JP4802053B2 - Socket for electrical parts - Google Patents

Description

  The present invention restricts the position of the movable-side contact portion of a contact pin that is detachably held by an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), in particular, a contact pin that is in contact with a terminal of the electrical component. The present invention relates to a socket for an electrical component which has been improved to perform.

  Conventionally, as this type of “socket for electrical parts”, there is an IC socket that detachably holds an IC package that is an “electrical part” (see FIG. 9).

  This IC package 6 is a so-called gull wing type, and a plurality of IC leads 6a which are “terminals” project in a crank shape from two opposite sides of a substantially rectangular parallelepiped package body 6b. ing.

  On the other hand, in the IC socket, a housing portion 1 a for housing the IC package 6 is formed in the socket body 1, and a plurality of contact pins 2 that are in contact with the IC leads 6 a of the IC package 6 are disposed. The contact pin 2 has a movable contact piece 3, and a movable side contact portion 3 a that is separated from and in contact with the upper surface of the IC lead 6 a is formed on the movable contact piece 3. A mold guide 1b that supports the lower surface of 6a and guides the periphery of the IC package 6 is formed.

  An operation member 4 is disposed in the socket body 1 so as to be movable up and down, and the operation member 4 is lowered against the urging force of the movable contact piece 3 of the contact pin 2 to thereby move the operation member 4. 4, the operation piece 3b of the movable contact piece 3 of the contact pin 2 is pressed outward.

  As a result, the spring portion 3c of the movable contact piece 3 of the contact pin 2 is elastically deformed to separate the movable contact portion 3a from the IC lead 6a, and the operating member 4 is lifted, whereby the spring portion. The movable contact portion 3a is restored by the elastic force of 3c and comes into contact with the upper surface of the IC lead 6a. The IC lead 6a is sandwiched between the movable contact portion 3a and the mold guide 1b, and the contact pin 2 The IC lead 6a is electrically connected.

  Further, in a state where the IC package 6 is not accommodated on the socket body 1 (non-accommodated state), the movable side contact portion 3a comes into contact with the mold guide 1b. The mold guide 1b is formed to be relatively narrow so that it can be inserted between the vertical portion of the crank-shaped IC lead 6a and the package body 6b.

As this kind of thing, there exists a thing as described in patent document 1. FIG.
Japanese Patent Laid-Open No. 11-26127.

  However, in such a conventional device, when the IC package 6 is not accommodated, the tip of the movable contact portion 3a is formed on the mold guide 1b of the socket body 1 so as to be landed. When the metal movable side contact portion 3a comes into contact with the synthetic resin mold guide 1b, the mold guide 1b is damaged or the tip of the movable side contact portion 3a is slightly displaced or slid. In this case, the distal end of the movable contact portion 3a can easily fall off from the distal end portion of the narrow mold guide 1b, and if it falls off, the contact pin 2 itself can be damaged.

  Accordingly, an object of the present invention is to provide a socket for an electrical component that restricts the position of the movable contact portion and prevents damage to a mold guide or the like.

In order to achieve such an object, the invention described in claim 1 includes a socket body in which an electrical component having a crank-shaped terminal extending sideward is accommodated, and a contact pin attached to the socket body, to the contact pins is a movable contact piece which is elastic deformation stationary strips is formed, the distal end portion of the movable contact piece, the movable contact portion upper surface to contact away the shoulder of the electrical part terminals is formed The stationary contact piece is formed with a stationary contact portion that contacts a lower surface side of a shoulder portion of the terminal of the electrical component in the accommodated state of the electrical component, and the movable side in the accommodated state of the electrical component. The contact portion and the fixed side contact portion are configured to sandwich the shoulder portion of the terminal , and the movable contact piece is formed with a position restricting portion in the vicinity of the movable side contact portion, and the movable contact portion is formed. When the piece is closed by elastic force, In non-accommodating state, the position regulating portion is brought into contact with the stopper portion, performs position restriction of the movable contact part, the movable-side contact portion is the upper end portion of the fixed contact part, of the terminal The electrical component socket is configured to be separated by a distance smaller than the thickness.

The invention according to claim 2 is characterized in that, in addition to the configuration according to claim 1, the stopper portion is formed in the socket body .

The invention according to claim 3 is characterized in that, in addition to the configuration according to claim 1 , the stopper portion is formed on the fixed contact piece .

  According to the invention described in each claim, when the movable contact piece is closed by an elastic force, the position restricting portion comes into contact with the stopper portion in a non-accommodating state of the electric component, thereby restricting the position of the movable contact portion. The movable contact portion is separated from the upper end of the electrical component guide portion or the fixed contact portion by a distance smaller than the thickness of the terminal. It is possible to prevent the contact portion from falling off from the upper end, and it is possible to prevent damage to the contact pin, the electrical component guide portion, and the like.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 7 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 12 that is an “electrical component”. The IC lead 12b as the “terminal” 12 is electrically connected to the wiring board (not shown) of the measuring instrument (tester).

  As shown in FIG. 7, the IC package 12 is a so-called gull wing type, and includes a large number of IC leads from four sides to a side of a rectangular package body 12 a as an “electric component body”. 12b protrudes. The IC lead 12b is formed in a crank shape, and a shoulder portion 12d is formed on the vicinity of the package body 12a so as to be one step higher than the tip portion 12c side.

  On the other hand, the IC socket 11 generally includes a socket body 13 mounted on the wiring board. The socket body 13 is formed with a housing portion 13a for housing the IC package 12, and the IC package 12 A guide portion 13b is provided corresponding to each corner of the package body 12a. Also, as shown in FIG. 3, partitioning portions 13c are formed on the four opposing sides around the accommodating portion 13a between the guide portions 13b, and a number of slits 13d are formed at predetermined intervals in the partitioning portion 13c. It is formed with. Further, the socket body 13 is formed with a mold guide 13h for guiding the package body 12a, and a number of slits 13j are formed in the mold guide 13h at predetermined intervals.

  The socket body 13 is provided with a plurality of elastically deformable contact pins 15 that are separated from and in contact with the IC leads 12b, and a rectangular frame-shaped operation member 16 that elastically deforms the contact pins 15 It is arranged freely.

  The contact pin 15 is made of a material having elasticity and excellent electrical conductivity, and is press-fitted and disposed in an outer position of the accommodating portion 13a of the socket body 13 as shown in FIG.

  Specifically, as shown in FIG. 2, the contact pin 15 is formed with a fixing portion 15 a fixed to the socket body 13 on the lower side, and the fixing portion 15 a is press-fitted and fixed to the press-fitting hole 13 e of the socket body 13. . A fixed contact piece 15b and a movable contact piece 15c project from the fixed portion 15a upward.

  The fixed contact piece 15b is formed with a fixed-side contact portion 15d that contacts the lower surface of the IC lead 12b at the upper end portion. As shown in FIG. 2 and the like, the fixed-side contact portion 15d has a substantially triangular shape, is inserted into an insertion hole 13f formed in the socket body 13, and the locking portion 15e is locked to the socket body 13. Are inserted into the slits 13j of the mold guide 13h. Then, the upper end portion of the fixed side contact portion 15d faces upward, projects slightly upward from the upper end portion of the mold guide 13h, and the shoulder of the IC lead 12b extends to the narrow upper end portion of the fixed side contact portion 15d. The part 12d is placed and brought into contact therewith.

  Further, as shown in FIG. 1, a locking projection 15k is formed on the fixed contact piece 15b near the lower side of the fixed-side contact portion 15d, and the locking projection 15k is formed on the socket body 13. It is locked to the locking recess 13k to restrict upward movement.

  On the other hand, the movable contact piece 15c is formed with a spring portion 15f that is curved in a substantially S shape, and a movable side contact portion 15g is extended above the spring portion 15f toward the central portion of the socket body 13. ing. The movable-side contact portion 15g is configured such that the IC lead 12b is sandwiched between the fixed-side contact portion 15d of the fixed contact piece 15b by contacting the upper surface of the IC lead 12b and pressing it downward. .

  Further, the contact pin 15 is provided with an operation piece 15h that is pressed by an operation member 16 to be described in detail later and branched upward from the movable side contact portion 15g side. In addition, below the fixed portion 15a, a lead portion 15i connected to a wiring board (not shown) is extended downward.

  Further, the movable contact piece 15c is formed with a convex position restricting portion 15j near the lower side of the movable contact portion 15g. When the movable contact piece 15c is closed by an elastic force, the IC package 12 is not accommodated. In this state, the position restricting portion 15j comes into contact with the stopper portion 13g formed on the socket body 13 to restrict the position of the movable side contact portion 15g, and the movable side contact portion 15g becomes the upper end of the fixed side contact portion 15d. It is configured to be separated from the portion by a distance H smaller than the thickness T of the IC lead 12b.

  On the other hand, the operation member 16 has a rectangular frame shape corresponding to the shape of the IC package 12, and has an opening 16a of a size that allows the IC package 12 to be inserted. The IC package 12 is inserted through the opening 16a. Thus, the socket body 13 is accommodated on the upper side of the accommodating portion 13a. The operation member 16 is disposed so as to be movable up and down with respect to the socket body 13 and is urged upward by a coil spring (not shown), and a locking claw (not shown) is attached to the socket body 13 at the highest position. The operation member 16 is prevented from coming off by being locked by the locked portion.

  Further, the operation member 16 is formed with a cam portion 16c slidably contacting the operation piece 15h of the contact pin 15. By lowering the operation member 16, the operation piece 15h of the contact pin 15 is brought into contact with the cam portion 16c. By being pressed, the spring portion 15f is elastically deformed and the movable contact portion 15g is displaced obliquely upward and outward.

  Next, a method of using the IC socket 11 having such a configuration will be described.

  First, the lead portions 15i of the contact pins 15 of the IC socket 11 are inserted into the insertion holes of the wiring board and soldered in advance, thereby arranging the plurality of IC sockets 11 on the wiring board.

  Then, the IC package 12 is set and electrically connected to the IC socket 11 by, for example, an automatic machine as follows.

  That is, the IC package 12 is transported by an automatic machine, and the operation member 16 is moved from the state shown in FIG. 4 with the automatic machine in a state where the IC package 12 is held above the housing portion 13a of the socket body 13. The contact pin 15 is pressed downward and lowered against the biasing force of the contact pin 15 and the biasing force of a coil spring (not shown). Then, the contact pin operation piece 15h is pressed by the cam portion 16c of the operation member 16, the spring portion 15f is elastically deformed, and the movable contact portion 15g is displaced obliquely upward and opened to the maximum extent, so that the IC package can be opened. Evacuated from 12 insertion range.

  In this state, when the IC package 12 is released from the automatic machine, the IC package 12 is guided and accommodated on the accommodating portion 13 a of the socket body 13 by the guide portion 13 b, and the shoulder portion 12 d of the IC lead 12 b of the IC package 12 is fixed to the contact pin 15. It will be in the state contacted on the side contact part 15d (refer FIG. 5).

  Next, when the pressing force of the operation member 16 by the automatic machine is released, the operation member 16 rises due to the elastic force of the spring portion 15f of the movable contact piece 15c of the contact pin 15 and the coil spring and the like, and due to the elastic force of the spring portion 15f. The movable contact portion 15g of the contact pin 15 begins to return. When the operation member 16 is raised to a predetermined position, the movable side contact portion 15g of the contact pin 15 comes into contact with the upper surface of the shoulder portion 12d of the predetermined IC lead 12b of the positioned IC package 12 to electrically (See FIG. 6).

  In this state, the burn-in test of the IC package 12 is performed.

On the other hand, when the operation member 16 is raised in a state where the IC package 12 is not accommodated, the movable contact portion 15g of the movable contact piece 15c has a substantially arc-shaped locus from the obliquely upward position to the obliquely downward position. while moves along a moving locus of the substantially arc shape toward the position regulating portion 15j of even obliquely upper position obliquely downward orientation location.

  When the position restricting portion 15j comes into contact with the stopper portion 13g of the socket main body 13, the movement of the movable side contact portion 15g is restricted, and the movable side contact portion 15g is moved with respect to the upper end portion of the fixed side contact portion 15d. The distance H is less than the thickness T of the IC lead 12b. As a result, the tip of the movable contact portion 15g can be prevented from hitting the upper end of the fixed contact portion 15d, and the tip of the movable contact portion 15g can be prevented from falling off the upper end of the fixed contact portion 15d. The contact pin 15 can be prevented from being damaged. Of course, since the movable side contact portion 15g does not come into contact with the mold guide 13h, the mold guide 13h can be prevented from being damaged.

Further, since the distance H between the movable side contact portion 15g and the upper end portion of the fixed side contact portion 15d in the non-accommodating state of the IC package 12 is smaller than the thickness T of the IC lead 12b, the IC package 12 is accommodated. Then, the movable contact portion 15g is surely in contact with the upper surface of the IC lead 12b.
[ Reference example ]

FIG. 8 shows a reference example .

In the first embodiment, the so-called two-point contact pin 15 having the fixed contact piece 15b and the movable contact piece 15c is provided. However, in this reference example , the fixed contact piece 15b is not provided and the movable contact piece 15b is movable. A so-called one-point contact pin 15 provided with only the contact piece 15c is provided. Further, since the fixed contact piece 15b is not provided, the mold guide 13h which is an “electrical component guide portion” is not formed with the slit 13j into which the fixed side contact portion 15d of the fixed contact piece 15b is inserted. It is not formed in a so-called comb shape, but is formed continuously.

  That is, the movable contact piece 15c is not formed with a convex shape as in the first embodiment, but is formed with a flat position restricting portion 15j. When the IC package 12 is not housed, the position restricting portion 15j is a socket body. 13, the position of the movable contact portion 15 g of the movable contact piece 15 c is regulated, and the distance from the upper end portion of the mold guide 13 h of the socket body 13 is smaller than the thickness T of the IC lead 12 b. It is configured to be separated by H.

  Accordingly, the movable contact portion 15g of the movable contact piece 15c does not come into contact with the upper end of the mold guide 13h, and the movable contact portion 15g does not fall off from the mold guide 13h. Damage and contact pin 15 itself can be prevented.

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

In the above embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices. Further, the IC package 12 is applied to the case where the IC leads 12b protrude from the four sides of the package body 12a, but the IC leads protrude from the two opposite sides of the IC package body toward the side. It can also be applied to packages. Furthermore, the stopper portion is formed on the socket body in each of the above embodiments, but the present invention is not limited to this, and a stopper portion with which the position restricting portion abuts may be formed on the fixed contact piece of the contact pin.

It is a top view of the IC socket which concerns on Embodiment 1 of this invention. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 according to the first embodiment. It is a perspective view which shows the accommodating part etc. of the IC socket which concerns on the same Embodiment 1. FIG. FIG. 6 is a cross-sectional view of the IC socket according to the first embodiment in a state where the operation member is at the highest position in the IC package non-accommodating state. FIG. 8 is a cross-sectional view of the IC socket according to the first embodiment in a state where the operation member is at the lowest position in the IC package housing state. FIG. 6 is a cross-sectional view of the IC socket according to the first embodiment in a state in which the operation member is at the highest position in the IC package housing state. It is a figure which shows IC package, (a) is a top view of IC package, (b) is a front view. It is a half cross-sectional view of an IC socket according to a reference example . It is sectional drawing of the IC socket which shows a prior art example.

Explanation of symbols

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Package body
12b IC lead (terminal)
12d shoulder
13 Socket body
13a containment
13b Guide section
13c Bulkhead
13g Stopper
13h Mold guide (Electric parts guide)
13j slit
15 Contact pin
15b Fixed piece
15c movable contact
15d Fixed side contact area
15f Spring part
15g Movable contact part
15h operation piece
15j Position restriction section
16 Operation member T Thickness H Width

Claims (3)

A socket main body in which an electrical component having a crank-shaped terminal extending in a lateral direction is accommodated, and a contact pin attached to the socket main body, and a movable contact piece elastically deformed with a fixed contact piece. : it is formed, the distal end portion of the movable contact piece, the movable contact part that contacts away the top surface of the shoulder portion of the electrical component terminal is formed, said the stationary contact piece is in a housing state of the electrical component, A fixed-side contact portion that contacts a lower surface side of the shoulder portion of the terminal of the electrical component is formed, and the shoulder portion of the terminal is sandwiched between the movable-side contact portion and the fixed-side contact portion when the electrical component is accommodated is configured to,
The movable contact piece is formed with a position restricting portion in the vicinity of the movable contact portion, and when the movable contact piece is closed by an elastic force, the position restricting portion is a stopper when the electric component is not housed. The movable side contact portion is positioned so as to be in contact with the portion, and the movable side contact portion is separated from the upper end portion of the fixed side contact portion by a distance smaller than the thickness of the terminal. A socket for electrical parts characterized by the above. The electrical component socket according to claim 1, wherein the stopper portion is formed in the socket body . The electrical component socket according to claim 1 , wherein the stopper portion is formed on the fixed contact piece .

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