JP3946670B2

JP3946670B2 - Equipment housing member

Info

Publication number: JP3946670B2
Application number: JP2003177907A
Authority: JP
Inventors: 浩一原; 孝治五十嵐; 剛一郎上田; 孝典岡田
Original assignee: Shindengen Electric Manufacturing Co Ltd; Tokai Kogyo Co Ltd
Current assignee: Shindengen Electric Manufacturing Co Ltd; Tokai Kogyo Co Ltd
Priority date: 2003-06-23
Filing date: 2003-06-23
Publication date: 2007-07-18
Anticipated expiration: 2023-06-23
Also published as: JP2005019434A

Description

【０００１】
【発明の属する技術分野】
本発明は、作動時に発熱を伴う機器（トランジスター、ＭＯＳ、コンデンサー等の電気及び／又は電子機器）を内部に収納する機器収容部材に関するものである。
【０００２】
【従来の技術】
上記した機器収容部材の一つとしてケース組立体があり、このケース組立体として、ケースの蓋壁部に金属板製のバスバーを部分的に埋設した状態で、電気絶縁性の合成樹脂によりケースを略弁当箱状に射出成形し、ケースの蓋壁部の外側に導熱シートを介在させてアルミ板等の熱伝導性の高い放熱板を一体的に固着したものが知られている（例えば、特許文献１参照）。このケース組立体では、内部の機器から発生した熱を放熱板から放散させてケース内部の温度が上昇するのを防止している。
【０００３】
【特許文献１】
特開２００２−３４３９０５号公報
【０００４】
しかしながら、合成樹脂の射出成形によりケースＣ’を略弁当箱状に形成すると、樹脂の射出成形後における成形収縮は、その外面側の方が内面側よりも大きいために、図７に示されるように、開口と対向する蓋壁部２の外側が僅かに凹状となって反り返る。このように反り返った蓋壁部２に導熱シートＳを介在させて板状の放熱体Ｈを当てがって、前記放熱体Ｈの周縁近傍において複数本のビス１３を介してケースＣ’の蓋壁部２に放熱体Ｈを固着しても、図８に示されるように、ケースＣ’の蓋壁部２と放熱体Ｈとは、周縁部では密着するものの、中央部では両者の間に接触しない空隙部３１が生ずる。なお、図７において、Ｒ' は、凹状となった蓋壁部２の外側面の曲率半径を示す。
【０００５】
この結果、前記空隙部３１は断熱層として働くために、内部の機器から発生する熱を効果的に放熱体Ｈに伝導できなくなって、ケースＣ’の放熱効率が低下する。
【０００６】
【発明が解決しようとする課題】
本発明の課題は、合成樹脂から射出成形した機器収容部材の板状部の外側面に放熱体を固着する際に、その板状部の外側面と放熱体の裏面とが全面で密着して、機器収容部材内部の熱を効果的に伝導して放熱する放熱効率の高い機器収容部材の提供である。
【０００７】
【課題を解決するための手段】
上記課題を解決するための請求項１の発明は、作動するときに発熱を伴う電気機器及び／又は電子機器を内部に収容可能な収容空間を有する機器収容部材であって、前記機器収容部材は、弾性変形可能で電気絶縁性の合成樹脂から板状部を有するように射出成形され、前記板状部は、その内側に板状部と収容部材の他の部分とで形成される前記機器の収容空間を有していると共に、前記板状部の外側面は、前記合成樹脂よりも熱伝導性が高い材料から片面の少なくとも一部に略平坦面形状を有するように形成された放熱体に対面してこれを取付可能な放熱部となっており、前記板状部には、端子板部と基板部を一体に有するように予め別途形成された弾性変形可能な金属板製のバスバーの前記基板部が、前記板状部の厚さ方向中央よりも放熱部側に位置して一体的に埋設して固着されており、前記板状部は、機器収容部材が合成樹脂から射出成形される際に前記金属板製バスバーの基板部によって外側の合成樹脂の成形収縮量が内側の成形収縮量よりも小さく抑制されることによる成形収縮量の差により放熱部側が凸となる曲面に形成されていることを特徴としている。
【０００８】
請求項１の発明によれば、機器収容部材を構成する板状部の放熱部側が僅かに凸となる曲面に形成されているので、機器収容部材の板状部の外側面に板状の放熱体を取付けた時には、機器収容部材の板状部及び／又は放熱体が弾性変形して、放熱体の裏面（内側面）と機器収容部材の外側面との間に空間部が生じることなく、機器収容部材を構成する板状部の外側面が放熱体の裏面と密着し、機器収容部材内部から発生する熱を効率的に放熱体に伝えることができて放熱効率が低下しない。また、機器収容部材の射出成形時において、その板状部においてその厚さ方向で中央よりも外側に金属板製のバスバーの基板部を配置することにより、前記板状部の外側部を形成する材料の成形収縮が抑制されて、機器収容部材の板状部の放熱部側を僅かに凸となる曲面に簡単に形成できる。
【０００９】
また、請求項２の発明は、作動するときに発熱を伴う電気機器及び／又は電子機器を内部に収容可能な収容空間を有し、放熱体に一体に取付けられている機器収容部材であって、前記機器収容部材は、弾性変形可能で電気絶縁性の合成樹脂から板状部を有するように射出成形され、前記板状部は、その内側に板状部と収容部材の他の部分とで形成される前記機器の収容空間を有していると共に、前記板状部の外側面は、前記合成樹脂よりも熱伝導性が高い材料から片面の少なくとも一部に略平坦面形状を有するように形成された放熱体に対面してこれを取付可能な放熱部となっており、前記板状部には、端子板部と基板部を一体に有するように予め別途形成された弾性変形可能な金属板製のバスバーの前記基板部が、前記板状部の厚さ方向中央よりも放熱部側に位置して一体的に埋設して固着されており、前記板状部は、機器収容部材が合成樹脂から射出成形される際に前記金属板製バスバーの基板部によって外側の合成樹脂の成形収縮量が内側の成形収縮量よりも小さく抑制されることによる成形収縮量の差により放熱部側が凸となる曲面に形成されており、機器収容部材は、固着具により前記放熱体の平坦面に固着されることにより、前記板状部の放熱部が凸状曲面から弾性変形して放熱体の平坦面と平行に固着されていることを特徴としている。
【００１０】
請求項２の発明は、請求項１の発明を「機器収容部材を構成する板状部の外側面に放熱体が一体に取付けられた状態」で把握したものであって、その実質的な作用効果は、請求項１の発明の効果に加えて、内部に機器類を安定して実装できる。
【００１１】
請求項３の発明は、請求項１又は２の発明において、前記機器収容部材は略箱状ケースをなし、前記板状部が略箱状ケースの底壁部又は蓋壁部を構成していることを特徴としている。
【００１２】
請求項３の発明によれば、略箱状ケースの広い面積を有する底壁部又は蓋壁部の外側面に放熱体が一体に取付けられる構成であるので、底壁部又は蓋壁部と放熱体とが隙間なく密着して放熱性が高められるという請求項１又は２の発明の作用効果に加えて、放熱面積そのものが大きくなるために、放熱性が一層高められる。
【００１３】
また、請求項４の発明は、請求項１ないし３のいずれかの発明において、前記板状部において、複数個のバスバーが互いに間隔を保ち、各バスバーの基板部は同一面を保っていることを特徴としている。
【００１４】
請求項４の発明によれば、各バスバーは、板状部の面方向に沿って所定間隔を保って配置されていると共に、バスバーの基板部は、板状部の厚さ方向に沿って同一位置に配置されているため、機器収容部材の射出成形時において、板状部の面方向に沿った成形のバラツキがなくなって、板状部は、その放熱部側がほぼ一定曲率半径の凸となった曲面に形成される。このため、機器収容部材の板状部の外側面の放熱部側に放熱体を一体に固着して、前記板状部が凸状曲面から放熱体の平坦面と平行となるように変形される際に、放熱体の平坦面の平面形状に沿って変形し、機器収容部材の板状部と放熱体との間に空隙部が生じず、放熱性が一層高められる。
【００１５】
また、請求項５の発明は、請求項２ないし４のいずれかの発明において、前記板状部の外側の放熱部と放熱体の平坦部との間には、前記合成樹脂よりも熱伝導率が高くしかも電気絶縁性の熱伝導材を介して放熱体が固着されていることを特徴としている。
【００１６】
請求項５の発明によれば、機器収容部材の板状部と放熱体との間に、合成樹脂よりも熱伝導率が高くしかも電気絶縁性の熱伝導部材が介在されているので、板状部から放熱体への伝熱量が高まって、放熱効率が一層高められる。
【００１７】
また、請求項６の発明は、請求項５の発明において、前記板状部において、バスバーの基板部の外面が放熱部側に露出していることを特徴としている。このため請求項６の発明によれば、金属板製のバスバーが熱伝導材を介して放熱体に近接位置させることができるため、放熱体への熱伝達が高まって、放熱効率が高まる。
【００１８】
【発明の実施の形態】
以下、実施形態を挙げて本発明を更に詳細に説明する。図１は、本発明に係るケース組立体Ａの全体斜視図であり、図２は、図１のＸ−Ｘ線断面図であり、図３は、図１のＹ−Ｙ線断面図であり、図４は、ケースＣの斜視図であり、図５は、同じく平面図であり、図６は、ケースＣの蓋壁部２の外側に放熱体Ｈを固定する状態を示す断面図である。なお、図６は、図２及び図３に対してケースＣの蓋壁部２の外側が凸に湾曲した状態を誇張して表示してある。
【００１９】
本発明に係るケース組立体Ａは、底面が開口していて、作動時に発熱を伴うトランジスター、ＭＯＳ、コンデンサー等の電気及び／又は電子機器Ｐを内部の収容空間１に収納する略弁当箱状のケースＣと、前記ケースＣの蓋壁部２と対向して前記蓋壁部２に固定される平坦な面を有し略板状の放熱体Ｈとを有する。略弁当箱状のケースＣは、周壁部３と、当該周壁部３の上面開口を閉塞する蓋壁部２とが電気絶縁性を有する合成樹脂の射出成形により一体に形成されて、下面が開口した構成であって、枠状をした前記周壁部３の一方の短辺部の外側には、筒状をしたコネクター部４が一体に形成されている。
【００２０】
ケースＣの蓋壁部２には、その樹脂射出成形時において、内部の収容空間１に収納される電子機器を接続するための複数のバスバーＢの一部が部分的にインサートされる。本実施形態のバスバーＢは、金属板を断面Ｌ字状に折り曲げた形態であって、その基板部５がケースＣの蓋壁部２にインサートされると共に、その端子板部６が収容空間１内に配置される。本実施形態のケースＣでは、計６個のバスバーＢが縦横両方向にそれぞれ２列に３個ずつ並んで配置されている。即ち、図４及び図５に示されるように、計６個のバスバーＢは、縦横両方向に沿っていずれも一定間隔Ｄ₁，Ｄ₂をおいて配置されている。また、ケースＣの周壁部３におけるコネクター部４が設けられた部分には、ケースＣの樹脂射出成形時において、コネクター端子７がケースＣの内外の両方向に突出した形態で、その中央部のみが部分的にインサートされる。
【００２１】
バスバーＢの基板部５を蓋壁部２にインサートした状態でケースＣを樹脂射出成形する際には、図４ないし図６に示されるように、バスバーＢの基板部５が蓋壁部２の外面に露出されて、該蓋壁部２の外側面と同一面となるように配置される。また、バスバーＢの基板部５は、蓋壁部２の厚さ方向との関係では、基板部５の全体が蓋壁部２の厚さ方向の中央よりも外側、つまり蓋壁部２の厚さの（1/2)よりも放熱体Ｈの側に偏った位置に配置されている。このため、バスバーＢの基板部５を蓋壁部２に部分インサートしてケースＣを合成樹脂から射出成形した後において、前記蓋壁部２の外側部分の樹脂は、バスバーＢの基板部５がインサートされているために収縮が抑制されるが、前記蓋壁部２の内側部分の樹脂は、制約を受けずに外側部分よりも大きく収縮する。
【００２２】
よって、ケースＣを合成樹脂により射出成形する際において、蓋壁部２を形成する樹脂の外側は内側よりも収縮量が少なくなって、内外部分において樹脂の成形収縮に差が生ずる。この結果、ケースＣの蓋壁部２は、外面が僅かに凸となる曲面となって形成されて、従来のように、蓋壁部２の上面が僅かに凹状となって反り返ることはなくなる。ここで、「僅かに凸となる」とは、後述する放熱体Ｈの取付けにおいて割れ等を生ずることなく平坦状に弾性変形できる範囲の凸をいう。また、各バスバーＢは、縦横両方向に沿っていずれも一定間隔Ｄ₁，Ｄ₂をおいて配置されていると共に、バスバーＢの基板部５は、蓋壁部２の外側面に露出して、これと同一面となるように蓋壁部２の厚さ方向に沿って配置されているため、ケースＣの射出成形時において、蓋壁部２の面方向に沿った成形のバラツキがなくなって、蓋壁部２は、その放熱部側が凸となった曲面に形成される。このため、ケースＣの蓋壁部２の外側面の放熱部側に放熱体Ｈを一体に固着して、前記蓋壁部２が凸状曲面から放熱体Ｈの平坦面と平行となるように変形される際に、放熱体Ｈの平坦面に沿った平面形状に変形され易くなって、ケースＣの蓋壁部２と放熱体Ｈとの間に空隙部が殆ど生じなくなって、放熱性が一層高められる。なお、ケースＣの樹脂射出成形時においては、蓋壁部２におけるバスバーＢの基板部５の下方には、前記バスバーＢと長さが同一で幅が狭く、前記バスバーＢに接続される電子機器Ｐが部分収納される機器収納凹部８が形成され、ケースＣの蓋壁部２の周縁部には、複数のビス挿通孔９が形成される。
【００２３】
次に、上記したケースＣの蓋壁部２の外側に板状の放熱体Ｈを固定してケース組立体Ａを形成する場合について説明する。板状の放熱体Ｈは、ケースＣの蓋壁部２の外側に板状の導熱シートＳを介在させて固定されて、ケースＣの内部において電子機器から発生した熱を伝導させて外部に放散させる部材である。このため、放熱体Ｈは、放熱性能を高めるためにアルミニウム板等の金属板で構成されて、表面には凹凸部１２が形成されている（図１、図２及び図６参照）。また、前記導熱シートＳは、電気絶縁性でかつ熱伝導性の高い材料、例えばシリコン系樹脂の積層体で形成されている。なお、図６において、Ｒは、僅かに凸となる湾曲面となった蓋壁部２の外面の曲率半径を示す。
【００２４】
そして、図６に示されるように、外面側が僅かに凸となるように湾曲されたケースＣの蓋壁部２の外側に導熱シートＳを介在させて平坦状の面を有する放熱体Ｈを配置し、ケースＣの周縁部の複数箇所において、ケースＣの蓋壁部２に対して放熱体Ｈを、ケースＣの内側から挿入された複数本のビス１３によって固定すると、図２に示されるように、ケースＣの蓋壁部２は、放熱体Ｈの平坦面形状に倣って、外面側が僅かに凸となった湾曲形状から平坦面状に変形させられて、放熱体ＨはケースＣの蓋壁部２に対してほぼ全面において密着した状態で固定される。また、このようにしてケースＣの蓋壁部２に放熱体Ｈが固定されると、ケースＣの蓋壁部２の外面側が僅かに凸の湾曲面の場合には、ほぼ平坦状に変形させられた蓋壁部２の内部には、外面側が僅かに凸となるような湾曲形状（原形状）に復元しようとする内部応力が残存しており、この内部応力の存在によっても、ケースＣの蓋壁部２と放熱体Ｈとの密着性は高められる。このため、放熱体Ｈの内面側とケースＣの蓋壁部２の外面側との間には空隙部は殆ど発生しなくなる。このようにして、ケースＣの蓋壁部２の外側に導熱シートＳを介して放熱体Ｈが固定されて、ケース組立体Ａが形成される。
【００２５】
なお、このケース組立体Ａを用いてケースＣの蓋壁部２の内面側に形成された部品の収容空間１に電子機器Ｐを収納して、各バスバーＢの基板部５に接続し、各バスバーＢの端子板部６をワイヤー類Ｗ₁で電気的に接続すると共に、特定のバスバーＢとコネクター端子７とを別のワイヤー類Ｗ₂で接続する。最後に、ケースＣの底面の開口に底壁板１４を接着剤等によって気密を保持して固定するとコネクター等の製品が完成する。上記の通りケースＣは電子機器Ｐを収納、実装する前に蓋壁部２を平坦形状に弾性変形させているので、電子機器Ｐを実装した後に弾性変形させる場合に比較して、機器Ｐがワイヤー類Ｗ₁，Ｗ₂に歪みを生じさせない実用上の利点がある。
【００２６】
このように、ケースＣの蓋壁部２に部分インサートされるバスバーＢの基板部５を蓋壁部２の厚さ方向中央よりも外側に配置させてあるため、ケースＣの樹脂射出成形時において、蓋壁部２を形成する樹脂の外側は内側よりも収縮量が少なくなって、蓋壁部２の内外部分において樹脂の成形収縮量に差が生ずる。この結果、ケースＣの樹脂射出成形時において、その蓋壁部２の外側が僅かに凸状となって、従来構造のように凹状となるのが防止されるので、ケースＣの蓋壁部２の外側に板状の放熱体Ｈを配置して固定した場合に、前記蓋壁部２に対して放熱体Ｈが全面密着して、両者の間に空隙部が生じない。よって、ケースＣ内で発生した熱を放熱体Ｈに効率的に伝導できて、放熱効率が高められる。
【００２７】
特に、上記実施形態では、バスバーＢの基板部５がケースＣの蓋壁部２の外側に露出していて、導熱シートＳに直接に接触して熱伝達率が高められるために、ケースＣ内に発生した熱の放熱効率が一層高められる利点がある。しかし、本発明においては、樹脂の射出成形時にケースＣの蓋壁部２に埋設されるバスバーＢの基板部５は、前記蓋壁部２の厚さ方向の中央よりも外側に偏して配置された状態で、前記基板部５の全体が蓋壁部２に埋設された形態であれば、蓋壁部２の外側部と内側部とで材料の成形収縮の差が生じて、蓋壁部２の外側面を僅かに凸状に形成できる。
【００２８】
また、上記実施形態では、ケースＣの蓋壁部２の外面側が僅かに凸となる湾曲面となっていて、ケース組立体Ａの組立て時において、平坦状の放熱体ＨをケースＣの蓋壁部２の外面側の凸状湾曲面に倣って湾曲させて、ケースＣの蓋壁部２に対して板状の放熱体Ｒを全面密着させて固定する構成であるが、ケースＣの蓋壁部２の外面側が曲率半径の大きなカーブの緩い凸状湾曲面となり、平坦面状に近い場合には、前記蓋壁部２の外面側と対向する放熱体Ｈの下面側を僅かに凸となるような湾曲面に形成しておいて、ケース組立体Ａの組立て時において、ケースＣの蓋壁部２の外面側の平坦面形状に倣わせて放熱体Ｈを平坦状に湾曲変形させて、ケースＣの蓋壁部２の外面に放熱体Ｈを全面密着状態で固定することも可能である。
【００２９】
また、上記実施形態では、箱状をしたケース（機器収容部材）Ｃの蓋壁部２の外側面に放熱体Ｈが固着される構成であって、蓋壁部２の部分からケースＣの内部の熱が放熱される構成であるが、底壁部の外側面に放熱体が固着される場合にも適用可能である。
【００３０】
また、上記実施形態では、ケースＣは、略弁当箱状であって、蓋壁部２と周壁部３とにより、内部に電気及び／又は電子機器Ｐを収納する収容空間１が形成された構成であるが、本発明における「収容空間」とは、上記実施形態のように、全周に亘って周壁部３が設けられた典型的な形状に限られず、前記周壁部３の一部が欠落されたような形状であって、変則的な箱状、或いは不完全な箱状をした形状のもの、更には、「底板部と側板部とで囲まれる空間が物品の収容空間となっている」という箱の観念から離れているが、放熱体を固着する板状部を有しているものは、本発明の対象である「機器収容部材」に該当する。
【００３１】
更に上記実施形態では、ケースＣを射出成形する際に、後工程の弾性変形後にバスバーの端子板部が正規位置となるように蓋壁部が後に弾性変形されることを考慮して、バスバーの射出成形型内へのセット位置を決定しておくことが好ましい。
【００３２】
【発明の効果】
本発明に係る機器収容部材は、外側面に放熱体が取付けられる板状部の厚さ方向に対するバスバーの埋設位置の工夫によって、前記板状部の外側面が凸となるように形成できるので、前記板状部の外側に放熱体を一体に固着する際に、前記放熱体を前記板状部の外側面の凸形状に倣わせて湾曲させることにより、機器収容部材の板状部の外側に放熱体を隙間のないほぼ全面密着状態で固着できる。この結果、機器収容部材内部の熱が効果的に放熱体に熱伝達されて、放熱効率の高い機器収容部材が得られる。
【図面の簡単な説明】
【図１】本発明に係るケース組立体Ａの全体斜視図である。
【図２】図１のＸ−Ｘ線断面図である。
【図３】図１のＹ−Ｙ線断面図である。
【図４】ケースＣの斜視図である。
【図５】同じく平面図である。
【図６】ケースＣの蓋壁部２の外側に放熱体Ｈを固定する状態を示す断面図である。
【図７】従来のケースＣ' を主体に示すケース組立体Ａ’の組立て前の横断面図である。
【図８】同じくケース組立体Ａ’の組立て後の横断面図である。
【符号の説明】
Ａ：ケース組立体（機器収容部材）
Ｂ：バスバー
Ｃ：ケース（機器収容部材）
Ｄ₁，Ｄ₂：バスバーの配置間隔
Ｈ：放熱体
Ｐ：電子機器
Ｓ：導熱シート（熱伝導材）
１：ケースの収容空間
２：ケースの蓋壁部
３：ケースの周壁部
５：バスバーの基板部
６：バスバーの端子板部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a device housing member that houses a device that generates heat during operation (electrical and / or electronic devices such as a transistor, a MOS, and a capacitor).
[0002]
[Prior art]
There is a case assembly as one of the above-mentioned device housing members. As this case assembly, the case is made of an electrically insulating synthetic resin in a state where a metal plate bus bar is partially embedded in the lid wall portion of the case. It is known that it is injection-molded in a substantially lunch box shape, and a heat conductive sheet such as an aluminum plate is integrally fixed by interposing a heat conductive sheet outside the lid wall of the case (for example, a patent Reference 1). In this case assembly, the heat generated from the internal devices is dissipated from the heat radiating plate to prevent the temperature inside the case from rising.
[0003]
[Patent Document 1]
JP 2002-343905 A
However, when the case C ′ is formed in a substantially lunch box shape by injection molding of synthetic resin, the molding shrinkage after injection molding of the resin is larger on the outer surface side than on the inner surface side, and as shown in FIG. Further, the outer side of the lid wall portion 2 facing the opening is slightly concave and warps. The plate-like heat dissipating member H is applied to the warped cover wall portion 2 with the heat conducting sheet S interposed therebetween, and the cover of the case C ′ is interposed via a plurality of screws 13 in the vicinity of the periphery of the heat dissipating member H. Even if the radiator H is fixed to the wall 2, as shown in FIG. 8, the lid wall 2 and the radiator H of the case C ′ are in close contact with each other at the periphery, but between the two at the center. A gap 31 that does not contact is formed. In FIG. 7, R ′ represents the radius of curvature of the outer surface of the lid wall portion 2 having a concave shape.
[0005]
As a result, since the gap 31 functions as a heat insulating layer, the heat generated from the internal devices cannot be effectively conducted to the radiator H, and the heat dissipation efficiency of the case C ′ is lowered.
[0006]
[Problems to be solved by the invention]
The problem of the present invention is that when the radiator is fixed to the outer surface of the plate-like portion of the equipment housing member injection-molded from synthetic resin, the outer surface of the plate-like portion and the rear surface of the radiator are closely adhered to each other. The present invention provides a device housing member with high heat dissipation efficiency that effectively conducts heat inside the device housing member and dissipates heat.
[0007]
[Means for Solving the Problems]
The invention of claim 1 for solving the above-mentioned problem is a device housing member having a housing space capable of housing an electric device and / or an electronic device that generates heat when operating, wherein the device housing member includes: The device is formed of an elastically deformable and electrically insulating synthetic resin so as to have a plate-like portion, and the plate-like portion is formed of the plate-like portion and the other part of the housing member inside thereof. A heat sink having an accommodating space and an outer surface of the plate-like portion formed from a material having higher thermal conductivity than the synthetic resin so as to have a substantially flat surface shape on at least a part of one surface. It is a heat dissipating part that can be attached to face to face, and the plate-like part of the bus bar made of an elastically deformable metal plate separately formed in advance so as to integrally have a terminal plate part and a board part The board part dissipates heat from the center of the plate part in the thickness direction. The plate-like portion is formed by molding the outer synthetic resin by the base plate portion of the metal plate bus bar when the device housing member is injection-molded from the synthetic resin. It is characterized in that the heat radiating portion side is formed into a convex curved surface due to a difference in molding shrinkage due to the shrinkage being suppressed smaller than the inner molding shrinkage.
[0008]
According to the first aspect of the present invention, since the heat radiating portion side of the plate-like portion constituting the device housing member is formed in a slightly convex curved surface, the plate-like heat radiation is formed on the outer surface of the plate-like portion of the device housing member. When the body is attached, the plate-like portion of the device housing member and / or the heat radiating body is elastically deformed, and there is no space between the back surface (inner surface) of the heat radiating member and the outer surface of the device housing member, The outer surface of the plate-shaped portion constituting the device housing member is in close contact with the back surface of the heat radiating body, and heat generated from the inside of the device housing member can be efficiently transmitted to the heat radiating body, so that the heat radiating efficiency is not lowered. Further, at the time of injection molding of the device housing member, the outer portion of the plate-like portion is formed by disposing the metal plate bus bar substrate portion outside the center in the thickness direction of the plate-like portion. The molding shrinkage of the material is suppressed, and the heat radiation portion side of the plate-like portion of the device housing member can be easily formed into a slightly convex curved surface.
[0009]
Further, the invention of claim 2 is a device housing member that has a housing space capable of housing an electric device and / or an electronic device that generates heat when activated, and is integrally attached to a heat radiator. The device housing member is injection-molded so as to have a plate-like portion made of an elastically deformable and electrically insulating synthetic resin, and the plate-like portion includes a plate-like portion and another portion of the housing member inside thereof. In addition to having a housing space for the device to be formed, the outer surface of the plate-like portion has a substantially flat surface shape on at least a part of one surface from a material having higher thermal conductivity than the synthetic resin. A heat dissipating part that faces and can be attached to the formed heat dissipating body, and the plate-like part is an elastically deformable metal that is separately formed in advance so as to integrally have a terminal board part and a board part The board portion of the bus bar made of plate is in the thickness direction of the plate-like portion. The plate-like portion is located on the side of the heat radiating portion, and is integrally embedded and fixed, and the plate-like portion is arranged outside by the base plate portion of the metal plate bus bar when the device housing member is injection-molded from synthetic resin. The heat sink is formed into a curved surface with a convex shape due to the difference in molding shrinkage due to the molding shrinkage of the synthetic resin being suppressed to be smaller than the inner molding shrinkage. By being fixed to the flat surface, the heat radiating portion of the plate-like portion is elastically deformed from the convex curved surface and fixed in parallel to the flat surface of the heat radiating body.
[0010]
The invention of claim 2 grasps the invention of claim 1 in the “state in which the heat radiating body is integrally attached to the outer surface of the plate-like portion constituting the device housing member”, and its substantial action. In addition to the effect of the invention of claim 1, the effect is that the devices can be stably mounted inside.
[0011]
According to a third aspect of the present invention, in the first or second aspect of the invention, the device accommodating member forms a substantially box-shaped case, and the plate-shaped portion constitutes a bottom wall portion or a lid wall portion of the substantially box-shaped case. It is characterized by that.
[0012]
According to invention of Claim 3, since it is the structure by which a heat radiator is integrally attached to the outer surface of the bottom wall part or cover wall part which has a large area of a substantially box-shaped case, it is heat-dissipating with a bottom wall part or a cover wall part, and heat dissipation. In addition to the effect of the invention of claim 1 or 2 in which the body is in close contact with the gap and the heat dissipation is enhanced, the heat dissipation area itself is increased, so that the heat dissipation is further enhanced.
[0013]
According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, in the plate-like portion, a plurality of bus bars are kept spaced from each other, and the substrate portions of the bus bars are kept on the same surface. It is characterized by.
[0014]
According to invention of Claim 4, each bus bar is arrange | positioned at predetermined intervals along the surface direction of a plate-shaped part, and the board | substrate part of a bus bar is the same along the thickness direction of a plate-shaped part. Therefore, when the equipment housing member is injection-molded, there is no variation in molding along the surface direction of the plate-like part, and the plate-like part has a convexity with a substantially constant radius of curvature on the heat radiation part side. Formed in a curved surface. For this reason, a heat radiating body is integrally fixed to the heat radiating portion side of the outer surface of the plate-like portion of the device housing member, and the plate-like portion is deformed so as to be parallel to the flat surface of the heat radiating body from the convex curved surface. At this time, it is deformed along the planar shape of the flat surface of the heat radiating body, and no gap is formed between the plate-like portion of the device housing member and the heat radiating body, so that the heat dissipation is further enhanced.
[0015]
According to a fifth aspect of the present invention, in any one of the second to fourth aspects of the present invention, the thermal conductivity between the heat radiating portion outside the plate-like portion and the flat portion of the heat radiating member is higher than that of the synthetic resin. In addition, it is characterized in that the heat radiating body is fixed via an electrically insulating heat conductive material.
[0016]
According to the invention of claim 5, between the plate-like portion of the device housing member and the heat dissipating member, the heat conductivity higher than that of the synthetic resin and the electrically insulating heat conducting member is interposed. The amount of heat transfer from the part to the heat radiating body is increased, and the heat radiation efficiency is further enhanced.
[0017]
The invention of claim 6 is characterized in that, in the invention of claim 5, in the plate-like portion, the outer surface of the substrate portion of the bus bar is exposed to the heat radiating portion side. Therefore, according to the sixth aspect of the present invention, the metal bar bus bar can be positioned close to the radiator via the heat conductive material, so that heat transfer to the radiator is enhanced and the heat radiation efficiency is enhanced.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail with reference to embodiments. 1 is an overall perspective view of a case assembly A according to the present invention, FIG. 2 is a sectional view taken along line XX of FIG. 1, and FIG. 3 is a sectional view taken along line YY of FIG. 4 is a perspective view of the case C, FIG. 5 is a plan view of the case C, and FIG. 6 is a cross-sectional view showing a state in which the radiator H is fixed to the outside of the lid wall portion 2 of the case C. . FIG. 6 exaggerates the state in which the outer side of the lid wall portion 2 of the case C is convexly curved with respect to FIGS. 2 and 3.
[0019]
The case assembly A according to the present invention has a substantially lunch box-like shape in which the bottom surface is opened and an electric and / or electronic device P such as a transistor, a MOS, or a capacitor that generates heat during operation is stored in the internal storage space 1. A case C and a substantially plate-like radiator H having a flat surface fixed to the lid wall portion 2 so as to face the lid wall portion 2 of the case C are provided. The substantially lunch box-like case C has a peripheral wall portion 3 and a lid wall portion 2 that closes the upper surface opening of the peripheral wall portion 3 formed integrally by injection molding of a synthetic resin having electrical insulation, and the lower surface is opened. A cylindrical connector portion 4 is integrally formed on the outer side of one short side portion of the frame-shaped peripheral wall portion 3.
[0020]
In the lid wall portion 2 of the case C, a part of a plurality of bus bars B for connecting an electronic device stored in the internal storage space 1 is partially inserted during the resin injection molding. The bus bar B of the present embodiment is a form in which a metal plate is bent into an L-shaped cross section, and its substrate portion 5 is inserted into the lid wall portion 2 of the case C, and its terminal plate portion 6 is the accommodating space 1. Placed inside. In the case C of the present embodiment, a total of six bus bars B are arranged in three rows and two rows in both the vertical and horizontal directions. That is, as shown in FIGS. 4 and 5, a total of six bus bars B are arranged at regular intervals D ₁ and D ₂ along both the vertical and horizontal directions. Further, the portion of the peripheral wall 3 of the case C where the connector portion 4 is provided is such that the connector terminal 7 protrudes in both the inside and outside of the case C at the time of resin injection molding of the case C. Partially inserted.
[0021]
When the case C is resin-injected with the substrate portion 5 of the bus bar B inserted into the lid wall portion 2, the substrate portion 5 of the bus bar B is attached to the lid wall portion 2 as shown in FIGS. 4 to 6. It is exposed to the outer surface and is arranged so as to be flush with the outer surface of the lid wall 2. In addition, the substrate portion 5 of the bus bar B is in the relationship with the thickness direction of the lid wall portion 2 so that the entire substrate portion 5 is outside the center of the lid wall portion 2 in the thickness direction, that is, the thickness of the lid wall portion 2. It is disposed at a position that is biased toward the heat dissipating body H with respect to (1/2). For this reason, after the base plate part 5 of the bus bar B is partially inserted into the lid wall part 2 and the case C is injection molded from synthetic resin, the resin of the outer part of the lid wall part 2 is the base part 5 of the bus bar B. Although the shrinkage is suppressed due to the insertion, the resin in the inner portion of the lid wall portion 2 shrinks more than the outer portion without being restricted.
[0022]
Therefore, when the case C is injection-molded with synthetic resin, the outer side of the resin forming the lid wall portion 2 has a smaller amount of shrinkage than the inner side, and there is a difference in resin molding shrinkage between the inner and outer portions. As a result, the lid wall portion 2 of the case C is formed as a curved surface whose outer surface is slightly convex, and the upper surface of the lid wall portion 2 is slightly concave and does not warp as in the prior art. Here, “slightly convex” means a convex in a range that can be elastically deformed into a flat shape without causing a crack or the like in the mounting of the radiator H described later. In addition, each bus bar B is arranged at regular intervals D ₁ and D ₂ along both the vertical and horizontal directions, and the substrate portion 5 of the bus bar B is exposed on the outer surface of the lid wall portion 2. Since it is arranged along the thickness direction of the lid wall portion 2 so as to be the same surface as this, at the time of injection molding of the case C, there is no variation in molding along the surface direction of the lid wall portion 2, The lid wall portion 2 is formed in a curved surface whose convex side is the heat radiation portion. For this reason, the heat radiator H is integrally fixed to the heat radiating portion side of the outer surface of the lid wall portion 2 of the case C so that the lid wall portion 2 is parallel to the flat surface of the heat radiator H from the convex curved surface. When it is deformed, it becomes easy to be deformed into a planar shape along the flat surface of the heat radiating body H, and there is almost no gap between the lid wall portion 2 of the case C and the heat radiating body H, so that heat dissipation is achieved. Increased further. At the time of resin injection molding of the case C, an electronic device connected to the bus bar B below the board part 5 of the bus bar B in the lid wall part 2 has the same length as the bus bar B and a narrow width. A device storage recess 8 in which P is partially stored is formed, and a plurality of screw insertion holes 9 are formed in the peripheral portion of the lid wall portion 2 of the case C.
[0023]
Next, the case where the case assembly A is formed by fixing the plate-like heat radiating body H to the outside of the lid wall portion 2 of the case C described above will be described. The plate-shaped heat radiator H is fixed to the outside of the lid wall 2 of the case C with a plate-shaped heat conductive sheet S interposed therebetween, and conducts heat generated from the electronic device inside the case C to dissipate to the outside. It is a member to be made. For this reason, the heat radiator H is made of a metal plate such as an aluminum plate in order to improve the heat radiation performance, and the uneven portion 12 is formed on the surface (see FIGS. 1, 2 and 6). Further, the heat conductive sheet S is formed of a laminate of electrically insulating and high heat conductive materials, for example, a silicon resin. In FIG. 6, R represents a radius of curvature of the outer surface of the lid wall portion 2 that is a slightly convex curved surface.
[0024]
And as FIG. 6 shows, the heat radiator H which has a flat surface is arrange | positioned by interposing the heat-conducting sheet S on the outer side of the cover wall part 2 of the case C curved so that the outer surface side may become slightly convex. When the heat radiating body H is fixed to the lid wall portion 2 of the case C by a plurality of screws 13 inserted from the inside of the case C at a plurality of locations on the peripheral portion of the case C, as shown in FIG. Further, the lid wall portion 2 of the case C is deformed into a flat surface shape from a curved shape whose outer surface side is slightly convex following the flat surface shape of the heat radiator H, and the heat radiator H is a lid of the case C. It is fixed in a state of being in close contact with the wall portion 2 over almost the entire surface. Further, when the radiator H is fixed to the lid wall portion 2 of the case C in this way, when the outer surface side of the lid wall portion 2 of the case C is a slightly convex curved surface, it is deformed into a substantially flat shape. In the inside of the lid wall portion 2 thus formed, there remains an internal stress that attempts to restore the curved shape (original shape) so that the outer surface side is slightly convex. Adhesion between the lid wall 2 and the radiator H is enhanced. For this reason, almost no gap is generated between the inner surface side of the radiator H and the outer surface side of the lid wall portion 2 of the case C. In this manner, the heat radiating body H is fixed to the outside of the lid wall portion 2 of the case C via the heat conducting sheet S, and the case assembly A is formed.
[0025]
The case assembly A is used to house the electronic device P in the component housing space 1 formed on the inner surface side of the lid wall portion 2 of the case C, and to connect to the substrate portion 5 of each bus bar B. The terminal plate portion 6 of the bus bar B is electrically connected by the wires W ₁ , and the specific bus bar B and the connector terminal 7 are connected by another wire W ₂ . Finally, when the bottom wall plate 14 is fixed to the opening on the bottom surface of the case C while being kept airtight with an adhesive or the like, a product such as a connector is completed. As described above, the case C has the lid wall 2 elastically deformed into a flat shape before the electronic device P is housed and mounted, so that the device P is more elastic than the case where the electronic device P is elastically deformed after being mounted. There is a practical advantage that the wires W ₁ and W ₂ are not distorted.
[0026]
As described above, since the substrate portion 5 of the bus bar B that is partially inserted into the lid wall portion 2 of the case C is disposed outside the center in the thickness direction of the lid wall portion 2, at the time of resin injection molding of the case C The outer side of the resin forming the lid wall portion 2 has a smaller amount of shrinkage than the inner side, and a difference occurs in the molding shrinkage amount of the resin at the inner and outer portions of the lid wall portion 2. As a result, at the time of resin injection molding of the case C, the outer side of the lid wall portion 2 is slightly convex and is prevented from being concave as in the conventional structure. When the plate-like heat radiator H is arranged and fixed outside, the heat radiator H comes into close contact with the lid wall portion 2 and no gap is formed between the two. Therefore, the heat generated in the case C can be efficiently conducted to the heat radiating body H, and the heat radiation efficiency is improved.
[0027]
In particular, in the above embodiment, the substrate portion 5 of the bus bar B is exposed to the outside of the lid wall portion 2 of the case C and directly contacts the heat conducting sheet S to increase the heat transfer coefficient. There is an advantage that the heat radiation efficiency of the generated heat can be further improved. However, in the present invention, the substrate portion 5 of the bus bar B embedded in the lid wall portion 2 of the case C at the time of resin injection molding is arranged so as to be offset outward from the center of the lid wall portion 2 in the thickness direction. If the entire substrate portion 5 is embedded in the lid wall portion 2 in a state of being formed, a difference in molding shrinkage of the material occurs between the outer side portion and the inner side portion of the lid wall portion 2, and the lid wall portion The outer surface of 2 can be formed slightly convex.
[0028]
Further, in the above embodiment, the outer surface side of the cover wall portion 2 of the case C is a curved surface that is slightly convex, and when the case assembly A is assembled, the flat radiator H is attached to the cover wall of the case C. It is configured to bend along the convex curved surface on the outer surface side of the portion 2 and to fix the plate-like radiator R in close contact with the lid wall portion 2 of the case C. When the outer surface side of the portion 2 is a gently convex curved surface with a large radius of curvature, and close to a flat surface, the lower surface side of the radiator H facing the outer surface side of the lid wall portion 2 is slightly convex. When the case assembly A is assembled, the radiator H is curved and deformed in a flat shape following the flat surface shape on the outer surface side of the lid wall portion 2 of the case C. It is also possible to fix the heat radiating body H to the outer surface of the lid wall portion 2 of the case C in a close contact state.
[0029]
Moreover, in the said embodiment, it is the structure by which the thermal radiation body H adheres to the outer surface of the cover wall part 2 of the box-shaped case (equipment accommodation member) C, Comprising: From the part of the cover wall part 2, it is the inside of case C. However, the present invention can also be applied to a case where a radiator is fixed to the outer surface of the bottom wall portion.
[0030]
Moreover, in the said embodiment, the case C is substantially lunch box shape, Comprising: The accommodation space 1 which accommodates electricity and / or the electronic device P inside was formed by the cover wall part 2 and the surrounding wall part 3. However, the “accommodating space” in the present invention is not limited to a typical shape in which the peripheral wall portion 3 is provided over the entire circumference as in the above embodiment, and a part of the peripheral wall portion 3 is missing. In addition, an irregular box shape or an incomplete box shape, and “the space surrounded by the bottom plate portion and the side plate portion is an article storage space. Although having a plate-like portion for fixing the heat dissipating member, it is a “device housing member” that is an object of the present invention.
[0031]
Furthermore, in the above embodiment, when the case C is injection-molded, it is considered that the lid wall portion is elastically deformed later so that the terminal plate portion of the bus bar is in a normal position after the elastic deformation in the post process. It is preferable to determine the set position in the injection mold.
[0032]
【The invention's effect】
The device housing member according to the present invention can be formed so that the outer surface of the plate-like portion is convex by devising the buried position of the bus bar with respect to the thickness direction of the plate-like portion to which the radiator is attached to the outer surface. When the radiator is fixed integrally to the outside of the plate-like portion, the radiator is curved to follow the convex shape of the outer surface of the plate-like portion, so that the outside of the plate-like portion of the device housing member is curved. It is possible to fix the heat radiating body in a close contact state with almost no gap. As a result, the heat inside the device housing member is effectively transferred to the heat radiating body, and a device housing member with high heat dissipation efficiency is obtained.
[Brief description of the drawings]
FIG. 1 is an overall perspective view of a case assembly A according to the present invention.
2 is a cross-sectional view taken along line XX of FIG.
3 is a cross-sectional view taken along line YY in FIG.
4 is a perspective view of case C. FIG.
FIG. 5 is a plan view of the same.
6 is a cross-sectional view showing a state in which a heat radiating body H is fixed to the outside of the lid wall portion 2 of the case C. FIG.
FIG. 7 is a cross-sectional view of a case assembly A ′ mainly showing a conventional case C ′ before assembly.
FIG. 8 is a cross-sectional view of the case assembly A ′ after assembly.
[Explanation of symbols]
A: Case assembly (device housing member)
B: Bus bar C: Case (equipment housing member)
D ₁ , D ₂ : bus bar arrangement interval H: radiator P: electronic device S: heat conducting sheet (heat conducting material)
1: Case housing space 2: Case lid wall portion 3: Case peripheral wall portion 5: Bus bar substrate portion 6: Bus bar terminal plate portion

Claims

A device housing member having a housing space capable of housing an electrical device and / or an electronic device that generates heat when activated,
The device housing member is injection-molded so as to have a plate-like portion made of an elastically deformable and electrically insulating synthetic resin, and the plate-like portion is formed by a plate-like portion and another portion of the housing member inside the plate-like portion. The outer surface of the plate-like portion is formed from a material having higher thermal conductivity than the synthetic resin so that at least a part of one surface has a substantially flat surface shape. It is a heat dissipating part that can be mounted facing the heat dissipating body,
The board portion of the bus bar made of an elastically deformable metal plate, which is separately formed in advance so as to integrally have the terminal plate portion and the board portion, is located on the plate-like portion from the center in the thickness direction of the plate-like portion. It is located on the heat dissipation part side and is embedded and fixed integrally.
The plate-like portion is because the molding shrinkage amount of the outer synthetic resin is suppressed to be smaller than the inner molding shrinkage amount by the base plate portion of the metal plate bus bar when the device housing member is injection-molded from the synthetic resin. A device housing member, characterized in that the device housing member is formed in a curved surface having a convex portion on the heat radiation portion side due to a difference in molding shrinkage.

A device housing member that has a housing space that can accommodate an electrical device and / or an electronic device that generates heat when operating, and is integrally attached to a radiator,
The device housing member is injection-molded so as to have a plate-like portion made of an elastically deformable and electrically insulating synthetic resin, and the plate-like portion is formed by a plate-like portion and another portion of the housing member inside the plate-like portion. The outer surface of the plate-like portion is formed from a material having higher thermal conductivity than the synthetic resin so that at least a part of one surface has a substantially flat surface shape. It is a heat dissipating part that can be mounted facing the heat dissipating body,
The board portion of the bus bar made of an elastically deformable metal plate, which is separately formed in advance so as to integrally have the terminal plate portion and the board portion, is located on the plate-like portion from the center in the thickness direction of the plate-like portion. It is located on the heat dissipation part side and is embedded and fixed integrally.
The plate-like portion is because the molding shrinkage amount of the outer synthetic resin is suppressed to be smaller than the inner molding shrinkage amount by the base plate portion of the metal plate bus bar when the device housing member is injection-molded from the synthetic resin. Due to the difference in molding shrinkage, it is formed in a curved surface with a convex on the heat dissipation part side,
The device housing member is fixed to the flat surface of the heat radiating body by a fixing tool, so that the heat radiating portion of the plate-like portion is elastically deformed from the convex curved surface and is fixed in parallel to the flat surface of the heat radiating body. A device housing member characterized by the above.

The device storage member according to claim 1 or 2, wherein the device storage member forms a substantially box-shaped case, and the plate-shaped portion constitutes a bottom wall portion or a lid wall portion of the substantially box-shaped case. .

4. The device housing member according to claim 1, wherein a plurality of bus bars are spaced from each other in the plate-like portion, and a substrate portion of each bus bar is kept on the same surface. 5.

Between the heat radiating portion outside the plate-like portion and the flat portion of the heat radiating member, the heat radiating member is fixed with a heat conductivity higher than that of the synthetic resin and electrically insulating. The device accommodating member according to claim 2, wherein

The device accommodating member according to claim 5, wherein an outer surface of the substrate portion of the bus bar is exposed to the heat radiating portion side in the plate-like portion.