave shape so as to accommodate and hold the electronic component 17 such as.

  In addition, locking claw portions 19 and 23 for locking to the control board 5 and the power board 3 at the time of assembly are provided at three locations on the outer peripheral portion of the board body 10 respectively in the vertical direction from the upper and lower surfaces 10a and 10b. Has been.

  Further, as shown in FIGS. 4 and 6, a cutout portion 18 is formed in the vicinity of the accommodating portion 12, that is, on the side portion of the accommodating portion 12, on the lower surface 10 b side of the substrate body 10. 7 is a portion where the resin material is present in the prior art as shown in FIG. 7, for example, the lower position of the boss portion 13 or a part of the thick partition wall 12a between the accommodating portions 12. Is formed.

  As shown in FIG. 1, the control board 5 is formed by a synthetic resin material into a thin plate shape having a substantially L-shaped plane, and is formed by four fixing screws 20 that are inserted through the screw insertion holes formed at the corners. The bus bar assembly 4 is fixed to the upper part with a predetermined gap.

  A control circuit including a computer is attached to the control board 5, and a control signal for controlling driving of an inverter (semiconductor element) that is a drive circuit of the electric motor is generated by this board.

  A plurality of terminal pins provided on the lead frame 7 of the power board 3 and the terminal group 9a of the connector 9 are connected to a plurality of small hole groups 21 and 22 provided on one side of the control board 5 by solder. ing.

  Hereinafter, the operation of the electronic device control apparatus according to the present embodiment will be described. First, when the injection-molded bus bar assembly 4 is taken out from the mold, on the upper surface 10a side of the board body 10 on which the bus bar 11 is disposed, Since the amount of the resin material is increased by the respective built-up portions 15 and 16 as compared with the conventional one, the thermal contraction rate is increased. On the other hand, on the lower surface 10b side of the substrate body 10, since the amount of the resin material is reduced by the respective cutout portions 18 as compared with the conventional one, the thermal contraction rate is reduced.

  That is, in the prior art, as shown in the schematic diagram of FIG. 8, on the upper surface 10 a side of the substrate body 10 on which many bus bars 11 are provided, the bus bar 11 reduces the amount of shrinkage, and conversely, on the lower surface 10 b side where there are many resin materials Then, since the amount of heat shrinkage increases, the warpage deformation in which the upper surface 10a side is convex increases, and the warpage deformation amount is about 4 mm or more as a whole.

  On the other hand, in the present embodiment, a large number of the overlaid portions 15 and 16 are provided on the upper surface 10a side, while a large number of the hollow portions 18 are formed on the lower surface 10b side. The amount of heat shrinkage is almost the same. Therefore, the convex warpage deformation amount on the upper surface 10a side and the concave warpage deformation amount on the lower surface 10b side are reduced, and the warpage deformation of the entire bus bar assembly 4 is sufficiently suppressed, and the warpage is within about 2 mm. The amount of deformation can be suppressed.

  As a result, when the power board 3, the bus bar assembly 4, and the control board 5 are assembled to the ECU casing 01, the overall positional shift is suppressed, for example, the terminal pins of the terminal group of the board body 10. 14 and the terminal hole of the control board 5 are easily positioned. As a result, the assembling work of each component and the terminal connecting work are facilitated, and the work cost can be reduced.

  Moreover, in this embodiment, since one build-up part 15 is couple | bonded with each boss | hub part 13 of the same resin material, it becomes possible to obtain a big shrinkage deformation amount. In addition, since each of the built-up portions 15 is provided on the outer peripheral portion 10c of the upper surface 10a of the substrate body 10 and is formed lower than the height of each boss portion 13, interference with other members such as the control substrate 5 can be prevented. At the same time, the heat shrinkability on the upper surface 10a side can be obtained efficiently.

  Further, since the other built-up portion 16 is formed at the upper end portion of the partition wall 10d of each bus bar 11, it is possible to effectively use the dead space and also the influence on the bus bar 11 due to shrinkage deformation. Can be avoided. Specifically, it is possible to suppress the displacement of the bus bar 11 due to the warp deformation of the substrate body 10 and the stress applied to the bus bar 11.

  Since each of the lightening portions 18 is formed in the vicinity of each housing portion 12, each housing portion 12 is hardly affected by shrinkage deformation, and deformation of the housing portion 12 itself is also suppressed. The electronic component 17 can be accommodated easily, and electrical influences caused by pressure contact with the electronic component 17 can be avoided. Further, the heat shrinkability on the lower surface 10b side can be effectively suppressed by the thinned portion 18 on the outer peripheral side of the lower surface 10b.

  The present invention is not limited to the configuration of each of the embodiments described above. For example, the bus bar assembly 4 can be applied to an electronic device control device other than the brake system of the automobile.

  When the bus bar 11 is formed on the lower surface 10b side instead of the upper surface 10a side of the substrate body 10, the build-up portions 14 and 15 and the thinned portion 18 are formed on the opposite sides, respectively. Warpage deformation can also be suppressed.

  Further, it is basically arbitrary to form the build-up portions 15 and 16 and the light-extracted portion 18 in the substrate body 10, but as described above, the build-up portions 15 and 16 are at least described above. When coupled to each boss portion 13, the boss portion 13 is also a resin material, so that a large amount of contraction can be obtained.

  The amount of warp deformation of the bus bar assembly 4 varies depending on the overall size and thickness of the bus bar assembly 4. In any case, the warp deformation amount depends on the presence of the respective built-up portions 15, 16 and the lightening portions 18. The amount of warp deformation is sufficiently suppressed.

DESCRIPTION OF SYMBOLS 01 ... ECU casing 02 ... Cover 1 ... Electronic device control apparatus 2 ... Electronic circuit 3 ... Power board 4 ... Bus-bar assembly (resin mold)
5 ... Control board 10 ... Board body (support)
11 ... Bus bar 12 ... Accommodating part (holding part)
13 ... Boss part 15 · 16 ... Overlay part 17 ... Electronic component 18 ... Meat removal part

Claims (2)

An electronic device control apparatus comprising a bus bar assembly in which a plurality of conductor bus bars are integrally disposed and fixed on one end surface side of a resin-molded board body and a plurality of electronic components are mounted on the other end surface side. There,
A boss part having a screw insertion hole formed integrally therewith is provided on the outer peripheral part of the one end surface side of the substrate body, and a resin material build-up part is integrally provided on the outer surface of each boss part. While forming the height of the raised portion lower than the height of the boss portion,
An electronic device control characterized in that a concave housing portion for housing and holding an electronic component is formed on the other end surface side of the substrate body, and a lightening portion is formed on the other end surface side and in the vicinity of the housing portion. apparatus. 2. The electronic device control device according to claim 1, wherein the build-up portion on the one end surface side is formed by a rising wall coupled to a boss portion through which the screw insertion hole is formed .

Images