JP4977428B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer or an optical device wafer while applying ultrasonic vibration to a cutting blade.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of sapphire substrates are divided into individual light emitting diodes, laser diodes, CCDs and other optical devices by cutting along the streets. It's being used.

  The above-described cutting along the wafer street is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a wafer, a cutting means for cutting the workpiece held on the chuck table, and a cutting for relatively moving the chuck table and the cutting means. And feeding means. The cutting means includes a cutting tool having a rotating spindle and a cutting blade mounted on the spindle, and a spindle unit having a drive mechanism for driving the rotating spindle to rotate. In such a cutting apparatus, the cutting tool and the work piece held on the chuck table are relatively cut and fed while rotating the cutting tool at a rotational speed of 20000 to 40000 rpm.

  However, brittle hard materials such as silicon, sapphire, silicon nitride, glass, and lithium tantalate are used for the wafer on which the device is formed. There is a problem of lowering. Also, a wafer with high Mohs hardness such as sapphire is very difficult if not impossible to cut with a cutting blade.

In order to solve the above-described problem, an ultrasonic vibrator is disposed on a rotating spindle on which a cutting tool equipped with a cutting blade is mounted, and an AC voltage is applied to the ultrasonic vibrator to thereby apply an ultrasonic voltage to the cutting blade. There has been proposed a cutting method in which cutting is performed while applying sonic vibration. A cutting tool used in this cutting method includes a vibration transmission member attached to a rotary spindle, and a cutting blade attached to the vibration transmission member, and transmits ultrasonic vibration that vibrates in the axial direction of the rotary spindle. Is converted into radial vibration, and radial ultrasonic vibration is applied to the cutting blade.
(For example, refer to Patent Document 1.)
Japanese Patent No. 3469516

It is desired that general cutting without applying ultrasonic vibration can be performed by mounting a general cutting tool on the rotary spindle of the above-described ultrasonic vibration cutting device.
However, the vibration transmission member (blade base) of a cutting tool for ultrasonic vibration cutting and the blade base of a cutting tool that does not impart ultrasonic vibration that are generally used have different configurations, and are used for ultrasonic vibration cutting. In order to prevent wear due to vibration, it is necessary to provide a close contact member at the joint between the vibration transmission member (blade base) of the cutting tool and the rotary spindle. For this reason, it is not possible to mount a cutting tool that does not impart ultrasonic vibration, which is generally used for a rotating spindle of a cutting apparatus for ultrasonic vibration cutting, and when cutting without applying ultrasonic vibration, There is a problem that an expensive cutting tool for ultrasonic vibration cutting must be used, which is uneconomical.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is cutting capable of mounting a cutting tool that does not impart ultrasonic vibration, which is generally used for a rotary spindle for ultrasonic vibration cutting. To provide an apparatus.

In order to solve the above main technical problem, according to the present invention, there is provided a chuck table for holding a workpiece, a rotating spindle, a cutting tool attached to the rotating spindle, and ultrasonic vibration means disposed on the rotating spindle. cutting means for cutting the workpiece held on the chuck table provided in switching cutting device comprises a power supply means, the applying high frequency power to the ultrasonic vibrating means,
A mounter for mounting a cutting tool attached to a mounter attachment provided at an end of the rotary spindle;
The mounter is provided on a blade base of a cutting tool that does not apply ultrasonic vibration, a connecting portion that is connected to the rotary spindle, a mounting hole provided in a vibration transmission member of the cutting tool for ultrasonic vibration cutting. A mounting portion that selectively fits the mounting hole, and the vibration transmitting member or ultrasonic vibration of the cutting tool for ultrasonic vibration cutting that is provided at one end of the mounting portion and is fitted to the mounting portion. A regulation part that regulates the position of the blade base of the cutting tool that is not connected, and is connected to the mounter attachment part via the contact member between the connection part,
A cutting device is provided.

An adhesion member is mounted on the inner peripheral surface of the mounting hole formed in the vibration transmission member of the cutting tool for ultrasonic vibration cutting.
The mounting part of the rotating spindle has a joining surface whose end face is perpendicular to the axis, and the connecting part of the mounter has a joining surface whose end face is perpendicular to the axis, and the mounter is a joining part of the connecting part. It connects with a close_contact | adherence member between the surface and the joint surface of a mounter attachment part.
In addition, the mounter mounting portion of the rotary spindle includes a tapered portion, the connecting portion includes a tapered recess that fits into the tapered portion, and the mounter is provided between the tapered recess of the connecting portion and the tapered portion of the mounter mounting portion. Are connected to each other through a close contact member.

According to the present invention, the mounter attached to the rotary spindle is configured to be detachable from a cutting tool for ultrasonic vibration cutting and a generally used cutting tool that does not impart ultrasonic vibration. When performing general cutting that does not apply ultrasonic vibration to the cutting blade, a cutting tool that does not apply ultrasonic vibration that is generally used is mounted on the mounter. Can be worn. Therefore, when performing general cutting without applying ultrasonic vibration to the cutting blade, it is not necessary to use an expensive cutting tool for ultrasonic vibration cutting, which is economical.
Further, according to the present invention, since the mounter is connected to the mounter mounting portion via the contact member, the wearer and the rotating spindle can be prevented from being worn by direct contact between metals. it can.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting device constructed in accordance with the present invention. The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing a support frame that supports a wafer, which will be described later, via a protective tape as a workpiece. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  The cutting apparatus shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is mounted on a moving base (not shown) and is moved in an indexing direction indicated by an arrow Y perpendicular to the cutting feed direction indicated by the arrow X by indexing feeding means (not shown), and a cutting direction by a notch feeding means (not shown). It can be moved in the direction indicated by the arrow Z. The spindle unit 4 will be described with reference to FIG.

A spindle unit 4 shown in FIG. 2 includes a spindle housing 41, a rotating spindle 42 rotatably disposed in the spindle housing 41, a mounter 5 attached to a front end portion of the rotating spindle 42, and the mounter 5 A cutting tool 6 to be mounted is provided.
The spindle housing 41 is formed in a substantially cylindrical shape and includes a shaft hole 411 penetrating in the axial direction. A rotary spindle 42 inserted through a shaft hole 411 formed in the spindle housing 41 is provided with a mounter mounting portion 421 at the front end portion thereof, and a thrust bearing formed in the central portion so as to protrude in the radial direction. A flange 424 is provided. The mounter mounting portion 421 has a joint surface 422 whose end surface is perpendicular to the axis, and a female screw hole 423 is formed at the center of the shaft. In this way, the rotary spindle 42 disposed through the shaft hole 411 formed in the spindle housing 41 is rotatably supported by high-pressure air supplied between the inner wall of the shaft hole 411.

A mounter 5 for selectively mounting a cutting tool for ultrasonic vibration cutting, which will be described later, and a generally used cutting tool that does not apply ultrasonic vibration to a mounter mounting portion 421 provided at the front end of the rotary spindle 42. Is attached. The mounter 5 and its mounting structure will be described with reference to FIG.
The mounter 5 is formed of aluminum in the illustrated embodiment, and is connected to a connecting portion 51 that is connected to the joint surface 422 of the mounter mounting portion 421 of the rotary spindle 42, the cutting tool 6 for ultrasonic vibration cutting, or generally used later. A cylindrical mounting portion 52 for selectively mounting a cutting tool that does not impart ultrasonic vibration, and a cutting tool 6 for ultrasonic vibration cutting provided at one end (right end in FIG. 3) of the mounting portion 52 or described later. The control part 53 which controls the position of the cutting tool which does not provide the ultrasonic vibration generally used is provided. In the illustrated embodiment, the connecting portion 51 and the restricting portion 53 are formed by a disc-shaped flange 50 provided at one end (the right end in FIG. 3) of the mounting portion 52, and the right end surface in FIG. 3, the left end surface in FIG. 3 functions as the restricting portion 53. In addition, the connection part 51 is provided with the joint surface 511 perpendicular | vertical with respect to an axial center in embodiment shown in FIG. The mounting portion 52 constituting the mounter 5 has a through hole 521 through which the fastening bolt 7 is inserted at the center of the shaft, and a male nut into which the fastening nut 8 is screwed onto the outer peripheral surface of the other end portion (left end portion in FIG. 3). A screw 522 is formed. The mounter 5 configured as described above is configured by screwing the fastening bolt 7 inserted into the through hole 521 provided in the mounting portion 52 into the female screw hole 423 provided in the mounter mounting portion 421 of the rotary spindle 42. As shown in FIG. 2, it is attached to the mounter mounting portion 421 of the rotary spindle 42. At this time, it is important that the adhesion member 43 is interposed between the joint surface 422 of the mounter mounting portion 421 and the joint surface 511 of the connecting portion 51 of the mounter 5. The contact member 43 is formed in a ring shape from a synthetic resin, and is attached to the joint surface 421a of the mounter mounting portion 421. In this way, the metal members do not directly contact each other by interposing the contact member 43 between the joint surface 422 of the mounter mounting portion 421 and the joint surface 511 of the connecting portion 51 of the mounter 5. Therefore, even if ultrasonic vibration is applied to the rotary spindle 42 as will be described later, wear of the joint surface 422 of the mounter mounting portion 421 and the joint surface 511 of the connecting portion 51 of the mounter 5 due to direct metal contact is prevented. can do.

  3, the ultrasonic vibration cutting tool 6 mounted on the mounting portion 52 constituting the mounter 5 includes a vibration transmission member 61 as a blade base, and the vibration transmission member. And an annular cutting blade 62 attached to 61. In the illustrated embodiment, the vibration transmission member 61 is made of aluminum, and has a central large-diameter portion 611 and a first projecting coaxially projecting from one end surface (the right end surface in FIG. 3) of the central large-diameter portion 611. And a second small-diameter portion 613 formed so as to protrude coaxially from the other end surface (the left end surface in FIG. 3) of the central large-diameter portion 611. The first small diameter portion 612 and the second small diameter portion 613 are formed with the same dimensions. A mounting hole 614 that fits with the mounting portion 52 that constitutes the mounter 5 is formed in the center of the shaft of the vibration transmitting member 61 formed in this way. In the illustrated embodiment, the cutting blade 62 attached to the vibration transmission member 61 is attached to the outer peripheral surface at the center position in the width direction of the central large diameter portion 611 of the vibration transmission member 61. The cutting blade 62 includes an electroformed blade in which abrasive grains are bonded by metal plating such as nickel, a resin bond grindstone blade in which abrasive grains are bonded by resin bond, a metal bond grindstone blade in which abrasive grains are bonded by metal bond, and abrasive grains. A vitrified bond grindstone blade bonded with a vitrified bond can be used. An adhesion member 66 made of a synthetic resin is mounted on the inner peripheral surface of the mounting hole 614 in the vibration transmission member 61 of the cutting tool 6 for ultrasonic vibration cutting thus configured, and the vibration transmission member 61 is configured. Close contact members 67 and 68 made of synthetic resin are also attached to the end surfaces of the first small diameter portion 612 and the second small diameter portion 613, respectively.

  The ultrasonic vibration cutting tool 6 configured as described above fits the mounting hole 614 of the vibration transmitting member 61 into the mounting portion 52 that constitutes the mounter 5, and the male screw 522 formed in the mounting portion 52. The fastening nut 8 is screwed to the mounting portion 52 so as to be mounted on the mounting portion 52 constituting the mounter 5 as shown in FIG. In addition, by screwing the fastening nut 8 into the male screw 522 formed in the mounting portion 52, the vibration transmission member 61 of the cutting tool 6 is brought into contact with the mounting portion 52 provided in the mounter 5 and the position is regulated. Since the vibration transmitting member 61 of the cutting tool 6 mounted on the mounter 5 in this way has the contact members 66, 67, 68 made of the above-described synthetic resin mounted on the contact portion with the mounter 5, the metals are attached to each other. There is no direct contact. Therefore, as will be described later, even if ultrasonic vibration is applied to the rotating spindle 42 and ultrasonic vibration is transmitted to the mounter 5, wear of the mounter 5 and the vibration transmitting member 61 due to direct contact between metals can be prevented. it can.

Next, an example in which a general cutting tool is mounted on the mounter 5 will be described with reference to FIGS. 4 and 5. In the embodiment shown in FIGS. 4 and 5, the mounter mounting portion 421, the mounter 5, and the fastening bolt 7 provided at the front end portion of the rotary spindle 42 are the same as those in the embodiment shown in FIGS. 2 and 3. Therefore, the same reference numerals are assigned and detailed description thereof is omitted.
4 and 5 is a cutting tool 6a that is not generally applied with ultrasonic vibration and is generally called a hub blade, and is a blade base 61a and one end surface of the blade base 61a ( 4 and 5, the cutting blade 62a is mounted on the outer periphery of the right end surface. In the illustrated embodiment, the blade base 61a is made of aluminum, and a mounting hole 614a that fits with the mounting portion 52 that constitutes the mounter 5 is formed in the center of the shaft. The cutting blade 62a mounted on one end surface of the blade base 61a (the outer peripheral portion of the right end surface in FIGS. 4 and 5) is an electroformed blade in which abrasive grains are bonded by metal plating such as nickel, and the abrasive grains are bonded by resin bonds. Resin bond grindstone blades, metal bond grindstone blades obtained by bonding abrasive grains with metal bonds, and vitrified bond grindstone blades obtained by bonding abrasive grains with vitrified bonds can be used. The general cutting tool 6a configured as described above fits the mounting hole 614a of the blade base 61a into the mounting portion 52 constituting the mounter 5, and is fastened to the male screw 522 formed in the mounting portion 52 with the fastening nut 8a. Are mounted on the mounting portion 52 constituting the mounter 5 as shown in the figure. Since the width of the blade base 61a is smaller than the width of the vibration transmitting member 61 constituting the cutting tool 6 for ultrasonic vibration cutting, the fastening nut 8a is formed to have a size larger than the width of the fastening nut 8. Yes. In this way, by screwing the fastening nut 8a, the blade base 61a of the cutting tool 6a is brought into contact with the mounting portion 52 provided in the mounter 5 and the position thereof is regulated.

Next, another embodiment of the mounting structure to the mounter mounting portion 421 provided at the front end of the rotating spindle 42 of the mounter will be described with reference to FIGS. The mounter mounting portion 421 and the mounter 5a in the embodiment shown in FIG. 6 and FIG. 7 are the same as those in the embodiment of FIG. 2 and FIG. Detailed description is omitted.
The mounter mounting portion 421 in the embodiment shown in FIGS. 6 and 7 has a tapered portion 422a having an outer peripheral surface formed into a tapered surface. An adhesive member 43a made of synthetic resin is attached to the tapered surface of the tapered portion 422a of the mounter mounting portion 421. On the other hand, a tapered recess 511a as a connecting portion 51 is formed at the axial center of the mounting portion 52 constituting the mounter 5a. The tapered recess 511a has a tapered inner peripheral surface corresponding to the tapered portion 422a of the mounter mounting portion 421. The mounter 5a configured in this manner engages the tapered recess 511a with the tapered portion 422a of the mounter mounting portion 421, and rotates the through bolt 521a provided in the mounting portion 52 and the fastening bolt 7 inserted through the tapered recess 511a. By screwing into a female screw hole 423a provided in the mounter mounting portion 421 of the spindle 42, it is attached to the mounter mounting portion 421 of the rotating spindle 42 as shown in FIG.

  Returning to FIG. 2 and continuing the description, the spindle unit 4 in the illustrated embodiment includes an electric motor 9 for rotationally driving the rotary spindle 42. The illustrated electric motor 9 is constituted by a permanent magnet motor. The permanent magnet type electric motor 9 is disposed on the spindle housing 41 on the outer peripheral side of the rotor 91 and a rotor 91 made of a permanent magnet mounted on a motor mounting portion 424 formed in an intermediate portion of the rotary spindle 42. It consists of a stator coil 92. In the electric motor 9 configured as described above, the rotor 91 is rotated by applying AC power to the stator coil 92 by power supply means described later, and the rotating spindle 42 to which the rotor 91 is mounted is rotated.

  The spindle unit 4 in the illustrated embodiment includes an ultrasonic transducer 10 that is disposed on the rotary spindle 42 and applies ultrasonic vibration to the cutting blade 62. The ultrasonic transducer 10 includes an annular piezoelectric body 101 polarized in the axial direction of the rotary spindle 42 and two annular electrode plates 102 and 103 mounted on both side polarization surfaces of the piezoelectric body 101. It has become. The piezoelectric body 101 is formed of piezoelectric ceramics such as barium titanate, lead zirconate titanate, and lithium tantalate. The ultrasonic transducer 10 configured as described above is attached to the rotary spindle 42 and generates ultrasonic vibration when AC power having a predetermined frequency is applied to the electrode plates 102 and 103 by a power supply unit described later. A plurality of ultrasonic transducers 10 may be arranged in the axial direction.

The spindle unit 4 in the illustrated embodiment includes power supply means 11 that applies AC power to the ultrasonic transducer 10 and applies AC power to the electric motor 9.
The power supply means 11 includes a rotary transformer 12 disposed at the rear end of the spindle unit 4. The rotary transformer 12 includes a power receiving unit 121 disposed at the rear end of the rotary spindle 42 and a power feeding unit 122 disposed opposite to the power receiving unit 121 and disposed at the rear end portion of the spindle housing 41. is doing. The power receiving means 121 includes a rotor side core 121a attached to the rotary spindle 42, and a power receiving coil 121b wound around the rotor side core 121a. One end of the power receiving coil 121 b of the power receiving means 121 configured as described above is connected to the electrode plate 102 of the ultrasonic transducer 10, and the other end is connected to the electrode plate 103. The power feeding means 122 includes a stator side core 122a disposed on the outer peripheral side of the power receiving means 121 and a power feeding coil 122b disposed on the stator side core 122a. The power feeding coil 122b of the power feeding means 122 configured as described above is supplied with AC power via the electric wirings 123 and 124.

  The power supply means 11 in the illustrated embodiment includes an AC power supply 13 for AC power supplied to the power supply coil 122 b of the rotary transformer 12, a current adjustment means 14 as power adjustment means, and an AC power supplied to the power supply means 122. A frequency adjusting means 15 for adjusting the frequency of the current, a control means 16 for controlling the current adjusting means 14 and the frequency adjusting means 15, and an input means 17 for inputting the type of the cutting tool 6 provided with a cutting blade to the control means. It has. The control means 16 includes a memory for storing a frequency setting map for outputting a frequency setting signal to the frequency adjusting means 15 corresponding to the type of the cutting tool 6. 2 supplies AC power to the stator coil 92 of the electric motor 9 via the control circuit 18 and the electric wirings 921 and 922.

The spindle unit 4 in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
When performing the cutting operation, AC power is supplied from the power supply means 11 to the stator coil 92 of the electric motor 9. As a result, the electric motor 9 rotates and the rotary spindle 42 rotates, and the cutting blade 62 attached to the vibration transmitting member 61 of the cutting tool 6 attached to the front end of the rotary spindle 42 via the mounter 5 is rotated. It is done.

  On the other hand, the power supply means 11 controls the current adjusting means 14 and the frequency conversion means 15 by the control means 16 to control the voltage of the AC power to a predetermined voltage, and the frequency of the AC power is set to a predetermined frequency (for example, 50 kHz). To the power supply coil 122b of the power supply means 122 constituting the rotary transformer 12. When AC power having a predetermined frequency is applied to the feeding coil 122b as described above, AC power having a predetermined frequency is interposed between the electrode plate 102 and the electrode plate 103 of the ultrasonic transducer 10 via the power receiving coil 121b of the rotating power receiving means 121. Is applied. As a result, the ultrasonic transducer 10 is repeatedly displaced in the radial direction and vibrates ultrasonically. This ultrasonic vibration is transmitted to the vibration transmission member 61 of the cutting tool 6 through the rotary spindle 42 and the vibration transmission member 61 is ultrasonically vibrated in the radial direction. Therefore, the cutting blade 62 attached to the vibration transmission member 61 vibrates ultrasonically in the radial direction.

  Referring back to FIG. 1, the description of the cutting apparatus in the illustrated embodiment is for imaging the surface of the workpiece held on the chuck table 3 and detecting a region to be cut by the cutting blade 62. The alignment means 20 is provided. The alignment unit 20 includes an imaging unit including an optical unit such as a microscope or a CCD camera. In addition, the cutting apparatus includes a display unit 21 that displays an image captured by the alignment unit 20.

  In the cassette mounting area 22a of the apparatus housing 2, a cassette mounting table 22 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 22 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 22, a cassette 23 for storing a semiconductor wafer W as a workpiece is placed. The semiconductor wafer W accommodated in the cassette 23 has a grid-like street formed on the surface, and devices such as capacitors, LEDs, and circuits are formed in a plurality of rectangular areas partitioned by the grid-like street. . The semiconductor wafer W thus formed is accommodated in the cassette 23 with the back surface adhered to the front surface of the protective tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer W accommodated in a cassette 23 placed on a cassette placement table 22 (a state in which the wafer is supported on an annular frame F via a protective tape T). Is transferred to the temporary table 24, the transfer means 26 is configured to transfer the semiconductor wafer W transferred to the temporary table 24 onto the chuck table 3, and the semiconductor wafer W is cut on the chuck table 3. Cleaning means 27 for cleaning the semiconductor wafer W, and cleaning transport means 28 for transporting the semiconductor wafer W cut on the chuck table 3 to the cleaning means 27.

The operation of the cutting apparatus configured as described above will be briefly described mainly with reference to FIG.
First, ultrasonic vibration cutting that performs cutting while applying ultrasonic vibration to the cutting blade will be described. When performing ultrasonic vibration cutting, the cutting tool 6 for ultrasonic vibration cutting is mounted on the mounter 5 attached to the rotary spindle 42 as shown in FIG. Then, the code number of the corresponding cutting tool is input from the input means 17.

  As described above, if the cutting tool 6 for ultrasonic vibration cutting is mounted on the mounter 5 and the code number of the corresponding cutting tool is input from the input means 17, the cutting apparatus performs the cutting operation. That is, the semiconductor wafer W accommodated at a predetermined position of the cassette 23 placed on the cassette placement table 22 is positioned at the carry-out position by the vertical movement of the cassette placement table 22 by a lifting means (not shown). Next, the unloading means 25 moves forward and backward to unload the semiconductor wafer W positioned at the unloading position onto the temporary placement table 24. The semiconductor wafer W carried out to the temporary placement table 24 is transferred onto the chuck table 3 by the turning operation of the transfer means 26. When the semiconductor wafer W is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer W on the chuck table 3. The support frame F that supports the semiconductor wafer W via the protective tape T is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer W is moved to just below the alignment means 20. When the chuck table 3 is positioned immediately below the alignment means 20, the street formed on the semiconductor wafer W is detected by the alignment means 20, and the spindle unit 4 is moved and adjusted in the direction of the arrow Y, which is the indexing direction. A precision alignment operation with the cutting blade 62 of the tool 6 is performed (alignment process).

  Thereafter, AC power is supplied from the power supply means 11 shown in FIG. 2 to the stator coil 92 of the electric motor 9. As a result, the electric motor 9 rotates and the rotary spindle 42 rotates, and the cutting blade 62 attached to the vibration transmitting member 61 of the cutting tool 6 attached to the front end of the rotary spindle 42 via the mounter 5 is rotated. It is done. Then, the cutting blade 62 is cut and fed by a predetermined amount in the direction indicated by the arrow Z in FIG. 1, and the chuck table 3 holding the semiconductor wafer W is sucked and held in the direction indicated by the arrow X that is the cutting feed direction (the rotation axis of the cutting blade 62 and The semiconductor wafer W held on the chuck table 3 is cut along a predetermined street by the cutting blade 62 by moving at a predetermined cutting feed rate in a direction orthogonal to the vertical direction. In this cutting process, AC power having a frequency corresponding to the code number of the cutting tool input from the power supply means 11 to the ultrasonic vibrator 10 by the input means 17 is applied. As a result, as described above, the ultrasonic transducer 10 is repeatedly displaced in the radial direction and vibrates ultrasonically. This ultrasonic vibration is transmitted to the vibration transmission member 61 of the cutting tool 6 through the rotary spindle 42 and the mounter 5, and the vibration transmission member 61 is ultrasonically vibrated in the radial direction. Therefore, since the cutting blade 62 mounted on the vibration transmitting member 61 is ultrasonically vibrated in the radial direction, the cutting resistance by the cutting blade 62 can be reduced. Even if the semiconductor wafer W is a difficult-to-cut material such as sapphire. Can be easily cut.

  Next, general cutting that performs cutting without applying ultrasonic vibration to the cutting blade will be described. When cutting without applying ultrasonic vibration to the cutting blade, as shown in FIGS. 4 and 5, a cutting tool 6a that does not apply ultrasonic vibration generally used for the mounter 5 attached to the rotary spindle 42 is used. Installing. Then, the code number of the corresponding cutting tool is input from the input means 17. As described above, when the cutting tool 6a that does not impart ultrasonic vibration generally used in the mounter 5 is mounted and the code number of the corresponding cutting tool is input from the input means 17, the cutting apparatus performs the cutting operation. To do. And the alignment process mentioned above is implemented. Next, AC power is supplied to the stator coil 92 of the electric motor 9 from the power supply means 11 shown in FIG. As a result, the electric motor 9 rotates and the rotary spindle 42 rotates, and the blade base of the cutting tool 6a that is attached to the tip of the rotary spindle 42 via the mounter 5 and does not apply the ultrasonic vibration that is generally used. The cutting blade 62a attached to 61a is rotated. Then, the cutting blade 62a is cut and fed by a predetermined amount in the direction indicated by the arrow Z in FIG. 1, and the chuck table 3 holding the semiconductor wafer W is sucked and held in the direction indicated by the arrow X that is the cutting feed direction (the rotation axis of the cutting blade 62 The semiconductor wafer W held on the chuck table 3 is cut along a predetermined street by the cutting blade 62a by moving at a predetermined cutting feed speed in a direction orthogonal to the vertical direction. In this cutting process, AC power is not applied from the power supply means 11 to the ultrasonic transducer 10. Therefore, general cutting without applying ultrasonic vibration to the cutting blade 62a is performed.

  As described above, in the cutting apparatus in the illustrated embodiment, the mounter 5 attached to the rotary spindle 42 includes the cutting tool 6 for ultrasonic vibration cutting and the generally used cutting tool 6a that does not apply ultrasonic vibration. Since it is configured to be detachable, when performing ultrasonic vibration cutting, the cutting tool 6 for ultrasonic vibration cutting is mounted on the mounter 5 and general cutting without applying ultrasonic vibration to the cutting blade is performed. The cutting tool 6a which does not give the ultrasonic vibration generally used can be mounted. Therefore, it is economical because it is not necessary to use an expensive cutting tool 6 for ultrasonic vibration cutting when performing general cutting without applying ultrasonic vibration to the cutting blade.

The perspective view of the cutting device comprised according to this invention. Sectional drawing of the spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. Sectional drawing which decomposes | disassembles and shows the mounter attachment part and mounter of the rotating spindle which comprise the spindle unit shown in FIG. 2, and the cutting tool for ultrasonic vibration cutting. FIG. 3 is an exploded cross-sectional view showing a mounter mounting portion and a mounter of a rotating spindle constituting the spindle unit and a cutting tool that is generally not used for applying ultrasonic vibration. Sectional drawing which shows the state which assembled the mounter attachment part and mounter of the rotating spindle which comprise the spindle unit shown in FIG. 4, and the cutting tool which does not provide the ultrasonic vibration generally used. The disassembled sectional view which shows the other embodiment of the mounter attachment part of the rotating spindle which comprises a spindle unit, and a mounter. Sectional drawing which shows the state which assembled the mounter attachment part and mounter of the rotating spindle which comprise a spindle unit.

Explanation of symbols

2: device housing 3: chuck table mechanism 30: chuck table 4: spindle unit 41: spindle housing 42: rotating spindle 421: mounter mounting part 5: mounter 51: connecting part 52: mounting part 53: regulating part 6: ultrasonic vibration Cutting tool 61 for cutting 61: Vibration transmitting member 62: Cutting blade 6a: Cutting tool that does not apply ultrasonic vibration generally used 61a: Blade base 62a: Cutting blade 7: Fastening bolt 8: Fastening nut 9: Electric motor 10: Ultrasonic vibrator 11: Power supply means 12: Rotary transformer 121: Power receiving means 122: Power supply means 13: AC power supply 14: Current adjustment means 15: Frequency adjustment means 16: Control means 17: Input means 20: Alignment means 21 : Display means 22: Cassette mounting table 2 3: Cassette 24: Temporary table 25: Unloading means 26: Conveying means 27: Cleaning means

Claims (4)

A chuck table for holding a workpiece, a rotating spindle, a cutting tool attached to the rotating spindle, and an ultrasonic vibration means disposed on the rotating spindle, for cutting the workpiece held on the chuck table. a cutting means, the switching cutting device comprises a power supply means, the applying high frequency power to the ultrasonic vibrating means,
A mounter for mounting a cutting tool attached to a mounter attachment provided at an end of the rotary spindle;
The mounter is provided on a blade base of a cutting tool that does not apply ultrasonic vibration, a connecting portion that is connected to the rotary spindle, a mounting hole provided in a vibration transmission member of the cutting tool for ultrasonic vibration cutting. A mounting portion that selectively fits the mounting hole, and the vibration transmitting member or ultrasonic vibration of the cutting tool for ultrasonic vibration cutting that is provided at one end of the mounting portion and is fitted to the mounting portion. A regulation part that regulates the position of the blade base of the cutting tool that is not connected, and is connected to the mounter attachment part via the contact member between the connection part,
The cutting device characterized by the above.   The cutting apparatus according to claim 1, wherein an adhesion member is attached to an inner peripheral surface of the attachment hole formed in the vibration transmission member of the cutting tool for ultrasonic vibration cutting.   The mounter mounting portion of the rotary spindle has a joining surface whose end surface is perpendicular to the axis, and the connecting portion of the mounter has a joining surface whose end surface is perpendicular to the axis. The cutting device according to claim 1, wherein the cutting device is connected between the bonding surface of the connecting portion and the bonding surface of the mounter mounting portion via the contact member.   The mounter mounting portion of the rotating spindle includes a tapered portion, the connecting portion includes a tapered recess that fits into the tapered portion, and the mounter includes the tapered recess of the connecting portion and the taper of the mounter mounting portion. The cutting device according to claim 1, wherein the cutting device is connected to the portion via the contact member.

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