JP4810268B2 - Superconducting wire connection method and superconducting wire - Google Patents

Description

  The present invention relates to a superconducting wire connecting method and a superconducting wire using the connecting method.

  The superconducting coil can be used for various applications such as a magnetic resonance diagnostic imaging apparatus (MRI) and a superconducting magnetic energy storage apparatus (SMES). When producing a large superconducting coil, a superconducting conductive wire having a length of several kilometers to several tens of kilometers may be required. However, it is often difficult to secure such a length with a single superconducting wire having no connection from the viewpoint of manufacturing the superconducting wire. In particular, in the high-temperature superconducting wire, for example, the currently used Bi2223 silver sheath wire has the longest length of a single-length wire of about 1 km, and the Y-type wire that is the next-generation wire still has a length of 1 km. Has not reached.

Therefore, in producing a superconducting coil, it is necessary to connect the superconducting wires to each other, and the technology for that is important. Here, in the case of a high-temperature superconducting wire, particularly a thin film wire in which a high-temperature superconducting layer is formed on a substrate (base material), the substrate is a high-resistance base material and is called an intermediate layer between the substrate and the high-temperature superconducting layer. Since an oxide layer typified by YSZ (yttrium-stabilized zirconia) or CeO ₂ is formed, when connecting high-temperature superconducting wires to each other, it is necessary to always connect the high-temperature superconducting layer sides, not the substrate side. is there. A part of such a superconducting connection technique has already been disclosed in Patent Document 1.

Further, Patent Document 2 describes a superconducting connection technique in which a new superconducting layer is formed at a connection portion between superconducting wires in order to connect the superconducting wires as low resistance as possible.
JP 2000-133067 A JP 2005-63695 A

  Patent Document 1 shows the existence of an intermediate layer that is a high-resistance material or an insulator between a superconducting layer and a substrate, and in the connection portion, each substrate is not electrically connected. is there. In this case, for example, when a quench or thermal runaway occurs in a coil wound with a superconducting wire, for example, current cannot be shunted to the substrate side. Therefore, particularly in the case of a high-temperature superconducting wire having a high critical current density, it may be necessary to take measures such as arranging a thicker stabilizing metal on the high-temperature superconducting layer side in order to maintain the stability of the coil. It is disadvantageous in terms of cost, coil size and the like to newly arrange another stabilizing metal without using the original constituent material of the high-temperature superconducting wire.

  In addition, the invention described in Patent Document 2 has a problem that the connection process is much more costly and time consuming than the connection method such as soldering because the original object of the invention is a low resistance connection method. Further, since the invention of Patent Document 2 is not intended to connect the substrates positively, it is merely provided with electrical contact at the cross-sectional portion of the substrate of about 100 μm, and is sufficient to shunt current. There is a problem that a large connection area is not secured.

  The present invention has been made to solve such conventional problems, and in the connection between superconducting wires, as well as the superconducting layer of the superconducting wire, the superconducting layer and the base material are electrically connected, and quenching and thermal runaway are performed. Provides a superconducting wire connecting method, a superconducting wire material and a superconducting coil device using the connecting method, which can divert current to the base material when the occurrence occurs, and is more compact and has a predetermined stability. The purpose is to do.

In order to achieve the above object, a superconducting wire connecting method according to an embodiment of the present invention is a superconducting wire formed by sequentially laminating a superconducting layer and a conductive metal layer on one side of a metal substrate via an intermediate layer. It is a connection method, the disposing step of disposing the conductive metal layers of each connection end portion in each of the superconducting wires to be connected to face each other, and each of the connection end portions so as to cover each end face A stacking step of stacking a connection plate made of a conductive metal in close contact with the superconducting wire from one metal base material to the other conductive metal layer of the superconducting wire, the superconducting wires and the superconducting members A connection step of connecting the wire and the connection plate .

In order to achieve the above object, a superconducting wire connecting method according to another embodiment of the present invention is formed by sequentially laminating a superconducting layer and a conductive metal layer on one surface of a metal substrate via an intermediate layer. A superconducting wire connecting method, an arrangement step of connecting end faces of connecting end portions of the superconducting wire to be connected, and a conductive metal layer of each superconducting wire so as to cover the connecting end portions, A first stacking step of stacking superconducting wires different from the respective superconducting wires such that the surfaces of the respective conductive metal layers face each other; and on the other surface of the metal base of each of the superconducting wires And a second stacking step in which the connection plates made of the first conductive metal are stacked so as to face each other, and at least one end of the superconducting wire to be connected or at least one position in the longitudinal direction of the superconducting wire. The gold of the conductive metal layer and the another superconducting wire A contact step of contacting the base material with a connection plate made of a second conductive metal, each of the superconducting wires and the other superconducting wire, each of the superconducting wires and the first connection plate, and the second connection; A connection step of connecting the plate, the superconducting wire, and the other superconducting wire, respectively .

  According to the present invention, since the superconducting layer and the substrate are also electrically connected, when quenching or thermal runaway occurs, a current can be shunted to the substrate side, and the superconducting wire having a predetermined stability Connection can be provided.

EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated based on drawing. FIG. 1 is a cross-sectional view showing a superconducting wire connection structure according to a first embodiment of the present invention.
The superconducting wire 1 is formed by sequentially laminating a superconducting layer 4 and a conductive metal layer 5 on one side of a metal base 2 via an intermediate layer 3.

The metal substrate 2 can be appropriately determined depending on the type, material, thickness, etc. of the superconducting wire 1 to be used. Specifically, various metal materials such as silver, platinum, stainless steel, copper, Ni—W alloy, Ni—Fe alloy, and nickel-based alloys such as Hastelloy can be used, and nickel-based alloys are preferable. The metal substrate 2 is usually plate-shaped and its thickness can be determined according to the application, but is usually about 50 to 100 μm. The metal substrate 2 is usually a high resistance layer.
When the superconducting layer 4 is abnormal, for example, a current flowing in the superconducting layer 4 when an abnormality occurs in the superconducting layer 4 such as a quench phenomenon due to a temperature rise due to some disturbance or a thermal runaway occurs from the conductive metal, for example. It is possible to prevent the superconducting layer 4 from being damaged by Joule heat or the like by being divided through the connecting plate 6.

The material constituting the intermediate layer 3 is, for example, YSZ (yttrium stabilized zirconia), SrTiO ₃ , MgO, Al ₂ O ₃ , LaAlO ₃ whose thermal expansion coefficient is closer to that of the superconducting layer 3 than the metal substrate 2. An intermediate layer made of a ceramic crystal such as LaGaO ₃ , YAlO ₃ , or ZrO ₂ can be used. Among these, it is preferable to use a material with as much crystal orientation as possible. The intermediate layer 3 normally insulates the metal substrate 2 and the superconducting layer 4. Although the thickness of the intermediate | middle layer 3 can be suitably determined according to a use, it is about 10-800 nm normally.

The superconductor constituting the superconducting layer 4 is a superconductor capable of forming the superconducting layer 4 laminated on the metal substrate 2 via the intermediate layer 3. These superconductors include high temperature superconductors. Examples of the high-temperature superconductor include yttrium-based high-temperature superconductors, such as YBCO-based oxide superconductors, holmium-based high-temperature superconductors, such as HoBCO-based oxide superconductors, RE123 (rare earth elements such as Y, Nd, and Sm) -based superconductors. Body, AB-Cu-O system (where A is one or more elements of Group IIIa elements of the periodic table such as La, Ce, Y, Sc, Yb, and B is periodic table IIa of Sr, Ba, etc.) An oxide superconductor of one or more group elements).
The superconducting layer 4 can be manufactured by forming a thin film of a superconductor such as YBCO on the metal substrate 2 through the intermediate layer 3 by, for example, chemical vapor deposition (CVD). The thickness of such a superconducting layer 4 can be appropriately determined according to the application, but is usually about 1 μm.

Examples of the material of the conductive metal layer 5 include silver, stainless steel, copper, and SUS (for example, SUS304). The thickness of the conductive metal layer 5 can be appropriately determined according to the application, but is usually about 10 to 100 μm, for example, 50 μm.
For example, a silver deposition layer may be formed between the conductive metal layer 5 and the superconducting layer 4. In this case, the thickness of the silver vapor deposition layer can be determined as appropriate, and can be, for example, about 10 μm.

  The length of the overlapping portion of the connection portion (connection end portion) between one superconducting wire 1a and the other superconducting wire 1b, so-called wrap length (W), can be appropriately determined according to the application. The wrap length (W) varies depending on the required strength of the connecting portion, but is usually 5 cm or more, for example, about 5 to 10 cm.

Next, the connection plate 6 made of a conductive metal will be described. The connection plate 6 made of a conductive metal is made of a conductive metal such as silver or copper. The connection plate 6 made of a conductive metal electrically connects the metal substrate 2 and the superconducting layer 4 existing via the insulating intermediate layer 3. Therefore, for example, when quenching or thermal runaway occurs, current can be shunted from the superconducting layer 4 to the metal substrate 2. Further, the connection plate 6 made of a conductive metal can improve the strength of the interface portion (connection end portion) of the connection between the superconducting wires 1a and 1b.
The length, thickness, shape, and the like of the connection plate 6 made of a conductive metal can be appropriately determined according to the application. For example, the length can be set to a length of half or more of the wrap length (W).

  Next, a method of connecting a plurality of (here, two) superconducting wires 1a and 1b will be described. First, the connection end portions of the superconducting wires 1a and 1b to be connected are arranged with the conductive metal layer 5 facing each other. Next, a connection plate 6 made of a conductive metal is applied to each superconducting wire 1a from one metal substrate 2 of the superconducting wire to the other conductive metal layer 5 so as to cover the connection end portions arranged in this manner. 1b is stacked closely. And each superconducting wire and each superconducting wire and a connection board are connected.

  As a method for connecting the respective superconducting wires and each superconducting wire and a connection plate made of a conductive metal, any method can be used as long as these can be electrically connected. For example, the connection can be made using soldering, diffusion bonding, or the like.

For example, when connecting using soldering, solder is placed at the connection end of the superconducting wire 1a to which the conductive metal layer 5 is connected, and the conductive metal layer 5 of the other superconducting wire 1b is connected. The connected end portions are arranged so as to oppose each other on the solder, and the solder is melted and connected by heating or, optionally, heating under pressure.
The solder to be used can be appropriately determined according to the type of the superconducting wire 1 and the type of the conductive metal layer 5. For example, silver, copper, indium, tin-silver solder, tin-copper solder, tin-lead solder, indium-silver solder, tin-indium solder, tin-bismuth, tin-bismuth-- Solder such as indium solder can be used. The soldering conditions can be determined as appropriate according to the type of solder used.

  For example, in the case of bonding using diffusion bonding, a connection end portion to which the conductive metal layer 5 of one superconducting wire 1a is connected and a connection to which the conductive metal layer 5 of the other superconducting wire 1b is connected. The ends are arranged so as to oppose each other and connected by heating or optionally heating under pressure. The conditions for diffusion bonding can be appropriately determined according to the type of superconducting wire 1 used, the type of conductive metal layer 5, and the like.

  In this way, by reliably connecting the superconducting layer and the metal base material, current can be shunted from the superconducting layer to the metal base material when a quench or thermal runaway occurs. A superconducting wire connecting structure having a predetermined stability can be provided in a compact and cost-effective manner. Moreover, the strength of the interface portion of the connection of each superconducting wire can be improved.

  Next, a second embodiment of the present invention will be described. FIG. 2 is a cross-sectional view showing a superconducting wire connection structure according to a second embodiment of the present invention.

  In the superconducting wire connecting structure according to this embodiment, in the superconducting wire 1, a stabilizing metal layer 7 is formed on the opposite side of the surface of the metal base 2 of each superconducting wire from which the intermediate layer 3 is formed. Yes. The stabilizing metal layer 7 is made of a material such as copper or silver. The thickness of the stabilizing metal layer 7 can be appropriately determined depending on the application. For example, the thickness can be about 50 to 100 μm. The stabilizing metal layer 7 is connected by a method such as soldering or diffusion bonding.

  According to this embodiment, since the stabilizing metal layer 7 is present facing the metal substrate 2, for example, when quenching or thermal runaway occurs in the superconducting layer 4, In addition, since the current can also be shunted to the stabilized metal layer 7, it is possible to provide a superconducting wire connecting structure having more stability.

  Next, a description will be given based on FIGS. 3 to 5 in the third embodiment of the present invention. 3 is a cross-sectional view showing the connection structure of each superconducting wire in this embodiment, FIG. 4 is a cross-sectional view showing the connection structure at the end of the superconducting wire in this embodiment, and FIG. 5 is a superconducting wire in this embodiment. It is sectional drawing which shows the connection structure in the at least 1 place in the longitudinal direction.

  First, connection of a plurality (here, two) of superconducting wires 1a and 1b shown in FIG. 3 in this embodiment will be described. Another superconducting wire 11 in this embodiment is formed by sequentially laminating a metal substrate 12, an intermediate layer 13, a superconducting layer 14, and a conductive metal layer 15. In this embodiment, another superconducting wire 11 may be different from the superconducting wire 1 or may be the same type, but the same type is preferable because it is easy to manufacture. The length of another superconducting wire 11 can be appropriately determined according to the application, but is usually about 5 cm to 10 cm.

  First, the end surfaces of the connection end portions of the superconducting wires 1a and 1b to be connected are arranged to face each other. Next, superconducting wires 11 different from the respective superconducting wires 1a and 1b are placed on the conductive metal layers 5 of the respective superconducting wires 1a and 1b so as to cover the connection end portions. The 15 surfaces are stacked so that they face each other. Furthermore, a connection plate 8 made of a conductive metal is stacked on the metal base 2 of each superconducting wire 1a, 1b so as to cover this connection end. And each superconducting wire 1a, 1b and another superconducting wire 11, and each superconducting wire 1a, 1b and the connection board 8 which consists of an electroconductive metal are each connected. Here, as a method of connection, similarly to the first embodiment of the present invention, electrical connection can be performed using soldering and diffusion bonding. Moreover, since each superconducting wire 1a, 1b arrange | positioned face-to-face, an electric current flows through another superconducting wire 11, even if the end surfaces of each superconducting wire 1a, 1b are contacting, it is not contacting. Also good. Further, the end surfaces of each superconducting wire 1a, 1b may or may not be electrically connected, for example, soldered or diffusion bonded.

  Thus, since each superconducting wire 1a, 1b is faced | matched and it electrically connects via another superconducting wire 11, there is no inversion of the surface in the longitudinal direction of the superconducting wire by connection, Therefore Manufacturability of a superconducting wire Will improve.

  Next, the connection of the superconducting wire shown in FIG. 4 in this embodiment will be described. First, as shown in FIG. 4 (a), the superconducting wire 1 formed by sequentially laminating the metal substrate 2, the intermediate layer 3, the superconducting layer 4 and the conductive metal layer 5 is electrically conductive at the end. The metal terminal 21 is electrically connected through the metal layer 5. The metal terminal 21 is made of a conductive metal such as silver or copper. A current flows from the metal terminal 21 to the superconducting layer 4 through the conductive metal layer 5.

  In at least one of the ends of the superconducting wire 1, that is, the metal terminal 21, the metal base 2 and the metal terminal 21 of the superconducting wire 1 are electrically connected via a connection plate 22 made of a conductive metal. The connection plate 22 made of a conductive metal is the same in material and connection method as the connection plate 6 made of a conductive metal in the first embodiment of the present invention. Examples of the connection method include soldering and diffusion bonding.

In FIG. 4B, the superconducting wire 1 is connected to the metal terminal 21 via the metal base 2 at the end. In FIG. 4 (b), the conductive metal layer 5 and the metal terminal 21 of the superconducting wire 1 are electrically connected to each other through the connection plate 22 made of a conductive metal at both ends of the superconducting wire 1, that is, the metal terminal 21. Connected to. This is because a current flows from the metal terminal 21 to the superconducting layer 4, so that it is necessary to connect the connection plate 22 made of a conductive metal at both ends of the superconducting wire 1. 4 (a) and 4 (b), the end portion of the superconducting wire 1 means the end portion of the wire when the superconducting wire 1 is connected to the wire.
Of the connection structure of FIG. 4 (a) and the connection structure of FIG. 4 (b), the connection structure of FIG. 4 (a) is easier to manufacture, and the metal terminal 21 at the end of the superconducting wire 1 The connection with the connection plate 22 made of a conductive metal is preferable because at least one of the connections is sufficient.

  In this way, at the end of the superconducting wire 1, the metal terminal 21 and the connection plate 22 made of conductive metal are electrically connected, so that the superconducting layer 4 and the metal substrate 2 are electrically connected. .

  Next, the connection of the superconducting wire shown in FIG. 5 in this embodiment will be described. FIG. 5 is a cross-sectional view of a structure in which the superconducting layer 4 of the superconducting wire 1 and the metal substrate 2 are connected by a connecting plate 23 made of a conductive metal at a predetermined location in the longitudinal direction of the superconducting wire 1. Of the superconducting wire 1 formed by sequentially laminating the metal substrate 2, the intermediate layer 3, the superconducting layer 4, and the conductive metal layer 5, a group made of a conductive metal existing via the insulating intermediate layer 3. The material 2 and the superconducting layer 4 are brought into contact with each other at a predetermined position in the longitudinal direction of the superconducting wire 1 by a connecting plate 23 made of a conductive metal, and are electrically connected.

The material of the connection plate 23 made of a conductive metal is the same as that of the connection plate 6 made of a conductive metal in the first embodiment of the present invention, and examples thereof include silver and copper. In addition, the connecting plate (connecting portion) 23 made of a conductive metal can use any shape as long as it can connect the superconducting layer 4 of the superconducting wire 1 and the metal substrate 2. For example, a U-shaped cross section as shown in FIG. 5 or a rectangular shape having a hollow inside can be used.
For the electrical connection by the connection plate 23 made of a conductive metal, a method capable of electrically connecting the metal substrate 2 and the superconducting layer 4 can be used. For example, soldering or diffusion bonding can be used.

  The electrical connection by the connecting plate 23 made of the conductive metal may be at least one place in the longitudinal direction of the superconducting wire 1, but by connecting at a plurality of places, for example, more quickly when a quench occurs. A current can be passed from the superconducting layer 4 to the metal substrate 2. In addition, the connection of the superconducting wire for flowing from the superconducting layer 4 to the metal substrate 2 in this embodiment is the connection at the end (metal terminal 21) of the superconducting wire 1 in FIG. 4 and the longitudinal direction of the superconducting wire 1 in FIG. It is sufficient if there is at least one of the connections at a predetermined location in FIG. 1, but it is also possible to have both of these connections. In this case, for example, when quenching occurs, it is preferable because a current can flow from the superconducting layer 4 to the metal substrate 2 even more rapidly.

  The superconducting wires in this embodiment are connected by connecting the superconducting wires 1a and 1b as shown in FIG. 3, and the end of the superconducting wire 1 and / or superconducting as shown in FIGS. 4 and / or 5. The superconducting layer 4 of the superconducting wire 1 and the metal substrate 2 are connected to each other through a connecting plate 22 and / or 23 made of a conductive metal at least at one place in the longitudinal direction of the wire 1. By connecting the superconducting wires 1a and 1b as shown in FIG. 3, there is no inversion of the surface of the superconducting wire in the longitudinal direction due to the connection of the superconducting wires, so that the manufacturability of the superconducting wire is improved, and FIG. 4 and / or FIG. By connecting the superconducting layer 4 of the superconducting wire 1 and the metal base 2 as shown, for example, when a quench occurs, the current can be shunted from the superconducting layer 4 to the metal base 2, which is more compact at a lower cost. In addition, a superconducting wire connecting structure having a predetermined stability can be provided.

  Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the connection structure of the superconducting wire in this embodiment. This embodiment is a connection structure corresponding to the connection structure of the superconducting wire shown in FIG. 3 in the third embodiment of the present invention.

  In this embodiment, the connection structure of the superconducting wires 1a and 1b as shown in FIG. 3 is further connected by a connection plate 6 made of a conductive metal. As shown in FIG. 6, a conductive metal is formed from the metal substrate 12 of another superconducting wire 11 to the conductive metal layer 5 of each superconducting wire 1 a, 1 b so as to cover the connection ends on both sides of the other superconducting wire 11. The connection plates 6 made of are closely stacked and stacked. As shown in FIG. 6, the connection plate 6 made of a conductive metal may be made of a connection plate 6 made of two conductive metals, or the connection plate 6 made of one conductive metal that is integrated. It may be.

  Thus, in this embodiment, by connecting the connection plate made of a conductive metal, the connection of the superconducting wire becomes more reliable, and the strength of the interface portion of the connection of the superconducting wire further increases.

  Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view showing a connection structure of superconducting wires in this embodiment. This embodiment is a connection structure corresponding to the connection structure of each superconducting wire shown in FIG. 3 in the third embodiment of the present invention.

In this embodiment, as shown in FIG. 7, a plurality (two in the drawing) of superconducting wires 1a and 1b are butted in the direction in which the conductive metal layers 5 are in the same direction. A conductive metal plate, that is, a stabilizing metal layer 24 is disposed so as to overlap the connection end portion of the conductive metal layer 5. The metal base 2 of each of the superconducting wires 1a and 1b is electrically connected by arranging a connection plate 8 made of a conductive metal. The stabilization metal layer 24 and the conductive metal layer 5 of the superconducting wire 1 can be connected by a method capable of electrically connecting them, such as soldering or diffusion bonding.
The stabilizing metal layer 24 may be made of a conductive material and may be made of a material that can electrically connect the superconducting layers 4 of the superconducting wires 1a and 1b. Of these, metals with low resistivity, such as copper and silver, are preferred. The thickness and length of the stabilizing metal layer 24 can be appropriately determined according to the type of superconducting wire used.

  According to this embodiment, it is possible to provide a superconducting wire connecting structure at lower cost.

  Next, the contents of the present invention will be described based on examples.

(Example 1)
Two superconducting wires were prepared. The superconducting wire is formed on a tape-like member (width 2 cm × length 10 m × thickness 100 μm) in which a YSZ (yttrium stabilized zirconia) plane orientation intermediate layer (thickness 200 nm) is formed on a Hastelloy tape by an ion beam assisted sputtering method. Then, a Y-Ba-Cu-O-based superconducting layer having a thickness of 1 μm was formed, and a copper layer having a thickness of 50 μm was formed thereon via a silver deposited layer having a thickness of 10 μm.
Next, tin-silver solder is placed on the connection end of the surface of the copper layer of one superconducting wire, and the connection end of the surface of the copper layer of the other superconducting wire is placed on the connection end where this solder is placed. Superimposed.
Further, a copper connection plate was stacked in close contact with each superconducting wire using solder from one hastelloy of the superconducting wire to the other copper layer so as to cover the connection end.
Electrical connection was made by soldering by heating at 250 ° C. to obtain a superconducting wire connection structure as shown in FIG. Here, the wrap length (W) of the connection end of one superconducting wire and the other superconducting wire was 5 cm. Moreover, the thickness of the solder at the connection end was 10 μm.
As a result, a good connection between the superconducting layer of one superconducting wire and the Hastelloy (base material) of the other superconducting wire was obtained. Moreover, the joining strength of the connection end of the superconducting wire was improved.

(Comparative Example 1)
A superconducting wire connection structure was obtained in the same manner as in Example 1 except that a copper connection plate was not used.
As a result, it was not possible to obtain a good connection structure between the superconducting layer of one superconducting wire and the base layer of the other superconducting wire.

(Example 2)
Two superconducting wires similar to those in Example 1 were prepared. The end surfaces of the connecting end portions of these two superconducting wires are butted together, and on the copper layer of each superconducting wire, a superconducting wire of the same kind as this superconducting wire (length: 5 cm) is covered. Stacking was performed so that the surfaces of the respective copper layers faced each other through tin-silver solder. Next, it piled up so that the copper connection board (length: 5 cm) might oppose on the Hastelloy (base material) of each superconducting wire.
Further, in the vicinity of the center of the superconducting wire, the superconducting layer and Hastelloy (base material) were brought into contact with a copper connection plate having a U-shaped cross section through a tin-silver solder. Electrical connection was made by soldering by heating at 250 ° C. to obtain a superconducting wire connection structure as shown in FIGS.
As a result, since there is no inversion of the surface of the superconducting wire in the longitudinal direction due to the connection of the superconducting wire, the manufacturability of the superconducting wire is improved, and a good connection between the superconducting layer of the superconducting wire and Hastelloy (base material) is obtained. .

It is sectional drawing which shows the connection structure of the superconducting wire which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the connection structure of the superconducting wire which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the connection structure of the superconducting wire in the 3rd Embodiment of this invention. It is sectional drawing which shows the connection structure in the edge part of the superconducting wire in the 3rd Embodiment of this invention. It is sectional drawing which shows the connection structure in the predetermined location of the longitudinal direction of the superconducting wire in the 3rd Embodiment of this invention. It is sectional drawing which shows the connection structure of the superconducting wire which concerns on the 4th Embodiment of this invention. It is sectional drawing which shows the connection structure of the superconducting wire which concerns on the 5th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a, 1b ... Superconducting wire, 2 ... Metal base material, 3 ... Intermediate | middle layer, 4 ... Superconducting layer, 5 ... Conductive metal layer, 6 ... Connection board which consists of conductive metals, 7 ... Stabilized metal layer, 8 ... Connecting plate made of conductive metal, 11 ... other superconducting wire, 12 ... metal substrate, 13 ... intermediate layer, 14 ... superconducting layer, 15 ... conductive metal layer, 21 ... metal terminal, 22 ... from conductive metal Connecting plate, 23 ... connecting plate made of conductive metal, 24 ... stabilizing metal layer

Claims (4)

A superconducting wire connecting method in which a superconducting layer and a conductive metal layer are sequentially laminated on one side of a metal substrate via an intermediate layer,
An arrangement step of arranging each other not face to the conductive metal layer of the connection end portion in the superconducting wire, respectively to be connected,
Wherein toward the connection end portion of each of the end faces of the respective superconducting wires while the other of the conductive metal layer from the metal substrate of the covering of the connection plate made of a conductive metal in intimate contact with said superconducting wire stacking Stacking process,
A method of connecting superconducting wires, comprising connecting each of the superconducting wires and connecting each of the superconducting wires and the connecting plate. A superconducting wire connecting method in which a superconducting layer and a conductive metal layer are sequentially laminated on one surface of a metal substrate via an intermediate layer,
Arrangement step of abutting the end faces of the connecting end of the superconducting wire to be connected;
So as to cover the connection end portion, the conductive metal layer of the superconducting wire, said another superconducting wire and the superconducting wire, the surface of each of the conductive metal layer is stacked so as to face 1 stacking process,
A second stacking step of stacking the connection plates made of the first conductive metal on the other surface of the metal substrate of each superconducting wire,
At least at one end of the superconducting wire to be connected or in the longitudinal direction, the conductive metal layer of the superconducting wire and the metal substrate of the other superconducting wire are connected by a connecting plate made of a second conductive metal. A contact process for contacting;
And connecting each of the superconducting wires and the other superconducting wire, connecting each of the superconducting wires and the first connecting plate, and the second connecting plate , the superconducting wire, and the other superconducting wire. A superconducting wire connecting method characterized by the above. 3. The first stacking step stacks a conductive metal plate different from the other superconducting wire on the conductive metal layer of each superconducting wire so as to face each other. The connection method of the superconducting wire described in 1.   A superconducting wire comprising a connecting portion connected by using at least one of the connecting methods according to any one of claims 1 to 3.

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