JP2004055985A - Ceramic package and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic package which is easy to be manufactured, makes narrow the width of a recessed groove having a conductor pattern is capable of high-density wiring, improves the dimension accuracy of the recessed groove and does not cause position deviation, and is capable of lateral conduction. <P>SOLUTION: A conductor pattern having a traverse cross section in the form of a semi-long circle is formed on the side wall of a ceramic substrate specifying a cavity to package electronic components, and the conductor pattern is configured so as to connect wiring patterns provided on the surface and/or inside of the ceramic substrate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a ceramic package, and more particularly, to a ceramic package for mounting an electronic component such as a semiconductor element. The present invention also relates to an electronic device using such a ceramic package.
[0002]
[Prior art]
As is well known, there are various types of semiconductor devices, and some semiconductor devices are configured by mounting a semiconductor chip on a ceramic package. The ceramic package is usually manufactured by laminating a predetermined number of green sheets, firing and integrating them. In general, a ceramic package has a hollow structure (cavity) at the center thereof so that a semiconductor chip can be mounted. The ceramic package has a hollow structure, which is effective in preventing the breakage of the bonding wire, and is not only excellent in moisture resistance and heat dissipation, but also by increasing the number of stacked green sheets to improve the wiring pattern. Since the number can be increased, a high-density package can be realized. The structure of the ceramic package includes, for example, a side blaze, a bottom blaze, a chip carrier, and a pin grid array (PGA).
[0003]
FIG. 7 shows a leadless chip carrier disclosed in JP-A-62-89345 as an example of a ceramic package. FIG. 7A is a plan view of the leadless chip carrier, and FIG. 7B is a cross-sectional view taken along line BB of FIG. 7A.
[0004]
The illustrated leadless chip carrier 40 includes a ceramic substrate 41 having a semiconductor element mounting portion (cavity) 44, an internal conduction portion (middle step portion) 42, and an external conduction portion 43. The ceramic substrate 41 can be formed by forming a ceramic green sheet, that is, a plurality of unfired ceramic sheets into a required shape, and then stacking and firing. In a predetermined region of the ceramic substrate 41, gold plating or the like is applied after firing on a metallized layer formed in advance in order to establish electrical conduction. Further, as shown in FIG. 8A, the external conducting portion 43 attached to the peripheral wall of the carrier 40 forms a concave groove having a semicircular cross section by cutting as shown in FIG. As described above, it can be formed by sequentially applying the metallized layer 45 and the gold plating layer 46. Also, instead of forming the concave groove by cutting, a ceramic substrate is formed with a margin around it, and a through-hole having a circular cross section is formed instead of the concave groove, and the substrate is formed through the through-hole. A leadless chip carrier having the same structure can be manufactured by cutting with a diamond cutter or the like on a line connecting the center points of the above. In the ceramic package having such a structure, since the external conducting portion is provided on the side wall of the substrate, in addition to the above-described effects (prevention of disconnection, improvement of moisture resistance and heat dissipation, high-density wiring), simplification of the wiring structure. The same effect can also be obtained.
[0005]
However, as described above, the method of forming the concave groove by cutting or other mechanical processing involves a complicated manufacturing process, and defects such as burrs are likely to occur during processing. Further, in such a machining method or a method in which a through hole is formed and then cut in half to form a concave groove, the size of the obtained concave groove is limited, and the width of the concave groove is usually about 400 to 500 μm. Therefore, only a groove having a groove can be formed, and the demand for high-density wiring cannot be sufficiently satisfied. Further, in the conventional method, the positional deviation of the concave groove is apt to occur, and there is a problem that it is not possible to secure conduction between the conductor pattern and the wiring pattern on the side surface of the concave groove.
[0006]
Further, when a conventional ceramic package is used for a high-frequency circuit, a concave groove itself cannot be formed when wiring becomes dense. This is because a ground effect cannot be obtained by arranging the ground layers on both sides of the signal layer.
[0007]
[Problems to be solved by the invention]
An object of the present invention is to solve the problems of the conventional techniques as described above, and to provide a ceramic package capable of side conduction, which is easy to manufacture, and the width of the groove provided with the conductor pattern is small, It is an object of the present invention to provide a ceramic package which enables high-density wiring and has high dimensional accuracy of the concave groove and does not cause positional deviation.
[0008]
Another object of the present invention is to provide an electronic device that is excellent in moisture resistance and heat dissipation and that can be mounted at high density.
[0009]
These and other objects of the present invention will be readily understood from the following detailed description.
[0010]
[Means for Solving the Problems]
According to one aspect of the present invention, there is provided a ceramic package including a ceramic substrate having a cavity for mounting electronic components at a substantially central portion,
On the side wall of the ceramic substrate defining the cavity, a conductor pattern having a semi-elliptical cross section is formed by vertically notching and penetrating the side wall, and
The ceramic package is characterized in that the conductor pattern connects wiring patterns provided on the surface and / or inside of the ceramic substrate.
[0011]
According to another aspect of the present invention, there is provided an electronic device including a ceramic package including a ceramic substrate having a cavity in a substantially central portion, and an electronic component mounted in the cavity. ,
On the side wall of the ceramic substrate defining the cavity, a conductor pattern having a semi-elliptical cross section is formed by vertically notching and penetrating the side wall, and
The electronic device is characterized in that the conductor pattern connects wiring patterns provided on the surface and / or inside of the ceramic substrate.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
The ceramic package and the electronic device according to the present invention can each be advantageously implemented in various forms. The embodiments of the present invention specifically described below therefore do not limit the scope of the present invention.
[0013]
FIG. 1 is a sectional view showing a preferred embodiment of a ceramic package according to the present invention. The ceramic package 10 includes a ceramic substrate 1 having a rectangular opening (cavity) 4 for mounting an electronic component (here, an LSI chip) 5 at a substantially central position. The ceramic substrate 1 has a first ceramic substrate (hereinafter, also referred to as a “substrate body”) 11 and a second ceramic substrate (hereinafter, also referred to as a “frame”) 12 in order to provide a staircase structure on a side wall thereof. Consists of These ceramic substrates can be preferably formed integrally from a plurality of green sheets through lamination and firing. For example, the ceramic substrate 1 can be easily manufactured by laminating and firing one frame body 12 on one substrate body 11. Although not shown here, as described with reference to FIG. 2, the surface of the ceramic substrate 1 includes a wiring pattern (for example, a signal layer, a ground layer, and a power supply layer) including the surface of the step portion. Is formed, and a conductive pattern for side conduction is buried in the side wall of the ceramic substrate 1. In the illustrated example, one step structure is provided on the side wall of the ceramic substrate 1. However, two or more step structures may be provided according to a desired wiring pattern. It may be omitted.
[0014]
The ceramic substrate can be arbitrarily manufactured from various ceramic materials. Suitable ceramic materials include, but are not limited to, alumina (aluminum oxide), aluminum nitride, glass ceramic, and the like. The ceramic substrate can be advantageously manufactured by manufacturing green sheets from a slurry containing these ceramic material powders, then forming and processing a plurality of green sheets into a predetermined shape, and then laminating and firing. This manufacturing method will be described in detail below.
[0015]
The metal plate 7 is joined to the back surface of the ceramic substrate 1 (substrate body 11). The metal plate 7 closes the bottom surface of the opening 4 to define a cavity, defines an element mounting surface, and also functions as a heat sink. The metal plate 7 is usually made of a metal material plate having excellent heat radiation characteristics, for example, a plate made of copper, aluminum or an alloy thereof. The joining of the metal plate 7 to the substrate body 11 is usually performed by brazing. Therefore, a metallized layer (metallized pattern) is formed on the bottom surface of the substrate main body 11 from, for example, tungsten in a brazing region, and a metal plating layer is further formed on the metallized layer from nickel, gold, or the like. is there. For brazing the metal plate 7, for example, silver brazing or the like can be used. In the illustrated example, the element mounting cavity 4 is formed by the metal plate 7, but if necessary, the substrate main body 11 is formed of a plate material having no opening, and the central portion thereof has a rectangular shape serving as the cavity 4 or a part thereof. May be formed.
[0016]
The ceramic package 10 as described above is usually used by being mounted on a motherboard, a printed circuit board, or the like. The connection with the outside at the time of mounting can use a technique generally used in this technical field. For example, a lead pin can be provided upright as an external connection terminal by using the exposed region 11b on the back surface of the substrate body 11. According to another method, a ball bump may be provided as an external connection terminal, or a lead may be extended in parallel with the back surface of the ceramic substrate 11.
[0017]
The ceramic package according to the present invention can provide an electronic device by mounting an electronic component in a cavity formed substantially at the center of the ceramic substrate. Here, the “electronic device” is used in a broad sense, and means various electronic devices in which one or more electronic components are mounted in a predetermined region of a ceramic package, for example, a semiconductor device. The “electronic component” includes various components including an IC chip, an LSI chip, a semiconductor element such as a CCD (Charge Coupled Device) chip, a chip capacitor, a diode such as an LD (Laser Diode), a PD (Photodiode), and the like. means.
[0018]
For example, when manufacturing a semiconductor device using the ceramic package 10 of FIG. 1, the LSI chip 5 is mounted on the surface of the metal plate 7 that defines the bottom surface of the cavity 4 of the package 10. The chip 5 can be adhered and fixed to the metal plate 7 with, for example, a brazing material, an adhesive, or the like. If necessary, a stage for mounting a chip (for example, a molybdenum plate) may be provided on the metal plate 7. The electrode terminals of the chip 5 are connected to the conductor patterns of the ceramic substrate 1 via the bonding wires 6. After mounting the chip 5, although not shown, the entire cavity 4 may be sealed with an insulating resin such as an epoxy resin. Finally, the upper surface of the ceramic package 10 is sealed with a cap (not shown), and the semiconductor device is completed. For the cap, for example, a Kovar (KОVAR) plate or the like can be used, and for joining the cap to the package, a brazing material, for example, a brazing material such as Ni—Sn can be used.
[0019]
The ceramic package of the present invention is characterized in that a semi-elliptical conductor pattern is formed on the side wall of the ceramic substrate for side conduction. This conductor pattern can be typically formed as schematically shown in FIG. That is, on the side wall of the ceramic substrate 1 that defines the cavity 4 of the ceramic package 10, the conductor pattern 3 having a semi-elliptical cross section is formed by notching and penetrating the side wall in the vertical direction. The conductor pattern 3 can connect the wiring patterns provided on the surface of the ceramic substrate 1 and the inside thereof, and therefore, the side conduction of the ceramic package 10 can be ensured.
[0020]
In the case of the ceramic package 10 of FIG. 2, the first conductor pattern 31 is embedded in the side wall (this defines the outer periphery of the cavity) of the first ceramic substrate (substrate body) 11 having a square opening at the center. On the surface, there is a wiring pattern 2 composed of a signal line 22 and ground layers 21 formed on both sides thereof. The first conductor pattern 31 has a semi-elliptical cross section as shown in FIG. On the first ceramic substrate 11, a second ceramic substrate 12 having a square opening in the center similarly is integrally mounted. The second ceramic substrate 12 is used as a frame, a second conductor pattern 32 is embedded in a side wall thereof, and a ground layer 21 is formed on a surface thereof. The second conductor pattern 32 has a semi-elliptical cross section similarly to the first conductor pattern 31. Further, although not shown, the wiring pattern 2 is also formed inside the ceramic substrate 1. Although the illustrated conductor pattern has a semi-elliptical cross-section, if a comparable effect can be obtained, the conductor pattern may be formed to have an elongated rectangular cross-section. Good.
[0021]
In each of the ceramic substrates, the conductive pattern can be formed in various sizes. The height h of the conductor pattern is the same as the thickness of the ceramic substrate in which the pattern is embedded, and can be arbitrarily changed according to the substrate thickness. The width w of the conductor pattern is not particularly limited, and may be in a range of about 400 to 500 μm generally used for the purpose of side conduction, but is preferably about 100 μm or less. And more preferably about 50 μm or less. The lower limit of the width w of the conductor pattern is usually about 30 μm in consideration of the processing capability of the current technology. According to the present invention, even when such a narrow width is applied to the conductor pattern, side conduction can be ensured without defects such as positional deviation, and a slight positional deviation is achieved by adopting a semi-oval cross section. This is because the side conduction does not adversely affect even if there is any. Further, the depth d of the conductor pattern is not particularly limited, but is usually in a range of about 50 to 200 μm. It is not necessary to set the depth of the conductor pattern to a particularly large value, as long as side conduction is ensured.
[0022]
The conductor pattern having a semi-elliptical cross section can be preferably formed as shown in FIG. After a through hole having an oval cross section is formed in the conductor pattern forming portion of the green sheet 1, the conductor pattern forming material 3 is filled as shown in FIG. For the formation of the through-hole, a conventional perforating means, for example, punching or punching can be used. Examples of suitable perforation means include, for example, punching with a punch, laser processing, and the like. As the conductive pattern forming material, various conductive materials can be used according to the manufacturing conditions of the ceramic package and the like, but a conductive paste is preferable. Useful conductor pastes include conductor pastes containing high melting point metals, such as, for example, molybdenum paste and tungsten paste. After the filling of the conductive paste is completed, the green sheet 1 is cut along a punching line c passing through a substantially middle position of the conductive filling through hole 3 in order to form a conductive pattern for side conduction with the cavity. For this cutting process, for example, punching with a punch is advantageous. As a result, as shown in FIG. 4B, a conductor pattern 3 having a semi-elliptical cross section embedded in the green sheet 1 at a predetermined depth is obtained.
[0023]
The wiring pattern can be formed inside or on the surface of the ceramic substrate using a conventional technique. A preferred method of forming the wiring pattern is, for example, a method of forming a metallized layer on the surface of the green sheet using a conductive metal material during the production of the ceramic substrate. Suitable conductive metals are, for example, tungsten, molybdenum, and the like. Although the thickness of the metallized layer can be changed in a wide range, it is usually in the range of about 5 to 30 μm. The metallized layer may further have a metal plating layer thereon as required. The metal plating layer can be formed using a conventional electrolytic plating method or an electroless plating method after firing the green sheet. Suitable plating metals are, for example, nickel, gold and the like. Although the thickness of the metal plating layer can be changed in a wide range, it is usually in the range of about 1.5 to 5 μm in the case of Ni plating, and about 0.3 to 2 μm of Au plating to be applied thereon. is there.
[0024]
A ceramic substrate having a cavity for mounting electronic components at a substantially central portion is provided, and a side wall of the ceramic substrate defining the cavity has a semi-elliptical cross-section that is notched and penetrated in the vertical direction. The ceramic package according to the present invention in which the conductive pattern is formed can be manufactured by various methods. It is recommended to use a method based on lamination of green sheets, although a method based on pressing of ceramic powder may be used if necessary. This is because the layout of the wiring pattern can be freely changed, and the conductor pattern can be formed easily and with high precision.
[0025]
The method for manufacturing a ceramic package of the present invention based on lamination of green sheets usually includes a series of steps as follows.
(1) Production and molding of green sheets
(2) Formation of through holes and filling of conductors
(3) Formation of metallization layer for wiring pattern
(4) Cavity processing
(5) Green sheet lamination
(6) Individual cutting
(7) firing
Preferably, the ceramic package of the present invention comprises the following steps:
From the ceramic raw material, to produce a green sheet of the number and thickness necessary to form the ceramic substrate by lamination,
Forming each of the green sheets into a shape necessary to form the ceramic substrate,
Forming a through hole having an oblong cross section at the position where the conductor pattern of the green sheet is formed,
Filling the through hole with a material (conductor) for forming the conductor pattern,
On the surface of the green sheet, a metallization layer for a wiring pattern is formed according to a predetermined wiring design,
Punching the green sheet along a punching line passing through a substantially central position of the through hole of the conductor filling, and processing an opening forming the cavity at a substantially central portion of the green sheet;
The green sheets are laminated in a predetermined order to form a laminated sheet in which the openings and the through holes of the conductor filling are respectively communicated,
Cutting the laminate sheet along a predetermined cutting line to cut out pieces of the ceramic package precursor; and
Firing the individual pieces of the ceramic package at a predetermined temperature and integrating them;
Can be produced. In the above steps, the processing order may be changed as necessary, or additional processing steps may be added. After the ceramic package is manufactured as described above, as a finishing process, a metal pattern is applied to a wiring pattern or the like exposed on the surface, an external connection terminal is attached to the back surface of the substrate, or a metal plate ( It is common to attach a heat sink.
[0026]
Further, it is advantageous that the manufacturing method is implemented based on a multi-cavity method. This is because a large number of ceramic packages can be manufactured collectively from one laminated green sheet. Further, external connection terminals can be formed or a heat sink can be attached to the ceramic package obtained by the cutting step according to a conventional method.
[0027]
More specifically, the ceramic package of the present invention can be advantageously manufactured in a method as shown in FIGS. When the ceramic substrate is composed of a substrate main body and a frame as shown in FIGS. 1 and 2, it is advantageous to produce each member in a separate step and to integrate them by lamination as shown in FIG. is there.
Preparation and molding of green sheet:
From the ceramic raw material, green sheets having a number and a thickness necessary for forming a ceramic substrate by lamination are produced. For example, a green sheet is produced by molding a ceramic slurry prepared by mixing a raw material ceramic powder (for example, alumina powder in the case of an alumina substrate), a plasticizer, a solvent, and the like. For example, the slurry is formed into a sheet by a doctor blade method. The thickness of the green sheet can vary widely depending on the desired details of the ceramic package and the manufacturing conditions, but is usually in the range of about 0.2 to 0.5 mm.
[0028]
After the production of the long green sheet, it is cut into a size necessary for forming the ceramic substrate. The shape is usually square or rectangular. In the case where a ceramic package is manufactured in a multi-piece manner, the size is set so that a required number of packages (pieces) can be finally cut.
Formation of through holes:
In each green sheet, a through hole necessary for providing a via hole and a conductor pattern in a finally obtained ceramic package is formed. For example, a through hole having a diameter commensurate with the via hole is formed at the via hole formation site. Although it is an essential step in the present invention, as shown in FIG. 6A, a through hole 13 having an elliptical cross section is formed in a predetermined size in a portion of the green sheet 1 where a conductor pattern is formed. Form with. The through hole can be formed by, for example, laser processing.
Filling through holes:
As shown in FIG. 6B, the through holes of the green sheet 1 are filled with a conductor pattern forming material (conductor) 3. As the conductor, for example, a paste containing a metal having a high melting point such as tungsten or molybdenum can be advantageously used because of ease of filling.
Formation of metallization layer for wiring pattern:
The ceramic package usually has a wiring pattern (a signal layer, a ground layer, a power supply layer, and the like) on its surface and inside. Preferably, these wiring patterns can be advantageously formed by printing a metallized layer (also referred to as an internal metallized layer) in a pattern at the stage of a green sheet. The pattern of the wiring pattern metallization layer is determined according to a predetermined wiring layout. Examples of the metallized metal include tungsten and molybdenum. FIG. 6C shows a state where the wiring pattern 2 is formed on the conductor pattern 3.
Cavity processing:
After filling the through-hole with the conductor and forming the metallized layer as described above, a rectangular opening for a cavity is formed substantially in the center of the green sheet. Various methods can be used for machining the cavity. For example, punching using a punch or the like is convenient.
[0029]
Since this cavity is processed along a punching line passing through the middle of the through hole for filling the conductor, the conductor pattern 3 having a semi-elliptical cross section as shown in FIG. Is formed.
[0030]
The above processing steps have been described assuming the manufacture of the main body of the ceramic substrate. According to this processing step, the frame of the substrate can be similarly manufactured. However, in the production of the frame, the step of punching an opening for the cavity during the production is omitted, and the opening is also formed at the same time when the frame is cut into individual pieces after metallization to improve the handleability. be able to.
Green sheet lamination:
After forming cavities, via holes, conductor patterns, wiring patterns, and the like in each green sheet, a required number of green sheets are laminated in a predetermined order and integrated by pressure. In laminating the green sheets, it is necessary to pay attention so that the conductor pattern, the wiring pattern and the like do not shift between the sheets. In the present invention, since the conductor pattern is formed in a semi-elliptical cross section, even a slight displacement does not adversely affect the electrical connection.
Cutting of laminated sheet (outer shape processing):
The laminated sheets manufactured as described above are individually cut along predetermined cutting lines. The obtained individual piece can be said to be a precursor of the target ceramic package. If necessary, profile each piece.
Baking of the package precursor:
The individual pieces obtained by cutting are put together in a firing furnace, fired at a predetermined temperature and integrated. The firing temperature varies depending on the type of ceramic and the like, but is usually a high temperature of about 1500 to 1600 ° C. As a result of the baking, the resin component contained in the package precursor is removed by thermal decomposition, and the conductive paste in the through-hole is metallized.
Adhesion of metal plate (heat sink):
It is preferable to attach a metal plate, for example, a copper plate, to the back surface of the package precursor by brazing for the purpose of heat radiation or the like.
Formation of metal plating layer:
After the above steps are completed, a metal plating layer is applied to the wiring pattern (surface metallization layer) exposed on the surface of the package precursor, if necessary. Applicable metal plating layers include, for example, a nickel plating layer and a gold plating layer. Through this plating layer, for example, connection with a semiconductor chip can be established. Thus, the ceramic package described above with reference to FIGS. 1 and 2 is completed.
[0031]
Further, external connection terminals may be provided on the back surface of the ceramic package. For example, when a plurality of leads are erected as external connection terminals, the lead frame can be brazed after nickel plating.
[0032]
【The invention's effect】
As described in detail above, according to the present invention, a ceramic package capable of conducting on the side surface is easy to manufacture, the width of the groove having the conductor pattern is small, and high-density wiring is possible. In addition, it is possible to provide a ceramic package which has high dimensional accuracy of the concave groove and does not show positional deviation.
[0033]
In fact, when this ceramic package is used, even if the wiring pattern is dense in the high-frequency transmission device, the ground layers can be reliably arranged on both sides of the signal line, and a satisfactory shielding effect can be obtained. Further, since the ground layers are all exposed on the surface of the ceramic substrate, the wiring layout can be realized without waste.
[0034]
Further, according to the present invention, it is possible to easily manufacture the concave groove of the ceramic package capable of conducting on the side surface with high dimensional accuracy and without positional deviation. In addition, the width of the concave groove can be reduced to 100 μm or less from the limit of about 400 to 500 μm in the conventional method, which can contribute to high density.
[0035]
Further, according to the present invention, it is possible to provide a semiconductor device and other electronic devices that are excellent in moisture resistance and heat dissipation and that can be mounted at a high density by utilizing the advantages of the ceramic package.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a preferred embodiment of a ceramic package according to the present invention.
FIG. 2 is an enlarged perspective view showing a part of the ceramic package shown in FIG. 1;
FIG. 3 is an enlarged perspective view showing a conductor pattern portion of the ceramic package shown in FIG. 2;
FIG. 4 is a plan view schematically showing a method of forming the conductor pattern shown in FIG.
FIG. 5 is a flow sheet showing a preferred method of manufacturing the ceramic package shown in FIG. 1;
FIG. 6 is a plan view sequentially showing a method of forming the conductor pattern shown in FIG. 4;
FIG. 7 is a plan view and a sectional view schematically showing an example of a conventional leadless chip carrier.
FIG. 8 is a plan view schematically showing a method of forming an external conduction portion in the leadless chip carrier shown in FIG.
[Explanation of symbols]
1. Ceramic substrate
2. Wiring pattern
3. Conductor pattern
4. Cavity
5. Semiconductor chip
6. Bonding wire
7 ... metal plate
10. Ceramic package
13 ... Through-hole

Claims (10)

A ceramic package including a ceramic substrate having a cavity for mounting electronic components at a substantially central portion,
On the side wall of the ceramic substrate defining the cavity, a conductor pattern having a semi-elliptical cross section is formed by notching and penetrating the side wall in a vertical direction, and the conductor pattern is formed on the surface of the ceramic substrate. And / or interconnecting wiring patterns provided inside the ceramic package. The ceramic substrate is formed by molding a plurality of green sheets into a predetermined shape, laminating and firing, and the conductor pattern has an oblong cross section during the formation of the ceramic substrate. 2. The ceramic package according to claim 1, wherein the ceramic package is formed by cutting a through hole filled with a conductor at a substantially intermediate position. 3. The ceramic package according to claim 1, wherein a side wall of the ceramic substrate that defines the cavity has a stepped structure, and the conductor pattern is formed on a side surface of each stepped portion. 4. The ceramic package according to any one of claims 1 to 3, wherein the conductive pattern is made of a conductive paste. The ceramic package according to any one of claims 1 to 4, wherein the width of the conductor pattern is 100 µm or less. The ceramic package according to claim 1, wherein a bottom surface of the cavity is defined by a metal plate bonded to a back surface of the ceramic substrate. The ceramic package according to any one of claims 1 to 6, wherein the ceramic package is manufactured collectively by a multi-cavity method. The ceramic package according to any one of claims 1 to 7, wherein the electronic component is a semiconductor element. An electronic device comprising: a ceramic package including a ceramic substrate having a cavity in a substantially central portion; and an electronic component mounted in the cavity.
On the side wall of the ceramic substrate defining the cavity, a conductor pattern having a semi-elliptical cross section is formed by notching and penetrating the side wall in a vertical direction, and the conductor pattern is formed on the surface of the ceramic substrate. And / or interconnecting wiring patterns provided inside the electronic device. The electronic device according to claim 9, wherein the electronic component is a semiconductor element.

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