JP5374860B2 - Microactuator and manufacturing method thereof, microactuator array, microactuator device, optical device, display device, exposure apparatus, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To extend lifetime, increase response speed, change only the direction of a driven body with no deformation of the driven body itself, and shorten a settling time, for increased speed of driving. <P>SOLUTION: Both ends of a plate-like member 2 are fixed to a substrate 1 by way of a leg part 3. The plate-like member 2 can deflect between the portions fixed to the substrate 1. A mirror 4 which is a driven body is locally and mechanically connected to a specified part in the deflectable region of the plate-like member 2 through a connection part 11. A fixed electrode 5 is provided on the substrate 1, in the region facing the central part of the plate-like member 2. A voltage is applied between the fixed electrode 5 and a facing movable electrode of the plate-like member 2 to generate static electricity between them, so that the inclination of the mirror 4 changes with no deformation of the mirror 4 itself. The counter region to the plate-like member 2 of the base body is flattened so that the interval between the substrate and the plate-like member 2 is narrowed. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a microactuator, a microactuator array, a microactuator device, an optical device, a display device, an exposure apparatus, and a device manufacturing method.

  Along with the development of MEMS (Micro-Electro-Mechanical System) technology, microactuators using this technology, optical devices such as DMD (Digital Micro-mirror Device) using this technology, and such optical devices were used. Various projection apparatuses and exposure apparatuses using such optical devices as variable shaping masks (also called programmable masks or active masks) have been proposed.

  For example, the following Patent Document 1 discloses a representative DMD. In this DMD, the mirror is held by a torsion hinge, the hinge is twisted and deformed by electrostatic force, the mirror is rotated to change its direction, and the incident light reflection direction is changed. A plurality of basic units are arranged one-dimensionally or two-dimensionally to form a spatial light modulator, which is applied to an optical information processing apparatus, a projection display apparatus, an electrostatographic printing apparatus, and the like.

  An optical device that changes the reflection direction of incident light by bending a cantilever provided with a mirror with an electrostatic force is also known.

  However, in the microactuator using the torsion hinge, since the mirror is held by the torsion hinge, it is easily damaged by the torsional stress applied to the coupling portion of the torsion hinge, and it is difficult to extend its life. Also, in the microactuator using a cantilever, the response speed cannot be increased because the natural frequency of the cantilever is low.

  Therefore, in Patent Document 2 below, a micromirror device using a doubly supported beam provided to fix both ends on a substrate having a V-shaped recess and to span the recess is proposed. In this device, a light reflecting film is formed on both cantilever beams, and the mirror is integrated with the both cantilever beams as a whole. In the state where no electrostatic force is applied, the double-supported beam (that is, the mirror) has a flat plate shape. On the other hand, when the electrostatic force is applied, the double-supported beam (that is, the mirror) is V-shaped along the V-shaped recess by electrostatic force. To change the reflection direction of incident light.

Since this device uses a doubly-supported beam, it is less likely to break than using a torsion hinge, and it is possible to extend the service life, increase the natural frequency, and increase the response speed. Can be fast.
Japanese Patent No. 3492400 JP 2005-24966 A

  However, in the device disclosed in Patent Document 2, since the mirror is integrated with the doubly supported beam, when the doubly supported beam is deformed into a V shape by electrostatic force, the mirror is also deformed into a V shape, The reflection surface of the mirror becomes two surfaces (one surface of the V shape and the other surface) having different directions. As a result, the direction of the reflected light varies greatly depending on the position where the incident light is incident, stray light or the like is likely to be generated, and it is difficult to absorb light with respect to the stray light.

  Thus, although the device disclosed in Patent Document 2 is very excellent in terms of extending the life and speeding up the response speed, the driven mirror is integrated with the doubly supported beam. The mirror, which is a driven body, is also deformed, which causes inconvenience.

  Further, not only the microactuator used in the mirror device disclosed in Patent Document 2, but also the microactuator used in various other applications, the orientation of the driven body without deforming the driven body itself. May only be required to change.

  Further, in such a microactuator, in order to further increase the driving speed, it is preferable that the time (stabilization time) until the vibration during driving attenuates and settles is short.

  The present invention has been made in view of such circumstances, and can achieve a long life and a high response speed, and can change only the direction of the driven body without deforming the driven body itself. It is another object of the present invention to provide a microactuator that can shorten the settling time and increase the driving speed. Another object of the present invention is to provide a microactuator array using such a microactuator, a microactuator device, an optical device, a display device, an exposure apparatus, and a device manufacturing method using such an exposure apparatus. And

In order to solve the above-mentioned problem, a microactuator according to a first aspect of the present invention includes a base, a plate-like member supported by the base, and a driving force applying unit, and the plate-like member is the plate-like member. It is fixed to the base body at a predetermined location over the entire circumference or a part of the periphery of the member, and can be bent and deformed in a region other than the predetermined location in the plate-like member. The driven member is locally mechanically connected to a predetermined portion of the plate-like member in a region where the plate-like member can be bent and deformed, and includes the two portions facing each other in the peripheral portion of the plate-like member, Is driven on at least a part of the plate-like member so that the bending-deformable region of the plate-like member is deformed in accordance with a signal and the inclination of the predetermined portion of the plate-like member changes. Can give power, Region facing the said plate-like member in the serial base is flattened, the driving force providing means, one or more of the first electrode portion provided on the base body, the one provided on the plate-like member One or more second electrode portions that can generate an electrostatic force between the one or more first electrode portions due to a voltage between the first electrode portion and the first electrode portion .
The microactuator according to a second aspect of the present invention is the microactuator according to the first aspect, wherein the one or more first electrode portions are opposed to a part of the plate member and the remaining part of the plate member. Is not opposite.

The microactuator according to a third aspect of the present invention is the microactuator according to the first or second aspect, wherein the base has a planarizing film planarized by CMP in the facing region.

The microactuator according to a fourth aspect of the present invention is the micro-actuator according to any one of the first to third aspects, in the state where the driving force is not applied, the plate member, the plate member, and the opposing region in the base body. The gap between them is 0.3 μm or less.

The microactuator according to a fifth aspect of the present invention is the microactuator according to any one of the first to fourth aspects, wherein the driven body has a main plane, the main plane of the plate-like member and the main body of the driven body. The plane is substantially parallel.

The microactuator according to a sixth aspect of the present invention is the microactuator according to any one of the first to fifth aspects, wherein the predetermined portion of the plate-like member is a portion eccentric from the center of gravity of the plate-like member. .

A microactuator according to a seventh aspect of the present invention includes a base, a plate-like member supported by the base, and a driving force imparting unit, and the plate-like member has an entire circumference in a peripheral portion of the plate-like member. Alternatively, it is fixed to the base at a predetermined position over a part thereof, and can be bent and deformed in an area other than the predetermined position in the plate-shaped member, and the predetermined position is in the peripheral portion of the plate-shaped member The driven body is locally mechanically connected to a predetermined part of the plate-shaped member in a region where the plate-like member can be bent and deformed. A driving force can be applied to at least a part of the plate-like member so that the bending-deformable region of the plate-like member is deformed to change the inclination of the predetermined portion of the plate-like member. Yes, the plate shape in the substrate Region facing the wood is flattened, the predetermined portion of the plate-shaped member is one that is part eccentric from the center of gravity of the plate-like member.

A microactuator array according to an eighth aspect of the present invention is a microactuator array including a plurality of microactuators, a first terminal group including a plurality of terminals, and a second terminal group including a plurality of terminals. (I) each microactuator is a microactuator according to any one of the first to sixth aspects, and (ii) for each microactuator, the first electrode portion of the microactuator includes: It is electrically connected to one terminal of one of the first and second terminal groups and is not electrically connected to the other terminals of the first and second terminal groups. (Iii) For each microactuator, the second electrode portion of the microactuator is connected to the first and second terminal groups. And is not electrically connected to the other terminals of the first and second terminal groups, and (iv) for each microactuator, One terminal of the first or second terminal group electrically connected to the first electrode portion of the microactuator and the first or second electrically connected to the second electrode portion of the microactuator. The combination with one terminal of the second terminal group is unique to the microactuator, and (v) at least one terminal of the first terminal group is two or more of the plurality of microactuators. And (vi) at least one terminal of the second terminal group is connected to the plurality of micro-actuators. Commonly electrically connected to the first or second electrode section of two or more microactuators of the actuator.

  The “unique” in (iv) corresponds to two terminals when any one terminal is selected from the first terminal group and any one terminal is selected from the second terminal group ( In other words, this means that only one microactuator (with these two terminals electrically connected to both electrodes) is specified.

An optical device according to a ninth aspect of the present invention includes the microactuator according to any one of the first to seventh aspects and the driven body, and the driven body is an optical element.

An optical device according to a tenth aspect of the present invention is the optical device according to the ninth aspect, wherein the optical element is a mirror.

An optical device according to an eleventh aspect of the present invention is the optical device according to the ninth or tenth aspect, comprising a plurality of sets of the microactuator and the optical element.

A display device according to a twelfth aspect of the present invention is a display device including a spatial light modulator, wherein the spatial light modulator is an optical device according to the eleventh aspect.

An exposure apparatus according to a thirteenth aspect of the present invention is an exposure apparatus that exposes an object using illumination light, comprising the optical device according to the eleventh aspect disposed on an optical path of the illumination light, The object is exposed using the illumination light via an optical device.

In an exposure apparatus according to a fourteenth aspect of the present invention, in the thirteenth aspect, the optical device generates a predetermined pattern by irradiation with the illumination light.

The exposure apparatus according to a fifteenth aspect of the present invention is the exposure apparatus according to the thirteenth or fourteenth aspect, further comprising a moving body that holds and moves the object, and the driving force applying means for each microactuator of the optical device. Is controlled in synchronization with the movement of the moving body in a predetermined direction.

A device manufacturing method according to a sixteenth aspect of the present invention is a device manufacturing method including a lithography process, in which the exposure is performed using the exposure apparatus according to any one of the thirteenth to fifteenth aspects. It is.
According to a seventeenth aspect of the present invention, there is provided a device manufacturing method comprising: a base including a substrate, an insulating film, a fixed electrode, and a wiring pattern; and a plate-like shape supported by the base and capable of being bent and deformed by the fixed electrode. A method of manufacturing a microactuator having a member, wherein the insulating film is formed on the substrate, and the fixed electrode is opposed to a part of the plate member and the remaining part of the plate member Forming the fixed electrode and the wiring pattern on the insulating film so as not to face each other, and flattening on the insulating film and the region facing the plate-like member on the fixed electrode and the wiring pattern Forming a film to be a film, flattening the film to be the planarization film to form a planarization film, forming a sacrificial layer on the planarization film, and on the sacrificial layer The plate member Viewed including the method comprising forming the said microactuator is intended a microactuator according to the first to seventh either aspect.

  According to the present invention, the service life and response speed can be increased, and only the direction of the driven body can be changed without deforming the driven body itself. A microactuator that can be shortened and driven at higher speed can be provided. In addition, according to the present invention, a microactuator array using such a microactuator, a microactuator device, an optical device, a display device, an exposure apparatus, and a device manufacturing method using such an exposure apparatus are provided. Can do.

  Hereinafter, a microactuator, a microactuator array, a microactuator device, an optical device, a display device, an exposure apparatus, and a device manufacturing method according to the present invention will be described with reference to the drawings.

  [First Embodiment]

  FIG. 1 is a schematic perspective view schematically showing a unit element of the optical device according to the first embodiment of the present invention. FIG. 2 is a schematic plan view schematically showing the unit element shown in FIG. 1 and 2, the planarization film 20 is omitted. FIG. 3 is a schematic plan view schematically showing the plate-like member 2 of the unit element shown in FIG. FIG. 3 also shows a connecting portion 11 described later. FIG. 4 is a schematic cross-sectional view along the line A-A ′ in FIG. 2.

  For convenience of explanation, as shown in FIGS. 1 to 4, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined (the same applies to the drawings described later). The surface of the substrate 1 is parallel to the XY plane. The + side in the Z-axis direction may be referred to as the upper side, and the − side in the Z-axis direction may be referred to as the lower side. In addition, the material etc. which are demonstrated below are illustrations, and are not limited to this.

  The optical device according to the present embodiment includes a silicon substrate 1 constituting a base, a plate-like member 2 supported on the silicon substrate 1 via legs 3, a mirror 4 as an optical element that is a driven body, And a fixed electrode (first electrode portion) 5. The base includes not only the silicon substrate 1 but also the insulating film 6, the fixed electrode 5, and the planarizing film 20 formed on the silicon substrate 1. The driven body driven by the microactuator according to the present invention is not limited to the mirror 4, and may be other optical elements such as a diffractive optical element, an optical filter, a photonic crystal, or the like. Any member may be used.

  In the present embodiment, the plate-like member 2 has a quadrangular shape in plan view as seen from the Z-axis direction. When an electrostatic force described later as a driving force is not applied, the main plane of the plate-like member 2 is parallel to the XY plane as shown in FIGS.

  The plate-like member 2 is formed on an insulating film 6 such as a silicon oxide film on the substrate 1 in the vicinity of one side of the + X side and the one side of the −X side, which are two locations facing each other in the periphery of the plate-like member 2. Via a wiring pattern 7 (see FIG. 4, omitted in FIGS. 1 and 2) made of an aluminum film and a planarizing film 20 such as a silicon oxide film (see FIG. 4, omitted in FIGS. 1 and 2). It is fixed to the substrate 1 via legs 3 rising from the substrate 1. Therefore, in this embodiment, the plate-like member 2 is a doubly supported beam. An area between the + X side leg 3 and the −X side leg 3 in the plate-like member 2 is an area that can be bent and deformed.

  The plate-like member 2 is composed of a thin film, and is composed of a three-layer film in which a silicon nitride film 8 as a lower insulating film, an intermediate aluminum film 9 and an upper silicon nitride film 10 are laminated.

  In the present embodiment, the leg portion 3 is configured by extending the silicon nitride films 8 and 10 and the aluminum film 9 constituting the plate-like member 2 as they are. The aluminum film 9 is connected to the wiring pattern 7 through the openings formed in the silicon nitride film 8 and the planarizing film 20 in the leg 3.

  In the present embodiment, the mirror 4 is composed of a thin film and is composed of an aluminum film. It has a quadrangular shape in plan view as viewed from the Z-axis direction. When the electrostatic force described later as the driving force is not applied, the main plane of the mirror 4 is parallel to the XY plane as shown in FIGS. 1 to 4, and the main plane of the plate-like member 2 is It is parallel. Although not shown in the drawings, in order to increase the rigidity of the mirror 4, it is preferable to reinforce by forming a step (a rising portion or a falling portion) around the mirror 4 as necessary.

  The mirror 4 is mechanically locally connected to a portion that is eccentric in the −X direction from the center (center of gravity) of the plate-like member 2 in the region where the plate-like member 2 can be bent and deformed via the connection portion 11. It is connected. The connecting portion 11 is configured by extending an aluminum film constituting the mirror 4 as it is.

  In the present embodiment, the fixed electrode 5 is formed of an aluminum film so as to overlap the plate member 2 over the entire Y axis direction of the plate member 2 in the vicinity of the center of the plate member 2 in the X axis direction. ing. A movable electrode (second electrode portion) in which an area of the aluminum film 9 constituting the plate-like member 2 that faces the fixed electrode 5 can generate an electrostatic force with the fixed electrode 5 due to a voltage between the aluminum electrode 9 and the fixed electrode 5. ). The remaining region of the aluminum film 9 is a wiring pattern for connecting the movable electrode to the wiring pattern 7.

  In the present embodiment, as described above, the fixed portion of the mirror 4 with respect to the plate-like member 2 is eccentric in the −X direction, and the fixed electrode 5 and the movable electrode are at the center of the plate-like member 2 in the X-axis direction. Has been placed. In the present embodiment, this causes the fixed electrode 5 and the movable electrode to be deformed by deformation of the plate-like member 2 in accordance with a signal (in this embodiment, a voltage between the fixed electrode 5 and the movable electrode). A driving force that can apply a driving force (electrostatic force in the present embodiment) to the plate-like member 2 so that the possible region is deformed and the inclination of the fixed portion of the mirror 4 with respect to the plate-like member 2 changes. The giving means is configured. But in this invention, you may comprise a driving force provision means so that arbitrary driving forces other than an electrostatic force can be provided. For example, as the driving force applying means, a current path that is arranged in a magnetic field and generates a Lorentz force by energization may be provided in the plate-like member 2, or a piezoelectric element may be provided to use the driving force by the piezoelectric element.

  In the present embodiment, as shown in FIG. 4, a silicon oxide film or the like is formed so as to cover the wiring pattern 7, the fixed electrode 5, and the insulating film 6 in a region on the substrate 1 including a region facing the plate-like member 2. By forming the flattening film 20 made of the above, the region facing the plate-like member 2 in the base is flattened. The planarization film 20 is a film planarized by, for example, CMP, but is not necessarily limited thereto. A gap d is formed between the plate member 2 and a region of the substrate facing the plate member 2.

  Here, the operation of the optical device according to the present embodiment (particularly, the operation of the unit element) will be described with reference to FIG. FIG. 5 is a diagram schematically showing each operation state of the optical device according to the present embodiment, and corresponds to a cross-sectional view that greatly simplifies FIG.

  In FIG. 5A, as in FIG. 4, no voltage is applied between the fixed electrode 5 and the movable electrode (a region of the aluminum film 9 facing the fixed electrode 5) (that is, both have the same potential). ), A state in which no electrostatic force is generated between them. In this state, the plate-like member 2 is not deformed and has a flat shape. For this reason, the mirror 4 is maintained parallel to the substrate 1.

  FIG. 5B shows a state where a not-so-high voltage is applied between the fixed electrode 5 and the movable electrode, and an electrostatic force is generated between them. By this electrostatic force, the vicinity of the center in the X-axis direction of the plate-like member 2 is pulled in the substrate direction (−Z direction). As a result, the plate-like member 2 bends toward the substrate 1 as shown in FIG. Since the fixing part of the mirror 4 with respect to the plate-like member 2 (that is, the part to which the connecting portion 11 is connected) is eccentric in the −X direction from the center of the plate-like member 2, the plate-like member 2 is located at the position of the connecting portion 11. Make an inclined surface. By this action, the mirror 4 is inclined with respect to the substrate 1. The inclination angle can be adjusted by adjusting the voltage applied between the fixed electrode 5 and the movable electrode. In the present embodiment, DC driving in which a DC voltage is applied between both electrodes may be employed, or AC driving in which an AC pulse is applied to both electrodes may be employed. In order to avoid the influence of charge-up or the like, it is preferable to adopt AC driving.

  FIG. 5C shows a state in which a relatively high voltage is applied between the fixed electrode 5 and the movable electrode to generate a relatively large electrostatic force therebetween. In this state, the plate-like member 2 is deformed until it comes into contact with the substrate 1 and is stationary when it comes into contact. Also in this case, the mirror 4 is inclined with respect to the substrate 1 as in the case of FIG. 5B, but the inclination angle is larger than that in the case of FIG.

  Although the unit element of the optical device according to the present embodiment has been described above, the microactuator that drives the mirror 4 is configured by components other than the mirror 4 in the structure of the unit element described above.

  In the optical device according to the present embodiment, as shown in FIG. 6, the above-described unit elements shown in FIGS. 1 to 4 are two-dimensionally arranged on the substrate 1. Thereby, the optical device according to the present embodiment constitutes a spatial light modulator. In FIG. 6, for the sake of simplicity, 4 × 4 unit elements are arrayed, but any number of unit elements may be used. In FIG. 6, one mirror 4 corresponds to one unit element, but for simplicity, illustration of components other than the mirror 4 of each unit element is omitted. Note that the arrangement of unit elements is not limited to the example shown in FIG. 6, and for example, an arrangement such as shifting by half a pitch for each column or each row may be employed. Further, the unit elements may be arranged one-dimensionally. In FIG. 6, the mirror 4 in the second row and the second column is in the state shown in FIG. 5C, and the other mirrors 4 are in the state shown in FIG. In the present embodiment, the state shown in FIG. 5B is used without using the state shown in FIG. 5B. Conversely, the state shown in FIG. 5B is used. It may be.

  In the optical device according to the present embodiment, although not shown in the drawing, driving for determining the voltage state between the electrodes of each unit element so that the state of the mirror 4 of each unit element is in a state corresponding to the control signal. A circuit is adopted. As such a drive circuit, for example, a drive circuit similar to DMD or the like can be adopted. However, an arrayed optical device according to the present embodiment (a device obtained by removing the mirror 4 from each unit element of this optical device). The microactuator array has a circuit configuration shown in FIG. 11 on the chip. This circuit configuration will be described later.

  Here, an example of the manufacturing method of the optical device according to the present embodiment will be described with reference to FIGS. 7 to 9, particularly focusing on the unit element. 7 to 9 are cross-sectional views showing the respective manufacturing steps and correspond to FIG.

  First, a silicon oxide film 6 is formed on the silicon substrate 1. Next, an aluminum film is formed, and the aluminum film is patterned into the shape of the fixed electrode 5 and the wiring pattern 7 by photolithography (FIG. 7A).

  Next, a silicon oxide film 20 to be a planarizing film is formed (FIG. 7B). Subsequently, the silicon oxide film 20 is flattened by CMP to form a flattened film, and in this flattened film 20, a contact hole 20a is formed at a position where the leg 3 is to be formed by photolithography (FIG. 7C). ). The contact hole 20a can also be formed after the later-described sacrificial layer 21 and the silicon nitride film 8 are formed. In this case, the sacrificial layer 21 can be formed with higher flatness.

  Subsequently, a sacrificial layer 21 such as a photoresist is formed by spin coating, and an opening 21a is formed in the sacrificial layer 21 at a position where the leg 3 is to be formed (FIG. 8A).

  Thereafter, a silicon nitride film 8, an aluminum film 9, and a silicon nitride film 10 are sequentially formed, and these films 8 to 10 are patterned into the shape of the plate-like member 2 by a photolithography etching method (FIG. 8B). At this time, the etching step may be performed every time the film is formed, or after all the films have been formed, etching may be sequentially added from the upper layer film, or they may be combined. An opening is formed in the leg portion 3 in the silicon nitride film 8 so that the aluminum film 9 is electrically connected to the wiring pattern 7 in the leg portion 3.

  Next, an opening 10 a is formed by photolithography at a position where the connection portion 11 is to be formed in the silicon nitride film 10. Further, a sacrificial layer 22 such as a photoresist is formed, and an opening 22a is formed in the sacrificial layer 22 at a position where the connection portion 11 is to be formed (FIG. 9A). Since the mirror 4 does not necessarily need to be electrically connected to the aluminum film 9, the opening 10a is not necessarily formed.

  Next, an aluminum film is formed, and this aluminum film is patterned into the shape of the mirror 4 by photolithography (FIG. 9B). Finally, the sacrificial layers 21 and 22 are removed by plasma ashing or the like. Thereby, the optical device according to the present embodiment is completed.

  In the present embodiment, as described above, as shown in FIG. 4, by forming the planarizing film 20, the region facing the plate-like member 2 in the base is flattened, and the plate-like member 2 in the base is A gap d is formed between the opposite region and the plate-like member 2. The gap d is preferably 0.3 μm or less, for example, about 0.25 μm, in order to shorten the stabilization time described later.

  As shown in FIG. 4, the fixed electrode 5 and the wiring pattern 7 are partially formed in the region below the plate-like member 2, but the uneven shape due to this is not transferred to the plate-like member 2. It is necessary to do so. This is because if the uneven shape is transferred to the plate-like member 2, the above-described bending operation of the plate-like member 2 is hindered. In the present embodiment, in order to prevent the uneven shape from being transferred to the plate-like member 2, the flattened film 20 flattened by CMP is formed as described above, and the region facing the plate-like member 2 in the substrate is formed. Is flattened.

  On the other hand, in order to prevent the uneven shape from being transferred to the plate-like member 2, the flattening film 20 is not formed, and the region facing the plate-like member 2 is not flattened in FIG. The sacrificial layer 21 made of a photoresist may be spin-coated directly on the substrate in the state shown in a), and the sacrificial layer 21 may be made sufficiently thick. If the sacrificial layer 21 is made sufficiently thick, the upper surface of the sacrificial layer 21 can be flattened, and the uneven shape transfer to the plate-like member 2 can be prevented. However, in this case, in order to sufficiently planarize the upper surface of the sacrificial layer 21, the sacrificial layer 21 needs to be sufficiently thick. The gaps in the figure are considerably widened and cannot be made 0.3 μm or less.

  If the gap between the region facing the plate-like member 2 and the plate-like member 2 in the base is wide, the driving speed will be adversely affected. The reason is described below. The microactuator used in the present embodiment generally has a large Q value when miniaturized, and therefore once the plate-like member 2 or the like vibrates, there is a tendency that it does not readily settle. And if the space | gap between the opposing area | region with the plate-shaped member 2 in a base | substrate and the plate-shaped member 2 is narrow enough, the squeezed film damping effect will appear notably, the vibration at the time of a drive will attenuate | damp, and it will become static. However, if the gap is wide, the squeezed film damping effect is reduced, the stabilization time is lengthened, and the driving speed is adversely affected.

  Therefore, increasing the thickness of the sacrificial layer 21 without forming the planarizing film 20 to prevent the uneven shape from being transferred to the plate-like member 2 has an adverse effect on driving speed.

  On the other hand, in the present embodiment, since the planarizing film 20 is formed and the region facing the plate-like member 2 in the substrate is flattened, the uneven shape is plate-like even if the sacrificial layer 21 is thinned. It is not transferred to the member 2. Therefore, the thickness of the sacrificial layer 21 can be made as thin as 0.3 μm or less, and thereby, the squeezed film damping effect appears remarkably, the settling time is shortened, and the driving speed is increased. Can do. The squeezed film damping effect in this case occurs when the plate-like member 2 receives air resistance from the surrounding air (gas) during driving, and this air resistance is effectively reduced by narrowing the gap d. growing.

  The inventor manufactured an optical device similar to that of the present embodiment with the gap d being 0.25 μm. The experimental results of the drive characteristics of the optical device are shown in FIG. In the experiment, as shown in FIG. 10, a square-wave drive voltage in which positive and negative are reversed every cycle is applied between the fixed electrode 5 and the movable electrode, a laser beam is applied to the mirror 4, and the reflected light is reflected. The intensity was measured with a photodiode. The intensity of the reflected light was measured at two locations where the output was maximum when the angle of the mirror 4 (an angle based on an angle parallel to the substrate 1) was 0 deg and 1.8 deg. FIG. 10 shows that in this experiment, switching between the two angles of the mirror 4 can be performed in a very short time of 3 μsec or less including the stabilization time.

  FIG. 11 is an electric circuit diagram showing a circuit configuration on the chip of the optical device according to the present embodiment. A single unit element (and hence a single microactuator) shown in FIGS. 1 to 4 has one capacitor (a fixed electrode 5 and the movable electrode (the fixed electrode 5 of the aluminum film 9) in terms of electric circuit. This is equivalent to the capacitor formed by In FIG. 11, the capacitors of the unit elements in the m-th row and the n-th column are denoted as Cmn. For example, the capacitor of the unit element in the upper left (first row, first column) in FIG. 11 is denoted as C11. In the present embodiment, the left electrode in FIG. 11 of each capacitor is a fixed electrode 5 and the right electrode in FIG. 11 is a movable electrode.

  In FIG. 11, nine unit elements are arranged in 3 rows and 3 columns in order to simplify the description. However, the number of unit elements is not limited at all, and the principle is the same for other numbers. Further, even if the number of unit elements is the same, it is not necessary to make the number of rows and columns the same, and it is not necessary to make a matrix arrangement.

  As shown in FIG. 11, the optical device according to the present embodiment includes a first plurality of terminal groups composed of a plurality of terminals CD1 to CD3 and a second terminal group composed of a plurality of terminals CU1 to CU3. Is provided. These terminals CD1 to CD3 and CU1 to CU3 are terminals for external connection. In the present embodiment, the electrical connection shown in FIG. 11 is realized by the wiring pattern 7 under the leg 3 and the wiring pattern of the fixed electrode 5 described above. The terminals CD1 to CD3 and CU1 to CU3 can be configured, for example, by using part of these wiring patterns as electrode pads.

  Further, in FIG. 11, the number of terminals CD1 to CD3 of the first terminal group is three as the number of rows of unit elements, and the number of terminals CU1 to CU3 of the second terminal group is the number of columns of unit elements. There are also three. However, the number of first and second terminal groups is not necessarily the same as the number of rows and columns of unit elements, and for example, the following conditions (a) to (e) may be satisfied. That is, (a) for each microactuator, the fixed electrode 5 of the microactuator is electrically connected to one terminal of one of the first and second terminal groups and the (B) For each microactuator, the movable electrode of the microactuator is the other of the first and second terminal groups, and is not electrically connected to the other terminals of the first and second terminal groups. Electrically connected to any one terminal of the terminal group and not electrically connected to other terminals of the first and second terminal groups; (c) for each microactuator, the microactuator of the microactuator; Electrically connected to one terminal of the first or second terminal group electrically connected to the fixed electrode 5 and the movable electrode of the microactuator The combination of the first or second terminal group and one terminal is unique to the microactuator, and (d) at least one terminal of the first terminal group is the optical device. And (e) at least one of the second terminal groups is electrically connected in common to the fixed electrode 5 or the movable electrode of two or more microactuators of the plurality of microactuators mounted on It is possible to satisfy each condition that one terminal is electrically connected in common to the fixed electrode 5 or the movable electrode of two or more microactuators of the plurality of microactuators mounted on the optical device. That's fine.

  As an example satisfying the conditions (a) to (e), in the example shown in FIG. 11, the fixed electrode 5 of the capacitors C11, C12, C13 in the first row is electrically connected to the terminal CD1 of the first terminal group. Connected to each other and not electrically connected to other terminals. The fixed electrodes 5 of the capacitors C21, C22, C23 in the second row are electrically connected in common to the terminal CD2 of the first terminal group, and are not electrically connected to the other terminals. The fixed electrodes 5 of the capacitors C31, C32, and C33 in the third row are electrically connected in common to the terminal CD3 of the first terminal group, and are not electrically connected to the other terminals. The movable electrodes of the capacitors C11, C21, C31 in the first column are electrically connected in common to the terminal CU1 of the second terminal group, and are not electrically connected to the other terminals. The movable electrodes of the capacitors C12, C22, C32 in the second row are electrically connected in common to the terminal CU2 of the second terminal group, and are not electrically connected to the other terminals. The movable electrodes of the capacitors C13, C23, and C33 in the third row are electrically connected in common to the terminal CU3 of the second terminal group, and are not electrically connected to the other terminals.

  In the present embodiment, an external control circuit (not shown) is connected to the terminals CD1 to CD3 and CU1 to CU3, and the potentials of these terminals are controlled independently to switch the state of each unit element (for example, , Switching between the state shown in FIG. 5A and the state shown in FIG. The external control circuit supplies a control signal for realizing a switching state indicated by the command signal in response to the command signal as a potential to be applied to the terminals CD1 to CD3 and CU1 to CU3.

  FIG. 12 shows an example of a timing chart of potentials applied to the terminals CD1 to CD3 and CU1 to CU3 by the external control circuit. In the example shown in FIG. 12, the external control circuit applies any one of potentials ± Vh, ± Vm, 0 to the terminals CD1 to CD3 and CU1 to CU3. In the example shown in FIG. 12, AC driving is adopted. Here, Vh and Vm are positive values with reference to 0, and Vh> Vm. However, it goes without saying that the absolute value of each potential may be determined on the basis of any potential level as long as the relative relationship between them is not changed.

  In the example shown in FIG. 12, all actuators are in the released state (the state shown in FIG. 5A) before time t1. At time t1, all nine actuators are in a clamped state (the state shown in FIG. 5C). Vh is set so that 2 × Vh becomes higher at a voltage higher than the clamp voltage Vc of the actuator (minimum voltage from the released state to the clamped state). Vm is set so that Vm is higher than the release voltage Vr (maximum voltage from the clamped state to the released state; Vr <Vc) in FIG. 11 and 2 × Vm is lower than the clamped voltage Vc. Thereafter, from time t1 to time t8, a method is shown in which all actuators are once clamped and any actuator is released therefrom. A case where an actuator that is in a specific released state is clamped and another actuator is released from the time when some of the actuators are in the released state is shown after time t9. The operation example shown in FIG. 12 is the same as the operation example disclosed in FIG. 16 of JP-A-2004-184564 (thus, FIG. 13 of the publication).

  In the optical device according to the present embodiment, the circuit configuration shown in FIG. 11 described above is adopted as the circuit configuration on the chip, and therefore, on the chip as in the technique disclosed in Japanese Patent Application Laid-Open No. 2004-184564. It is possible to reduce the number of terminals for external connection (that is, the number of wires drawn to the outside) without mounting an address circuit or the like.

  According to the present embodiment, since the plate-like member 2 is a doubly-supported beam, as in the device disclosed in Patent Document 2 described above, damage is less likely to occur than when a torsion hinge is used. The lifetime can be increased, the natural frequency can be increased, and the response speed can be increased.

  And according to this Embodiment, unlike the device disclosed by patent document 2 mentioned above, the mirror 4 is not integrated with the plate-shaped member 2 entirely, but via the connection part 11, The plate-like member 2 is locally mechanically connected to a part of the region where the plate-like member 2 can be deformed. Therefore, as shown in FIG. 5 described above, only the orientation of the mirror 4 can be changed without deforming the mirror 4 itself.

  Furthermore, according to the present embodiment, as described above, since the flattening film 20 is formed and the region facing the plate-like member 2 on the base is flattened, the plate-like member 2 on the base and The gap d between the opposing region and the plate-like member 2 can be narrowed. Therefore, according to the present embodiment, the above-described squeezed film damping effect can be enhanced, so that the settling time can be shortened and the driving speed can be further increased.

  In the present invention, it is not always necessary to arrange a plurality of the above-described unit elements on the substrate 1, and only one unit element described above may be arranged on the substrate 1.

  [Second Embodiment]

  FIG. 13 is a schematic configuration diagram showing a projection display device (projection display device) according to the second embodiment of the present invention.

  The projection display device according to the present invention includes a light source 31, an illumination optical system 32, a spatial light modulator 33, a light absorption plate 34, a projection optical system 35, a screen 36, and a control unit 37. In the present embodiment, the optical device according to the first embodiment described above is used as the spatial light modulator 33.

  The illumination light emitted from the light source 31 passes through the illumination optical system 32 and is then applied to the spatial light modulator 33. Each unit element of the spatial light modulator 33 has its mirror 4 at the first angle (state shown in FIG. 5 (a)) or the second angle (state shown in FIG. 5 (b) or FIG. 5 (c)). Suppose you have At the first angle, the incident light is reflected in the first direction, reaches the light absorption plate 34, and the light disappears. At the second angle, incident light is reflected in the second direction, passes through the projection optical system 35, and is then projected onto the screen 36. The control unit 37 controls the spatial light modulator 33 by sending a control signal to the spatial light modulator 33 according to the image signal, and changes the angle of the mirror 4 of each unit element according to the image signal. With this control, a still image or a moving image indicated by the input image signal can be formed on the screen 36.

  Although this embodiment is an example of a so-called black and white display device, colorization can also be achieved by diverting the prior art. Although not shown, for example, a color wheel is installed in the illumination optical system 32 or between the illumination optical system 32 and the spatial light modulator 33, or the light source 31 is made up of red, blue, and green. It is assumed that the color can be controlled in time division, and colorization can be achieved by synchronizing with the spatial light modulator 33.

  The projection display device using the optical device according to the present invention is not limited to the type of display device as in the present embodiment, and can be used for various types of projection display devices. As a configuration example of the projection image display device, various types using a liquid crystal panel, DMD, or the like as a spatial light modulator have been proposed. Regarding the optical system used in the projection image display apparatus using DMD, the spatial light modulator by the optical device of the present invention is a mirror device that changes the mirror angle similar to that of DMD, and therefore basically the same one is used. Can be used. Projection image display devices using a liquid crystal panel use polarized light in principle, and there are transmission types as well as reflection types. For this reason, when these optical systems are adapted to the spatial light modulator by the optical device according to the present invention, it is sufficient to change those points.

  Note that the application using the spatial light modulator includes not only a video application such as a projection image display device and an exposure device described later, but also the optical information processing device and the electrophotographic printing device described above, and optical communication. There are various uses such as an optical switch used in the field, a Switched Blazed Grating Device, and a plate setter used in the printing field. The present invention is also applicable to these.

  [Third Embodiment]

  FIG. 14 is a schematic block diagram showing an exposure apparatus 100 according to the third embodiment of the present invention.

  The exposure apparatus 100 according to the present embodiment includes an illumination system 41, a pattern generation device 42, a projection optical system PL, a stage device 43, a reflection mirror 44, a control system, and the like. The exposure apparatus 100 forms a pattern image (pattern image) generated by the pattern generation apparatus 42 on the wafer W placed on the stage ST constituting a part of the stage apparatus 43 using the projection optical system PL. To do. The control system includes a microcomputer, and is configured around a main control device 45 that controls the entire device.

  The illumination system 41 includes a light source system including a light source unit and a light source control system, and illumination optics including a collimating lens, an optical integrator (such as a fly-eye lens, a rod-type integrator, or a diffraction element), a condenser lens, a field stop, a relay lens, and the like. System and the like (both not shown). From this illumination system 41, illumination light IL is emitted.

  As the light source unit, for example, as disclosed in International Publication No. 1999/46835 pamphlet (corresponding US Pat. No. 7,023,610), solid laser light source such as DFB semiconductor laser or fiber laser, fiber amplifier, etc. A harmonic generator that outputs pulsed light having a wavelength of 193 nm is used. Note that the light source unit may be, for example, a laser diode that generates continuous light or pulsed light having a wavelength of 440 nm.

  The reflection mirror 44 reflects the illumination light IL emitted from the illumination system 41 toward a variable shaping mask VM described later of the pattern generation device 42. The reflection mirror 44 actually constitutes a part of the illumination optical system inside the illumination system 41, but here, it is taken out from the illumination system 41 for convenience of explanation. .

  The pattern generation device 42 includes a variable shaping mask VM, a mirror drive system 51, and the like. The variable shaping mask VM is disposed on the −Z side of the projection optical system PL and on the optical path of the illumination light IL reflected by the reflection mirror 44. In the present embodiment, the optical device according to the first embodiment described above is used as the variable shaping mask VM. In the present embodiment, in the state shown in FIG. 5A, when the illumination light IL is irradiated onto the mirror 4 of the unit element, the illumination light IL is reflected by the mirror 4 and applied to the projection optical system PL. In the state shown in FIG. 5C (or the state shown in FIG. 5B), when the illumination light IL is applied to the mirror 4 of the unit element, the mirror 4 of the unit element The reflected illumination light does not enter the projection optical system PL. The mirror drive system 51 drives the variable shaping mask VM under the instruction of the main controller 45, and includes a circuit corresponding to the external control circuit described in the first embodiment.

  The mirror drive system 51 acquires pattern design data (for example, CAD data) among data necessary for forming a pattern image from a host device (not shown) via an interface (not shown). Based on the acquired design data, the mirror drive system 51 irradiates the light from the variable shaping mask VM onto the partition area portion to be exposed on the wafer W via the projection optical system PL, thereby exposing the wafer W. A signal for driving each unit element is generated and supplied to the variable molding mask VM so that the light from the variable molding mask VM is not irradiated to the portion other than the target partition region portion. As a result, the pattern generator 42 generates a pattern according to the design data. Note that the pattern generated by the pattern generation device 42 changes as the wafer W moves in the scanning direction (here, the X-axis direction).

  Projection optical system PL has a plurality of optical elements arranged in a predetermined positional relationship inside the lens barrel. The projection optical system PL projects the pattern generated by the pattern generation device 42 at a projection magnification β on the wafer W arranged on the surface to be exposed.

  The stage device 43 is for moving the wafer W to be exposed in the XY plane while being aligned with the projection optical system PL. The stage device 43 and a stage drive system 52 that controls the drive of the stage ST. And.

  The stage ST is driven by the stage drive system 52 and moves three-dimensionally in the XY plane and in the Z-axis direction, or through the projection optical system PL by being appropriately tilted with respect to the image plane of the projection optical system PL. The wafer W can be aligned with the pattern image. Further, the stage ST is driven by the stage drive system 52 and can be moved at a desired speed in the scanning direction.

  The main control device 45 operates the illumination system 41, the pattern generation device 42, the stage device 43, etc. at appropriate timings to project the pattern image generated by the pattern generation device 42 at an appropriate location on the wafer W. Project through. At this time, the main controller 45 causes the mirror drive system 51 to control the variable shaping mask VM in synchronization with the movement of the wafer W by the stage device 43.

  In the device manufacturing method according to the embodiment of the present invention, the semiconductor device includes a step of performing function / performance design of the device, a step of forming a wafer from a silicon material, and the variable forming mask VM by the exposure apparatus 100 of the above embodiment. The wafer is manufactured through a lithography process including a process of exposing the wafer W via a process, a process of forming a circuit pattern such as etching, a device assembly process (including a dicing process, a bonding process, and a package process), an inspection process, and the like. The present invention can be applied not only to an exposure apparatus for manufacturing a semiconductor device but also to an exposure apparatus for manufacturing various other devices.

  [Fourth Embodiment]

  FIG. 15 is a schematic plan view schematically showing the plate-like member 2 of the unit element of the optical device according to the fourth embodiment of the present invention, and corresponds to FIG. 15, elements that are the same as or correspond to those in FIG. 3 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The optical device according to the present embodiment is different from the optical device according to the first embodiment in that, in the first embodiment, the plate-like member 2 is a substrate through the legs 3 only in the vicinity of the two sides. In the present embodiment, the plate member 2 is only fixed to the substrate 1 via the legs 3 in the vicinity of the four sides. Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

  [Fifth Embodiment]

  FIG. 16 is a schematic cross-sectional view schematically showing a unit element of an optical device according to the fifth embodiment of the present invention, and corresponds to FIG. 16, elements that are the same as or correspond to the elements in FIG. 4 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The optical device according to the present embodiment is different from the optical device according to the first embodiment in that the connection portion 11 is arranged at the center of the mirror 4 and the connection portion 11 is at the center of the plate-like member 2. Instead of the fixed point and one fixed electrode 5 formed on the substrate 1 near the center of the plate-like member 2 in the X-axis direction, the X-axis is placed on the −X side and the + X side of the plate-like member 2. The point that two fixed electrodes 5a and 5b are formed on the substrate 1 at symmetrical positions with respect to the direction, and one aluminum film 9 that is continuous as a whole is composed of two aluminum films 9a on the −X side and + X side. It is only a point separated into 9b.

  In the present embodiment, similarly to the first embodiment, in the region on the substrate 1 including the region facing the plate-like member 2, the wiring pattern 7, the fixed electrodes 5a and 5b, and the insulating film 6 are used. A planarizing film 20 made of a silicon oxide film or the like is formed so as to cover the substrate, so that the region facing the plate-like member 2 on the substrate is planarized.

  In the present embodiment, the region 9a 'of the aluminum film 9a that faces the fixed electrode 5a is a movable electrode that can generate an electrostatic force between the fixed electrode 5a and the region 9a'. In addition, the region 9b 'of the aluminum film 9b facing the fixed electrode 5b is a movable electrode that can generate an electrostatic force with the fixed electrode 5b due to the voltage between the fixed electrode 5b.

  FIGS. 17 and 18 are diagrams schematically showing each operation state of the optical device according to the present embodiment, and correspond to a cross-sectional view that greatly simplifies FIG.

  FIG. 17A shows a state where no voltage is applied between the electrodes 5a and 9a 'and between the electrodes 5b and 9b' and no electrostatic force is generated between them, as in FIG. In this state, the plate-like member 2 is not deformed and has a flat shape. For this reason, the mirror 4 is maintained parallel to the substrate 1.

  FIG. 17B shows that a relatively high voltage is applied between the electrodes 5a and 9a ′ to generate a relatively large electrostatic force between them, while no voltage is applied between the electrodes 5b and 9b ′. A state where no electrostatic force is generated is shown. In this state, the plate-like member 2 is in contact with the vicinity of the electrode 5a in the vicinity of the electrode 9a ', but the distance between the electrodes 5b and 9b' is relatively large. In this state, the mirror 4 is relatively large and tilted to the left in the drawing.

  In FIG. 17C, a relatively high voltage is applied between the electrodes 5b and 9b 'to generate a relatively large electrostatic force between them, while no voltage is applied between the electrodes 5a and 9a'. A state where no electrostatic force is generated is shown. In this state, the plate-like member 2 is in contact with the vicinity of the electrode 5b in the vicinity of the electrode 9b ', but the distance between the electrodes 5a and 9a' is relatively large. In this state, the mirror 4 is relatively large and tilted to the right side in the figure.

  In FIG. 18A, a not so high voltage is applied between the electrodes 5b and 9b ′ to generate an electrostatic force between them, while no voltage is applied between the electrodes 5a and 9a ′. The state which does not generate an electrostatic force is shown. In this state, the plate-like member 2 approaches the electrode 5b in the vicinity of the electrode 9b ', but the distance between the electrodes 5a and 9a' is relatively large. In this state, the mirror 4 is not so large and is inclined to the right side in the figure. The inclination angle can be adjusted by adjusting the voltage applied between the electrodes 5b and 9b '.

  Although not shown in the drawing, contrary to the case of FIG. 18 (a), a not so high voltage is applied between the electrodes 5a and 9a ′ to generate an electrostatic force between them, while the electrodes 5b and 9b. If no voltage is applied between them and no electrostatic force is generated between them, the plate-like member 2 approaches the electrode 5a near the electrode 9a ', but the distance between the electrodes 5b and 9b' is relatively large. Become. In this state, the mirror 4 is not so large and tilts to the left in the figure. The inclination angle can be adjusted by adjusting the voltage applied between the electrodes 5a and 9a '.

  FIG. 18B shows a state in which a relatively high voltage is applied between the electrodes 5a and 9a 'and between the electrodes 5b and 9b' to generate a relatively large electrostatic force therebetween. In this state, the plate-like member 2 is in contact with the vicinity of the electrode 5a in the vicinity of the electrode 9a 'and is in contact with the vicinity of the electrode 5b in the vicinity of the electrode 9b'. In this state, the mirror 4 is positioned at the lowest position while maintaining parallel to the substrate 1.

  FIG. 18C shows a state in which a not so high voltage is applied between the electrodes 5a and 9a 'and between the electrodes 5b and 9b' to generate a not so large electrostatic force therebetween. In this state, the plate-like member 2 approaches the vicinity of the electrode 5a in the vicinity of the electrode 9a 'and approaches the vicinity of the electrode 5b in the vicinity of the electrode 9b'. In this state, the mirror 4 is located at an intermediate height position while maintaining parallel to the substrate 1. The height can be adjusted by adjusting the voltage applied between the electrodes 5a and 9a 'and between the electrodes 5b and 9b'.

  Thus, according to the present embodiment, as shown in FIGS. 17A to 17C and FIG. 18A, not only can the inclination of the mirror 4 be changed, but also FIG. 18B and 18C, the height can be changed while the mirror 4 is kept parallel to the substrate 1. FIG.

  Therefore, according to the present embodiment, not only the direction of the reflected light can be changed, but also the optical distance of the reflected light is changed by changing the height position without tilting the mirror 4 to shift the phase of the reflected light. And can be used as a phase modulator. Therefore, if the optical device according to the present embodiment is used as the variable shaping mask VM in the exposure apparatus as in the third embodiment, it can also function as a phase shift mask.

  Except for this, the present embodiment can provide the same advantages as those of the first embodiment.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

It is a schematic perspective view which shows typically the unit element of the optical device by the 1st Embodiment of this invention. FIG. 2 is a schematic plan view schematically showing the unit element shown in FIG. 1. It is a schematic plan view which shows typically the plate-shaped member of the unit element shown in FIG. FIG. 3 is a schematic cross-sectional view along the line A-A ′ in FIG. 2. It is a figure which shows typically each operation state of the optical device by the 1st Embodiment of this invention. It is a figure which shows the example of arrangement | positioning of the unit pixel in the optical device by the 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the optical device by the 1st Embodiment of this invention. FIG. 8 is a process diagram illustrating a process following the process in FIG. 7. FIG. 9 is a process diagram illustrating a process following the process in FIG. 8. It is a figure which shows the experimental result of the drive characteristic of the produced optical device. It is an electric circuit diagram which shows the circuit structure on the chip | tip of the optical device by 1st Embodiment. 3 is a timing chart of potentials applied to respective terminals of the optical device according to the first embodiment of the present invention. It is a schematic block diagram which shows the projection display apparatus (projection type display apparatus) by the 2nd Embodiment of this invention. It is a schematic block diagram which shows the exposure apparatus by the 3rd Embodiment of this invention. It is a schematic plan view which shows typically the plate-shaped member 2 of the unit element of the optical device by the 4th Embodiment of this invention. It is a schematic sectional drawing which shows typically the unit element of the optical device by the 5th Embodiment of this invention. It is a figure which shows typically each operation state of the optical device by the 5th Embodiment of this invention. It is a figure which shows typically each other operation state of the optical device by the 5th Embodiment of this invention.

Explanation of symbols

1 Substrate 2 Plate Member 4 Mirror 5 Fixed Electrode 20 Flattening Film

Claims (17)

A base, a plate-like member supported by the base, and a driving force applying means;
The plate-like member is fixed to the base at a predetermined location over the entire circumference or a part of the periphery of the plate-like member, and can be bent and deformed in a region other than the predetermined location in the plate-like member. Yes,
The predetermined location includes two locations facing each other in the peripheral portion of the plate-shaped member,
A driven body is locally mechanically connected to a predetermined portion of the plate-shaped member in a deformable region;
In response to the signal, the driving force applying means is configured so that the region of the plate-like member that can be bent and deformed is bent and the inclination of the predetermined portion of the plate-like member is changed. A driving force can be imparted to at least a part thereof,
The opposing area | region with the said plate-shaped member in the said base | substrate is planarized,
The driving force applying means may be configured such that the one or more first electrode portions provided on the base and the one or more first electrode portions provided on the plate-like member by a voltage between them. Including one or more second electrode parts capable of generating an electrostatic force between the first electrode part and the first electrode part,
A microactuator characterized by that.   2. The microactuator according to claim 1, wherein the one or more first electrode portions are opposed to a part of the plate-shaped member and are not opposed to a remaining portion of the plate-shaped member.   3. The microactuator according to claim 1, wherein the base has a flattening film flattened by CMP in the facing region.   The microactuator according to any one of claims 1 to 3, wherein a gap between the plate-like member and the facing region of the substrate is 0.3 µm or less in a state where the driving force is not applied. .   5. The microactuator according to claim 1, wherein the driven body has a main plane, and the main plane of the plate-like member and the main plane of the driven body are substantially parallel. .   The microactuator according to any one of claims 1 to 5, wherein the predetermined part of the plate-like member is a part eccentric from the center of gravity of the plate-like member. A base, a plate-like member supported by the base, and a driving force applying means;
The plate-like member is fixed to the base at a predetermined location over the entire circumference or a part of the periphery of the plate-like member, and can be bent and deformed in a region other than the predetermined location in the plate-like member. Yes,
The predetermined location includes two locations facing each other in the peripheral portion of the plate-shaped member,
A driven body is locally mechanically connected to a predetermined portion of the plate-shaped member in a deformable region;
In response to the signal, the driving force applying means is configured so that the region of the plate-like member that can be bent and deformed is bent and the inclination of the predetermined portion of the plate-like member is changed. A driving force can be imparted to at least a part thereof,
The opposing area | region with the said plate-shaped member in the said base | substrate is planarized,
The predetermined part of the plate-like member is a part eccentric from the center of gravity of the plate-like member.
A microactuator characterized by that. A microactuator array comprising a plurality of microactuators, a first terminal group consisting of a plurality of terminals, and a second terminal group consisting of a plurality of terminals,
Each of the microactuators is a microactuator according to any one of claims 1 to 6,
For each of the microactuators, the first electrode portion of the microactuator is electrically connected to one terminal of one of the first and second terminal groups and the first Not electrically connected to the other terminals of the first and second terminal groups,
For each of the microactuators, the second electrode portion of the microactuator is electrically connected to one terminal of the other terminal group of the first and second terminal groups and the first Not electrically connected to the other terminals of the first and second terminal groups,
Regarding each microactuator, one terminal of the first or second terminal group electrically connected to the first electrode portion of the microactuator and the second electrode portion of the microactuator are electrically connected. The combination with one terminal of the connected first or second terminal group is specific to the microactuator,
At least one terminal of the first terminal group is electrically connected in common to the first or second electrode portion of two or more microactuators of the plurality of microactuators;
At least one terminal of the second terminal group is electrically connected in common to the first or second electrode portion of two or more microactuators of the plurality of microactuators;
A microactuator array characterized by that.   An optical device comprising the microactuator according to claim 1 and the driven body, wherein the driven body is an optical element.   The optical device according to claim 9, wherein the optical element is a mirror.   The optical device according to claim 9 or 10, comprising a plurality of sets of the microactuator and the optical element.   A display device comprising a spatial light modulator, wherein the spatial light modulator is the optical device according to claim 11. An exposure apparatus that exposes an object using illumination light,
The optical device according to claim 11 disposed on an optical path of the illumination light,
An exposure apparatus that exposes the object using the illumination light that passes through the optical device.   The exposure apparatus according to claim 13, wherein the optical device generates a predetermined pattern by irradiation with the illumination light. A moving body that holds and moves the object;
The exposure apparatus according to claim 13 or 14, wherein the driving force applying means of each microactuator of the optical device is controlled in synchronization with the movement of the movable body in a predetermined direction. A device manufacturing method including a lithography process,
16. A device manufacturing method comprising performing exposure using the exposure apparatus according to claim 13 in the lithography process. A substrate configured to include a substrate, an insulating film, a fixed electrode, and a wiring pattern;
A microactuator manufacturing method comprising a plate-like member supported by the base body and capable of being bent and deformed by the fixed electrode,
Depositing the insulating film on the substrate;
Forming the fixed electrode and the wiring pattern on the insulating film so that the fixed electrode faces a part of the plate-shaped member and does not face the remaining portion of the plate-shaped member;
Forming a film to be a planarizing film on the insulating film and on the fixed electrode and the wiring pattern in a region facing the plate-like member;
Flattening the film to be the flattened film into a flattened film;
Forming a sacrificial layer on the planarizing film;
Forming the plate-like member on the sacrificial layer;
Only including,
The microactuator is the microactuator according to any one of claims 1 to 7.
A manufacturing method of a microactuator characterized by the above.

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