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JP4855307B2 - Electronic component compression molding method - Google Patents

Electronic component compression molding method Download PDF

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Publication number
JP4855307B2
JP4855307B2 JP2007063336A JP2007063336A JP4855307B2 JP 4855307 B2 JP4855307 B2 JP 4855307B2 JP 2007063336 A JP2007063336 A JP 2007063336A JP 2007063336 A JP2007063336 A JP 2007063336A JP 4855307 B2 JP4855307 B2 JP 4855307B2
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Prior art keywords
resin
plate
resin material
release film
cavity
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JP2008221622A (en
Inventor
剛 天川
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Towa Corp
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Towa Corp
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Priority to JP2007063336A priority Critical patent/JP4855307B2/en
Application filed by Towa Corp filed Critical Towa Corp
Priority to KR1020127010489A priority patent/KR101245393B1/en
Priority to MYPI2014002352A priority patent/MY182099A/en
Priority to SG201002433-9A priority patent/SG161252A1/en
Priority to MYPI2014002351A priority patent/MY182097A/en
Priority to KR1020117011977A priority patent/KR101162460B1/en
Priority to SG2012062972A priority patent/SG184703A1/en
Priority to PCT/JP2008/054026 priority patent/WO2008126527A1/en
Priority to KR1020097014160A priority patent/KR101107843B1/en
Priority to MYPI20092598A priority patent/MY154681A/en
Priority to TW097108668A priority patent/TW200843930A/en
Publication of JP2008221622A publication Critical patent/JP2008221622A/en
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Publication of JP4855307B2 publication Critical patent/JP4855307B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently feed a granular resin material (granular resin) 6 into a lower mold cavity 5 provided in a set of mold 1 (both upper and lower molds 2 and 3) for compression molding for an electronic component. <P>SOLUTION: At first, a required amount of the granular resin 6 is fed into a plate 21 for storing a resin (resin storing part 22), and a release film 11 with a required dimension covers on an opening part 23 side of the plate. The inside of a releasing film-covered plate 21 is set to a required degree of vacuum and the release film 11 covers fixedly on the plate to form a resin-distributed plate 25 and to turn it reversely. Then, the resin-distributed plate 25 turned reversely is transferred to a position of a mold cavity 5 by an in-loader 9. The vacuum condition in this reversely turned plate 25 is released and the releasing film 11 is covered on the inner face of the cavity 5, and the granular resin 6 is made to fall down into the mold cavity 5 covered with the release film 11 from the plate 21. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

本発明は、ＩＣ等の電子部品を圧縮成形する電子部品の圧縮成形方法に係り、特に、電子部品の圧縮成形用金型に樹脂材料を供給するものに関する。   The present invention relates to a compression molding method for an electronic component that compresses and molds an electronic component such as an IC, and more particularly to a method for supplying a resin material to a compression molding die for an electronic component.

従来から、図６に示すように、電子部品の圧縮成形用金型８１を用いて、基板８２に装着した所要数の電子部品８３を顆粒状の樹脂材料（顆粒樹脂）８４にて圧縮成形（樹脂封止成形）することが行われているが、次のようにして行われている。   Conventionally, as shown in FIG. 6, a required number of electronic parts 83 mounted on a substrate 82 are compression-molded with a granular resin material (granular resin) 84 using a compression molding die 81 for electronic parts. Resin sealing molding) is carried out as follows.

即ち、まず、電子部品の圧縮成形用金型８１（上型８５と下型８６）に設けた下型キャビティ８７内に離型フィルム８８を被覆すると共に、この離型フィルム８８を被覆した下型キャビティ８７内に顆粒樹脂８４を供給して加熱溶融化し、次に、前記した金型８１（８５・８６）を型締めして下型キャビティ８７内の溶融樹脂に基板８２に装着した所要数の電子部品８３を浸漬することにより、下型キャビティ８７の形状に対応した樹脂成形体内に所要数の電子部品８３を圧縮成形（一括片面モールド）している。   That is, first, a release film 88 is coated in a lower mold cavity 87 provided in a compression molding die 81 (upper mold 85 and lower mold 86) of an electronic component, and the lower mold is coated with this release film 88. The granule resin 84 is supplied into the cavity 87 and melted by heating. Next, the above-described mold 81 (85/86) is clamped, and the required number of the melt resin in the lower mold cavity 87 attached to the substrate 82 is obtained. By immersing the electronic components 83, the required number of electronic components 83 are compression-molded (collective single-sided molding) in a resin molded body corresponding to the shape of the lower mold cavity 87.

ところで、前記した下型キャビティ８７内に顆粒樹脂を供給するには樹脂材料供給機構（下部シャッタ９０と供給部９１）が用いられている。
即ち、前記した樹脂材料供給機構８９（供給部９１）に所要量の顆粒樹脂８４を投入してこの樹脂材料供給機構８９を前記した上下両型８５・８６間に進入させ、次に、樹脂材料供給機構８９の下部シャッタ９０を引いて開けることにより、供給部９１から下型キャビティ８７内に顆粒樹脂８４を落下させて供給している。 Incidentally, a resin material supply mechanism (lower shutter 90 and supply portion 91) is used to supply the granular resin into the lower mold cavity 87 described above.
That is, a predetermined amount of granular resin 84 is put into the above-described resin material supply mechanism 89 (supply unit 91), and this resin material supply mechanism 89 enters between the upper and lower molds 85 and 86, and then the resin material. By pulling and opening the lower shutter 90 of the supply mechanism 89, the granular resin 84 is dropped from the supply unit 91 into the lower mold cavity 87 and supplied.

特開２００４−２１６５５８号JP 2004-216558 A

しかしながら、金型キャビティ８７内への樹脂８４の供給時において、樹脂材料供給機構８９のシャッタ９０を開けて下型キャビティ８７内に顆粒樹脂８４を落下供給させた場合、樹脂の一部９２が樹脂材料供給機構８９（供給部９１）側に残存することがある。
従って、金型キャビティ８７内への樹脂８４の供給時において、金型キャビティ８７内に樹脂８４を効率良く供給することができないと云う弊害がある。
また、金型キャビティ８７内への樹脂８４の供給時に、樹脂の一部（残存する顆粒樹脂）９２が樹脂材料供給機構８９（供給部９１）側に残存するため、金型キャビティ８７内に供給される樹脂量に不足が発生し易い。
従って、金型キャビティ８７内への樹脂８４の供給時において、金型キャビティ８７内に供給される樹脂量の信頼性を効率良く向上させることができないと云う弊害がある。 However, when the resin 84 is supplied into the mold cavity 87, when the shutter 90 of the resin material supply mechanism 89 is opened and the granular resin 84 is dropped and supplied into the lower mold cavity 87, a part 92 of the resin is resin. It may remain on the material supply mechanism 89 (supply unit 91) side.
Therefore, there is an adverse effect that the resin 84 cannot be efficiently supplied into the mold cavity 87 when the resin 84 is supplied into the mold cavity 87.
Further, when the resin 84 is supplied into the mold cavity 87, a part of the resin (residual granular resin) 92 remains on the resin material supply mechanism 89 (supply unit 91) side, so that the resin 84 is supplied into the mold cavity 87. Insufficient amount of resin is likely to occur.
Therefore, when the resin 84 is supplied into the mold cavity 87, there is an adverse effect that the reliability of the amount of resin supplied into the mold cavity 87 cannot be improved efficiently.

即ち、本発明は、金型キャビティ内への樹脂の供給時に、金型キャビティ内に樹脂を効率良く供給することを目的とする。
また、本発明は、金型キャビティ内への樹脂の供給時において、金型キャビティ内に供給される樹脂量の信頼性を効率良く向上させることを目的とする。 That is, an object of the present invention is to efficiently supply the resin into the mold cavity when the resin is supplied into the mold cavity.
It is another object of the present invention to efficiently improve the reliability of the amount of resin supplied into the mold cavity when supplying the resin into the mold cavity.

前記技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、電子部品の圧縮成形用金型を用いて、離型フィルムが被覆された金型キャビティ内に所要量の樹脂材料を供給すると共に、前記したキャビティ内の樹脂に電子部品を浸漬することにより、前記したキャビティ内で当該キャビティの形状に対応した樹脂成形体内に前記した電子部品を樹脂封止成形する電子部品の圧縮成形方法であって、前記金型キャビティ内に供給する所要量の樹脂材料を収容し且つ前記キャビティと同等の凹部を有する樹脂収容部を備えた樹脂収容用プレートを用意する工程と、前記樹脂収容部の開口部の周囲に設けたプレート周縁部に前記離型フィルムを吸着する吸引孔を設ける工程と、前記金型キャビティへの供給前に、前記プレートにおける樹脂収容部内に所要量の樹脂材料を供給する工程と、 前記したプレートの開口部側に所要の大きさを有する離型フィルムを載置し、前記離型フィルムを前記プレート周縁部の吸引孔にて吸着して固定する工程と、前記離型フィルムを載置したプレートにおける樹脂収容部内を所要の真空度に設定する工程と、前記離型フィルムを被覆し且つ前記樹脂収容部内を所要の真空度に設定したプレートを反転させて反転プレートを形成する工程と、前記した反転プレートを前記した金型キャビティの位置に移送する工程と、前記した反転プレートにおける樹脂収容部内の真空状態を解除する工程と、前記した反転プレートにおける樹脂収容部内の真空状態の解除時に、前記した離型フィルムを前記したキャビティ面に被覆固定させる工程と、前記した反転プレートにおける樹脂収容部内の真空状態の解除時に、前記した離型フィルムを被覆した金型キャビティ内に前記したプレートの樹脂収容部内から樹脂材料を供給する工程とを含むことを特徴とする。 An electronic component compression molding method according to the present invention for solving the above technical problem uses a mold for compression molding of an electronic component, and a required amount of resin material in a mold cavity covered with a release film. The electronic component is molded into the resin molding body corresponding to the shape of the cavity in the cavity by compressing the electronic component by resin sealing molding by immersing the electronic component in the resin in the cavity. A molding method comprising a step of preparing a resin-accommodating plate that accommodates a required amount of a resin material to be supplied into the mold cavity and includes a resin accommodating portion having a recess equivalent to the cavity; and the resin accommodating A step of providing a suction hole for adsorbing the release film on the periphery of the plate provided around the opening of the part, and before the supply to the mold cavity, Supplying a required amount of the resin material into the fat container, placing a release film having a required size on the opening side of the plate, and placing the release film in a suction hole in the peripheral edge of the plate Adsorbing and fixing, a step of setting the inside of the resin container in the plate on which the release film is placed to a required degree of vacuum, a degree of vacuum covering the release film and the inside of the resin container A step of inverting the plate set to form a reversal plate, a step of transferring the reversal plate to the position of the mold cavity, and a step of releasing the vacuum state in the resin container in the reversal plate, , during release of the vacuum state in the resin receiving part in the inverted plate described above, a step of covering secure the release film described above the cavity surface described above, and the Rolling during release of the vacuum state in the resin receiving part in the plate, characterized in that it comprises a step of supplying a resin material from the resin receptacle of the plates to the mold release film was coated mold cavity.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記プレートの樹脂収容部内に樹脂材料を供給しながら、又は、前記プレートの樹脂収容部内に樹脂材料を供給する前に、前記した樹脂材料を計量する工程とを含むことを特徴とする。 Further, in the compression molding method for electronic parts according to the present invention for solving the above technical problem , the resin material is supplied into the resin container of the plate or the resin material is supplied into the resin container of the plate. A step of weighing the resin material before supply.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記プレートの樹脂収容部内に所要量の樹脂材料を供給した後、前記したプレートの樹脂収容部内の樹脂材料の厚さを均一にする工程を行うことを特徴とする。 The compression molding method for an electronic component according to the present invention for solving the technical problems above, after supplying the required amount of resin material into the resin receptacle of the plate, the resin in the resin receiving part of the plates A step of making the thickness of the material uniform is performed.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記樹脂材料が、所要の粒径分布を有する粉末状の樹脂材料であることを特徴とする。 In addition, the electronic component compression molding method according to the present invention for solving the technical problem described above is characterized in that the resin material is a powdery resin material having a required particle size distribution.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記樹脂材料が、顆粒状の樹脂材料であることを特徴とする。   The electronic component compression molding method according to the present invention for solving the above technical problem is characterized in that the resin material is a granular resin material.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記樹脂材料が、粉末状の樹脂材料であることを特徴とする。   The electronic component compression molding method according to the present invention for solving the above technical problem is characterized in that the resin material is a powdered resin material.

即ち、本発明によれば、金型キャビティ内への樹脂の供給時に、金型キャビティ内に樹脂を効率良く供給することができると云う優れた効果を奏する。
また、本発明によれば、金型キャビティ内への樹脂の供給時において、金型キャビティ内に供給される樹脂量の信頼性を効率良く向上させることができると云う優れた効果を奏する。 That is, according to the present invention, there is an excellent effect that the resin can be efficiently supplied into the mold cavity when the resin is supplied into the mold cavity.
Further, according to the present invention, there is an excellent effect that the reliability of the amount of resin supplied into the mold cavity can be improved efficiently when the resin is supplied into the mold cavity.

以下、実施例図に基づいて、本発明を詳細に説明する。
図１、図２（１）〜（２）は、本発明に用いられる樹脂収容用のプレートである。
図３、図４、図５は、本発明に用いられる電子部品の圧縮成形用金型である。 Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 and FIG. 2 (1) to (2) are resin housing plates used in the present invention.
3, 4 and 5 are molds for compression molding of electronic parts used in the present invention.

（電子部品の圧縮成形用金型の構成について）
まず、本発明に用いられる電子部品の圧縮成形用金型の構成について説明する。
即ち、図３、図４、図５に示す電子部品の圧縮成形用金型１には、固定上型２と、上型２に対向配置した可動下型３と、上型２の型面に設けた基板セット部４と、下型３に設けた圧縮成形用キャビティ５と、前記した金型１に顆粒状の樹脂材料（顆粒樹脂）６と所要数の電子部品７を装着した基板８（成形前基板）とを同時に（或いは、個別に）供給するインローダ９と、前記した金型１で圧縮成形（樹脂封止成形）された成形済基板を取り出すアウトローダ（図示なし）と、前記した金型１を所要の温度にまで加熱する加熱手段（図示なし）と、前記した金型１を所要の型締圧力にて型締めする型締手段（図示なし）とが設けられて構成されている。
なお、前記した上型基板セット部４には電子部品７を下方向（下型方向）に向けた状態で供給セットすることができるように構成されると共に、前記した下型キャビティ５にはそのキャビティ開口部１０が上方向（上型方向）に開口した状態で設けられて構成されている。
また、前記した下型３の型面を含むキャビティ面には、後述する（所要の大きさの）離型フィルム１１を吸着固定する適宜な吸着固定手段（例えば、所要数の吸引孔と真空経路と真空引き機構とから構成）が設けられて構成されている。
また、前記したインローダ９には、インローダの下部側に設けられた後述する樹脂収容用プレートを係着するプレート係着部９ａと、インローダの上部側に設けられ且つ電子部品７を下方向に向けた状態で電子部品７を装着した基板８（成形前基板）を載置する基板載置部９ｂとが設けられて構成されている。
従って、前記した下型３の型面を含む下型キャビティ５内面に後述する（所要の大きさの）離型フィルム１１を被覆させることができるように構成されると共に、前記したインローダ９を用いることにより、前記した離型フィルム１１を被覆した下型キャビティ５内に顆粒樹脂６を供給し且つ前記した基板セット部４に電子部品７を装着した基板８を供給セットすることができるように構成されている。 (About the structure of electronic parts compression molding mold)
First, the structure of the electronic component compression mold used in the present invention will be described.
That is, the electronic component compression molding die 1 shown in FIGS. 3, 4, and 5 includes a fixed upper die 2, a movable lower die 3 disposed opposite to the upper die 2, and a mold surface of the upper die 2. A substrate set portion 4 provided, a compression molding cavity 5 provided in the lower mold 3, and a substrate 8 in which a granular resin material (granule resin) 6 and a required number of electronic components 7 are mounted on the mold 1 described above ( An in-loader 9 for supplying (pre-molding substrate) simultaneously (or individually), an outloader (not shown) for taking out a molded substrate that has been compression-molded (resin-sealed molding) with the mold 1 described above, and A heating means (not shown) for heating the mold 1 to a required temperature and a mold clamping means (not shown) for clamping the mold 1 with a required clamping pressure are provided. Yes.
The above-described upper mold substrate setting unit 4 is configured so that the electronic component 7 can be supplied and set in a state of being directed downward (lower mold direction). The cavity opening 10 is provided and configured in an open state in the upward direction (upper mold direction).
Further, on the cavity surface including the mold surface of the lower mold 3 described above, suitable suction fixing means (for example, a required number of suction holes and vacuum paths) for fixing the release film 11 (having a required size) described later by suction is fixed. And a vacuuming mechanism).
The inloader 9 has a plate engaging portion 9a for engaging a resin accommodating plate, which will be described later, provided on the lower side of the inloader, and an electronic component 7 directed downwardly on the upper side of the inloader. In this state, a substrate mounting portion 9b for mounting a substrate 8 (substrate before molding) on which the electronic component 7 is mounted is provided.
Therefore, the inner surface of the lower mold cavity 5 including the mold surface of the lower mold 3 can be covered with a release film 11 (having a required size), which will be described later, and the inloader 9 described above is used. In this way, the granular resin 6 can be supplied into the lower mold cavity 5 coated with the release film 11 and the substrate 8 with the electronic component 7 mounted on the substrate set portion 4 can be set. Has been.

また、前記金型１に所要の型締圧力にて型締めすることにより、前記キャビティ５内で加熱溶融化された樹脂材料（６）に前記した電子部品７を浸漬し得て、前記キャビティ５内の樹脂（６）に所要の樹脂圧を加えることができるように構成されている。
また、前記したキャビティ５内で当該キャビティ５の形状に対応した樹脂成形体１２内に電子部品７を圧縮成形（樹脂封止成形）することができるように構成されている。
なお、前記した金型１に顆粒樹脂６を供給する樹脂材料の供給手段として、後述する樹脂収容用のプレート２１用いられて構成されている。 Further, by clamping the mold 1 with a required clamping pressure, the electronic component 7 can be immersed in the resin material (6) heated and melted in the cavity 5, and the cavity 5 can be immersed. A required resin pressure can be applied to the inner resin (6).
Further, the electronic component 7 can be compression molded (resin sealing molding) in the resin molded body 12 corresponding to the shape of the cavity 5 in the cavity 5 described above.
In addition, as a resin material supply means for supplying the granular resin 6 to the mold 1 described above, a resin accommodating plate 21 described later is used.

（樹脂収容用プレートの構成について）
即ち、図１、図２（１）、図２（２）に示すように、前記した樹脂収容用プレート２１（トレイ）には、所要量の顆粒樹脂６が収容（供給）される樹脂収容部（凹部）２２と、樹脂収容部２２に設けられたプレート開口部２３（樹脂収容部２２の開口部）と、プレート開口部２３の周囲に設けられたプレート周縁部２４とが設けられて構成されている。
また、樹脂収容用プレート２１は、キャビティ５と同等の窪み（樹脂収容部２２）を有するプレートである。
即ち、樹脂収容部２２に配布（供給）された所要量の顆粒樹脂６の形状（例えば、シート形状）は、そのままの状態で、キャビティ５内に供給セットすることができるように構成されている。
従って、樹脂収容部２２における所要量の顆粒樹脂６の形状は、キャビティ５の形状に適合することになる。
更に、前記したプレート２１において、前記した樹脂収容部２２に所要量の顆粒樹脂６を収容すると共に、前記したプレート周縁部２４を含むプレート開口部２３に所要の大きさ（広さ）の離型フィルム１１を被覆することにより、前記した顆粒樹脂６を収容した樹脂収容部２２（プレート開口部２３側）を前記した被覆離型フィルム１１にて閉鎖（封鎖）することができるように構成されている。 (Regarding the structure of the resin housing plate)
That is, as shown in FIGS. 1, 2 (1), and 2 (2), the resin storage portion in which the required amount of granular resin 6 is stored (supplied) in the resin storage plate 21 (tray). (Recess) 22, a plate opening 23 (opening of the resin container 22) provided in the resin container 22, and a plate peripheral part 24 provided around the plate opening 23 are provided. ing.
The resin accommodating plate 21 is a plate having a recess (resin accommodating portion 22) equivalent to the cavity 5.
In other words, the shape (for example, the sheet shape) of the required amount of granular resin 6 distributed (supplied) to the resin container 22 is configured to be supplied and set in the cavity 5 as it is. .
Therefore, the shape of the required amount of the granular resin 6 in the resin accommodating portion 22 matches the shape of the cavity 5.
Further, in the above-described plate 21, a required amount of the granular resin 6 is stored in the above-described resin storage portion 22, and a mold having a required size (width) is released in the plate opening 23 including the above-described plate peripheral portion 24. By covering the film 11, the resin accommodating portion 22 (plate opening 23 side) containing the granular resin 6 can be closed (sealed) with the above-described coated release film 11. Yes.

（プレート内の真空引きの構成について）
また、図示はしていないが、樹脂収容用プレート２１には、前記した離型フィルム１１にて被覆閉鎖された樹脂収容部２２の内部から空気を強制的に吸引排出する真空引き手段として、例えば、真空ポンプ等の真空引き機構が設けられて構成されると共に、プレート２１の本体（樹脂収容部２２）側に設けた開閉弁と真空引き機構とが真空チューブ等の真空経路（真空チューブ）にて連通接続して構成され、更に、この開閉弁に対して真空チューブが着脱自在に設けられて構成されている。
即ち、まず、前記した開閉弁を開状態とし、次に、前記した真空引き機構にて前記した真空経路（開閉弁）を通して前記した樹脂収容部２２から空気を強制的に吸引排出して開閉弁を閉状態とすることにより、前記した樹脂収容部２２内を所要の真空度に設定して離型フィルム１１をプレート２１に被覆固定することができるように構成されている。
なお、次に、プレート２１（開閉弁）側のから真空チューブを取り外しても良い。
即ち、前記したプレート２１の開口部２３側を離型フィルム１１にて被覆して樹脂収容部２２内を真空引きすることにより、前記した顆粒樹脂６を供給した樹脂収容部２２内を所要の真空度に設定して前記した離型フィルム１１にて封鎖することができるように構成されている。
従って、前記した離型フィルム１１で被覆固定され且つ前記した顆粒樹脂６を供給された樹脂収容部２２（プレート２１）内を真空引きすることにより、樹脂配布済プレート２５を形成することができる。
なお、本発明は、後述するように、この樹脂配布済プレート２５を反転させた状態で前記した上下両型２・３間にこの樹脂配布済プレート２５を進入させることになる。 (About the structure of vacuum drawing in the plate)
Although not shown, the resin containing plate 21 has, for example, vacuum evacuation means for forcibly sucking and discharging air from the inside of the resin containing portion 22 covered and closed by the release film 11 described above. In addition, a vacuum pumping mechanism such as a vacuum pump is provided, and an on-off valve and a vacuum pumping mechanism provided on the main body (resin housing portion 22) side of the plate 21 are provided in a vacuum path (vacuum tube) such as a vacuum tube. In addition, a vacuum tube is detachably provided with respect to the on-off valve.
That is, first, the on-off valve is opened, and then the air is forcibly sucked and discharged from the resin housing portion 22 through the vacuum path (open-close valve) by the vacuum drawing mechanism. By making the closed state, the inside of the resin accommodating portion 22 is set to a required degree of vacuum, and the release film 11 can be covered and fixed to the plate 21.
Next, the vacuum tube may be removed from the plate 21 (open / close valve) side.
That is, the opening 23 side of the plate 21 is covered with the release film 11 and the inside of the resin container 22 is evacuated, so that the inside of the resin container 22 supplied with the granular resin 6 is subjected to a required vacuum. It is configured so that it can be sealed with the release film 11 set as described above.
Therefore, the resin-distributed plate 25 can be formed by evacuating the inside of the resin container 22 (plate 21) that is covered and fixed with the release film 11 and supplied with the granular resin 6 described above.
In the present invention, as will be described later, the resin distributed plate 25 is inserted between the upper and lower molds 2 and 3 with the resin distributed plate 25 inverted.

また、前記したプレート周縁部２４に所要数の吸引孔を設けて構成すると共に、前記した吸引孔から前記した真空引き機構（前記した真空経路及び開閉弁を含む）にて空気を強制的に吸引排出して前記したプレート周縁部２４に前記した離型フィルム１１を吸着することにより、前記したプレート２１の開口部２３側を離型フィルム１１で被覆固定する構成を採用しても良い。
また、前記した離型フィルム１１のプレート２１への被覆について、前記した樹脂収容部２２内の真空引きの構成と、前記したプレート周縁部２４における吸引孔からの真空引きの構成を併用しても良い。
また、前記したプレート２１における樹脂収容部２２内（プレート周縁部２４の吸引孔）からの真空引きは、後述する反転した樹脂配布済プレート２５の上下両型２・３間への進入時に継続して行っても良い。
なお、前記した樹脂収容用プレート２１に所要量の顆粒樹脂６を計量して配布（投入）するには、例えば、後述する樹脂材料の配布手段が用いられている。 Further, the above-described plate peripheral portion 24 is provided with a required number of suction holes, and air is forcibly sucked from the suction holes by the vacuuming mechanism (including the vacuum path and the opening / closing valve). It is also possible to employ a configuration in which the opening 23 side of the plate 21 is covered and fixed with the release film 11 by discharging and adsorbing the release film 11 to the peripheral edge 24 of the plate.
Further, regarding the coating of the release film 11 on the plate 21, the configuration of evacuation in the resin housing portion 22 and the configuration of evacuation from the suction hole in the plate peripheral portion 24 may be used in combination. good.
Further, the evacuation from the inside of the resin accommodating portion 22 (the suction hole of the plate peripheral edge portion 24) in the plate 21 is continued when the inverted resin distributed plate 25 described later enters between the upper and lower molds 2 and 3. You may go.
In order to weigh and distribute (inject) a required amount of the granular resin 6 to the resin accommodating plate 21, for example, a resin material distribution means described later is used.

（樹脂材料の配布手段の構成について）
また、図１に示す樹脂材料の配布手段（樹脂材料の計量投入手段）３１にて、プレート２１（樹脂収容部２２）に所要量の顆粒樹脂６を計量して投入することにより、プレート２１の樹脂収容部２２に顆粒樹脂６を均一な厚さ（単位面積当たり一定量の樹脂量）で配布することができるように構成されている。
なお、樹脂材料の配布手段３１には、樹脂材料の投入側配布手段３１ａと樹脂材料の受給側配布手段３１ｂとに分かれて構成されている。 (Configuration of resin material distribution means)
In addition, the resin material distribution means (resin material metering means) 31 shown in FIG. The granular resin 6 can be distributed to the resin accommodating portion 22 with a uniform thickness (a constant amount of resin per unit area).
The resin material distribution means 31 is divided into a resin material input side distribution means 31a and a resin material receiving side distribution means 31b.

また、樹脂材料の投入側配布手段３１ａには、プレート２１（樹脂収容部２２）に所要量の顆粒樹脂６を投入する樹脂材料の投入手段３２と、プレート２１に投入される所要量の顆粒樹脂６を計量する樹脂材料のフィーダ側計量手段（ロードセル）３３とから構成されている。
また、図１に示すように、樹脂材料の投入手段３２には、顆粒樹脂のホッパ３４と、プレート２１に顆粒樹脂を適宜な振動手段（図示なし）にて振動させながら移動させて投入するリニア振動フィーダ３５とが設けられて構成されている。
従って、樹脂材料の投入側配布手段３１ａにおいて、ホッパ３４からの顆粒樹脂６をリニア振動フィーダ３５にて振動させながら移動させてプレート２１（樹脂収容部２２）に所要量の顆粒樹脂６を投入することができるように構成されると共に、プレート２１に投入される顆粒樹脂６を、顆粒樹脂６を投入しながら（樹脂材料の投入時に）、フィーダ側計量手段（ロードセル）３３にて計量することができるように構成されている。 The resin material input side distribution means 31a includes a resin material input means 32 for supplying a required amount of granular resin 6 to the plate 21 (resin housing portion 22), and a required amount of granular resin to be input to the plate 21. 6 is composed of feeder-side weighing means (load cell) 33 of a resin material for weighing 6.
Further, as shown in FIG. 1, the resin material charging means 32 is a linear resin hopper 34 and a linear resin for moving the granular resin to the plate 21 while vibrating it with appropriate vibration means (not shown). A vibration feeder 35 is provided.
Accordingly, in the resin material input side distribution means 31a, the granular resin 6 from the hopper 34 is moved while being vibrated by the linear vibration feeder 35, and a required amount of the granular resin 6 is charged into the plate 21 (resin accommodating portion 22). The granule resin 6 put into the plate 21 can be measured by the feeder-side weighing means (load cell) 33 while the granule resin 6 is being put in (when the resin material is put in). It is configured to be able to.

また、樹脂材料の受給側配布手段３１ｂには、プレート２１（樹脂収容部２２）を載置（移動）するプレート載置手段（図示なし）と、リニア振動フィーダ３５から樹脂収容部２２内に投入された顆粒樹脂６（プレート２１）を振動させながら当該顆粒樹脂６をＸ方向或いはＹ方向に移動させて樹脂収容部２２内で顆粒樹脂６の厚さを均一化する（単位面積当たり一定量の樹脂量に形成する）樹脂材料の振動均一化手段（図示なし）と、プレート２１に投入される所要量の顆粒樹脂６を計量する樹脂材料のプレート側計量手段（ロードセル）３６とが設けられて構成されている
従って、樹脂材料の受給側配布手段３１ｂにおいて、プレート載置手段に載置されたプレート２１に投入された所要量の顆粒樹脂６を、プレート２１を振動均一化手段にて振動させながら当該顆粒樹脂６をＸ方向或いはＹ方向に移動させて樹脂収容部２２内で顆粒樹脂６の厚さを均一化する（単位面積当たり一定量の樹脂量に形成する）ことができるように構成されると共に、プレート２１に投入される顆粒樹脂６を、顆粒樹脂６を投入しながら（樹脂材料の投入時に）、プレート側計量手段（ロードセル）３６にて計量することができるように構成されている。 The resin material receiving side distribution means 31b is loaded into the resin accommodating part 22 from a plate placing means (not shown) for placing (moving) the plate 21 (resin accommodating part 22) and the linear vibration feeder 35. While vibrating the granular resin 6 (plate 21), the granular resin 6 is moved in the X direction or the Y direction to make the thickness of the granular resin 6 uniform in the resin accommodating portion 22 (a constant amount per unit area). There are provided vibration equalizing means (not shown) of the resin material (not shown) formed on the resin amount, and plate-side weighing means (load cell) 36 of the resin material for weighing the required amount of granular resin 6 put into the plate 21. Therefore, in the resin material receiving side distribution means 31b, the required amount of the granular resin 6 put on the plate 21 placed on the plate placing means is used to make the plate 21 vibrate and uniform. The granular resin 6 is moved in the X direction or the Y direction while being vibrated in steps, and the thickness of the granular resin 6 is made uniform in the resin accommodating portion 22 (formed to a certain amount per unit area). In addition, the granular resin 6 charged in the plate 21 can be measured by the plate-side measuring means (load cell) 36 while the granular resin 6 is being charged (when the resin material is charged). It is configured as follows.

従って、図１に示すように、樹脂材料の配布手段３１にて、まず、リニア振動フィーダ３５からプレート２１の樹脂収容部２２に顆粒樹脂６を少量ずつ適宜に振動させながら投入（供給）し、次に、樹脂材料の振動均一化手段にて投入された当該顆粒樹脂６（プレート２１）を連続的に振動させることによりＸ方向或いはＹ方向に移動させて樹脂収容部２２内で顆粒樹脂６の厚さを均一化することができる（単位面積当たり一定量の樹脂量に形成することができる）。
また、前述したように、樹脂収容部２２内で顆粒樹脂６の厚さを効率良く均一化し得て（単位面積当たり一定量の樹脂量に効率良く形成し得て）樹脂収容部２２内で顆粒樹脂６（の表面）を効率良く平坦化することができる。
なお、顆粒樹脂６の計量について、樹脂材料の投入側配布手段３１ａのフィーダ側計量手段３３による計量工程と、樹脂材料の受給側配布手段３１ｂのプレート側計量手段３６による計量工程とを併用することができる。
また、これらの両計量工程をいずれか一方のみ実施する構成を採用してもよい。 Therefore, as shown in FIG. 1, the resin material distribution means 31 firstly feeds (supplies) the granular resin 6 from the linear vibration feeder 35 to the resin accommodating portion 22 of the plate 21 while appropriately vibrating it. Next, the granular resin 6 (plate 21) introduced by the vibration equalizing means of the resin material is continuously vibrated to move in the X direction or the Y direction, so that the granular resin 6 The thickness can be made uniform (can be formed in a certain amount of resin per unit area).
Further, as described above, the thickness of the granular resin 6 can be efficiently uniformed in the resin container 22 (can be efficiently formed to a certain amount of resin per unit area), and the granules can be formed in the resin container 22. The resin 6 (surface) can be planarized efficiently.
For the measurement of the granular resin 6, the weighing process by the feeder-side weighing means 33 of the resin material input-side distribution means 31a and the weighing process by the plate-side weighing means 36 of the resin material receiving-side distribution means 31b are used in combination. Can do.
Moreover, you may employ | adopt the structure which implements only one of these both measurement processes.

即ち、樹脂材料の投入手段３２（リニア振動フィーダ３５）においては、顆粒樹脂６を振動させることにより、単位時間当たり一定量の樹脂量にてプレート２１に投入することができるように構成されると共に、この単位時間当たりの樹脂投入量と、樹脂材料の振動均一化手段によるプレート２１（顆粒樹脂６）に対する振動作用とを適宜に調整することにより、樹脂収容部２２内に投入される顆粒樹脂６を単位面積当たり一定量の樹脂量に形成することができるように構成されている。
また、プレート２１の樹脂収容部２２における中央部に顆粒樹脂６を落下さて投入する構成を採用することができる。
この場合、樹脂収容部２２内で振動を加えられる顆粒樹脂６は外周囲方向に均等に移動して平坦化することになる。
また、プレート２１の樹脂収容部２２にリニア振動フィーダ３５から顆粒樹脂６を投入する場合に、プレート２１をプレート載置手段にて適宜に移動させても良い。
なお、プレート２１の樹脂収容部２２内における投入された顆粒樹脂６に凹凸部が残存した場合、プレート２１に振動作用を加えることにより、或いは、へらにて、当該凹凸部を平坦面にし得て顆粒樹脂６の厚さを均一化することができる。 That is, the resin material charging means 32 (linear vibration feeder 35) is configured so that the granular resin 6 is vibrated so that it can be charged into the plate 21 with a constant amount of resin per unit time. By appropriately adjusting the amount of resin charged per unit time and the vibration action on the plate 21 (granular resin 6) by the vibration equalizing means of the resin material, the granular resin 6 charged into the resin accommodating portion 22 is adjusted. Can be formed into a certain amount of resin per unit area.
Moreover, the structure which drops and throws the granular resin 6 into the center part in the resin accommodating part 22 of the plate 21 is employable.
In this case, the granular resin 6 to which vibration is applied in the resin accommodating portion 22 moves evenly in the outer peripheral direction and is flattened.
Further, when the granular resin 6 is introduced from the linear vibration feeder 35 into the resin accommodating portion 22 of the plate 21, the plate 21 may be appropriately moved by the plate mounting means.
In addition, when an uneven part remains in the charged granular resin 6 in the resin accommodating part 22 of the plate 21, the uneven part can be made flat by applying a vibration action to the plate 21 or with a spatula. The thickness of the granular resin 6 can be made uniform.

（電子部品の圧縮成形方法）
次に、図例を用いて、本発明に係る電子部品の圧縮成形方法を説明する。
即ち、まず、図１に示すように、前記した樹脂材料の配布手段３１にて、リニア振動フィーダからプレート２１の樹脂収容部２２内に顆粒樹脂６を少量ずつ振動させながら落下投入（供給）し、次に、樹脂収容部２２内の顆粒樹脂６を連続的に振動させながらＸ方向に或いはＹ方向に移動させることにより、顆粒樹脂６を単位面積当たり一定量の樹脂量に形成することができ、顆粒樹脂の厚さを均一化することができる。
このとき、プレート２１に投入される顆粒樹脂６を、顆粒樹脂６を投入しながら（樹脂材料の投入時に）、フィーダ側計量手段３３による計量とプレート側計量手段３６による計量とを併用することができる。
また、このとき、フィーダ側計量手段３３による計量とプレート側計量手段３６による計量とのいずれか一方の計量のみを実施しても良い。
従って、前記した樹脂材料の配布手段３１を用いて、プレート２１に投入される所要量の顆粒樹脂６を効率良く計量し得て、樹脂収容部２２内（プレート２１）の顆粒樹脂６を効率良く平坦化することができる。
なお、樹脂収容部２２内の顆粒樹脂６に凹凸部が残存した場合、プレート２１に振動を加えることにより、或いは、へらを用いることにより、脂収容部２２内の顆粒樹脂６を平坦化することができる。 (Electronic component compression molding method)
Next, an electronic component compression molding method according to the present invention will be described with reference to the drawings.
That is, first, as shown in FIG. 1, the resin material distribution means 31 drops and supplies (suppresses) the granular resin 6 from the linear vibration feeder into the resin accommodating portion 22 of the plate 21 while vibrating it little by little. Next, the granular resin 6 in the resin accommodating portion 22 is moved in the X direction or the Y direction while continuously vibrating, so that the granular resin 6 can be formed in a certain amount of resin per unit area. The thickness of the granular resin can be made uniform.
At this time, it is possible to use both the weighing by the feeder side weighing means 33 and the weighing by the plate side weighing means 36 while the granular resin 6 being charged into the plate 21 is being charged (when the resin material is charged). it can.
At this time, only one of the weighing by the feeder-side weighing means 33 and the weighing by the plate-side weighing means 36 may be performed.
Therefore, the resin material distribution means 31 can be used to efficiently measure the required amount of the granular resin 6 to be put into the plate 21, and the granular resin 6 in the resin container 22 (plate 21) can be efficiently measured. It can be flattened.
In addition, when an uneven | corrugated | grooved part remains in the granular resin 6 in the resin accommodating part 22, the granular resin 6 in the fat accommodating part 22 is planarized by applying a vibration to the plate 21 or using a spatula. Can do.

次に、図２（１）に示すように、顆粒樹脂６を供給したプレート２１の開口部２３に所要の大きさの離型フィルム１１を載置すると共に、前記した真空引き機構にて前記した顆粒樹脂６を供給したプレート２１の樹脂収容部２２から空気を強制的に吸引排出して前記した樹脂収容部２２内を所要の真空度に設定する。
このとき、前記プレート開口部２３側（プレート周縁部２４）に離型フィルム１１を被覆固定することができるので、離型フィルム１１が被覆され且つ樹脂材料６が投入されたプレート２１（樹脂収容部２２）、即ち、樹脂配布済プレート２５を形成することができる。
また、次に、図２（２）に示すように、前記した樹脂配布済プレート２５を反転させてインローダ９に係着する（なお、例えば、このとき、プレート２１の開閉弁側から真空チューブを取り外しても良い）。
このとき、前記したインローダ９の下部側に設けたプレート係着部９ａに反転した状態の樹脂配布済プレート２５を係着し、且つ、前記したインローダ９の上部側に設けた基板載置部９ｂに所要数の電子部品７を装着した基板８を、電子部品７を下方向に向けた状態で載置することができる。 Next, as shown in FIG. 2 (1), the release film 11 having a required size is placed in the opening 23 of the plate 21 supplied with the granular resin 6, and the above-described vacuuming mechanism is used as described above. Air is forcibly sucked and discharged from the resin container 22 of the plate 21 to which the granular resin 6 is supplied, and the inside of the resin container 22 is set to a required degree of vacuum.
At this time, since the release film 11 can be covered and fixed on the plate opening 23 side (plate peripheral edge 24), the plate 21 (resin accommodating portion) covered with the release film 11 and charged with the resin material 6 is used. 22) That is, the resin distributed plate 25 can be formed.
Next, as shown in FIG. 2 (2), the above-mentioned resin distributed plate 25 is reversed and engaged with the inloader 9 (for example, at this time, a vacuum tube is connected from the on-off valve side of the plate 21). May be removed).
At this time, the resin distributed plate 25 in an inverted state is engaged with the plate engaging portion 9a provided on the lower side of the inloader 9, and the substrate mounting portion 9b provided on the upper side of the inloader 9 is provided. The board 8 on which the required number of electronic components 7 are mounted can be placed with the electronic components 7 facing downward.

また、次に、図３に示すように、前記した金型１（上下両型２・３）を型開きして前記した上下両型２・３間にインローダ９を進入させる。
このとき、前記したキャビティ５の直上位置にインローダ９を配置すると共に、まず、前記した上型２の基板セット部４に、基板８に装着した電子部品７を下方向に向けた状態で供給セットし、次に、前記したキャビティ５の開口部１０を含む下型３の型面に樹脂配布済プレート２５を当接する。
このとき、前記したキャビティ５の開口部１０を含む下型３の型面に前記したプレート２１に被覆固定された離型フィルム１１が当接することになると共に、下型３の型面に離型フィルム１１の外周囲部が吸着固定され、更に、前記した下型３の型面とプレート周縁部２４にて離型フィルム１１の外周囲部側が挟持されることになる。
なお、このとき、前記したキャビティ５の開口部１０と前記したプレート２１の開口部２３とは合致した状態に構成されている。
次に、図４に示すように、樹脂配布済プレート２５の樹脂収容部２２内の真空状態を（例えば、開閉弁を開状態にして）解除する。
このとき、前記したキャビティ５内面と下型３の型面とから（即ち、吸引孔から）空気を強制的に吸引排出されているので、下型３の型面を含むキャビティ５内面に離型フィルム１１を吸着固定して被覆することになる。
また、このとき、離型フィルム１１におけるキャビティ５の開口部１０に対応する部分は下型キャビティ５内へ移動することになるので、離型フィルム１１にてキャビティ５内面を被覆することができる。
即ち、顆粒樹脂６を離型フィルム１１に載置して状態で、且つ、この離型フィルム１１の移動にしたがって、上方位置の樹脂収容部２２側から下方位置のキャビティ５内側に顆粒樹脂６が落下することになるので、顆粒樹脂６を離型フィルム１１で被覆されたキャビティ５内に供給することができる。 Next, as shown in FIG. 3, the mold 1 (upper and lower molds 2 and 3) is opened and an inloader 9 is inserted between the upper and lower molds 2 and 3.
At this time, the inloader 9 is disposed at a position directly above the cavity 5 and, first, the supply set is made with the electronic component 7 mounted on the substrate 8 facing downward on the substrate setting portion 4 of the upper mold 2. Then, the resin distributed plate 25 is brought into contact with the mold surface of the lower mold 3 including the opening 10 of the cavity 5 described above.
At this time, the mold release film 11 covered and fixed to the plate 21 contacts the mold surface of the lower mold 3 including the opening 10 of the cavity 5 described above, and the mold release is performed on the mold surface of the lower mold 3. The outer peripheral part of the film 11 is adsorbed and fixed, and the outer peripheral part side of the release film 11 is sandwiched between the mold surface of the lower mold 3 and the plate peripheral part 24.
At this time, the opening 10 of the cavity 5 and the opening 23 of the plate 21 are configured to coincide with each other.
Next, as shown in FIG. 4, the vacuum state in the resin accommodating portion 22 of the resin distributed plate 25 is released (for example, by opening the on-off valve).
At this time, air is forcibly sucked and discharged from the inner surface of the cavity 5 and the mold surface of the lower mold 3 (that is, from the suction hole), so that the mold is released to the inner surface of the cavity 5 including the mold surface of the lower mold 3. The film 11 is covered by adsorbing and fixing.
At this time, the part of the release film 11 corresponding to the opening 10 of the cavity 5 moves into the lower mold cavity 5, so that the inner surface of the cavity 5 can be covered with the release film 11.
That is, in the state where the granule resin 6 is placed on the release film 11 and the release film 11 moves, the granule resin 6 is moved from the resin housing portion 22 at the upper position to the inside of the cavity 5 at the lower position. Since it falls, the granule resin 6 can be supplied into the cavity 5 covered with the release film 11.

なお、このとき、前記したプレート２１の樹脂収容部２２をキャビティ５の直上位置に設けて構成し、且つ、離型フィルム１１の移動にしたがって顆粒樹脂６がそのままの均一の厚さとなるシート状を保持した状態で樹脂収容部２２から下型キャビティ５内に所要量の顆粒樹脂６の全てを効率良く供給することができる〔図４を参照〕。   At this time, the resin accommodating portion 22 of the plate 21 is provided at a position directly above the cavity 5, and the granular resin 6 has a uniform thickness as it is as the release film 11 moves. In the held state, it is possible to efficiently supply all of the required amount of the granular resin 6 from the resin container 22 into the lower mold cavity 5 (see FIG. 4).

次に、前記した金型１からインローダ９を退出させると共に、図５に示すように、前記した金型１を所要の型締圧力にて型締めすることにより、前記したキャビティ５内の樹脂に所要の樹脂圧を加えることになる。
このとき、基板８に装着された電子部品７を下型キャビティ５内で加熱溶融化された樹脂内に浸漬することにより、前記した電子部品７を当該キャビティ５内の形状に対応した樹脂成形体１２内に圧縮成形（樹脂封止成形）することができる。 Next, the inloader 9 is withdrawn from the mold 1 and the mold 1 is clamped at a required mold clamping pressure as shown in FIG. The required resin pressure is applied.
At this time, the electronic component 7 mounted on the substrate 8 is immersed in a resin melted by heating in the lower mold cavity 5, whereby the above-described electronic component 7 is molded into a resin corresponding to the shape in the cavity 5. 12 can be compression-molded (resin-sealed molding).

従って、本発明によれば、金型キャビティ内への樹脂の供給時に、金型キャビティ内に樹脂を効率良く供給することができると云う優れた効果を奏する。
また、本発明は、金型キャビティ内への樹脂の供給時において、金型キャビティ内に供給される樹脂量の信頼性を効率良く向上させることができると云う優れた効果を奏する。 Therefore, according to the present invention, there is an excellent effect that the resin can be efficiently supplied into the mold cavity when the resin is supplied into the mold cavity.
Further, the present invention has an excellent effect that the reliability of the amount of resin supplied into the mold cavity can be improved efficiently when the resin is supplied into the mold cavity.

本発明は、前述した実施例のものに限定されるものでなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意且つ適宜に変更・選択して採用できるものである。   The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

また、前記した実施例において、熱硬化性の樹脂材料を用いて説明したが、熱可塑性の樹脂材料を用いても良い。   In the above-described embodiments, the thermosetting resin material has been described. However, a thermoplastic resin material may be used.

また、前記した実施例において、顆粒状の樹脂材料を用いて説明したが、所要の粒径分布を有する粉末状の樹脂材料（パウダー樹脂）、粉末状の樹脂材料（粉末樹脂）などの種々の形状の樹脂材料を採用することができる。 In the above-described embodiments, the granular resin material has been described. However, various kinds of powdered resin material (powder resin), powdered resin material (powder resin) having a required particle size distribution are used. A resin material having a shape can be employed.

また、前記した実施例において、例えば、シリコン系の樹脂材料、エポキシ系の樹脂材料を用いることができる。
また、前記実施例において、透明性を有する樹脂材料、半透明性を有する樹脂材料、燐光物資、蛍光物質を含む樹脂材料など種々の樹脂材料を用いることができる。 In the above-described embodiments, for example, a silicon-based resin material or an epoxy-based resin material can be used.
Moreover, in the said Example, various resin materials, such as the resin material which has transparency, the resin material which has translucency, a phosphorescent material, and the resin material containing a fluorescent substance, can be used.

また、前記した実施例において、プレート２１内に樹脂材料を供給しながら（樹脂材料の供給時に）、又は、プレート２１内に樹脂材料を供給する前に、前記した樹脂材料を計量する工程を行う構成を採用しても良い。   In the above-described embodiment, the step of measuring the resin material is performed while supplying the resin material into the plate 21 (at the time of supplying the resin material) or before supplying the resin material into the plate 21. A configuration may be adopted.

図１は、本発明に係る電子部品の圧縮成形方法を説明する樹脂収容用のプレートと樹脂材料の配布機構とを概略的に示す概略斜視図であって、図１は前記したプレートに樹脂材料を配布する状態を示している。FIG. 1 is a schematic perspective view schematically showing a resin housing plate and a resin material distribution mechanism for explaining a compression molding method for an electronic component according to the present invention. FIG. Shows the status of distribution. 図２（１）、図２（２）は、本発明に係る電子部品の圧縮成形方法を説明する樹脂収容用のプレートを概略的に示す概略縦断面図であって、図２（１）は前記した樹脂材料を投入したプレートに離型フィルムを被覆した状態を示し、図２（２）は図２（１）に示す離型フィルム被覆プレートを反転させた状態を示している。2 (1) and 2 (2) are schematic longitudinal sectional views schematically showing a resin housing plate for explaining a compression molding method of an electronic component according to the present invention, and FIG. FIG. 2 (2) shows a state in which the release film coating plate shown in FIG. 2 (1) is inverted. 図３は、本発明に係る電子部品の圧縮成形方法を説明する電子部品の圧縮成形用金型を概略的に示す概略縦断面図であって、前記した金型に図２（２）に示す反転離型フィルム被覆プレートを供給した状態を示している。FIG. 3 is a schematic longitudinal sectional view schematically showing a compression molding die for electronic parts for explaining the compression molding method for electronic parts according to the present invention, and is shown in FIG. The state which supplied the reverse release film coating plate is shown. 図４は、図３に対応する電子部品の圧縮成形用金型を概略的に示す概略縦断面図であって、前記した金型に設けた離型フィルム被覆の下型キャビティ内に反転プレートから樹脂材料を落下供給した状態を示している。FIG. 4 is a schematic longitudinal sectional view schematically showing a compression molding die for electronic parts corresponding to FIG. 3, in which the reversal plate is inserted into the lower die cavity of the release film coating provided on the aforementioned die. A state in which the resin material is supplied in a dropped manner is shown. 図５は、図３に対応する電子部品の圧縮成形用金型を概略的に示す概略縦断面図であって、前記した金型の型締状態を示している。FIG. 5 is a schematic longitudinal sectional view schematically showing a compression molding die for electronic parts corresponding to FIG. 3, and shows a mold clamping state of the aforementioned die. 図６は、従来の電子部品の圧縮成形方法を説明する電子部品の圧縮成形用金型を概略的に示す概略縦断面図である。FIG. 6 is a schematic longitudinal sectional view schematically showing a compression molding die for electronic parts for explaining a conventional compression molding method for electronic parts.

１ 電子部品の圧縮成形用金型
２ 固定上型
３ 可動下型
４ 基板セット部
５ 下型キャビティ
６ 顆粒状の樹脂材料（顆粒樹脂）
７ 電子部品
８ 基板
９ インローダ
９ａ プレート係着部
９ｂ 基板載置部
１０ キャビティ開口部
１１ 離型フィルム
１２ 樹脂成形体
２１ 樹脂収容用プレート
２２ 樹脂収容部
２３ プレート開口部
２４ プレート周縁部
２５ 樹脂配布済プレート
３１ 樹脂材料の配布手段
３１ａ 投入側配布手段
３１ｂ 受給側配布手段
３２ 樹脂材料の投入手段
３３ フィーダ側の計量手段
３４ ホッパ
３５ リニア振動フィーダ
３６ プレート側の計量手段 1 Mold for compression molding of electronic parts 2 Fixed upper mold 3 Movable lower mold 4 Substrate setting part 5 Lower mold cavity 6 Granular resin material (granular resin)
7 Electronic component 8 Substrate 9 Inloader 9a Plate engaging portion 9b Substrate placing portion 10 Cavity opening portion 11 Release film 12 Resin molded body 21 Resin accommodating plate 22 Resin accommodating portion 23 Plate opening portion 24 Plate peripheral portion 25 Resin distributed Plate 31 Resin material distribution means 31a Input side distribution means 31b Receiving side distribution means 32 Resin material input means 33 Feeder side weighing means 34 Hopper 35 Linear vibration feeder 36 Plate side weighing means

Claims (6)

電子部品の圧縮成形用金型を用いて、離型フィルムが被覆された金型キャビティ内に所要量の樹脂材料を供給すると共に、前記したキャビティ内の樹脂に電子部品を浸漬することにより、前記したキャビティ内で当該キャビティの形状に対応した樹脂成形体内に前記した電子部品を樹脂封止成形する電子部品の圧縮成形方法であって、
前記金型キャビティ内に供給する所要量の樹脂材料を収容し且つ前記キャビティと同等の凹部を有する樹脂収容部を備えた樹脂収容用プレートを用意する工程と、
前記樹脂収容部の開口部の周囲に設けたプレート周縁部に前記離型フィルムを吸着する吸引孔を設ける工程と、
前記金型キャビティへの供給前に、前記プレートにおける樹脂収容部内に所要量の樹脂材料を供給する工程と、
前記したプレートの開口部側に所要の大きさを有する離型フィルムを載置し、前記離型フィルムを前記プレート周縁部の吸引孔にて吸着して固定する工程と、
前記離型フィルムを載置したプレートにおける樹脂収容部内を所要の真空度に設定する工程と、
前記離型フィルムを被覆し且つ前記樹脂収容部内を所要の真空度に設定したプレートを反転させて反転プレートを形成する工程と、
前記した反転プレートを前記した金型キャビティの位置に移送する工程と、
前記した反転プレートにおける樹脂収容部内の真空状態を解除する工程と、
前記した反転プレートにおける樹脂収容部内の真空状態の解除時に、前記した離型フィルムを前記したキャビティ面に被覆固定させる工程と、
前記した反転プレートにおける樹脂収容部内の真空状態の解除時に、前記した離型フィルムを被覆した金型キャビティ内に前記したプレートの樹脂収容部内から樹脂材料を供給する工程とを含むことを特徴とする電子部品の圧縮成形方法。 By supplying a required amount of a resin material into a mold cavity covered with a release film using a compression mold for electronic parts, and by immersing the electronic part in the resin in the cavity described above, An electronic component compression molding method for resin-sealing the above-described electronic component in a resin molded body corresponding to the shape of the cavity in the cavity,
Preparing a resin containing plate having a resin containing portion containing a required amount of resin material to be supplied into the mold cavity and having a recess equivalent to the cavity;
Providing a suction hole for adsorbing the release film on the periphery of the plate provided around the opening of the resin container;
Before supplying to the mold cavity, supplying a required amount of resin material into the resin container in the plate;
Placing a release film having a required size on the opening side of the plate, and adsorbing and fixing the release film at a suction hole in the peripheral edge of the plate;
A step of setting the required degree of vacuum inside the resin container in the plate on which the release film is placed;
A step of inverting a plate that covers the release film and that is set to a required degree of vacuum in the resin accommodating portion to form a reversal plate;
Transferring the reversing plate described above to the position of the mold cavity;
Releasing the vacuum state in the resin container in the reversing plate, and
A step of covering and fixing the above-described release film on the above-described cavity surface when releasing the vacuum state in the resin container in the above-described reversing plate ;
A step of supplying a resin material from the resin accommodating portion of the plate into the mold cavity coated with the release film when the vacuum state in the resin accommodating portion of the reversing plate is released. Electronic component compression molding method. プレートの樹脂収容部内に樹脂材料を供給しながら、又は、前記プレートの樹脂収容部内に樹脂材料を供給する前に、前記した樹脂材料を計量する工程とを含むことを特徴とする請求項１に記載の電子部品の圧縮成形方法。 The method of claim 1, further comprising a step of weighing the resin material while supplying the resin material into the resin container of the plate or before supplying the resin material into the resin container of the plate. The compression molding method of the electronic component as described. プレートの樹脂収容部内に所要量の樹脂材料を供給した後、前記したプレートの樹脂収容部内の樹脂材料の厚さを均一にする工程を行うことを特徴とする請求項１に記載の電子部品の圧縮成形方法。 2. The electronic component according to claim 1, wherein after the required amount of resin material is supplied into the resin housing portion of the plate , the step of making the thickness of the resin material in the resin housing portion of the plate uniform is performed. Compression molding method. 樹脂材料が、所要の粒径分布を有する粉末状の樹脂材料であることを特徴とする請求項１に記載の電子部品の圧縮成形方法。 The compression molding method for electronic parts according to claim 1, wherein the resin material is a powdery resin material having a required particle size distribution. 樹脂材料が、顆粒状の樹脂材料であることを特徴とする請求項１に記載の電子部品の圧縮成形方法。   The compression molding method for electronic parts according to claim 1, wherein the resin material is a granular resin material. 樹脂材料が、粉末状の樹脂材料であることを特徴とする請求項１に記載の電子部品の圧縮成形方法。   The method for compression molding an electronic component according to claim 1, wherein the resin material is a powdered resin material.
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JP2007063336A JP4855307B2 (en) 2007-03-13 2007-03-13 Electronic component compression molding method
KR1020097014160A KR101107843B1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
SG201002433-9A SG161252A1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
MYPI2014002351A MY182097A (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
KR1020117011977A KR101162460B1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
SG2012062972A SG184703A1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
KR1020127010489A KR101245393B1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
MYPI2014002352A MY182099A (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
MYPI20092598A MY154681A (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
PCT/JP2008/054026 WO2008126527A1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
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