JP2004047188A - Socket for electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electrical component capable of improving the high frequency characteristic of a contact pin, and narrowing an arrangement space. <P>SOLUTION: In the IC socket 11, the contact pin 17 is composed of an electrical component side contact member 26 contacting an IC package, and a printed circuit board side contact member 27 contacting a printed circuit board 13. An energizing member 23 is provided at the side of the contact pin 17. When the IC package 12 is housed in a socket body 15, the electrical component side contact member 26 is pressed, and both contact members 26 and 27 are displaced sideways in contacting states. By this, the energizing member 23 is elastically deformed, at least one of the contact members 26 and 27 is pressed sideways by the elastic force of the energizing member 23, and both contact members 26 and 27 are energized so as to return to original attitudes. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrical component socket for detachably holding an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), and in particular, to an improved contact pin and the like disposed in the socket and contacting the electrical component terminal. It is about.
[0002]
[Prior art]
Conventionally, as this kind, for example, there is one shown in FIG. 13 (see Japanese Patent Application Laid-Open No. 10-116670). This is a device for electrically connecting a terminal 1a of an IC package 1 as an "electric component" and a terminal 2a of a circuit board 2. A contact 4 is provided on a device main body 3.
[0003]
The contact 4 is formed of a conductive plate material, engaging grooves 4a and 4b are formed at both ends, an elastic element 5 is fitted into one engaging groove 4a, and the other engaging groove is formed. The rigid element 6 is fitted and supported by 4b.
[0004]
The upper end of the contact 4 contacts the terminal 1 a of the IC package 1, and the lower end of the contact 4 contacts the terminal 2 a of the circuit board 2. And the circuit board terminal 2a are electrically connected.
[0005]
In such a case, since the engaging groove 4b is formed in a long hole shape that is substantially long in the vertical direction, the contact 4 is slightly rotated by the IC package 1 being pressed downward, so that the contact 4 is slightly rotated. When the contact portion 4 slightly slides on the lower surface of the IC package terminal 1a, the wiping effect is exhibited. In addition, a slight sliding occurs between the contact 4 and the circuit board terminal 2a.
[0006]
[Problems to be solved by the invention]
However, in such a conventional device, although the contact 4 has a predetermined width, since the contact 4 is formed obliquely long so as to be configured to rotate, the contact space for the device main body 3 is provided. And the high-frequency characteristics of the contact 4 could not be improved so much.
[0007]
Therefore, an object of the present invention is to provide an electrical component socket that can improve the high-frequency characteristics of a contact (corresponding to the “contact pin” of the present invention) and can also provide a small installation space.
[0008]
[Means for Solving the Problems]
In order to solve such a problem, the invention according to claim 1 has a socket main body that is provided on a printed circuit board and accommodates an electric component, and includes a contact pin provided in the socket main body. In the electrical component socket in which the printed board and the electrical component are electrically connected to each other, the contact pin includes an electrical component side contact member that is in contact with the electrical component, and a printed board side that is in contact with the printed board. A contact member, and a biasing member provided on a side of the contact pin. When the electric component is accommodated in the socket body, the electric component side contact member is pushed to In a state where the component side contact member and the printed circuit board side contact member are in contact with each other, the biasing member is elastically deformed by being displaced laterally, and the elastic force of the urging member causes the urging member to deform. At least one of the air component side contact member or the printed board side contact member is pressed from the side, and the electric component side contact member and the printed board side contact member are urged to return to the original posture. It is a socket for electrical components.
[0009]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, the electric component side contact member and the printed circuit board side contact member are displaced while rotating with respect to each other when the electric component is accommodated. It is characterized by having done.
[0010]
According to a third aspect of the present invention, in addition to the configuration of the first aspect, when the electric component is accommodated, the electric component-side contact member descends substantially in parallel, and the printed board-side contact member is displaced while rotating. It is characterized by doing so.
[0011]
According to a fourth aspect of the present invention, in addition to the configuration of the first aspect, when the electric component is accommodated, the electric component-side contact member descends substantially in parallel, and the printed board-side contact member moves in a horizontal direction. It is characterized by doing so.
[0012]
According to a fifth aspect of the present invention, in addition to the configuration of any one of the first to fourth aspects, the urging member is made of an insulating and elastic silicone rubber.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
[0014]
[First Embodiment of the Invention]
1 to 7 show a first embodiment of the present invention.
[0015]
First, the configuration will be described. In the drawing, reference numeral 11 denotes an IC socket as a so-called clamshell type “socket for electric parts”, and this IC socket 11 performs a performance test of an IC package 12 as an “electric part”. In this case, the electrical connection between the IC leads 12b of the IC package 12 and the printed circuit board 13 of the measuring instrument (tester) is made.
[0016]
This IC package 12 is a so-called gull wing type. As shown in FIG. 7, a crank-shaped IC lead 12 is formed from two opposing sides of a flat rectangular parallelepiped package body 12a toward the side. It is protruding.
[0017]
The IC socket 11 has a socket body 15 mounted on a printed circuit board 13 as shown in FIGS. 2 and 3, and the socket body 15 has a socket body 16 on which a contact pin 17 is held. In addition, a cover member 19 for pressing the IC package 12 is rotatably attached to the socket body 16, and a stopper member 20 for maintaining the cover member 19 in a closed state is provided.
[0018]
More specifically, a recess 16a larger than the IC package 12 is formed at the center of the socket body 16, and a contact pin guide member 22 and a biasing member 23 are disposed on a bottom plate 16b of the recess 16a. A guide plate 24 is disposed above the guide plate 24.
[0019]
The contact pins 17 are arranged in two rows corresponding to the IC leads 12 between the guide plate 24 and the bottom plate portion 16b.
[0020]
The contact pins 17 include an electrical component-side contact member 26 that contacts the IC lead 12b of the IC package 12 and a printed board-side contact member 27 that contacts the printed board 13.
[0021]
The electrical component side contact member 26 and the printed board side contact member 27 are formed of a conductive metal material in a plate shape, and each contact pin is formed in a plurality of receiving grooves formed adjacent to the contact pin guide member 22. 17 are insulated from each other. The width of the accommodation groove is substantially the same as that of each of the contact members 26 and 27, and movement in a direction perpendicular to the plate thickness direction is possible in a state where play in the plate thickness direction is restricted.
[0022]
The electric component side contact member 26 has a long plate portion 26a having a fixed width on the upper side, and the long plate portion 26a is inserted into the insertion hole 24a of the guide plate 24 and protrudes upward as shown in FIG. In addition, a stopper 26b is formed below the long plate 26a to abut against the lower surface of the guide plate 24 and restrict upward removal. The insertion hole 24a of the guide plate 24 is formed in a tapered shape so that the electric component side contact member 26 may be slightly inclined.
[0023]
The electric component side contact member 26 has an upper end portion of the long plate portion 26 formed in an arc shape and an arc-shaped sliding protrusion 26c formed in a lower portion.
[0024]
Further, the printed circuit board side contact member 27 has a long plate portion 27a having a fixed width on the lower side, and the long plate portion 27a is inserted into the insertion hole 16c of the bottom plate portion 16b as shown in FIG. On the upper side of the long plate portion 27a, a stopper portion 27b which is in contact with the upper surface of the bottom plate portion 16b and regulates a downward drop is formed. The insertion hole 16c of the bottom plate portion 16b is formed in a tapered shape so that the printed board side contact member 27 may be slightly inclined.
[0025]
The printed board side contact member 27 has a lower end portion of a long plate portion 27a formed in an arc shape, an arc-shaped sliding recessed portion 27c formed in an upper portion, and a sliding projection 26c formed in the sliding recessed portion 27c. And the center P of this engagement position is set at a position offset with respect to the center line O of the long plate portions 26a, 27a of the contact members 26, 27. Thereby, when the electric component side contact member 26 is pressed downward, the contact members 26 and 27 are formed to be displaced and inclined while rotating (two points in FIGS. 5 and 6). Dashed line).
[0026]
Further, a pressed portion 27d is formed on the printed board side contact member 27 beside the sliding concave portion 27c, and when the pressed portion 27d is displaced as shown by a two-dot chain line in FIG. When the urging member 23 is elastically deformed, the pressed portion 27d is pressed from the side by the urging member 23, and the electric component side contact member 26 or the printed board side contact member 27 returns to the original posture. It is energized as follows.
[0027]
The urging member 23 is formed of a square rod-shaped silicone rubber having an insulating property and an elasticity, and is disposed horizontally on one side of the contact pins 17 arranged in a line. Here, since the contact pins 17 are arranged in two rows, one contact pin 17 is arranged in each row, that is, a total of two contact pins 17 are arranged.
[0028]
As shown in FIGS. 4 and 5, openings 22a and 24b are formed in the center of the contact pin guide member 22 and the guide plate 24, and an IC package is formed in the openings 22a and 24b. The floating plate 30 in which the housing 12 is housed is arranged to be vertically movable, and the floating plate 30 is urged upward by a spring 31 arranged between the floating plate 30 and the bottom plate portion 16b. A mold guide 30a is formed at the periphery of the floating plate 30 to abut on and guide the peripheral end surface of the package body 12a.
[0029]
Then, the IC leads 12b of the IC package 12 housed on the floating plate 30 come into contact with the electric component side contact members 26 of the contact pins 17.
[0030]
Further, a frame-shaped set piece 33 made of silicone rubber is disposed on the guide plate 24, and a set plate 34 made of synthetic resin is provided above the set piece 33 and the socket body 16 with bolts 35. The nut 36 is fixed to the socket body 16 and disposed.
[0031]
On the other hand, as shown in FIGS. 1 and 2, the cover member 19 is rotatably disposed on the socket body 16 by the rotation shaft 39, is urged in the opening direction by the spring 40, and is provided at the distal end. The stopper member 20 is adapted to be engaged with and disengaged from the locked portion 16d on which the socket body 16 is formed.
[0032]
Further, a package holder 41 is disposed on the cover member 19 so as to be vertically movable in the state shown in FIG. 2, and the locking claw 41 a is locked to the cover member 19 to prevent the package holder 41 from falling off. 2, the package holder 41 is urged downward by the spring 42.
[0033]
The package holder 41 is inserted into the openings 33a and 34a of the set piece 33 and the set plate 34 in the state shown in FIG. 2, and is a pressing part 41b formed on the peripheral edge of the lower surface. As shown, an accommodation recess 41c for accommodating the IC lead 12b and accommodating the package body 12a is formed.
[0034]
Next, the operation will be described.
[0035]
When the IC socket 11 is attached to the printed circuit board 13 in advance, the lower end of the long plate portion 27a of the contact pin 17 of the printed circuit board side contact member 27 is in contact with the electrode of the printed circuit board 13. In this state, as shown in FIG. 5, the center line O of the long plate portion 27 stands upright along the vertical direction.
[0036]
To accommodate the IC package 12 from this state, the cover member 19 is opened, and the IC package 12 is placed on the floating plate 30 by being guided by the mold guide 30a (see FIG. 5).
[0037]
Thereafter, the cover member 19 is closed, and the stopper member 20 is locked to the locked portion 16d of the socket body 16, whereby the cover member 19 is completely closed.
[0038]
Thereby, as shown in FIG. 4, the IC lead 12 b of the IC package 12 is pressed by the pressing portion 41 b of the package holder 41, and the floating plate 30 is lowered by the urging force of the spring 31.
[0039]
As a result, the long plate portion 26a of the electric component side contact member 26 of the contact pin 17 is pressed downward, so that the center P of the engagement position of the two contact members 26 and 27 is set to the both long plate portions 26a. Since it is set at a position offset from the center line O, as shown by the two-dot chain line from the solid line in FIG. At the same time, by being pressed by the electric component side contact member 26, the printed board side contact member 27 also tilts while rotating.
[0040]
When the printed board-side contact member 27 is tilted, the urging member 23 is pressed by the pressed portion 27d as shown by a two-dot chain line in FIG. 6, and the urging member 23 is elastically deformed. The reaction force acts on the printed circuit board side contact member 27 and the electric component side contact member 26, and acts as a force for returning them to the original posture.
[0041]
Due to the reaction force from the biasing member 23, the contact pressure between the contact members 26 and 27 of the contact pin 17 and the IC lead 12b and the printed circuit board 13 is secured.
[0042]
As a result, the IC package 12 and the printed board 13 are electrically connected via the contact pins 17, and a burn-in test or the like of the IC package 12 is performed.
[0043]
When taking out the IC package 12 after the test, contrary to the above, the IC package 12 can be taken out by opening the cover member 19 after rotating the stopper member 20 to release the locked state. it can. In a state where the IC package 12 is removed, the contact members 26 and 27 of the contact pin 17 return to their original positions and become upright by the return force of the urging member 23 (see the solid line in FIG. 6).
[0044]
In such a case, the contact pin 17 is made of two parts, and the elastic force for ensuring the contact pressure and the like is ensured by the biasing member 23 arranged on the side. Since the electrical component side contact member 26 and the printed board side contact member 27) can be reduced in size, the path through which current flows can be shortened. Therefore, the test of the high-frequency IC package 12 can be favorably performed, and the space for disposing the contact pins 17 can be reduced.
[0045]
Further, the lower end portion of the long plate portion 27a of the printed board side contact member 27 is formed in an arc shape, and in a state where a part of this arc is in contact with the printed board 13, the printed board side contact member 27 is By rotating around the contact portion, the contact member 27 hardly slides on the printed circuit board 13, so that damage on the printed circuit board 13 side can be suppressed.
[0046]
Further, since the contact pin 17 is composed of two components (the electrical component-side contact member 26 and the printed circuit board-side contact member 27), and the two contact members 26 and 27 are configured to rotate and fall, the electrical component-side contact member is formed. The displacement amount H in the vertical direction can be increased, and the IC package 12 in which a large number of IC leads 12b have variations in the vertical direction can be satisfactorily handled.
[0047]
Furthermore, since the urging member 23 is made of silicone rubber, one urging member 23 may be provided for a large number of contact pins 17, so that an urging member is provided for each contact pin 17. Since there is no need to perform this operation, the number of components can be reduced, and the work of disposing the urging member 23 can be easily performed.
[0048]
[Embodiment 2]
FIG. 8 shows a second embodiment of the present invention.
[0049]
In the second embodiment, the electrical component-side contact member 46 and the printed board-side contact member 47 of the contact pin 45 have an upside-down substantially reverse relationship as compared with the first embodiment, and the two The pins 45 are arranged adjacent to each other in a line-symmetric relationship.
[0050]
That is, the electrical component side contact member 46 has a long plate portion 46a formed on the upper side and a sliding concave portion 46c formed on the lower side, and an urging member is provided beside the sliding concave portion 46c. A pressed portion 46d pressed by the pressure roller 23 is formed.
[0051]
Further, the printed board side contact member 47 has a long plate portion 47a formed on the lower side and a sliding protrusion 47c formed on the upper side, and the sliding protrusion 47c is connected to the electric component side contact member 46. Is engaged with the sliding concave portion 46c.
[0052]
In such a device, when the IC package 12 is accommodated and the electric component side contact member 46 is pressed and displaced downward while rotating, the electric component side contact member 46 is pushed by the electric component side contact member 46 and the printed circuit board side is pressed. The contact member 47 rotates around the lower end and tilts. At the same time, the urging member 23 is elastically deformed at the pressed portion 46 d of the electric component side contact member 46.
[0053]
On the other hand, after the IC package 12 is taken out, the reaction force of the urging member 23 presses the electric component side contact member 46 so as to return to the original posture, and the sliding recess 46c of the electric component side contact member 46 Since the sliding protrusion 47c of the printed circuit board side contact member 47 is engaged with the electric component side contact member 46, the printed circuit board side contact member 47 is pressed to the original posture. You.
[0054]
Other configurations and operations are the same as those of the first embodiment, and thus description thereof will be omitted.
[0055]
Third Embodiment of the Invention
FIG. 9 shows a third embodiment of the present invention.
[0056]
In the third embodiment, the electrical component side contact member 56 of the contact pin 55 is disposed in the insertion hole 24a of the guide plate 24 so as to be vertically movable without tilting.
[0057]
This electric component side contact member 56 has a long plate portion 56a formed on the upper side and a slanted portion 56b formed on the lower end portion.
[0058]
The printed board side contact member 57 has a long plate portion 57a formed on the lower side, and a sliding portion 57b pressed on the upper end portion by sliding the inclined portion 56b. A pressed portion 57c pressed by the urging member 23 is formed on the side of the sliding portion 57b.
[0059]
In such a case, when the IC package 12 is accommodated, the electric component side contact member 56 is moved down from the state shown by the solid line to the state shown by the two-dot chain line in FIG. While the inclined portion 56b of the contact member 56 slides on the sliding portion 57b of the printed board side contact member 57, the sliding portion 57b is pressed.
[0060]
As a result, the contact member 57 on the printed circuit board side is rotated about the lower end side and tilted, whereby the urging member 23 is pressed by the pressed portion 57c. The contact pressure between the leads 12b and the printed circuit board 13 is secured.
[0061]
Other configurations and operations are the same as those of the first embodiment, and thus description thereof will be omitted.
[0062]
[Embodiment 4]
FIG. 10 shows a fourth embodiment of the present invention.
[0063]
In the fourth embodiment, the electrical component side contact member 66 of the contact pin 65 is disposed in the insertion hole 24a of the guide plate 24 so as to be vertically movable without tilting.
[0064]
As in the third embodiment, the electric component side contact member 66 has a long plate portion 66a formed on the upper side and an inclined portion 66b formed on the lower end portion.
[0065]
Further, the printed board side contact member 67 has a long plate portion 67a formed on the lower side, and a sliding portion 67b pressed by sliding the inclined portion 66b on the upper end portion. A pressed portion 67c pressed by the urging member 23 is formed on the side of the sliding portion 67b.
[0066]
In such a case, when the IC package 12 is accommodated, the electric component side contact member 66 moves down from the state shown by the solid line to the state shown by the two-dot chain line in FIG. While the inclined portion 66b of the member 66 slides on the sliding portion 67b of the printed board side contact member 67, the sliding portion 67b is pressed.
[0067]
As a result, the printed board side contact member 67 is translated in the left direction in the figure, the urging member 23 is pressed by the pressed portion 67c, and the reaction force from the urging member 23 causes the IC lead 12b and the printed board to move. 13 is secured.
[0068]
Other configurations and operations are the same as those of the first embodiment, and thus description thereof will be omitted.
[0069]
[Embodiment 5]
11 and 12 show a fifth embodiment of the present invention.
[0070]
The fifth embodiment is different from the first embodiment in the arrangement relationship between the contact pins 17 and the urging members 23.
[0071]
That is, the one shown in FIG. 11 corresponds to an IC package in which IC leads are provided on four sides of a rectangular package body, and contact pins 17 are arranged corresponding to the four sides. An urging member 23 is arranged. In the figure, for the sake of simplicity, the contact pins 17 are arranged at two places corresponding to each side for simplification, but in reality, many contact pins 17 are arranged.
[0072]
FIG. 12 corresponds to an IC package in which terminals are provided in a matrix on the lower surface of a rectangular package body. Contact pins 17 are arranged in a matrix corresponding to these terminals. The urging members 23 are arranged between the members 17 in a rectangular frame shape. In this figure, two contact pins 17 are arranged corresponding to each side of the urging member 23 for the sake of simplicity of explanation. However, in reality, many contact pins 17 are arranged.
[0073]
As described above, the arrangement relationship between the contact pins 17 and the urging members 23 can be appropriately set in relation to the IC package.
[0074]
In the above-described embodiment, the present invention is applied to the IC socket 11 as the “electric component socket”. However, the present invention is not limited to this and can be applied to other devices. Further, in the above-described embodiment, the present invention is applied to the so-called clamshell type IC socket 11. However, the present invention is not limited to this, and may be applied to an open top type IC socket. Further, the present invention is applied to an IC socket 11 that accommodates a gull-wing type IC package 12 as an “electric component”, but other types of ICs such as a BGA (Ball Grid Array) and an LGA (Land Grid Array) are available. Of course, the present invention can be applied to an IC socket for accommodating a package. Furthermore, in the above embodiment, the urging member 23 is formed of silicone rubber, but is not limited thereto, and may be a plate spring or the like.
[0075]
【The invention's effect】
As described above, according to the invention described in each claim, the contact pin is constituted by the electric component side contact member contacting the electric component and the printed board side contact member contacting the printed board. In addition, an urging member is provided on the side of the contact pin, and when the electric component is accommodated in the socket body, the electric component-side contact member is pushed, and the electric component-side contact member and the printed circuit board-side contact member are pressed. Is displaced sideways in a state where the contact is made, the biasing member is elastically deformed, and at least one of the electrical component side contact member or the printed circuit board side contact member is pressed from the side by the elastic force of the biasing member. Since the contact member on the electrical component side and the contact member on the printed circuit board side are urged to return to the original posture, the contact pin is made into two parts, and the elastic force for securing the contact pressure or the like is lateral. To Because it is so as to ensure the location has been urging member, it is possible to two parts (electrical part side contact member and the printed circuit board-side contact member) in a small, a shorter path for current flow. Therefore, the test of the high-frequency electric component can be performed favorably, and the space for disposing the contact pins can be reduced.
[0076]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, the electric component side contact member and the printed board side contact member are displaced while rotating with respect to each other when the electric component is accommodated. Since the contact member is configured to rotate and fall, the amount of vertical displacement of the contact member on the electrical component side can be increased, and even in an electrical component in which a large number of terminals have vertical variations, it can be satisfactorily performed. Can respond. Further, since the contact member hardly slides on the printed circuit board by rotating about the lower end portion of the printed circuit board side contact member, damage on the printed circuit board side can be suppressed.
[0077]
According to the fifth aspect of the present invention, since the urging member is made of silicone rubber having insulation and elasticity, it is sufficient to arrange one urging member for a large number of contact pins. Since there is no need to provide an urging member for each pin, the number of components can be reduced and the operation of arranging the urging member can be easily performed.
[Brief description of the drawings]
FIG. 1 is a plan view showing an IC socket according to Embodiment 1 of the present invention, showing a state where a cover member is opened.
FIG. 2 is a sectional view showing an IC socket according to the first embodiment.
FIG. 3 is a sectional view taken along a direction orthogonal to FIG. 2 according to the first embodiment.
FIG. 4 is an enlarged sectional view of a portion X in FIG. 2 according to the first embodiment.
FIG. 5 is an enlarged sectional view of a main part according to the first embodiment.
FIG. 6 is a sectional view showing movement of the contact pin according to the first embodiment.
7A and 7B are diagrams showing the IC package according to the first embodiment, wherein FIG. 7A is a plan view of the IC package, FIG. 7B is a front view, and FIG. 7C is a right side view.
FIG. 8 is an enlarged sectional view of a main part according to Embodiment 2 of the present invention.
FIG. 9 is an enlarged sectional view of a main part according to Embodiment 3 of the present invention.
FIG. 10 is an enlarged sectional view of a main part according to Embodiment 4 of the present invention.
FIG. 11 is a schematic diagram showing an arrangement relationship between a contact pin and an urging member according to Embodiment 5 of the present invention.
FIG. 12 is a schematic diagram showing another arrangement relationship between the contact pin and the urging member according to the fifth embodiment of the present invention, which is different from FIG.
FIG. 13 is an enlarged sectional view of a main part showing a conventional example.
[Explanation of symbols]
11 IC socket (electric component socket)
12 IC package (electric parts)
12a Package body 12b IC lead (terminal)
13 Printed Circuit Board 15 Socket Body 16 Socket Body 17, 45, 55, 65 Contact Pin 18 Contact Unit 23 Biasing Member 26, 46, 56, 66 Electrical Component Side Contact Member 27, 47, 57, 67 Printed Circuit Board Side Contact Member

Claims (5)

An electrical device having a socket body provided on a printed board and accommodating an electrical component, wherein the printed board and the electrical component are electrically connected to each other through contact pins provided on the socket body. In the socket for parts,
The contact pin includes an electric component-side contact member that is in contact with the electric component, and a printed board-side contact member that is in contact with the printed board, and an urging member is provided beside the contact pin. Provided,
When the electric component is accommodated in the socket body, the electric component side contact member is pushed, and is displaced laterally in a state where the electric component side contact member and the printed board side contact member are in contact with each other. Thereby, the urging member is elastically deformed, and at least one of the electric component side contact member or the printed circuit board side contact member is pressed from the side by the elastic force of the urging member, so that the electric component side A socket for an electrical component, wherein the contact member and the printed board-side contact member are urged to return to their original positions. The electrical component socket according to claim 1, wherein the electrical component side contact member and the printed circuit board side contact member are displaced while rotating with respect to each other when the electrical component is accommodated. 2. The electrical component socket according to claim 1, wherein the electrical component side contact member is lowered substantially in parallel when the electrical component is accommodated, and the printed board side contact member is displaced while rotating. . 2. The electrical component socket according to claim 1, wherein the electrical component side contact member is lowered substantially in parallel when the electrical component is accommodated, and the printed circuit board side contact member is moved in a horizontal direction. . The electrical component socket according to any one of claims 1 to 4, wherein the urging member is a silicone rubber having an insulating property and an elastic property.

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