JP4550642B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to an electrical component socket that detachably accommodates an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) and is electrically connected to a wiring board.

  Conventionally, as this type of “electrical component socket”, for example, there is an IC socket that detachably accommodates an IC package that is an “electrical component”. An example of this type of IC socket is shown in FIGS. 16 to 18 (see Patent Document 1).

  As shown in FIG. 16, the IC socket 11 is arranged on a printed circuit board 12. By holding the IC package 13 in the IC socket 11, the IC package 13 is printed on the printed circuit board. 12 is electrically connected.

  The IC socket 11 includes a base plate 14, a tab film 15, a ball guide 16, and a pressing jig 17 in order from below, and these are detachably attached by bolts 18 and nuts 19.

  As shown in FIG. 16, the base plate 14 has a rectangular plate shape, and a large number of round pins 14a are arranged in two rows on the four sides of the peripheral portion, and a total of four bolt holes 14b are formed inside these. In addition, a positioning hole 14c is formed, and a resilient elastic member 14d made of silicone rubber is disposed at the center. As shown in FIGS. 16 and 17, the round pin 14 a is disposed vertically through the base plate 14, a fitting recess 14 e is formed in the upper portion, and a lower insertion portion 14 f is formed from the lower surface of the base plate 14. The insertion portion 14f protrudes downward and is inserted into the through hole 12a of the printed circuit board 12 to be electrically connected.

  Further, as shown in FIGS. 16 and 17, the tab film 15 is formed in a thin sheet shape, which is substantially the same size as the base plate 14, and is formed on the surface of the IC package 13 side. The electrode pattern 15a to be joined to the array 13a is provided, the back surface on the base plate 14 side is provided with a pin type terminal 15b to be joined to the base plate 14, and a conductive wire for connecting the pin type terminal 15b and the electrode pattern 15a is provided. Yes. The pin-type terminal 15b is formed so as to be able to be inserted into the fitting recess 14e of the round pin 14a of the base plate 14. The tab film 15 is also formed with bolt holes 15c and positioning holes 15d having the same position and size as the base plate 14 and the like.

  Further, as shown in FIGS. 16 and 17, the ball guide 16 is formed of an insulating material, and has a rectangular plate shape substantially the same size as the pressing jig body 20 of the pressing jig 17. A positioning opening 16a for positioning the periphery of the solder ball 13a of the IC package 13 is formed in the portion, and a bolt hole 16b and a positioning hole 16c having the same position and size as the bolt hole 15c and the positioning hole 15d of the tab film 15 are formed. Is formed. As shown in FIG. 18, the solder balls 13a arranged on the outermost periphery of the IC package 13 are positioned by the positioning openings 16a.

  Furthermore, as shown in FIG. 17, the pressing jig 17 is attached to a rectangular frame-shaped pressing jig main body 20 so that the cover member 21 is rotatably attached by a shaft 22 and is opened by a spring 29 (see FIG. 17). 17, the pusher member 23 that presses the IC package 13 against the cover member 21 is swingable by the shaft 30 and is biased in a direction away from the cover member 21 by the spring 28. Is provided. Further, the cover member 21 is provided with a locked portion 24, while the pressing jig main body 20 is provided with a latch member 25 locked to the locked portion 24 so as to be rotatable by a shaft 26. The latch member 25 is biased clockwise (in the locking direction) in FIG.

  As shown in FIGS. 16 and 17, the pressing jig body 20 has a rectangular IC package 13 inserted therein and is accommodated on the tab film 15, and has a positioning hole in the lower surface portion. Positioning pins 20a fitted to 14c, 15d, and 16c protrude downward, and further, as shown in FIG. 18, bolt holes 20b having the same position and size as the bolt holes 16b of the ball guide 16 are formed. Has been.

  Then, as shown in FIG. 17, the positioning pins 20a of the pressing jig body 20 are fitted into the positioning holes 14c, 15d, and 16c of the base plate 14, the tab film 15, and the ball guide 16, so that the respective members have predetermined positions. The bolts 18 are inserted from above into the bolt holes 14b, 15c, 16b, and 20b of the base plate 14, the tab film 15, the ball guide 16, and the pressing jig body 20, and screwed into the nut 19. Thus, they are fixed in a superposed state.

  In such a case, in order to accommodate the IC package 13 in the IC socket 11, as shown in FIG. 18, the outer peripheral edge of the IC package 13 is formed on the inner surface of the rectangular frame-shaped pressing jig body 20. In addition, the ball guide 16 positions the solder balls 13 a of the IC package 13.

  The peripheral edge of the upper surface of the IC package 13 thus positioned is pressed by a pusher member 23 as shown in FIG.

In Patent Document 2, while providing a plurality of protrusions on a pad (electrode) of a wiring electrically connected to a spherical terminal (solder ball) of an IC package, conductivity is ensured, The quality is ensured by not damaging the lowermost end of the solder ball.
Japanese Patent Application Laid-Open No. 11-242977. Japanese Patent Laid-Open No. 2000-235062.

  However, in such a conventional apparatus, since the tab film 15 is disposed on the lower surface of the pressing jig body 20, the pressing jig body 20 and the tab film 15 are placed at predetermined positions on the base plate 14. When trying to arrange, it has to be arranged individually step by step, and the arrangement work becomes complicated. In addition, since the base plate 14 is disposed below the tab film 15 and the base plate 14 is electrically connected to the printed circuit board 12, the number of parts is increased, and the thickness of the base plate 14 is increased by the IC. The height of the socket 11 will become high.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a socket for electrical parts that eliminates the base plate, reduces the number of parts, has good workability, and can reduce the height of the socket.

In order to achieve such an object, the invention described in claim 1 is arranged on a wiring board provided with electrodes, accommodates an electric part provided with a terminal, and includes the electric part and the wiring board. An electrical component socket for electrical connection, a socket body for housing the electrical component, and a conductive sheet that is disposed on a bottom surface of the socket body and has a flexibility to be in electrical contact with an electrode of the wiring board The conductive sheet is attached by inserting a predetermined amount of a plurality of locking pieces formed on the peripheral edge of the conductive sheet into a horizontal groove-shaped locking portion provided on the bottom surface side of the socket body. By means, it is detachably disposed on the bottom surface of the socket body, the mounting means is when a force corresponding to the sticking force when the conductive sheet is stuck on the wiring board, The conductive sheet is Characterized in that the socket for electrical parts that are configured to deviate from Tsu preparative body.

According to a second aspect of the present invention, there is provided an electrical component that is disposed on a wiring board provided with an electrode, accommodates an electrical component provided with a terminal, and electrically connects the electrical component and the wiring board. The socket includes a socket body that houses the electrical component, and a conductive sheet that is disposed on a bottom surface of the socket body and has a flexibility to be in electrical contact with an electrode of the wiring board. Inserts a locking pin protruding from the bottom surface of the socket body into a locking hole formed at a predetermined position, and two opposing side edges of the conductive sheet are formed on the bottom surface side of the socket body. The mounting means is detachably disposed on the bottom surface of the socket body by mounting means that hooks and holds by holding the holding pieces having a substantially L-shaped cross section provided at two opposing positions. Wiring When a force corresponding to the sticking-out force when stuck on a plate is applied, wherein the conductive sheet has a socket for electrical parts that are configured to disengage from the socket body.

According to a third aspect of the present invention, there is provided an electrical component that is disposed on a wiring board provided with an electrode, accommodates an electrical component provided with a terminal, and electrically connects the electrical component and the wiring board. The socket includes a socket body that houses the electrical component, and a conductive sheet that is disposed on a bottom surface of the socket body and has a flexibility to be in electrical contact with an electrode of the wiring board. Is detachably disposed on the bottom surface of the socket body by an attachment means that is locked by an adhesive interposed between the conductive sheet and the bottom surface of the socket body, and the attachment means includes the conductive sheet that but that when the force corresponding to the sticking-out force when stuck on the wiring board is applied, the conductive sheet has a socket for electrical parts that are configured to disengage from the socket body And butterflies.

  According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, the conductive sheet has a central contact portion connected to the electrical component side on the central portion side of the upper surface. And a peripheral contact portion that is connected to the central contact portion via a wiring and is electrically connected to an electrode of the wiring board.

  In the invention according to claim 5, in addition to the structure according to claim 4, a sheet-like elastic member is interposed between a portion of the conductive sheet where the peripheral contact portion is provided and the socket body. It is characterized by that.

According to the first aspect of the present invention, there is provided a conductive sheet that is disposed on the bottom surface of the socket body that accommodates the electrical component and has a flexibility to be electrically connected to the electrode of the wiring board. Attaches and detaches to the bottom surface of the socket body by mounting means for locking by inserting a predetermined amount of a plurality of locking pieces formed on the peripheral edge of the locking piece into a lateral groove-shaped locking portion provided on the bottom surface side of the socket body. The attachment means is configured so that the conductive sheet is detached from the socket body when a force corresponding to the sticking force when the conductive sheet is stuck on the wiring board is applied. Therefore, the base plate is abolished, the number of parts is reduced, and the height of the socket can be reduced. In addition, since the conductive sheet is disposed on the bottom surface of the socket body by the attaching means, it is easier to handle compared to the case where it is separated, and the workability of the electrical component socket can be improved. Further, when the socket body is removed from the wiring board with the conductive sheet adhered to the wiring board side, the attachment means is detached from the bottom surface of the socket body when a force corresponding to the sticking force is applied. Therefore, without applying excessive force to the conductive sheet, the conductive sheet is detached from the socket body and remains on the wiring board side. Can be reused. Further, it is possible to dispose the wiring board on the bottom surface of the socket body so as to come off when a force corresponding to the affixing force is applied with a mounting means having a simple configuration that simply provides the locking piece and the locking portion. it can.

According to the second aspect of the present invention, the conductive sheet is provided on the bottom surface of the socket main body that houses the electrical component and has a flexibility to be electrically connected to the electrode of the wiring board. Inserts a locking pin projecting from the bottom surface of the socket body into a locking hole formed at a predetermined position, and two opposing side edges of the conductive sheet are opposed to the bottom surface side of the socket body. It is detachably disposed on the bottom surface of the socket body by an attaching means that is hooked to a holding piece having a substantially L-shaped cross section provided at a location, and the conductive sheet is attached to the wiring board. Since the conductive sheet is configured to be detached from the socket body when a force equivalent to the sticking force is applied, the base plate is eliminated, the number of parts is reduced, and the height of the socket is reduced. Kill. In addition, since the conductive sheet is disposed on the bottom surface of the socket body by the attaching means, it is easier to handle compared to the case where it is separated, and the workability of the electrical component socket can be improved. Further, when the socket body is removed from the wiring board with the conductive sheet adhered to the wiring board side, the attachment means is detached from the bottom surface of the socket body when a force corresponding to the sticking force is applied. Therefore, without applying excessive force to the conductive sheet, the conductive sheet is detached from the socket body and remains on the wiring board side. Can be reused. In addition, the mounting means is simply configured to provide a locking hole, a locking pin, and a holding piece, and the wiring board is disposed on the bottom surface of the socket body so that it is removed when a force corresponding to the sticking force is applied. can do.

According to the third aspect of the present invention, the conductive sheet is provided on the bottom surface of the socket main body that accommodates the electrical component and has the flexibility to be electrically connected to the electrode of the wiring board. Is detachably disposed on the bottom surface of the socket body by an attachment means that is locked by an adhesive interposed between the conductive sheet and the bottom surface of the socket body. Since the conductive sheet is configured to be detached from the socket body when a force equivalent to the sticking force applied to the socket is applied, the base plate is eliminated and the number of parts is reduced. Can be reduced. In addition, since the conductive sheet is disposed on the bottom surface of the socket body by the attaching means, it is easier to handle compared to the case where it is separated, and the workability of the electrical component socket can be improved. Further, when the socket body is removed from the wiring board with the conductive sheet adhered to the wiring board side, the attachment means is detached from the bottom surface of the socket body when a force corresponding to the sticking force is applied. Therefore, without applying excessive force to the conductive sheet, the conductive sheet is detached from the socket body and remains on the wiring board side. Can be reused. Moreover, since the attachment means is an adhesive interposed between the bottom surface of the socket body and the conductive sheet, the wiring board can be applied to the bottom surface of the socket body with a simple operation simply by applying the adhesive. It can be arranged so as to be disengaged when a corresponding force is applied.

  According to the invention of claim 4, the conductive sheet is provided with a central contact portion that is electrically connected to the terminal side of the electrical component on the central portion side of the upper surface, and the central contact point on the peripheral portion side of the lower surface. Since the peripheral contact portion that is connected to the portion via the wiring and is electrically connected to the electrode of the wiring board is provided, the pitch of the peripheral contact portion can be wider than the pitch of the central contact portion. Manufacturing is easy and inexpensive.

  According to the fifth aspect of the present invention, since the sheet-like elastic member is interposed between the portion where the peripheral contact portion of the conductive sheet is provided and the socket body, the conductive member is made conductive by the urging force of the elastic member. A contact pressure between the peripheral contact portion of the sheet and the electrode of the wiring board can be ensured.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 13 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 31 in the figure denotes an IC socket as an “electrical component socket”. By holding an IC package 33 as an “electrical component” in the IC socket 31, an electrical connection with the wiring board 32 is achieved. To connect to.

  As shown in FIG. 13, this IC package 33 is a so-called BGA (Ball Grid Array) type, and a large number of substantially spherical solder balls as “terminals” are provided on the lower surface of a rectangular package body 33b. 33a are arranged in a matrix in columns and rows.

  In short, the IC socket 31 has an expansion sheet 35 as a “conductive sheet” in which the wiring substrate 32 and the IC package 33 are arranged on opposite surfaces, and the wiring is provided via the expansion sheet 35. The substrate 32 and the IC package 33 are configured to be electrically connected. On the expansion sheet 35, an elastic member 37, a pressing jig 38 as a “socket body”, and an alignment plate 39 are provided. Yes. A clamping member 34 is provided below the wiring board 32.

  Then, the wiring board 32, the expansion sheet 35, and the elastic member 37 are attached by bolts 41 and nuts 42 while being sandwiched from the upper and lower sides (both sides) by the clamping member 34 and the pressing jig 38. Yes.

  More specifically, as shown in FIGS. 7 and 8, the expansion sheet 35 is configured such that the IC package 33 is accommodated in the central portion of the upper surface, and has a rectangular shape that is substantially the same size as the sandwiching member 34. It is formed in a thin sheet shape (film shape). The expansion sheet 35 is provided with a central contact portion 35a that is in pressure contact with the solder ball 33a of the IC package 33 on the central portion side of the upper surface, and on the peripheral portion side of the lower surface via the central contact portion 35a via wiring. A peripheral contact portion 35b that is connected and electrically connected to the electrode 32a of the wiring board 32 is provided.

  As shown in FIG. 8, the peripheral contact portions 35b are arranged in four rows corresponding to the electrodes 32a of the wiring board 32, and the electrodes 32a of the wiring board 32 abut on the peripheral contact portions 35b to be electrically connected. (See FIG. 9).

  Further, the expansion sheet 35 is formed with positioning holes 35f, and a plurality of locking pieces 35e, which are one component of the “attachment means”, are formed at the peripheral edge. As shown in FIG. 6, the pressing jig 38 is locked and held by a locking portion 48 h that is a component of “attachment means” formed on the pressing jig main body 48 of the pressing jig 38.

  This locking force is set so as to be released when a predetermined force is applied to the expansion sheet 35. The predetermined force corresponds to a sticking force when the expansion sheet 35 is stuck on the wiring board 32.

  Further, the elastic member 37 is formed by forming a sheet made of silicone rubber into a rectangular frame shape (half is shown in FIG. 10), and as shown in FIGS. 2 and 3, a peripheral contact portion 35b of the expansion sheet 35 is formed. Between the surface portion of the formed portion and a frame-shaped pressing jig main body 48 which will be described in detail later, it is arranged in a state elastically deformed by a predetermined amount in the vertical direction (thickness direction).

  The pressing jig 38 has a rectangular frame-shaped pressing jig main body 48 as shown in FIGS. 1 to 2 and the like, and a cover member 49 is rotated by a shaft 50 in the pressing jig main body 48. It is freely attached and is biased by the spring 51 in the opening direction (clockwise in FIGS. 2 and 3).

  As shown in FIGS. 1 to 3, the pressing jig main body 48 has an inner opening 48 a for accommodating the IC package 33 formed inside the frame shape, and a bolt hole 48 b through which the bolt 41 is inserted. A plurality of positioning pins 48e that are formed and are fitted into the positioning holes 32c of the wiring board 32 project downward.

  The alignment plate 39 is detachably disposed in the inner opening 48a. The alignment plate 39 also has a frame shape as shown in FIGS. 1 and 2, and the outer peripheral surface of the package body 33b of the IC package 33 is positioned in the inner opening as shown in FIGS. It is configured to be stored in a state.

  Specifically, as shown in FIGS. 1 to 3, the alignment plate 39 is formed with a stepped portion 39 a at the outer peripheral edge, and the stepped portion 39 a is engaged with the lower inner peripheral edge 48 c of the pressing jig body 48. In this way, the pressing jig body 48 is detachably attached.

  A tapered guide surface 39b is formed on the inner peripheral edge of the frame shape of the alignment plate 39 so as to guide the IC package 33 on the upper side, and the IC package guided by the guide surface 39b. A positioning surface 39c that positions and accommodates 33 at a predetermined position is formed along the vertical direction continuously below the guide surface 39b.

  Further, the alignment plate 39 is provided with a positioning pin 39e on the lower surface side, and the positioning pin 39e is fitted into the positioning hole 35f of the expansion sheet 35 to be positioned.

  On the other hand, as shown in FIGS. 2 and 3, the cover member 49 is provided with a pusher 53 and a pad 54 that press the IC package 33. The pusher 53 is disposed in the recess 49a of the cover member 49 so as to be movable up and down in FIG. 3, and is urged downward by a plurality of springs 55, and a spherical convex portion 53a is formed at the center of the lower surface portion. Projected.

  The pad 54 is formed with a spherical concave portion 54a with which the spherical convex portion 53a abuts, and a long hole 54b extending in the vertical direction is formed on both sides of the concave portion 54a. . The two shafts 56 attached to the cover member 49 are inserted into the long holes 54b, respectively, and the pad 54 is swingable around the contact portion with the convex portion 53a of the pusher 53. It is supported.

  Further, the shaft 56 is detachably attached to the cover member 49, and the pad 54 can be replaced by removing the shaft 56. A pressing surface 54 c having substantially the same size as the upper surface of the IC package 33 is formed at the lower end portion of the pad 54. As shown in FIG. 2, the pressing surface 54 c is formed to be smaller than the inner opening of the alignment plate 39 (an opening formed by a positioning surface 39 c that is continuous in a square shape).

  Furthermore, between the pad 54 and the pusher 53, as shown in FIGS. 2 and 3, a spring 57 is disposed on the side away from the shaft 50 (left side in FIGS. 2 and 3). The side of the pad 54 that is separated from the shaft 50 is pressed by the spring 57 and is urged against the pusher 53 in the counterclockwise direction in FIGS.

  Further, as shown in FIG. 3, the pressing jig body 48 is formed with a locked portion 48d, while the cover member 49 is provided with a latch member 60 locked to the locked portion 48d. The latch member 60 is rotatably arranged by a shaft 61, and is urged counterclockwise (locking direction) in FIGS.

  On the other hand, the wiring board 32 is formed with an opening 32b in a range corresponding to the back surface side of the central contact portion 35a of the expansion sheet 35, and around the opening 32b to the peripheral contact portion 35b of the expansion sheet 35. An electrode 32a to be connected is formed (see FIG. 12).

  As shown in FIGS. 2, 3 and 11, the clamping member 34 is a quadrangular shape with a predetermined thickness, a bolt hole 34a is formed, and an opening 32b of the wiring board 32 is formed at the center. An elastic member 34c that contacts the back side of the central contact portion 35a of the expansion sheet 35 is disposed. The elastic member 34c is made of silicone rubber, has elasticity, and is formed in a square plate shape.

  Further, a position restricting portion 34d to be inserted into the opening 32b of the wiring board 32 is formed around the elastic member 34c so as to protrude into a rectangular frame shape, and the position restricting portion 34d is formed on the holding member 34. It is fitted and positioned in the fitting recess 39d of the alignment plate 39.

  Furthermore, as shown in FIGS. 2 and 3, a nut 42 that is screwed into the bolt 41 is disposed on the holding member 34 so as not to rotate.

  Then, the bolt 41 is inserted into the bolt hole 48 b of the pressing jig body 48, the notch 35 g of the expansion sheet 35, the bolt hole 32 d of the wiring board 32, and the bolt hole 34 a of the clamping member 34, and screwed into the nut 42. By doing so, they are fixed in a superposed state.

  Next, how to use the IC socket 31 will be described.

  First, the IC socket 31 is disposed on the wiring board 32. In this case, the clamping member 34 is disposed below the wiring board 32, and the position restricting portion 34d is inserted into the opening 32b of the wiring board 32 so as to protrude upward.

  On the other hand, as shown in FIG. 6, the expansion sheet 35 is disposed at a predetermined position on the wiring board 32 in a state where the expansion sheet 35 is engaged with the engagement portion 48 h of the lower surface portion of the pressing jig body 48. In this case, since the flexible expansion sheet 35 is locked to the lower surface portion of the pressing jig main body 48, the handling is easier and the arrangement workability is improved as compared with the case where it is separated. be able to.

  Then, the wiring board 32 is fixed by a bolt 41, a nut 42, and the like in a state where the wiring board 32 is sandwiched between the holding member 34 and the pressing jig 38.

  Accordingly, the peripheral contact portion 35b of the expansion sheet 35 is pressed and electrically connected to the electrode portion 32a of the wiring board 32.

  Next, the IC package 33 is set in the IC socket 31 thus arranged as follows.

  That is, with the cover member 49 of the pressing jig 38 opened, the IC package 33 is inserted into the pressing jig main body 48 and accommodated on the expansion sheet 35. At this time, the peripheral edge portion of the IC package 33 is guided by the guide surface 39b of the alignment plate 39 and positioned at a predetermined position.

  In this state, each solder ball 33a of the IC package 33 is brought into contact with the central contact portion 35a on the upper surface of the expansion sheet 35.

  Next, when the cover member 49 of the pressing jig 38 is closed, the latch member 60 is locked to the locked portion 48d of the pressing jig main body 48, and the cover member 49 is completely closed.

  As a result, the upper surface of the IC package 33 is pushed by the pad 54, the solder ball 33a of the IC package 33 is pressed against the center contact portion 35a of the expansion sheet 35, and the elastic member 34c is elastically deformed, and this reaction force Thus, the solder ball 33a and the central contact portion 35a are electrically connected with a predetermined contact pressure.

  As a result, the IC package 33 is electrically connected to the wiring board 32 via the expansion sheet 35. In particular, when the density of a large number of solder balls 33a of the IC package 33 is dense, if it is intended to directly connect the solder balls 33a to the wiring board 32, high accuracy is required for the production of the wiring board 32. Therefore, here, by extending a wiring (not shown) around the center contact portion 35a at the center portion of the expansion sheet 35 and providing a peripheral contact portion 35b at the peripheral portion, the periphery of the extension sheet 35 is larger than the pitch of the center contact portion 35a. The pitch of the contact portions 35b can be widened. Therefore, the pitch of the electrodes 32a of the wiring board 32 connected to the peripheral contact portion 35b can be increased, and the manufacturing of the wiring board 32 and the like is facilitated.

  In this state, a burn-in test is performed. The peripheral contact portion 35b of the expansion sheet 35 may stick to the electrode 32a of the wiring board 32 due to a temperature rise or the like during the burn-in test. In this state, when the IC socket 31 is removed from the wiring board 32 for replacement of the IC socket 31 or the like, a predetermined force acts on the expansion sheet 35 due to the attachment. As a result, the locking piece 35e of the expansion sheet 35 is detached from the locking portion 48h of the pressing jig main body 48, and the IC socket 31 is removed in a state where the expansion sheet 35 remains attached to the wiring board 32. be able to.

  If it tries, it can prevent tearing by forcibly peeling off the expansion sheet 35, and it can be reused by reattaching the pressing jig 38 on the upper side of the expansion sheet 35 in the stuck state. it can.

  Further, since the peripheral contact portion 35b of the expansion sheet 35 is directly pressed against the electrode 32a of the wiring board 32, the structure can be simplified without the need for providing the pin-type terminal 15b as in the prior art. Further, since it is not necessary to provide the pinching member 34 like the round pin 14a of the base plate 14 of the conventional example, the structure can be simplified in this respect.

  Further, since the expansion sheet 35 is a thin sheet, the entire IC socket 31 can be made more compact.

  Furthermore, since only the expansion sheet 35 is interposed between the IC package 33 and the wiring board 32 and the IC package 33 and the wiring board 32 are electrically connected via the expansion sheet 35, the IC package The number of parts interposed between 33 and the wiring board 32 is small, and the electrical connection between them can be made more reliable.

  Furthermore, the pressing jig 38, the expansion sheet 35, the clamping member 34, and the like are detachably fixed by bolts 41 and nuts 42, and the expansion sheet 35 is sandwiched between the pressing jig 38 and the clamping member 34. Therefore, the extension sheet 35 that is most easily damaged can be easily replaced by simply removing the bolt 41 and the nut 42.

Further, since the sheet-like elastic member 37 is interposed between the portion where the peripheral contact portion 35 b of the expansion sheet 35 is provided and the pressing jig main body 48, the expansion sheet 35 is urged by the urging force of the elastic member 37. The contact pressure between the peripheral contact portion 35b and the electrode 32a of the wiring board 32 can be ensured.
[Embodiment 2 of the Invention]

  14 and 15 show a second embodiment of the present invention.

  The second embodiment is different from the first embodiment in “attachment means”.

  That is, in the first embodiment, as the “attachment means”, the extension sheet 35 is provided with the locking piece 35e, and the pressing jig main body 48 is provided with the locking portion 48h, so that the expansion sheet 35 is attached to the bottom surface of the pressing jig main body 48. In the second embodiment, a locking pin 48f is projected from the bottom surface of the pressing jig body 48, and the locking pin 48f is locked to the locking hole 35h of the expansion sheet 35. The expansion sheet 35 is attached to the bottom surface of the pressing jig main body 48 by hooking the side edge 35j of the expansion sheet 35 on the holding piece 48g having a substantially L-shaped cross section of the pressing jig main body 48. Yes. Even in this case, when a predetermined force is applied to the expansion sheet 35, the locking hole 35h is set to be detached from the locking pin 48f, and the side edge portion 35j is set to be detached from the holding piece 48g.

  Even if it does in this way, the effect similar to Embodiment 1 is acquired. Other configurations and operations are the same as those in the first embodiment.

  In the above embodiment, the present invention is applied to the IC socket 31 for the BGA type IC package 33. However, the present invention is not limited to this, and the LGA (Land Grid Array) type, the PGA (Pin Grid Array) type, etc. The present invention can be applied to an IC package in which terminals are provided on the lower surface of the IC package and IC sockets for IC packages in which terminals are extended from the side of the IC package, such as a QFP (Quad Flat Package) type. it can.

  In addition, the socket for electrical parts of the present invention can be applied to a so-called open top type IC socket or a socket provided with a pusher for pressing the electrical parts on the automatic machine side.

  Furthermore, the “attachment means” is not limited to the structure of the first and second embodiments, and the expansion sheet can be attached to the bottom surface of the socket body using an adhesive instead of the locking portion 42a and the like. . In this case, the adhesive force of the adhesive is set so as to be released when a predetermined force is applied.

  Furthermore, in this embodiment, the expansion sheet 39 is used as the “conductive sheet”, but not limited to this, as long as it is disposed on the upper surface of the wiring board and is electrically connected. A sheet having another structure may be used.

  Further, the peripheral contact portion of the conductive sheet is not limited to that of the embodiment, but may be of a pin shape, and the electrical conductive member is not limited to that of the above embodiment, and has conductivity and stretchability. If it has, it may be formed by elongating a thin plate so as to have a spring property.

  Further, in this embodiment, the clamping member 34 is used, but the clamping member 34 is not always necessary.

It is a top view of the IC socket which concerns on Embodiment 1 of this invention, and is a figure of the state which opened the cover member half. FIG. 3 is a cross-sectional view of the IC socket according to the first embodiment. FIG. 3 is an exploded cross-sectional view of FIG. 2 according to the first embodiment. It is a bottom view of the state which has arrange | positioned the expansion sheet to the pressing jig which concerns on the same Embodiment 1. FIG. FIG. 3 is an enlarged cross-sectional view in a state where the IC package according to the first embodiment is disposed. It is an expanded sectional view which shows the latching state of the expansion sheet which concerns on the same Embodiment 1. FIG. It is a top view of the expansion sheet which concerns on the same Embodiment 1. FIG. It is a bottom view of the expansion sheet which concerns on the same Embodiment 1. It is sectional drawing which shows the connection state of the surrounding contact part of the expansion sheet which concerns on the same Embodiment 1, and the electrode of a wiring board. FIG. 3 is a plan view showing half of the elastic member according to the first embodiment. It is a top view which shows the clamping member which concerns on the same Embodiment 1. FIG. FIG. 3 is a plan view of the wiring board according to the first embodiment. It is a figure which shows IC package, (a) is a front view, (b) is a bottom view. It is the schematic perspective view which looked at the socket main body and expansion sheet which concern on Embodiment 2 of this invention from diagonally downward. It is sectional drawing which shows the latching state of the latching pin which concerns on the same Embodiment 2. It is a disassembled perspective view which shows the IC socket etc. of a prior art example. It is a figure which shows the prior art example, and is sectional drawing of IC socket. It is a figure which shows the prior art example, and is an expanded sectional view which shows the contact state etc. of the solder ball and tab film of IC package.

Explanation of symbols

31 IC socket (socket for electrical parts)
32 Wiring board
32a electrode
33 IC package (electrical parts)
33a Solder ball (terminal)
33b Package body
35 Expansion sheet (conductive sheet)
35a Center contact
35b Ambient contact
35e Locking piece (mounting means)
35h Locking hole (mounting means)
37 Elastic member
38 Pressing jig (socket body)
39 Alignment plate (socket body)
48 Press jig body (socket body)
48f Locking pin (mounting means)
48g Holding piece (mounting means)
48h Locking part (mounting means)

Claims (5)

In an electrical component socket that is disposed on a wiring board provided with an electrode, accommodates an electrical component provided with a terminal, and electrically connects the electrical component and the wiring board;
A socket body that houses the electrical component;
A conductive sheet disposed on the bottom surface of the socket body and having flexibility to be in electrical contact with the electrodes of the wiring board;
The conductive sheet includes a plurality of locking pieces formed on a peripheral edge of the conductive sheet, and is inserted into the horizontal groove-shaped locking portion provided on the bottom surface side of the socket body by a predetermined amount to lock the socket. It is detachably placed on the bottom of the main unit,
The attachment means is configured so that the conductive sheet is detached from the socket body when a force corresponding to a sticking force when the conductive sheet is stuck on the wiring board is applied. Socket for electrical parts. In an electrical component socket that is disposed on a wiring board provided with an electrode, accommodates an electrical component provided with a terminal, and electrically connects the electrical component and the wiring board;
A socket body that houses the electrical component;
A conductive sheet disposed on the bottom surface of the socket body and having flexibility to be in electrical contact with the electrodes of the wiring board;
The conductive sheet is inserted with a locking pin projecting from the bottom surface of the socket body into a locking hole formed at a predetermined position, and two opposite side edges of the conductive sheet are connected to the socket body. It is detachably disposed on the bottom surface of the socket body by an attaching means that engages with a holding piece having a substantially L-shaped cross section provided at two opposite positions on the bottom surface side.
The attachment means is configured so that the conductive sheet is detached from the socket body when a force corresponding to a sticking force when the conductive sheet is stuck on the wiring board is applied. socket for electrical parts to be. In an electrical component socket that is disposed on a wiring board provided with an electrode, accommodates an electrical component provided with a terminal, and electrically connects the electrical component and the wiring board;
A socket body that houses the electrical component;
A conductive sheet disposed on the bottom surface of the socket body and having flexibility to be in electrical contact with the electrodes of the wiring board;
The conductive sheet is detachably disposed on the bottom surface of the socket body by an attachment means that is locked by an adhesive interposed between the conductive sheet and the bottom surface of the socket body.
The attachment means is configured so that the conductive sheet is detached from the socket body when a force corresponding to a sticking force when the conductive sheet is stuck on the wiring board is applied. socket for electrical parts to be.   The conductive sheet is provided with a central contact portion connected to the electrical component side on the central portion side of the upper surface, and connected to the central contact portion on the peripheral edge side of the lower surface via the wiring. The electrical component socket according to claim 1, further comprising a peripheral contact portion that is in electrical contact with the electrode.   The electrical component socket according to claim 4, wherein a sheet-like elastic member is interposed between a portion where the peripheral contact portion of the conductive sheet is provided and the socket body.

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