JP2007103826A - Semiconductor chip pickup device - Google Patents

Abstract

Provided is a semiconductor chip pick-up device in which a semiconductor chip can be peeled off from an adhesive sheet and picked up easily and reliably without causing damage to a semiconductor chip having a special structure.
A bump drive device 17 is driven and a bump member 11 pushes up a semiconductor chip 15 via an adhesive sheet 16. At this time, the spherical tip 11a of the protrusion member 11 contacts the lower peripheral edge or the inner wall surface of the opening 15a on the back surface of the semiconductor chip 15, but does not contact the wafer above the recess 15b. Next, the vacuum device 13 is operated to generate a vacuum state between the adhesive sheet 16 and the pickup stage 12, and the adhesive sheet 16 is vacuum-sucked from the suction path 14 in the pickup stage 12 around the protruding member 11. Then, the pressure-sensitive adhesive sheet 16 is peeled from the semiconductor chip 15 by pulling the surface of the pressure-sensitive adhesive sheet 16 opposite to the bonding surface of the semiconductor chip 15.
[Selection] Figure 1

Description

  The present invention relates to a pickup device that is used in a manufacturing process of a semiconductor device and peels off from an adhesive sheet that holds a semiconductor chip, and is particularly applied to a hollow or concave semiconductor chip having an opening on the back surface.

  A conventional semiconductor chip pickup device will be described with reference to the drawings.

  FIGS. 4A to 4D are schematic sectional views of a conventional semiconductor chip pickup device and a partial cross-sectional view for explaining the operation thereof. 1 is a semiconductor chip, 2 is an adhesive sheet for adhering and holding the semiconductor chip 1 The dicing sheet 3 is a pickup stage for guiding the vertical movement of the protruding pin 4. Conventionally, the protruding pin 4 is lifted from the lower side of the dicing sheet 2, and the semiconductor chip 1 is moved to the dicing sheet 2. It was the structure which peels from the dicing sheet 2 by pushing up through.

  More specifically, as shown in FIG. 4A, the protrusion pin 4 is moved up and down by a drive means that reciprocates up and down on the pickup stage 3, for example, a servo motor, and is diced by the protrusion pin 4. The semiconductor chip 1 is pushed up through the sheet 2, and the semiconductor chip 1 is peeled off from the dicing sheet 2. After peeling off, the semiconductor chip 1 is moved to a predetermined position on a substrate such as a lead frame by a conveying means (not shown) and die bonded.

  However, the shape of the semiconductor chip 1 is not a flat plate shape as shown in FIGS. 4A and 4B, and the bottom surface of the semiconductor chip 1 is hollow 1a as shown in FIGS. 4C and 4D. In the case of a special configuration such that the inner central portion of the hollow 1a cannot be touched, as shown in FIG. If the position accuracy varies, the protruding pin 4 comes off from the guide of the pickup stage 3, and the tip of the protruding pin 4 comes into contact with a portion of the semiconductor chip 1 that should not be contacted. May cause problems.

  Further, since the protruding pin 4 is in a point contact state with respect to the semiconductor chip 1, there has been a problem that damage such as scratches and chips is likely to occur on the back surface of the semiconductor chip 1 or the inner wall portion of the hollow 1a.

Therefore, in the pickup mechanism described in Patent Document 1, as shown in the perspective view of FIG. 5, the protruding member 6 provided on the pickup stage 5 so as to be movable up and down is shaped like a flat plate. In addition, by making the tip side gradually tapered toward the tip and making it linearly contact with the semiconductor chip 7, the semiconductor chip 7 is pushed up through the dicing sheet 8 in a stable state, It is supposed to be peeled off.
JP 2004-47708 A

  However, it is difficult to process the shape of the tip of the push-up member 6 as shown in FIG. 5, and the cost becomes high. Further, when adsorption occurs, a special structure as shown in FIGS. 4 (c) and 4 (d). The semiconductor chip 1 has a problem that the hollow 1a on the back surface is easily damaged.

  The present invention solves the above-described conventional problems, and can pick up a semiconductor chip from an adhesive sheet easily and reliably without causing damage to a semiconductor chip having a special structure. The purpose is to provide.

  In order to achieve the above object, a semiconductor chip pick-up device according to the present invention pushes up and peels off the semiconductor chip from an adhesive sheet that adheres and holds the back surface side of a hollow or concave semiconductor chip having an opening on the back surface. A semiconductor chip pick-up device capable of projecting a protruding member that pushes up an inner wall surface portion of the hollow or concave shape of the semiconductor chip through the adhesive sheet, and from the side opposite to the semiconductor chip bonding side A suction member that sucks the pressure-sensitive adhesive sheet and peels the semiconductor chip from the pressure-sensitive adhesive sheet. With this configuration, even if the semiconductor chip has a hollow or concave shape with an opening on the back surface, the semiconductor chip Using the opening on the back side, the inner wall surface of the semiconductor chip is pushed all over by the protruding member. Raise it possible, to allow good pickups stable and accurate.

  According to the present invention, it is possible to stably and accurately pick up a semiconductor chip having a hollow or concave shape having an opening on the back surface, and it is easy to process a protruding member, which increases the cost. Therefore, it becomes a pickup device corresponding to semiconductor devices of various structures, thereby realizing improvement in productivity and yield of semiconductor device manufacturing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  A semiconductor device manufacturing method according to an embodiment of the present invention will be described with reference to the drawings.

  1A to 1C are cross-sectional views for explaining the configuration and operation of a semiconductor chip pickup apparatus according to Embodiment 1 of the present invention. Reference numeral 11 denotes a tip 11a having a spherical shape, rubber, and the like. The protruding member 12, which is an elastic member, has a guide shaft portion 11 b of the protruding member 11 that can be moved up and down at the center, and an air suction by a vacuum device 13 including an air pump that is a suction member at the inner peripheral portion. The pick-up stage 15 provided with the suction path 14 is a recess 15b having an opening 15a on the back surface or a hollow semiconductor chip that is bonded and held on the adhesive tape 16, and 17 is moved up and down the protrusion member 11. A thrust drive device 18 including a servo motor to be operated is a collet.

  The diameter of the tip end portion 11a of the protruding member 11 is slightly larger than the opening 15a on the back surface of the semiconductor chip 15, and has an outer shape that does not enter the recess 15b.

  Further, the semiconductor chip 15 used in the present embodiment has a rectangular shape with an outer size of about 2.4 mm on each side, a thickness of about 0.4 mm, and a central portion on the back surface from the opening 15a to a recess 15b having a height of about 200 μm. Furthermore, the thickness of the film thickness part 15c formed on the upper part of the recess 15b is about 20 μm, the inside of the film thickness part 15c is hollow, and the film thickness part 15c is covered with a thin film. It has a structure. In addition, the recess 15b is formed in a square shape with each side of about 1.8 mm in the semiconductor chip 15, and an end of about 0.8 mm around the periphery is bonded and held to the adhesive sheet 16.

  Next, the pickup operation of the first embodiment configured as described above will be described.

  First, as shown in FIG. 1A, the pickup stage 12 and the protruding member 11 are moved, and the tip end portion 11a of the protruding member 11 is moved to the lower surface of the semiconductor chip 15 to be picked up. In this state, the pickup stage 12 supports the semiconductor chip 15 in a horizontal state at a position where the semiconductor chip 15 contacts via the adhesive sheet 16.

  Next, the bump driving device 17 is driven, and the bump member 11 is pushed up so as to push up the semiconductor chip 15 from the lower side of the adhesive sheet 16 as shown in FIG. At this time, the spherical tip portion 11a of the protruding member 11 contacts the lower peripheral edge or inner wall surface of the opening 15a on the back surface of the semiconductor chip 15, but does not contact the wafer above the recess 15b.

  Next, the vacuum device 13 is operated to generate a vacuum state between the adhesive sheet 16 and the pickup stage 12, and as shown in FIG. 1 (c), the suction in the pickup stage 12 around the protruding member 11 is performed. The pressure-sensitive adhesive sheet 16 is peeled off from the semiconductor chip 15 by vacuum-adsorbing the pressure-sensitive adhesive sheet 16 from the path 14 and pulling the surface of the pressure-sensitive adhesive sheet 16 opposite to the bonding surface of the semiconductor chip 15.

  In this state, the semiconductor chip 15 is picked up by the collet 18 and is die-bonded by the collet 18 to a predetermined location on a substrate such as a lead frame (not shown).

  In the present embodiment, the pickup stage 12 is configured such that the back surface of the pressure-sensitive adhesive sheet 16 that holds and holds the semiconductor chip 15 and the upper surface of the pickup stage 12 are supported in a horizontal state. In this way, not only the semiconductor chip 15 is pushed up via the adhesive sheet 16 by the protruding member 11 guided by the pickup stage 12, but the adhesive sheet 16 is adsorbed by the suction path 14, Since the semiconductor chip 15 is pulled, the semiconductor chip 15 can be picked up efficiently, and the occurrence of damage such as scratches and chips on the semiconductor chip 15 can be minimized.

  2A and 2B are views for explaining a pickup stage according to the second embodiment of the present invention. FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along line AA in FIG. . In the following description, members corresponding to those already described are assigned the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 2B, the tip 21a of the protrusion member 21 has a spherical outer shape, and has a shape that does not contact the wafer at the top of the recess 15b of the semiconductor chip 15 as in the first embodiment. However, the material of the tip portion 21a of the protrusion member 21 is a rubber material that does not break the semiconductor chip 15, and a cavity 21b is formed inside.

  The inside of the cavity 21b is pressurized with hydraulic pressure or air pressure, and the tip portion 21a bulges outward from the inside, whereby the shape of the tip portion 21a of the protrusion member 21 can be controlled. .

  By doing so, it is possible to easily set the shape corresponding to various shapes and dimensions in the recess 15b of the semiconductor chip 15 and the mechanical strength.

  Further, the tip shape of the protrusion member is not limited to the spherical shape as in the above-described embodiment. For example, the tip portion 31a is formed like the protrusion member 31 in Embodiment 3 shown in FIGS. 3 (a) and 3 (b). The planar shape is a polygonal shape such as a triangle or a quadrangle, the trapezoidal shape is a small side on the side where the recess 15b is inserted, and the tip 31a is partially inserted into the recess 15b of the semiconductor chip 15. It can also be considered.

  What is required as a protruding member is that the tip is in contact with the lower end surface or inner surface of the opening 15a on the back surface of the semiconductor chip 15, but the tip is not in contact with the wafer at the top of the recess 15b. is there.

  As described above, in the present embodiment, in the pickup stage 12, the tip portions 11a, 21a, 31a are in contact with the end surface or the inner surface of the opening 15a on the back surface of the semiconductor chip 15 by the protruding members 11, 21, 31, and the recesses are formed. The semiconductor chip 15 is formed by pushing up the adhesive members 16 by the protruding members 11, 21, 31 through the adhesive sheet 16 in a state where the wafer does not contact the wafer at the top of 15 b and vacuum suction of the adhesive sheet 16 from the suction path 14. By peeling from the adhesive sheet 16, the semiconductor chip 15 can be protruded and picked up so as not to cause damage such as scratches or chips on the back surface of the semiconductor chip 15.

  The present invention is applied to a pickup device that peels a semiconductor chip from an adhesive sheet in the manufacturing process of the semiconductor device, and is particularly effective for use in picking up a specially shaped semiconductor chip in which the semiconductor chip is recessed or hollow.

(A)-(c) is sectional drawing for demonstrating the structure and operation | movement in the pick-up apparatus of the semiconductor chip which is Embodiment 1 of this invention. (A), (b) is a figure for demonstrating the pick-up stage of Embodiment 2 of this invention, (a) is a top view, (b) is AA sectional drawing of (a). (A), (b) is a figure for demonstrating the pick-up stage of Embodiment 3 of this invention, (a) is a top view, (b) is AA sectional drawing of (a). (A)-(d) is a partial cross section explaining schematic structure of the conventional semiconductor chip pick-up apparatus, and its operation | movement. The perspective view which shows schematic structure of the pick-up apparatus of the conventional semiconductor chip

Explanation of symbols

11, 21, 31 Projection members 11a, 21a, 31a Tip 11b Guide shaft 12 Pickup stage 13 Vacuum device 14 Suction path 15 Semiconductor chip 15a Opening 15b Recess 16 Adhesive tape 17 Projection drive 18 Collet 21a Cavity

Claims (4)

A semiconductor chip pick-up device capable of pushing up and removing the semiconductor chip from an adhesive sheet that adheres and holds the back surface side of the hollow or concave semiconductor chip having an opening on the back surface,
A protruding member that pushes up the inner wall surface portion of the hollow or concave shape of the semiconductor chip via the adhesive sheet, and the adhesive sheet is sucked from the side opposite to the semiconductor chip bonding side to thereby adhere the semiconductor chip to the adhesive A pickup device for a semiconductor chip, comprising: a suction member for peeling from the sheet.   2. The semiconductor chip pick-up device according to claim 1, wherein a tip portion of the protruding member is formed in a spherical shape in which a part thereof is inserted into the hollow or concave shape of the semiconductor chip.   The tip portion of the protruding member is formed in a trapezoidal cross section in which a part is inserted into the hollow or concave shape of the semiconductor chip and the insertion side is a small side. 2. A pick-up device for a semiconductor chip according to 1.   4. The pick-up device for a semiconductor chip according to claim 1, wherein a tip portion of the protruding member is formed of an elastic member and can bulge outward from the inside of the tip portion. .

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