CN108269743A - Step-like aluminium nitride ceramics block preparation method and step-like aluminium nitride ceramics block - Google Patents
Step-like aluminium nitride ceramics block preparation method and step-like aluminium nitride ceramics block Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 141
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 229910017083 AlN Inorganic materials 0.000 title 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 title 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 63
- 239000000047 product Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 10
- 239000011265 semifinished product Substances 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 239000010931 gold Substances 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000001465 metallisation Methods 0.000 claims abstract description 4
- 238000000227 grinding Methods 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000004512 die casting Methods 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 239000005416 organic matter Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 10
- 238000009713 electroplating Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
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Abstract
本发明提供了一种台阶状氮化铝陶瓷块制备方法，属于半导体封装技术领域领域，包括以下步骤：将氮化铝粉体制作为陶瓷块，将所述陶瓷块进行金属化印刷，将金属化印刷后的所述陶瓷块进行烧结，将烧结后的所述陶瓷块外表面的待焊接位置镀镍，取至少两块镀镍的所述陶瓷块，通过焊料将所述陶瓷块焊接为台阶状，将焊接好的台阶状陶瓷块进行电镀镍/金，制成半成品，最后再进行裂片得到成品。本发明还提供了一种台阶状氮化铝陶瓷块，通过上述制备方法制得。
The invention provides a method for preparing a stepped aluminum nitride ceramic block, which belongs to the technical field of semiconductor packaging, and comprises the following steps: using aluminum nitride powder as a ceramic block, performing metallization printing on the ceramic block, and metallizing The printed ceramic block is sintered, and the outer surface of the sintered ceramic block is nickel-plated at the position to be welded, and at least two nickel-plated ceramic blocks are taken, and the ceramic block is welded into a stepped shape by solder. , electroplating nickel/gold on the welded step-shaped ceramic block to make a semi-finished product, and finally split to obtain a finished product. The present invention also provides a stepped aluminum nitride ceramic block, which is prepared by the above preparation method.
Description
技术领域technical field
本发明属于半导体封装技术领域，更具体地说，是涉及一种台阶状氮化铝陶瓷块的制备方法及台阶状氮化铝陶瓷块。The invention belongs to the technical field of semiconductor packaging, and more specifically relates to a preparation method of a stepped aluminum nitride ceramic block and the stepped aluminum nitride ceramic block.
背景技术Background technique
近年来对LED、光通信领域封装要求的不断提高，其封装结构也在朝着小型化、高功率、高密度封装方向发展，同时对封装用陶瓷外形及结构提出更高要求。对于多层台阶状封装用氮化铝陶瓷产品，传统的加工方式直接激光或者机械切割根本无法实现。In recent years, the packaging requirements for LEDs and optical communications have been continuously improved, and their packaging structures are also developing in the direction of miniaturization, high power, and high-density packaging. At the same time, higher requirements are placed on the appearance and structure of packaging ceramics. For aluminum nitride ceramic products for multi-layer stepped packaging, traditional processing methods such as direct laser or mechanical cutting cannot be realized at all.
发明内容Contents of the invention
本发明的目的在于提供一种台阶状氮化铝陶瓷块制备方法及台阶状氮化铝陶瓷块，以解决现有技术中存在的多层台阶状封装用氮化铝陶瓷产品利用传统的加工方式直接激光或机械切割无法实现的技术问题。The object of the present invention is to provide a method for preparing a stepped aluminum nitride ceramic block and a stepped aluminum nitride ceramic block, so as to solve the problem in the prior art that aluminum nitride ceramic products for multilayer stepped packaging use traditional processing methods Technical issues that cannot be achieved by direct laser or mechanical cutting.
为实现上述目的，本发明采用的技术方案是：提供一种台阶状氮化铝陶瓷块制备方法，包括以下步骤：In order to achieve the above object, the technical solution adopted by the present invention is to provide a method for preparing a stepped aluminum nitride ceramic block, comprising the following steps:
将氮化铝粉体制作为陶瓷块，Aluminum nitride powder is used as a ceramic block,
将所述陶瓷块进行金属化印刷，The ceramic block is metallized and printed,
将金属化印刷后的所述陶瓷块进行烧结，Sintering the metallized and printed ceramic block,
将烧结后的所述陶瓷块外表面的待焊接位置镀镍，Nickel-plating the position to be welded on the outer surface of the sintered ceramic block,
取至少两块镀镍的所述陶瓷块，通过焊料将所述陶瓷块焊接为台阶状，Take at least two nickel-plated ceramic blocks, and weld the ceramic blocks into a stepped shape with solder,
将焊接好的台阶状陶瓷块进行电镀镍/金，制成半成品，最后再进行裂片得到成品。The welded stepped ceramic block is electroplated with nickel/gold to make a semi-finished product, and finally split to obtain a finished product.
进一步地，所述将氮化铝粉体制作为陶瓷块的步骤为：Further, the step of using the aluminum nitride powder body as a ceramic block is:
(1)成型：将所述氮化铝粉体制作成所需要形状的坯片，(1) Forming: the aluminum nitride powder is made into a green sheet of the desired shape,
(2)排胶：将成型后的所述坯片中的有机物质排出，(2) Debinding: discharge the organic matter in the formed green sheet,
(3)烧结：将排胶后的坯片烧结成陶瓷，(3) Sintering: Sinter the green sheet after debinding into ceramics,
(4)磨抛：对烧结后的陶瓷进行切割、磨削、研磨和抛光以制作为所需尺寸的陶瓷块。(4) Grinding and polishing: cutting, grinding, grinding and polishing the sintered ceramics to make ceramic blocks of required size.
进一步地，所述成型步骤中，采用压铸成型工艺制作氮化铝坯片。Further, in the forming step, a die-casting forming process is used to produce aluminum nitride blanks.
进一步地，所述将所述陶瓷块进行金属化印刷步骤中，在所述陶瓷块表面进行钨浆丝网印刷。Further, in the step of performing metallization printing on the ceramic block, tungsten paste screen printing is performed on the surface of the ceramic block.
进一步地，取两块镀镍的所述陶瓷块，通过焊料将两块所述陶瓷块焊接为两层台阶状。Further, take two nickel-plated ceramic blocks, and weld the two ceramic blocks into a two-layer stepped shape with solder.
本发明还提供一种根据上述制备方法制得的台阶状氮化铝陶瓷块。The present invention also provides a stepped aluminum nitride ceramic block prepared according to the above preparation method.
本发明提供的台阶状氮化铝陶瓷块制备方法及台阶状氮化铝陶瓷块的有益效果在于：与现有技术相比，本发明制备的台阶状氮化铝陶瓷块的每一层均为陶瓷结构，相比较铁镍合金金属块和陶瓷焊接产品来说，台阶状氮化铝陶瓷块的上下两层或多层的产品膨胀系数和导热率均相同，并且具有高的散热能力，产品稳定性更高。The preparation method of the stepped aluminum nitride ceramic block provided by the present invention and the beneficial effects of the stepped aluminum nitride ceramic block are: compared with the prior art, each layer of the stepped aluminum nitride ceramic block prepared by the present invention is Ceramic structure, compared with iron-nickel alloy metal blocks and ceramic welding products, the product expansion coefficient and thermal conductivity of the upper and lower layers of the stepped aluminum nitride ceramic block are the same, and have high heat dissipation capacity, and the product is stable Sex is higher.
附图说明Description of drawings
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the descriptions of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only of the present invention. For some embodiments, those of ordinary skill in the art can also obtain other drawings based on these drawings without paying creative efforts.
图1为本发明中的台阶状氮化铝陶瓷块制备方法流程图；Fig. 1 is the flow chart of the method for preparing a stepped aluminum nitride ceramic block in the present invention;
图2为本发明中的台阶状氮化铝陶瓷块的结构示意图；Fig. 2 is the structural representation of the stepped aluminum nitride ceramic block in the present invention;
图3为图2的俯视图。FIG. 3 is a top view of FIG. 2 .
其中，图中各附图标记：Wherein, each reference sign in the figure:
1-上陶瓷层；2-下陶瓷层。1-upper ceramic layer; 2-lower ceramic layer.
具体实施方式Detailed ways
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device Or elements must have a certain orientation, be constructed and operate in a certain orientation, and thus should not be construed as limiting the invention.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”、“若干个”的含义是两个或两个以上，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" and "several" mean two or more, unless otherwise specifically defined.
请参阅图1，现对本发明提供的台阶状氮化铝陶瓷块制备方法进行说明。所述台阶状氮化铝陶瓷块制备方法，包括以下步骤：Referring to FIG. 1 , the preparation method of the step-shaped aluminum nitride ceramic block provided by the present invention is now described. The preparation method of the stepped aluminum nitride ceramic block comprises the following steps:
将氮化铝粉体制作为陶瓷块，Aluminum nitride powder is used as a ceramic block,
将所述陶瓷块进行金属化印刷，The ceramic block is metallized and printed,
将金属化印刷后的所述陶瓷块进行烧结，Sintering the metallized and printed ceramic block,
将烧结后的所述陶瓷块外表面的待焊接位置镀镍，Nickel-plating the position to be welded on the outer surface of the sintered ceramic block,
取至少两块镀镍的所述陶瓷块，通过焊料将所述陶瓷块焊接为台阶状，Take at least two nickel-plated ceramic blocks, and weld the ceramic blocks into a stepped shape with solder,
将焊接好的台阶状陶瓷块进行电镀镍/金，制成半成品，最后再进行裂片得到成品。The welded stepped ceramic block is electroplated with nickel/gold to make a semi-finished product, and finally split to obtain a finished product.
本发明提供的台阶状氮化铝陶瓷块制备方法，与现有技术相比，本发明制备的台阶状氮化铝陶瓷块的每一层均为陶瓷结构，相比较铁镍合金金属块和陶瓷焊接产品来说，台阶状氮化铝陶瓷块的上下两层或多层的产品膨胀系数和导热率均相同，并且具有高的散热能力，产品稳定性更高。The preparation method of the stepped aluminum nitride ceramic block provided by the present invention, compared with the prior art, each layer of the stepped aluminum nitride ceramic block prepared by the present invention is a ceramic structure, compared with iron-nickel alloy metal block and ceramic For welding products, the product expansion coefficient and thermal conductivity of the upper and lower two or more layers of the stepped aluminum nitride ceramic block are the same, and it has high heat dissipation capacity and higher product stability.
进一步地，请参阅图1，作为本发明提供的台阶状氮化铝陶瓷块制备方法的一种具体实施方式，所述将氮化铝粉体制作为陶瓷块的步骤为：Further, please refer to Figure 1, as a specific implementation of the method for preparing a stepped aluminum nitride ceramic block provided by the present invention, the steps of using aluminum nitride powder as a ceramic block are:
(1)成型：将所述氮化铝粉体制作成所需要形状的坯片，(1) Forming: the aluminum nitride powder is made into a green sheet of the desired shape,
(2)排胶：将成型后的所述坯片中的有机物质排出，(2) Debinding: discharge the organic matter in the formed green sheet,
(3)烧结：将排胶后的坯片烧结成陶瓷，(3) Sintering: Sinter the green sheet after debinding into ceramics,
(4)磨抛：对烧结后的陶瓷进行切割、磨削、研磨和抛光以制作为所需尺寸的陶瓷块。(4) Grinding and polishing: cutting, grinding, grinding and polishing the sintered ceramics to make ceramic blocks of required size.
进一步地，请参阅图1，作为本发明提供的台阶状氮化铝陶瓷块制备方法的一种具体实施方式，所述成型步骤中，采用压铸成型工艺制作氮化铝坯片。Further, please refer to FIG. 1 , as a specific implementation of the method for preparing a stepped aluminum nitride ceramic block provided by the present invention, in the forming step, a die-casting process is used to produce an aluminum nitride blank.
进一步地，请参阅图1，作为本发明提供的台阶状氮化铝陶瓷块制备方法的一种具体实施方式，所述将所述陶瓷块进行金属化印刷步骤中，在所述陶瓷块表面进行钨浆丝网印刷。Further, please refer to Fig. 1, as a specific embodiment of the method for preparing a stepped aluminum nitride ceramic block provided by the present invention, in the step of metallizing and printing the ceramic block, the surface of the ceramic block is Tungsten paste screen printing.
进一步地，请参阅图2和图3，作为本发明提供的台阶状氮化铝陶瓷块制备方法的一种具体实施方式，取两块镀镍的所述陶瓷块，通过焊料将两块所述陶瓷块焊接为两层台阶状。Further, please refer to Fig. 2 and Fig. 3, as a specific implementation of the preparation method of the step-shaped aluminum nitride ceramic block provided by the present invention, two nickel-plated ceramic blocks are taken, and the two blocks are soldered together. The ceramic block is welded into a two-layer stepped shape.
请参阅图2和图3，本发明还提供了一种通过上述台阶状氮化铝陶瓷块制备方法制得的台阶状氮化铝陶瓷块，该台阶状氮化铝陶瓷块包括焊接在一起的上陶瓷层1和下陶瓷层2。Referring to Fig. 2 and Fig. 3, the present invention also provides a stepped aluminum nitride ceramic block prepared by the above step-shaped aluminum nitride ceramic block preparation method, the stepped aluminum nitride ceramic block includes welding together Upper ceramic layer 1 and lower ceramic layer 2.
在本发明中，台阶状氮化铝陶瓷块不限于只有两层氮化铝陶瓷块焊接构成，还可以由多层氮化铝陶瓷块焊接构成。In the present invention, the stepped aluminum nitride ceramic block is not limited to only two layers of aluminum nitride ceramic blocks welded, and may also be formed by welding multiple layers of aluminum nitride ceramic blocks.
台阶状氮化铝陶瓷结构为多层陶瓷焊接构成，多层陶瓷均采用压铸成型工艺制作氮化铝生瓷片，生瓷片进行排胶，烧结工艺，通过研磨机对陶瓷片进行加工至图纸尺寸，陶瓷表面进行钨浆丝网印刷，并烧结金属化，电镀镍后，多层陶瓷通过电镀金属层用焊料进行焊接，焊接好的陶瓷块进行电镀镍/金，制成半成品，最后再进行裂片得到成品。上述的裂片是指使用裂片机对半成品进行裂片操作，将半成品制作为成品。对于特殊产品要求，需要增加辅助步骤。The stepped aluminum nitride ceramic structure is composed of multi-layer ceramic welding. The multi-layer ceramics are all made of aluminum nitride green ceramic sheets by die-casting molding process. The green ceramic sheets are deglued and sintered. Dimensions, the ceramic surface is screen printed with tungsten paste, and sintered to metallize. After electroplating nickel, the multilayer ceramics are welded with solder through the electroplated metal layer, and the welded ceramic block is electroplated with nickel/gold to make a semi-finished product, and finally The lobes get the finished product. The above split refers to the use of a splitter to split the semi-finished product and make the semi-finished product into a finished product. Additional steps may be required for special product requirements.
氮化铝陶瓷金属化印刷主要指在氮化铝陶瓷表面制作厚膜等金属线条电路以满足功率模块封装电气互联、绝缘、信号传输等要求，形成氮化铝陶瓷封装基板产品。Aluminum nitride ceramic metallization printing mainly refers to the production of thick film and other metal line circuits on the surface of aluminum nitride ceramics to meet the requirements of power module packaging electrical interconnection, insulation, signal transmission, etc., to form aluminum nitride ceramic packaging substrate products.
磨抛工艺指的是使用研磨机、切割机对陶瓷材料经过坯料切割、磨削、研磨和抛光等工序制成所需尺寸的零件。The grinding and polishing process refers to the use of grinders and cutters to cut, grind, grind and polish ceramic materials to make parts of the required size.
排胶工艺指的是氮化铝成型的坯片中含有较多的有机物质，这些物质必须在氮化铝烧结之前排出，排除充分后才能进入烧结阶段，否则将导致氮化铝陶瓷烧结困难。The debinding process refers to the fact that the green sheet formed by aluminum nitride contains more organic substances. These substances must be discharged before aluminum nitride sintering, and the sintering stage can only be entered after the removal is sufficient, otherwise it will cause difficulty in sintering aluminum nitride ceramics.
氮化铝具有高热导率、良好的绝缘性能和力学性能、无毒、耐高温和耐化学腐蚀等特性，是目前最理想的绝缘散热材料，广泛应用于大规模集成电路、半导体模块电路及大功率器件等高技术领域，如高功率IGBT模块、高亮度LED、功率激光器以及光通信器件。Aluminum nitride has the characteristics of high thermal conductivity, good insulation and mechanical properties, non-toxic, high temperature resistance and chemical corrosion resistance. It is currently the most ideal insulation and heat dissipation material. It is widely used in large-scale integrated circuits, semiconductor module circuits and large-scale High-tech fields such as power devices, such as high-power IGBT modules, high-brightness LEDs, power lasers, and optical communication devices.
台阶状氮化铝陶瓷块克服了传统机械加工业无法加工的难题，相对于铁镍合金金属块和陶瓷焊接产品，台阶状氮化铝陶瓷块产品具有以下显著优势：The stepped aluminum nitride ceramic block overcomes the difficulties that cannot be processed in the traditional mechanical processing industry. Compared with the iron-nickel alloy metal block and ceramic welding products, the stepped aluminum nitride ceramic block product has the following significant advantages:
1)陶瓷块的每一层均为陶瓷结构，相对于铁镍合金金属块和陶瓷焊接产品来说，台阶状陶瓷块具有每层产品线膨胀系数、导热率相同，具有高的散热能力，产品稳定性更高；1) Each layer of the ceramic block is a ceramic structure. Compared with the iron-nickel alloy metal block and ceramic welding products, the stepped ceramic block has the same linear expansion coefficient and thermal conductivity of each layer of the product, and has a high heat dissipation capacity. The product Higher stability;
2)陶瓷块的每层均采用氮化铝材料，经过焊接制备而成，焊接强度满足使用要求，因此均具有氮化铝陶瓷较高的机械强度，易加工；2) Each layer of the ceramic block is made of aluminum nitride material, prepared by welding, and the welding strength meets the requirements of use, so it has high mechanical strength of aluminum nitride ceramics and is easy to process;
3)陶瓷块采阵列加工工艺，焊接完毕，电镀后再进行裂片，有效提高了生产效率。3) The ceramic block adopts an array processing technology. After welding, it is split after electroplating, which effectively improves the production efficiency.
相对于一体型陶瓷产品来说，台阶状陶瓷块焊接产品具有以下显著优势：Compared with integral ceramic products, stepped ceramic block welding products have the following significant advantages:
1)陶瓷块的每层均为陶瓷结构，相对于一体型陶瓷产品来说，台阶状陶瓷块状具有省料的优点，一体成型陶瓷结构，腔体部分为废料区，而焊接产品可以节省陶瓷用量，满足使用要求条件下，批量生产更经济节约；1) Each layer of the ceramic block is a ceramic structure. Compared with the integrated ceramic product, the stepped ceramic block has the advantage of saving materials. The integrally formed ceramic structure, the cavity part is a waste area, and the welded product can save ceramics. The dosage is more economical and economical in mass production under the condition of meeting the requirements of use;
2)陶瓷块的每层均为陶瓷结构，相对于一体型陶瓷产品来说，台阶状陶瓷块状具有易成型的优势，灵活多变，改变底层陶瓷上金属线区域，通过焊接方式，即可实现不同位置陶瓷焊接；2) Each layer of the ceramic block is a ceramic structure. Compared with integrated ceramic products, the stepped ceramic block has the advantage of being easy to form, flexible and changeable, changing the metal wire area on the bottom ceramic, and welding. Realize ceramic welding in different positions;
3)陶瓷块每层均为陶瓷结构，相对于一体型陶瓷产品来说，台阶状陶瓷块状可以多层累加焊接，传统一体腔型陶瓷产品工艺角度加工难度较大。3) Each layer of the ceramic block is a ceramic structure. Compared with the one-piece ceramic product, the stepped ceramic block can be multi-layered and welded. The traditional one-piece cavity ceramic product is more difficult to process.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.
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