JP5115518B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic device in which a circuit board is accommodated in a board packing tool that performs electromagnetic wave shielding of the circuit board.

  In various electronic devices, various electromagnetic wave shielding means are taken for measures against EMI (ElectroMagnetic Interference), that is, in order to prevent leakage of electromagnetic waves from the inside and intrusion of electromagnetic waves from the outside.

  As the electromagnetic wave shielding means, a method using a metal casing or a method of providing a conductive layer on the inner surface of a resin casing by electroless plating or the like is general. For example, as shown in Patent Document 1, a method of covering a circuit board accommodated in a housing with a conductive bag has also been proposed.

  In the method disclosed in Patent Document 1, a multilayer sheet in which an insulating layer is disposed on one surface of a conductive layer made of a conductive woven fabric or the like and a heat-sealable insulating layer is disposed on the back surface is used as a heat-sealable insulator. It is folded in half so that the layer is on the inside, and both sides are heat sealed and sewn with conductive thread. Further, the conductor layer is exposed in the remaining opening from which the connector cable is pulled out, and in a state where the circuit board is accommodated, these are fixed with a conductive adhesive tape to form a bag. In this way, a shielding bag is formed from the multilayer sheet, and electromagnetic wave shielding in all directions with respect to the circuit board is achieved.

  By the way, the shielding bag provided with the metal casing, the resin casing plated on the inner surface, and the conductor layer functions as an electromagnetic wave shield by being fixed to the GND potential, that is, grounded. For example, as shown in Patent Document 2 (see FIG. 6), the contact spring made of a metal material ensures a good electrical connection between the above-described metal housing and the GND pattern of the circuit board, while ensuring good electrical connection. A configuration for fixing a body or the like to the GND potential is known.

JP-A-7-245496 JP 2007-314026 A

  In the method using a metal casing, the casing itself becomes heavy, which is against the demand for weight reduction. In addition, the method of providing a conductive layer on the inner surface of a resin casing by electroless plating can reduce the weight compared to a metal casing, but the conductive layer by plating or the like is easily peeled off due to rubbing during manufacture. When the conductive layer is peeled off, there is a problem that the electromagnetic wave shielding effect is lost.

  On the other hand, in the method disclosed in Patent Document 1, since the shielding bag is made of a multilayer sheet including a conductive layer such as a conductive woven fabric, the weight can be reduced as compared with a metal casing. In addition, since the heat-sealable insulating layer forms the inner surface of the bag, the electromagnetic wave shielding effect can be ensured even if there is rubbing or the like during the manufacturing, and the GND of the circuit configured on the circuit board can be secured. Short-circuiting between the part excluding the part fixed to the potential and the shielding bag can be prevented.

  However, in the method shown in Patent Document 1, since the heat-sealable insulating layer forms the inner surface of the bag, the contact spring shown in Patent Document 2 is brought into direct contact with the conductor layer (conductive cloth). I can't. For example, it is conceivable to fix the conductor layer (conductive woven fabric) to the GND potential by means other than the contact spring. However, as in the case of the contact spring, the electrical connection state should be ensured satisfactorily using elastic deformation. Shielding performance may be deteriorated.

  In view of the above problems, an object of the present invention is to provide an electronic device that is lightweight and can ensure an electromagnetic wave shielding effect while preventing a short circuit with a circuit board.

  In order to achieve the above object, an electronic device according to claim 1 includes a circuit board having an electronic component mounted on at least one of a first main surface and a second main surface which is the back surface of the first main surface, and a circuit. A board packing tool that accommodates the board in the internal space and shields the electromagnetic wave of the circuit board, and is made of a metal material and mounted on the first main surface of the circuit board to electrically connect the GND pattern of the circuit board and the board packing tool. And a contact spring connected to the circuit board, wherein the substrate packing device comprises at least a laminated woven fabric of a conductive woven fabric obtained by metal-plating a resin woven fabric and a non-conductive woven fabric made of a resin woven fabric. While including as a site | part which covers the 1st main surface side, the nonelectroconductive woven fabric has comprised the inner surface of the board | substrate packing tool. A conductive relay member is fixed to the laminated woven fabric. The relay member is electrically connected to the conductive woven fabric, and a contact spring is formed on the surface of the non-conductive woven fabric forming the inner surface of the substrate packing device. It is arrange | positioned in the contact part of.

  In the present invention, the substrate packing tool covers at least the first main surface side of the circuit board with a laminated woven fabric of a conductive woven fabric obtained by metal plating a resin woven fabric and a non-conductive woven fabric made of the resin woven fabric. Includes as. Since the main material of the laminated woven fabric is a resin woven fabric, the electronic device can be reduced in weight compared to a conventional metal casing.

  Further, in the laminated woven fabric, since the non-conductive woven fabric forms the inner surface of the substrate packing tool, even if the laminated woven fabric is not particularly formed, it is fixed to the GND potential of the circuit configured on the circuit board. It is possible to prevent a short circuit between the part excluding the part to be attached and the substrate packing tool.

  In addition, since the non-conductive woven cloth forms the inner surface of the board packing tool, when the circuit board is accommodated in the internal space of the board packing tool, the electronic components mounted on the circuit board come into contact with the conductive woven cloth. The peeling of the metal plating layer can be suppressed. The conductive woven fabric constituting the laminated woven fabric is obtained by metal-plating a resin woven fabric, and has a structure in which metal-plated resin fibers are entangled three-dimensionally. That is, the metal plating layer of the conductive woven fabric is not only on the surface of the case like the conductive layer provided on the conventional resin case. Therefore, even if there is rubbing or the like on the conductive woven fabric that forms the outer surface of the substrate packing tool, a part of the metal plating layer of the conductive woven fabric (for example, only the surface) is peeled off, The electromagnetic shielding effect is not easily lost.

  In addition, since the conductive relay member is electrically connected to the conductive woven fabric and disposed at the contact portion of the contact spring on the surface of the nonconductive woven fabric, the nonconductive woven fabric is packaged on the board. Although it is the structure which makes the inner surface of a tool, the electrical connection state of the GND pattern of a circuit board and a board | substrate packing tool (conductive woven fabric) can be favorably ensured by the elastic deformation of a contact spring. That is, the substrate packing tool can be effectively functioned as an electromagnetic wave shield.

  As described above, according to the electronic device of the present invention, it is lightweight and can secure an electromagnetic shielding effect while preventing a short circuit with the circuit board.

  As the relay member, as described in claim 2, a conductive yarn having conductivity may be adopted, and a conductive woven fabric and a non-conductive woven fabric may be sewn by the conductive yarn. According to a third aspect of the present invention, the relay member may be made of a metal material and contacted with the conductive woven fabric and the non-conductive woven fabric to be caulked and fixed to the laminated woven fabric.

  In particular, according to the former (conductive yarn), since a through hole for fixing the relay member to the laminated woven fabric is unnecessary, the manufacturing process can be simplified and the manufacturing cost can be reduced. Moreover, since it is not necessary to provide a through-hole in the laminated woven fabric, the electromagnetic wave shielding effect can be enhanced.

  According to a fourth aspect of the present invention, the contact spring is preferably provided around the connector as a shield of the connector mounted on the circuit board. Thus, when the contact spring functions as a shield for the connector, external noise that enters the circuit board from the outside through the connector can be effectively released to the board packing tool (conductive woven cloth) as GND. Moreover, although the through hole for a connector is provided in the board packaging tool, since the contact spring is located around the through hole, it is possible to effectively shield electromagnetic waves entering and exiting through the through hole.

  As a board | substrate packing tool, the 1st molded object which covers the 1st main surface side of a circuit board as a molded object of laminated woven fabric, for example as described in Claim 5, and the 2nd main surface side of a circuit board It is good also as a structure which consists of a 2nd molded object which covers. According to this, since the board packing tool is composed of two molded bodies, an internal space having a predetermined shape and size can be secured to accommodate the circuit board, and contact between the circuit board and the board packing tool can be suppressed. .

  In addition, as described in claim 6, the part is formed of a laminated woven fabric, and a part covering the first main surface side of the circuit board and a part covering the second main surface side of the circuit board are integrally formed. It is good also as a structure. According to this, while having the same effect as the invention according to the fifth aspect, since the molded body has a so-called egg pack shape, the process of forming the substrate packing tool from the molded body can be simplified.

  Furthermore, as described in claim 7, as a part covering the first main surface side of the circuit board, the metal plate is provided as a part covering the second main surface side of the circuit board while having a molded body of the laminated woven fabric. It is also possible to adopt a configuration having this. According to this, as in the fifth aspect, the contact between the circuit board and the board packing tool can be suppressed. Moreover, although it becomes heavier than the structure of Claims 5 and 6 by the part containing a metal plate, an electronic device can be reduced in weight rather than the conventional metal housing | casing.

  As described in claim 8, it is preferable that the molded body is formed by pressure forming. According to this, a molded object can be manufactured thinly, lightweight and inexpensively. However, in addition to pressure forming, vacuum forming, hot pressing, or the like can be employed.

It is a top view which shows schematic structure of the electronic device which concerns on 1st Embodiment. It is a top view which shows schematic structure of a board | substrate packing tool. It is sectional drawing which follows the III-III line of FIG. It is a figure which shows schematic structure of a relay member, (a) is the top view seen from the outer surface side of the board | substrate packaging tool, b) is sectional drawing which follows the IVb-IVb line | wire of (a). It is a top view which shows the modification of a relay member. It is a figure which shows schematic structure of a relay member among the electronic devices which concern on 2nd Embodiment, (a) is a top view, (b) is sectional drawing which follows the VIb-VIb line | wire of (a). It is a figure which shows the modification of a relay member, (a) is a top view, (b) is sectional drawing which follows the VIIb-VIIb line | wire of (a). It is sectional drawing which shows the other modification of a substrate packing tool. It is sectional drawing which shows the other modification of a substrate packing tool. It is sectional drawing which shows the other modification of an electronic device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a plan view (plan view seen from the first case side) showing a schematic configuration of the electronic device according to the first embodiment. FIG. 2 is a plan view (plan view seen from the first molded body side) showing a schematic configuration of the substrate packing tool. 3 is a cross-sectional view taken along line III-III in FIG. 4A and 4B are diagrams illustrating a schematic configuration of the relay member, in which FIG. 4A is a plan view viewed from the outer surface side of the substrate packing tool, and FIG. 4B is a cross-sectional view taken along line IVb-IVb in FIG. In the following, the thickness direction of the circuit board is simply referred to as the thickness direction.

  As shown in FIGS. 1 to 3, the electronic device 10 includes, as main parts, a circuit board 11 and a board packaging 12 that houses the circuit board 11 in the internal space S <b> 1 and shields the circuit board 11 from electromagnetic waves. The circuit board 11 is mounted with a contact spring 23 for electrically connecting a GND pattern (not shown) of the circuit board 11 and the board packing tool 12. In the present embodiment, a housing 13 is further provided that is made of resin and accommodates the board packing tool 12 including the circuit board 11 in the internal space S2.

  The electronic device 10 according to the present embodiment is a meter control device in which a control circuit of a vehicle meter display unit is configured on a circuit board 11. In addition, the said instrument display part is comprised with the LCD panel which is not illustrated in this embodiment. The internal space S1 corresponds to the internal space described in the claims.

  The circuit board 11 has a wiring board 20 in which wiring (not shown) made of a conductive material such as copper is disposed on an insulating base material mainly made of resin or ceramics. In the present embodiment, a planar rectangular multilayer substrate in which wiring patterns formed by patterning copper foil are arranged in multiple layers on an insulating base material made of glass epoxy resin (glass fiber reinforced epoxy resin) is used as the wiring substrate 20. Adopted.

  A plurality of lands (not shown except for the lands 24 corresponding to the contact springs 23) are provided on the front and back surfaces of the wiring board 20, in other words, on the front surface 11a and the back surface 11b of the circuit board 11. In the central part excluding the peripheral part which is a fixed part to the substrate packing tool 12, electronic parts 21 such as a microcomputer, a power transistor, a resistor, and a capacitor are soldered and mounted on the corresponding land. In the present embodiment, among the electronic components 21, a tall component such as an aluminum electric field capacitor (not shown) is mounted on the front surface 11a side, and a component shorter than the tall component is mounted on the back surface 11b side. The wiring and the electronic component 21 constitute a circuit. Specifically, the circuit board 11 has an LCD controller for controlling each pixel of the LCD panel, a CPU (Central Processing Unit), and the like as a control circuit for the LCD panel. In addition, it has an interface, a memory, etc. (not shown). The front surface 11a corresponds to the first main surface, and the back surface 11b corresponds to the second main surface.

  On the surface 11a of the circuit board 11, the above-described connector 22 has a function of inputting / outputting power, GND, and signals, in other words, a relay function of electrically connecting a circuit configured on the circuit board 11 and an external device. In order to fulfill, it is soldered and mounted on a corresponding land (not shown). In the present embodiment, as an example, the fitting direction of the connector 22 and a connector (not shown) of an external device coincides with the thickness direction, and the terminal 22a of the connector 22 is connected to the wiring board along the thickness direction. 20 is an insertion mounting structure that penetrates through 20 (flow soldering mounting structure). The connector 22 may have a surface mounting structure (reflow soldering mounting structure).

  Further, the contact spring 23 described above is electrically connected to the surface 11a between the GND pattern (not shown) of the wiring of the wiring board 20 fixed to the GND potential and the board packing tool 12, that is, the board. In order to set the packing tool 12 to the GND potential, it is soldered and mounted on the corresponding land 24. The contact spring 23 is formed by processing a metal plate into a predetermined shape so as to have a spring property, and the height from the surface 11a in the thickness direction in a state before being accommodated in the substrate packing tool 12 is high. The height is set to be lower than the height from the surface 11 a to the inner surface 30 d of the first molded body 30 constituting the substrate packing tool 12 in a state where the circuit board 11 is accommodated in the substrate packing tool 12. That is, the contact spring 23 comes into contact with the inner surface 30d of the first molded body 30 in an elastically deformed state in a state in which the circuit board 11 is accommodated in the board packing tool 12.

  Particularly in the present embodiment, the contact spring 23 is disposed around the connector 22, and among the plurality of terminals 22 a of the connector 22, some of the terminals 22 a electrically connected to the shielded wire of the external device, The circuit board 11 corresponding to the terminal 22 a is electrically connected via the land, wiring, and the land 24. That is, the contact spring 23 serves as a shield for the connector 22, and external noise (electrical noise) that enters the circuit board 11 from the outside via the connector 22 is converted into GND by the substrate packing tool 12 (first molded body 30). The conductive woven fabric 12a) is effectively released.

  Furthermore, in this embodiment, the contact spring 23 is annularly arranged so as to surround the connector 22. Specifically, the outer surface of the housing of the connector 22 has a planar rectangular shape as shown in FIGS. 1 and 4A, and four contact spring pieces 23a to 23d (corresponding to the four outer surfaces forming the rectangle). FIG. 4 illustrates contact spring pieces 23a, and contact spring pieces 23b to 23d are not shown. The ends of adjacent contact springs are welded to form an annular contact spring 23. As shown in FIGS. 1 to 4, the substrate packing tool 12 and the housing 13 are provided with through holes 33 and 42 for exposing the connector 22 to the outside. The space S1 is a closed space. That is, the contact spring 23 can effectively shield electromagnetic waves entering and exiting through the through holes 33 and 42.

  Further, in the present embodiment, the insertion hole 25 into which the screws 50 and 52 for fixing the circuit board 11 to the board packing tool 12 are inserted at the edge of the planar rectangular circuit board 11 (wiring board 20). They are provided at a plurality of locations apart from each other. In the present embodiment, as the insertion holes 25, four holes for the screws 50 that fix the substrate packing tool 12 together with the circuit board 11 to the second case 41 constituting the housing 13, and the circuit board 11 to the board packing tool 12. There are four holes for the screw 52 to be fixed to. The four insertion holes 25 for the screws 50 are respectively provided at the centers of the sides of the planar rectangular circuit board 11 at the edges, and the four insertion holes 25 for the screws 52 are planar rectangular at the edges. Are provided at four corners of the circuit board 11 (see FIG. 2).

  As described above, the board packing tool 12 accommodates the circuit board 11 in the internal space S1 and performs electromagnetic wave shielding of the circuit board 11. In this embodiment, the conductive woven cloth obtained by metal plating the resin woven cloth is used. 12a and a non-conductive woven fabric 12b made of a resin woven fabric (non-metal plating) is formed by two molded bodies 30 and 31 formed by molding a non-conductive woven fabric 12b. Inner surfaces 30d and 31d of the packing tool 12 are formed. In addition, as a raw material of the said resin woven fabric, polyester, especially high-strength polyethylene terephthalate (PET), or a polyimide can be employ | adopted, for example.

  The two molded bodies 30 and 31 are respectively formed by laminating and arranging the conductive woven fabric 12a and the non-conductive woven fabric 12b via an adhesive (not shown) and pressure forming. Such molded bodies 30 and 31 maintain a predetermined shape as long as no external force is applied, but have a flexibility to be deformed to some extent when an external force is applied. For example, the thicknesses of the molded bodies 30 and 31 are preferably in the range of 0.1 mm or more and 5 mm or less. When the thickness of the molded bodies 30 and 31 is less than 0.1 mm, the strength for maintaining the predetermined shape is insufficient, and when the thickness of the molded bodies 30 and 31 is greater than 5 mm, the substrate packing 12 However, it becomes the same weight as the conventional resin casing. Furthermore, it is preferable that the thickness of the molded bodies 30 and 31 is in the range of 0.3 mm or more and 1.5 mm or less. When the thickness of the molded bodies 30 and 31 is less than 0.3 mm, there is a risk of bending when the molded bodies 30 and 31 are assembled. When the thickness of the molded bodies 30 and 31 is greater than 1.5 mm Since the amount of deformation in the thickness direction when pressurized is large, for example, fixing work by the screw 50 becomes difficult.

  Of the two molded bodies 30, 31, the first molded body 30 is a part that mainly covers the front surface 11 a side of the circuit board 11, and the second molded body 31 is a part that mainly covers the back surface 11 b side of the circuit board 11. is there. Then, by assembling the two molded bodies 30 and 31 along the thickness direction, the substrate packaging tool 12 having the internal space S1 for accommodating the circuit board 11 is obtained. In the present embodiment, the planar shapes (planar shapes perpendicular to the thickness direction) of the two molded bodies 30 and 31 are both rectangular corresponding to the planar shape (planar rectangular shape) of the circuit board 11. Then, in a state where the annular edge portions 30a and 31a are overlapped with each other (the inner surfaces 30d and 31d are in contact with each other), as shown in FIG. 3, the edge portions 30a and 31a over the entire circumference of the edge portions 30a and 31a. By stitching them together with the conductive thread 35, the bag-like substrate packing tool 12 with the closed end is formed. In other words, the conductive woven fabric 12a that forms the outer surface of the first molded body 30 and the conductive woven fabric 12a that forms the outer surface of the second molded body 31 are formed by the conductive yarn 35 over the entire periphery of the edges 30a and 31a. Are electrically connected to each other, so that the substrate packing 12 performs electromagnetic wave shielding in almost all directions with respect to the circuit board 11 accommodated in the internal space S1. In the present embodiment, the conductive yarn 35 is sewn densely (without a gap) over the entire periphery of the edges 30a and 31a.

  The first molded body 30 has an annular edge portion 30a and a center portion surrounded by the edge portion 30a, and the center portion is recessed with respect to the edge portion 30a. And as this recessed part (center part), it continues to the edge part 30a, and in the state which accommodated the circuit board 11 in internal space S1, at least one part of a recessed part bottom face (inner surface 30d) is the surface 11a of the circuit board 11, and The first recess 30b is in contact, and the second recess 30c has a longer distance between the bottom surface (inner surface) of the recess and the surface 11a of the circuit board 11 than the first recess 30b. That is, the concave portion has a two-stage structure having two concave portions 30b and 30c having different depths with respect to the edge portion 30a.

  The first recess 30b is a portion facing the edge on the surface 11a side of the circuit board 11 in a state in which the circuit board 11 is accommodated in the internal space S1, and with the corresponding first recess 31b of the second molded body 31. Between them, the circuit board 11 is sandwiched and fixed. In the present embodiment, an insertion hole 32 into which the screws 50 and 52 are inserted is provided in the first recess 30 b corresponding to the above-described insertion hole 25.

  The second recess 30c does not contact the electronic component 21 mounted on the surface 11a of the circuit board 11 in a state where the circuit board 11 is accommodated in the internal space S1, and the contact spring 23 contacts the inner surface 30d. , Has a predetermined depth. In the present embodiment, a through-hole 33 for exposing the connector 22 to the outside is formed in the second recess 30c. Corresponding to the contact spring 23, a relay member 36 that relays the electrical connection between the contact spring 23 and the conductive woven fabric 12a is also fixed.

  The relay member 36 is made of a conductive material, and a portion of the conductive woven fabric 12 a that forms the outer surface of the substrate packing tool 12 that covers the surface 11 a of the circuit board 11 to which the contact spring 23 is fixed, that is, the conductivity of the first molded body 30. In addition to being electrically connected to the conductive woven fabric 12a, it is disposed at the contact portion of the contact spring 23 on the surface of the non-conductive woven fabric 12b forming the inner surface 30d. In the present embodiment, as shown in FIGS. 4A and 4B, the relay member 36 is made of conductive thread having conductivity, and is fixed to the second recess 30c surrounding the through hole 33. Yes. Specifically, the relay member 36 made of conductive yarn is fixed to the second recess 30c by sewing the conductive woven fabric 12a and the non-conductive woven fabric 12b around the through hole 33 in the second recess 30c. ing. In the present embodiment, as shown in FIG. 4A, the conductive thread 35 is sewn densely (without a gap) so as to surround the through hole 33. In the assembled state, the joint member 36 and the contact spring 23 disposed on the surface of the non-conductive woven fabric 12b surround the connector 22 and are in contact with each other.

  On the other hand, the 2nd molded object 31 also has the cyclic | annular edge part 31a and the center part enclosed by the edge part 31a, and the center part is dented with respect to the edge part 31a. And as this recessed part (center part), it continues to the edge part 31a, and in the state which accommodated the circuit board 11 in internal space S1, at least one part of a recessed part bottom face (inner surface 30d) is with the back surface 11b of the circuit board 11 The first recess 31b is in contact with the first recess 31b, and the second recess 31c has a longer facing distance between the bottom surface (inner surface) of the recess and the back surface 11b of the circuit board 11 than the first recess 31b. That is, the recess has a two-stage structure having two recesses 31b and 31c having different depths with respect to the edge 31a.

  The first recess 31b corresponds to the first recess 30b described above, and faces the edge on the back surface 11b side of the circuit board 11 in a state where the circuit board 11 is accommodated in the internal space S1, and the first recess 30b The circuit board 11 is sandwiched between and fixed. In the first recess 31b, an insertion hole 34 into which the screws 50 and 52 are inserted is provided corresponding to the insertion hole 25 described above. The insertion hole 34 into which the screw 52 is inserted is a screw hole into which the screw 52 is screwed.

  The second recess 31c corresponds to the second recess 30c described above, and in a state where the circuit board 11 is accommodated in the internal space S1, the second recess 31c does not come into contact with the electronic component 21 mounted on the back surface 11b of the circuit board 11. It has a predetermined depth. In the present embodiment, as described above, since the tall component of the electronic component 21 is mounted on the surface 11a, the depth of the second recess 31c is the depth of the second recess 30c on the first molded body 30 side. It is shallower than the depth.

  The housing 13 is made of a resin material, and is opened and closed in the thickness direction by a first case 40 disposed mainly on the front surface 11a side and a second case 41 disposed mainly on the back surface 11b side with respect to the circuit board 11. It is configured to be possible. And the 1st case 40 and the 2nd case 41 are assembled | attached along the thickness direction, and it becomes the housing | casing 13 provided with the interior space S2 which accommodates the board | substrate packing tool 12 containing the circuit board 11. FIG. As described above, the housing 13 protects the board packing tool 12 including the circuit board 11. In addition, as a resin material which comprises the housing | casing 13, well-known materials, such as an epoxy resin, are employable.

  In the present embodiment, the first case 40 and the second case 41 are configured to be separable (configured as separate members). In addition, the planar shapes (planar shapes perpendicular to the thickness direction) of the two cases 40 and 41 are both rectangular, corresponding to the planar rectangular circuit board 11 and the substrate packing tool 12, and correspond to each other. A plurality of screw holes (not shown) into which the screws 51 are screwed are provided in the annular edges 40a and 41a. Then, one casing 13 is configured by screwing a screw 51 into a matching screw hole (not shown) in a state where the annular edges 40a and 41a are overlapped with each other. As shown in FIG. 1, in the present embodiment, ten fixing portions by the screws 51 are provided at approximately equal intervals.

  The edge part 40a of the 1st case 40 is facing the edge part 41a of the 2nd case 41, as shown in FIG. Moreover, the center part enclosed by the annular edge part 40a becomes the recessed part 40b. The recess 40b has a predetermined depth so as to accommodate the first molded body 30 side in the substrate packing tool 12. In the present embodiment, a through hole 42 for exposing the connector 22 to the outside is formed in the recess 40b. In addition, although it is good also as a structure which the recessed part 40b of the 1st case 40 contacts the 2nd recessed part 30c of the 1st molded object 30, in this embodiment, a structure which has a clearance gap between the recessed part 40b and the 2nd recessed part 30c. It has become.

  On the other hand, also in the second case 41, the central part surrounded by the annular edge part 41a is a concave part, and the concave part continues to the edge part 41a and faces the edge part 31a of the second molded body 31. 1 recessed part 41b, 2nd recessed part 41c which is deeper than 1st recessed part 41b, and opposes 1st recessed part 31b (in other words, peripheral part of the circuit board 11) of the 2nd molded object 31, and 2nd recessed part 41c Deeply, it has the 3rd recessed part 41d facing the 2nd recessed part 31c of the 2nd molded object 31. As shown in FIG. That is, the concave portion has a three-stage structure having three concave portions 41b, 41c, and 41d having different depths with respect to the edge portion 41a.

  As described above, the first concave portion 41 b faces the edge portion 31 a of the second molded body 31, and supports the edge portions 30 a and 31 a including the portion stitched by the conductive thread 35 in the substrate packing tool 12. It has become.

  As described above, the second concave portion 41 c faces the first concave portion 31 b of the second molded body 31, and the first concave portions 30 b and 31 b of the molded bodies 30 and 31 and the peripheral edge of the circuit board 11 in the substrate packing tool 12. Supporting the part. In the present embodiment, screw holes (not shown) are provided in the second recess 41c corresponding to the insertion holes for the screws 50 among the insertion holes 25, 32, and 34 described above. Then, in the state where the second molded body 31, the circuit board 11, and the first molded body 30 are stacked in this order on the second recess 41c, the screw 50 is screwed into the four holes that overlap each other, whereby the circuit board is obtained. 11 is fixed to the two molded bodies 30 and 31, and the board packaging 12 containing the circuit board 11 is fixed to the second case 41 (housing 13).

  As described above, the third recessed portion 41d faces the second recessed portion 31c of the second molded body 31, that is, faces the central portion of the circuit board 11, and accommodates the second molded body 31 side of the substrate packing tool 12. Therefore, it has a predetermined depth. In addition, although it is good also as a structure which the 3rd recessed part 41d of the 2nd case 40 contacts with the 2nd recessed part 31c of the 2nd molded object 31, in this embodiment, it is between the 3rd recessed part 41d and the 2nd recessed part 31c. It has a configuration with a gap.

  Next, a method for assembling the electronic device 10 will be described with reference to FIG. First, the circuit board 11, the molded bodies 30, 31, and the cases 40, 41 are prepared. At this time, the connector 22 and the contact spring 23 are mounted on the circuit board 11 together with the electronic component 21.

  Next, the circuit board 11 is fixed to the board packing tool 12. First, the circuit board 11 is positioned and placed on the second molded body 31. At this time, the peripheral portion of the circuit board 11 is positioned on the first recess 31b, and the circuit board 11 is placed so that the corresponding insertion hole 25 coincides with the insertion hole 34 provided in the first recess 31b. Next, the first molded body 30 is positioned and placed on the second molded body 31 and the circuit board 11 so as to cover the surface 11 a of the circuit board 11. At this time, the edge 30 a of the first molded body 30 is located on the edge 31 a of the second molded body 31, the first recess 30 b is located on the peripheral edge of the circuit board 11, and the insertion hole 25 of the circuit board 11. The corresponding insertion holes 32 are aligned with each other, and the connector 22 is placed so as to pass through the through hole 33 of the second recess 30c. In this state, among the insertion holes 25, 32, and 34, the screws 52 are respectively inserted into the insertion holes 25, 32, and 34 at the four corners corresponding to the screws 52, and the circuit board 11 is inserted into the molded bodies 30 and 31, respectively. Fix it. In this state, the contact spring 23 contacts the relay member 36.

  Next, in a state where the edges 30 a and 31 a of the two molded bodies 30 and 31 are overlapped with each other, the edges 30 a and 31 a are stitched together with the conductive thread 35. In the present embodiment, the entire edges of the annular edges 30a and 31a are sewn tightly (no gaps). Thereby, the bag-shaped board | substrate packing tool 12 with which the edge part was closed is obtained. In addition, the circuit board 11 is fixed to the board packaging tool 12 in the state where the board packaging tool 12 is obtained, and is accommodated in the internal space S1.

  Next, the substrate packing tool 12 is fixed to the second case 41. First, the edges 30a and 31a of the molded bodies 30 and 31 are positioned on the first recess 41b of the second case 41, and the first recesses 30b and 31b of the molded bodies 30 and 31 and the circuit are positioned on the second recess 41c. The substrate packing tool 12 is placed on the second molded body 31 side so that the peripheral edge of the substrate 11 is located and the screw holes of the second case 41 are aligned with the corresponding insertion holes 25, 32, 34 for the screws 50. It is positioned and placed on the second case 41 as the mounting side. Then, in this state, the screws 50 are respectively inserted into the insertion holes 25, 32, 34 and the screw holes corresponding to the screws 50, and the substrate packing tool 12 is fixed to the second case 41.

  Next, the first case 40 is assembled to the second case 41. First, the edge 40a of the first case 40 is positioned on the edge 41a of the second case, the corresponding screw holes (not shown) of the edges 40a and 41a are aligned, and the connector 22 is a through hole of the recess 40b. The first case 40 is positioned and placed on the second case 41 so as to be inserted through the second case 41. In this state, the first case 40 is assembled to the second case 41 with the screw 51. Thus, the electronic device 10 described above can be obtained.

  Next, the effect of the characteristic part of the electronic device 10 according to the present embodiment will be described. First, in this embodiment, the substrate packing tool 12 is constituted by the laminated woven fabric molded bodies 30 and 31 of the conductive woven fabric 12a obtained by metal plating the resin woven fabric and the non-conductive woven fabric 12b made of the resin woven fabric. ing. That is, the main material of the substrate packing tool 12 is a resin woven fabric. The housing 13 is also made of a resin material. Therefore, the electronic device 10 can be reduced in weight as compared with the conventional metal casing.

  Moreover, in the board | substrate packing tool 12, since the nonelectroconductive woven fabric 12b has comprised inner surface 30d and 31d, the site | part fixed to GND electric potential among the circuits (electronic component 21 and wiring) comprised in the circuit board 11 It is possible to prevent a short circuit between the portion except for and the substrate packing tool 12.

  In addition, since the non-conductive woven fabric 12b forms the inner surfaces 30d and 31d of the board packaging tool 12, the circuit board 11 is placed on the circuit board 11 during manufacturing, particularly when the circuit board 11 is accommodated in the internal space S1 of the board packaging tool 12. The mounted electronic component 21 is unlikely to contact the conductive woven fabric 12a, and peeling of the metal plating layer on the conductive woven fabric 12a can be suppressed. The conductive woven fabric 12a is obtained by metal-plating a resin woven fabric, and has a structure in which metal-plated resin fibers are entangled three-dimensionally. That is, the metal plating layers of the molded bodies 30 and 31 including the conductive woven fabric 12a are not only on the surface of the casing such as the conductive layer (inner plating layer) provided on the conventional resin casing. Therefore, even if rubbing or the like occurs in the course of manufacture, a part (for example, only the surface) in the thickness direction of the metal plating layers of the molded bodies 30 and 31 made of the conductive woven fabric 12a is peeled off, and the electromagnetic wave The effect of the shield can be maintained.

  In addition, the conductive relay member 36 is electrically connected to the conductive woven fabric 12a that forms the outer surface of the substrate packaging tool 12, and the non-conductive woven fabric 12b that forms the inner surfaces 30d and 31d of the substrate packaging tool 12. It is arrange | positioned in the contact site | part of the contact spring 23 in the surface. Accordingly, the non-conductive woven fabric 12b forms the inner surfaces 30d and 31d of the substrate packing 12, and the elastic deformation of the contact spring 23 causes the GND pattern of the circuit board 11 and the substrate packing 12 (conductive woven fabric 12a). ) Can be secured well. That is, since the substrate packaging tool 12 and the contact spring 23 are fixed to the GND potential, the substrate packaging tool 12 (and the contact spring 23) can effectively function as an electromagnetic wave shield.

  From the above, according to the electronic device 10 according to the present embodiment, it is lightweight and can secure an electromagnetic wave shielding effect while preventing a short circuit with the circuit board 11. Since the contact spring 23 also functions as an electromagnetic wave shield, it is possible to effectively shield electromagnetic waves that enter and exit the internal space S1 through the through holes 33 and 42 for the connector 22.

  Moreover, in this embodiment, the conductive yarn which has electroconductivity is employ | adopted as the relay member 36, and the electroconductive woven fabric 12a and the nonelectroconductive woven fabric 12b are stitched together by the electroconductive yarn. Accordingly, since a through hole for fixing the relay member 36 to the laminated woven fabric is unnecessary, the manufacturing process can be simplified and the manufacturing cost can be reduced. Moreover, since it is not necessary to provide a through-hole in the laminated woven fabric, the electromagnetic wave shielding effect can be enhanced.

  In the present embodiment, the contact spring 23 is disposed around the connector 22, and among the plurality of terminals 22 a of the connector 22, some of the terminals 22 a electrically connected to the shield wire of the external device The circuit board 11 corresponding to the terminal 22a is electrically connected via the land, wiring, and land 24. That is, the contact spring 23 serves as a shield for the connector 22, and external noise that enters the circuit board 11 from the outside via the connector 22 is effectively applied to the board packing tool 12 (first molded body 30) as GND. I can escape.

  In the present embodiment, since the contact spring 23 is provided around the connector 22, the inner space S <b> 1 is closed by the contact spring 23 while having the through holes 33 and 42. Electromagnetic waves entering and exiting the internal space S1 through the through holes 33 and 42 for the connector 22 can be shielded more effectively. Furthermore, since the land 24 and the contact spring 23 are provided in the vicinity of the connector, compared to the configuration in which the contact spring 23 is provided at a position away from the connector 22, the internal space S1 by the board packing tool 12 and the contact spring 23 is A wide mounting space for the electronic component 21 can be secured.

  Moreover, in this embodiment, since the board | substrate packing tool 12 consists of the two molded objects 30,31, the internal space S1 of a predetermined shape and a size is ensured so that the circuit board 11 may be accommodated, and the circuit board 11 and a board | substrate packing tool. 12 can be suppressed. Thereby, the contact reliability of the electronic component 21 of a circuit board and the board | substrate packing tool 12, for example can be avoided, and the connection reliability of the electronic component 21 can be improved.

  In the present embodiment, the molded bodies 30 and 31 are formed by pressure forming. When the compressed air molding method is used in this way, the molded bodies 30 and 31 can be manufactured thin and lightweight at low cost. However, in addition to pressure forming, vacuum forming, hot pressing, or the like can be employed.

  In the present embodiment, the contact spring 23 and the relay member 36 are shown in an annular shape surrounding the connector 22, but a plurality of contact springs 23 and relay members 36 may be used. In other words, a gap may be provided between adjacent contact springs 23 (relay members 36). However, from the viewpoint of electromagnetic shielding, it is better that the interval between the adjacent contact springs 23 (relay members 36) is shorter, and it is preferable to set the interval to 1/4 or less of the minimum frequency among the frequencies having a large influence. In the example shown in FIG. 5, the plurality of relay members 36 are fixed to the first molded body 30 with a distance d <b> 1 between the adjacent relay members 36. In the vehicular meter control device shown as the electronic device 10 in the present embodiment, the d1 is ¼ or less (about 30 to 40 mm) of the minimum frequency among the frequencies having a great influence. FIG. 5 is a plan view showing a modification of the relay member.

  In the present embodiment, the bag-like substrate packing tool 12 that electrically connects the conductive woven fabrics 12a to each other by the conductive yarn 35 and performs electromagnetic wave shielding at the edges 30a and 31a of the two molded bodies 30 and 31; An example to do. However, the electrical connection between the conductive woven fabrics 12a is not limited to the conductive yarn 35. For example, the conductive woven fabric 12a may be electrically connected to each other by caulking a metal member to form the substrate packing tool 12. In addition, although the example in which the conductive thread 35 is sewn densely (without a gap) over the entire circumference of the edges 30a and 31a has been shown, like the contact spring 23 and the relay member 36 described above, a predetermined interval, specifically, an influence is given. It is also possible to sew (caulk) with an interval of 1/4 or less of the minimum frequency among the large frequencies.

  In the present embodiment, an example in which the electronic component 21 is mounted on the front and back surfaces 11a and 11b of the circuit board 11 is shown. However, a configuration in which the electronic component 21 is mounted on only one of them may be adopted.

(Second Embodiment)
Next, a second embodiment of the present invention will be described based on FIG. 6A and 6B are diagrams illustrating a schematic configuration of the relay member in the electronic device according to the second embodiment, where FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along line VIb-VIb in FIG. is there. FIG. 6 corresponds to FIG. 4 of the first embodiment.

  Since the electronic device shown in the present embodiment is often in common with that according to the first embodiment, the detailed description of the common parts will be omitted below, and different parts will be described mainly. Moreover, in this embodiment, the same code | symbol shall be provided about the same element as 1st Embodiment.

  In the first embodiment, an example of the relay member 36 made of conductive yarn is shown. On the other hand, in this embodiment, the relay member 37 made of a metal material is employed, and the relay member 37 includes the conductive woven fabric 12a and the non-conductive woven fabric, as shown in FIGS. 6 (a) and 6 (b). It is characterized by being caulked and fixed to the laminated woven fabric in contact with 12b.

  In the example shown in FIGS. 6A and 6B, a plurality of (six) through holes 38 are formed in the second recess 30c of the first molded body 30 so as to surround the connector 22 (through hole 33). ing. Then, a relay member 37 (for example, a rivet) made of a metal material is inserted into each through hole 38, and the end of the relay member 37 exposed from the through hole 38 extends in a direction perpendicular to the thickness direction. Then, it is caulked and fixed to the first molded body 30. As such a relay member 37, any known member that is inserted into the through hole and caulked and fixed to the peripheral portion of the through hole can be adopted. For example, the relay member 37 having a head (flange portion) at one end in advance may be inserted into the through hole 38 from the inner surface 30d side, and the other end exposed to the outer surface side may be crushed and fixed.

  In this state, one end portion of the relay member 37 is located on the surface of the non-conductive woven fabric 12 b that forms the inner surface 30 d of the substrate packing tool 12. The contact spring 23 is in contact with the one end portion while being elastically deformed. In the example shown in FIG. 6, the contact spring 23 is also divided into a plurality (six) corresponding to the relay member 37.

  As described above, even when the relay member 37 that is caulked and fixed to the laminated woven fabric (first molded body 30) is used, it is possible to achieve substantially the same effect as the relay member 36 using the conductive yarn shown in the first embodiment. .

  As shown in the modification of the first embodiment (see FIG. 5), in the plurality of contact springs 23 and relay members 37, from the viewpoint of electromagnetic shielding, the adjacent contact springs 23 (relay members 37) The interval is preferably set to an interval equal to or less than ¼ of the minimum frequency among the frequencies having a large influence. In the configuration shown in FIG. 6A, the interval between the adjacent relay members 37 (contact springs 23) is ¼ or less of the minimum frequency among the frequencies having a great influence.

  In the present embodiment, in order to enhance the electromagnetic wave shielding effect, an example in which a plurality of through holes 38 are provided in the first molded body 30 so as to surround the through holes 33 and the relay members 37 are disposed in the respective through holes 38 is shown. . However, in this configuration, since the through hole 38 is necessary, the number of manufacturing steps increases, and the manufacturing cost increases. In addition, since the through hole 38 and the relay member 37 are provided at a position away from the through hole 33, the contact spring 23 is separated from the connector 22, and the internal space S <b> 1 partitioned including the contact spring 23 in the circuit board 11. The mounting area of the electronic component 21 is reduced. Furthermore, if it tries to surround the through-hole 33, the mechanical strength around the through-hole 33 in the first molded body 30 is lowered, and the first molded body 30 may not be able to maintain a predetermined shape.

  On the other hand, in the example shown in FIGS. 7A and 7B, the through hole 33 of the first molded body 30 is provided larger than the through hole 33 shown in FIG. A cylindrical relay member 37 is inserted into the hole 33, and an end portion of the relay member 37 exposed from the through hole 33 is extended in a direction perpendicular to the thickness direction to form the first molded body 30. It is fixed by caulking. In this state, the flange portion 37 a on one end side of the relay member 37 is located on the surface of the non-conductive woven fabric 12 b that forms the inner surface 30 d of the substrate packing tool 12. Further, the through-hole 37b inside the cylinder of the relay member 37 functions as the above-described through-hole 33 in FIG. With such a configuration, the above-described problems can be solved. Furthermore, since the relay member 37 can be disposed in an annular shape surrounding the connector 22, the electromagnetic wave shielding effect can be further enhanced. FIG. 7 is a view showing a modification of the relay member, in which (a) is a plan view and (b) is a cross-sectional view taken along line VIIb-VIIb in (a). FIG. 7 corresponds to FIG.

  In addition, in this embodiment, about structures other than the relay member 37, the structure shown in 1st Embodiment and its modification is applicable.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the said embodiment, the board | substrate packing tool 12 shape | molds the lamination | stacking woven fabric of the electroconductive woven fabric 12a which metal-plated the resin woven fabric, and the nonelectroconductive woven fabric 12b (without metal plating) which consists of a resin woven fabric. An example in which the two molded bodies 30 and 31 are configured and the non-conductive woven fabric 12b forms the inner surfaces 30d and 31d of the substrate packing tool 12 is shown. However, as the substrate packing tool 12, the above-mentioned laminated woven fabric is included as a portion covering the surface 11a side of the circuit board 11 on which the connector 22 and the contact spring 23 are mounted, and the non-conductive woven fabric 12b in the laminated woven fabric is the substrate. The inner surface 30d of the packing tool 12 may be formed.

  For example, as shown in FIG. 8, the substrate packing tool 12 covers a portion 130 (hereinafter simply referred to as a surface portion 130) that covers the front surface 11 a side of the circuit board 11 and a portion 131 (hereinafter referred to as the back surface 11 b side) of the circuit board 11. The back surface portion 131 may be formed as a single body. Also in this substrate packaging tool 12, the molded body is formed by forming a laminated woven fabric of a conductive woven fabric 12a and a non-conductive woven fabric 12b, and the non-conductive woven fabric 12b is formed on the inner surface 130d, 131d. The front surface portion 130 has substantially the same structure as the above-described first molded body 30 and the back surface portion 131 has the same structure as the above-described second molded body 31. In FIG. The code | symbol which added 100 to the code | symbol of is given. The front surface part 130 and the back surface part 131 are connected via a connection part 138. Specifically, only one side of the rectangular shape of the front surface portion 130 and the back surface portion 131 having a planar rectangular shape is connected by the connection portion 138. The connection portion 138 is provided with a notch 138a, which can be bent to form the internal space S1. That is, the substrate packing tool 12 has a so-called egg pack-like structure. The electronic device 10 having such a configuration can be expected to have the same effect as the electronic device 10 described in the above embodiment. Moreover, since the molded body has a so-called egg pack shape, the process of forming the substrate packing tool 12 from the molded body can be simplified. In addition, in FIG. 8, although the example which consists of a conductive thread | yarn is shown as the relay member 136, the thing fixed by crimping is also applicable. FIG. 8 is a cross-sectional view showing another modification of the substrate packing tool, and corresponds to FIG. 3 described above.

  Moreover, as shown in FIG. 9, the board | substrate packing tool 12 has the molded object 230 of the structure substantially the same as the 1st molded object 30 shown in 1st Embodiment as a site | part which covers the surface 11a side of the circuit board 11. As shown in FIG. A configuration may be adopted in which a flat metal plate 231 made of a metal material is provided as a portion covering the back surface 11b side of the circuit board 11. Also in this substrate packaging tool 12, the molded body 230 is formed by molding a laminated woven fabric of the conductive woven fabric 12a and the non-conductive woven fabric 12b, and the non-conductive woven fabric 12b is formed on the inner surface 230d of the substrate packaging device 12. I am doing. In FIG. 9, the code | symbol which added 200 to the code | symbol of the two molded objects 30 and 31 is provided in the corresponding location. As for the circuit board 11 shown in FIG. 9, the electronic component 21 is mounted only in the surface 11a side. In addition, the first recess 41b of the second case 41 is flat with the second recess 41c, that is, the second case 41 has a two-stage recess structure with the edge 41a as a reference. Further, the metal member 235 is caulked and fixed to the edge portion 230a of the molded body 230 and the edge portion 231a of the metal plate 231. As a result, the conductive woven fabric 12a and the metal plate 231 forming the molded body 230 are electrically connected. It is connected to the. The metal member 235 is fixed at a plurality of positions with an interval equal to or less than ¼ of the minimum frequency among the frequencies having a large influence so that the substrate packing tool 12 exhibits an electromagnetic wave shielding effect. The electronic device 10 having such a configuration can be expected to have the same effect as the electronic device 10 described in the above embodiment. The substrate packing tool 12 is composed of a molded body 230 formed by molding a laminated woven fabric of the conductive woven fabric 12a and the non-conductive woven fabric 12b and the metal plate 231. Since the material includes the molded body 230 made of a resin woven fabric, the entire substrate packing tool 12 is heavier than the electronic device 10 made of a laminated woven fabric, but the weight of the electronic device 10 is reduced compared to a conventional metal casing. be able to. FIG. 9 is also a cross-sectional view showing another modification of the substrate packing tool, and corresponds to FIG. 3 described above.

  Furthermore, although not shown in figure, as the laminated woven fabric which the board | substrate packing tool 12 comprises, an unshaped thing can also be employ | adopted. For example, an unmolded laminated woven fabric may be adopted instead of the two molded bodies 30, 31 shown in FIG. 3, or an unmolded laminated woven fabric is adopted instead of the molded body 230 shown in FIG. You may do it. Thus, when the board | substrate packing tool 12 using a non-molded laminated woven fabric is employ | adopted, since a formation process can be skipped, a manufacturing process can be simplified and manufacturing cost can be reduced. However, since the circuit board 11 comes into contact with the board packaging tool 12, there is a concern that the connection reliability of the electronic component 21 is lowered. Further, in order to ensure contact with the contact spring 23, it is necessary to fix the relay member 36 in a wider range than the molded body.

  In the said embodiment, the electronic device 10 showed the example containing the housing | casing 13 which protects the circuit board 11 and the board | substrate packing tool 12. As shown in FIG. However, the electronic device 10 may not include the housing 13 and the substrate packing tool 12 may also serve as the housing. In this case, the substrate packing tool 12 including the two molded bodies 30 and 31 described above, the substrate packing tool 12 including one molded body having the front surface portion 130 and the back surface portion 131, and the molded body 230 and the metal plate 231 are included. When any one of the board packing tools 12 is employed, the circuit board 11 can be suitably protected from the outside.

  In the embodiment described above, the example in which the circuit board 11 is fixed to the board packaging tool 12 by the screw 50 and the circuit board 11 and the board packaging tool 12 are fixed to the housing 13 (second case 41) has been described. However, the fixing means for fixing the circuit board 11 to the board packing tool 12 and the fixing means for fixing the circuit board 11 and the board packing tool 12 to the housing 13 (second case 41) may be separate. For example, in the example shown in FIG. 10, the fixing portion by the screw 50 is also replaced with the portion for fixing the circuit board 11 by the screw 52 to the substrate packing tool 12. That is, in FIG. 10, the circuit board 11 is fixed to the board packing tool 12 by screws 52 at eight places. Also, the board packaging 12 in which the edges 30a and 31a are stitched together by the conductive yarn 35 and the conductive woven fabrics 12a are electrically connected over the entire circumference of the edges 30a and 31a is connected to the internal space S1. In a state where the substrate 11 is accommodated, the edge portions 30 a and 31 a are sandwiched between the inner peripheral portion of the edge portion 40 a of the first case 40 and the first recess portion 41 b of the second case 41. As a result, the circuit board 11 and the board packing tool 12 are fixed to the housing 13. In addition, the edge part 40a of the 1st case 40 has the above-mentioned inner peripheral part with the outer peripheral part facing the edge part 41a of the 2nd case 41. As shown in FIG. FIG. 10 is a cross-sectional view showing another modification of the electronic device, and corresponds to FIG. 3 described above.

  Further, a screw for fixing the circuit board 11 and the first molded body 30 and a screw for fixing the circuit board 11 and the second molded body 31 may be separated. Furthermore, a screw for fixing the second molded body 31 to the second case 41, a screw for fixing the circuit board 11 to the second case 41, and a screw for fixing the first molded body 30 to the second case 41 may be divided. .

  In the above-described embodiment, the case 13 includes the two cases 40 and 41. However, like the substrate packing tool 12 shown in FIG. 8, it has a portion (front surface portion) covering the front surface 11 a side of the circuit board 11 and a portion (back surface portion) covering the back surface 11 b side of the circuit board 11, A so-called egg pack-like structure in which the front surface portion and the back surface portion are connected via a connecting portion may be used. In this way, even in an egg pack-like structure, the board packing tool 12 is fixed to the housing 13 (second case 41) by the screw 50 shown in FIG. 3, and the board packing tool 12 is fixed by clamping illustrated in FIG. Any of these can be applied.

  In the above embodiment, an example in which the housing 13 is configured to be openable and closable in the thickness direction has been described. However, the configuration of the housing 13 is not limited to the above example when the substrate packaging tool 12 is not sandwiched by the housing 13. For example, the housing 13 configured to be openable and closable in a direction perpendicular to the thickness direction can be employed.

  In the above embodiment, an example in which a laminated woven fabric is configured by interposing an adhesive between the conductive woven fabric 12a and the non-conductive woven fabric 12b has been described. However, the method for integrating the conductive woven fabric 12a and the non-conductive woven fabric 12b is not limited to the above example. For example, as the resin constituting the non-conductive woven fabric 12b, a thermoplastic resin having a melting point lower than that of the resin constituting the conductive woven fabric 12a is adopted, and the non-conductive is softened by receiving heat during molding such as pressure forming. The laminated woven fabric may be formed by bringing the conductive woven fabric 12b into close contact with the conductive woven fabric 12a.

  Moreover, the structure of the circuit board 11, the board | substrate packing tool 12, and the housing | casing 13 is not limited to the said example. For example, in 1st Embodiment or 2nd Embodiment, the 1st recessed part 41b of the 2nd case 41 is good also as a 2 step | paragraph recessed structure on the basis of the 2nd recessed part 41c, ie, the edge 41a.

DESCRIPTION OF SYMBOLS 10 ... Electronic device 11 ... Circuit board 12 ... Board packing tool 12a ... Conductive woven cloth 12b ... Non-conductive woven cloth 13 ... Housing 22 ... Connector 23 ... Contact spring 30: first molded body 31: second molded body 36, 37: relay member S1: internal space

Claims (8)

A circuit board on which electronic components are mounted on at least one of the first main surface and the second main surface which is the back surface of the first main surface;
A circuit board packing tool for accommodating the circuit board in an internal space and performing electromagnetic wave shielding of the circuit board;
An electronic device comprising a contact spring made of a metal material, mounted on a first main surface of the circuit board, and electrically connecting the GND pattern of the circuit board and the board packaging tool,
The substrate packing tool includes a laminated woven fabric of a conductive woven fabric obtained by metal plating a resin woven fabric and a non-conductive woven fabric made of a resin woven fabric as a portion covering at least the first main surface side of the circuit board. And the non-conductive woven fabric forms the inner surface of the substrate packing tool,
A conductive relay member is fixed to the laminated woven fabric, and the relay member is electrically connected to the conductive woven fabric, and the surface of the non-conductive woven fabric forming the inner surface of the substrate packing tool. The electronic device according to claim 1, wherein the electronic device is disposed at a contact portion of the contact spring. The relay member is a conductive yarn having conductivity,
The electronic device according to claim 1, wherein the conductive woven fabric and the non-conductive woven fabric are sewn by the conductive yarn.   2. The electronic device according to claim 1, wherein the relay member is made of a metal material and is caulked and fixed to the laminated woven fabric in contact with the conductive woven fabric and the non-conductive woven fabric. .   The electronic device according to claim 1, wherein the contact spring is provided around the connector as a shield of the connector mounted on the circuit board.   The board packing tool includes a first molded body covering the first main surface side of the circuit board as a molded body of the laminated woven fabric, and a second molded body covering the second main surface side of the circuit board. The electronic device according to claim 1, wherein the electronic device is an electronic device.   The board packing tool is made of a molded body of the laminated woven fabric, and a part covering the first main surface side of the circuit board and a part covering the second main surface side of the circuit board are integrally formed. The electronic device according to claim 1, wherein:   The board packaging tool has a molded body of the laminated woven fabric as a part covering the first main surface side of the circuit board and a metal plate as a part covering the second main surface side of the circuit board. The electronic device according to claim 1, wherein:   The electronic device according to claim 5, wherein the molded body is formed by pressure forming.

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