JP5269303B2 - Socket for electrical parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for electrical component preventing damages of a mold guide. <P>SOLUTION: A fixed contact piece which makes a pair with a movable contact piece is formed on a contact pin installed on a socket body 13. A fixed side contact part 15d to contact the lower face side of an IC lead of an IC package is formed on the fixed contact piece, while a plurality of slits 13j penetrating in vertical direction are formed at prescribed intervals at the mold guide 13h. A movable side contact part 15g is inserted in each slit 13j and the upper end part of the movable side contact part 15g is brought to the upper part. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention is improved to prevent damage to an electrical component socket for detachably holding an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), in particular, a mold guide for guiding the electrical component. The present invention relates to a socket for electrical parts.

  Conventionally, as this type of “electrical component socket”, there is an IC socket that detachably holds an IC package that is an “electrical component” (see FIG. 8).

  This IC package 6 is a so-called gull wing type, and a plurality of IC leads 6a which are “terminals” project in a crank shape from two opposite sides of a substantially rectangular parallelepiped package body 6b. ing.

  On the other hand, in the IC socket, a housing portion 1 a for housing the IC package 6 is formed in the socket body 1, and a plurality of contact pins 2 that are in contact with the IC leads 6 a of the IC package 6 are disposed. The contact pin 2 has a movable contact piece 3, which is formed with a movable contact portion 3a that is separated from and in contact with the upper surface of the IC lead 6a. The socket body 1 has an IC lead 6a. A mold guide 1b for supporting the lower surface of the IC package 6 and guiding the periphery of the IC package 6 is formed.

  An operation member 4 is disposed in the socket body 1 so as to be movable up and down, and the operation member 4 is lowered against the urging force of the movable contact piece 3 of the contact pin 2 to thereby move the operation member 4. 4, the operation piece 3b of the movable contact piece 3 of the contact pin 2 is pressed outward.

  As a result, the spring portion 3c of the movable contact piece 3 of the contact pin 2 is elastically deformed to separate the movable contact portion 3a from the IC lead 6a, and the operating member 4 is lifted, whereby the spring portion 3c. The movable contact portion 3a is restored by the elastic force and contacts the upper surface of the IC lead 6a. The IC lead 6a is sandwiched between the movable contact portion 3a and the mold guide 1b, and the contact pin 2 and the IC lead 6a. Are electrically connected to each other.

  When the IC package 6 is not accommodated on the socket body 1 (non-accommodated state), the movable contact portion 3a comes into contact with the mold guide 1b. The mold guide 1b is formed to be relatively narrow so that it can be inserted between the vertical portion of the crank-shaped IC lead 6a and the package body 6b.

As this kind of thing, there exists a thing as described in patent document 1. FIG.
Japanese Patent Laid-Open No. 11-26127.

  However, in such a conventional device, when the IC package 6 is not accommodated, the tip of the movable contact portion 3a is formed on the mold guide 1b of the socket body 1, so that the structure is formed. When the metal movable contact portion 3a comes into contact with the synthetic resin mold guide 1b, the mold guide 1b may be damaged.

  Therefore, an object of the present invention is to provide a socket for an electrical component that prevents damage to the mold guide and achieves good electrical continuity between the contact pin and the IC lead of the electrical component.

In order to achieve this object, the invention according to claim 1 includes a socket body in which an electrical component having a terminal extending laterally is accommodated, and a contact pin attached to the socket body, the contact pin Is formed with a movable contact piece that is elastically deformed, and a movable side contact portion that is in contact with and separated from the upper surface of the terminal of the electrical component is formed at the tip of the movable contact piece, and the electrical component body of the electrical component A socket for an electrical component in which a mold guide protruding in a substantially mountain shape that contacts and guides the periphery of the socket is formed on the socket body, and the contact pin is a fixed contact piece paired with the movable contact piece The fixed contact piece is formed with a fixed-side contact portion that contacts the lower surface side of the electrical component terminal, while the mold guide has a plurality of slits penetrating in the vertical direction between the predetermined intervals. Formed in Rutotomoni is inserted hole in the socket body below the respective slits formed in the insertion hole and the respective slit, the fixed contact part is inserted from below, the upper end of the fixed contact part The fixed side contact portion is disposed at a position corresponding to the movable side contact portion in a non-accommodating state of the electrical component, the portion facing the upper portion and projecting upward from the upper end portion of the mold guide. The terminal projecting laterally from the electric component body is formed in a crank shape, and the terminal is formed so that the vicinity side of the electric component body is one step higher than the tip end side, and the shoulder portion formed one step higher The movable-side contact portion is in contact with the upper surface of the shoulder, and the fixed-side contact portion is in contact with the lower surface of the shoulder portion, and the fixed-side contact portion inserted through the slit is substantially mountain-shaped Mold guide and Characterized in that the socket for electrical parts that exhibit the same mountain shape.

According to the first aspect of the present invention, when the electrical component is accommodated, the electrical component can be accommodated at a predetermined position by the mold guide of the socket body.

In addition, a plurality of slits are formed in the mold guide, and the fixed side contact portions are inserted and disposed in the respective slits. Can be arranged. Furthermore , since the stationary side contact portion is arranged at a position corresponding to the movable side contact portion in the non-accommodating state of the electrical parts, unlike the conventional case, the movable side contact portion does not hit the mold guide, and is made of a synthetic resin. The mold guide can be prevented from being damaged, and even if the movable side contact portion comes into contact with the fixed side contact portion, both are made of the same type of metal, so that both of the damages can be suppressed.

  Moreover, by inserting the fixed-side contact portion into the slit of the mold guide, the fixed-side contact portion can be guided by this mold guide, and the fixed-side contact portion can be prevented from falling.

  Furthermore, since the fixed contact portion of the contact pin is disposed at the portion where the mold guide is disposed, it can be brought into contact with the terminal of the electrical component at two points of the movable contact portion and the fixed contact portion. Can be improved.

  Embodiments of the present invention will be described below.

  1 to 7 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 12 that is an “electrical component”. The IC lead 12b as the “terminal” 12 is electrically connected to the wiring board (not shown) of the measuring instrument (tester).

  As shown in FIG. 7, the IC package 12 is a so-called gull wing type, and includes a large number of IC leads from four sides to a side of a rectangular package body 12 a as an “electric component body”. 12b protrudes. The IC lead 12b is formed in a crank shape, and a shoulder portion 12d is formed on the vicinity of the package body 12a so as to be one step higher than the tip portion 12c side.

  On the other hand, the IC socket 11 generally includes a socket body 13 mounted on the wiring board. The socket body 13 is formed with a housing portion 13a for housing the IC package 12, and the IC package 12 A guide portion 13b is provided corresponding to each corner of the package body 12a. Further, between the guide portions 13b, partition walls 13c are formed on four opposing sides around the housing portion 13a, and a number of slits 13d are formed in the partition walls 13c at predetermined intervals. Further, the socket body 13 is formed with four mold guides 13h for guiding the peripheral edge of the package body 12a inside the partition wall 13c.

  Each of these mold guides 13h is formed to be positioned below the shoulder 12d of the crank-shaped IC lead 12b. The mold guide 13h has a shape protruding substantially in a mountain shape, and a plurality of slits 13j penetrating in the vertical direction are formed at predetermined intervals (see FIG. 3).

  The socket body 13 is provided with a plurality of elastically deformable contact pins 15 that are separated from and in contact with the IC leads 12b, and a rectangular frame-shaped operation member 16 that elastically deforms the contact pins 15 It is arranged freely.

  The contact pin 15 is made of a material having elasticity and excellent electrical conductivity, and is press-fitted and disposed in an outer position of the accommodating portion 13a of the socket body 13 as shown in FIG.

  Specifically, the contact pin 15 has a fixing portion 15 a fixed to the socket main body 13 on the lower side, and the fixing portion 15 a is press-fitted and fixed to the press-fitting hole 13 e of the socket main body 13. A fixed contact piece 15b and a movable contact piece 15c project from the fixed portion 15a upward. The fixed contact piece 15b and the movable contact piece 15c form a pair.

  The fixed contact piece 15b is formed with a fixed-side contact portion 15d that contacts the lower surface of the IC lead 12b at the upper end portion. As shown in FIG. 2 and the like, the fixed-side contact portion 15d has a substantially triangular shape, and is inserted into an insertion hole 13f formed in the socket body 13 so that the locking portion 15e is locked to the socket body 13. Thus, the downward movement of the fixed side contact portion 15d is restricted and inserted into each slit 13j of the mold guide 13h. Then, the upper end portion of the fixed side contact portion 15d faces upward, projects slightly upward from the upper end portion of the mold guide 13h, and the shoulder of the IC lead 12b extends to the narrow upper end portion of the fixed side contact portion 15d. The part 12d is placed and brought into contact therewith.

  Further, as shown in FIG. 2 and the like, a locking projection 15k is formed on the fixed contact piece 15b near the lower side of the fixed side contact portion 15d, and the locking projection 15k is formed on the socket body 13. It is locked to the locking recess 13k to restrict upward movement.

  On the other hand, the movable contact piece 15c is formed with a spring portion 15f that is curved in a substantially S shape, and a movable side contact portion 15g is extended above the spring portion 15f toward the central portion of the socket body 13. ing. The movable side contact portion 15g abuts on the upper surface of the shoulder portion 12d of the IC lead 12b and presses it downward, so that the shoulder portion 12d of the IC lead 12b is in contact with the fixed side contact portion 15d of the fixed contact piece 15b. It is comprised so that it may be clamped.

  Further, the contact pin 15 is provided with an operation piece 15h that is pressed by an operation member 16 to be described in detail later and branched upward from the movable side contact portion 15g side. In addition, below the fixed portion 15a, a lead portion 15i connected to a wiring board (not shown) is extended downward.

  On the other hand, the operation member 16 has a rectangular frame shape corresponding to the shape of the IC package 12, and has an opening 16a of a size that allows the IC package 12 to be inserted. The IC package 12 is inserted through the opening 16a. Thus, the socket body 13 is accommodated on the upper side of the accommodating portion 13a. The operation member 16 is disposed so as to be movable up and down with respect to the socket body 13, and is biased upward by a coil spring (not shown). The operation member 16 is prevented from coming off by being locked by the locked portion.

  Further, the operation member 16 is formed with a cam portion 16c slidably contacting the operation piece 15h of the contact pin 15. By lowering the operation member 16, the operation piece 15h of the contact pin 15 is brought into contact with the cam portion 16c. By being pressed, the spring portion 15f is elastically deformed and the movable contact portion 15g is displaced obliquely upward and outward.

  Next, a method of using the IC socket 11 having such a configuration will be described.

  First, the lead portions 15i of the contact pins 15 of the IC socket 11 are inserted into the insertion holes of the wiring board and soldered in advance, thereby arranging the plurality of IC sockets 11 on the wiring board.

  Then, the IC package 12 is set and electrically connected to the IC socket 11 by, for example, an automatic machine as follows.

  That is, the IC package 12 is transported by an automatic machine, and the operation member 16 is moved from the state shown in FIG. 4 with the automatic machine in a state where the IC package 12 is held above the housing portion 13a of the socket body 13. The contact pin 15 is pressed downward and lowered against the biasing force of the contact pin 15 and the biasing force of a coil spring (not shown). Then, the contact pin operation piece 15h is pressed by the cam portion 16c of the operation member 16, the spring portion 15f is elastically deformed, and the movable contact portion 15g is displaced obliquely upward and opened to the maximum extent, so that the IC package can be opened. Evacuated from 12 insertion range.

  In this state, when the IC package 12 is released from the automatic machine, the IC package 12 is guided and accommodated on the accommodating portion 13 a of the socket body 13 by the guide portion 13 b, and the shoulder portion 12 d of the IC lead 12 b of the IC package 12 is fixed to the contact pin 15. It will be in the state contacted on the side contact part 15d (refer FIG. 5).

  Next, when the pressing force of the operation member 16 by the automatic machine is released, the operation member 16 rises due to the elastic force of the spring portion 15f of the movable contact piece 15c of the contact pin 15 and the coil spring and the like, and due to the elastic force of the spring portion 15f. The movable contact portion 15g of the contact pin 15 begins to return. When the operation member 16 is raised to a predetermined position, the movable side contact portion 15g of the contact pin 15 comes into contact with the upper surface of the shoulder portion 12d of the predetermined IC lead 12b of the positioned IC package 12 to electrically (See FIG. 6).

  In this state, the burn-in test of the IC package 12 is performed.

  On the other hand, when the operation member 16 is raised in a state where the IC package 12 is not accommodated, the movable contact portion 15g of the movable contact piece 15c has a substantially arc-shaped locus from the obliquely upward position to the obliquely downward position. Move along.

  The movable contact portion 15g comes into contact with the upper end portion of the fixed contact portion 15d and stops.

  In such a case, when the IC package 12 is accommodated, the IC package 12 can be accommodated in a predetermined position by the mold guide 13 h of the socket body 13.

Further, a plurality of slits 13j are formed in the mold guide 13h, and the fixed-side contact portions 15d are inserted and disposed in the respective slits 13j. The fixed-side contact portion 15d can be disposed. Furthermore , since the fixed side contact portion 15d is disposed at a position corresponding to the movable side contact portion 15g in the non-accommodating state of the IC package 12, the movable side contact portion 15g hits the mold guide 13h unlike the conventional case. In addition, it is possible to prevent damage to the synthetic resin mold guide 13h, and even if the movable side contact portion 15g abuts against the fixed side contact portion 15d, both are made of the same type of metal, so that damage to both can be suppressed.

  Moreover, by inserting the fixed side contact portion 15d into the slit 13j of the mold guide 13h, the fixed side contact portion 15d can be guided by the mold guide 13h, and the fixed side contact portion 15d can be prevented from falling down. it can.

  Furthermore, since the fixed side contact portion 15d of the contact pin 15 can be disposed at the portion where the mold guide 13h is disposed, the IC lead 12b of the IC package 12 can be provided at two points of the movable side contact portion 15g and the fixed side contact portion 15d. Can be brought into contact with each other, and conductivity can be improved.

  In the above embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices. Further, the IC package 12 is applied to the case where the IC leads 12b protrude from the four sides of the package body 12a, but the IC leads protrude from the two opposite sides of the IC package body toward the side. It can also be applied to packages.

1 is a plan view of an IC socket according to an embodiment of the present invention. It is sectional drawing which follows the AA line of FIG. 1 which concerns on the same embodiment. It is a perspective view which shows the accommodating part etc. of the IC socket which concerns on the same embodiment. FIG. 10 is a cross-sectional view of the IC socket according to the same embodiment in a state where the operation member is at the highest position in the IC package non-accommodating state. It is sectional drawing of the state which has an operation member in the lowest position in the IC package accommodation state of the IC socket which concerns on the embodiment. It is sectional drawing of the state which has an operation member in the highest position in the IC package accommodation state of the IC socket which concerns on the embodiment. It is a figure which shows IC package, (a) is a top view of IC package, (b) is a front view. It is sectional drawing of the IC socket which shows a prior art example.

Explanation of symbols

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Package body (Electric component body)
12b IC lead (terminal)
13 Socket body
13a containment
13b Guide section
13c Bulkhead
13h Mold guide
13j slit
15 Contact pin
15b Fixed piece
15c movable contact
15d Fixed side contact area
15f Spring part
15g Movable contact part
15h operation piece
16 Operation parts

Claims (1)

A socket body that houses an electrical component having a terminal extending laterally, and a contact pin attached to the socket body, and a movable contact piece that is elastically deformed is formed on the contact pin. A movable-side contact portion that is separated from and in contact with the upper surface of the terminal of the electrical component is formed at the tip of the piece, and a mold guide that protrudes in a substantially mountain shape that contacts and guides the periphery of the electrical component body of the electrical component. A socket for electrical parts formed in the socket body ,
The contact pin is formed with a fixed contact piece that is paired with the movable contact piece, and the fixed contact piece is formed with a fixed contact portion that contacts the lower surface side of the electrical component terminal, the mold guides, a plurality of slits penetrating vertically, Rutotomoni formed at a predetermined interval, the socket body into the insertion hole below the respective slits are formed, in the insertion hole and the respective slit, the fixed The side contact portion is inserted from below , the upper end portion of the fixed side contact portion faces upward and protrudes upward from the upper end portion of the mold guide. The fixed contact portion is arranged at a corresponding position,
The electrical component is formed such that the terminal protruding laterally from the electrical component main body is formed in a crank shape, and the terminal is formed so that the vicinity side of the electrical component main body is one step higher than the tip side, and the one step higher The movable contact portion is contacted with the upper surface of the shoulder portion, and the fixed contact portion is contacted with the lower surface of the shoulder portion,
The electrical component socket, wherein the fixed-side contact portion inserted through the slit has substantially the same mountain shape as the substantially mountain-shaped mold guide.

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