JP5075769B2 - Semiconductor chip pickup device and semiconductor chip pickup method using the same - Google Patents

Description

  The present invention relates to a semiconductor chip pickup device for peeling a semiconductor chip mounted on the surface of an adhesive sheet from the adhesive sheet, and a semiconductor chip pickup method using the same.

  As a conventional semiconductor chip pickup device used in the manufacturing process of a semiconductor device, for example, there are those described in Patent Documents 1 and 2.

  In the semiconductor chip pickup device described in Patent Document 1, a dicing sheet to which a semiconductor chip (hereinafter also referred to as a chip) is attached is placed on a stage, and a roller having a plurality of protruding members is rotated while these protruding members are rotated. Push up from the bottom of the dicing sheet.

  The pickup device for a semiconductor chip described in Patent Document 2 places a dicing sheet on which a chip is attached on a stage, and slides a plurality of projecting members from the stage under the dicing sheet.

In recent years, with the thinning of packages, there is a demand for thinning of chips.
JP 2003-224088 A JP 2005-328054 A

  However, in the prior art described in the above document, when trying to pick up a thin chip, the chip cannot be withstood to peel off the chip from the adhesive sheet, and the chip is cracked or chipped. This problem becomes more prominent with larger chips. Therefore, there is a concern that the yield of large thin semiconductor chips will decrease.

According to the present invention, there is provided a semiconductor chip pickup device for peeling a semiconductor chip mounted on the surface of an adhesive sheet from the adhesive sheet,
A stage on which the adhesive sheet is placed;
A plurality of sliders that are in contact with the back surface of the adhesive sheet, move in a horizontal direction with respect to the semiconductor chip in a plan view , and are individually movable ;
A slider accommodating portion formed on the stage and accommodating the plurality of sliders;
A suction mechanism connected to the stage and sucking the slider housing;
Have
On the stage, the adhesive sheet is placed at a position where the semiconductor chip faces the slider accommodating portion,
The plurality of sliders are arranged in parallel and spaced apart from each other so as to face one of the semiconductor chips.

Further, a semiconductor chip pickup method for peeling a semiconductor chip mounted on the surface of an adhesive sheet from the adhesive sheet using a pickup device,
The pickup device is
A stage on which the adhesive sheet is placed;
A plurality of semiconductor chips that are arranged in parallel with each other facing the semiconductor chip, are in contact with the back surface of the adhesive sheet, move in a horizontal direction with respect to the semiconductor chip in a plan view , and are individually movable And the slider
A slider accommodating portion formed on the stage and accommodating the plurality of sliders;
A suction mechanism connected to the stage and sucking the slider housing;
With
Placing the adhesive sheet on the stage at a position where the slider housing part faces the semiconductor chip, and bringing the adhesive sheet into contact with the slider;
Suctioning the slider housing;
Moving the slider in a horizontal direction with respect to the semiconductor chip in plan view;
A method for picking up a semiconductor chip is provided.

  According to the present invention, the plurality of sliders accommodated in the slider accommodating portion are in contact with the pressure-sensitive adhesive sheet, and are arranged in parallel so as to be separated from each other so as to face one semiconductor chip. As a result, a space closed by the adhesive sheet is formed in the gap between the sliders, and the suction mechanism sucks the slider accommodating portion, so that a negative pressure can be generated in the gap between the sliders. Can be peeled off from the semiconductor chip. Further, since negative pressure is also generated in the space formed by the peripheral portion of the slider accommodating portion and the adhesive sheet, the adhesive sheet facing the peripheral portion of the slider accommodating portion can also be sucked and peeled off from the semiconductor chip. Accordingly, a plurality of peeling starting points dispersed from each other are formed, and by moving the slider in the horizontal direction with respect to the semiconductor chip, the peeling portion can be gradually increased from the above starting points. Therefore, it is possible to disperse the force applied to the semiconductor chip when the adhesive sheet is peeled from the semiconductor chip, and it is possible to prevent cracking even in a large thin chip.

  The various components of the present invention do not have to be individually independent, but a plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps a part of another component, and the like.

  According to the present invention, even a thin semiconductor chip can be peeled from an adhesive sheet while preventing cracking. Therefore, the yield in the semiconductor chip pickup process can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  1 and 2 are schematic views showing the pickup device 1 of the present embodiment. FIG. 1 is a side view of the pickup device 1 of the present embodiment. 2 and 3 are plan views of the pickup device 1 of the present embodiment.

  The pickup device 1 is a semiconductor chip pickup device that peels off a semiconductor chip 12 mounted on the surface of a dicing sheet (adhesive sheet) 13 from the dicing sheet 13. The pickup apparatus 1 includes a stage 100 on which the dicing sheet 13 is placed, and sliders 201a, 201b, 201c, and 201d that are in contact with the back surface of the dicing sheet 13 and move in the horizontal direction with respect to the semiconductor chip 12 in plan view. And a slider accommodating portion 102 that accommodates each slider, and a suction mechanism 500 that is connected to the stage 100 and sucks the slider accommodating portion 102. A dicing sheet 13 is placed on the stage 100 at a position where the semiconductor chip 12 faces the slider accommodating portion 102. The sliders 201a, 201b, 201c, and 201d are arranged in parallel so as to face the one semiconductor chip 12 and are separated from each other.

The distance between the sliders can be set to an optimum distance according to the size and thickness of the chip, the magnitude of the negative pressure generated from the suction mechanism 500, and the adhesive force of the dicing sheet. The distance can be approximately the same as the distance of the gap formed between the peripheral edge and each slider. FIG. 3A is an enlarged view of the slider accommodating portion 102 portion. As shown in FIG. 3A, if the design is made so that d ₁ = d ₂ , a tensile force can be applied uniformly. It is also possible to design the slider intervals to be different from each other.

  The pickup device 1 also includes a control unit (not shown) that horizontally moves the sliders 201a, 201b, 201c, and 201d. The control unit can move the sliders 201a, 201b, 201c, and 201d in an arbitrary order, or can move them simultaneously.

  The pickup device 1 can be suitably used for picking up a semiconductor chip 12 having a size of 1 to 20 mm and a substrate thickness of 5 to 200 μm. The semiconductor chip 12 picked up by the pickup device 1 is used for manufacturing a device such as a mobile LSI.

  The expander 200 is a unit that fixes a wafer ring (not shown). After the semiconductor wafer 600 is diced, it is mounted on the expander 200 and expanded.

  FIG. 4 is a diagram illustrating an operation in which the pickup device 1 peels the semiconductor chip 12 from the dicing sheet 13. 4A to 4C are cross-sectional views of the pickup device 1. The operation of peeling the semiconductor chip 12 from the dicing sheet 13 will be described with reference to FIGS.

  First, the sliders 201a, 201b, 201c, and 201d are accommodated in the slider accommodating portion 102 (FIG. 2A), and the dicing sheet 13 is placed on the stage 100 from the back surface at a position where the slider accommodating portion 102 faces the semiconductor chip 12. Place. By doing so, the dicing sheet 13 comes into contact with each of the sliders 201a, 201b, 201c, and 201d, and a closed space is formed between the slider accommodating portion 102 and the dicing sheet 13. A closed space closed by the dicing sheet 13 is also formed in the gap between the sliders. The semiconductor wafer 600 is diced, and the dicing sheet 13 is expanded. The diced semiconductor wafer 600 is composed of a plurality of semiconductor chips 12.

  Next, the slider housing portion 102 is sucked by the suction mechanism 500 (FIG. 4A). By doing so, a negative pressure is generated in the closed space formed between the slider accommodating portion 102 and the dicing sheet 13. As a result, a negative pressure is also generated in the closed space formed by the dicing sheet 13 in the gaps between the sliders 201a, 201b, 201c, and 201d. Therefore, the dicing sheet 13 that closes the gap between the sliders is peeled off from the semiconductor chip 12.

  In addition, gaps having a predetermined width are formed between the sliders 201 a and 201 d and the slider accommodating portion 102. Therefore, this gap is also sucked by the suction mechanism 500. Accordingly, the dicing sheet 13 held facing the peripheral edge of the slider accommodating portion 102 is sucked and peeled off from the semiconductor chip 12. In FIG. 2A, the shape of the semiconductor chip 12 is indicated by a broken line. As described above, the dicing sheet 13 is placed on the stage 100 so that the peripheral edge of the slider housing portion 102 and the peripheral edge of the semiconductor chip 12 are opposed to each other. When disposed, the dicing sheet 13 adhered to the peripheral edge of the semiconductor chip 12 can be peeled off. At this time, by appropriately controlling the suction force, it can be peeled off with an appropriate suction force, and chipping of the semiconductor chip 12 can be prevented.

  In this way, the dicing sheet 13 facing the position indicated by the dotted line in FIG. 3B is peeled from the semiconductor chip 12.

  Next, as shown in FIG. 4B, the sliders 201 b and 201 c are moved in the horizontal direction with respect to the semiconductor chip 12 in plan view.

  Here, the dicing sheet 13 is pulled in by a negative pressure in the gap between the slider 201 a and the slider 201 b and peeled off from the semiconductor chip 12. Therefore, a separation starting point is formed in a part of the dicing sheet 13 in the gap between the slider 201a and the slider 201b. Therefore, by moving the sliders 201b and 201c, the peeling portion can be gradually increased in the horizontal direction from the starting point of the peeling.

  Further, the portion of the dicing sheet 13 that faces the peripheral edge of the slider accommodating portion 102 is also peeled off from the semiconductor chip 12. Therefore, similarly, a separation starting point is formed in the gap between the slider 201b and the slider 201c and the gap between the slider 201c and the slider 201d. Therefore, as described above, when the slider 201b and the slider 201c move horizontally, the peeling portion can be gradually increased in the horizontal direction from the starting point of the peeling.

  In other words, it can be said that the separation starting point is formed in the dicing sheet 13 in contact with the portion indicated by the dotted line in FIG. Then, the sliders 201a, 201b, 201c, and 201d are individually moved, so that the peeled portion of the dicing sheet 13 can be gradually increased from a plurality of starting points dispersed from each other (FIG. 2 (c)). In this way, the entire semiconductor chip 12 is peeled from the dicing sheet 13.

  The peeled semiconductor chip 12 is picked up by being attracted to the bonding head 300 shown in FIG. The bonding head 300 mounts the picked-up semiconductor chip 12 on the die mounter 400. By placing the mounting substrate on the die mounter 400, the semiconductor chip 12 can be mounted on the substrate.

  Next, operational effects of the pickup device 1 will be described with reference to FIGS. According to the pickup device 1, the sliders 201 a, 201 b, 201 c, and 201 d accommodated in the slider accommodating unit 102 are in contact with the dicing sheet 13 and are arranged in parallel so as to be opposed to one semiconductor chip 12. . As a result, a space closed by the dicing sheet 13 is formed in the gap between the sliders, and the suction mechanism 500 sucks the slider accommodating portion 102, so that a negative pressure can be generated in the gap between the sliders. A part of the dicing sheet 13 can be peeled off from the semiconductor chip 12. Further, since negative pressure is also generated in the space formed by the peripheral portion of the slider accommodating portion 102 and the dicing sheet 13, the dicing sheet 13 facing the peripheral portion of the slider accommodating portion 102 is also sucked from the semiconductor chip 12. Can be peeled off. Therefore, a plurality of separation starting points dispersed from each other are formed, and by moving the sliders 201a, 201b, 201c, and 201d in the horizontal direction with respect to the semiconductor chip, the separation part can be gradually enlarged from the above starting points. it can. Therefore, it is possible to disperse the force applied to the semiconductor chip 12 when the dicing sheet 13 is peeled from the semiconductor chip 12, and it is possible to prevent cracking even in a large thin chip.

  Moreover, the semiconductor chip 12 can be efficiently peeled from the dicing sheet 13 by controlling the movement of the sliders 201a, 201b, 201c, and 201d.

  For example, by moving the sliders 201a, 201b, 201c, and 201d individually with respect to the semiconductor chip 12, it is possible to effectively peel off portions having poor peelability.

  Further, the moving speeds of the sliders 201a, 201b, 201c, and 201d can be arbitrarily changed. For example, when the peelability is poor, the slider can be moved quickly to increase the peel force. On the other hand, the semiconductor chip 12 can be gradually peeled from the dicing sheet 13 by gradually moving the slider at a place where the crack or chipping of the semiconductor chip 12 is a concern. Therefore, it is possible to efficiently peel the semiconductor chip 12 from the dicing sheet 13 while preventing the semiconductor chip 12 from cracking.

  By the way, when the dicing sheet 13 is arranged on the stage 100 so that the peripheral edge of the slider accommodating portion 102 and the peripheral edge of the semiconductor chip 12 are opposed to each other, a slider other than the peripheral portion (in the example of FIG. 2, the slider 201b, By moving 201c) first, a cavity is formed at a position facing the central portion of the semiconductor chip 12. Then, depending on the size and thinness of the semiconductor chip 12, there is a concern that the semiconductor chip 12 may be drawn into a negative pressure and strain cracked. Therefore, when there is such a concern, the sliders (slider 201a and slider 201d in the example of FIG. 2) on the peripheral edge of the slider housing portion 102 are moved first, and then the other sliders (in the example of FIG. 2). , Slider 201b and slider 201c) can be moved. The cavity formed by the movement of the sliders (sliders 201a and 201d) at the peripheral edge of the slider housing portion 102 is smaller than the cavity formed by the movement of the sliders 201b and 201c. Therefore, distortion and cracking of the semiconductor chip 12 can be suppressed.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

  For example, as shown in FIG. 5, the sliders 201 a, 201 b, 201 c, and 201 d may each include a plurality of slits 103 on the side in contact with the dicing sheet 13. The slit 103 communicates with the slider accommodating portion 102. FIG. 5 is a plan view showing a pickup device 2 which is a modification of the pickup device 1. The pickup device 2 is different from the pickup device 1 only in that each slider includes a slit 103.

  The slit 103 extends in a direction intersecting with the moving direction of each slider, preferably at a right angle, in plan view, and reaches each side surface of the sliders 201a, 201b, 201c, and 201d.

  Since the dicing sheet 13 is placed on the stage 100 at a position where the slider accommodating portion 102 faces the semiconductor chip 12, the dicing sheet 13 comes into contact with each of the sliders 201a, 201b, 201c, and 201d, and the slit 103 of each slider. A space communicating with the slider accommodating portion 102 is formed between the slit 103 and the dicing sheet 13 by covering the upper surface of the substrate with the dicing sheet 13.

  In the pickup device 2, when the slider accommodating portion 102 is sucked by the suction mechanism 500, negative pressure is also generated in the space formed between the slit 103 and the dicing sheet 13. Therefore, the dicing sheet 13 is peeled off from the semiconductor chip 12 and comes into contact with the slit 103.

  In FIG. 5A, the shape of the semiconductor chip 12 is indicated by a broken line, but as shown in the figure, the slit 103 is formed at a position corresponding to the central part of the semiconductor chip 12 so that the central part of the semiconductor chip 12 is removed. The dicing sheet 13 can be peeled off. By doing so, the central portion of the semiconductor chip 12 which is difficult to peel can be peeled off.

  Next, as described in the pickup device 1, the sliders 201 a, 201 b, 201 c, and 201 d are moved in the horizontal direction with respect to the semiconductor chip 12 in plan view, but as described above, the slit 103 of the dicing sheet 13 and Since the facing part is peeled off from the semiconductor chip 12, the starting point of peeling is formed. Therefore, by moving each slider, the peeling portion can be gradually increased in the horizontal direction from the starting point of the peeling. Therefore, in the pickup device 2, the starting point of peeling can be further increased and the peeling force can be increased.

  According to the pickup device 2, the slit 103 provided on the side of the sliders 201 a, 201 b, 201 c, 201 d in contact with the dicing sheet 13 communicates with the slider accommodating portion 102. As a result, the suction mechanism 500 sucks the slider housing portion 102 to suck the slit 103 and generate negative pressure in the space formed by the slit 103 and the dicing sheet 13. The dicing sheet 13 can be sucked by this negative pressure, and a part of the dicing sheet 13 can be peeled off from the semiconductor chip 12. Therefore, it is possible to further increase the number of separation starting points dispersed from each other. When the sliders 201a, 201b, 201c, and 201d are individually moved in the horizontal direction with respect to the semiconductor chip 12, the peeling portion is gradually enlarged from the starting point, and the dicing sheet 13 is peeled from the semiconductor chip 12. Further, the force applied to the semiconductor chip 12 can be dispersed.

  Further, as shown in FIG. 5A, the dicing sheet 13 is held on the stage 100 so that the slit 103 and the central portion of the semiconductor chip 12 face each other, so that the dicing sheet 13 facing the slit 103 is removed. It can be sucked into the slit 103, and a horizontal pulling force can be applied to the dicing sheet 13 to which the central portion of the semiconductor chip 12 is attached. Therefore, it is possible to accelerate the peeling by applying a pulling force in the horizontal direction to the dicing sheet 13 to which the chip central portion that is difficult to peel is attached.

  Needless to say, the above-described embodiments and modifications can be combined within a range in which the contents do not conflict with each other. Further, in the above-described embodiments and modifications, the structure of each part has been specifically described, but the structure and the like can be changed in various ways within the scope of the present invention.

It is a typical side view showing a pickup device concerning an embodiment. It is a top view of the pick-up apparatus concerning an embodiment. It is a top view of the pick-up apparatus concerning an embodiment. It is a figure explaining operation | movement of the pick-up apparatus which concerns on embodiment. 4A to 4C are cross-sectional views of the pickup device according to the embodiment. It is a top view of the pick-up apparatus which concerns on the modification of embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pickup apparatus 2 Pickup apparatus 12 Semiconductor chip 13 Dicing sheet 100 Stage 102 Slider accommodating part 103 Slit 200 Expander 201a Slider 201b Slider 201c Slider 201d Slider 300 Bonding head 400 Dimounter 500 Suction mechanism 600 Semiconductor wafer

Claims (5)

A semiconductor chip pickup device for peeling a semiconductor chip mounted on the surface of an adhesive sheet from the adhesive sheet,
A stage on which the adhesive sheet is placed;
A plurality of sliders that are in contact with the back surface of the adhesive sheet, move in a horizontal direction with respect to the semiconductor chip in a plan view , and are individually movable ;
A slider accommodating portion formed on the stage and accommodating the plurality of sliders;
A suction mechanism connected to the stage and sucking the slider housing;
Have
On the stage, the adhesive sheet is placed at a position where the semiconductor chip faces the slider accommodating portion,
The semiconductor chip pickup device, wherein the plurality of sliders are arranged in parallel and spaced apart from each other so as to face the one semiconductor chip. The plurality of sliders include at least one slit on the side where each slider contacts the adhesive sheet,
The semiconductor chip pickup device according to claim 1 , wherein the slit communicates with the slider accommodating portion. 3. The semiconductor chip pickup device according to claim 2 , wherein the slit extends at a right angle to the moving direction of the slider in a plan view. A method for picking up a semiconductor chip by peeling a semiconductor chip mounted on the surface of the pressure-sensitive adhesive sheet from the pressure-sensitive adhesive sheet using a pickup device,
The pickup device is
A stage on which the adhesive sheet is placed;
A plurality of semiconductor chips that are arranged in parallel with each other facing the semiconductor chip, are in contact with the back surface of the adhesive sheet, move in a horizontal direction with respect to the semiconductor chip in a plan view , and are individually movable And the slider
A slider accommodating portion formed on the stage and accommodating the plurality of sliders;
A suction mechanism connected to the stage and sucking the slider housing;
With
Placing the adhesive sheet on the stage at a position where the slider housing part faces the semiconductor chip, and bringing the adhesive sheet into contact with the slider;
Suctioning the slider housing;
Moving the slider in a horizontal direction with respect to the semiconductor chip in plan view;
A method for picking up a semiconductor chip, comprising: In the step of contacting the adhesive sheet to the slider according to claim 4, the peripheral portion of the semiconductor chip and the slider receiving portion of the peripheral portion and wherein the placement of the adhesive sheet at a position facing A method for picking up a semiconductor chip.

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