JP4733061B2 - Plural wiring base, wiring base and electronic device, and division method of multiple wiring base - Google Patents

Description

  The present invention relates to a plurality of wiring bases in which a plurality of wiring bases on which electronic components are attached to a mounting base, a wiring base obtained by dividing the plurality of wiring bases, and the wiring base The present invention relates to an electronic device having electronic components mounted thereon and a method of dividing a plurality of wiring bases.

  2. Description of the Related Art Conventionally, wiring boards (electronic component storage packages) for mounting electronic components such as semiconductor elements and crystal resonators are made of tungsten on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metal powder metallization such as molybdenum.

  An electronic component is mounted on the upper surface of the wiring board, and after each electrode of the electronic component is electrically connected to the wiring conductor via an electrical connection means such as solder or a bonding wire, the electronic component Is covered with a lid made of metal or ceramics or potting resin and sealed to produce an electronic device.

  By the way, with the recent demand for downsizing of electronic devices, such wiring boards have become extremely small with a size of several mm square or less. In order to facilitate the handling of such a small-sized wiring board and to improve the efficiency of manufacturing the wiring board and the electronic device using the wiring board, a large number of wiring boards serving as the wiring board are used. The circuit board is manufactured in the form of a so-called multiple wiring board in which the region is arranged vertically and horizontally at the center of a large-area mother board.

  Such a multi-layer wiring board has, for example, a plurality of wiring board regions each having wiring conductors arranged vertically and horizontally at the center of a substantially square plate-like mother board, and at least one of the mother boards. Divided grooves that divide each wiring board region are formed vertically and horizontally on this surface. Then, before or after the electronic components are mounted on each wiring board area, the mother board is bent along the dividing grooves and divided into wiring board areas, so that a large number of wiring boards and electronic devices can be obtained. Are manufactured simultaneously and intensively.

  Such a multi-wiring board is prepared by, for example, preparing a ceramic green sheet for a mother board, printing a metallized paste for a wiring conductor on the ceramic green sheet, and, if necessary, a plurality of ceramic green sheets. After the sheets are laminated, a cut for a dividing groove is made on at least one surface by a cutting blade such as a cutter blade or a mold, and the sheet is fired at a high temperature.

JP 2006-128363 A

  However, due to variations in shrinkage when firing the ceramic green sheet for the mother board and rattling of the side face of the wiring board when the mother board is divided along the dividing grooves, the outer dimensions of the wiring board and the electronic components Variations may occur in positional accuracy between the mounting portion and the outer side of the wiring board. In the conventional technology, in the process of mounting the electronic component on the mounting portion, the electronic component is positioned based on the distance from the side surface with respect to the side surface of the wiring board. Therefore, if variations occur in the outer dimensions of the wiring board and the positional accuracy between the mounting portion and the outer side of the wiring substrate, the electronic component cannot be mounted at the intended position of the mounting portion with high accuracy. In the case of using a wiring board formed from such a plurality of wiring boards as a wiring board for mounting an image pickup device, the external dimensions of the wiring board and mounting of the image pickup device with the recent increase in the number of pixels of the image pickup device, etc. There has been a remarkable demand for high accuracy in the positional accuracy between the portion and the outer side of the wiring board, and it has become difficult to satisfy these requirements.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to have excellent external dimensions of the wiring base and positional accuracy between the outer side of the wiring base and the mounting portion. It is an object of the present invention to provide a multiple wiring base, a wiring base obtained by dividing the multiple wiring base, a method of dividing the multiple wiring base, and an electronic device.

  The multiple wiring base of the present invention is divided into a lattice shape when viewed from one side in the thickness direction, and a dividing groove is formed on the surface portion along the lattice, and penetrates in the thickness direction in each divided lattice region. A wiring board in which a through hole is formed, a support part that is individually inserted into the through hole formed in each lattice region and supported by the wiring board, and from the support part, in the thickness direction of the wiring board An extension part extending along the one surface with a space therebetween, and a mounting base to which an electronic component can be attached to the support part, wherein the extension part is a thickness of the wiring board When viewed from one of the directions, the end portion protrudes into an adjacent region.

  Preferably, at one surface portion in the thickness direction of the wiring board, an end of the extending portion of the mounting base supported by being inserted through the through holes formed in the lattice region is in the thickness direction of the wiring board. A concave portion is formed in a portion overlapping with the dividing groove when viewed from one side.

  Preferably, the dividing groove is formed on one surface portion in the thickness direction of the wiring board and extends closer to the other surface of the wiring board than the concave portion.

  Preferably, the mounting base is attached to an inner peripheral surface facing the through hole of the wiring board and supported by the wiring board.

  The wiring base of the present invention is obtained by dividing the multiple wiring wiring base of the present invention for each lattice region.

  An electronic device of the present invention includes the wiring base of the present invention and an electronic component mounted on a support portion of the wiring base.

  The method for dividing a multi-piece wiring base of the present invention is a method of dividing the multi-piece wiring base for each grid region with a fulcrum on the other surface in the thickness direction of the multi-piece wiring base of the present invention. It is characterized by doing.

  The multiple wiring wiring base of the present invention includes a wiring board that is divided into a lattice shape when viewed from one side in the thickness direction, and a plurality of mounting bases that are arranged for each lattice region. Divided grooves are formed along the lattice on the surface portion of the wiring board, and through holes are formed through each of the divided lattice regions in the thickness direction. Each mounting base is individually inserted into a through-hole formed in each lattice region and supported by the wiring board, and this supporting part is spaced from this supporting part on one surface in the thickness direction of the wiring board. An extending portion extending along one surface, and an electronic component can be attached to the support portion. As viewed from one side of the wiring board in the thickness direction, the extending portion of each mounting base has an end protruding in an adjacent lattice region. Since the extension part of the mounting base is separated from one surface of the wiring board, the plurality of wiring bases are arranged along the dividing grooves even though the end part of the extension part protrudes to the adjacent region. When dividing, it can be divided by suppressing the possibility that the extension part of the mounting base touches the wiring board and deforms or is chipped, and a wiring base excellent in the shape of the mounting base can be formed. it can.

  Since the end of the extending portion of the mounting base protrudes into an adjacent region when viewed from one side in the thickness direction of the wiring board, the end of the extending portion can be used as the outer side of the wiring base. Even if there is variation in the shape of the divided wiring board, or the side surface of the divided wiring board is wobbled, and there is variation in the dimensions of the divided wiring board, the end of the extended portion Since this is the outer side of the wiring base, variations in the dimensions of the wiring board do not affect the dimensions of the wiring base. The electronic component is mounted on a support portion of the mount, and this support portion functions as a mounting portion. Since the extension portion is formed to extend from the support portion, even if there is a variation in the size of the wiring substrate that is temporarily divided as described above, the variation in the size of the wiring substrate is caused by the outer edge of the wiring base and the electronic component. Does not affect the positioning accuracy with the mounting part. As a result, it is possible to obtain a wiring base having excellent positional accuracy between the outer dimensions of the wiring base and the outer side of the wiring base and the mounting portion of the electronic component.

  Preferably, at one surface portion in the thickness direction of the wiring board, the end of the extending portion of the mounting base that is inserted and supported by the through-hole formed in the lattice region is from one side in the thickness direction of the wiring board. A concave portion is formed in a portion overlapping the dividing groove as viewed. Since the end of the extended portion protrudes into an adjacent region when viewed from one side in the thickness direction of the wiring board, the end of the extended portion is Although there is a possibility of approaching the wiring board in the adjacent area, since the recess is formed in the wiring board around the end of the extension part of the mounting base, the end part of the extension part of the mounting base is It is in a state that it is more easily separated from one surface, and when dividing a multi-piece wiring base along the dividing groove, the extension part of the mounting base may contact the wiring board and be deformed or chipped Can be divided more effectively.

  In addition, since the recess is formed in the wiring board around the end of the extension of the mounting base, the end of the extension of the mounting base is bent when handling multiple wiring bases. Even so, it is possible to reduce the possibility that the extending portion of the mounting base contacts the wiring board and is deformed or chipped.

  By these, the wiring base excellent in the shape of the mounting base can be formed. Therefore, the support part of the mounting base of the wiring base is used as a mounting part for electronic components, and the end of the extending part of the mounting base protruding from the outer side of the wiring board is used as the outer side of the wiring base. Therefore, it is possible to provide a wiring base excellent in the positional accuracy between the outer dimensions of the wiring base and the outer side of the wiring base and the electronic component mounting portion.

  Preferably, the dividing groove is formed on one surface portion in the thickness direction of the wiring board and extends closer to the other surface of the wiring board than the concave portion, so that the plurality of wiring bases are divided. At that time, since the stress is not applied to the corners of the recesses, the wiring substrate can be divided well, and the wiring substrate can be prevented from being chipped or enlarged in the peripheral region of the recesses. it can. As a result, it is possible to reduce the possibility that the outer side of the wiring board protrudes from the end of the extension part of the mounting base, and to make the wiring base excellent in reliability with the chipping of the wiring board suppressed. Can do.

  Preferably, the mounting base is attached to the inner peripheral surface facing the through hole of the wiring board and supported by the wiring board, so that the mounting base is supported by the wiring board in a region separated from the extending portion of the mounting base. By separating the part to be supported from the mounting base and the extending part in this way, the possibility that the extending part is deformed due to the stress of the joint part or the like is reduced, and the extending part is accurately determined in a predetermined manner. It can be arranged at a position, and the external dimensions and height dimensions of an electronic device on which a wiring base and electronic components are mounted can be made highly accurate.

  Since the wiring base of the present invention is obtained by dividing the multi-piece wiring base of the present invention into each lattice region, the above-described configuration is excellent in the shape of the mounting base, and the external dimensions and wiring of the wiring base. The positional accuracy between the outer side of the base and the mounting part of the electronic component is excellent.

  Since the electronic device of the present invention includes the wiring base of the present invention and the electronic components mounted on the support portion of the wiring base, the mounting device is excellent in the shape of the mounting base, the external dimensions of the wiring base and the wiring base. Since the wiring base having excellent positional accuracy between the outer periphery of the electronic component and the mounting part of the electronic component is used, the electronic device is excellent in reliability.

  The method for dividing a multi-piece wiring base of the present invention is to divide a multi-piece wiring base for each grid region with the lattice on the other surface in the thickness direction of the multi-pitch wiring base of the present invention as a fulcrum. Therefore, when dividing, it can be divided while suppressing the possibility that the mounting base comes into contact with the wiring board. Therefore, deformation and chipping of the mounting base can be suppressed, and the wiring base having an excellent mounting base shape can be suppressed. It can be a stand.

  Hereinafter, an embodiment of a multiple wiring base 11 according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a bottom view showing a multiple wiring base 11 according to an embodiment of the present invention. FIG. 2 is a plan view of the multiple wiring base 11. FIG. 3 is a cross-sectional view of the multiple wiring base 11 viewed from the section line AA of FIG. FIG. 4 is a cross-sectional view of the multiple wiring base 11 viewed from the section line BB in FIG. In these drawings, 1 is a wiring board, 2 is a mounting base, 3 is a through hole, 4 is a lattice region, 5 is a dividing groove, 6 is a support portion, 7 is an extension portion, and 8 is a wiring conductor.

  The multiple wiring base 11 of the present invention is divided into a lattice shape when viewed from one side in the thickness direction Z (hereinafter sometimes referred to as a plan view), and the dividing groove 5 is formed on the surface portion along the lattice. The wiring board 1 in which the through-holes 3 penetrating in the thickness direction Z are formed in each divided grid region 4 and the through-holes 3 formed in the respective grid regions 4 are individually inserted and supported by the wiring board 1 Along this one surface (one main surface 1a) at an interval from the support portion 6 and the support portion 6 to one surface of the wiring board 1 in the thickness direction Z (hereinafter, sometimes referred to as one main surface 1a). And a support 2 to which an electronic component can be attached to the support portion. The extension portion 7 is an adjacent lattice as viewed from one side in the thickness direction Z of the wiring board 1. An end 7 a protrudes from the region 4.

The wiring board 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body, for example, an aluminum oxide sintered body. For example, alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), and other raw material powders are mixed with a suitable organic solvent and solvent to obtain a mud-like shape. A ceramic green sheet (ceramic green sheet) is obtained by forming a sheet using a well-known doctor blade method or calender roll method, etc. Next, the ceramic green sheet is appropriately punched, and if necessary It is manufactured by laminating a plurality of sheets and firing them at a high temperature (about 1500 to 1800 ° C.).

  A plurality of lattice regions 4 are arranged vertically and horizontally at the center of the wiring board 1. Each lattice region 4 is formed with a through hole 3 through which a mounting base 2 to be described later is inserted, a dividing groove 5 for dividing the wiring board 1 into each lattice region 4, and a wiring conductor 8.

  Such through-holes 3 are formed on the ceramic green sheet for the wiring substrate 1 by forming the through-holes for the through-holes 3 by a die or punching method by punching or a processing method such as laser processing. 4 predetermined regions. In the case where the wiring substrate 1 is composed of a plurality of layers, such through holes 3 are formed by forming through holes for the through holes 3 by punching or the like in each ceramic green sheet, and then laminating these ceramic green sheets. Alternatively, after stacking a plurality of ceramic green sheets, these ceramic green sheets may be simultaneously punched out by a punching method or the like to form a through hole for the through hole 3.

  Further, the shape of the through-hole 3 may be formed in a shape such as a polygonal shape such as a square shape, a shape having an arc shape such as a perfect circle shape or an oval shape, etc. in plan view. Other shapes may be used. Further, for example, as shown in FIG. 3, the through hole 3 near the other surface (hereinafter sometimes referred to as the other main surface 1b) in the thickness direction Z of the wiring board 1 is more than the through hole 3 near the one main surface 1a. A shape having one or a plurality of steps so as to retreat inside, or a shape inclined so that the inner peripheral surface 3a of the wiring board 1 facing the through hole 3 approaches from the one main surface 1a to the other main surface 1b. The size of the opening of the one main surface 1a may be different from the size of the opening of the other main surface 1b. Also, the shape of the opening on one main surface 1a and the shape of the opening on one main surface 1b and the shape of the opening on the other main surface 1b are such that the shape of the opening on the other main surface 1b is a quadrangle. The shape may be different. By forming the through hole 3 having such a shape, the mounting base 2 formed so as to be fitted into the through hole 3 can be easily and accurately attached to the intended position.

  The dividing groove 5 is formed along the outer edge of each lattice region 4 on at least one main surface 1a of the one main surface 1a and the other main surface 1b of the wiring board 1. The dividing groove 5 acts to easily and accurately perform the bending when the wiring substrate 1 is bent to form a plurality of wiring bases to be described later. Further, the dividing groove 5 is formed so that both ends thereof are separated from the outer periphery of the wiring board 1 as necessary. The width of the opening of the dividing groove 5 formed on the surface portion of the wiring board 1 is about 0.05 to 1 mm, and the depth is about 0.05 to 2 mm. 2, 3, and 4, the planned dividing line 5 a when the wiring board 1 is divided along the dividing groove 5 is indicated by a two-dot chain line.

  In addition, such a division | segmentation groove | channel 5 presses the cutter blade and metal mold | die which have a V-shaped cross-sectional edge to the ceramic green sheet for wiring boards 1, and makes the cut, and is made the ceramic green for wiring boards 1. It is formed in a lattice shape on the main surface of the sheet. In addition, when the wiring board 1 is produced by laminating a plurality of ceramic green sheets, the cut is made after producing a laminate in which a plurality of ceramic green sheets are laminated. A plurality of wiring boards can be bent by dividing the plurality of wiring bases 11 along the dividing grooves 5 before or after mounting electronic components on each grid region 4 of the plurality of wiring bases 11. And a plurality of wiring bases are formed together with a mounting base 2 to be described later.

  The wiring conductor 8 functions as a conductive path for electrically connecting an electronic component to an external electric circuit board, is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and is a ceramic green for the wiring board 1. A metallized paste for the wiring conductor 8 is printed on the sheet by printing means such as a screen printing method, and fired together with the ceramic green sheet for the wiring substrate 1 to be deposited on the upper and lower surfaces of each region. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as necessary to a main component metal powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing.

  Further, the wiring conductors 8 formed on the upper surface and the lower surface are electrically connected by a through conductor 12 that penetrates the wiring substrate 1 in the thickness direction Z. Such a through conductor 12 is formed by punching a ceramic green sheet for the wiring board 1 by a die or punching method or by a processing method such as laser processing prior to printing and application of a metallized paste for forming the wiring conductor 8. A through hole for 12 is formed, and a metallized paste for the through conductor 12 is filled in the through hole for the through conductor 12 by a printing means such as a screen printing method, and this is combined with a ceramic green sheet for the wiring board 1 Formed in each region by firing. The metallized paste for the through conductor 12 is prepared in the same manner as the metallized paste for the wiring conductor 8, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  Further, if a portion of the wiring conductor 8 exposed on the outer surface of the wiring substrate 1 is coated with a metal having excellent corrosion resistance such as nickel (Ni) or gold (Au), the wiring conductor 8 is oxidized and corroded. In addition, the wiring conductor 8 and the electronic component can be effectively bonded, and the wiring conductor 8 can be electrically connected to the Au wire, the solder bump, and the like, and the wiring conductor 8 can be firmly bonded to the external circuit board. can do. Therefore, in the portion where the wiring conductor 8 is exposed on the outer surface of the wiring substrate 1, a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are formed by an electroplating method or a method. It is sequentially deposited by electrolytic plating.

  The mounting base 2 includes a support portion 6 that is inserted and supported through the through-holes 3 formed in each lattice region 4, and an extension portion 7 that extends from the support portion 6 along one surface (one main surface 1a). And. And the surface of the support part 6 which protrudes from the other main surface 1b of the wiring board 1 can be used as the mounting part 2a on which the electronic component is mounted. Such a mounting base 2 is made of a metal material such as Cu, Cu-W, Al, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a ceramic material of a silicon carbide sintered body, or the like. Can be used. The mounting base 2 is preferably attached to the inner peripheral surface 3a facing the through hole 3 of the wiring board 1 and supported by the wiring board 1. In the present embodiment, the support portion 6 of the mounting base 2 is the wiring board. It is attached to the inner peripheral surface 3 a facing the one through hole 3 and supported by the wiring board 1.

  The mounting base 2 is attached to and supported by the wiring board 1 with resin, glass, brazing material, etc. for each lattice region 4. When the mounting base 2 is supported on the wiring substrate 1 by a brazing material such as a silver-copper brazing material, a metal metallization layer (not shown) for bonding is formed in a predetermined region of each lattice region 4 of the wiring substrate 1. The metal metallized layer for bonding and the mounting base 2 can be bonded and attached with a brazing material. The metal metallized layer for bonding can be formed in a predetermined region of each lattice region 4 of the wiring board 1 by using the same material and printing method as those of the wiring conductor 8 described above.

  Further, when the mounting base 2 is made of a metal material or the like, if the metal having excellent corrosion resistance such as nickel (Ni) or gold (Au) is also deposited on the outer surface of the mounting base 2, the mounting base 2 can be effectively prevented from oxidative corrosion. Accordingly, a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the outer surface of the mounting base 2 by an electrolytic plating method or an electroless plating method. ing. In addition, in order to strengthen the joint between the mounting base 2 and the electronic component and the joint between the mounting base 2 and the wiring board 1 at the mounting part 2a on which the electronic component is mounted and the part to be joined to the wiring board 1. If necessary, a plating layer as described above may be applied.

  In addition, the shape of the support portion 6 of the mounting base 2 may be formed in a shape such as a polygonal shape such as a quadrangle shape or a shape having an arc shape such as a perfect circle shape or an oval shape in plan view. Also, other shapes than those described above may be used. Further, for example, as shown in FIG. 3, the support portion 6 near the other main surface 1 b has a shape having one or a plurality of steps so as to retreat inside the support portion 6 near the one main surface 1 a, As the shape in which the side surface of the support portion 6 is inclined so as to approach the other main surface 1b from the one main surface 1a, the size of the shape on the one main surface 1a side and the shape of the other main surface 1b are made different. May be. In addition, the shape on the one main surface 1a side in the plan view of the support portion 6 is a circular shape, and the shape on the other main surface 1b side is a quadrangular shape. The shape may be different. Preferably, the support portion 6 has a shape along the inner peripheral surface 3a of the wiring board 1 facing the through hole 3 in a state where the mounting base 2 is inserted into the through hole 3 and attached to the wiring board 1. The inner peripheral surface 3 a is formed smaller than the thickness of the adhesive layer 13 between the support portion 6 and the wiring substrate 1. As described above, if the support portion 6 has a shape along the inner peripheral surface 3a of the wiring substrate 1 facing the through hole 3 and fits into the through hole 3 such as a step, for example, as described above. By fitting the support portion 6 into the through hole 3 from the one main surface 1a side, the mounting base 2 can be easily and accurately attached to the intended position. In addition, it does not need to be attached on the entire inner peripheral surface 3a of the through hole 3. For example, when both the mounting base 2 and the through hole 3 have a stepped shape, the mounting base 2 may be attached to the wiring board 1 at this stepped portion.

  Further, in the case where a metal metallization layer for bonding is provided on the wiring board 1, in order to strengthen the bonding between the metallization layer for bonding and the mounting base 2, the metallization layer outside the bonding metallization layer is provided. A metal such as nickel (Ni) is deposited on the surface.

  The mounting base 2 is one or more extending along the one surface (one main surface 1a) at an interval from the support portion 6 to one surface (one main surface 1a) in the thickness direction Z of the wiring board 1. The extending portion 7 is provided. The mounting base 2 in the present embodiment has two extending portions 7b and 7c extending from one end portion in the extending direction of the support portion 6. The extending portion 7 of the mounting base 2 is seen from one side in the thickness direction Z of the wiring board 1, the end portion 7 a protrudes in an adjacent region, and the end portion 7 a from the lattice region 4 where each mounting base 2 is disposed. Is protruding. Specifically, the mounting base 2 includes a first extending portion 7b extending in one of the row directions X of the two directions in which the respective lattice regions 4 are arranged (hereinafter referred to as the row direction X and the column direction Y, respectively). And a second extending portion 7c extending in the other direction of the row direction X. Further, the first extending portion 7b is disposed on one side in the column direction Y, and the second extending portion 7c is disposed on the other side in the row direction X. Thus, the extension part 7 and the extension part of the mount 2 provided in the adjacent grid | lattice area | region 4 by making arrangement | positioning of the row direction X of the 1st extension part 7b and the 2nd extension part 7c different. 7 can be prevented from overlapping. As shown in FIG. 3, the end portions 7a of the extending portions 7 of the mounting base 2 of the lattice region 4 arranged on the outermost periphery are arranged vertically and horizontally in accordance with the extending direction of the extending portions 7 and the like. The wiring board 1 protrudes to a peripheral area (hereinafter referred to as a dummy area 10) of the wiring board 1 outside the lattice area 4. The dummy area 10 is formed as a non-product part in the outer peripheral area of the lattice area 4 and can be used as an area for facilitating the manufacture and transportation of the multiple wiring base 11. It can be used for positioning and fixing when the wiring base 11 is processed or transported. Moreover, if necessary, a through hole for forming a plating conduction pattern for depositing a plating layer on the wiring conductor 8 and a wiring conductor 8 for connecting to an external circuit board on the side surface of the wiring base is formed. It is also done.

  In the method for dividing the multi-piece wiring base 11 in the present embodiment, the multi-piece wiring base 11 is arranged with the lattice on the other surface (the other main surface 1b) in the thickness direction Z of the multi-piece wiring base 11 as a fulcrum. 11 is bent to divide the wiring base 11 for each lattice region 4.

  According to the plurality of wiring bases 11 of the present embodiment described above, since the extending portion 7 of the mounting base 2 is separated from one surface of the wiring board 1, the end portion 7a of the extending portion 7 is used. Although the plurality of wiring bases 11 are divided along the dividing grooves 5, the extending portion 7 of the mounting base 2 contacts the wiring substrate 1 and is deformed even though the plurality of wiring bases 11 are divided along the dividing grooves 5. It is possible to divide the wiring board while suppressing the possibility of being cut or chipped, and it is possible to form a wiring base excellent in the shape of the mounting base 2.

  Since the end 7a of the extending portion 7 of the mounting base 2 protrudes into the adjacent lattice region 4 when viewed from one side in the thickness direction Z of the wiring board 1, the end 7a of the extending portion 7 is connected to the wiring base. Can be outside. Even if a variation occurs in the shape of the wiring substrate 1 or a side surface of the divided wiring substrate 1 causes a variation in the dimensions of the divided wiring substrate 1, the end of the extension 7 Since the portion 7a is the outer side of the wiring base, the variation in the dimensions of the wiring board 1 does not affect the dimensions of the wiring base. The electronic component is mounted on the support portion 6 of the mounting base 2, and this support portion 6 functions as the mounting portion 2a. Since the extension portion 7 is formed to extend from the support portion 6, even if the dimension of the wiring substrate 1 divided as described above varies, the variation in the size of the wiring substrate 1 may be outside the wiring base. The positional accuracy between the side and the electronic component mounting portion 2a is not affected. Accordingly, it is possible to obtain a wiring base excellent in the positional accuracy between the outer dimensions of the wiring base and the outer side of the wiring base and the electronic component mounting portion 2a.

  Further, according to the multiple wiring base 11 of the present embodiment, the mounting base 2 is attached to the inner peripheral surface 3 a facing the through hole 3 of the wiring board 1 and supported by the wiring board 1. It is supported by the wiring board 1 in a region separated from the extending portion 7 of the table 2. In this way, by separating the part to be supported of the mount 2 and the extension part 7, the possibility that the extension part 7 is deformed due to the stress of the joint part or the like is reduced, and the extension part 7. Can be arranged at a predetermined position with high accuracy, and the external dimensions and height dimensions of an electronic device on which a wiring base and electronic components are mounted can be made highly accurate.

  Further, according to the method of dividing the multi-piece wiring base 11 of the present embodiment, a plurality of multi-wiring bases are provided for each grid region 4 with the grid in the thickness direction Z of the multi-piece wiring base 11 as a fulcrum. 11 is divided, the possibility of the mounting base 2 coming into contact with the wiring board 1 can be reduced when it is divided, so that deformation and chipping of the mounting base 2 can be suppressed. It can be set as the wiring base excellent in the shape of 2.

  The extending portion 7 of the multi-piece wiring base 11 of the present embodiment is provided at an interval on the one main surface 1a in the thickness direction Z of the wiring board 1 in all the extended regions. It is not necessary for the extended portion 7 to be spaced from one surface in the thickness direction Z of the wiring board 1 in the entire extended region. In other words, at least in the peripheral region of the region overlapping with the outer edge of the lattice region 4, an interval is provided on one surface in the thickness direction Z of the wiring substrate 1, and the extension portion 7 of the mounting base 2 is attached to the wiring substrate 1 when dividing. What is necessary is just to be able to suppress contacting.

  Moreover, in order to suppress that the extension part 7 of the mounting base 2 contacts the wiring board 1, it is preferable to leave about 0.2 mm. Note that the distance provided between the extending portion 7 and the wiring board 1 may be determined as appropriate depending on the thickness and size of the wiring board 1 and the conditions such as a device that divides the wiring base 11.

  Further, in the multiple wiring base 11 of the present embodiment, the respective lattice regions 4 are provided adjacent to each other. However, the present invention may be applied to the case where dummy regions are provided between the lattice regions 4. In this case, the end portion 7a of the extending portion 7 of the mounting base 2 is projected to the adjacent dummy region. The dummy region formed between the lattice regions 4 is formed as a non-product part, and is formed on a plating conduction pattern for attaching a plating layer to the wiring conductor 8 or on the side surface of the wiring base as necessary. A through hole for forming the wiring conductor 8 for connection to the external circuit board is formed.

  FIG. 5 is a bottom view showing a multiple wiring base 21 according to another embodiment of the present invention. FIG. 6 is a cross-sectional view of the multiple wiring base 21 as viewed from the section line CC in FIG. The multiple wiring base 21 of the present embodiment, in addition to the multiple wiring base 11 of the above-described embodiment, on one surface (one main surface 1a) portion of the wiring board 1 in the thickness direction Z, A recessed portion 9 is formed at a portion where the end portion 7a of the extending portion 7 of the mounting base 2 inserted and supported by the through hole 3 of the adjacent lattice region 4 overlaps when viewed from one side in the thickness direction Z of the wiring board 1. Is done. Since the multiple wiring base 21 of the present embodiment has substantially the same configuration as the multiple wiring wiring base 11 of the above-described embodiment, the corresponding components are denoted by the same reference numerals and overlapped. Description is omitted.

  The recesses 9 are formed on the one main surface 1a of the wiring substrate 1 so as to extend in a square column shape in the column direction Y along the lattice except for both ends in the column direction Y in each lattice region 4. Such recesses 9 are formed by forming through holes for the recesses 9 in some of the ceramic green sheets for the wiring board 1 by a die or punching method by punching or by a processing method such as laser processing. By laminating with the sheet, it is formed in a predetermined region of each lattice region 4.

  Since the end portion 7a of the extending portion 7 protrudes to the adjacent lattice region 4 when viewed from one side in the thickness direction Z of the wiring board 1, when the plurality of wiring bases 21 are bent and divided, There is a possibility that the end portion 7a of the extending portion 7 may approach the wiring substrate 1 in the adjacent lattice region 4, but in this way, the recessed portion 9 is formed in the wiring substrate 1 around the end portion 7a of the extending portion 7 of the mounting base 2. Therefore, the end 7a of the extending portion 7 of the mounting base 2 is more easily separated from one surface of the wiring board 1, and a plurality of wiring bases 21 are formed in the dividing grooves 5. When dividing along, the extension part 7 of the mounting base 2 can be divided while further suppressing the possibility of deformation or chipping due to contact with the wiring board 1.

  Further, since the recess 9 is formed in the wiring board 1 around the end 7a of the extending portion 7 of the mounting base 2, the extended portion of the mounting base 2 is handled when handling the multiple wiring base 21. Even if 7a is bent at the end 7a, the possibility that the extended portion 7 of the mounting base 2 contacts the wiring board 1 and is deformed or chipped can be reduced.

  By these, the wiring base excellent in the shape of the mounting base 2 can be formed. Accordingly, the support portion 6 of the mounting base 2 of the wiring base is used as the electronic component mounting portion 2a, and the end portion 7a of the extending portion 7 of the mounting base 2 protruding from the outer side of the wiring board 1 is used as the wiring base. Therefore, it is possible to provide a wiring base excellent in the external dimension of the wiring base and the positional accuracy between the outer side of the wiring base and the electronic component mounting portion 2a.

  Further, the dividing groove 5 is formed on one surface (one main surface 1a) portion in the thickness direction Z of the wiring board 1 and extends closer to the other surface (the other main surface 1b) of the wiring substrate 1 than the concave portion 9. It is preferable. That is, it is shown that the dividing groove 5 is formed on the main surface of the wiring substrate 1 on the side where the recess 9 is formed, and the depth of the dividing groove 5 is deeper than the depth of the recess 9. For this reason, when the multi-piece wiring base 21 is divided, the stress is not applied to the corners or the like of the concave portion 9, so that the wiring substrate 1 can be divided satisfactorily and the periphery of the concave portion 9. It is possible to prevent the wiring substrate 1 from being chipped or enlarged in the region. As a result, it is possible to reduce the possibility that the outer side of the wiring substrate 1 protrudes from the end portion 7a of the extending portion 7 of the mounting base 2, and to provide a highly reliable wiring in which chipping of the wiring substrate 1 is suppressed. It can be a base.

  Such a dividing groove 5 can be formed by making a notch deeper than the depth of the recess 9 when making a notch for the dividing groove 5 in the ceramic green sheet for the wiring board 1. .

  In the multi-cavity wiring base 21 in the present embodiment, in addition to the dividing groove 5 formed on the one main surface 1a portion of the wiring substrate 1, the dividing groove 22 is also formed on the other main surface 1b portion of the wiring substrate 1. Further formed. The dividing groove 22 formed on the other main surface 1b is formed along the lattice, extends from the other main surface 1b toward the one main surface 1a, and is similar to the dividing groove 5 formed on the one main surface 1a described above. Formed.

  In the multiple wiring wiring base according to yet another embodiment of the present embodiment, the recess 9 may penetrate the wiring board 1. In this case, since the recess 9 penetrates, the dividing groove 5 does not have to be deeper than the depth of the recess 9 as described above. Further, in this case, the end 7a of the extending portion 7 of the mounting base 2 can be confirmed from the other main surface 1b side through the recessed portion 9 penetrating the wiring board 1, so that the image When an electronic component is mounted by recognizing the end 7a of the extending portion 7 of the mounting base 2 with a camera or the like capable of acquiring information, a plurality of wiring bases before being divided for each grid area 4 In this state, an electronic component can be mounted on the mounting portion 2a of the mounting base 2.

  The wiring base according to the present embodiment is obtained by dividing the above-described multiple wiring wiring base into each lattice region 4. As a result, a plurality of wiring bases including the small wiring board divided for each lattice region 4 and the mounting base 2 supported by the small wiring board are formed. From this, according to the above, the shape of the mounting base 2 is excellent, and the external dimensions of the wiring base and the positional accuracy between the outer side of the wiring base and the electronic component mounting portion 2a are excellent.

  The electronic device according to the present embodiment includes any one of the wiring bases according to the above-described embodiments and an electronic component mounted on the supporting part 6 of the wiring base. The electronic component in the present embodiment is mounted on the mounting portion 2a of the wiring base described above. The electronic component is realized by, for example, a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, or various sensors such as an imaging element. In the multiple wiring base, the electronic component may be mounted on the wiring base obtained by dividing the multiple wiring base along the dividing groove 5, and as described above, the recess 9 penetrates. In such a case, a plurality of electronic devices may be formed by mounting a plurality of electronic components on each lattice region 4 of the plurality of wiring bases to form a plurality of electronic devices.

  When the electronic component is a wire bonding type semiconductor element, the electronic component is fixed with a bonding material such as glass, resin, brazing material, etc., and then the electrode of the semiconductor element and the wiring conductor 8 are connected via the bonding wire. Is electrically connected.

  And the electronic component is sealed by covering the electronic component with a sealing resin such as an epoxy resin, or a lid made of resin, metal, ceramics, etc. placed so as to cover the electronic component is made of glass, resin, It is sealed by being attached to the wiring base with an adhesive such as a brazing material.

  When the electronic component is mounted on the wiring base, the end 7a of the extending portion 7 of the wiring base mounting base 2 can be used as a reference for the outer side of the wiring base. In order to use the end portion 7a of the extending portion 7 as a reference, the end portion 7a is brought into contact with a jig of a device for mounting an electronic component, a camera capable of acquiring image information, or the like. The method of reading the position 7a and performing it can be taken. For this reason, the wiring base is excellent in the shape of the mounting base 2 and has excellent positional accuracy between the outer dimensions of the wiring base and the outer side of the wiring base and the mounting part 2a of the electronic component. Electronic components can be accurately mounted, and an electronic device with excellent reliability can be obtained.

  Further, when the electronic device is mounted on the external circuit board, if the lower surface of the mounting base 2 is in contact with the external board circuit, the positional accuracy in the thickness direction Z between the external circuit board and the electronic component is high. As an example, the electronic device can be mounted on an external circuit board. Moreover, when the mounting base 2 is excellent in heat dissipation, when the electronic component is operated, the heat generated from the electronic component can be released to the outside satisfactorily.

  FIG. 7 is a cross-sectional view of a multiple wiring base 31 according to still another embodiment of the present invention. The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, as shown in FIG. 7, the support portion 6 of the mounting base 2 does not protrude from the other main surface 1 b of the wiring board 1, and the electronic component mounting portion 2 a of the support portion 6 is the other main surface of the wiring substrate 1. You may make it locate in the one main surface 1a side rather than 1b.

  FIG. 8 is a cross-sectional view showing a multiple wiring base 41 according to still another embodiment of the present invention. In the multiple wiring wiring base 41 of the present embodiment, the wiring board 1 is arranged at the periphery of each lattice region 4 in the wiring board 1 of the multiple wiring wiring bases 11, 21, 31 of each of the above-described embodiments. A frame 42 extending in one of the thickness directions Z is formed. The electronic component is housed in, for example, a component housing space 43 surrounded by the frame body 42.

  The support 6 of the mount 2 protrudes from the through hole 3 into the component housing space 43 and is supported by the wiring board 1. That is, the mounting portion 2 a is disposed in the component housing space 43. In such a multi-wiring base 41, after the electronic component is mounted on the mounting portion 2a, the component housing space 43 is filled with the sealing resin described above, or the direction in which the frame 42 extends in the lid described above. The electronic component can be sealed by covering the entire surface of the one surface 42a.

It is a bottom view which shows the multiple picking wiring base 11 of one Embodiment of this invention. 3 is a plan view of a multiple wiring base 11. FIG. FIG. 2 is a cross-sectional view of a plurality of wiring bases 11 as viewed from a section line AA in FIG. 1. FIG. 3 is a cross-sectional view of a plurality of wiring bases 11 as seen from a section line BB in FIG. 1. It is a bottom view which shows the multiple picking wiring base 21 of other embodiment of this invention. FIG. 6 is a cross-sectional view of a plurality of wiring bases 21 as seen from a section line CC in FIG. 5. It is sectional drawing of the multiple pick-up wiring base 31 of further another embodiment of this invention. It is sectional drawing which shows the multiple pick-up wiring base 41 of further another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 1a One main surface 1b The other main surface 2 Mounting base 2a Mounting part 3 Through hole 3a Inner peripheral surface which faces a through hole 4 Lattice area | region 5,22 Dividing groove 5a Scheduled dividing line 6 Support part 7 Extension part 7a Extension 7b 1st extension part 7c 2nd extension part 8 wiring conductor 9 recessed part 11,21,31,41 Plurality wiring base 12 penetration conductor 42 frame

Claims (7)

A wiring board that is divided into a lattice shape when viewed from one side in the thickness direction, a dividing groove is formed on the surface portion along the lattice, and a through-hole that penetrates in the thickness direction is formed in each divided lattice region;
A support portion that is individually inserted into the through-holes formed in each lattice region and is supported by the wiring substrate, and the one surface spaced from the support portion in a thickness direction of the wiring substrate. An extending portion extending along the mounting portion, and a mounting base to which an electronic component can be attached to the support portion,
The extending portion has a plurality of wiring bases characterized in that an end portion projects into an adjacent region when viewed from one side in the thickness direction of the wiring board.   At one surface portion in the thickness direction of the wiring board, an end portion of the extending portion of the mounting base that is inserted into and supported by the through holes formed in the lattice region is viewed from one side in the thickness direction of the wiring board. The multi-piece wiring base according to claim 1, wherein a concave portion is formed in a portion overlapping with the dividing groove.   3. The multiple wiring according to claim 2, wherein the dividing groove is formed on one surface portion in the thickness direction of the wiring board and extends closer to the other surface of the wiring board than the concave portion. Base.   The multiple mounting wiring according to claim 1, wherein the mounting base is attached to an inner peripheral surface facing the through hole of the wiring board and supported by the wiring board. Base.   A wiring base obtained by dividing the plurality of wiring bases according to any one of claims 1 to 4 for each lattice region. The wiring base according to claim 5;
And an electronic component mounted on a support portion of the wiring base.   5. The multi-ply wiring base is divided for each grid region with the lattice on the other surface in the thickness direction of the multi-ply wiring base according to claim 1 as a fulcrum. The method of dividing the multiple wiring base.

Images