JP4817781B2 - Manufacturing method of electronic component package - Google Patents

Description

  The present invention relates to a method for manufacturing a package for housing an electronic component such as a light emitting element.

  Conventionally, a light emitting device as shown in FIG. 7 is known (see Patent Document 1). The light emitting device has a light emitting element (2) mounted on a ceramic package (16), and the package (16) is formed by joining and integrating a base portion (18) and a frame portion (19). Has been. A cavity (17) is formed inside the frame body portion (19) as a space for accommodating the light emitting element (2), and the cavity (17) extends in a direction away from the base body portion (18). It is expanding. In addition, a metal layer (32) surrounding the entire circumference of the cavity (17) is formed on the inner peripheral surface (33) of the frame body portion (19).

  In the method for manufacturing the light emitting device, as shown in FIG. 8, a punch (80) and a die are formed so as to form a through hole to be the cavity (17) in the ceramic green sheet (42) to be the frame body portion (19). (81) is used to punch the ceramic green sheet (42). Thus, a through hole (43) that expands in the punching direction is formed in the ceramic green sheet (42). The inner peripheral surface of the through hole is inclined with respect to the surface direction of the ceramic green sheet (42), and the inclination angle θ is adjusted by the clearance C between the punch (80) and the die (81). be able to. The ceramic green sheet (42) in which the through-hole (43) is formed is bonded to a ceramic green sheet (not shown) to be the base portion (18), and then fired together with the ceramic green sheet.

On the other hand, as shown in FIG. 9, there is a manufacturing method for forming a space (92) to be the cavity (17) in the ceramic body (9) to be the package (16) by pressure molding using a rubber plate (94). It is known (see Patent Document 2). First, as shown in FIG. 9 (a), a plurality of ceramic green sheets (90) serving as the base (18) are stacked and compressed in the stacking direction. Then, a plurality of ceramic green sheets (91) serving as the frame (19) provided with through holes are laminated on the compressed ceramic green sheet (90) as shown in FIG. The sheet (91) is pressed by the rubber plate (94) in the stacking direction. As a result, a ceramic body (9a) in which a plurality of ceramic green sheets (90) (91) are integrated is obtained. Thereafter, on the ceramic body (9a), as shown in FIG. 9 (c), a ceramic green sheet (91) provided with a through hole having a larger opening area than the ceramic green sheet previously laminated is laminated, and a rubber plate ( The ceramic body (9b) is obtained by pressurizing according to 94). Then, on the ceramic body (9b), as shown in FIG. 9 (d), a ceramic green sheet (91) provided with a through hole having a larger opening area than the ceramic green sheet previously laminated is laminated, and a rubber plate ( The ceramic body (9c) is obtained by pressurizing according to 94).
Japanese Patent Laid-Open No. 2002-232017 Japanese Patent No. 3225666

  However, in the manufacturing method shown in FIG. 8, when the through hole (43) serving as the cavity (17) is punched and formed in the ceramic green sheet (42) serving as the frame body portion (19), the inside of the through hole (43) is formed. There is a problem that it is difficult to adjust the inclination angle θ of the peripheral surface to a desired angle. Further, the inner peripheral surface of the ceramic green sheet (42) becomes rough, and there is a problem that a smooth inner peripheral surface cannot be obtained.

  Further, the manufacturing method shown in FIG. 9 also has a problem that the shape of the inner peripheral surface (93) of the space (92) serving as the cavity (17) is formed in a step shape, and a smooth inner peripheral surface cannot be obtained. there were.

  An object of the present invention is to provide a method of manufacturing a package for an electronic component that can smooth the inner peripheral surface of a cavity for housing an electronic component as compared with the conventional one and can form the inner peripheral surface at a desired inclination angle. Is to provide.

An electronic component package manufactured according to the present invention is configured by laminating a base body part (11) and a frame body part (12) made of an insulating material, and the frame body part (12) includes a base body part (11) and A cavity (10) is formed through the frame body (12) in the stacking direction to accommodate electronic components, and the inner peripheral surface (51) of the frame body (12) surrounding the cavity (10) is formed. In at least a part of the region, an inclined surface that is inclined with respect to the stacking direction is formed so that the cavity (10) is enlarged from the base portion (11) side toward the opening side of the frame body portion (12). Has been.
In the first step, the electronic component package manufacturing method according to the present invention prepares one or a plurality of ceramic green sheets (13) to be the frame body portion (12), and the base portion (11). One or more ceramic green sheets (14) are prepared. One or a plurality of ceramic green sheets (13) serving as the frame portion (12) are provided with through holes (15) in which the cavities (10) are to be formed.
In the second step, one or a plurality of ceramic green sheets (13) to be the frame body portion (12) obtained in the first step is pressed. The mold (6) used for the pressing includes a base part (60) having a flat press surface and a convex part (61) protruding from the press surface of the base part (60). Has a side surface (62) having an inclination angle with respect to the protruding direction of the convex portion (61), and the inclination angle of the side surface (62) corresponds to the inclination angle of the inclined surface of the frame body portion (12). . During the press working, the convex portion (61) of the mold (6) is press-fitted into the through hole (15) of the ceramic green sheet (13). In the second step, a plurality of ceramic green sheets (13) and (14) obtained in the first step are stacked and compressed in the stacking direction.
In the third step, the laminate of the plurality of ceramic green sheets (13) and (14) obtained in the second step is fired.

  In the method for manufacturing an electronic component package of the present invention, the ceramic green sheet (13) to be the frame body portion (12) is pressed by the mold (6) in the second step, so that the thickness direction At the same time, the plastic deformation occurs in a direction perpendicular to the compression direction. In the process of press-fitting the convex portion (61) of the mold (6) into the through hole (15) of the ceramic green sheet (13), the deformation of the ceramic green sheet (13) in the direction perpendicular to the compression direction is The inner peripheral surface of the through hole (15) of the ceramic green sheet (13) is received by the side surface (62) of the convex portion (61) of the mold (6), and the side surface of the convex portion (61) of the mold (6). Pressed by (62). Thereby, the inner peripheral surface of the through hole (15) of the ceramic green sheet (13) is formed into a shape corresponding to the shape of the convex portion (61) of the mold (6), and the through hole (15) is smooth. The inner peripheral surface is formed, and the inclination angle of the inner peripheral surface is formed at an angle corresponding to the inclination angle of the side surface of the convex portion (61) of the mold (6).

  In a specific configuration, the plurality of through holes (15) provided in the plurality of ceramic green sheets (13) to be the frame body portion (12) are one or more ceramic greens to be the base portion (11). The size gradually increases in the stacking direction from the sheet (14) side.

  According to the specific configuration, the space surrounded by the inner peripheral surface of the through hole (15) of the plurality of laminated ceramic green sheets (13) is the shape of the convex portion (61) of the mold (6). It has a shape corresponding to. Therefore, when the convex portion (61) of the mold (6) is press-fitted into the through hole (15) of the ceramic green sheet (13), all the through holes (15) of the plurality of ceramic green sheets (13) are inserted. Is pressed against the side surface (62) of the convex portion (61) of the mold (6).

  In a specific configuration, in the second step, one or a plurality of ceramic green sheets (13) serving as a frame body portion (12) on one or a plurality of ceramic green sheets (14) serving as a base portion (11). ), And a plurality of laminated ceramic green sheets (13) and (14) are sandwiched between the mold (6) and the metal base plate (64), and simultaneously compressed.

  According to the specific configuration, the shape of the inner peripheral surface of the through hole (15) of the ceramic green sheet (13) that becomes the frame portion (12) corresponds to the shape of the convex portion (61) of the mold (6). At the same time, the ceramic green sheet (13) serving as the frame portion (12) and the ceramic green sheet (14) serving as the base portion (11) are integrated.

  In a specific configuration, in the second step, one or more ceramic green sheets (13) to be the frame body portion (12) are sandwiched between the mold (6) and the base plate (65) made of an elastic body. After being pressed and compressed, it is compressed in the stacking direction together with one or a plurality of ceramic green sheets (14) to be the base portion (11).

  According to this specific configuration, the convex portion (61) of the mold (6) passes through all the through holes (15) of the one or more ceramic green sheets (13), and the ceramic green sheets (13 ) Of the ceramic green sheet (13) is completed in a state of protruding from the surface facing the base plate (65) and biting into the base plate (65).

  In a specific configuration, a metal film is formed on the inner peripheral surface of the through hole (15) of at least one ceramic green sheet (13) among one or more ceramic green sheets (13) to be the frame portion (12). (50) is formed.

  According to this specific configuration, the inner peripheral surface of the through-hole (15) of the ceramic green sheet (13) is pressed against the side surface (62) of the convex portion (61) of the mold (6), whereby the metal film (50) is pressed against the side surface (62) of the convex portion (61) of the mold (6), and the inner peripheral surface of the through hole (15) of the ceramic green sheet (13) is the convex portion of the mold (6). In addition to the shape corresponding to the shape of (61), the metal film (50) is integrated on the inner peripheral surface to form a continuous smooth reflective layer (5).

  In a specific configuration, in the first step, one or a plurality of ceramic green sheets (13) serving as a frame body portion (12) are provided with through holes (15) at a plurality of locations, respectively. In the second step, one or a plurality of sheets that become the frame body portion (12) are formed using the mold (6) in which the protrusions (61) protrude from a plurality of locations. The ceramic green sheet (13) is pressed, and the projections of the mold (6) are press-fitted into the through holes (15) of the ceramic green sheet (13). By firing in the third step, an aggregate substrate (7) in which a plurality of package portions (70) are aggregated is obtained. Further, the assembly substrate (7) obtained through the third step is subjected to processing for cutting each package portion (70), thereby obtaining a plurality of packages (1) each having a cavity (10). .

  According to the specific configuration, a plurality of packages (1) are manufactured at the same time, so that productivity is improved.

  According to the method for manufacturing an electronic component package according to the present invention, the inner peripheral surface of the cavity (10) for housing the electronic component is smoothed as compared with the conventional one, and the inner peripheral surface is formed at a desired inclination angle. be able to.

Hereinafter, embodiments of the present invention applied to a method for manufacturing a light emitting device package will be described in detail with reference to the drawings.
FIG. 1 shows a light emitting device having a package (1) manufactured by the manufacturing method of the present invention. The package (1) is made of ceramic, and a frame body portion (12) is laminated on a base body portion (11), and the whole has a substantially rectangular parallelepiped shape.

  A cavity (10) for accommodating the light emitting element (2) made of LED is recessed in the frame body portion (12). The cavity (10) has a rectangular opening on the upper surface of the frame (12) with the long side in the longitudinal direction of the package (1).

  Of the inner peripheral surface of the cavity (10), the two surfaces (51a) (51a) facing each other in the longitudinal direction of the package (1) extend from the base body (11) side to the opening side of the frame body portion (12). It has an inclination angle of about 15 ° with respect to the stacking direction of the base body portion (11) and the frame body portion (12) so as to enlarge the cavity (10), and the other two surfaces (51b) (51b) is substantially perpendicular to the base portion (11). Moreover, all the inner peripheral surfaces (51a) and (51b) of the frame portion (12) are covered with a reflective layer (5) having a smooth surface made of metal such as silver.

  A first land layer (31) and a second land layer (41) are formed of a conductive material such as silver on the bottom surface of the cavity (10), and a power supply terminal provided on the upper surface of the light emitting element (2). (Not shown) is connected to the first land layer (31) via the wire (20), and a ground terminal (not shown) provided on the back surface of the light emitting element (2) is connected to the second land layer (41). ) Directly connected. The package (1) is provided with external electrodes (3) and (4), which are connected to the first and second land layers (31) and (41), respectively.

  The light-emitting device shown in FIG. 1 is surface-mounted on a circuit board in such a posture that the external electrodes (3) and (4) are tilted sideways, and the external electrodes (3) ( 4) is soldered. Then, power is supplied from the circuit board to the light emitting element (2), whereby the light emitting element (2) operates. Of the light emitted from the light emitting element (2) in all directions, the light incident on the surface of the reflective layer (5) is reflected by the surface and travels forward (upward in FIG. 1). .

FIG. 2 shows a manufacturing process of the package (1).
First, as shown in FIG. 2 (a), three ceramic green sheets (14) serving as the base portion (11) are prepared, and four ceramic green sheets (13a) (13b) serving as the frame body portion (12). ) (13c) (13d) are prepared. Each of the four ceramic green sheets (13a) to (13d) is provided with a rectangular through hole (15). The through-holes (15) provided in the four ceramic green sheets (13a) to (13d) have substantially the same short-side dimension and different long-side dimensions. The size of the opening of the through hole (15) is from the lower layer to the upper layer arranged on the base part (11) side, ceramic green sheet (13a), ceramic green sheet (13b), ceramic green sheet (13c) ) And ceramic green sheets (13d) in this order. Further, a metal film (50) serving as the reflective layer (5) is formed on the inner peripheral surface of each through hole (15) of the four ceramic green sheets (13a) to (13d). The metal film (50) is formed, for example, by printing a silver paste.

  Next, the four ceramic green sheets (13a) to (13d) are laminated on the three ceramic green sheets (14) laminated. When laminating the ceramic green sheets (13a) to (13d), the ceramic green sheet (13a) in which the minimum through-hole (15) is formed is stacked on the lower ceramic green sheet (14), and the ceramic green sheets Ceramic green sheets (13b), (13c), and (13d) are laminated on the sheet (13a) in ascending order of the size of the through holes (15). At this time, the positions of the ceramic green sheets (13a) to (13d) are aligned so that the center positions of the through holes (15) of the ceramic green sheets (13a) to (13d) coincide with the stacking direction. The total thickness of the ceramic green sheets (13a) to (13d) laminated in this way is about 0.5 mm, and through holes (15) are formed inside the laminated ceramic green sheets (13a) to (13d). A stepped pyramid-shaped space surrounded by the inner peripheral surface of) is formed.

Next, as shown in FIG. 2B, a laminate in which four ceramic green sheets (13a) to (13d) and three ceramic green sheets (14) are laminated (hereinafter referred to as a laminate). Is pressed in the stacking direction. The mold (6) used for the press work is made of stainless steel, and has a flat base portion (60) having a flat press surface, and a convex portion (61) protruding from the press surface of the base portion (60). And have. The convex portion (61) has a truncated pyramid shape corresponding to the shape of the cavity (10) shown in FIG. 1, and has an inclination angle θ ₁ of about 15 ° with respect to the protruding direction of the convex portion (61). It includes a pair of side surfaces (62) and (62) that are inclined and approach each other in a direction away from the press surface, and a bottom surface (63) that is a plane parallel to the press surface.

  As a preparation before pressing, the laminate is placed on a metal base plate (64). At this time, the ceramic green sheet (14) side of the laminate is disposed on the base plate (64) side. At this stage, the space surrounded by the inner peripheral surface of the through hole (15) of the laminated ceramic green sheets (13a) to (13d) approximated the shape of the convex portion (61) of the mold (6). Shape.

In the press working, the ceramic green sheet laminate is sandwiched between the mold (6) and the base plate (64), and the convex portion (61) of the mold (6) is ceramic green sheets (13a) to (13d). Press fit into the through hole (15). As a result, the bottom surface (63) of the protrusion (61) passes through all the through holes (15) of the ceramic green sheets (13a) to (13d), and the bottom surface (63) is pressed against the ceramic green sheet (14). Is done. In this state, the laminated body is compressed and integrated between the press surface of the mold (6) and the base plate (64). At this time, the temperature setting is 90 to 100 ° C., and the pressure setting is 20 to 40 MPa.

The ceramic green sheets (13a) to (13d) are compressed in the thickness direction by press working and cause plastic deformation in a direction orthogonal to the compression direction. The ceramic green sheets (13a) to (13d) are compressed in the process in which the convex portion (61) of the mold (6) is press-fitted into the through holes (15) of the ceramic green sheets (13a) to (13d). The plastic deformation in the direction orthogonal to the direction is received by the side surface (62) of the convex portion (61) of the mold (6). And the metal film (50) formed in the internal peripheral surface of the through-hole (15) of all the ceramic green sheets (13a)-(13d) is the side surface (62) of the convex part (61) of the mold (6). Close contact with.

In this way, the metal film (50) formed on the inner peripheral surface of the through hole (15) of the ceramic green sheets (13a) to (13d) is the side surface (62) of the convex portion (61) of the mold (6). The inner peripheral surface becomes a shape corresponding to the shape of the convex portion (61) of the mold (6), and the metal film (50) is integrated with the inner peripheral surface continuously. Thus, a smooth reflective layer (5) is formed.

  A laminated body integrated by the above steps is obtained, and finally the laminated body is fired. As a result, the package (1) shown in FIG. 1 is obtained.

In the above embodiment, the inclination angle θ ₁ of the inclined inner peripheral surface (51a) of the frame body portion (12) shown in FIG. 1 is formed at about 15 °. The inclination angle of the peripheral surface (51a) can be arbitrarily set. For example, as shown in FIG. 3, the inner peripheral surface (51a) is inclined drives out small inclination angle theta ₂ than the inclination angle theta ₁ of the inner peripheral surface (51a) in the form of the embodiment of the frame portion (12) In the process of manufacturing the package (1), the mold (6) used for the press working has a side surface (62) inclined at an inclination angle θ ₂ with respect to the protruding direction of the convex portion (61). Yes.

When the inclination angle θ ₂ of the side surface (62) of the convex portion (61) of the mold (6) is 5 ° or less, a plurality of ceramic green sheets (13) are formed as shown in FIGS. Even when all the openings of the through-holes (15) to be opened have the same size, the metal film (50) of the through-holes (15) of all the ceramic green sheets (13) is pressed by the same pressing as in the above embodiment. ) Is pressed against the side surface (62) of the convex portion (61) of the mold (6). As a result, the inner peripheral surface of the through hole (15) of the ceramic green sheet (13) is formed in a shape corresponding to the shape of the convex portion (61) of the mold (6).

  In another embodiment, only four ceramic green sheets (13) laminated as shown in FIGS. 4 (a) and 4 (b) are made of a mold (6) and a base plate made of an elastic body such as rubber ( In the same manner as in the above embodiment, pressing is performed using the mold (6). Thereafter, as shown in FIG. 4 (c), the ceramic green sheets (13) pressed are laminated on the three laminated ceramic green sheets (14), and these ceramic green sheets (13) are laminated. The laminated body in which (14) is laminated is compressed and integrated in the laminating direction.

In this manufacturing method, as shown in FIG. 4B, by pressing the laminated ceramic green sheets (13), the convex portions (61) of the mold (6) are laminated to the laminated ceramic green sheets ( 13) penetrates the through hole (15) of the ceramic green sheet (13) and protrudes from the surface facing the base plate (65), and its tip bites into the base plate (65), and in this state the ceramic green sheet ( The compression of 13) is completed.
Therefore, even if the projecting height of the convex part (61) of the mold (6) does not exactly match the thickness of the laminated ceramic green sheet (13), the ceramic green sheet (13) is surely secured. It can be compressed. Therefore, the dimensional accuracy of the mold (6) can be set gently. FIG. 4 (a) shows an example in which the opening sizes of the through holes (15) of the four ceramic green sheets (13) are different, but the penetration of the four ceramic green sheets (13) is shown. When all the openings of the holes (15) are equal in size, pressing can be performed in the same manner.

  In the above-described embodiment, the manufacturing method for one package (1) shown in FIG. 1 has been described. Actually, however, through holes (15) are formed at a plurality of locations on the ceramic green sheet (13) as shown in FIG. ), And a plurality of packages (1) are produced simultaneously using a mold (6) in which convex portions (61) protrude from a plurality of locations of the base portion (60).

In this manufacturing method, after the press work similar to the above embodiment, that is, as shown in FIG. 5, the convex portion (61) of the die (6) is press-fitted into the through hole (15) of the ceramic green sheet (13). After the caulking, the laminated body in which the ceramic green sheets (13) and the ceramic green sheets (14) are laminated is baked to collect a plurality of package parts (70) as shown in FIG. 7) is obtained. Then, the collective substrate (7) is cut along the two-dot chain line in the figure for each package part (70) to obtain a plurality of packages (1). When the collective substrate (7) is cut for each package part (70), a V-shaped groove is provided at the boundary between the package part (70) of the collective substrate (7) and a method of cutting using the dicer. Any method of breaking along the V-shaped groove may be used. In this manufacturing method, since a plurality of packages (1) are manufactured at the same time, mass productivity is improved.

  In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim. For example, the shape of the cavity (10) of the package (1) shown in FIG. 1 can be arbitrarily changed by changing the shape of the convex part (61) of the mold (6) shown in FIGS. it can.

Further, the number of ceramic green sheets (13) to be the frame portion (12) is not limited to four, and in the embodiment shown in FIG. 3, the ceramic green sheets (13) may be one thick sheet. Good. Similarly, in any of the embodiments shown in FIGS. 2 to 5, the number of ceramic green sheets serving as the base portion is not limited to three, and may be one thick.

Further, by forming a metal film (50) on the inner peripheral surface of the through hole (15) only in a part of the ceramic green sheets (13) among the plurality of ceramic green sheets (13), it is shown in FIG. The reflective layer (5) can be formed only on a part of the inner peripheral surfaces (51a) (51b) of the frame body portion (12). Further, it is possible to adopt a configuration in which the reflection layer (5) is omitted and light is reflected by the inner peripheral surfaces (51a) and (51b) of the package (1).

It is a perspective view of the light emitting device using the package obtained by the manufacturing method of this invention. It is sectional drawing which shows the manufacturing process of a package. It is sectional drawing which shows the other manufacturing process of a package. It is sectional drawing which shows another manufacturing process of a package. It is sectional drawing which shows the whole structure of FIG. It is a perspective view of the collective substrate formed by assembling package parts. It is sectional drawing of the conventional light-emitting device. It is sectional drawing which shows the manufacturing process of the conventional package. It is sectional drawing which shows the manufacturing process of the other conventional package.

Explanation of symbols

(1) Package
(10) Cavity
(11) Base part
(12) Frame part
(13) Ceramic green sheet
(14) Ceramic green sheet
(15) Through hole
(2) Light emitting element
(5) Reflective layer
(50) Metal film
(51) Inner peripheral surface
(6) Mold
(60) Base
(61) Convex
(62) Side
(63) Bottom
(64) Base plate
(65) Base plate
(7) Assembly board
(70) Package part

Claims (5)

The base body part (11) and the frame body part (12) made of an insulating material are laminated, and the frame body part (12) penetrates in the stacking direction of the base body part (11) and the frame body part (12). A cavity (10) for accommodating an electronic component is formed, and at least a part of the inner peripheral surface (51) of the frame body portion (12) surrounding the cavity (10) has the cavity (10) In the method for manufacturing an electronic component package in which a slope inclined with respect to the stacking direction is formed so as to expand from the base portion (11) side toward the opening side of the frame body portion (12),
First step of preparing one or a plurality of ceramic green sheets (13) to be the frame portion (12) and preparing one or a plurality of ceramic green sheets (14) to be the base portion (11) A second step of laminating a plurality of ceramic green sheets (13) and (14) obtained in the first step and compressing them in the laminating direction, and firing the laminate obtained in the second step A third step,
In the first step, through holes (15) in which the cavities (10) are to be formed are opened as one or a plurality of ceramic green sheets (13) to be the frame portion (12). Prepare multiple ceramic green sheets,
The second step includes a base portion (60) having a flat press surface and a convex portion (61) protruding from the press surface of the base portion (60), and the convex portion (61) includes a convex portion (61). A side surface (62) having an inclination angle with respect to the projecting direction of the metal mold (6), and the inclination angle of the side surface (62) corresponds to the inclination angle of the inclined surface of the frame body portion (12) ; Using the base plate (65) made of an elastic body , the ceramic green sheet (13) is attached to the mold (6) on one or a plurality of ceramic green sheets (13) to be the frame body portion (12 ). protrusions (61) are caused to press-fit the convex portion of the mold (6) into the through-hole (15) of the ceramic green sheet (13) together with the nipping by the flat pressing surface and the base plate (65) of After pressing the base plate (65) into the base plate (65), the ceramic green sheet (13) serving as the frame portion (12) is replaced with one or more ceramic green sheets serving as the base portion (11). Sea The method of manufacturing an electronic component package, which comprises compressing the stacking direction with (14).   The plurality of through holes (15) provided in the plurality of ceramic green sheets (13) serving as the frame body portion (12) are on the side of the one or more ceramic green sheets (14) serving as the base body portion (11). The manufacturing method of the package for electronic components of Claim 1 with which the magnitude | size of opening is expanding sequentially from the stacking direction. In the first step, a metal is formed on the inner peripheral surface of the through hole (15) of at least one ceramic green sheet (13) among one or a plurality of ceramic green sheets (13) to be the frame portion (12). The manufacturing method of the package for electronic components of Claim 1 or Claim 2 which forms a film | membrane (50). In the first step, as one or a plurality of ceramic green sheets (13) to be the frame portion (12), one or a plurality of ceramic green sheets each having through holes (15) opened at a plurality of locations are obtained. Make and
In the second step, one or a plurality of ceramic green sheets (13) to be a frame body portion (12) are formed using a mold (6) in which the convex portions (61) are provided in a plurality of locations. Pressing is performed to press-fit the convex portions (61) of the mold (6) into the through holes (15) of the ceramic green sheet (13), and the resulting laminate is subjected to the third step. The manufacturing method of the package for electronic components in any one of Claim 1 thru | or 3 which obtains the aggregate substrate (7) which a plurality of package parts (70) aggregate by performing baking. A process of cutting the collective substrate (7) obtained through the third step for each package part (70) is performed to obtain a plurality of packages (1) each having a cavity (10). The manufacturing method of the package for electronic components of Claim 4 which has a process.

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