JP5287492B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic device in which a circuit board is housed in a board packaging tool that performs electromagnetic wave shielding of the circuit board, and a board packaging tool including the circuit board is housed in a housing.

  In various electronic devices, various electromagnetic wave shielding means are taken for measures against EMI (ElectroMagnetic Interference), that is, in order to prevent leakage of electromagnetic waves from the inside and intrusion of electromagnetic waves from the outside.

  As the electromagnetic wave shielding means, a method using a metal casing or a method of providing a conductive layer on the inner surface of a resin casing by electroless plating or the like is general.

  For example, as shown in Patent Document 1, a method of covering a circuit board accommodated in a housing with a conductive bag has also been proposed. In the method disclosed in Patent Document 1, a multilayer sheet in which an insulating layer is disposed on one surface of a conductive layer made of a conductive woven fabric or the like and a heat-sealable insulating layer is disposed on the back surface is used as a heat-sealable insulator. It is folded in half so that the layer is on the inside, and both sides are heat sealed and sewn with conductive thread. Further, the conductor layer is exposed in the remaining opening from which the connector cable is pulled out, and in a state where the circuit board is accommodated, these are fixed with a conductive adhesive tape to form a bag. In this way, a shielding bag is formed from the multilayer sheet, and electromagnetic wave shielding in all directions with respect to the circuit board is achieved.

JP-A-7-245496

  In the method using a metal casing, the casing itself becomes heavy, which is against the demand for weight reduction. In addition, the method of providing a conductive layer on the inner surface of a resin casing by electroless plating can reduce the weight compared to a metal casing, but the conductive layer by plating or the like is easily peeled off due to rubbing during manufacture. When the conductive layer is peeled off, there is a problem that the electromagnetic wave shielding effect is lost.

  On the other hand, in the method disclosed in Patent Document 1, since the shielding bag is made of a multilayer sheet including a conductive layer such as a conductive woven fabric, the weight can be reduced as compared with a metal casing. In addition, since the heat-sealable insulating layer forms the inner surface of the bag, the electromagnetic wave shielding effect can be ensured even if there is rubbing or the like during the manufacturing, and the GND of the circuit configured on the circuit board can be secured. Short-circuiting between the part excluding the part fixed to the potential and the shielding bag can be prevented.

  However, since the heat-sealable insulating layers are in contact with each other in the folded state, both sides are heat-sealed and the sewing thread is sewn with a conductive thread to achieve omnidirectional electromagnetic shielding against the circuit board. Must. This increases the cost. Moreover, since the opening part which pulls out a connector cable etc. must be fixed with a conductive adhesive tape, this also increases cost.

  In view of the above problems, an object of the present invention is to provide an electronic device that is light in weight and that does not easily lose its shielding property even if it is rubbed during manufacture.

  In order to achieve the above object, an electronic device according to claim 1 includes a circuit board having an electronic component mounted on at least one of a first main surface and a second main surface which is the back surface of the first main surface, and a circuit. A board packaging device that accommodates the board in the first internal space and shields the circuit board from electromagnetic waves, and is configured to be openable and closable in the thickness direction of the circuit board, and is disposed on the first main surface side with respect to the circuit board. 1 case and the 2nd case arrange | positioned at the 2nd main surface side, and the board | substrate packing tool containing a circuit board is accommodated in the 2nd internal space formed in the state which assembled | attached the 1st case and the 2nd case A resin casing. And the board | substrate packing tool is the 1st molded object which covers the 1st main surface side of a circuit board as a molded object of the conductive woven fabric which plated the resin woven cloth with metal, and the 2nd main surface side of the circuit board. It consists of the 2nd molded object to cover, the cyclic | annular edge part in a 1st molded object and the cyclic | annular edge part in a 2nd molded object mutually overlap in thickness direction, and are clamped by the 1st case and the 2nd case It is characterized by.

  In the present invention, the first internal space is formed by two molded bodies (first molded body and second molded body) formed by molding a conductive woven fabric obtained by metal-plating a resin woven fabric. A substrate packing tool for performing electromagnetic wave shielding of the circuit board in a state of being housed in the container is configured. That is, since the main material of the substrate packing tool is a resin woven fabric, the electronic device can be reduced in weight as compared with a conventional metal casing.

  In addition, the conductive woven fabric constituting the substrate packing tool is obtained by metal-plating a resin woven fabric and has a structure in which metal-plated resin fibers are entangled three-dimensionally. That is, the metal plating layer of the molded body made of the conductive woven fabric is not only on the surface of the casing such as the conductive layer provided on the conventional resin casing. Therefore, even if there is rubbing with an electronic component in the middle of manufacture, a part (for example, only the surface) in the thickness direction of the metal plating layer of the formed body made of the conductive woven fabric is peeled off, and the electromagnetic wave Shielding effect is not easily lost.

  In addition, by using the assembly of the first case and the second case, the edge of the first molded body and the edge of the second molded body are overlapped with each other with the first case and the second case. Hold it. And thereby, the board | substrate packing tool which performs the electromagnetic wave shield of all directions with respect to a circuit board is comprised. Therefore, since it is not necessary to perform sewing with a conductive thread or fixing with a conductive adhesive tape as in the prior art, the manufacturing cost of the electronic device can be reduced.

  As described above, according to the present invention, it is possible to provide an electronic device that is light in weight and that does not easily lose its shielding performance even if it is rubbed during manufacture.

  Next, in the electronic device according to claim 2, the circuit board on which electronic components are mounted on at least one of the first main surface and the second main surface which is the back surface of the first main surface, A board packing device that is housed in the internal space and shields the circuit board from electromagnetic waves, a first case that is configured to be openable and closable in the thickness direction of the circuit board, and that is disposed on the first main surface side with respect to the circuit board and the first case 2 A resin casing that has a second case disposed on the main surface side, and that accommodates a substrate packing device including a circuit board in a second internal space formed in a state in which the first case and the second case are assembled. And. The substrate packing tool is formed of a conductive woven fabric formed by metal-plating a resin woven fabric, and the molded body covers a portion covering the first main surface side of the circuit board and a second main surface side of the circuit board. The covering portion is integrally formed, and the edge of the portion covering the first main surface side and the edge of the portion covering the second main surface side in the molded body overlap each other in the thickness direction, and the first It is characterized by being sandwiched between the first case and the second case in a state in which the case and the second case are assembled.

  In the present invention, the electromagnetic wave shield of the circuit board is provided in a state having a first internal space and being accommodated in the first internal space by one molded body formed by molding a conductive woven fabric obtained by metal plating a resin woven fabric. A board packing tool is configured. That is, since the main material of the substrate packing tool is a resin woven fabric, the electronic device can be reduced in weight as compared with a conventional metal casing. Moreover, since both surfaces (the 1st main surface and the 2nd main surface) of a circuit board are covered with one molded object, compared with the structure which covers both surfaces of a circuit board with a some member, the manufacturing process of a board | substrate packing tool, etc. The manufacturing process of the electronic device can be simplified.

  Also in the present invention, the conductive woven fabric constituting the substrate packing tool is obtained by metal-plating a resin woven fabric, and has a structure in which metal-plated resin fibers are entangled three-dimensionally. That is, the metal plating layer of the molded body made of the conductive woven fabric is not only on the surface of the casing such as the conductive layer provided on the conventional resin casing. Therefore, even if there is rubbing with an electronic component in the middle of manufacture, a part (for example, only the surface) in the thickness direction of the metal plating layer of the formed body made of the conductive woven fabric is peeled off, and the electromagnetic wave Shielding effect is not easily lost.

  Further, by using the assembly of the first case and the second case, the edge of the part covering the first main surface side and the edge of the part covering the second main surface side of the molded body are overlapped with both edges. In this state, it is held between the first case and the second case. And thereby, the board | substrate packing tool which performs the electromagnetic wave shield of all directions with respect to a circuit board is comprised. Therefore, since it is not necessary to perform sewing with a conductive thread or fixing with a conductive adhesive tape as in the prior art, the manufacturing cost of the electronic device can be reduced.

  As described above, according to the present invention, it is possible to provide an inexpensive electronic device that is light in weight and hardly loses its shielding performance even if it is rubbed during manufacture.

  Next, an electronic device according to a third aspect includes a circuit board having an electronic component mounted on the first main surface among the first main surface and the second main surface which is the back surface of the first main surface, and a circuit. A board packaging device that accommodates the board in the first internal space and shields the circuit board from electromagnetic waves, and is configured to be openable and closable in the thickness direction of the circuit board, and is disposed on the first main surface side with respect to the circuit board. 1 case and the 2nd case arrange | positioned at the 2nd main surface side, and the board | substrate packing tool containing a circuit board is accommodated in the 2nd internal space formed in the state which assembled | attached the 1st case and the 2nd case A resin casing. And as a site | part which covers the 2nd main surface side of a circuit board while having a molded body of the conductive woven fabric which metal-plated the resin woven fabric as a site | part which covers the 1st main surface side of a circuit board, a board | substrate packaging tool In the substrate packaging tool having the metal plate, the annular edge of the molded body and the annular edge of the metal plate overlap each other in the thickness direction, and the first case and the second case are assembled. It is characterized by being sandwiched between the first case and the second case.

  In the present invention, a molded body formed by molding a conductive woven fabric obtained by metal plating a resin woven fabric, and a metal plate have a first internal space, and the electromagnetic wave of the circuit board is accommodated in the first internal space. A substrate packing tool for shielding is configured. In other words, since the main packaging material includes a molded body whose main material is a resin woven fabric, the electronic device can be reduced in weight as compared with a conventional metal casing.

  In addition, the conductive woven fabric constituting the substrate packing tool is obtained by metal-plating a resin woven fabric and has a structure in which metal-plated resin fibers are entangled three-dimensionally. That is, the metal plating layer of the molded body made of the conductive woven fabric is not only on the surface of the casing such as the conductive layer provided on the conventional resin casing. Therefore, even if there is rubbing with an electronic component in the middle of manufacture, a part (for example, only the surface) in the thickness direction of the metal plating layer of the formed body made of the conductive woven fabric is peeled off, and the electromagnetic wave Shielding effect is not easily lost.

  Moreover, the assembly | attachment of a 1st case and a 2nd case is utilized, and the edge part of a molded object and the edge part of a metal plate are clamped by the 1st case and the 2nd case in the state which accumulated both edge parts. And thereby, the board | substrate packing tool which performs the electromagnetic wave shield of all directions with respect to a circuit board is comprised. Therefore, since it is not necessary to perform sewing with a conductive thread or fixing with a conductive adhesive tape as in the prior art, the manufacturing cost of the electronic device can be reduced.

  As described above, according to the present invention, it is possible to provide an electronic device that is light in weight and that does not easily lose its shielding performance even if it is rubbed during manufacture.

  As described in claim 4, among the sandwiched parts of the substrate packing tool in the first case and the sandwiched parts of the substrate packing tool in the second case, the molded body is interposed between the circuit board, It is preferable that the convex portions are provided at predetermined intervals.

  When the convex portion is provided in this manner, in the portion where the convex portion is provided, when the first case and the second case are assembled, the molded body is pushed by the convex portion, and the portion covering the first main surface side of the circuit board. The edge portion and the edge portion of the portion covering the second main surface side of the circuit board are securely adhered. Therefore, by providing convex portions at predetermined intervals according to the wavelength to be shielded, electromagnetic wave shielding in all directions can be performed on the circuit board.

  According to a fifth aspect of the present invention, the first case and the second case are assembled to each other by a plurality of fixing parts to form a resin casing, and the convex portions are provided between the fixing parts adjacent to each other. It is preferable to adopt the configuration described above.

  Not only in the vicinity of the fixed part, but also in the part provided with the convex part, the edge part of the part covering the first main surface side of the circuit board and the edge part of the part covering the second main surface side of the circuit board are in contact with each other It becomes easy to do. Therefore, by providing the convex portion between the fixed parts, the number of the fixed parts can be reduced while securing the shielding property. For example, in the case of screw fastening, the number of screws and holes into which the screws are inserted can be reduced. In the case of fitting, the mold structure can be simplified by reducing fitting protrusions and fitting grooves. That is, the cost can be further reduced.

  According to a sixth aspect of the present invention, the circuit board may be made of a metal material and mounted with a contact spring that electrically connects the GND pattern of the circuit board and the conductive woven fabric. According to this, the electrical connection state between the GND pattern of the circuit board and the conductive woven fabric can be ensured satisfactorily by the elastic deformation of the contact spring. And since the area | region where a conductive woven fabric (board | substrate packing tool) and a contact spring function integrally as GND, ie, functions as GND, shielding property can be improved.

  According to a seventh aspect of the present invention, it is preferable that the resin casing has a convex portion for pressing the conductive woven fabric interposed between the resin spring and the contact spring at a portion facing the contact spring. According to this, while assembling the first case and the second case, the conductive woven fabric can be pressed by the convex portion, and the contact state between the conductive woven fabric and the contact spring can be made better.

  According to the eighth aspect of the present invention, the contact spring is preferably provided around the connector mounted on the circuit board. According to this, since the contact spring functions as a shield for the connector, the external noise that enters the circuit board from the outside through the connector is effectively released to the board packing tool (conductive cloth) as GND. Can do. Also, the housing and the substrate packing tool are provided with through holes for connectors, but since contact springs are located around the through holes, the electromagnetic waves entering and exiting through the through holes can be effectively shielded. Can do.

  As described in claim 9, it is preferable that the molded body is formed by pressure forming. According to this, a molded object can be manufactured thinly, lightweight and inexpensively. However, in addition to pressure forming, vacuum forming, hot pressing, or the like can be employed.

  In addition, as said molded object, you may employ | adopt the molded object which consists only of the conductive woven fabric which carried out the metal plating of the resin woven fabric, and the electroconductive which carried out the metal plating of the resin woven fabric as described in Claim 10. A laminated woven fabric of a conductive woven fabric and a non-conductive woven fabric made of a resin woven fabric may be formed, and the conductive woven fabric may constitute the inner surface of the substrate packing tool.

It is a top view which shows schematic structure of the electronic device which concerns on 1st Embodiment. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing which follows the III-III line of FIG. It is sectional drawing which shows a modification. It is sectional drawing which shows the other modification of a substrate packing tool. It is sectional drawing which shows the other modification of a housing | casing.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a plan view (plan view seen from the first case side) showing a schematic configuration of the electronic device according to the first embodiment. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. In the following, the thickness direction of the circuit board is simply referred to as the thickness direction.

  As shown in FIGS. 1 and 2, the electronic device 10 includes, as main parts, a circuit board 11, a board packaging tool 12 that houses the circuit board 11 in the internal space S <b> 1, shields the circuit board 11 from electromagnetic waves, and a resin. And a housing 13 that accommodates the board packing tool 12 including the circuit board 11 in the internal space S2. The electronic device 10 according to the present embodiment is a meter control device in which a control circuit of a vehicle meter display unit is configured on a circuit board 11. In addition, the said instrument display part is comprised with the LCD panel which is not illustrated in this embodiment. The internal space S1 corresponds to the first internal space, and the internal space S2 corresponds to the second internal space.

  The circuit board 11 has a wiring board 20 in which wiring (not shown) made of a conductive material such as copper is disposed on an insulating base material mainly made of resin or ceramics. In the present embodiment, a planar rectangular multilayer substrate in which wiring patterns formed by patterning copper foil are arranged in multiple layers on an insulating base material made of glass epoxy resin (glass fiber reinforced epoxy resin) is used as the wiring substrate 20. Adopted.

  The front and back surfaces of the wiring board 20, in other words, the front surface 11 a and the back surface 11 b of the circuit board 11 are provided with a plurality of lands as a part of the wiring, and a peripheral portion serving as a fixing portion for the substrate packing tool 12. In the central part excluding, electronic parts 21 such as a microcomputer, a power transistor, a resistor, and a capacitor are soldered and mounted on the corresponding land. In the present embodiment, among the electronic components 21, a tall component such as an aluminum electric field capacitor (not shown) is mounted on the front surface 11a side, and a component shorter than the tall component is mounted on the back surface 11b side. The wiring and the electronic component 21 constitute a circuit. Specifically, the circuit board 11 has an LCD controller for controlling each pixel of the LCD panel, a CPU (Central Processing Unit), and the like as a control circuit for the LCD panel. In addition, it has an interface, a memory, etc. (not shown). The front surface 11a corresponds to the first main surface, and the back surface 11b corresponds to the second main surface.

  In addition to the electronic component 21 described above, the surface 11a of the circuit board 11 electrically connects a power supply, a GND, a signal input / output function, in other words, a circuit configured on the circuit board 11 and an external device. A connector 22 that performs a relay function is soldered to a corresponding land (not shown). In the present embodiment, as an example, the fitting direction of the connector 22 and a connector (not shown) of an external device coincides with the thickness direction, and the terminal 22a of the connector 22 is connected to the wiring board along the thickness direction. 20 is an insertion mounting structure that penetrates through 20 (flow soldering mounting structure). The connector 22 may have a surface mounting structure (reflow soldering mounting structure).

  In addition, a contact spring for electrically connecting a GND pattern (not shown) fixed to the GND potential and the substrate packing tool 12 among the wiring of the wiring board 20, that is, for setting the substrate packing tool 12 to the GND potential. 23 are soldered to the corresponding land 24a. The contact spring 23 is formed by processing a metal plate into a predetermined shape so as to have a spring property, and the height from the surface 11a in the thickness direction in a state before being accommodated in the substrate packing tool 12 is high. The height is set to be lower than the height from the surface 11 a to the inner surface 30 d of the first molded body 30 constituting the substrate packing tool 12 in a state where the circuit board 11 is accommodated in the substrate packing tool 12. That is, the contact spring 23 comes into contact with the inner surface 30d of the first molded body 30 in an elastically deformed state in a state in which the circuit board 11 is accommodated in the board packing tool 12.

  In particular, in the present embodiment, the contact spring 23 is arranged around the connector 22, preferably around the connector 22 (around in this embodiment), and among the plurality of terminals 22 a of the connector 22, the shield wire of the external device Are electrically connected through a part of the terminals 22a electrically connected to the terminals 22a and lands, wirings, and lands 24a of the circuit board 11 corresponding to the terminals 22a. That is, the contact spring 23 serves as a shield for the connector 22, and external noise that enters the circuit board 11 from the outside via the connector 22 is effectively applied to the board packing tool 12 (first molded body 30) as GND. It is designed to fulfill the function of escaping. Further, the substrate packing tool 12 and the housing 13 are provided with through holes 33 and 42 for exposing the connector 22 to the outside, respectively, but even if such through holes 33 and 42 are provided, The contact spring 23 can effectively shield electromagnetic waves entering and exiting through the through holes 33 and 42.

  In the present embodiment, a land 24b is provided at the edge of the planar rectangular circuit board 11 (wiring board 20) together with the contact spring 23 to fix the board packing tool 12 to the GND potential. . In the example shown in FIG. 2, a land 24b is provided on the surface 11a of the circuit board 11, and the inner surface 30d of the first molded body 30 is in contact with the land 24b. However, the land 24b may be configured to be provided on the back surface 11b side and the front and back surfaces 11a and 11b. In addition, when it has the contact spring 23, it is good also as a structure without the land 24b.

  In addition, insertion holes 25 into which the screws 50 for fixing the circuit board 11 to the board packing tool 12 are inserted are provided at a plurality of positions on the edge portion so as to be separated from each other. In the present embodiment, the circuit board 11 and the substrate packing tool 12 are fixed to the second case 41 constituting the housing 13.

  As described above, the board packing tool 12 accommodates the circuit board 11 in the internal space S1 and performs electromagnetic wave shielding of the circuit board 11. In this embodiment, the conductive woven cloth obtained by metal plating the resin woven cloth is used. It is comprised by the two molded objects 30 and 31 formed by shape | molding. For example, polyester, particularly high-strength polyethylene terephthalate (PET), or polyimide can be used as a raw material for the resin woven fabric to be subjected to metal plating. Further, the two molded bodies 30 and 31 are both molded by using a pressure forming method. Such molded bodies 30 and 31 maintain a predetermined shape as long as no external force is applied, but have a flexibility to be deformed to some extent when an external force is applied.

  The first molded body 30 is a part that mainly covers the front surface 11 a side of the circuit board 11, and the second molded body 31 is a part that mainly covers the back surface 11 b side of the circuit board 11. Then, by assembling the two molded bodies 30 and 31 along the thickness direction, the substrate packaging tool 12 having the internal space S1 for accommodating the circuit board 11 is obtained. In the present embodiment, the planar shapes (planar shapes perpendicular to the thickness direction) of the two molded bodies 30 and 31 are both rectangular, and the annular edge portions 30a and 31a are overlapped with each other (inner surfaces 30d and 31d). In this state, the edge portions 30a and 31a are sandwiched between the first case 40 and the second case 41 constituting the housing 13, thereby forming the bag-like substrate packing tool 12.

  The first molded body 30 has an annular edge portion 30a and a center portion surrounded by the edge portion 30a, and the center portion is recessed with respect to the edge portion 30a. And as this recessed part (center part), it continues to the edge part 30a, and in the state which accommodated the circuit board 11 in internal space S1, at least one part of a recessed part bottom face (inner surface 30d) is the surface 11a of the circuit board 11, and The first recess 30b is in contact, and the second recess 30c has a longer distance between the bottom surface (inner surface) of the recess and the surface 11a of the circuit board 11 than the first recess 30b. That is, the concave portion has a two-stage structure having two concave portions 30b and 30c having different depths with respect to the edge portion 30a.

  The first recess 30b is a portion facing the edge on the surface 11a side of the circuit board 11 in a state in which the circuit board 11 is accommodated in the internal space S1, and with the corresponding first recess 31b of the second molded body 31. Between them, the circuit board 11 is sandwiched and fixed. In this embodiment, the 1st molded object 30 is contacting the above-mentioned land 24b in the 1st recessed part 30b. The first recess 30b is provided with an insertion hole 32 into which the screw 50 is inserted, corresponding to the insertion hole 25 described above.

  The second recess 30c is a part excluding a part fixed to the GND potential in a circuit (a wiring including the electronic component 21 and the land) configured in the circuit board 11 in a state where the circuit board 11 is accommodated in the internal space S1. It has a predetermined depth so as not to come into contact with. In the present embodiment, a through hole 33 for exposing the connector 22 to the outside is formed in the second recess 30c. Further, the contact spring 23 is in contact with the inner surface 30 d of the first molded body 30 in the second recess 30 c.

  On the other hand, the 2nd molded object 31 also has the cyclic | annular edge part 31a and the center part enclosed by the edge part 31a, and the center part is dented with respect to the edge part 31a. And as this recessed part (center part), it continues to the edge part 31a, and in the state which accommodated the circuit board 11 in internal space S1, at least one part of a recessed part bottom face (inner surface 30d) is with the back surface 11b of the circuit board 11 The first recess 31b is in contact with the first recess 31b, and the second recess 31c has a longer facing distance between the bottom surface (inner surface) of the recess and the back surface 11b of the circuit board 11 than the first recess 31b. That is, the recess has a two-stage structure having two recesses 31b and 31c having different depths with respect to the edge 31a.

  The first recess 31b corresponds to the first recess 30b described above, and faces the edge on the back surface 11b side of the circuit board 11 in a state where the circuit board 11 is accommodated in the internal space S1, and the first recess 30b The circuit board 11 is sandwiched between and fixed. The first recess 31b is provided with an insertion hole 34 into which the screw 50 is inserted, corresponding to the insertion hole 25 described above.

  The second recess 31c corresponds to the second recess 30c described above, and the circuit (the wiring including the electronic component 21 and the land) formed on the circuit board 11 in a state where the circuit board 11 is accommodated in the internal space S1. It has a predetermined depth so as not to come into contact with any part other than the part fixed to the GND potential. In the present embodiment, as described above, since the tall component of the electronic component 21 is mounted on the surface 11a, the depth of the second recess 31c is the depth of the second recess 30c on the first molded body 30 side. It is shallower than the depth.

  The housing 13 is made of a resin material, and is opened and closed in the thickness direction by a first case 40 disposed mainly on the front surface 11a side and a second case 41 disposed mainly on the back surface 11b side with respect to the circuit board 11. It is configured to be possible. And the 1st case 40 and the 2nd case 41 are assembled | attached along the thickness direction, and it becomes the housing | casing 13 provided with the interior space S2 which accommodates the board | substrate packing tool 12 containing the circuit board 11. FIG. As described above, the housing 13 protects the board packing tool 12 including the circuit board 11. In addition, as a resin material which comprises the housing | casing 13, well-known materials, such as an epoxy resin, are employable.

  In the present embodiment, the first case 40 and the second case 41 are configured to be separable (configured as separate members). The two cases 40 and 41 have a rectangular planar shape (a planar shape perpendicular to the thickness direction), and a screw 51 is screwed into the corresponding annular edge portions 40a and 41a. A plurality of screw holes (not shown) are provided. Then, one casing 13 is configured by screwing a screw 51 into a matching screw hole (not shown) in a state where the annular edges 40a and 41a are overlapped with each other. As shown in FIG. 1, in the present embodiment, ten fixing portions by the screws 51 are provided at approximately equal intervals.

  As for the edge part 40a of the 1st case 40, as shown in FIG. 2, the site | part of the outer peripheral side opposes the edge part 41a of the 2nd case 41, and the site | part of an inner peripheral side is the edge part 30a of the 1st molded object 30. Opposite. Moreover, the center part enclosed by the annular edge part 40a becomes the recessed part 40b. The recess 40b has a predetermined depth so as to accommodate the first molded body 30 side in the substrate packing tool 12. In the present embodiment, a through hole 42 for exposing the connector 22 to the outside is formed in the recess 40b. In addition, although it is good also as a structure which the recessed part 40b of the 1st case 40 contacts the 2nd recessed part 30c of the 1st molded object 30, in this embodiment, a structure which has a clearance gap between the recessed part 40b and the 2nd recessed part 30c. It has become.

  On the other hand, also in the second case 41, the central part surrounded by the annular edge part 41a is a concave part, and the concave part continues to the edge part 41a and faces the edge part 31a of the second molded body 31. The first recess 41b, the second recess 41c deeper than the first recess 41b and facing the first recess 31b of the second molded body 31, and the second recess 31c of the second molded body 31 deeper than the second recess 41c. And a third concave portion 41d facing each other. That is, the concave portion has a three-stage structure having three concave portions 41b, 41c, and 41d having different depths with respect to the edge portion 41a.

  As described above, the first concave portion 41b corresponds to the inner peripheral portion of the edge portion 40a, and is in a state where the two molded bodies 30, 31 and the circuit board 11 are accommodated in the internal space S2, and between the edge portion 40a. Thus, the edge portions 30a and 31a of the two molded bodies 30 and 31 are sandwiched and sandwiched.

  As described above, the second concave portion 41c is opposed to the first concave portion 31b of the second molded body 31, and supports the two molded bodies 30, 31 (substrate packaging tool 12) and the circuit board 11. Yes. In the present embodiment, screw holes (not shown) are provided in the second recess 41c corresponding to the insertion holes 25, 32, and 34 described above. Then, in the state where the second molded body 31, the circuit board 11, and the first molded body 30 are stacked in this order on the second recess 41c, the screw 50 is screwed into the four holes that overlap each other, whereby the circuit board is obtained. 11 is fixed to the two molded bodies 30 and 31, and the circuit board 11 and the molded bodies 30 and 31 are fixed to the second case 41.

  As described above, the third recessed portion 41d faces the second recessed portion 31c of the second molded body 31, that is, faces the central portion of the circuit board 11, and accommodates the second molded body 31 side of the substrate packing tool 12. Therefore, it has a predetermined depth. In addition, although it is good also as a structure which the 3rd recessed part 41d of the 2nd case 40 contacts with the 2nd recessed part 31c of the 2nd molded object 31, in this embodiment, it is between the 3rd recessed part 41d and the 2nd recessed part 31c. It has a configuration with a gap.

  Moreover, in this embodiment, as shown in FIG.1 and FIG.3, in the 1st case 40, in the inner peripheral site | part of the edge part 40a which clamps the edge part 30a of the 1st molded object 30 (board | substrate packing tool 12), As a part of the first case 40, a plurality of convex portions 43 are provided at predetermined intervals. In particular, in the present embodiment, the convex portions 43 are respectively provided between the plurality of fixing portions (the portions of the screws 51) of the first case 40 and the second case 41, that is, between the fixing portions adjacent to each other. From the viewpoint of electromagnetic shielding, the shorter the interval between the adjacent convex portions 43, the better. In this embodiment, the space | interval of the adjacent convex part 43 is 1/2 or less (about 60-80 mm) of the minimum frequency among the frequencies with a big influence as a vehicle meter control apparatus. In other words, the interval between the adjacent convex portion 43 and the fixed portion (screw 51) is ¼ or less (about 30 to 40 mm) of the minimum frequency.

  Next, a method for assembling the electronic device 10 will be described with reference to FIG. First, the circuit board 11, the molded bodies 30, 31, and the cases 40, 41 are prepared. At this time, the connector 22 and the contact spring 23 are mounted on the circuit board 11 together with the electronic component 21.

  Then, the second molded body 31 is positioned and placed on the second case 41. At this time, the edge 31a is positioned on the first recess 41b, the first recess 31b is positioned on the second recess 41c, and the first recess 31b corresponds to a screw hole (not shown) provided in the second recess 41c. It mounts so that the insertion hole 34 to match. Next, the circuit board 11 is positioned and placed on the second molded body 31 supported by the second case 41 with the back surface 11b as the second case 41 side. At this time, the edge is positioned on the first recess 31b, and the insertion hole 34 provided in the first recess 31b is placed so that the corresponding insertion hole 25 coincides. Next, the first molded body 30 is positioned and placed on the circuit board 11 supported by the second case 41 via the second molded body 31. At this time, the edge 30a is located on the edge 31a, the first recess 30b is located on the edge of the circuit board 11, and the insertion hole 32 corresponding to the first recess 30b is inserted into the insertion hole 25 of the circuit board 11. Are placed so that the connector 22 is inserted through the through hole 33 of the second recess 30c. In this state, the circuit board 11 is fixed to the molded bodies 30 and 31 by the screw 50 and these are fixed to the second case 41.

  Next, the first case 40 is assembled to the second case 41. At this time, the outer peripheral part of the edge part 40a is located on the edge part 41a, the inner peripheral part of the edge part 40a is located on the edge part 30a of the first molded body 30, and the corresponding screws of the edge parts 40a and 41a The first case 40 is positioned and placed on the second case 41 so that the holes (not shown) match and the connector 22 is inserted through the through hole 42 of the recess 40b. In this state, the first case 40 is assembled to the second case 41 with the screw 51. By this assembly, the edge portions 30a and 31a of the two molded bodies 30 and 31 are sandwiched in the thickness direction by the inner peripheral portion of the edge portion 40a in the first case 40 and the first recess portion 41b in the second case 41. The edges 30a and 31a are in close contact with each other (good contact). Thus, the electronic device 10 described above can be obtained.

  Next, the effect of the characteristic part of the electronic device 10 according to the present embodiment will be described. First, in this embodiment, the board | substrate packing tool 12 which performs the electromagnetic wave shielding of the circuit board 11 is comprised by the two molded objects 30 and 31 formed by shape | molding the conductive woven fabric which metal-plated the resin woven fabric. That is, the main material of the substrate packing tool 12 is a resin woven fabric. The housing 13 is also made of a resin material. Therefore, the electronic device 10 can be reduced in weight as compared with the conventional metal casing.

  Further, the conductive woven fabric constituting the substrate packing tool 12 is obtained by metal-plating a resin woven fabric, and has a structure in which metal-plated resin fibers are entangled three-dimensionally. That is, the metal plating layers of the molded bodies 30 and 31 made of the conductive woven fabric are not only on the surface of the housing such as the conductive layer (inner surface plating layer) provided on the conventional resin housing. Therefore, even if there is rubbing with the electronic component 21 in the course of manufacture, a part (for example, only the surface) in the thickness direction of the metal plating layers of the molded bodies 30 and 31 made of conductive woven fabric is peeled off. And the effect of electromagnetic wave shielding can be maintained.

  Further, the first case 40 and the second case 41 constituting the housing 13 with the edge 30a of the first molded body 30 and the edge 31a of the second molded body 31 overlapped with both edges 30a, 31a. The board packing tool 12 having an internal space S1 for accommodating the circuit board 11 is configured by the edge portions 40a and 41a. That is, by assembling the first case 40 and the second case 41 so as to form the housing 13, the board packaging tool 12 that performs omnidirectional electromagnetic shielding on the circuit board 11 is configured. Accordingly, since it is not necessary to perform sewing with a conductive thread or fixing with a conductive adhesive tape as in the prior art, the manufacturing cost of the electronic device 10 can be reduced.

  As described above, according to the present embodiment, it is possible to provide the electronic device 10 that is lightweight and that does not easily lose the shielding performance even if there is rubbing during manufacture or the like at low cost.

  In the present embodiment, a plurality of convex portions 43 are formed as a part of the first case 40 on the inner peripheral portion of the edge 40 a of the first case 40 that sandwiches the edges 30 a and 31 a of the molded bodies 30 and 31. Are provided at predetermined intervals. Therefore, at the portion where the convex portion 43 is provided, when the first case 40 and the second case 41 are assembled, the molded bodies 30 and 31 are pushed by the convex portion 43 as shown in FIG. It is possible to ensure close contact (good contact). That is, the shielding property with respect to the circuit board 11 can be ensured.

  In particular, in the present embodiment, the protrusions 43 are respectively provided between the fixing parts (the parts of the screws 51) between the first case 40 and the second case 41, that is, between the adjacent fixing parts. More specifically, the interval between the adjacent convex portions 43 is ½ or less (about 60 to 80 mm) of the minimum frequency among the frequencies having a large influence as the meter control device. In other words, the interval between the adjacent convex portion 43 and the fixed portion is ¼ or less (about 30 to 40 mm) of the minimum frequency. Therefore, omnidirectional electromagnetic shielding can be performed on the circuit board 11.

  In addition, also in the position of the convex part 43, if the 1st case 40 and the 2nd case 41 are fixed with the screw | thread 51, there can exist an effect equivalent to the said structure. However, the number of screws 51 increases and the number of man-hours also increases. Moreover, in order to secure the fixed space by the screw | thread 51, there exists a possibility that the physique of the housing | casing 13 may also become large. On the other hand, if the fixed portion is thinned out by the convex portion 43 as in the present embodiment, the cost can be reduced while securing the shielding property. In addition, an increase in the size of the housing 13 can be suppressed.

  In the present embodiment, the contact spring 23 is mounted on the circuit board 11, and the GND pattern of the circuit board 11 and the first molded body 30 are electrically connected by the contact spring 23. Therefore, due to the elastic deformation of the contact spring 23, the electrical connection state between the GND pattern of the circuit board 11 and the first molded body 30 (board packaging tool 12) can be ensured satisfactorily. And since the board | substrate packing tool 12 and the contact spring 23 function integrally as GND, ie, the area | region which functions as GND increases, the shielding performance with respect to the circuit board 11 can be improved.

  In particular, in the present embodiment, the contact spring 23 is disposed around (preferably around) the connector 22, and a part of the plurality of terminals 22 a of the connector 22 that is electrically connected to the shield wire of the external device. The terminals 22a are electrically connected to the lands, wirings, and lands 24a of the circuit board 11 corresponding to the terminals 22a. That is, the contact spring 23 serves as a shield for the connector 22, and external noise that enters the circuit board 11 from the outside via the connector 22 is effectively applied to the board packing tool 12 (first molded body 30) as GND. Can escape. Further, the substrate packing tool 12 and the housing 13 are provided with through holes 33 and 42 for exposing the connector 22 to the outside, respectively, but even if such through holes 33 and 42 are provided, The contact spring 23 can effectively shield electromagnetic waves entering and exiting through the through holes 33 and 42.

  In the present embodiment, the molded bodies 30 and 31 are formed by pressure forming. When the compressed air molding method is used in this way, the molded bodies 30 and 31 can be manufactured thin and lightweight at low cost. However, in addition to pressure forming, vacuum forming, hot pressing, or the like can be employed.

  In the present embodiment, an example in which the concave portion 40b of the first case 40 is not in contact with the second concave portion 30c of the first molded body 30 with which the contact spring 23 contacts is shown. However, it is good also as a structure where the housing | casing 13 has a convex part for pressing the electroconductive woven fabric (molded object) interposed between contact springs 23 in the part facing contact springs 23. In the example shown in FIG. 4, a convex portion 44 that protrudes toward the circuit board 11 is provided in the concave portion 40 b of the first case 40. When the first case 40 and the second case 41 are assembled, the convex portion 44 is The second recess 30c of the first molded body 30 is pressed to be deformed, and the contact spring 23 is elastically deformed through the deformed second recess 30c. According to this, the contact state between the second recess 30c and the contact spring 23 can be made better. FIG. 4 is a cross-sectional view showing a modification, and corresponds to FIG.

  In the present embodiment, an example in which the electronic component 21 is mounted on the front and back surfaces 11a and 11b of the circuit board 11 is shown. However, a configuration in which the electronic component 21 is mounted on only one of them may be adopted.

  Moreover, in this embodiment, the example which the convex part 43 for making the edge parts 30a and 31a of the molded objects 30 and 31 adhere more reliably to the inner peripheral site | part of the edge part 40a of the 1st case 40 was shown. . However, the second case 41 may have a convex portion 43.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.

  Since the electronic device shown in the present embodiment is often in common with that according to the first embodiment, the detailed description of the common parts will be omitted below, and different parts will be described mainly. Moreover, in this embodiment, the same code | symbol shall be provided about the same element as 1st Embodiment.

  In 1st Embodiment, the board | substrate packing tool 12 showed the example which consists of the two molded objects 30,31. On the other hand, this embodiment is characterized in that the substrate packing tool 12 is formed of a single conductive woven fabric formed by metal plating a resin woven fabric.

The substrate packing tool 12 which is one molded body includes a part covering the front surface 11a side of the circuit board 11 ( hereinafter simply referred to as a front surface part ) and a part covering the back surface 11b side of the circuit board 11 ( hereinafter simply referred to as a back surface part). Show). The first molded body 30 surface sites have been described above, the back surface portion is substantially the same structure as the second molded body 31 as described above.

Moreover, the surface site | part and the back surface site | part are connected via the connection site | part . Specifically, of the surface portion and the rear surface portion of the flat rectangular shape, only the rectangular one side is more connected to the connecting site. This connection part is provided with a notch , which can be bent to form the internal space S1. That is, the substrate packing tool 12 has a so-called egg pack-like structure.

And the edge part of the front surface part and the edge part of the back surface part are clamped by the edge parts 40a and 41a of the 1st case 40 and the 2nd case 41 which comprise the housing | casing 13, in the state which accumulated both edge parts . . Further, the edge portions 40a and 41a of the first case 40 and the second case 41 also sandwich the bent connection portion . Thereby, the substrate packing tool 12 that performs omnidirectional electromagnetic shielding with respect to the circuit board 11 is configured. Therefore, also in this embodiment, sewing with a conductive thread and fixing with a conductive adhesive tape are unnecessary, and the manufacturing cost of the electronic device 10 can be reduced.

In addition, the edge part and the surface 11a side of a connection part correspond to the edge part of the site | part which covers the surface side as described in a claim , and the edge part and the back surface 11b side of a connection part are in a claim. This corresponds to the edge of the portion covering the back side.

  As described above, the electronic device 10 according to the present embodiment can be expected to have the same effect as the electronic device 10 illustrated in the first embodiment.

(Third embodiment)
Next, a third embodiment of the present invention will be described.

  Since the electronic device shown in this embodiment is often in common with the above-described embodiments, detailed description of the common parts will be omitted, and different parts will be described mainly. Moreover, in this embodiment, the same code | symbol shall be provided about the same element as said each embodiment.

In 1st Embodiment, the board | substrate packing tool 12 showed the example which consists of the two molded objects 30,31. In contrast, the present embodiment is characterized in that the substrate packing tool 12 is formed of a molded body and a metal plate .

The board packaging tool 12 has a molded body having substantially the same structure as the first molded body 30 shown in the first embodiment as a portion covering the front surface 11 a side of the circuit board 11, and the back surface 11 b side of the circuit board 11. A flat metal plate made of a metal material is provided as a portion covering the substrate .

  The circuit board 11 has the electronic component 21 mounted only on the surface 11a side, and the connector 22 and the contact spring 23 are also mounted on the surface 11a side.

The first recess 41b of the second case 41, a second recess 41c and a flat configuration, i.e., the second case 41 has a concave structure of the two-stage edge 41a as a reference.

And the edge part of the molded object and the edge part of a metal plate are clamped by edge part 40a, 41a of the 1st case 40 and the 2nd case 41 which comprise the housing | casing 13, in the state which accumulated both edge parts . . Thereby, the board | substrate packing tool 12 provided with internal space S1 which accommodates the circuit board 11 is comprised. That is, the substrate packing tool 12 that performs electromagnetic wave shielding in all directions with respect to the circuit board 11 is configured. Therefore, also in this embodiment, sewing with a conductive thread and fixing with a conductive adhesive tape are unnecessary, and the manufacturing cost of the electronic device 10 can be reduced.

As described above, the electronic device 10 according to the present embodiment can be expected to have the same effect as the electronic device 10 illustrated in the first embodiment. A more resin woven fabric molded body and the metal plate obtained by molding the conductive fabric and metal plating, and the substrate packaging component 12 is configured, as the substrate packaging component 12, the main material is a resin fabric Includes molded bodies . Therefore, although it becomes heavier than the electronic device 10 of the above-described embodiment, the electronic device 10 can be reduced in weight as compared with a conventional metal casing.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

In the present embodiment, as the various molded articles, an example of a molded article comprising a resin fabric only conductive fabric and metal plating. However, as shown in FIG. 5 , for example, a laminated woven fabric of a conductive woven fabric 12a obtained by metal plating a resin woven fabric and a non-conductive woven fabric 12b made of a resin woven fabric (without metal plating) is formed. The conductive woven fabric 12 a may be configured to form the inner surfaces 30 d and 31 d of the substrate packing tool 12. In the example shown in FIG. 5 , the laminated woven fabric is applied to the configuration shown in the first embodiment, but may be applied to the configurations shown in the second embodiment and the third embodiment. it can. Such a laminated woven fabric may be formed by integrating an electrically conductive woven fabric and a non-conductive woven fabric with an adhesive interposed therebetween, or by softening the non-conductive woven fabric at the time of molding. And the non-conductive woven fabric may be integrated by close contact. FIG. 5 is a cross-sectional view showing another modification of the substrate packing tool 12 and corresponds to FIG.

In the present embodiment, an example in which the housing 13 includes two cases 40 and 41 has been described. However, as in the substrate packing tool 12 shown in the second embodiment, a part 140 that covers the front surface 11a side of the circuit board 11 (hereinafter simply referred to as the front surface part 140) and a part that covers the back surface 11b side of the circuit board 11 141 (hereinafter simply referred to as a back surface portion 141), and the front surface portion 140 and the back surface portion 141 may be connected via a connecting portion 143. In the example shown in FIG. 6 , the front surface portion 140 has substantially the same structure as the above-described first case 40 and the back surface portion 141 has the same structure as the above-described second case 41. A code obtained by adding 100 to the code is given. Moreover, only one side is connected by the connection part 143 among the surface part 140 and the back surface part 141 of a plane rectangular shape, and the notch 143a is provided in the connection part 143. FIG. Thereby, it can be bent to form the internal space S2. That is, the housing 13 has a so-called egg pack-like structure. FIG. 6 is a cross-sectional view showing another modification of the housing 13.

  In the present embodiment, an example in which the first case 40 and the second case 41 are assembled by the screw 51 to form the housing 13 is shown. However, the fixing method of the two cases 40 and 41 is not limited to screw fastening. For example, the fitting by the fitting protrusion and fitting groove which make a pair is also employable.

  In the present embodiment, the circuit board 11 is fixed to the board packing tool 12 by the common screw 50, and the circuit board 11 and the board packing tool 12 are fixed to the second case 41. However, the screw that fixes the circuit board 11 to the board packing tool 12 and the screw that fixes the circuit board 11 and the board packing tool 12 to the second case 41 may be separated (may be separate). Further, a screw for fixing the circuit board 11 and the first molded body 30 and a screw for fixing the circuit board 11 and the second molded body 31 may be separated. Furthermore, a screw for fixing the second molded body 31 to the second case 41, a screw for fixing the circuit board 11 to the second case 41, and a screw for fixing the first molded body 30 to the second case 41 may be divided. .

  Moreover, the structure of the circuit board 11, the board | substrate packing tool 12, and the housing | casing 13 is not limited to the said example. For example, in 1st Embodiment or 2nd Embodiment, the 1st recessed part 41b of the 2nd case 41 is good also as a 2 step | paragraph recessed structure on the basis of the 2nd recessed part 41c, ie, the edge 41a.

DESCRIPTION OF SYMBOLS 10 ... Electronic device 11 ... Circuit board 12 ... Board packaging tool 13 ... Housing 30 ... 1st molded object 31 ... 2nd molded object 30a, 31a ... Edge 40 ... 1st case 41 ... 2nd case 40a, 41a ... Edge S1 ... 1st interior space

Claims (10)

A circuit board on which electronic components are mounted on at least one of the first main surface and the second main surface which is the back surface of the first main surface;
A circuit packer for accommodating the circuit board in a first internal space and performing electromagnetic wave shielding of the circuit board;
The circuit board is configured to be openable and closable in a thickness direction, and has a first case disposed on the first main surface side and a second case disposed on the second main surface side with respect to the circuit board. An electronic device comprising: a resin housing that houses the board packaging device including the circuit board in a second internal space formed in a state where the first case and the second case are assembled;
The substrate packing tool includes a first molded body that covers a first main surface side of the circuit board as a molded body of a conductive woven fabric obtained by metal plating a resin woven fabric, and a second main surface side of the circuit board. A second molded body covering
The annular edge of the first molded body and the annular edge of the second molded body overlap with each other in the thickness direction, and are sandwiched between the first case and the second case. An electronic device. A circuit board on which electronic components are mounted on at least one of the first main surface and the second main surface which is the back surface of the first main surface;
A circuit packer for accommodating the circuit board in a first internal space and performing electromagnetic wave shielding of the circuit board;
The circuit board is configured to be openable and closable in a thickness direction, and has a first case disposed on the first main surface side and a second case disposed on the second main surface side with respect to the circuit board. An electronic device comprising: a resin housing that houses the board packaging device including the circuit board in a second internal space formed in a state where the first case and the second case are assembled;
The substrate packing tool is formed of a conductive woven fabric formed by metal plating a resin woven fabric,
The molded body is integrally formed with a portion covering the first main surface side of the circuit board and a portion covering the second main surface side of the circuit board,
In the molded body, an edge of a portion covering the first main surface side and an edge of a portion covering the second main surface side overlap each other in the thickness direction, and the first case and the second An electronic apparatus, wherein the electronic device is sandwiched between the first case and the second case in a state where the case is assembled. Of the first main surface and the second main surface that is the back surface of the first main surface, a circuit board on which electronic components are mounted on the first main surface;
A circuit packer for accommodating the circuit board in a first internal space and performing electromagnetic wave shielding of the circuit board;
The circuit board is configured to be openable and closable in a thickness direction, and has a first case disposed on the first main surface side and a second case disposed on the second main surface side with respect to the circuit board. An electronic device comprising: a resin housing that houses the board packaging device including the circuit board in a second internal space formed in a state where the first case and the second case are assembled;
The substrate packaging tool includes a conductive woven fabric formed by metal plating a resin woven fabric as a portion covering the first main surface side of the circuit board, and a portion covering the second main surface side of the circuit board. As a metal plate,
In the substrate packaging tool, the annular edge of the molded body and the annular edge of the metal plate overlap each other in the thickness direction, and the first case and the second case are assembled. An electronic apparatus characterized by being sandwiched between the first case and the second case.   Among the sandwiched parts of the board packing tool in the first case and the sandwiched parts of the board packing tool in the second case, the molded body is interposed between the circuit board and a plurality of convex portions. The electronic device according to claim 1, wherein the electronic device is provided at a predetermined interval. The first case and the second case are assembled to each other by a plurality of fixing parts to form the resin casing,
The electronic device according to claim 4, wherein the convex portion is provided between the fixing portions adjacent to each other.   6. The circuit board is made of a metal material, and a contact spring for electrically connecting the GND pattern of the circuit board and the conductive woven fabric is mounted thereon. The electronic device according to item 1.   The said resin housing | casing has a convex part for pressing the said conductive woven fabric interposed between the said contact springs in the site | part facing the said contact springs. Electronic equipment.   The electronic device according to claim 6, wherein the contact spring is provided around a connector mounted on the circuit board.   The electronic device according to claim 1, wherein the molded body is formed by pressure forming. The molded body is formed by molding a laminated woven fabric of a conductive woven fabric obtained by metal plating a resin woven fabric and a non-conductive woven fabric made of a resin woven fabric,
The electronic device according to claim 1, wherein the conductive woven fabric forms an inner surface of the substrate packing tool.

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