JP6101490B2 - Oxide superconducting wire connection structure and superconducting equipment - Google Patents

Description

  The present invention relates to an oxide superconducting wire connection structure and a superconducting device.

Bi-based superconducting wire Bi ₂ Sr ₂ CaCu ₂ O _{8 + δ} (Bi2212), Bi ₂ Sr ₂ Ca ₂ Cu ₃ O _{10 + δ} (Bi2223) and RE-123-based superconducting wire REBa ₂ Cu ₃ O _7-x (RE123: RE Development of oxide superconducting wires such as rare earth elements including Y and Gd is underway. These oxide superconducting wires have a critical temperature of about 90 to 110K and exhibit superconductivity above the liquid nitrogen temperature. Therefore, these oxide superconducting wires are considered to be extremely promising materials for practical use. There is a demand for use as a conductor or a superconducting coil.

  The Bi-based superconducting wire has a structure manufactured by the Powder In Tube method (PIT method) or the like so that the Bi-based superconducting layer is covered with an Ag sheath material. On the other hand, in the RE-123 series superconducting wire, an oxide superconducting layer is laminated on a tape-shaped metal substrate by a film forming method through an intermediate layer, and the first stabilization of thin silver is further performed on the oxide superconducting layer. A structure in which a layer is formed and a second stabilization layer made of a highly conductive metal material such as copper is provided thereon is employed.

  In order to apply the RE-123 series oxide superconducting wire to a practical device, a technique for connecting the oxide superconducting wire is desired. For example, in Patent Document 1, as shown in FIG. 17, end portions of a pair of oxide superconducting wires 211 and 212 in which an intermediate layer 203, an oxide superconducting layer 204, and a stabilizing layer 205 are laminated on a base material 202. There is disclosed a connection structure 200 that is arranged together, is further connected with an oxide superconducting wire 213 for connection, is joined with solder (not shown), and is further reinforced by a connection plate 206.

JP 2007-266149 A

However, in the connection structure 200 described in Patent Document 1, it is possible to improve the mechanical strength of the connection portion by reinforcing the connection portion with the connection plate 206, but the connection structure 200 is bent to the connection structure 200. When this is added, the oxide superconducting layer 204 may be deteriorated.
Since the connection structure 200 is arranged so that the ends of the pair of oxide superconducting wires 211 and 212 are aligned with each other, when bending is applied so that the pair of oxide superconducting wires 211 and 212 is inside. The ends interfere with each other, and a stress is generated that pushes up the oxide superconducting wire 213 for bonding located above the interfered portion. The stress may damage the crystal structure of the oxide superconducting layer 204 of the oxide superconducting wire 213 for bonding, and the structure is weak against bending.

  This invention is made | formed in view of the above situations, and it aims at providing the connection structure of an oxide superconducting wire strong with respect to a bending.

A connection structure in which an oxide superconducting wire formed by laminating an intermediate layer, an oxide superconducting layer, and a stabilizing layer on a tape-like base material is connected, and includes a first oxide superconducting wire and a second oxidation A superconducting wire and a third oxide superconducting wire, and the first and second oxide superconducting wires are aligned with the side on which the oxide superconducting layer is formed with respect to the substrate, and the ends are separated from each other. The stabilization layer of the third oxide superconducting wire is bridged to the stabilization layer of the first and second oxide superconducting wires so as to be arranged adjacent to each other and straddle the adjacent ends. The stabilization layers of the first and third oxide superconducting wires are bonded together by a conductive bonding material, and the stabilization layers of the second and third oxide superconducting wires are bonded by a conductive bonding material. , Between the end portions of the first and second oxide superconducting wires arranged apart from each other Away is characterized in that said third oxide is superconducting wire less than 0.4% to 90% of the length of the.
According to the present invention, the ends of the first and second oxide superconducting wires are arranged apart from each other by 0.4% or more of the length of the third oxide superconducting wire. At this time, it is possible to suppress the concentration of stress that interferes with the ends and pushes up to the third oxide superconducting wire positioned above the interfered portion. In addition, since the distance between the ends of the first and second oxide superconducting wires is less than 90% of the length of the third oxide superconducting wire, the first and third oxide heating devices can be used in a small heating device. Since the region where the oxide superconducting wire is bonded by the conductive bonding material and the region where the second and third oxide superconducting wires are bonded by the conductive bonding material can be heated simultaneously, the productivity is good. In addition, since the pair of oxide superconducting wires to be connected is arranged with the stacking direction aligned, there is no reverse inversion of the oxide superconducting wire at the connecting portion.

In the oxide superconducting wire connecting structure according to the present invention, the conductive bonding material has a thickness of 380 μm or less.
According to the present invention, by setting the thickness of the conductive bonding material to 380 μm or less, it becomes possible to ensure sufficient flexibility even when bending is applied to the connection structure, and oxidation is caused by bending. It is possible to suppress the physical superconducting layer from being damaged.

The oxide superconducting wire connecting structure of the present invention has a radius so that the first and second oxide superconducting wires are inside and the third oxide superconducting wire is outside along the stacking direction. It is bent to 5 mm or more and 200 mm or less.
According to the present invention, the oxide superconducting layer can be prevented from being damaged by being bent to a bending radius of 5 mm or more. Accordingly, the connection structure can be used in various superconducting devices without being restricted by the bending radius.

Further, the connection structure of the oxide superconducting wire of the present invention has a radius so that the first and second oxide superconducting wires are outside and the third oxide superconducting wire is inside along the stacking direction. It is bent to 12 mm or more and 200 mm or less.
According to the present invention, the oxide superconducting layer can be prevented from being damaged by being bent to a bending radius of 12 mm or more. Accordingly, the connection structure can be used in various superconducting devices without being restricted by the bending radius.

The present invention is characterized in that the base material of the third oxide superconducting wire is formed thinner than the base materials of the first oxide superconducting wire and the second oxide superconducting wire.
Since the third oxide superconducting wire having a base material thinner than that of the first and second oxide superconducting wires is used for connecting these wires, the overall thickness of the connection structure can be reduced.

The present invention is characterized in that the terminal of the first oxide superconducting wire, the terminal of the second oxide superconducting wire, and the terminal of the third oxide superconducting wire are individually covered with a covering member. To do.
By sealing the terminal portions of the first, second, and third oxide superconducting wires with a sealing member, it is possible to provide a connection structure with less risk of moisture intrusion from the outside. For this reason, even if it uses the oxide superconducting wire containing a connection structure for a long period of time, the superconducting wire which does not have a possibility of moisture deterioration can be provided.

The superconducting device of the present invention is characterized by having a connection structure of the oxide superconducting wire.
Since the oxide superconducting wire connected by the connection structure is used for a superconducting device, it becomes possible to improve the protection performance of the superconducting device against a mechanical load. Therefore, a superconducting device having higher reliability than before can be obtained. It can be realized.

  According to the present invention, the ends of the first and second oxide superconducting wires are arranged at a distance of 1 mm or more, so that the ends do not interfere with each other when bending is applied. Concentration of stress that pushes up on the third oxide superconducting wire located above the portion can be suppressed. Further, since the distance between the end portions of the first and second oxide superconducting wires is 190 mm or less, the first and third oxide superconducting wires are joined by the conductive joining material with a small heating device. The region to be bonded and the region to bond the second and third oxide superconducting wires with the conductive bonding material can be heated at the same time, so that productivity is good. In addition, since the pair of oxide superconducting wires to be connected is arranged with the stacking direction aligned, there is no reverse inversion of the oxide superconducting wire at the connecting portion.

It is a schematic diagram which shows the oxide superconducting wire which concerns on this invention, and its edge part. It is a cross-sectional schematic diagram which shows the connection structure which concerns on this invention. It is a partial section schematic diagram showing an example of a superconducting cable. It is sectional drawing which shows an example of a superconducting fault current limiter. An example of a superconducting motor is shown, FIG. 5A is a partial cross-sectional view showing the overall configuration, and FIG. 5B is a schematic diagram showing the positional relationship of each component. An example of a superconducting coil is shown. FIG. 6A is a perspective view showing a laminated body of superconducting coils, and FIG. 6B is a perspective view showing a single superconducting coil. It is a graph which shows the result of the bending test of an Example and a comparative example. It is a graph which shows the result of the bending test of an Example and a comparative example. It is a graph which shows the result of the bending test of an Example and a comparative example. It is a graph which shows the result of the bending test of an Example and a comparative example. It is a graph which shows the relationship between the distance of the edge parts of an oxide superconducting wire, and the result of a deterioration rate. It is a graph which shows the relationship between the length of a conductive joining material, and resistance value. It is a figure which shows the method of a bending test, FIG.13 (a) is a schematic diagram showing a mode that the 3rd oxide superconducting wire was arrange | positioned outside, and was bent, FIG.13 (b) is 3rd It is a schematic diagram showing a mode that the oxide superconducting wire was arranged and bent inside. FIG. 14A is a schematic view showing an oxide superconducting wire and its end portion according to the present invention, and FIG. 14B is a schematic view showing a first example of the end sealing structure of the oxide superconducting wire. FIG. 14 (c) is a schematic diagram showing a second example of the end sealing structure of the oxide superconducting wire. It is a schematic diagram which shows 2nd Embodiment of the connection structure which concerns on this invention, Fig.15 (a) is a front schematic diagram, FIG.15 (b) is a cross-sectional schematic diagram. It is a figure which shows the result of a pressure cooker test about the sample manufactured in the Example, and a comparative example sample. The connection structure of the oxide superconducting wire as a prior art example is shown.

Hereinafter, an embodiment of an oxide superconducting wire according to the present invention will be described with reference to the drawings.
In addition, in the drawings used in the following description, in order to make the features easy to understand, there are cases where the portions that become the features are enlarged for the sake of convenience, and the dimensional ratios of the respective components are not always the same as the actual ones. Absent.

(Oxide superconducting wire)
FIG. 1 is a schematic diagram showing an end 1a of an oxide superconducting wire 1 according to the present invention. Based on FIG. 1, each component of the tape-shaped oxide superconducting wire 1 is demonstrated in detail. However, the present invention is not limited to the following embodiments.
The oxide superconducting wire 1 has a structure in which an intermediate layer 11, an oxide superconducting layer 12, a first stabilizing layer 13, and a second stabilizing layer 14 are laminated on a tape-shaped substrate 10. In the present embodiment, the metal constituting the second stabilization layer 14 also serves as a metal layer that covers the outer periphery of the oxide superconducting wire 1.

  The base material 10 may be any material that can be used as a base material for a normal oxide superconducting wire, and is preferably a long tape having flexibility. In addition, the material used for the base material 10 preferably has a metal having high mechanical strength, heat resistance, and easy to be processed into a wire, for example, a nickel alloy such as stainless steel or hastelloy. And various heat-resistant metal materials, or materials in which ceramics are arranged on these metal materials. Among them, Hastelloy (trade name, manufactured by Haynes, USA) is preferable as a commercial product. This kind of Hastelloy includes Hastelloy B, C, G, N, W, etc., which have different amounts of components such as molybdenum, chromium, iron, cobalt, etc., and any kind can be used here. Further, as the base material 10, an oriented Ni—W alloy tape base material in which a texture is introduced into a nickel alloy can be used. What is necessary is just to adjust the thickness of the base material 10 suitably according to the objective, Usually, 10-500 micrometers, Preferably it is 20-200 micrometers.

As the intermediate layer 11, a structure in which a diffusion prevention layer, a bed layer, an alignment layer, and a cap layer are laminated in this order can be applied.
As a result of heat treatment when forming another layer on the upper surface of this layer, the diffusion preventing layer diffuses part of the constituent elements of the base material 10 when the base material 10 or other layers receive a thermal history. And it has a function which suppresses mixing into the oxide superconducting layer 12 side as an impurity. The specific structure of the diffusion preventing layer is not particularly limited as long as it can exhibit the above-described function, but Al ₂ O ₃ , Si ₃ N ₄ , or GZO (which has a relatively high effect of preventing contamination of impurities) A single layer structure or a multilayer structure composed of Gd ₂ Zr ₂ O ₇ ) or the like is desirable.

The bed layer is used to suppress the reaction of the constituent elements at the interface between the base material 10 and the oxide superconducting layer 12 and to improve the orientation of the layer provided on the upper surface than this layer. The specific structure of the bed layer is not particularly limited as long as it can exhibit the above functions, but Y ₂ O ₃ , CeO ₂ , La ₂ O ₃ , Dy ₂ O ₃ , Er ₂ O, which have high heat resistance. ₃ , a single layer structure or a multilayer structure composed of rare earth oxides such as Eu ₂ O ₃ and Ho ₂ O ₃ is desirable.

The alignment layer controls the crystal orientation of the cap layer and the oxide superconducting layer 12 formed thereon, suppresses the constituent elements of the substrate 10 from diffusing into the oxide superconducting layer 12, 10 and the oxide superconducting layer 12 have a function of reducing a difference in physical characteristics such as a coefficient of thermal expansion and a lattice constant. The material of the alignment layer is not particularly limited as long as it can express the above function, but when a metal oxide such as Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ) is used, In an ion beam assisted vapor deposition method (hereinafter also referred to as IBAD method), which will be described later, a layer having high crystal orientation is obtained, and the crystal orientation of the cap layer and the oxide superconducting layer 12 is improved. This is particularly suitable.

The cap layer is used when controlling the crystal orientation of the oxide superconducting layer 12 more strongly than the orientation layer, diffusing elements constituting the oxide superconducting layer 12 into the intermediate layer 11, or laminating the oxide superconducting layer 12. And a function of suppressing the reaction between the gas to be generated and the intermediate layer 11. The material of the cap layer is not particularly limited as long as it can exhibit the above functions, but is CeO ₂ , LaMnO ₃ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , ZrO ₂ , Ho ₂ O _3. From the viewpoint of lattice matching with the oxide superconducting layer 12, metal oxides such as Nd ₂ O ₃ and Zr ₂ O ₃ are preferable. Among them, CeO ₂ and LaMnO ₃ are particularly preferable because a layer having a higher degree of orientation than that of the intermediate layer 11 can be obtained.
Here, when CeO ₂ is used for the cap layer, the cap layer may include a Ce—M—O-based oxide in which part of Ce is substituted with another metal atom or metal ion.

The oxide superconducting layer 12 has a function of flowing current when in the superconducting state. As the material used for the oxide superconducting layer 12, a material composed of an oxide superconductor having a generally known composition can be widely applied. For example, copper such as RE-123 series superconductor, Bi series superconductor, etc. Examples include oxide superconductors. The composition of the RE-123 series superconductor is, for example, REBa ₂ Cu ₃ O _(7-x) (RE represents a rare earth element such as Y, La, Nd, Sm, Er, Gd, and x represents oxygen deficiency). mentioned, _{specifically, Y123 (YBa 2 Cu 3 O} (7-x)), Gd123 (GdBa 2 Cu 3 O (7-x)) and the like. The composition of the Bi-based superconductor, for _{example, Bi 2 Sr 2 Ca n-} 1 Cu n O 4 + 2n + δ (n is the number of layers of CuO _2, [delta] represents an excess oxygen.) Include. In this copper oxide superconductor, although the base material is an insulator, it becomes a superconductor by taking in oxygen, and has the property of exhibiting superconducting properties. Here, the material of the oxide superconducting layer 12 used in the present invention is a copper oxide superconductor. Unless otherwise specified, the material used for the oxide superconducting layer 12 is a copper oxide superconductor.

  The first stabilization layer 13 bypasses an overcurrent generated at the time of an accident, suppresses a chemical reaction occurring between the oxide superconducting layer 12 and a layer provided on the upper surface of this layer, and an element of one layer It has a function of preventing deterioration of superconducting characteristics caused by a part of the metal penetrating into the other layer and breaking the composition. Moreover, in order to make it easy to take in oxygen to the oxide superconducting layer 12, it has the function to make oxygen permeate easily at the time of heating. Therefore, a material containing at least Ag is used for the first stabilization layer 13. The material of the first stabilization layer 13 used in the present invention is Ag. Hereinafter, unless otherwise specified, the material used for the first stabilization layer 13 is Ag. The first stabilization layer 13 may be formed so as to cover the entire circumference of the laminate of the base material 10, the intermediate layer 11, and the oxide superconducting layer 12.

  The second stabilization layer 14 laminated on the first stabilization layer 13 is made of a highly conductive metal material, and the oxide superconducting layer 12 attempts to transition from the superconducting state to the normal conducting state for some reason. Sometimes, it functions as a bypass along with the first stabilizing layer 13 where the current of the oxide superconducting layer 12 commutates. The first stabilization layer 13 can be regarded as a part of the second stabilization layer 14 due to its function.

The metal material constituting the second stabilization layer 14 is not particularly limited as long as it has good conductivity, but is not limited to copper alloys such as copper, brass (Cu—Zn alloy), Cu—Ni alloy, stainless steel, and the like. It is preferable to use a material made of a relatively inexpensive material such as copper, and copper is preferable because it has high conductivity and is inexpensive. Further, when the oxide superconducting wire 1 is used for a superconducting fault current limiter, the second stabilization layer 14 is used to instantaneously suppress an overcurrent generated when a quench occurs and the state transitions to a normal conducting state. In the case of this application, examples of the material used for the second stabilization layer 14 include a high resistance metal such as a Ni-based alloy such as Ni—Cr.
The thickness of the 2nd stabilization layer 14 is not specifically limited, Although it can adjust suitably, it can be 10-300 micrometers.

  The method for forming the second stabilization layer 14 is not particularly limited, but in the present embodiment, a metal tape made of a highly conductive material such as copper is attached to the first stabilization layer via a conductive bonding material (not shown) such as solder. It is formed by being laminated on the stabilization layer 13. The second stabilization layer 14 covers the entire circumference of the laminate 15 in which the base material 10, the intermediate layer 11, the oxide superconducting layer 12, and the first stabilization layer 13 are laminated.

  When solder is used as a conductive bonding material (not shown) used when a metal tape is stuck on the first stabilization layer 13, the solder is not particularly limited, and a conventionally known solder can be used. . For example, lead-free solder, Pb-Sn alloy alloy, Sn, Sn—Ag alloy, Sn—Bi alloy, Sn—Cu alloy, Sn—Zn alloy, etc. Crystal solder, low-temperature solder, and the like can be mentioned, and these solders can be used singly or in combination of two or more. Among these, it is preferable to use solder having a melting point of 300 ° C. or less. Thereby, since it becomes possible to solder a metal tape and the 1st stabilization layer 13 at the temperature of 300 degrees C or less, it can suppress that the characteristic of the oxide superconducting layer 12 deteriorates with the heat of soldering.

  The second stabilization layer 14 is attached to the first stabilization layer 13 via solder, and the base material 10, the intermediate layer 11, the oxide superconducting layer 12, and the first stabilization layer 13 are laminated. The laminated body 15 is formed so as to cover almost the entire circumference. That is, the second stabilization layer 14 covers the peripheral surface of the laminate 15 excluding the center portion of the back surface on the side where the intermediate layer 11 is not formed in the base material 10 so as to form a C-shaped cross section. . The second stabilization layer 14 can be formed as a metal layer by forming a metal tape with a roll or the like and depositing it around the laminate 15. The central portion on the back surface side of the substrate 10 that is not covered with the second stabilization layer 14 is covered with the solder layer 16, and the solder layer 16 fills the recess formed by the edges of the second stabilization layer 14. It is formed as follows.

The outer periphery of the oxide superconducting wire 1 is covered with a metal layer (second stabilizing layer 14) made of a metal tape or the like and the solder layer 16, thereby preventing moisture from entering from the side surface of the oxide superconducting wire 1. Further, deterioration of the oxide superconducting layer 12 can be prevented.
In addition to forming a metal layer so as to cover the peripheral surface of the laminate 15 as described above, the entire outer periphery of the laminate 15 is covered by plating so that the metal on the outer periphery of the laminate 15 is covered. The layer and the second stabilization layer 14 may be integrally formed. In this case, by setting the thickness of the plating layer to 10 μm or more, a plating layer without a pinhole can be formed, and moisture can be reliably prevented from entering.

  Here, as described above, the oxide superconducting wire 1 in which a metal tape or a plating layer is formed as the second stabilization layer 14 is exemplified. However, the oxide superconducting wire of the present invention is not limited to this. For example, the oxide superconducting wire does not have the second stabilizing layer 14, that is, only the first stabilizing layer 13 serves as a stabilizing layer. It may be a configuration.

(Connection structure)
Hereinafter, a connection structure 30 in which the first and second oxide superconducting wires 4 and 5 that are the first embodiment of the connection structure according to the present invention are connected will be described with reference to FIG.
In addition, the 1st and 2nd oxide superconducting wire 4 and 5 connected in the connection structure 30 of this embodiment is the same form as the oxide superconducting wire 1 demonstrated based on FIG.

As shown in FIG. 2, the connection structure 30 is a structure that connects the first oxide superconducting wire 4 and the second oxide superconducting wire 5 .
The first and second oxide superconducting wires 4 and 5 are aligned with the base 10 on the side where the oxide superconducting layer 12 is formed, and a gap of a distance e is formed between the end portions 4a and 5a to be connected. Provided and arranged adjacent to each other. Further, the third oxide superconducting wire 6 is formed on the stabilizing layer 14 of the first and second oxide superconducting wires 4 and 5 so as to straddle the adjacent ends 4a and 5a. The stabilization layer 14 of the object superconducting wire 6 is bridged. Further, the stabilization layers 14 of the first and third oxide superconducting wires 4 and 6 are joined together by the conductive joining material 22, and the stabilization layers 14 of the second and third oxide superconducting wires 5 and 6 are joined. The two are bonded together by the conductive bonding material 22.

A procedure for forming the connection structure 30 will be described. First, the first and second oxide superconducting wires 4 and 5 are adjacent to each other with the end portions 4a and 5a to be connected apart from each other by a distance e.
At this time, the first and second oxide superconducting wires 4 and 5 are arranged so that the sides on which the oxide superconducting layers 12 and 12 are formed are aligned with respect to the base materials 10 and 10.
Next, the third oxide superconducting wire 6 is bridged across the end portions 4a and 5a of the adjacent first and second oxide superconducting wires 4 and 5. The third oxide superconducting wire 6 and the first and second oxide superconducting wires 4 and 5 are overlapped with the base 10 facing the side on which the oxide superconducting layer 12 is laminated. Further, the overlapping portion of the first oxide superconducting wire 4 and the third oxide superconducting wire 6 and the overlapping of the second oxide superconducting wire 5 and the third oxide superconducting wire 6 by the conductive bonding material 22. The connection structure 30 is configured by joining the parts.

As described above, solder can be used as the conductive bonding material 22 for bonding the first and second oxide superconducting wires 4 and 5 . As the solder as the conductive bonding material 22, the same solder as that used when a metal tape is attached on the first stabilization layer 13 can be used.

The first oxide superconducting wire 4 to the second oxide superconducting wire 5 , or the second oxide superconducting wire 5 is increased by increasing the length H ₂₂ in the longitudinal direction of the region joined by the conductive joining material 22. In the current path from 5 to the first oxide superconducting wire 4 , the cross-sectional area of the conductive bonding material 22 in the current direction can be increased, and the resistance value at the connection portion of the connection structure 30 can be suppressed as a whole. Can do. Therefore, the length H ₂₂ in the longitudinal direction of the region to be joined by the conductive joining material 22 is preferably longer from the viewpoint of the electrical resistance of the connection portion, and specifically, 10 mm or more. However, if the length H ₂₂ exceeds 120 mm, the connecting portion is too long, bending of the connection structure 30 is deteriorated.
In addition, in the melting of the conductive bonding material 22 at the time of connection, a region where the first and third oxide superconducting wires 4 and 6 are bonded by the conductive bonding material 22, and the second and third oxide superconducting wires. Since the area | region which joins 5 and 6 with the electroconductive joining material 22 becomes large, in order to heat simultaneously, a heating apparatus becomes large and is not realistic. Thus the length _{H 22,} the following is preferable 120mm or 10 mm.

The distance e between the end portions 4a and 5a to be connected to the first and second oxide superconducting wires 4 and 5 is preferably 1 mm or more. By arranging the first and second oxide superconducting wires 4 and 5 apart from each other by 1 mm or more, the connection structure 33 is bent such that the third oxide superconducting wire 6 is outside (in FIG. When an inverted U-shaped bend in which the center is the top point is applied, the ends 4a and 5a of the first and second oxide superconducting wires 4 and 5 interfere with each other, and above the interfered portion. It is possible to suppress the concentration of stress that pushes up on the third oxide superconducting wire 6 located in the region.
When the distance e between the end portions 4a and 5a exceeds 190 mm, the first and third oxide superconducting wires 4 and 6 are connected to the conductive bonding material in the melting of the conductive bonding material 22 at the time of connection. 22 and the region where the second and third oxide superconducting wires 5 and 6 are bonded by the conductive bonding material 22 exceed 190 mm. In order to heat them simultaneously, the total length is 200 mm. Larger heating devices are required. Therefore, it is not practical to join the regions to be joined by the two conductive joining materials 22 at the same time because the apparatus becomes larger and the cost increases. In the case where the regions to be joined by the two conductive joining materials 22 are connected separately, it is necessary to perform the process of heating, melting the conductive joining material 22, cooling and solidifying it twice, resulting in poor productivity. .
Therefore, the distance e between the end portions 4a and 5a is preferably 1 mm or more and 190 mm or less .

  In addition, the first oxide superconducting wire 4 and the third oxide superconducting wire 6 are overlapped with the bases 10 and 10 facing each other where the oxide superconducting layers 12 and 12 are laminated. Is desirable. Further, the third oxide superconducting wire 6 and the second oxide superconducting wire 5 may be overlapped with the bases 10 and 10 facing each other where the oxide superconducting layers 12 and 12 are laminated. desirable. By overlapping in this way, the connection structure 33 having a low electrical resistance at the connection portion can be configured. In addition, since the first oxide superconducting wire 4 and the second oxide superconducting wire 5 to be connected are laminated in the same direction, the first and second oxide superconducting wires 4 are connected at the connecting portion. There is no inversion of the front and back of 5 and handling becomes easy.

(Superconducting cable)
The oxide superconducting wire 1 (that is, the oxide superconducting wires 4 and 5) connected by the connection structure 30 manufactured as described above is used as the superconducting cable 80 shown in FIG. Can do. A cable core 85 at the center of the superconducting cable 80 is formed by winding a plurality of tape-shaped oxide superconducting wires 1 around a metal (for example, copper) former 81 in a spiral manner over two layers with an insulating layer 82 interposed therebetween. And is covered with a conductive cable stabilization layer 83. The cable core 85 is accommodated in a metal double insulation tube 84 having flexibility. The double heat insulating tube 84 has an inner tube 84a and an outer tube 84c, and a vacuum heat insulating layer 84b is formed between the inner tube 84a and the outer tube 84c to eliminate the influence of heat from the outside. It has become.
By using the oxide superconducting wire 1 connected to the superconducting cable 80 as described above, the superconducting cable 80 having various lengths can be produced regardless of the size of the production line.
Further, when connecting a plurality of superconducting cables 80, the connecting structure 30 can be adopted at the connecting portion, and the oxide superconducting wire 1 can be connected.

(Superconducting fault current limiter)
Moreover, the superconducting fault current limiter 99 which shows an example in FIG. 4 can be produced using the oxide superconducting wire 1 connected by the connection structure 30 of the first or second embodiment described above.
In the superconducting current limiter 99, the oxide superconducting wire 1 connected by the connection structure 30 is wound around a winding drum in a plurality of layers to form a superconducting current limiter module 90. The superconducting current limiter module 90 As a liquid nitrogen container 95 filled with liquid nitrogen 98. Further, the liquid nitrogen container 95 is stored inside a vacuum container 96 that blocks heat from the outside.
The liquid nitrogen container 95 has a liquid nitrogen filling part 91 and a refrigerator 93 in the upper part, and a heat anchor 92 and a hot plate 97 are provided below the refrigerator 93.
The superconducting current limiter 99 has a current lead portion 94 for connecting an external power source (not shown) to the superconducting current limiter module 90.
When used as the superconducting fault current limiter module 90 of the superconducting fault current limiter 99 as described above, the oxide superconducting wire 1 has Ni—Cr as the second stabilizing layer 14 as described with reference to FIG. Use a high-resistance metal such as

(Superconducting motor)
FIGS. 5A and 5B show an example of a superconducting motor 130 configured by using the oxide superconducting wire 1 connected by the connection structure 30 described above. The superconducting motor 130 includes a cylindrical rotor 132 that is rotatably supported in a cylindrical sealed container 131.

A plurality of superconducting motor coils 135 are attached around the central portion of the rotary shaft 133 around the shaft, and a plurality of copper coils made of copper coils supported on the inner wall side of the container 131 around the plurality of superconducting motor coils 135. The normal conducting coil 136 is arranged.
The superconducting motor coil 135 is formed by winding the oxide superconducting wire 1 connected by the connection structure 30 around a racetrack-shaped bobbin having an appropriate sumi R.
The rotating shaft 133 is provided with a plurality of pipes for allowing the cooling gas to flow in or out, and the cooling gas is introduced into the container 131 from a refrigerant supply device (not shown) separately provided outside to cool the cooling gas. The superconducting motor coil 135 can be cooled to a critical temperature or lower by gas. The superconducting motor coil 135 is cooled below the critical temperature, while the normal conducting coil 136 is configured as a normal temperature part.

  A superconducting motor 130 shown in FIGS. 5A and 5B introduces a cooling gas into the container 131 and uses the cooling gas to cool the superconducting motor coil 135 to a critical temperature or lower. A necessary current is supplied to the normal conducting coil 136 from a power supply (not shown) separately, and a necessary current is supplied to the superconducting motor coil 135 from a power supply (not shown) separately, resulting in a magnetic field generated by both coils. The rotating shaft 133 can be rotated by the rotational force thus used, and can be used as the superconducting motor 130.

(Superconducting coil)
The pancake superconducting coil 101 shown in FIG. 6B can be configured by winding the oxide superconducting wire 1 connected by the connection structure 30 manufactured as described above. Also, by superposing a plurality of superconducting coils 101 and connecting the respective superconducting coils 101 with each other by the connection structure 30, the superconducting coil laminate 100 that generates a strong magnetic force shown in FIG. 6A can be formed. it can.

As described above, the oxide superconducting wire 1 connected by the connection structure 30 described above can be used for various superconducting devices.
Here, the superconducting device is not particularly limited as long as it has the oxide superconducting wire 1, and examples thereof include a superconducting cable, a superconducting motor, a superconducting transformer, a superconducting current limiter, and a superconducting power storage device.

EXAMPLES Hereinafter, although an Example is shown and this invention is demonstrated further in detail, this invention is not limited to these Examples.
(Sample preparation)
An Al ₂ O ₃ (diffusion prevention layer; film thickness 150 nm) film was formed by sputtering on a tape-shaped Hastelloy (trade name, manufactured by Haynes, USA) having a width of 5 mm and a thickness of 0.1 mm. On top, Y ₂ O ₃ (bed layer; film thickness 20 nm) was formed by ion beam sputtering. Next, MgO (metal oxide layer; film thickness: 10 nm) is formed on the bed layer by ion beam assisted vapor deposition (IBAD method), and 0.5 μm thick is formed thereon by pulse laser vapor deposition (PLD method). CeO ₂ (cap layer) was formed. Next, a 2.0 μm-thick GdBa ₂ Cu ₃ O _7-δ (oxide superconducting layer) is formed on the CeO ₂ layer by the PLD method, and further a 10 μm-thick Ag layer (first film) is formed on the oxide superconducting layer by the sputtering method. A 0.1 mm thick Cu tape (second stabilizing layer) is formed on the Ag layer so as to form a C-shaped cross section, and a laminate (base material and intermediate layer) is formed. And a peripheral surface of the oxide superconducting layer and the first stabilizing layer) and covered with solder. Thus, a plurality of oxide superconducting wires 1 shown in FIG. 1 were produced. This oxide superconducting wire 1 is commonly used in the following examples and comparative examples.

(Examples 1, 2, 3 and Comparative Examples 1, 2)
Examples 1, 2, and 3 and Comparative Examples 1 and 2 having the connection structure 30 were produced using the oxide superconducting wire described above. Hereinafter, a method for producing the connection structure 30 of Examples 1, 2, and 3 will be described in detail with reference to FIG.
First, the first and second oxide superconducting wires 4 and 5 and the third oxide superconducting wire 6 in the connection structure 30 of FIG. 2 are prepared using the oxide superconducting wires described above.
Next, the first, second, and third oxide superconducting wires 4, 5, and 6 were arranged as shown in FIG. At this time, in the first and second oxide superconducting wires 4 and 5, the distance e between the end portions 4a and 5a to be connected was separated by 1 mm in Examples 1 and 3 and 5 mm in Example 2. In Comparative Examples 1 and 2, no gap was provided. The first and third oxide superconducting wires 4 and 6 and the second and third oxide superconducting wires 5 and 6 were arranged so as to overlap each other by 20 mm.
Next, the stabilization layers 14 of the entire 20 mm overlapping portion of the first and third oxide superconducting wires 4 and 6 are joined together by solder (conductive joining material 22), and the second and third oxides are joined. Examples 1 and 2 and Comparative Example 1 are In solder (conductive bonding material 22), and Example 3 and Comparative Example 2 are Sn solders. It joined by (electroconductive joining material 22).
In addition, when the samples of Examples 1, 2, and 3 and Comparative Examples 1 and 2 are prepared and bent in the following bending test, those that have been bent once are not used.

The connection structures of Examples 1 and 2 and Comparative Example 1 were subjected to a bending test with a bending radius of 50 mm. In the bending test, as shown in FIG. 13 (a), the first and second oxide superconducting wires 4 and 5 are inside the connecting structure of each sample along the stacking direction, and the third oxide superconducting wire is formed. This was performed by pressing and bending along the outer periphery of a winding drum B having a radius of 50 mm so that 6 was outside, and the ratio (deterioration rate) of critical current before and after this bending test was measured. The results are shown in FIG.
Referring to FIG. 7, in Examples 1 and 2, there is no significant deterioration in the critical current, while in Comparative Example 1, it is greatly deteriorated. Thereby, in the connection structure 30 shown in FIG. 2, when bending with a radius of 50 mm is performed in a bending direction (see FIG. 13A) such that the third oxide superconducting wire 6 is on the outside, It was confirmed that the deterioration due to bending can be suppressed by providing a gap of 1 mm or 5 mm between the end portions 4 a and 5 a of the second oxide superconducting wires 4 and 5. Therefore, it is considered that the deterioration due to bending can be suppressed if the gap is 1 mm or more.

The connection structures of Example 3 and Comparative Example 2 were subjected to a bending test with a bending radius of 70 mm. The bending test is performed in a bending direction (see FIG. 13 (a)) in which the third oxide superconducting wire 6 is on the outside, with a radius of 70 mm, and the ratio (deterioration rate) of critical current before and after the bending test. It was measured. The results are shown in FIG.
Referring to FIG. 8, in Example 1, no significant deterioration was observed in the critical current, whereas in Comparative Example 1, it was greatly deteriorated.
Thereby, in the connection structure 30 shown in FIG. 2, when bending with a radius of 70 mm is performed in a bending direction (see FIG. 13A) such that the third oxide superconducting wire 6 becomes the outside, It was confirmed that the deterioration due to bending can be suppressed by providing a gap of 1 mm or more between the end portions 4a and 5a of the second oxide superconducting wires 4 and 5.

Subsequently, the connection structures of Example 2 and Comparative Example 1 were subjected to bending tests at various bending radii with a radius of 70 mm or more. The bending test is performed by bending at various bending radii in the bending direction (see FIG. 13A) in which the third oxide superconducting wire 6 is on the outside, and the critical current before and after this bending test is measured. The ratio (deterioration rate) was measured. The results are shown in FIG.
Referring to FIG. 9, in Example 2, there is no significant deterioration in the critical current, whereas in Comparative Example 1, it is greatly deteriorated at a bending radius of 70 mm. Since the deterioration of 5% or more is problematic in actual use, it can be said that Comparative Example 1 is incompatible.
Thereby, in the connection structure 30 shown in FIG. 2, when bending is performed with a radius of 70 mm or more in a bending direction (see FIG. 13A) such that the third oxide superconducting wire 6 is on the outside, And it was confirmed that the deterioration due to bending can be suppressed by providing a gap between the end portions 4a and 5a of the second oxide superconducting wires 4 and 5.

(Example 4 and Comparative Example 1)
In the manufacturing procedure of Examples 1 and 2 described above, Example 4 was manufactured by arranging and connecting the distances e between the ends 4a and 5a to be connected to 50 mm.
In the bending test of Example 4, the bending direction in which the third oxide superconducting wire 6 is on the outside (see FIG. 13A) and the reverse bending direction of the third oxide superconducting wire 6 are as follows. Bending was performed at various bending radii in the bending direction (see FIG. 13B) that would be inside, and the ratio (deterioration rate) of critical current before and after that was measured. Moreover, in the comparative example 1, in the bending direction (refer FIG. 13 (a)) in which the 3rd oxide superconducting wire 6 becomes an outer side, it bends with various bending radii, and ratio of the critical current before and behind ( (Deterioration rate) was measured. The results are shown in FIG. In FIG. 10, the case where the bending in the direction shown in FIG. 13A is applied is the bending direction (a), and the case where the bending in the direction shown in FIG. 13B is applied is the bending direction (b). It was shown to.

Referring to FIG. 10, when Example 4 is bent in a bending direction (see FIG. 13A) such that the third oxide superconducting wire 6 is on the outside, the deterioration is remarkable due to bending with a bending radius of 5 cm or more. Did not happen. In addition, when Example 4 was bent in a bending direction (see FIG. 13B) in which the third oxide superconducting wire 6 was on the inside, no significant deterioration occurred in bending with a bending radius of 12 cm or more. . On the other hand, it can be seen that Comparative Example 1 is completely deteriorated in bending with a bending radius of 20 cm or less.
Thereby, in the connection structure 30 shown in FIG. 2, in any bending direction, a gap is provided between the end portions 4a and 5a of the first and second oxide superconducting wires 4 and 5, thereby bending. It was confirmed that the deterioration due to can be suppressed.
In addition, it was confirmed that the connection structure 30 is less likely to be deteriorated by bending in the bending direction (see FIG. 13A) in which the third oxide superconducting wire 6 is on the outside.

Next, in the manufacturing procedure of Examples 1 and 2 described above, the distance e between the end portions 4a and 5a to be connected is variously changed to 0 mm (that is, there is no gap), 1 mm, 5 mm, and 190 mm to be connected. In the bending direction (see FIG. 13A) in which the third oxide superconducting wire 6 is on the outside, a bending test with a bending radius of 50 mm is performed, and the ratio of critical currents before and after the material is prepared. (Deterioration rate) was measured. The results are shown in FIG.
Referring to FIG. 11, it was confirmed that if the distance e between the end portions 4a and 5a is 1 mm or more, the effect of suppressing the deterioration of the superconducting characteristics is exhibited.

In FIG. 12, when solder is used as the conductive bonding material 22 of the connection structure 30, the length H ₂₂ in the longitudinal direction of the region bonded by the solder (conductive bonding material 22) and the liquid nitrogen in the region The relationship of the magnitude of connection resistance is shown.
As shown in FIG. 12, when the length H ₂₂ = 5 mm, the resistance value is 310 nΩ, and when the length H ₂₂ = 10 mm, the resistance value is 154 nΩ. The connection resistance is preferably 300 nΩ or less in consideration of heat generation at the connection portion. Therefore, the length H ₂₂ in the longitudinal direction of the region joined by the solder (conductive joining material 22) is desirably 10 mm or more per side.

“Second Embodiment”
FIG. 14 shows the basic structure of an oxide superconducting wire used for the connection structure of the second embodiment. As shown in FIG. 14A, one surface of the tape-shaped substrate 10 in the oxide superconducting wire 20 is shown. On the (surface), the intermediate layer 11, the oxide superconducting layer 12, and the first stabilizing layer 13 are laminated to form a superconducting laminate 15, and the outer periphery of the superconducting laminate 15 is formed on the second stabilizing layer 14 1 is the same structure as the oxide superconducting wire 1 shown in FIG. Moreover, it is the same as that of the structure of the oxide superconducting wire 1 of previous embodiment also about the point which the 1st stabilization layer 13 may cover the perimeter of a laminated body.

FIG. 14A shows a cross-sectional structure of the oxide superconducting wire 20, and the portion excluding the terminal portions at both ends in the length direction of the oxide superconducting wire 20 has the structure shown in FIG. Terminal portions at both ends in the length direction of the object superconducting wire 20 have a structure shown in FIG.
The end portion of the oxide superconducting wire 20 shown in FIG. 14B is formed by surrounding the end 20a of the oxide superconducting laminate 20 with a covering member 21 made of a metal foil over a predetermined width. Below, each element which comprises the oxide superconducting wire 20 is demonstrated.

  The end portion 20a of the oxide superconducting wire 20 shown in FIG. 14 (a) is exposed without being covered with the covering member 21, and may react with moisture contained in the air or the like to deteriorate the superconducting characteristics. Therefore, as shown in FIG. 14B, the end portion 20a and the second stabilization layer 14 in the vicinity of the end portion 20a are covered with a covering member 21 over the length L from the end portion 20a. Then, the oxide superconducting wire 20 having a structure that prevents moisture from entering from the terminal portion of the oxide superconducting wire 20 is formed.

The form of the covering member 21 that covers the end portion 20a of the oxide superconducting wire 20 is not particularly limited as long as moisture can be prevented from entering. In the present embodiment, a conductive bonding material (not shown) such as solder is applied to one surface of a pair of metal foils 40, 40 made of Cu or the like, and the surfaces to which the conductive bonding material is applied face each other. It is formed by sandwiching the end 20a of the oxide superconducting wire 20 from above and below in the thickness direction and covering the end 20a of the oxide superconducting wire 20.
The side surface portion 21a of the covering member 21 covers the side surface of the oxide superconducting wire 20, the front end surface portion 21b covers the longitudinal end portion 20a of the oxide superconducting wire 20, and the covering member 21 is a conductive bonding material such as solder in each portion. Thus, the oxide superconducting wire 20 is joined. Moreover, the metal foils 40 and 40 close the edge part 20a vicinity of the oxide superconducting wire 20 by the edge parts 40c and 40c from an up-down direction, and each metal foil 40 is joined by the electroconductive joining material in the edge part 40c. ing.
Since the boundary surface between the oxide superconducting wire 20 and the metal foil 40 and the contact portion between the metal foils 40 and 40 are joined and completely sealed by the conductive bonding material, the boundary surface and the contact portion are separated from each other. Infiltration of moisture can be suppressed.

  When using solder as a conductive bonding material for bonding the interface between the oxide superconducting wire 20 and the covering member 21 and the contact portion between the metal foils 40 and 40 at the edge 40c, the solder is not particularly limited. In addition, a conventionally known solder can be used, and a bonding material similar to the conductive bonding material used when the metal tape is attached onto the first stabilization layer 13 described above can be used.

  Further, as shown in FIG. 14C, a resin coating member 41 can be used instead of the coating member 21. As a resin material constituting the resin coating member 41, for example, an epoxy resin, an acrylic resin, a wax or the like can be used. The resin coating member 41 can be formed by dipping or molding by molding into a mold. In this case, a uniform layer can be easily formed.

The length L in the longitudinal direction of the oxide superconducting wire 20 covered with the covering member 21 may be any length as long as the end 20a of the oxide superconducting wire 20 is completely covered. As shown in FIG. 1B, when the covering member 21 is formed by a pair of metal foils 40, 40, the longitudinal length L of the oxide superconducting wire 20 covered with the covering member 21 is 1 mm or more. By doing so, it is possible to reliably fix the metal foils 40 and 40 by the conductive joined body, and therefore, it is possible to reliably prevent moisture from entering, which is preferable. In addition, when the thickness exceeds 30 mm, not only the cost of the metal foil 40 increases, but also when connecting with other oxide superconducting wires to form a connection structure, the region where the thickness of the connection portion increases increases, This is not preferable because the handling of the part is deteriorated.
Therefore, the length L in the longitudinal direction of the oxide superconducting wire 20 covered with the covering member 21 is preferably 1 to 30 mm, even if the material constituting the covering member 21 is a resin (FIG. 1C The same applies to the configuration shown in FIG.

(Second Embodiment of Connection Structure)
Hereinafter, the connection structure according to the second embodiment will be described with reference to the drawings.
As shown in FIGS. 15 (a) and 15 (b), the first oxide superconducting wire 4 and the second oxide superconducting wire 5 connected in the connection structure 31 of this embodiment are shown in FIG. 14 (a). , (B) is the same structure as the oxide superconducting wire 1 described above, the tip (terminal) of the first oxide superconducting wire 4 and the tip (terminal) of the second oxide superconducting wire 5 are Both are covered with the covering member 21. The distance between end portions of the connection structure of the second embodiment is the same as that of the connection structure of the first embodiment.

The third oxide superconducting wire 6 has the same structure as that of the oxide superconducting wire 1, and the first end 6 a and the second end 6 b which are both ends thereof are covered with the covering member 21.
However, the base material 10 </ b> A of the third oxide superconducting wire 6 is formed thinner than the thickness of the base material 10 of the first oxide superconducting wire 4 and the base material 10 of the second oxide superconducting wire 5. The point is different. A superconducting laminate 15 is formed by laminating the intermediate layer 11, the oxide superconducting layer 12, and the first stabilizing layer 13 on the substrate 10 </ b> A, and the outer periphery of the superconducting 15 is covered with the second stabilizing layer 14. Thus, the oxide superconducting wire 20 has the same structure. Further, the constituent material of the base material 10 </ b> A is the same as that of the base material 10.

  The thickness of the base material 10A of the third oxide superconducting wire 6 is formed thinner than the base material 10 of the first oxide superconducting wire 4 and the second oxide superconducting wire 5, and as an example, the base material The thickness is preferably about 25 to 75% of 10 thickness. The thickness of the substrate 10A is set to 25% or more when the intermediate layer 11, the oxide superconducting layer 12, and the first stabilization layer 13 are formed on the substrate 10A when the substrate 10A is too thin. This is because in the film forming process, the strength of the base material 10A at the time of conveyance becomes insufficient, and the film quality may not be stable. The reason why the thickness of the base material 10A is 75% or less is that the thickness of the overlapping portion of the oxide superconducting wires in the connection structure 31 increases. By setting the thickness in such a range, the local bending strain received by the superconducting wire wound up when the coil is wound due to the level difference of the connection structure is alleviated, and deterioration of the superconducting characteristics can be prevented. Furthermore, the peeling stress generated by bending can be reduced.

As shown in FIGS. 15A and 15B, the connection structure 31 is formed by connecting the first oxide superconducting wire 4 and the second oxide superconducting wire 5 by the third oxide superconducting wire 6. Composed.
Adjacent the first oxide superconducting wire 4 and the second oxide superconducting wire 5 with their first stabilizing layer 13 side facing the same side with a slight gap between the ends of the wires, A connection structure 31 is formed by joining the third oxide superconducting wire 6 so as to bridge the ends of the wires. The portion where the third oxide superconducting wire 6 is superimposed on the end portion of the first oxide superconducting wire 4 is electrically and mechanically joined via a conductive joining material 32 such as solder, and the second oxide superconducting wire 6 is joined. A portion where the third oxide superconducting wire 6 is superposed on the superconducting wire 5 is electrically and mechanically joined via a conductive joining material 33 such as solder.

In the connection structure 31 shown in FIG. 15 (a), a superconducting current flows through the oxide superconducting layers 12 of the first, second, and third oxide superconducting wires 4, 5, and 6 in a state of being cooled below the critical temperature. However, in the connection portion, current flows through the first stabilization layer 13 and the second stabilization layer 14 existing in the connection portion.
When the first and second oxide superconducting wires 4 and 5 are joined using the third oxide superconducting wire 6, the first stabilizing layer 13 and the second stabilization layer are interposed between the superconducting wires 4, 5 and 6. There is a finite resistance due to the presence of normal conducting materials such as the layer 14. Therefore, it generates heat by energization, causes quenching, and has a risk of burning. Therefore, if the second stabilizing layer 14 and the conductive bonding materials 32 and 33 are made as thick as possible, the heat capacity of the connecting portion can be increased, which is caused by the heat generated when the current flows through the normal conducting material. Quenching can be suppressed.
Furthermore, if there is a region where current flows only in the third oxide superconducting wire 6, if the second stabilization layer is eliminated as in the conventional structure, it is weakly susceptible to quenching electrically and thermally. By leaving the second stabilization layer 14 of the third oxide superconducting wire 6 as it is, the connection structure 31 with high quench resistance can be obtained.

  If the second stabilization layer is temporarily removed to reduce the thickness of the connection structure 31, damage such as cracks and scratches may be given to the superconducting layer during the removing operation, and the superconducting wire may be deteriorated. Therefore, when connecting, it is advantageous to reduce the thickness of the connecting portion by reducing the thickness of the base 10A itself, instead of removing the second stabilizing layer. Thus, there is an effect that the connection can be made without affecting the sealing structure of the oxide superconducting wire while preventing the oxide superconducting wire from being damaged. In addition, the base material 10A of the third oxide superconducting wire 3 may be manufactured using a thin base material 10A in advance in the manufacturing stage as described later, or after performing various film forming processes, It may be thinned by using any means such as polishing and thinning the back surface side.

"Method for manufacturing connection structure"
A short oxide superconductor for connection using a base material 10A made of the same material as that of the base material 10 of the oxide superconducting wire 1 manufactured earlier, and having a thickness about half that of the base material 10A. A conductor is manufactured, and each end of the superconducting conductor is end-sealed with two metal foils in the same manner as described above, whereby the connecting oxide wire 6 is manufactured.
The two oxide superconducting wires 1 manufactured as described above are used as the first oxide superconducting wire 4 and the second oxide superconducting wire 5, and further the connecting oxide superconducting wire 6 is used. The form of connection structure 31 can be formed.

"Example of connection structure of second embodiment"
A plurality of tape-like base materials having a width of 5 mm, a thickness of 100 μm, and a length of 100 m made of Hastelloy (trade name Hastelloy C-276, manufactured by Haynes, USA) were prepared, and after polishing the surface, they were washed with alcohol and an organic solvent. .
Next, a diffusion prevention layer, a bed layer, an alignment layer, and a cap layer were laminated in this order on one surface of a plurality of substrates under the following formation conditions. When each film is formed, a feed reel and a take-up reel that transport the tape-shaped substrate are provided inside the film forming apparatus, and the film is sequentially formed on the substrate while moving the substrate at a predetermined speed. Went.
First, a 100 nm-thick diffusion prevention layer made of Al ₂ O ₃ is formed on a tape-like substrate by ion beam sputtering, and then Y ₂ is formed on the diffusion prevention layer by ion beam sputtering. A bed layer made of O ₃ and having a thickness of 20 nm was formed. Next, an alignment layer having a thickness of 10 nm made of MgO was formed on the bed layer by IBAD.

After forming the alignment layer, a 400 nm-thick cap layer made of CeO ₂ is formed by the PLD method, an oxide superconducting layer having a composition of YBa ₂ Cu ₃ O _7-x is formed, and a 2 μm thick Ag first layer is formed. 1 stabilization layer was formed by sputtering to obtain a laminate. This laminated body was subjected to oxygen annealing treatment in an oxygen atmosphere at 500 ° C. for 10 hours to obtain an oxide superconducting laminated body.
Next, a metal tape made of Cu having a width of 8 mm and a thickness of 0.02 mm, and a Sn tape having a thickness of 2 μm on one side is subjected to Sn plating by a roll forming method in combination with a heating furnace. By heating to 200 ° C. and melting, an oxide superconducting conductor having a structure in which the outer periphery of the oxide superconducting laminate was covered with a second stabilizing layer made of Cu via a Sn conductive bonding material layer was obtained.
Two oxide superconducting conductors obtained in the above process are prepared, one is used as the first oxide superconducting wire and the other is used as the second oxide superconducting wire, and both ends are 5 mm long. Then, the covering member 21 having the structure shown in FIG. 14B is formed by covering with a metal foil 40, 40 of Cu having a thickness of 0.02 mm (ie, L = 5 mm shown in FIG. 14B). Formed. The metal foils 40, 40 are integrated so that the portion protruding from the end of each wire is crimped with a jig, and the end of each oxide superconducting wire 4, 5 is soldered by the covering member 21 by soldering the crimped portion. Sealed.

Next, instead of the above-mentioned substrate having a thickness of 100 μm, a substrate having a thickness of 75 μm and a length of 1 m is used. A layer, an oxide superconducting layer, and a first stabilizing layer were laminated, and this laminated body was subjected to oxygen annealing treatment to obtain a superconducting laminated body for connection. An oxide superconducting conductor for connection having a structure in which this superconducting laminate was covered with the second stabilizing layer of Cu by the same roll forming method as described above was obtained.
From this connecting oxide superconducting conductor, a 65 mm long portion is cut out with scissors, and both end portions in the length direction are covered with the covering member 21 made of the metal foil 40 in the same manner as the first and second oxide superconducting wires. The terminal was sealed to obtain a third oxide superconducting wire 6 for connection. The total thickness of the third oxide superconducting wire 6 is 0.135 mm.

The first oxide superconducting wire 4 and the second oxide superconducting wire 5 have a gap of 5 mm between their ends, the oxide superconducting layer 12 is adjacent to the same side, and the adjacent ends A third oxide superconducting wire is applied so as to cover each part with a thickness of about 30 mm, and the attached structure is soldered with InSn solder for a length of about 15 mm to obtain the connection structure shown in FIGS. Produced. The total thickness of this connection structure was 0.33 mm.
Next, as a comparative example, the second stabilization layer 14 is omitted as the third oxide superconducting wire 6 used when the first oxide superconducting wire 4 and the second oxide superconducting wire 5 are joined. Using the oxide superconducting conductor having the configuration and exposing the first stabilizing layer 13, the oxide superconducting wires 4 and 5 are connected in a bridging manner as in the structure shown in FIGS. 15 (a) and 15 (b). The connection structure of the comparative example was obtained.

Each of these connection structures was subjected to a pressure cooker test. In the pressure cooker test, a sample containing the connection structure is allowed to stand for 100 hours at high temperature (121 ° C.), high humidity (100%), and high pressure (2 atm), and the ratio of critical current values (Ic) before and after that ( FIG. 16 shows the result of measuring Ic (measured value before test) / Ic ₀ (measured value after test): deterioration rate).

Referring to FIG. 16, in the example sample, the covering member is arranged at the connecting end portion, and the superconducting conductor is covered with the second stabilization layer, so that no great deterioration was observed in the pressure cooker test. .
On the other hand, the comparative sample was greatly deteriorated by the pressure cooker test. This is presumably because moisture entered during the test from the portion where the second stabilizing layer was removed, and the oxide superconducting layer deteriorated.

Next, in the above connection structure, the base material thickness of the first and second oxide superconducting wires is 0.1 mm, the second stabilization layer thickness is 0.1 mm, and there are two layers in total, When the overall thickness is 0.32 mm, the base thickness of the third oxide superconducting wire is 0.05 mm, and the stabilization layer is 0.1 mm, the overall thickness is about 0.27 mm.
Compared with the case where the base material of the third oxide superconducting wire was 0.1 mm, when the base material of the third oxide superconducting wire was 0.05 mm, the thickness was reduced by about 8%. When the quench resistance is calculated, the electrical resistivity of Cu and Hastelloy is different by about 500 times. Therefore, the thickness of the second stabilization layer of Cu does not change even if the Hastelloy base material is thinned. Absent. Therefore, the quench resistance of the oxide superconducting wire connection structure is hardly different from the conventional structure when the Cu stabilization layer is removed.

DESCRIPTION OF SYMBOLS 1 ... Oxide superconducting wire, 1a, 4a, 5a ... End part, 4 ... 1st oxide superconducting wire, 5 ... 2nd oxide superconducting wire, 6 ... 3rd oxide superconducting wire 10, 10A ... Base material 11 ... Intermediate layer 12 ... Oxide superconducting layer 13 ... First stabilizing layer 14 ... Second stabilizing layer 15 ... Laminated body 16 ... Solder layer 20 ... Superconducting wire 21 ... Covering material, 22 ... conductive bonding material, 30 ... connection structure, 31 ... connection structure, 32, 33 ... conductive bonding material, 80 ... superconducting cable, 99 ... superconducting current limiting device (superconducting equipment), 100 ... superconducting Coil laminate (superconducting equipment), 101 ... superconducting coil (superconducting equipment), 130 ... superconducting motor (superconducting equipment), 135 ... superconducting motor coil (superconducting equipment), 136 ... normal conducting coil, H ₂₂ ... length, e …distance

Claims (7)

A connection structure in which oxide superconducting wires are formed by laminating an intermediate layer, an oxide superconducting layer, and a stabilizing layer on a tape-shaped substrate,
Having a first oxide superconducting wire, a second oxide superconducting wire and a third oxide superconducting wire;
The first and second oxide superconducting wires are arranged adjacent to each other in a state in which the sides where the oxide superconducting layers are formed are aligned with respect to the substrate and the ends are separated from each other.
The stabilizing layer of the third oxide superconducting wire is bridged to the stabilizing layer of the first and second oxide superconducting wires so as to straddle the adjacent ends.
The stabilization layers of the first and third oxide superconducting wires are bonded together by a conductive bonding material,
The stabilization layers of the second and third oxide superconducting wires are bonded together by a conductive bonding material,
Spaced distance between the ends of the first and second oxide superconducting wire which is disposed said third length of 0.4 to 90% less der of the oxide superconducting wire is,
The substrate has a thickness of 20 to 200 μm;
The length in the longitudinal direction of the region where the stabilization layers of the first and third oxide superconducting wires are joined together by the conductive joining material is 10 mm or more and 20 mm or less,
The length in the longitudinal direction of the region where the stabilization layers of the second and third oxide superconducting wires are joined together by the conductive joining material is 10 mm or more and 20 mm or less,
Connection structure of the oxide superconducting wire distance between the ends of the first and second oxide superconducting wire, characterized in der Rukoto least 190mm below 1 mm.   2. The oxide superconducting wire connection structure according to claim 1, wherein the conductive bonding material has a thickness of 380 μm or less.   The first and second oxide superconducting wires are bent to a radius of 5 mm or more and 200 mm or less so that the third oxide superconducting wire is on the outside and the third oxide superconducting wire is on the outside along the stacking direction. The connection structure of the oxide superconducting wire according to 1 or 2.   The first and second oxide superconducting wires are bent to a radius of 12 mm to 200 mm so that the first and second oxide superconducting wires are on the outside and the third oxide superconducting wire is on the inside along the stacking direction. The connection structure of the oxide superconducting wire according to 1 or 2.   The base material of the third oxide superconducting wire is formed thinner than the base material of the first oxide superconducting wire and the second oxide superconducting wire. The connection structure of the oxide superconducting wire according to one item.   6. The terminal of the first oxide superconducting wire, the terminal of the second oxide superconducting wire, and the terminal of the third oxide superconducting wire are individually covered with a covering member. The connection structure of the oxide superconducting wire described in 1.   A superconducting device comprising the connection structure according to any one of claims 1 to 6.

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